TW554357B - The materials of micro-pores structure and the micro-pores-monolithic structure high frequency capacitors and its process - Google Patents

Abstract

This invention is about a material with micro-pores structure, it's used to manufacture the micro-pores monolithic structure with high frequency capacitors. The main theory is of microchemistry-liquidated transformation, meaning that liquid phase transformation pretexts the non-even-disperse slurry gel to form the sub-micro-meter ceramic powder in macro-cell structure. When a mixture of macro-cell structure powder with aqueous solution binder, this material will turn as micro-pores structures. When this power is used in manufacturing capacitors, by utilize the dielectric ceramic micro-pores monolithic structure (air mediums) will enhance the frequency characteristic of the capacitors.

Description

554357 V. Description of the invention (1) ----- the surname i ϊ, the related and related—a kind of hole-forming structural material, and the use of the aforementioned holes; Find high value-added products and improve the high-frequency characteristics of capacitors to find efficacy. According to Shaomi, ceramic capacitor is a kind of capacitor, which belongs to passive components. It is made of ceramic, although dielectric, electroplated with a thin metal film on both sides of the circular ceramic sheet. There are three types of ceramics: low dielectric constant type, high dielectric constant type, and semiconductor type. Low-dielectric constant type is the use of titanium oxide-based ceramics as a dielectric; high-dielectric constant type is the use of barium titanate-based ceramics as the 'I' dielectric. Semiconductor ceramic capacitors are based on the addition of impure impurities in barium titanate as the medium Electrical quality. Another way to distinguish them is to divide ceramic capacitors into single-layer ceramic capacitors and multilayer ceramic capacitors (MLCC). The characteristics of ceramic capacitors are high dielectric constant, good insulation, and good temperature characteristics. They can be made into small-sized products, which are suitable for communication products such as mobile phones, and thin and short products such as notebook computers. The capacitance value of the ceramic laminated capacitor is proportional to the surface area of the product and the number of stacked layers of the ceramic film. In recent years, as ceramic thin film stacking technology progresses more and more, the capacitance content is getting higher and higher. It can gradually replace capacitors with low and medium capacitance values (such as electrolytic capacitors and tantalum capacitors in the market). In addition, ceramic multilayer capacitors can pass through. SMT is directly adhered, and the production speed is faster than electrolytic capacitors and tantalum capacitors. Therefore, the market development of ceramic base capacitors is receiving more and more attention, and it is a capacitor product that develops very quickly. However, the main raw material of MLcc comes from palladium metal. Since palladium metal is only produced in Soviet Russia, the grid of palladium gold has always been closely related to the movement of Soviet Russia. So every additional layer of MLCC

554357 V. Description of the invention (2) The laminated layer must be coated with an internal electrode, and the amount of the laminated layer is increased. However, because the palladium metal is rare, the palladium metal is expensive, which makes the high electrode cost a mass production. 】 = Yes, the price has always been a hindrance. One of the major obstacles of π is a number of multi-layer capacitors. In recent years, portable communication or information consumer systems have become more and more powerful, which means that the terminals of related products and electronic products are higher. At the same time, the higher the frequency of use, the higher the circuit density. More and more. At present, the high-frequency capacitors used in the industry are digitally processed at high speed 0201 products, while domestic multilayer ceramic capacitors are small in size 0402, and the force has not yet been completed, so the related components are all “outside” and size processes. To develop, the materials needed for high-tech products = 2 It is a headache with technology. And because the ceramic materials are generally = d, the strength of the industry is not high, and the reliability is not good, since 198 :; = points are: Low mobility, peak one proposes that a number of nanometer composite materials are evenly dispersed in the substrate. Through the improvement of the microstructure, the substrate is significantly strengthened to have specific mechanical properties. = Material's Reliability. Nano-ceramics are actually made of dried porcelain. V 仏 卞 卞 稷 稷 稷 枓 枓 枓 枓 is characterized by fine particles: uniform knife cloth, but because the fine particles are very susceptible to Van der Waals and other works = The impact of the formation of agglomerates' is extremely difficult to disperse, and it is easy to cause excessive formation of crystal grains. Therefore, at the stage of preparing the composite slurry, select a base material that can be combined with the second phase: a combined ceramic base material and use it appropriately. Very dispersed ^ Another semi carbazide containing hydrochloric acid Aqueous colloidal dispersion of alumina powder as a dispersant. Alumina has always accounted for 554357 in the manufacture of precision ceramics. 5. Description of the invention (3) It has a very important position, especially the substrate in the electronics industry, and various high-strength wear-resistant Articles are developing in the direction of using high-purity (> 99%) alumina. The manufacturing method of these precision ceramic articles basically includes forming a sinterable high-purity j-oxide powder into a ceramic bad body with a specific shape. Then, the bad body is sintered into a ceramic object. Recent research has found that the use of the glue method (Wol lcndal Pfcessing) is an effective method to increase the strength of alumina ceramic bodies and that it can be made by Slip Casting or It is a high-pressure grouting (Pressure Casting) molding to form a ceramic bad body with complex shapes. It uses uniform particle size distribution and no obvious agglomeration (Agglomomer) such as sub-crometer alumina powder to make a dispersion. Liquid and through a ί = into a bad body 'The bad body is moderately dried and then sintered-mechanical strength. Generally commonly used dispersants can be divided into = class factor = ^ to make alumina particles The surface electricity is formed in the solution; the other one is the generation of three-dimensional: repulsion (s = ric Hindrance) through the adsorption of polymers to achieve the effect of dispersion stability. The ancient alumina powder is placed under strong acid or strong ^ changes For weak acid or weak test, this is a general high table = of = liquid will be used 'So the material will form a gel-like surface easily, high, can not smoothly float out of the polymer surface. So the most commonly used? I spent the adjustment of the pH value of ceramic fiber. For example, I borrowed * 79100101 (Publication No. 1 47864), but it is not ideal for the ancient case. Choose a polymer as a dispersant; its alumina effect 554357 V. Description of the invention (4) The adsorption, decomposition or high molecular weight of the surface: two-viscosity and other behaviors are very complicated, especially profound. Sub-knife agent, so the effect on the sintered pottery ware is as described above. The conventional ceramic capacitors can have the most densely packed structure, which is two times as much as the multilayer ceramic capacitor when powder is required after sintering. Electrical characteristics. Same as 3. %, High material cost and low production: price, which accounts for about 90% of the product. Enterprises can accept it. However, if the holes can be made, J's Electric Valley II is not directly punched into a mold. At the same time, it can be used to provide high-frequency conditions through the use of air media and ceramic materials such as': 冓. With the simplest and early structure), future researchers in materials need to break through the fate. The main purpose of the present invention is to improve the material quality and quality of the material. ”, # Mainly refers to the appropriate proportion of :: an organic solvent, ethanol and toluene and a dispersant to adjust it, and j Baojun :, administrate the low-speed grinding of a variety of different pellets ^ take an appropriate proportion of polyvinyl alcohol and The water mixes together, and the heart is equal to 2 '. The granules are vigorously mixed. 4 After the milky colloid is formed, the second month is baking: the flour becomes a porous structure material.粍 Into a solid state, that is, to make a capacitor ΪΪ: Another: ΐThe purpose is to provide a * "hole-forming single-crystal high-frequency, two-pirate 1 method", which is mainly formed by pulverizing the structure material, sintering, removing Manufacture of burrs and terminal electrodes, and high-frequency capacitors. U-formed single crystal Another main object of the present invention is to provide a "hole-shaped single-s ancient capacitor", which mainly includes a dielectric ceramic layer and at least two daily electrodes.

554357 V. Description of the invention (5) The intention is that the dielectric ceramics, the porosity of the dielectric ceramics, have the pore structure of the hollow crystals, taking advantage of the high-frequency characteristics. Early-crystal structure 'capacity by air medium' to increase capacitance 1. Micro :: 2 :: The theory applied to the invention is clarified as follows: Liquid-liquid phase change (1 i · Shishuangkou n 4Uld—liquid phase transformation) ^ 1 The two organic solvents existing in the organic slurry are mixed with formazan, toluene is toluene, and after mixing with a sub-binder, ethanol and water can complete the hydrophilic functional groups: =; The functional groups will repel each other. Nail-making materials (refer to the table Λ in Figure 丄 for mixing, and deliberately mix into a latex-like polyunion on the towel. See Table 2 ;; latex area), and then make Tao Jing powder glue ¥ ^ A t β Μ ί As shown in the figure 2, because of the large particle size of the latex, π 眭 古 八 工 工 私 ”“ Γ particle size fills the periphery of the large particle size powder: when the shape of the knife binder and inorganic materials is Particle size dispersion simulation chart, Fuzhong 19 1 ^ Magic /, 彳 shell key [brief 2 figure 〇 09 ® + A Λ, the first figure shows uniform dispersion, the second figure is not made After the latex is produced, the ceramic can be sintered to produce a bran-shaped hook knife. …, And the space of uniform sentence forms a hole list 2 · Physical part: In order to achieve the above results between powders, the powders are mixed. The use of small-sized powders with sub-microns has different particle sizes. If the particle size is nanometer, sintering will result in ^^ α (such as 〇 · 13 // m), which is the electrical characteristics of the product. At the same time, in order to take into account the scattering of the electronic ceramics and rhenium components and affect the heating conditions during sintering, we can obtain the dream, other, and other characteristics, such as flat and good results.

Page 9 554357 V. Description of the invention (6) The manufacturing method of the hole-forming structure material of the present invention includes the following steps: • Mixing the slurry. • Taking a proper proportion of the dielectric ceramic material. t ^ ,, " 十 （Dielectric

Ceramics) and two kinds of organic solvents ethanol (Et〇 Yu (but 〇〇1 uene)) and dispersing agent (under the viscosity), to ensure uniform dispersion, and then take a grinding ball; ^ Controlled at 10 cp to produce Grinding balls ... etc.) Grinding and mixing times such as oxidized misballs, milk bonding agent preparation ... Take the appropriate proportion of polyr ^ JG enol (PVA) and water, stir well; add the bonding agent ... Mix the aforementioned submicron powder with the binder and mix it until a milky colloid is formed. M Drying: The milky colloid bait from the previous step is smoked into a m ^ structure material. Basket nine, dried into a solid, That is, the hole is formed. When the ball is milled and stirred in the present invention, the ball is implemented at a low-speed grinding method. Π is known to use different types of mills with different particle sizes. In the present invention, 诰 ν 丨 丁 π β inches can be used. To convert single-crystal high-frequency capacitors, the steps are as follows: To ::: Construct a material to make holes and granules. At the same time, the materials of the 吉, 吉 and 吉 are ground in a mortar, and the & fixture is stamped into an ingot. 丨 'τ Fine, placed on a special sintering · hole hole as a bucket. It is reported that the ingot of 丨, dagger, and ° structural material is sintered to form a self-iron—to make a single crystal high-frequency hole: After deburring left and knowing the electrode manufacturing process, the aforementioned sintering and benefiting parties of the present invention. AJb ϋ Μ ΘΙ ty and the 'temperature setting' are Kou Fulei to his characteristic question 4, which is based on two. Chromium is getting hotter and colder in order to get the best results from the mystery of the hole, and the aj flatness. The early process is not possible in the frequency capacitor manufacturing process.

Electrode method. Generally, the terminal electrode is made of two tins, but the hole structure cannot be electroplated: silver, nickel, and plating remain in the holes. The best terminal electrode method ^ continued ^ to avoid causing residual sputtering of the plating solution), because the vacuum sputtering method uses vacuum sputtering (1. the equipment cost is low; 8 has the following advantages: 2) direct electrode plating, compared with the traditional process 7 丨3, Sputter plating end pole surface, strong mechanical strength; 'process; 4. Accuracy of South. And the container, at least two holes in the junction, with a hole device, can be MLCC) The simplest ceramic motor, steam high current needs According to the foregoing manufacturing method of the present invention, please refer to FIG. 3, and the single-crystal high-frequency electrical structure is hollowed out. This dielectric ceramic is used to study the hole of the same layer with a hollow crystal to improve the capacitor's height. Early-crystal structure, 70-year-old king of ceramic capacitors with high frequency (srf) by air medium, multilayer ceramic capacitors with the same electrical characteristics (: this problem and the problem of small size process instability. At the same time- The production process has produced some high-frequency characteristics with higher gas characteristics than M · or disc-shaped cereals. Its application areas include: communication handcarts, wireless transmission products, information-PDA, NB, Gao Integrated products with high frequency and bit logic. Future applications The circuit design with>, the principle of making use of the hole to develop more different material properties of the capacitor. Under the invention include a preferred possible embodiment of the present invention is further verified

554357 V. Description of the invention (8) Mixing and taking; I 137.87g of Dieiectric Ceramics, 25.06g of EtOH, 37.06g of Toluene and dispersant (such as BYK-1 1 1 ) 2.76g (2.0% of the dielectric ceramic material) viscosity is controlled below 10 cp 'to ensure uniform dispersion, must be = 3 dragons: 10 bandits: 30mm = 5: 3: 2 Grind and stir for 12 Hrs. (Powder particle size = 0 · 1 0 ~ 0 · 1 4 // m) [the three low-speed grinding methods of osmium oxide balls with different particle sizes can save more grinding time than conventional methods 丨 / 2 grinding time]; preparation of adhesive: take Polyvinyl alcohol (pVA) 0.4 g was added to 9.6 g of water and stirred well (PVA = 4%);

Take 5g of powder (particle size 0.13 // m) in the mixing step, add 5g of 4% PVA ^ and stir vigorously until a milky colloid is formed, and then dry into a solid; The solid block is ground in a mortar, and 0. 5 g of fine powder is punched into an ingot in a special jig; $ 结 · The temperature setting of the two-stage holding mode is shown in Figure 4; Electrically complete the single crystal high frequency capacitor. Please refer to the following drawings for the test results of the described examples of the present invention: FIG. 5 is a graph showing the relationship between the grinding time and the particle size. ”N is the relationship between the sintering temperature and the dielectric constant and porosity. (The porosity returns to 18% of the time; ^% γ 0 _ Ignore $ 7, the mechanical strength is insufficient, and the capacitor has a relatively low electrical resistance. ) Figure ^ is the frequency characteristic diagram after the capacitor is manufactured according to the present invention: Capacitance value test conditions: 1.0 volt 1MHz for HP 4194A hk meter Frequency test: HP S7CQI7. 〇 «53E network analyzer

Page 12 Brief description of the formulae Brief description of the drawings: Figure 1 is a schematic diagram of the liquid-liquid phase change of the present invention. Figure 2 is a schematic diagram of particle size dispersion simulation of the present invention. Among them, Fig. 2-1 is a schematic diagram of uniform dispersion of conventional particles. Figures 2-2 are schematic diagrams of uneven dispersion of particles of the present invention. FIG. 3 is a cross-sectional view of a cavity-shaped single crystal high-frequency capacitor according to the present invention. Fig. 4 is a temperature setting map of the present invention. Among them, Fig. 4-1 is a table for setting the temperature rise of the present invention. Figure 4-2 is the temperature-time monitoring chart set by Figure 4-1 (drawn by THERMOTRACKER temperature monitor). Fig. 5 is a graph showing the relationship between the grinding time and the particle diameter of the present invention. Among them, Fig. 5-1 is a table showing the relationship between the grinding time and the particle diameter of the present invention. Figure 5-2 is a graph of grinding time versus particle size plotted in Figure 5-1. Figure 6 shows the relationship between the open sintering temperature and the dielectric constant and porosity of the present invention. Among them, Fig. 6-1 is the relationship between sintering temperature and dielectric constant and porosity. Fig. 6-2 丨 Sintering temperature and dielectric constant and porosity relationship. Fig. 7 is the frequency characteristic diagram after the capacitor is manufactured according to the present invention. ’, Figure Two types of ceramic capacitors, capacitance value

Among them, Figure 7-1 is a statistical table of self-resonance frequencies of NP0, X7R and OTHER. · Frequency and withstand voltage Figure 7-2 is a statistical table of capacitance values of 0603 size capacitors. Figure 7-3 is a 1008 size NP0 3.2 pF Smith chart drawn by the HP 8753e network analyzer.

Page 14 554357 Simple illustration of the diagram Page 7-4 is a Smith chart drawn by HP 8753E network ana 1 yzer with 1008 size other 1.31pF. Figure 7-5 shows the Smith chart drawn by the HP 8753E network analyzer at 1 0 08 size X7R 12.1 pF. Figure 7-6 shows the Smith chart of 0805 size other 1.10 pF by HP 8753E network analyzer. Figures 7-7 are Smith charts of 0805 size X7R 9.5 pF drawn by HP 8753E network analyzer. Figure 7-8 is a Smith chart drawn by HP 8753E network analyzer with 0603 size other 0 · 60 pF. Figures 7-9 are Smith charts of 0603 size X7R 10.69 pF drawn by HP 8753E network analyzer. Reference numbers in the drawings: (1) Dielectric ceramic layer (2) Electrode

Page 15

Claims (1)

554357 VI. Scope of patent application Space to form a hole single crystal structure; and then to make a hole-shaped single crystal high-frequency capacitor after deburring and terminal electrode process. 4. According to the "Cavity Method for Single-Cavity High-Frequency Capacitors" described in item 3 of the scope of the patent application, the temperature setting of the sintering step is performed in a three-stage holding method. 5. A kind of "hole-forming single-crystal high-frequency capacitor", which mainly includes a dielectric ceramic layer and at least two electrodes, which is characterized in that the dielectric ceramic layer has a pore-like structure of a hollow crystal body and borrows the holes of the dielectric ceramic. Those who change the single crystal structure 'through the air medium' to improve the south frequency characteristics of the south capacitor. Page 17