TW553761B - Treatment of process gas effluent - Google Patents

Abstract

A system for reducing hazardous gases exhausted from a process chamber 25 includes a catalytic reactor 250 containing catalytic material that can catalyze destruction of the hazardous gases. The system may also include a heater 240, a scrubber 270, and a prescrubber 230. The system may reduce the amount of hazardous gases, particularly perfluorocompounds and/or F2, exhausted into the environment.

Description

553761 A7 V. Description of the Invention (Field of the Invention The present invention relates to a magnetic field such as * Magnet 71, Shuangbi and Wanfa, which can reduce the content of toxic process gases discharged from the process chamber. Background of the invention: Integrated circuit manufacturing process φ ,% S, hanging in the process room: using CFCs, CFCs, hydrocarbons, and immortals and other radon-containing gases. These gases will not only poison the human body, but also cause harm. In addition, because these gases have a strong absorption of infrared rays, they are also the most important substances that cause global temperature rise. Among the most difficult to handle are gaseous substances or over-gases (PFCs). Both compounds are very stable, so they can survive for thousands of years without being decomposed. Examples of such pFCs include carbon tetrafluoride (CF4), hexafluoroethane (cjo, perfluoropropane (cjj , Trifluoromethane (CHF3), 7T sulfur fluoride (SF6), nitrogen trifluoride (nf3), carbonyl fluoride (coF2), etc. For example, the life of carbon tetrafluoride (Cf4) in the environment The period can be as long as 50,000 years, and its impact on the global greenhouse effect It can be as long as more than 6.5 million years. Therefore, although a method and equipment that can effectively reduce the content of toxic process gases, especially PFCs, discharged from the process chamber are needed, perfluoride is used in many semiconductor processes For example, perfluoride is often used to etch thin films such as oxide layers, metal layers and dielectric layers on semiconductor substrates. In addition, perfluoride is also commonly used in chemical vapor deposition processes. It is also used in Can be used to clean etching residues or deposition residues in the process processing room. If these toxic compound gases are not intentionally introduced into the process processing room, they are generated during the manufacturing process. Page 2 This paper applies Chinese national standards. (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) _ -1 --- I--Order ·! I --— ΙΛ Employee Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed 553761 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () By-products' will therefore exist in the exhaust gas discharged from the process room. Another toxic gas Fluorine molecule, F2. Long-term exposure to F2 even at a concentration of only 1 ppm will cause considerable harm to the human body. Moreover, F2 is very difficult to decompose or convert to a less toxic form. Previously, it was made by containing F2 The exhaust gas passes through a very high exhaust smoke! Υ emissions, so that the F2 concentration released into the air can be lower than the legal emission concentration .: However, from an environmental point of view, this technology is too crude and it is not a manufacturing industry Desired 'because the volume of the process gas that produces F2 will be limited by the height of the smoke exhaust flue gas. In many substrate manufacturing processes and other processes, fluorine-containing exhaust gases are generated. For example, process gases containing F2, Or processes that produce F2 by-products can be used to etch thin films such as oxide layers, metal layers and dielectric layers on semiconductor substrates; used in chemical vapor deposition processes; and used to clean Etching or deposition residues in a process chamber. These toxic compounds are expelled from the exhaust stream outside the process. Therefore, the witch needs a method and equipment that can effectively reduce the toxic process gas content, especially the F2 content, discharged from the process room. A traditional method of reducing F2 content is to use a hydrogen combustion box to reduce F2 content. However, this system has several disadvantages. For example, very high temperatures (generally above 850 ° C) are required to convert F2 to HF in the presence of H2. And high-temperature HF is very corrosive and highly toxic, so the processing cost is not only expensive and very dangerous. In addition, the pipelines of the supply line in the manufacturing plant may also catch fire, which increases the operating cost and danger of this system. Page 3 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

553761 A7 B7

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of Invention () For environmental reasons, the amount of toxic gases and their by-products released into the air must be minimized. At the same time, there is also a need to effectively reduce the amount of mother gas and its by-products in the exhaust gas at a low cost. For the industry that uses PFCS compounds extensively (although the amount used by the industry is already relatively small in terms of the total global consumption or the amount of PFCs released), it is even more necessary to reduce the amount of PFC and other toxic gases to the extent possible lowest. Summary of the invention: The present invention uses a simple and effective way to reduce the content of toxic gases, such as pFCs: The content is very useful. The toxic gas referred to here refers to any toxic, harmful or unwanted gas, such as but not limited to PFCs, CFCs, carbonitrides, other fluorine-containing gases, and other unwanted gases. One of the objects of the present invention is a device capable of reducing the content of toxic gases in the exhaust gas from the process chamber. The device includes a processing chamber capable of processing a substrate in an excited state to generate an exhaust gas stream, and a processing chamber capable of receiving the exhaust gas. Catalytic reactor for gas flow. Another object of the present invention is a gas processing equipment capable of reducing the toxic gas content in the exhaust gas from the process chamber. The equipment includes a processing chamber capable of processing a substrate in an excited state and thereby generating an exhaust gas stream, and a processing chamber suitable for Receive and clean this scrubber. Another object of the present invention is a method for treating exhaust gas stream, which can reduce the content of toxic gas in the exhaust gas from the process chamber. This method includes the fourth page of this paper. (Mm) --I I ------ Installation -------- 丨 Ordering 丨 丨 II 丨 丨 (Please read the precautions on the back before filling out this page) 553761 Employees ’Intellectual Property Bureau of the Ministry of Economic Affairs Cooperative printed A7 B7 V. Description of the invention () A reactant is introduced into the exhaust gas, and the exhaust gas stream and the reactant are introduced into the catalytic reactor, thereby reducing the content of toxic gases in the exhaust gas. Another object of the present invention is a method for treating exhaust gas, which can reduce the content of perfluoride gas in the exhaust gas of the process chamber. The method includes introducing a reactant into the exhaust gas, and introducing the exhaust gas and the reactant into the exhaust gas. Catalytic reactor. Another object of the present invention is a method for treating an exhaust gas stream, which comprises catalyzing the exhaust gas stream to perform a reaction before or after step (a) cleaning the exhaust gas. Another object of the present invention is a gas processing equipment capable of reducing the content of toxic gas in the exhaust gas of the private room. The equipment includes a processing chamber capable of processing a substrate in an excited state to generate an exhaust gas stream, and a suitable processing chamber. Abatement system for reducing toxic gas content in exhaust gas, and a controller suitable for controlling the operation of the abatement system. Another object of the present invention is a method capable of reducing the content of toxic gas in the exhaust gas of the process chamber. The method includes treating a substrate under an excited gas, and thereby generating an exhaust gas to reduce the content of the toxic gas in the exhaust gas. The toxic gas content reduced by monitoring the exhaust gas is controlled. Another object of the present invention is a device capable of processing the gas discharged from a process chamber. The device includes a processing chamber capable of processing a substrate under a stimulated gas and thereby generating an exhaust gas stream, and a self-exhaust gas stream. 5 pages of this paper size are applicable to China National Standard (CNS) A4 specification (210 X 297 mm) ------------ ^ Installation -------- Order ------ --- (Please read the notes on the back before filling this page) 553761 A7 B7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (1) A first reactor for removing silicon and fluorine components, and a second reactor for removing the second component in the exhaust gas stream. Another object of the present invention is an apparatus capable of processing the gas discharged from the process chamber. The apparatus includes a reactor capable of removing one of the components from the exhaust gas stream. The reactor includes an inlet and a An outlet, and a heater located downstream of the outlet. Another object of the present invention is a device capable of cleaning the gas discharged from the process chamber. The device includes a reactor capable of receiving the exhaust gas flow, and a device capable of dispersing the clean gas in the direction opposite to the exhaust gas flow. A nozzle in the reactor and a filter sufficient to remove its reaction products from the exhaust gas stream. Another object of the present invention is an apparatus capable of cleaning the gas exhausted from the process chamber. The apparatus includes a reactor for receiving the exhaust gas stream, and a throat nozzle port adapted to inject the clean gas stream into the reactor ( venturi nozzle) 〇 Another object of the present invention is a device that can clean the gas discharged from the process chamber. The device includes a reactor containing four clean rooms. Another object of the present invention is a device capable of cleaning the gas discharged from a process chamber. The device includes a reactor that receives an exhaust gas stream and a clean gas stream, a filter, and a device capable of drawing clean gas from the reactor. And pass through the filter's pump. Another object of the present invention is a device that can clean the gas discharged from the process chamber. The device includes a first clean room, which contains at least a first reactor capable of receiving the exhaust gas stream; a second clean room, The paper size on page 6 applies to the Chinese national standard (CNS> A4 size (210 X 297 mm) ------------- — — ml — ^ · 11111111 (Please read the note on the back first) Please fill in this page again) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 B7 V. The description of the invention () contains at least a second reactor that can accept the exhaust gas stream; and a clean gas stream can be passed from the first reactor The pump is pumped to the second reactor. Another object of the present invention is a device capable of cleaning the gas discharged from the process chamber. The device includes a reaction capable of receiving the exhaust gas and directing the clean gas into the exhaust gas. And a detector capable of detecting the condition of the clean air stream or the reactor. Another object of the present invention is a device capable of processing gas discharged from a process chamber. The device includes A first reactor capable of receiving an exhaust gas stream, a second reactor capable of receiving an exhaust gas stream, and a pressure compensator capable of compensating a pressure difference between the first reactor and the second reactor Another object of the invention is a method capable of processing exhaust gas from a process chamber, the method comprising processing a substrate in a process chamber, thereby generating exhaust gas, and removing silicon components from the exhaust gas in a first reactor And the fluorine component, and remove the second component from the exhaust gas in the second reactor. Another object of the present invention is a method capable of processing the exhaust gas from the process chamber, the method comprising the process of including the exhaust gas in the reactor. One of the components is removed, and the exhaust gas is heated downstream of the reactor. Another object of the present invention is a method which can clean the exhaust gas from the process chamber, which method comprises introducing an exhaust gas stream into the reactor, Dispersing the clean air stream in the reactor in a direction opposite to the exhaust air stream, and filtering the exhaust air stream. Another object of the present invention is a method, It can be cleaned by the process room on page 7. This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ------------- Installation ------- -Order --- (Please read the notes on the back before filling this page) 1 553761 A7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Exhaust gas, this method includes introducing the exhaust gas stream into the reactor and injecting a clean gas stream into the reactor through a nozzle opening. Another object of the present invention is a method capable of cleaning the gas discharged from the process chamber. The method includes introducing an exhaust gas stream into a reactor, dispersing the clean gas stream in the reactor, and passing the clean gas stream through a filter. Withdrawn from the reactor. : Another object of the present invention is a method capable of cleaning the gas exhausted from the process chamber. The method includes introducing an exhaust gas stream into a first reactor, introducing the exhaust gas stream into a second reactor, and allowing cleanliness. The gas stream flows from the first reactor to the second reactor. Another object of the present invention is a method capable of cleaning the gas discharged from the process chamber. The method includes introducing the exhaust gas stream into the reactor, and introducing the clean gas stream into the reactor, and detecting the clean gas stream or the reaction. Condition of the device. Another object of the present invention is a method capable of cleaning the gas discharged from a process chamber. The method includes introducing an exhaust gas stream into a first reactor, processing the exhaust gas stream in a second reactor, and compensating the first gas stream. The pressure difference between one reactor and the second reactor. Another object of the present invention is a heating device for exhaust gas, which includes an exhaust gas inlet, an exhaust gas outlet, a wall adjacent to a gas flow channel, and a heater capable of heating the wall, wherein the exhaust gas The exhaust airflow introduced through the exhaust airflow inlet is heated while flowing along the gas flow channel toward the exhaust airflow outlet. Another object of the present invention is a substrate processing equipment, which includes a paper size that can be applied to the Chinese National Standard (CNS) A4 specification (21〇X 297 public love) on page 8 ---------- --Install -------- Order— (Please read the precautions on the back before filling this page) A7

553761 V. Description of the invention () Processing chamber for processing a substrate under excited gas and thereby generating exhaust gas flow, and-melting furnace, the dazzling furnace system includes an exhaust gas inlet, an exhaust gas outlet, The wall of the gas flow channel and a heater capable of heating the wall, wherein the exhaust airflow is an exhaust airflow introduced through the exhaust airflow inlet and is heated by the heater when flowing along the gasflow channel toward the exhaust airflow outlet. Another object of the present invention is a method for processing a substrate and an exhaust airflow, which includes processing the substrate in a processing area, thereby generating an exhaust airflow, allowing the exhaust airflow to pass through a gas flow channel, and firstly When passing through the gas flow channel twice, the exhaust gas flow is heated to a preset temperature. Another object of the present invention is a device capable of processing gas discharged from a process chamber. The device includes at least a catalytic reactor, the catalytic reactor having an exhaust gas inlet, an exhaust gas outlet, and a suitable The internal space containing the catalytic substance and an opening that leads to the catalytic reactor are suitable for removing or transporting a catalytic substance. Another object of the present invention is a method capable of removing the catalytic substance from a catalytic reactor that can accept gas emitted from a process chamber, the method comprising at least providing an opening to the reactor, and At least a portion of the catalytic substance is removed through the opening. Another object of the present invention is a device capable of processing gas discharged from a process chamber. The device includes at least a catalytic reactor, the catalytic reactor having an exhaust gas inlet, an exhaust gas outlet, and a suitable Releasable content container of the catalytic reactor (reactor page 9 This paper size applies to Chinese National Standard (CNS) A4 specifications (21 × 297 public love) (Please read the precautions on the back before filling (This page) ---- I! — Order! Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () container) 〇 Another purpose of the present invention is A method for removing a catalyst from a system capable of processing a gas discharged from a process chamber, the method including at least contacting the catalyst in a container and removing the catalyst from the container. Another object of the present invention is a device capable of processing the gas discharged from a process chamber. The device includes at least a processing chamber capable of processing a substrate under an excited gas and thereby generating an exhaust gas stream, and a catalyst. The catalytic reactor has an exhaust gas inlet, an exhaust gas outlet, and a catalytic substance existing in its internal space, wherein the catalytic substance can be removed from the equipment. Another object of the present invention is a device capable of processing the gas discharged from a process chamber. The device includes at least a processing chamber capable of processing a substrate under an excited gas and thereby generating an exhaust gas stream, and a catalytic property. A reactor having an exhaust gas inlet, an exhaust gas outlet, an internal space suitable for containing the catalytic substance, and means for transferring or removing the catalytic substance between the catalytic reactors ( means). Another object of the present invention is a method capable of processing the exhaust gas from a process chamber. The method includes treating a substrate under an excited gas, and thereby generating the exhaust gas, catalyzing a reaction in the exhaust gas, thereby catalyzing a reaction. The exhaust gas is processed and the catalytic material is removed from the catalytic zone. Another object of the present invention is a method 'which is capable of forming and processing exhaust gas from a process chamber. The method includes introducing a process gas into the process chamber and forming it into a process chamber before, during, or after processing a substrate in the process chamber. The 10th page of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) | 1 Order—1111! 553761 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention () Exhaust gas containing f2 gas and passing this exhaust gas over a catalyst to reduce the F2 gas in the exhaust gas Of content. Another object of the present invention is a method capable of forming and processing an exhaust gas from a process chamber. The method includes introducing a process gas into the process chamber and forming a process gas before, during, or after processing a substrate in the process chamber. The exhaust gas' containing F2 gas is introduced here: in the exhaust gas, the additive contains at least a hydrogen-containing substance and an oxygen-containing substance, thereby reducing the f2 gas content in the exhaust gas . Another object of the present invention is a method capable of forming and processing an exhaust gas from a process chamber. The method includes introducing a process gas into the process chamber and forming a process gas before, during, or after processing a substrate in the process chamber. The exhaust gas containing the F2 gas is heated, and the exhaust gas is passed over a catalyst to reduce the content of the exhaust gas in the exhaust gas. Another object of the present invention is a method capable of cleaning the process chamber. The method at least includes introducing a clean gas into the process chamber and forming an exhaust gas containing the gas. The content of F2 gas in the exhaust gas. Another object of the present invention is a method capable of forming and processing an exhaust gas from a process chamber. The method includes introducing a gas into the process chamber to process a substrate or cleaning the process chamber to form an exhaust gas containing F2 gas. A gas is introduced into the exhaust gas. The additive contains at least a substance containing wind and an substance containing oxygen, and the exhaust gas is passed through a catalyst to form HF, and then water is introduced into the exhaust gas to Apply the Chinese standard (CNS) A4 specifications (210 X 297 mm) on page 11 of this standard (please read the precautions on the back before filling this page)

553761 A7

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () HF dissolves. Another object of the present invention is a substrate processing equipment, the equipment includes at least a process gas source; a process chamber, which can perform processing with the process gas and thereby form an exhaust gas containing h gas; And a catalytic reaction H ′, which can treat the exhaust gas to reduce the content of I gas. Another object of the present invention is to provide a substrate processing equipment, where all the kings are "equipped". The equipment includes at least a process chamber, which can perform the treatment by the process gas and lice and thus form a Exhaust gas containing F2 gas; a cylinder and an additive source, which can introduce additives into the exhaust gas to reduce the F2 gas content in the exhaust gas. The additive system includes at least Today—〆 ° Substances containing tritium and a substance containing oxygen. Brief description of the drawing = The characteristics, purposes, and advantages of the present invention can be represented by π, and the following descriptions of McCaw, the scope of patent applications, and the explanation of implementation附图 5 | ϊ; Yang Zhi got a deeper understanding. Among them, Fig. 1 is a partial diagram of an exemplary semiconductor process equipment, which can process a substrate and thus produce embedded products. Exhaust gas per oxygen body. Figure 2 is an example of an exemplary catalytic reactor, which can be used in combination with a catalytic mitigation system. Figure 3 shows various In the temperature range, 3 kinds of gas are destroyed. Points ratio. Page 12 of this paper scale applicable to Chinese National Standard (CNS) A4 size (210 X 297 mm) ------ (Please read the notes and then fill in the back of this page)

553761 A7 B7 —__ 5. Description of the invention () Figure 4 is a schematic diagram of an embodiment of a catalytic mitigation system. (Please read the precautions on the back before filling out this page) Figures 5a and 5b are schematic diagrams of heaters that can be used with catalytic mitigation systems. FIG. 6 is a schematic diagram of another embodiment of a catalytic mitigation system. Figure 7 is a schematic diagram of a previous clean room embodiment that can be used with a catalytic mitigation system. -Figure 8 is a schematic diagram of another embodiment of a catalytic mitigation system. Figure 9 is a schematic diagram of a heat exchanger that can be used with a catalytic mitigation system. Figure 10 is a schematic diagram of a multichamber conduit that can be used with a catalytic mitigation system. Figure 11 is a schematic diagram of an embodiment of a control system that can be used with a catalytic mitigation system. Figure 12 is an example of a control program that can be used to control a catalytic mitigation system. Figure 13 is a partial schematic view of another embodiment of a clean room prior to use with a catalytic mitigation system. Figure 14 is a partial schematic view of a throat and throat nozzle embodiment that can be used with a front clean room. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Figure 15 is a schematic diagram of another embodiment of the former clean room. Fig. 16 is a partial schematic view of an embodiment of a front clean room and a clean liquid circulation system. Fig. 17 is a partial schematic view of an embodiment of a front clean room and a clean liquid circulation system. The figure shows that clean liquid can flow into the clean room and the cooling system. Page 13 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) _ ---- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 ----- B7 V. Description of the invention ( Figure 18 is a partial schematic view of another embodiment of a heater that can be used with a catalytic mitigation system. Figures 19a-19d are schematic side views of portions of a heater embodiment that can be used with a catalytic mitigation system. Figure 20 is a schematic diagram of another embodiment of a catalytic reactor that can be used with a catalytic mitigation system. * Fig. 21 is a schematic side view of another embodiment of the catalytic reactor of Fig. 20 which can be used with a catalyst collector and a catalyst source. Fig. 22 is a partial top view of another embodiment of a catalyst reactor and a reactor vessel that can be used with the catalytic mitigation system. Figure 23 is the 'intent' of the catalytic reactor of Figure 22 separate from the reactor vessel. Section 24 is a partial top view of another embodiment of a catalytic reactor and a reactor vessel using a catalytic mitigation system. Fig. 25 is a schematic diagram of a catalytic reactor shown in Fig. 25 separated from a reactor vessel. Fig. 26 is a schematic diagram of another embodiment of a substrate processing apparatus that generates a toxic exhaust gas stream. Fig. 27 Fig. 疋 Cleaning liquid Schematic diagram of another combination of the recirculation system and the front clean room. Comparative illustration of the drawing numbers: The first page of the 25 process room This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) (Please read the back first Please pay attention to this page before filling in this page) I Pack ---- Order --------- · 553761 A7 B7 V. Description of Invention (Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 30 Semiconductor substrate 35 Plasma Zone 40 Bracket 45 Mechanical or electrostatic fork post 50 Electrostatic element 52 Dielectric layer: 53 surface 54 trench 55 electrode 60 potential supply 66 gas passageway 67 heat exchange gas supply 68 outlet 70 gas supply source 72 gas nozzle / Process gas diffuser 75 Side wall 80 Exhaust system 82 Throttle valve 85 Exhaust pipe 100 Exhaust gas 101 Slow gas flow 125 Pump 200 Catalytic slow system 210 Conduit Page 15 (Please read first Read the notes on the back and fill in this page again.) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 553761 A7 B7 V. Description of the invention () 215 220 222 223 224 230 231 232 233 234 235 236 237 240 241 242 243 244 250 251 Flow control system Additive gas supply room Additive gas supply source channel Front clean room inlet outlet nozzle Front clean room reactor filter system Valve storage tank heater inlet Out CT Horizontally inwardly extending coil Coil catalytic reactor inlet extending longitudinally inward (please read the notes on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 252 Exit 255 High surface area piece 257 Catalytic surface 260 Cooling system No. 16 The paper size of this page applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 553761 A7 B7 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨-丨! -Order- — I!-— (Please read the back first Please fill out this page before printing) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description () 265, 275 270 280 3 10 3 12 3 15 3 20 322 327, 347 328, 348 329, 330 332, 333 335 340 342 345 350 355 357 359 359 360 361 362 365 After collecting the storage tank, the clean room exhaust device hydrolyzes the pipe string, the humid environment, the clean gas supply source, the first clean channel nozzle Substance platform channel throat nozzle that can increase surface area Second clean pipe string Second nozzle source Storage tank demister outlet C7 filter heat exchanger inlet outlet Π channel page 17 This paper size applies to China National Standard (CNS) A4 specifications ( (210 X 297 mm) 553761 A7 B7 V. Description of the invention () Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 370 Overflow channel 371 Reduced exhaust air inlet 372 Reduced exhaust air outlet π 375 Reduced Exhaust air flow channel 376 Filter unit 378 Insulation material 1 400 Controller 401 Image interface terminal 402 Recirculation system 405 Gas analysis probe 405 406 Pump 410 Gas analyzer 420 Pressure monitor 421 Particle filter 430 Temperature monitor 43, 432, 433, piping 434 440 Component control system 441 Clean liquid source 450 Valve controller 451, 455 Sewer 460 Monitor 461, 471 Piping page 18 (Please read the precautions on the back before filling in this Page) This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 553761 A7 B7 V. Description of invention (Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 475 Sorting program coding Process selection program 480 Dispersing valve Process room management program 481 P-trap 482 Pump 485 Exhaust gas slow-down 490 Slow-down valve 500 Control system 510 Controller 520 pH meter 530 Flow controller 540, 540, 540, heater / heater 592, 5929 541, 541 ”inlet 542 > 5425 order 545, 545 'spiral gas channel 550 external heating element 595, 595” 551 hollow interior 555 > 5559 outer channel 556, 557 closed end 560 > 565 inner tube 561, 566 Entrance Page 19 (Please read first (Notes on the back then fill out this page)

This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 553761 A7 _B7 V. Description of the invention () Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 562, 563 Exit end 567 Hollow 570 Gap 580, 590 Obstacle 581 > 591 opening 593 > 5939 Gas flow channel 594, 5945 wall 610 > 620 channel 614, 624 flange 630 > 635 channel cover 632 insulation part 640 vacuum tube 650 vacuum generator 655, 640 line 660 catalyst collection Reactor 661 inlet 662 outlet 665 filter 668 exhaust gas 670 catalyst source 710, 720 stabilizer plate 750 > 850 reactor vessel 760 ^ 860 reactor vessel wall 764 > 864 flange page 20 (Please read the precautions on the back before filling (This page). II n ϋ nnn el, II n I a ^ in III »This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 553761 A7 B7 V. Description of invention () Wisdom of the Ministry of Economic Affairs Property Bureau employee consumer cooperative print 765 > 865 space 770 > 780 groove 790 lid 875 side 880 fine groove 8 85 Fine groove opening 890 0-type sealing ring 895 Thin plate 925 Substrate processing equipment 935 Process chamber 940 Gas diffuser 942 Nozzle or manifold 944 Wall 946 Floor 950 Processing area 952 Supply line 954 Process gas supply source 956 Air valve 958 Process Controller 960 bracket 962 > 964 electrode 970 power supply 972 network 976 heating mechanism page 21 丨 — — — — — — ——— install · ----- 丨 丨 Order · 丨 丨!丨 i (Please read the precautions on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 553761 A7 B7

V. Description of the invention () 980 982 990 994 996 Exhaust gas exhaust system process room Clean gas supply source Throttle valve Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics Detailed description of the invention: This invention relates to a kind of Gas treatment equipment used by Wang Zhiqi, and a method that can reduce the toxic gas content in the exhaust gas from the process chamber. The foregoing description and drawings represent only an exemplary description of the present invention, and the scope of the present invention is not limited thereto. Therefore, although these descriptions and illustrations can explain the characteristics of the present invention, it is necessary to understand that each of the characteristics can be used independently in the present invention, and not limited to the specific illustration. Η Shidu α "human τ" and the present invention includes these Any combination of features. Figure 1 is a partial schematic view of an exemplary semiconductor process equipment, which includes a chamber such as the MxP + oxidation etching chamber sold by Santa Clara, Claifornia. 25. For a general description of this room, see US Patent Nos. 4,842,683 and 5,215,619 by Chen et al .; and US Patent No. 4,668,338 by May dan et al .; the contents of which are incorporated herein by reference. Such process chambers can be used in multi-chamber integrated process systems, such as the system in U.S. Patent No. 4,9 5 1,601 by Maydan et al., The contents of which are incorporated herein by reference. Examples are shown here, which are suitable for processing semiconductor substrates 30. The examples are only for the purpose of illustrating the present invention, and the present invention is not limited to page 22. The paper dimensions are applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 'loading ------ (Please read the precautions on the back before filling out this page) tr --------- ceremony 丨 553761 A7 V. Description of the invention () Not limited by this During the manufacturing process, the chamber 25 is evacuated to make the chamber pressure lower than about 500 Torr, and the substrate 30 is transferred from the vacuum load transfer chamber (not shown) to the plasma region 35 of the chamber 25. The substrate 30 is placed on a bracket 40, which can optionally include a mechanical or electrostatic fork 45. A typical electrostatic fork 45 comprises an electrostatic member composed of a dielectric layer 52: 50, The surface 53 of the dielectric layer 52 is suitable for receiving a substrate 30. The dielectric layer 52 may cover an electrode 55-it may be a single conductor or several conductors-it can be picked up by a charge-level grip 30. After the substrate 30 is placed on the pillar 45, the electrode 55 is charged, depending on the degree of negative electricity of the substrate 30, the potential supply source 60 provides the electrode 55 with sufficient static electricity to hold the substrate 3Q. The electrostatic fork The fork 65 is supported by a bottom 65 below the column 45 and can be selectively electrified at an RF bias potential. The surface 53 may contain a trench 54 such as helium The heat exchange gas can maintain the temperature on the substrate 30. The heat exchange gas system is provided by a gas channel 66 having one or more outlets 68, which can transfer gas to the surface 53 of the fork 45 and extend through One or more electrodes 55 and the dielectric layer 52. A heat exchange gas supply source 67 supplies heat exchange gas to the gas passage 66 through a gas supply pipe. The trench 54 on the surface 53 of the dielectric layer 52 is just the right size The heat exchange gas is held and dispersed to heat or cool the entire back surface of the substrate 30. The trenches 54 are like the trenches 54 crossing each other on the dielectric layer 52. Preferably, at least one gas channel 66 terminates in one of the trenches 54; and more preferably, the gas channel 66 terminates in one or more trenches 54 that are staggered with each other. The gas channel 66, gas supply pipe, and ditch 54 are based on page 23. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) • I 丨 — 丨 i 丨 丨 — 丨 installed !! Ordered by S 丨 I 丨 S 丨 i 丨 (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 Α7 ______ Β7 V. Description of the invention () Drilling, drilling or grinding. Typically, the heat exchange JL body contains or gas' which is supplied at a pressure of about 5 Torr to about 30 Torr, but other gases such as CF4 can also be used. The process gas system is introduced into the chamber 25 via a gas supply pipe including a first gas supply source 70 and one or more gas nozzles 72 in the chamber 25. The gas in the chamber 25 is generally maintained at a low pressure. Applying an electromagnetic energy to the process gas can form a gas plasma in the plasma region 35. In the chamber 25, the plasma is generated by applying an rf electric current to the electrode 55 (as a cathode) and grounding the side wall 75 in the chamber 25 to form another electrode 55 (anode). Alternatively, an RF current may be applied to a conductive coil (not shown) to conduct the coupling energy into the chamber 25 to form a gas plasma in the plasma region 35. The frequency of the rf current applied to the electrode 55 or the conductive coil is generally between about 50 KHz to about 60 MHz, and more preferably about 3.56 MHz. Electron cyclotron resonance can also be used to increase the strength of the plasma in a magnetically enhanced reactor, which uses a magnetic field generator 77 such as a permanent magnet or an electromagnetic coil to provide a magnetic field to increase the plasma area. Plasma strength and uniformity in 35. Preferably, the magnetic field system includes a rotating magnetic field, and the axis of rotation of the magnetic field is parallel to the plane of the substrate 30, as described in U.S. Patent No. 4,842,683. The exhaust gas 100 contains process gas and process by-products, and is discharged out of the chamber 25 via an exhaust system 80 which can be depressurized to approximately 1.0 mTorr. The exhaust system 80 includes an exhaust pipe 85, which is connected to one or more pumps capable of evacuating the gas in the chamber 25, such as a high vacuum pump or a page 24. This paper applies Chinese national standards. (CNS) A4 specification (21〇X 297mm) (Please read the precautions on the back before filling this page)

553761 A7

Printed by the Consumer Cooperative of the Ministry of Economic Affairs, Kao Hui Property and Employee Cooperatives. The exhaust pipe 85 has a throttle valve 82 which can control the gas pressure in the chamber 25. In addition, the optical endpoint detection technology is usually used to measure the intensity of the light emitted by each gas in the chamber 25, or reflected by the layer on the substrate 30 Light intensity to determine whether the etching process is complete. In the operation of a typical semiconductor process chamber 25, a semiconductor substrate is placed on a support 40 in the process chamber 25, such as cf, CF, 4 2 6 Λ c3f8, chf3, sf6, nf3, cof2 Process gas composed of fluorine-containing gas such as ch3f, c4f8, CH2F2, c4f, etc. will be introduced into the processing area 35 through the process gas disperser 72. The process gas system is excited by a gas-filled exciter in the chamber 25, for example, the substrate 30 is treated in an electromagnetically charged gas or a microwave-induced plasma gas. Alternatively, the gas can be excited in another unconnected chamber. During or after the treatment, the exhaust gas formed by the used process gas and gas by-products is discharged out of the chamber 25 and enters the conduit 210 of the catalytic mitigation system 200. The fluorine-containing gas may also be used in the cleaning process of the process chamber 25. To reduce the content of toxic gases such as PFCs gas and undesired gases in the exhaust gas 100, an additive gas may be added to the exhaust gas. For example, a gas containing hydrogen and oxygen, such as h2O, can be added to the exhaust gas 100 containing CF4 to convert cf4 to

HF. It is generally believed that the reaction proceeds through the following reaction formula: CF4 + 2 H20 — C02 + 4 HF CO can be directly discharged, and HF can be discharged by dissolving it in water. However, it is still highly corrosive and highly toxic. After minor adjustments, hydrogen and oxygen can also be used to decompose other PFCs. Page 25 The paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) '------ ---- ---------------- ^ --------- 2 Please read the notes on the back before filling in this page, > 553761 A7 B7 V. Description of the invention () Thing. For example, it is generally believed that CJ6 can interact with h20 and oxygen through the following reaction formula: (Please read the precautions on the back before filling this page)

2 C2F6 + 6 H20 + 02 — 4 C02 + 12 HF Therefore, you can add H2O and / or oxygen or other reactive gases to the exhaust gas 100 to reduce the content of toxic gases in the exhaust gas. Catalysts are known to help these exemplary mitigation reactions proceed. Therefore, in the first version of the wheat of the present invention, an exhaust gas 100 is passed over a catalyst. The catalyst may be placed in a catalytic reactor 250 together with the exhaust gas 100 and the additive gas stream as shown in FIG. The exhaust gas 100 is evacuated from the catalytic reactor 250 by a vacuum pump, and the flow of the exhaust gas flowing through the catalytic reactor 250 is optionally adjusted by a flow controller such as a throttle valve. In addition, the exhaust gas 100 can also be mixed upstream with reactants such as additive gas or liquid, and then the gas mixture passes through the inlet 25 1 through the catalytic reactor 250 and exits through the outlet 252 to Provide a keystone scale / fluid that can be discharged into the atmosphere or can be easily discarded after disposal. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics. The catalytic reactor 250 contains a catalytic surface 257 that catalyzes a reaction to reduce the amount of toxic gases in the exhaust gas. A vacuum pump or flow control device is located on two opposite sides of the catalytic reactor 250 so that the exhaust gas 1000 can flow through the catalytic reactor 250. The exhaust gas 100 may be mixed upstream with a reactant such as an additive gas or a liquid, and this exhaust gas stream enters with the additive gas through an inlet 251, passes through a catalytic reactor 250 ', and exits through an outlet 252. The catalytic surface 257 can be a structured form, for example, from page 26. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) A7 B7

553761 V. Description of the invention () Ceramic or metal structures made of chemical substances or structures that can support fine particle catalysts, granular foam, or catalytic reactor 250 or the coatings on their walls. For example, the catalytic surface 257 may include a surface that supports a morphology. The support structure includes at least a honeycomb component with catalyst embedded therein to form a high surface area member 255. When the exhaust gas 100 enters from the inlet 251 When passing through this high surface area, the yak 255 passes above and then exits through the exit 2 5 2. The catalytic surface 2 5 7 may also be a structure that already contains a ceramic substance such as cordierite, Al203, aluminum silicate, mullite, silicided carbon, nitrogen silicide, zeolite, etc .; or may include a structure such as Zr02, Al2 〇3, Ti02 or a combination thereof or other coatings with catalytic properties and the like. This catalytic surface 257 may also be embedded in materials such as Pt, Pd, Rh, Cu, Ni, Co, Ag, Mo, W, V, La, or a combination thereof or other known substances that enhance catalytic activity. The reduced gas stream 1 0 1 leaving the catalytic reactor is already very safe and can be discharged directly or discarded after simple processing. Passing the exhaust gas 100 over the catalytic surface 257 shows that the activation energy of this slowdown reaction has been reduced, so the reaction rate can be increased. For example, by using a suitable catalyst surface, the activation energy required to decompose CF4 can be reduced by about 135 Kj / mol. In another embodiment, the activation energy of C2F6 can be reduced by about 98 Kj / mol. The minimum activation energy that allows the reduction of PFC content can also exist at low pressure ', thereby reducing energy consumption and improving reaction efficiency. Figure 3 shows the relationship between the three types of PFC gas and temperature in various temperature ranges. These three gases are CF 4, C 2 F 6 and C 3 F 8 are the exhaust gas 100 and the additives pass through the catalytic surface. The paper size on page 27 above 257 applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) F «ΛΜ9 ϋ mmmmmm nn n- ^ δ ,, fl oh · .Mmi I a ···· Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 Printed by the Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (). PFC can be reduced almost completely at temperatures below 700 ° C. Preferably, about 80% to about 100% of these toxic gases including PFC are completely destroyed, more preferably about 90% to about 100% are completely destroyed, and most preferably, about 95% to about 100% are completely destroyed To obtain a sufficiently reduced exhaust gas. All three PFC gases are attenuated at temperatures below 1000 ° C. At a temperature of 800 ° C, a clear mitigation effect is demonstrated. From about 400 ° C to about 800 ° C, the mitigation effects of these three PFC gases also began to increase. From a temperature of about 550 ° C to about 700 ° C, CF4 has been significantly damaged, and at about 600 ° C, the damage ratio has exceeded 95 ° /. . At higher temperatures or reaction temperatures below about 700 ° C, especially at about 700 ° C, the proportion of 'CF4, C2F6, and C3F8 gas is destroyed up to about 95%. Provides higher efficiency and lower energy consumption at lower temperatures. Figure 3 also shows the effective period of the catalyst. Each of these three gases shows the tests performed after processing 1,000, 22,000, and 53,000 substrates, respectively. The similarity of the three curves to each other shows the continuity effect of the catalytic surface 257 over a long period of time. It is expected that after the catalytic tilH has been treated for 100, 000 bases, the milk dragon maintains such a high efficiency ... Therefore, the catalyst and its catalytic surface can be used for at least 6 months. In one aspect, the catalytic reactor 250 is part of a large catalytic mitigation system 200. An example of this catalytic mitigation system is shown in FIG. A duct 210 is tightly coupled to the exhaust system 80 of the chamber 25 so that the exhaust gas 100 containing toxic gases such as PFCs can flow from the chamber 25 into the duct 210. This tube 210 can be transported on page 28. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ϋ i ^ fl 1 I 1 i · ——Hi ϋ · MMmmf a · — 1-.1 1 I —.1 one in ϋ nn 1 · — an n I fl (please read the precautions on the back before filling this page) 553761 A7 B7 V. Description of the invention () Out of gas 100, let it pass through this catalytic retardation Less system 200. The catalytic mitigation system may generally include a flow control system 2 1 5, an additive gas supply chamber 220, a heater 240, a catalytic reactor 250, a cooling system 260, and a rear clean room. 270. The flow control system 2 1 5 includes a valve 2 1 7 located in an inlet pipe 2 1 8. The inlet pipe 218 is in communication with the pipe 210 to allow air or other non-reactive gas to be introduced into the exhaust gas stream 1 0 0 'In addition, the pressure in the catheter 210 can be adjusted. In addition, it may be necessary to provide pressure control of the exhaust gas stream 100 to provide sufficient gas flow through the catalytic mitigation system 200. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). You can also use the flow control system 215, the additive gas supply room 220 and / or the rear clean room 230. Introduce appropriate additive gas streams, such as H20 and 02, into the exhaust gas stream 100. For example, a suitable additive gas supply source 220 includes a channel 223, which is controlled by a valve 224 to communicate with the additive gas or fluid supply source 222. Appropriate additives are added which can react with toxic gases in the exhaust gas stream 100 to achieve the purpose of mitigation. For example, in one embodiment, PFCs can be decomposed by adding about 0.1% to about 10% water, more preferably about 3% water, to the exhaust gas stream 100. Other additive gases can also be added, such as oxygen, or air, or other additive gases that can release oxygen-containing substances or oxygen-containing compounds into toxic gases. Alternatively, nitrogen may be added. To reduce the amount of undesired products such as CO ', it is preferred to add a gas such as 02 and / or air. In another embodiment, an additive containing oxygen and / or hydrogen is added to the page. The paper size is applicable to Chinese National Standard (CNS) A4 specification (21 × 297 mm) 553761 A7 V. Invention Explanation (In the gas stream 100, to produce products such as HF, coF2; Similarly, COF2 is also soluble in water. Others that can react with toxic gases to achieve the purpose of mitigation Additives A downstream heating system, such as a heater 240, can heat the exhaust gas 100 and additives in the channel 210 to promote the catalytic reaction in the catalytic reactor 250 to reduce the content of toxic cyanide The temperature of the heated gas stream 100 after passing through the catalytic reactor 25 can reduce the toxic gas content in the gas stream. In one aspect, the exhaust gas 100 is heated to a temperature of about 700 ° C to destroy PFC gas. As shown in Figures 5a and 5b, the heater 240 has an inlet 241 and an outlet 242, and may include a coil 243 extending laterally inward or a coil 244 extending longitudinally inward. The exhaust gas may pass directly through the coil 243, 244 up The heat is transferred from the coils 2 4 3, 2 4 4 to the exhaust gas 100 by convection, and the exhaust gas is heated by conduction. The coil temperature is maintained between about 800 ° C and about 870 ° C. In this way, the temperature difference of the exhaust gas from the inlet 24 1 to the outlet 242 is about 200 ° C to 25 ° C. In order to achieve the best mitigation effect of the PFC gas in the catalytic mitigation system 2000, The best temperature is about 70 ° C. A series of heaters 240 arranged along the channel 210 can be used to increase the temperature of the exhaust gas 100 to about 700 ° C; or these several The heaters 240 arranged along the channel 210 are connected in series into a loop, and the exhaust gas 100 is circulated several times to raise its temperature to about 700 ° C. Through the catalytic surface 257 in the catalytic reactor 250 After that, the exhaust gas that has been reduced can be cooled down before it is cleanly discharged. Page 30 This paper applies Chinese National Standard (CNS) A4 (210 X 297 mm). (Please read the back (Please fill in this page for matters needing attention) Packing ---- Order --------- Member of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Consumer Cooperatives Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economy 553761 A7 ________________ B7 V. Description of the invention () Cooling down. In one embodiment, the cooling system 260 includes a fluid cooling system, such as a cold water quenching system, which is borrowed Spray the water to reduce the temperature of the exhaust gas 1 0 1 that has been reduced. Or you can use other cooling systems such as a refrigeration system. The exhaust gas 1 0 1 that has been reduced can be introduced into a rear clean room 270 The rear clean room 270 has a reactor capable of dissolving the exhausted oxygen gas 101 which has been reduced, in a solvent. Solvents that can be used in subsequent clean rooms generally depend on the type of by-products that have been mitigated. For example, acidic by-products such as HF or HC1 can be dissolved in water to form an easier-to-handle acidic solution and discarded. It should be noted that acidic by-products such as HF may be formed in the catalytic mitigation system 2000. The HF present in the exhaust gases 100 and 101 is highly toxic and difficult to handle, so operators should try to avoid contact. In addition, HF is quite corrosive, especially at high temperatures and in the presence of water vapor or oxygen. Known alloys made of nickel, such as Inconel 600TM or Inconel 625 TM sold by Inco Corporation, Huntington, West Virginia, provide excellent corrosion resistance for catalytic reduction systems 200 And it can be easily sealed because it can prevent HF from escaping from the system to the environment. In this embodiment, the heater gas inlet 240 may be welded to the catalytic reactor 250, or it may be fixed by other permanent fixing methods to prevent toxic gases such as HF from escaping into the environment. FIG. 6 illustrates another embodiment of the catalytic mitigation system 200. The embodiment in FIG. 6 includes a channel 2 10, an air system 2 1 5, an additive gas supply chamber 220, a heater 240, a catalytic reactor 250, and a cooling sheet. Page 31 This paper applies Chinese national standards (CNS) ) A4 specification (210 X 297 mm) -III 1 I ------ · 1111111 ^ «— — — — — 1 — I. (Please read the precautions on the back before filling this page) 553761 A7 B7 5 Description of the invention () Yuan 260 and a clean room 270. In addition, the embodiment of Fig. 6 uses a front clean room 23① capable of processing the exhaust gas before the exhaust gas is processed in the catalytic reactor 250. The previous clean room, as shown in FIG. 7, includes an inlet 231 and an outlet 232 that can accept the exhaust gas 100 from the channel to provide the exhaust gas from the previous clean room 100 to the catalytic mitigation system 2 0 0 Other parts: go. One or more water nozzles 233 extend into the front clean room reactor 234 and spray water on the exhaust gas 100. The front clean room contains a filtration system 23 5 and a valve 236 to maintain the pressure in a storage tank 237 containing water and reaction products. The purpose of printing the former clean room 230 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is to enable the addition of additives to the additive gas supply room. The front clean room 230 may also be used to treat the exhaust gas 100 before the exhaust gas 100 is introduced into the catalytic reactor 250, and to apply a gas or specific substance therein that may harm the catalytic reactor 250 or reduce its effectiveness. Removed. For example, when SiF4 is present in the exhaust gas 100, this SiF4 may deactivate the catalyst or be decomposed due to moisture and form silicon deposits on the catalyst ^ SiF4 vapor is usually in the oxidation etching process of chamber 25 form. Previously, after the clean room 230 had reacted with S1F * and a clean air stream such as water, its content in the exhaust gas 100 could be reduced '. It is generally believed that the reaction system of water and SiF4 vapor proceeds through the following reaction formula:

< H20 + SiF4 — Si02 + 4 HF The SiO2 and HF products can be easily removed from the exhaust gas loo. HF can be separated from water, and Si02 can be removed by filtration. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 ___ Β7 ___ V. Description of the invention () The catalyst in the 25JL catalyst can be prolonged to have a spider period. The front clean room 230 may also allow H20 or other additive gases to be added to the exhaust gas 100 in a sufficient amount to reduce the content of toxic gases in the catalytic reactor 250. As described above, the removal of SiF4 is important to extend the life of the catalyst in the catalytic reactor 250. In this embodiment, the size and condition of the front clean room 230 need to be sufficient to completely remove all SiF4 in the exhaust gas. It is best to remove at least 90% of SiF4. When about 99% or more of SiF4 is removed, more preferably about 99.9% or more, the catalyst life can be extended to the longest. FIG. 8 shows another embodiment of the catalytic mitigation system. In this embodiment, the system 200 includes a staggered heat exchanger 36, which includes an exhaust gas inlet 361, an exhaust gas outlet 362, a reduced exhaust gas inlet 3 71, and A reduced exhaust air outlet 372. The cooled, fresh and > outgoing gas 100 and the heated, slowed exhaust gas 101 flow through each other and exchange heat. This can increase the temperature of the cooled, fresh exhaust gas by 1000, and reduce the temperature of the heated, slowed exhaust gas 101. Fig. 9 shows such a heat exchanger 360 which allows airflow to stagger. The exhaust gas 100 enters the heat exchanger 360 from the inlet 361 and is dispersed into a plurality of gas channels 365. The reduced exhaust gas flow 101 enters the heat exchanger 360 through the inlet 371 and is dispersed into a plurality of gas channels 3 75. These gas channels 375 are adjacent to the gas channel 365 and can transfer heat energy to the gas channel 365. The reduced exhaust airflow 101 transmits heat energy to the exhaust gas channel 365, and allows the temperature of the exhaust gas 100. Page 33 This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the back Please fill in this page again for attention) ----------------- \ 553761 A7 ----- B7 V. Description of the invention () and the reduced exhaust airflow 1 〇 丨 of The temperature is similar. The heat exchanger 3 60 may be surrounded by a heat insulating material 378 to prevent heat energy from being dissipated into the atmosphere and improve the efficiency of the heat exchanger 360. The heat exchanger 360 is preferably made of a nickel alloy such as Inconel which is resistant to HF and is easily sealed. The heat exchanger can improve the efficiency of the catalytic mitigation system 200 and reduce the energy consumption rate. The efficiency of the heat exchanger 360 is as high as 70%. : The heat exchanger 360 can reduce the number of heaters 240 (the number of times that the heater 240 passes) required to reach the desired temperature and reduce the energy consumption rate of the device. The catalytic mitigation system 200 may also receive airflows from several chambers 25a to 25d as shown in FIG. The counting rooms 25a-25d can be operated together or separately. The chambers 25a-25d can process the exhaust gas flow 100a-10d, which are respectively introduced into the channels 210a-210d communicating with the channel 210 to facilitate the processing in the catalytic mitigation system 2000. The air inlet system 2 1 5 can be used to ensure that sufficient pressure and airflow flows into the catalytic mitigation system 200. As shown in Figure 11, all components and their temperatures need to be properly controlled to ensure that toxic gases, including PFCs, have the best mitigation effect and that the catalytic mitigation system 200 functions properly. After passing the catalytic mitigation system 200, the exhaust gas whose toxic gas content has been almost completely reduced can be discharged into the environment without causing safety concerns. In the embodiment of FIG. 2, the catalytic mitigation system 2000 includes a control and monitoring system including a controller 400. In addition, the pressure detection lamp P and the thermometer τ can also be placed in the catalytic mitigation system 200 as shown in FIG. 11. In addition, the gas analysis probe on page 34 can be applied to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) (Please read the precautions on the back before filling this page) ------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7

V. Description of the invention () The needle 405 is placed in the reduced exhaust gas stream, preferably after the clean room 'to analyze the gas content of the reduced exhaust gas stream 101. The gas analysis probe 405 is in communication with the gas analyzer 41. The gas analyzer 4 i 〇 can provide gas separation data to the controller 400. Another additional gas analysis probe 405 may be placed in the exhaust gas stream, preferably in front of the front clean room 230, to determine whether the exhaust gas stream 100 contains daggers. The gas analyzer 410 includes any commercially available gas analyzer, such as the Sun Valley History of California, Denver Research Center (Standford Researcli Systems,

Sunnyvale, California). A pressure monitor 4:20 and a temperature monitor 43 are connected to the pressure detector and the temperature gauge respectively. The pressure monitor 420 and the temperature monitor 43 may provide the controller 400 with data about the pressure and temperature of the catalyzing mitigation system 200. The controller 400 can control and adjust the operating conditions of the catalytic mouthpiece system 200 and the process in the chamber 25 based on the monitored data. During operation, «: Ri Analyzer 4 1 0 can continuously monitor the toxic gas content in the exhaust gas released by the catalytic mitigation system 200 and provide a continuous output signal, or when the toxic gas content in the exhaust gas has been When the safe emission value is reached, that is. Clear start a safe quantity output signal. The controller 400 includes a computer-readable medium, which has a computer-readable code embedded therein, and can monitor the output signal from the gas analyzer and perform at least one of the following steps: The temperature of the heated exhaust gas stream ', for example, adjusts the heater by a component control system 440 (>; (ii) adjusts the additive gas ϋ or composition by operating a valve control system 450; (iii) ) Adjust the operating conditions of the chamber 25; (iv) page 35 of the final chamber 25. The paper size is facing the Chinese National Standard (CNS) A4 specification (210 X 297 public love). page)

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () A process; (The valve control system 45 ° opens the dispersion valve 48 ° and closes the mitigation " 0, which can guide the exhaust airflow of 纟 25. Off the catalytic mitigation system 200; and (vi) when the toxic gas content in the exhaust gas flow is too high or the catalytic mitigation system 200 is not operating well, a warning can be provided through the monitor 46 or another independent alarm Signal to the operator. When leaving, the exhaust air stream 100 in the clean room 230 contains undesired products, and similar steps can be taken. The step (v) above has some advantages because it allows for catalytic The mitigation system 200 can be periodically replaced without shutting down the substrate processing process of the chamber 25 or when it is inoperable. In addition, the controller 400 is designed to continuously monitor catalytic mitigation The pressure in the system 200 and the air flow it generates. When the specific pressure reading exceeds or falls below an acceptable value, the valve control system 450 or the component control system 440 can be used to open or close the valve. To change An exhaust blower 28 is used to adjust the base dust force. The exhaust device 280 can be a w gas pump or a venturi device, or the like. The controller 400 can be connected to Performance monitoring in the catalytic mitigation system 200 to maintain the temperature of the exhaust air flow i 00, 010 under the best conditions. The controller 400 can also adjust the temperature of the heater 240, or the cooling system needs The amount of cold water to extinguish the temperature. The controller 400 can operate the room 25 and the catalytic reduction system 200, and can include a computer code product that can control a computer, which includes one or more connected to a memory system And CPUs of peripheral control components, for example, one manufactured by Intel Corporation of Santa Clara, California. Page 36 This paper standard is applicable to China National Standard (CNS) A4 (210 X 297 mm) --- --------- Installation -------- Order --- I ----- (Please read the precautions on the back before filling out this page) 553761 Employee Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed A7 B7 5. Description of the invention () Pentium microprocessor sold. CP of controller 400 Us may also include ASIC (application specific integrated circuits), which is a specific component of the operating room 25 or the catalytic mitigation system 2000. The interface 401 between the operator and the controller 400 may be It is a CRT monitor and a light pen with a light sensor at the pen tip. When a specific screen or function is to be selected, the operator can touch a designated area on the CRT screen and press a button with the pen. The color of the touched area will change, or a new menu will be displayed or the screen will display some messages to confirm the message transmitted by the light pen and CRT monitor. But it can also communicate with the controller 400 such as a keyboard, mouse or pointing communication device. The computer program code can operate the CPUs, and can be traditional such as combination language, C, C ++ or pascal. Computer programming language to write and order other computer devices. Use a traditional document editor to place the appropriate program code into a single file or multiple files, and store or embed it in a computer-usable medium, such as a computer memory system. If the code is loaded It belongs to a high-level language. These codes will be compiled by the compiler code. These compilers are originally connected to the compiled window data and routine target programs. When executing these connected target programs, the system user needs to call the added programs first, and let the computer load these programs into the memory to perform the desired J task or program. The computer code contains one or more sets of computer instructions, which can display time, process gas composition points, process chamber pressure and temperature, and the electromagnetic energy in the manufacturing process. Page 37 This paper applies Chinese national standards (CNS) ) A4 specification (210 X 297 mm) ----------- install -------- order—1 ------ {Please read the notes on the back before filling in this Page} 553761 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7__ 5. Description of the invention () Low source, receiver position and other parameters in the process room 25. The computer program instruction set can also control the operation of the catalytic mitigation system 2000, the composition and flow of the additive gas introduced into the system, and the warning signal of the catalytic mitigation system 200 and other safe operating modes or control A preset toxic gas concentration starts the process chamber 25 or controls the trace toxic gas content in the exhaust gas. The better computer code is shown in Figure 12 and it contains array code instructions, such as process selector and process code 475, which can be entered by the operator and select a process order. After that, the selected process order is operated and executed in the selected manufacturing process 25; the process room management code 480 is the priority sequence for operating and managing the ploughshare contribution in the process room 25; exhaust gas is delayed Subtraction code 485 is the operable catalytic mitigation system 200. Although it seems that a set of different tasks is controlled by separate programs, it needs to be understood that these programs can be grouped together, or the tasks controlled by one set of codes can be combined with another set of codes. Achieve the desired effect. Therefore, the controller 400 and the code described herein should not be limited to those mentioned in the embodiment, and other sets of codes or computer instructions that can perform the same action to achieve the same function are also the norm of the present invention. During the operation, the user inputs a set of process settings and process room numbers into the process selection code 475 through the video interface terminal 40. The process setting is composed of the process group parameters of the specific process in the executable room 25, and is represented by the set number of settings. The process selection code 475 will identify a desired process room and the desired process group parameters that can be operated to perform the desired process. The parameters of the process group include the process conditions, for example, page 38. The paper size applies the Chinese National Standard (CNS) A4 rule ^ 297 public love) ----ϋ n imm n ϋ I i 一 ϋ n-ϋ an ϋ ϋ 1 I (Please read the precautions on the back before filling this page) 553761 A7 B7 V. Description of the invention (Process gas composition and flow, secondary mud trap, process chamber temperature and pressure, such as micro or RF bias power and magnetic field Electricity parameters such as plasma parameters, cooling gas pressure, and process chamber wall temperature. Item # Process selection code 475 can pass specific process setting parameters to the process responsible for controlling process operations in multiple different process chambers 25a-25d. Code 480 is used to perform this process setting. For example, the process room management code contains the substrate which can be used in the chamber 25 or on the substrate, and the metallurgy < code. The process room management code 48〇 Control the execution of component code instruction settings in each process room to control the operation of each component in the process room. Examples of component control code in the process room include setting the 30 position of the substrate. will The material arm 30 is loaded on the bracket 40 or the robot arm is removed from the bracket 40. The process gas control command setting can control the composition knife of the process gas supplied to the chamber 25 and the speed setting pressure control command setting. The size of the throttle valve to be opened 'The command setting of the plasma control controls the power level of the electric starter 60. During operation, the' process room management code 48 () will selectively execute the special process according to the desire 'to selectively Call the component code instruction settings in the process room ^, sort the component code instruction settings, and monitor each group: the operation of the code instruction settings, determine which component should be executed according to the process parameters to be executed, and Monitor and determine the response of the steps to execute a component code command setting. | Exhaust gas mitigation code 485 contains a code command setting that monitors the preset toxic gas concentration in the exhaust gas stream and responds to the toxic gas in the exhaust gas stream. The gas content / composition is used to operate the process room or gas processing group. Page 39 This paper size ^ Chinese National Standard x 297 " i ¥ 553761 Member of Intellectual Property Bureau, Ministry of Economic Affairs A7 was printed by the Industrial and Commercial Cooperatives. V. Invention Description (One). One of the better structures of the exhaust gas mitigation code 485 is the packaged gas analysis code 49, which is acceptable from the gas analysis probe. * II Institute The output signal of toxic gas content / composition (or safety emission illusion) is stored in the exhaust gas composition composition table made by other code instructions and set for regular monitoring; ⑴) pressure: control Code 491 can operate the valve control system 45. and / or: component control: system 440 to control the pressure and flow rate of the catalytic reduction system in response to the output signal; (iii) additive gas code 492 can control the valve control System; (iv) / ja degree control code 493 can control exhaust gas flow and I " temperature, (V) safety operation code 494 can monitor the volume of toxic gas in exhaust gas flow, and adjust chamber 25 and / or catalytic performance The operation of the system 200 was moderated to reduce or almost completely remove the toxic gases emitted. The gas analysis code 490 can monitor the toxic gas content or composition in the excited gas measured by the gas analyzer 41, and can receive the output signal (or safety discharge) of the toxic gas content or composition from the gas analysis probe 405 Signal). The gas analysis code 49 ° will store this output signal in the exhaust gas flow composition sub-table made by other code command settings for periodic monitoring. Or, when the content of toxic gas in the exhaust gas exceeds the preset operating safety value, the gas analysis code 49 will output a safe emission signal to other code command settings. The gas analysis code 490 may also be integrated on the gas analyzer 410 instead of the controller 400. The gas analysis code 490 can be adjusted as described above by adjusting the valve control system 450 and / or the component control system 440. Pressure control code 49 1 series includes pressure detectors and pressure paper standards applicable to China National Standard (CNS) A4 specifications (210 X 297 public love). -------- Order ----- ---- (Please read the precautions on the back before filling this page) 553761 A7 B7 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of invention (output signal of monitor 420 to adjust the catalytic mitigation system pressure When the pressure drops or rises above a preset value, the pressure control code can be controlled by the valve control system 45 or by the component control system 440 to operate the exhaust device 280, In order to produce the necessary pressure adjustment, the additive gas code 492 includes a code command setting for controlling the gas, air, or moisture supply through a valve control: system 45 to control the composition of the exhaust gas. Generally speaking, The additive gas code 492 can adjust the opening size of one or more additive gas valves according to the signal transmitted by the controller 400. When the content of toxic gas is detected to increase, the additive gas code 492 will increase the entry Catalytic slowing of the reaction gas flow rate of the system 200 to further reduce the content of toxic gases in the exhaust gas ° The temperature control code 493 includes a temperature response code that can be read to maintain the temperature of the exhaust gas flow 100 and 101 at a level that can be destroyed Within the optimal temperature range of the toxic gas, it is achieved by controlling the temperature of the heater 240 or the cooling system 260 by the component control system 440. The safe operation code 494 is operated together with other code command settings to adjust and discharge Operation of process chamber components or gas processing equipment related to the toxic gas content in the air stream to reduce or eliminate the toxic gas content. For example, the safety operation code 494 can be set to detect a toxic gas in the exhaust air stream When the gas content exceeds the preset value, or there is a trace amount of toxic gas in the exhaust gas stream, the process chamber 25 can be closed. Typically, when the substrate is treated with a toxic gas, generally the paper size on page 1 applies China National Standard (CNS) A4 Specification (210 X 297 mm) ------------ · Installation ------ (Please read the precautions on the back before filling Write this page) Order --------- 553761 A7 V. Description of the invention (In the traditional configuration, each gas supply line on the gas disperser 72 will have several safety gas valves that can be fully closed. When When the content of toxic gas in the exhaust air flow exceeds a preset value, the safety operation code 494 can provide an activation signal to the process gas control command setting in the process room management code 480 to close the safety gas valve. Or, the safety operation program Code 494 can direct the exhaust airflow to the exhaust port as described above or another: gas mitigation system. Conversely, when safety operation code 494 receives a zero or lower safety emission value from the gas analyzer 41 When the output signal is output, the program will send a control signal to instruct the process room management code 48 to continue the operation of the process room 25 in the current mode, and at the same time instruct the exhaust gas mitigation code 485 to perform catalytic performance in its current mode. Mitigation of system 2000 operation. During operation, the safety operation code 494 will repeatedly read the latest data in the composition table of the recently discharged airflow, and compare it with the signal sent by the flow controller that can control the flow level in the process chamber 25, and then send instructions as required. Adjust the process gas flow to reduce or completely remove toxic gases from the exhaust gas stream. Alternatively, when the safety operation code 494 receives a safety output value signal, these operations can also be performed. Typically, the program is set to start when the toxic gas content in the exhaust gas stream exceeds a predetermined value (for example, when the toxic gas concentration is between about 0.001% to about 丨 0). operating. In another embodiment, the safety operation code 494 can also activate an alarm or an indicator, such as an LED light, to indicate that the toxic gas content in the exhaust gas stream has reached a dangerous value; or provide a metering display, such as ( Please read the notes on the back before filling this page) ^ -------- ^ ---------. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 V. Description of the invention () One can follow the exhaust airflow (please read the precautions on the back before filling out this page) 1 The real-time content of each rolling body is displayed as a graphic image for monitoring by the operator. This safe operating mode allows the operator to monitor and prevent the accidental escape of toxic gases into the environment. The same signal can also be used to maintain the process equipment 25 in an inoperative mode 'or to activate safety discouragement when an abnormal condition is detected. In this mode, the safety operation code 494 can operate the process: room and gas processing equipment to provide a safety device that does not harm the environment. Front Clean Room Another embodiment of the front clean room 230 is shown in FIG. The front clean room 230 includes a reactor 23 that accepts the exhaust gas stream 100 and allows the exhaust gas stream 00 to react with the cleaning liquid. A hydrolyzer column 310 or channel 310 can accept an exhaust gas stream 100 from channel 21 which is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. This exhaust gas stream has been mixed with an additive in advance. The hydrolysis column 3 10 provides an aqueous or humid environment 3 1 2 for the exhaust gas flow 100. Which one begins to be exposed to water or other clean liquids' will cause the desired components (e.g., SiF4) in the exhaust gas stream 100 to begin to decompose. Hydrolysis tubing string 310 allows these large particulate matter to be removed before it becomes blocked or deposited in the post-processing tube string in front clean room 230. The initial moisture exposure, coupled with subsequent upright processing columns and a downward exhaust air stream of 100, allowed these large particles to be completely removed. A hydrolysis column or channel located downstream of the cleansing liquid disperser or other cleansing liquid source is not effective in removing substances such as SiF4 completely. A clean gas can be set up at or near the entrance 317 for this paper. Applicable to China National Standard (CNS) A4 (210 X 297 mm) 553761 A7 B7 V. Description of Invention (Employee of Intellectual Property Bureau, Ministry of Economic Affairs Consumer cooperatives should print sources 3 1 5 in order to introduce cleanliness such as air, lice or lice ... to " "float systems and or to prevent hydrolysis of upstream materials. The inlet can be a throat inlet. Later discharge The air stream 100 can disperse the "please like water" clean liquid from the supply source 325 into the exhaust air stream 100 through the first lacquer, the coin deep sheep channel or the channel 32 (^ 一 嘴嘴 3 22). The m is shown in the opposite direction of the airflow. The water is sprayed out in the opposite direction of the airflow. The opposite direction of the airflow means that the flow direction of the airflow is from ν to ν, which is opposite to the overall flow direction of the gas. This arrangement can be aided by Gravity helps water flow and helps transfer reaction products such as silicon dioxide and HF to the storage tank 350. The columns 3 to 20 can also optionally provide a surface area that can increase At the same time, plastic or ceramic pellets, such as ρν〇spheres, can increase the contact surface area of water / gas in the column, and then help Sih's decomposition reaction. One can also set up an exhaust gas 100 and the reaction products to pass easily, but The surface increasing substance 327 is difficult to pass through the platform 328 to accommodate the surface increasing substance 327 in the first column 320. The exhaust gas 100 will then flow through the channel 329 to a column or channel 330. A throat ( venturi tube) 3 3 2 can disperse fluid such as water from the supply source 335 into the pipe string 330. A nozzle 333 is located at the end of the upright pipe 332 to inject water into the pipe string. , The term refers to a channel with a certain volume and throat shape, which can increase the flow rate of the fluid flowing through it and reduce its pressure. The term "injection" means that the cleaning liquid is dispersed from the throat. This Invented throat nozzles 332, 333 The paper size in this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) ·! 1 Order ·! # 553761 A7 B7 Printed by the Employees' Cooperative of the Ministry of Intellectual Property Bureau of the People's Republic of China. 5. Description of the Invention (Provides an opening to disperse water into very fine particles. As shown in one case, for a pipe 332 with a diameter of about 1.5 inches, the throat The opening of the tube nozzle is between about 0.1 inches and .4 inches, preferably between about 0.25 inches and 1.25 inches, and more preferably between about 0.5 inches and 丨 inches. As shown in one case, the direction of water flow is the same as the flow direction of the exhaust gas 100. The function of the throat string 33o is as follows: 0 Further cleaning of the exhaust gas by generating particulate water to the south / gas contact area ' (Ii) By the high-speed impact of the water from the throat nozzle 3 33, the reaction product is further transferred to the storage tank 350. '«Η) As described above, the water is added to destroy the PFC in the catalytic reactor. , And (iy,) generates a negative pressure to effectively provide a positive sound to the exhaust gas 100 to compensate for the pressure loss in the clean A. The net pressure drop after passing through the front clean room is approximately zero. Sometimes ’even gets a net pressure increase. FIG. 14 is an exemplary embodiment of the throat pipe 332 and the throat nozzle. For example, the relative volume and angle of the throat and the opening can be improved to achieve the desired purpose. A second clean tubing string or channel 340 can accept the exhaust airflow from the throat string 33o. The two clean tubing strings may include a second nozzle 342 for dispersing the cleaning liquid. For example, the water supplied from the source 345 may be sprayed into the exhaust gas flow 100 in the opposite direction. The second clean tubing string may further contain a surface increasing substance 347 and a platform 348, which are similar to the first clean tubing having a surface increasing substance 327 and a platform 328. The second clean tubing string 340 can also provide another level of cleansing effect of the exhaust gas stream 100 and further transfer the reaction product to the storage tank 350. Page 45 This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) -------- ^ -------- 1 (Please read the precautions on the back before filling This page) 553761 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (The demister 355 can be located near the exit ⑴ to remove water droplets from the exhaust air stream. For catalytic treatment, the exhaust air stream The moisture content in 100 is preferably about% 3%; water droplets are not desirable, because the water droplets will carry the product particles brushed down and pollute the catalyst in the catalytic reactor 25. The demister 355 can remove the water droplets, and Pass the desired moisture. The mist eliminator 3 5 5 may contain enclosures or nets such as wire netting. · Each pipe or channel 310, 32, 33, 34 is designed to be destructible From about 80% to about 90 %%. Therefore, if there are two pipe strings and the exhaust gas flow 100 is passed through the two pipe strings, about 696 to about 99% of SiF4 can be removed. If three pipes are passed Column, you can also increase the removal ratio to about 99.2% to about 99.9%. If you pass 4 columns, remove Examples can be increased to about 99.8 ° /. To about 99.99 //. Quantitative test using the EPA method 5 "Determination of specific effluent particles from a static source", this technology shows that the efficiency of Sib removal is about It is 99.77% or better. The particle test results show that about 80% of the treated exhaust gas stream has a particle size of about i μm to 25 μm. Therefore, the filter 359 can be used to further Removal of particles, such as a hep a near the outlet 357; filter. Hepa filter 359 can remove reaction product particles that have not been sent to the staggered tank 350 almost completely. Hepa filters are particularly effective for filtering particles with a volume of 13 or more, Therefore, it is most suitable for removing these reaction products. It should be noted that the required number of columns can be contained in the front clean room 230. Furthermore, 'the column' need not be placed upright, but can be directly and horizontally Or in any appropriate direction. In addition, the columns need not necessarily be parallel to each other. Adjacent columns can be any degree from zero (also on page 46 of this paper rule. Specifications ⑽χ Tearing Public Director) --- --------- · Install -------- Order i (Please read the notes on the back before filling this page) ^ 3761

Description of the invention A7 B7 is placed at an angle that is' almost doubling and the exhaust airflow 100 flows in the opposite direction, as shown in Figure i3) to 180 degrees (that is, parallel and the exhaust airflow flows in the same direction). In one arrangement, the angle difference between the strings is below 90 degrees. The overflow channel 370 and the filtering unit 376 can maintain the capacity of the storage tank within a desired range. Fig. 15 shows an embodiment of the front clean room 230 including four chambers and extending inward. This inwardly extending design reduces the space occupied by the front clean room 23o. The cross-sectional area of the front clean room shown in Figure 15 is approximately j square feet or less. This design makes the material transfer easier and easier to assemble, and it can be used closely with the production and presentation room 25 without hindering the operation of the room 25. Another embodiment of the present invention is shown in FIG. In this embodiment, there is a recirculation system 402 to recirculate cleaning liquids such as water and reaction products through the front clean room 23. The storage tank 35 is first filled to a desired capacity by a transfer unit 375, which is connected to a clean liquid source such as water. This desired capacity is related to the height of the overflow channel 370. Open pump 4 06. The pump can draw liquid from the storage tank 350. In the illustrated embodiment, the liquid in the storage tank is water and a clean reaction product such as a dioxide #HFit: mixture. The fluid passing through the outlet 々η under the influence of the negative pressure generated by the pump 406 passes through the particle filter 421 which can remove all reaction product particles. The particle filter 421 may include a filter capable of removing particles having a diameter between 1 mm and 1 mm. In one case, the particle filter 42 can remove particles having a size of about 70 m or more. After that, the filtrate will pass through the pipeline mi, and the paper size will be in accordance with Chinese National Standard (CNS) A4 (21〇χ 297 mm)------------ i III I--β --- ----- I (Please read the notes on the back before filling this page)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 ------------ B7_-V. Description of the invention 332 in. Pump 406 can also draw fresh cleansing liquid from cleansing liquid source 441 (i.e., water) at a preset rate, which is water in the example shown. The newly added water will cause the storage tank 35 to overflow to the overflow channel 3 700 ', which can transfer the overflow to an acidic sewer. The newly added water can be used to maintain or trim the pΗ value in the storage tank 3 50 within a preset value range. In one example, fresh water is introduced at a rate of about 0.25 gallons to about 0.5 gallons per minute, or at a rate that can maintain a pH in the range of about 2 to 3. Alternatively, a pH meter and a controller can be installed to adjust the amount of water introduced according to the measured pH value. As shown in FIG. 17, the recirculation system 4 02 can be expanded to provide clean liquid to both the cooling unit 260 and the rear clean room 270, or one of them. The cooling system 260 may be a water quenching system with a nozzle 261, which sprays water into the heated and slowed exhaust gas ιo 'to cool the exhaust gas 101. The rear clean room 270 may be a clean room capable of supplying a cleaning liquid such as water to the reactor 272 to remove a composition in the exhaust gas 101. In one example, the cleaning liquid is water sprayed from the nozzle 271 into the exhaust gas 101 which has been reduced to dissolve the HF. Pump 406 can extract clean liquid such as water and reaction products in the manner shown in FIG. The water system is pumped from the pipeline 431 to the pipelines 432, 433, and 434 to transfer water to the nozzles 322, 332, and 3 42 respectively. In addition, the pipeline 431 can also provide water to the pipelines 435 and 436, which respectively lead to the rear clean room nozzle 271 and the front clean room nozzle 261. Page 48 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

-Installation --- Order --- IIIII Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economy 553761 A7 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economy B7 V. Description of the invention Sewer 4 55. Similarly, the rear clean room 270 also has a sewer 451 communicating with the collection storage tank 275. The pipelines 451 and 455 are connected to the pipeline 461, and then communicate with the rear clean room storage tank 350 through the pipeline 471. In order to adjust the pressure difference between the rear clean room 230 and the front clean room 270 and the cooling system 260, a pressure compensation unit 479 is installed. The pressure compensation unit 479 may include a gravity type sewer and a P-type trap 481, so that the water column in the sewer can automatically adjust its height according to the pressure difference in the device. Alternatively, a pump 482 can be used to compensate for this pressure difference. Other similar pressure compensators can also be used. A constant, preset amount of new cleaning liquid (e.g., water) can be added, and a considerable amount of cleaning liquid can also flow out of the overflow channel 370. Alternatively, a control system 500 may be provided. The control system 500 includes a conventional sanitary instrument, which can detect the pH values of the cleaning solution and the reaction products in the storage tank 350. A controller 510, which can be a central processing unit (CPU), can receive and analyze the value from the pH meter 520 and provide an output signal to the flow controller 530 according to the measured pH value. In this way, the amount of the newly added cleaning liquid can be adjusted so as to maintain the pH value of the storage tank 350 within a preset range. For example, when the pH value of the storage tank 3 50 is lower than 2, the controller 51 will send a signal to the flow controller 530 to increase the amount of water entering the system. When the pH of the storage tank 350 is higher than 3, the controller 510 stops the amount of water entering the system. The control system 500 can provide a well-controlled cleaning procedure and minimize the amount of water used. The controller 500 contains a computer-readable medium, which has a built-in ------ II ^ --------- (Please read the precautions on the back before filling this page) 76 3 5 5 A7 The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the computer code of B7 & Invention Description () to monitor the value from pH meter 520. The control system 500 can be incorporated into a system controller, such as the system controller described above. The controller 500 may also include a computer code product capable of controlling a computer, including one or more central processing units (CPUs) connected to a memory system and peripheral control components, such as a Pentium processor sold by Intel Corporation of Santa Clara, California. Device. The CPUs of the controller 500 may also include: an ASIC (ppncation specific integrated circuits) that can control specific components in a system. The interface between the operator and the controller 5000 can be a CRT curtain and a light pen with a light sensor at the pen tip. When selecting a specific screen or function, the operator can touch a designated area on the CRT screen or press a button on the pen. The area on the screen you touch changes color, or another new menu appears on the screen to confirm instructions from the light pen or the previous CRT screen. The controller 500 may also be communicated using other devices such as a keyboard, a slider, or a pointing communication device. This allows the operator to enter a range of pH or cleaning solution flow rates into the system. The pH meter can be located in any of the storage tanks 265, 275, or in any pipeline, such as in pipeline 431; or several pH meters can be used to further monitor the pH of the fluid. Alternatively, other cleaning liquid conditions such as pressure, temperature, flow rate, etc. may be monitored to monitor the operation of the system 402. The extended recirculation system 402 can direct the cleaning liquid into the front clean room 230, the cooling system 260, and the rear clean room 270. The need-to-know system 402 can be applied to one or two devices. In addition, the system 402 can also be expanded to further provide cleaning fluid to other locations. Another arrangement of the front clean room 230 is shown in page 17 囷, but the paper size on page 50 applies the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this page)

553761 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (), (2) Use the above-mentioned <multi-pipe 枉 clean room. Conversely, the picture in 帛 17 can be cleaned to 2 3 0. Simplified to use only one mouth. The heater replaces the heater 240 or in addition to the heater 240, it can still be used with the catalytic mitigation system, the heater 200 or the heater 54 () · .Other-implementation Example = Figure u. The heater 540 can reduce the length of time that the exhaust gas passes through 100, (u) quickly and effectively heat the exhaust gas to a high temperature; and g) heating without directly contacting the exhaust gas and heating elements Exhaust gas 100. ^ In the example shown in Figure 18, the heater 54 has an inlet 541 that accepts the exhaust gas m, an outlet 542 through which the exhaust gas can pass, and a wall of the spiral gas channel 545 Or several walls. The spiral airbar channel 545 is an external heating element 55o, which can include an infrared ceramic heating element. The heating element 55o can be cylindrical or any hollow interior 551 or similar space. Or holes and to The shape in which the knife can be covered by the heating element (that is, the heating element can be an opposed flat plate with a central hollow, rather than a continuous ring). In this hollow interior 551 there is an outer channel 555, and in the In addition, there are two inner tubes 560, 565 in the channel 555. The outer channel 555 and the two inner tubes 560, 565 together form a wall adjacent to the swirling gas channel 545, which can improve the exhaust airflow 100 in the furnace 54 〇 in the combination of Figure 18, and the opportunity to contact the heating surface. In the combination of Figure 18, the exhaust gas flow 100 into one of the inlet end of the inner tube 560, flowing through the entire length of the inner tube 56 Page f · 丨 · 丨 —-丨 丨 Order · 丨 — 丨 丨 — 丨 丨 I (Please read the precautions on the back before filling out this page) 553761 A7 ____B7 5. Description of the invention () and flow out from an exit end, enter Outer channel 5 5 5. The exhaust air flow is subject to an obstruction such as the closed end 5 5 6 of the outer channel 5 5 5 and is forced to pass through a cavity 567 between the inner tubes 560 and 565. Flow in the opposite direction until the exhaust airflow 100 reaches the other side of the outer channel 555 After the closed end 557, it continues to flow into the inlet end 566 of the second inner tube 565, and then flows out from the outlet end 563 of the second inner tube 565 to the outlet 542 of the heater 54Q. In the example shown, the outer channel 5 5 5 is smaller than The inner 5 5 1 of the heating element 5 5 0 is still small, so it can provide a gap 570 between the outer channel 555 and the heating element 550. It is generally believed that heat is mainly transmitted by the transfer element 550 to the outside in the form of radiant energy. The channel is then transmitted to the inner tubes 560, 505 by convection i. It is generally believed that the exhaust air flow is 100 to be heated by thermal convection on the surfaces of the tubes 555, 560, 565. The tubes 555, 560, 565 together form an interconnecting channel or a portion overlapping each other to define a wall adjacent to the airflow channel 545. The following description is only provided as an illustrative description of the embodiment in FIG. 18, and the scope of the present invention is not limited thereto. The length (L) of the heater 540 can be approximately 24 inches, and the cross-sectional area diameter is approximately 8.25 inches. The diameter of the outer channel 555 is about 3 inches, and the diameter of the inner tubes 560, 565 is about 1 inch to about 1.25 inches. The gap 570 is greater than about 2 mm, and preferably from about 5 mm to about 30 mm. In another example, this gap does not exist. The heating element 550 may be a conventional cylindrical heater, such as a heater sold by Thermal Dynamics Corporation of San Jose, California. Any suitably shaped heater can also be used. In an example, the heating element 550 can be used on page 5 of this page. The paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page)-Xiang! I order! ----

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The tubes 555, 560, 565 can be made of InconelTM or 31 6L non-face material, or plated with such materials. At least the interior of these tubes is made of a material that will not be corroded or destroyed by the exhaust air stream. For example, InconelTM β. In one example, the heater 540 occupies a volume of about 2,000 cubic inches, and its volume It is preferably about L3 00 cubic British pairs. In the embodiment of FIG. 18, each time the gas passes, it can heat the exhaust gas stream 100 to at least 40 ° C; in one example, it is heated from room temperature (about 23.0 to about 57 (TC; In another example, it is heated from room temperature to about 400t to about 70 ° C. The arrangement and combination shown in FIG. 18 is only exemplary, and the present invention is not limited to this combination. One inner tube, but in fact two or more inner tubes can be used, the outer channel can be replaced by a third inner tube, or the length of the inner tube can be shortened. In one example, 'the entire spiral gas channel 545 is located Inside the heating element 550. The heating element 550 may be located outside the gas passage 545, or may completely or partially cover the gas passage 545. Therefore, in an example, the heating element 550 may be located directly at least in part of the spiral gas passage 545 A heating plate above, below, or beside. The heating furnace of the present invention can effectively heat the discharged milk flow 100 to a high temperature through one or more swirling gas channels, and increase the exhaust gas flow 100 to stay in the heating furnace. Time to raise the Heating area, heating elements that provide sufficient energy, and gas channels that are long enough. "Spiral gas channels" d refers to any fluid channel in a device, such as a heating furnace, where the distance of gas flow is far beyond The length of the device is, for example, the curved airflow path shown in Figure 18. On page 53 shown in Figure 18, this paper size applies the China® Standard (CNS) A4 (210 X 297 mm) ) ----------------- (Please read the notes on the back before filling out this page) 553761 A7 B7 V. Description of the invention () In the example, the distance of the gas flow is about 3 L. Name and immortal μ ^ In his example, this (please read the precautions on the back before filling out this page) The distance can be much greater than 15L or much greater than 2L. The term "increasing retention time" refers to airflow retention The time in a device (for example, a heater) far exceeds the time required for the airflow to flow through the length L without hindrance. In the example, the residence time of the exhaust airflow 100 is less than about 3 seconds. As an example, the residence time is less than about 2 seconds. Refers to any heat transfer area 'increased within a smooth pipe, for example, to the tiger surface. When combined with a heat exchanger', such as heat exchanger 360 shown in Figure 9, the heater 540 will become Particularly efficient, it can heat the exhaust gas stream 100 with less time and consume less energy. It is known that the efficiency of the heat exchanger 3 60 is as high as 85%. In one example, by using a temperature of about 90 (rc Operating the heating element 550 at about 100 ° C. can quickly heat the exhaust gas flow 100 to about 700 ° C. The heated exhaust gas flow 100 can flow into the catalytic reactor 250 to effectively reduce the toxic gas ( (For example, perfluoride). Printed in Figures 19a and 19b of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, other embodiments of heaters 540 ', 540 ", which have interconnected gas channels and overlapping and intersecting parts, and can be used for catalytic relief Subtract system 200. In the embodiment shown in Figure 19a, the heater 5 40 'provides an obstacle such as a laminate or other obstruction 5 8 0 located in the outer channel 555' to force the exhaust air flow 100 to take A curving passage from inlet 54Γ to outlet 542 'to increase residence time and heating surface area, thereby defining a wall adjacent to the swirling gas channel 545'. Any number of laminates are also available Or other obstacles on page 54 This paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 public love) 553761 A7 B7 5. Description of the invention () Obstructions. In addition, 'opening 581 allows gas to pass through and bypass these laminates Or other obstructions 5 8 0. These laminates or other obstructions can be arranged to allow the exhaust airflow to swirl through the heater 540. The heater 540 "shown in Figure 19b is similar to the heater 540 ', only The middle layers are arranged at an angle to create a more vortex-like airflow in the heater 540 ". Any number of layers or other obstructions 5% and openings in any suitable direction 5 9 1 can be used. 19c and 19d show different embodiments of the heating furnaces 592, 592, in which the walls 594, 5 94 of the heating elements 595, 595, form a passage through which the exhaust airflow 100 can flow. The airflow flow channels 593, 593, can Formed by a wall that is defined and adjacent to a swirling gas channel, such as the tortuous channel shown in Figure 19c, or a wall of a non-spiral gas channel, such as shown in Figure 19d. Or The curved channel shown in Figure 19c may have more turns than shown, or its bending angle may be larger or smaller than the angle shown. The surface of walls 594, 5 94, may not: It is made by corroding the material eroded by the airflow 100, or it is plated with such materials, such as nickel alloy as discussed above, or it is plated with nickel alloy. It can also be coated with different materials depending on the operation of the heater. The length of the heating element needs to be long enough / Or strong, or the gas flow channel needs to be long enough or the number of turns needs to be sufficient, so that the exhaust gas flow 100 can be heated from room temperature to at least about 40 (TC) in only one pass. The furnace can heat the exhaust gas flow 100 To at least about 500 ° C or at least about 600 ° C. The heating element 595, 595 'can also be surrounded by heat-insulating substances to concentrate the heat energy inward and prevent the heat energy from escaping. Page 55 This paper applies the Chinese National Standard (CNS) ) A4 size (210 X 297 mm) (Please read the notes on the back before filling this page)

n ϋ n I n ^ aJ · n ϋ I ϋ III Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 B7 V. Description of the invention () Catalysts that can be replaced (Please read the precautions on the back before filling this page) In order to ensure that the catalyst 255 (including the catalytic surface 257) can provide sufficient gas mitigation effect, it should be replaced after its effective period has passed. As described above, the catalytic substance 255 in the catalytic reactor 250 is valid for more than six months or can be treated 100,000 times :. In the embodiment of the catalytic mitigation system 200 shown in FIG. 8, the catalytic reactor is melted or permanently fixed to the internal gas heater 240 and the staggered heat exchanger 360 to prevent Toxic gases such as HF escape from the exhaust gas. Exposure to HF vapor can cause severe damage to human lungs and other body tissues. Due to this safety design, when the catalytic substance 255 is replaced, the entire catalytic reactor 250, the heater 240 and the heat exchanger 360 need to be replaced together. Figures 20-25 show an exemplary embodiment of a catalytic reactor 250, which simplifies the process of catalyst replacement. When replacing the catalyst in a catalytic mitigation system, these embodiments represent a significant time and material savings during catalyst replacement, and reduce the time between substrate processing systems, while maintaining a fairly safe for the operator Operating environment. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 20 shows an embodiment of a catalytic reactor 25 containing a catalytic substance 255 (the catalytic substance refers to a catalytic surface and / or a high surface area structure). The wall 253 of the catalytic reactor 250 shown in Fig. 20 is cylindrical, but it may be of any suitable shape. The catalytic reactor 250 of FIG. 20 includes two channels 610, 612, which can be used to replace the used catalyst 255. Each channel includes a flange 614 on its far end, page 56 &gt; Paper size applies Chinese National Standard (CNS) A4 (210 X 297 public love)-553761 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () 624. When the catalytic reactor 250 is in operation, the channels 610, 612 are sealed with two channel covers 630, 635. The channel covers 63 and 63 are connected to the channels 6 10 and 6 1 2 with an appropriate connection mechanism. For example, screws may be passed through the flanges 614, 624 and then connected to the channel covers 63 0, 635. Alternatively, the channel covers 630, 635 may be fixed to the flanges 614, 624 with clips or glue, or a thread may be formed between the channel covers 630, 635 and the flanges 614, 624 or fixed by friction. The channel cover 630, 635 may include a connecting portion 631 made of a mechanical ceramic such as alumina, and an insulating portion 632 made of a ceramic such as alumina fiber, to reduce catalysis during operation. Thermal energy lost by the sexual reactor 250. The channel 62 0 can be used to suck out the catalytic material 25 5... By vacuum when the catalyst is replaced, as shown in FIG. 21. The cover 635 is removed, and then a vacuum tube 640 made of a material such as polyethylene or polypropylene is inserted into or adjacent to the channel 620 in any manner suitable for connecting the vacuum tube. A vacuum generator 650 generates a vacuum or pressure differential sufficient to remove the catalytic substance 255 out of the catalytic reactor 250. The vacuum generator 650 may cause the catalytic substance 255 to be transferred from the catalytic reactor 250 through the lines 640 and / or 655 to the catalyst collector 660. The catalyst collector 660 includes an inlet 661 and an outlet 624. The catalytic substance 255 is placed in a catalyst collector 660. After the catalytic substance 255 is removed from the catalytic reactor 250, the inlet 661 and the outlet 662 are sealed, and the catalyst collector 660 containing the used catalytic substance 255 can be further processed or discarded. A filter can be installed at the outlet 662. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ----------------- I- -Order --- 丨 丨 丨 丨 丨 (Please read the notes on the back before filling this page) 553761 A7

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () 665 ’to ensure that the content of the catalytic substance 255 or other substances in the exhaust gas 668 has reached a minimum. Thereafter, fresh catalytic material 255 from the catalyst source is added to the catalytic reactor 250. Replace the cover 635 on the channel 620, and remove the cover 630 of the channel 610. A vacuum tube 675 from one of the catalyst sources was inserted into the channel 610 and a new one: a catalytic substance 255 was added in a similar manner but in the opposite manner to removing the catalytic substance 2 5 5. Or 'use channel 620 as the entrance channel and channel 610 as the exit channel. The removal and transfer procedures may be performed separately as shown, or they may be performed simultaneously, that is, the channel covers 630, 635 are opened simultaneously, and the vacuum tubes 640, 675 are connected to the channels 610, 620 at the same time. Alternatively, one channel can be used as both the outlet and inlet channels, or multiple inlet channels and / or outlet channels can be provided at the same time. In one example (not shown), one or more channels 610, 620 may be placed outside the catalytic reactor 250. For example, the channel 610 is placed between a straight line formed by the heater 24o and the catalytic reactor 25o inlet 251, and the channel 62o is placed between the heater 36o and the catalytic reactor 250 outlet 252. . In this way, the used catalytic material 255 can be removed by the outlet 252 and passed through the channel 620 ', and then passed through the channel 610 through the inlet 251 to add fresh catalytic material 2 5 5. Similarly, the catalytic substance 2 55 can be removed by the channel 61 0 and the catalytic substance 255 can be transported by the channel 620, or the catalytic substance can be removed and transported by a channel outside the catalytic reactor 2 5 5 . Before, during, or after refilling the catalytic substance 2 5 5, you can put a 'camera-camera attached' into the catalytic reactor 2 50, and check that the paper size on page 58 is applicable. China National Standard (CNS) A4 Specification (210 X 297 mm) -1 ------ I-^ ---- II-^ illn --- (Please read the precautions on the back before filling in this Page) # 553761 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Inventory () and ensure that the used catalytic substances 2 5 5 have been completely removed, or that new catalytic substances 255 have been completed Fill, and / or use the camera to inspect the reactor for any corrosion or damage. In order to make the exhaust gas flow rate uniform and uniform ', it is better to completely remove all used catalysts, and also to periodically remove a small part of the catalysts. Alternatively, the thin rod may include an ultrasonic horn or the like to destroy any catalytic substance 255 remaining in the reactor 25 or the channels 612 and 62. The ultrasonic horn can emit ultrasonic frequencies. Other mechanical stirrers can also be used to destroy the agglomerated catalyst. Fig. 22 shows a partial top view of another embodiment of the catalytic reactor 25, which can be easily released from the reactor vessel 750. The reactor vessel 750 may be welded or otherwise tightly secured to the ends of the heater 240 and the heat exchanger 360. The reactor vessel 750 contains several walls 760 which define a space 76 5. This space 765 can be opened or operated from its top in order to place or remove the catalytic reactor 250 therein. The reactor vessel 750 contains a flange 764 that can be connected to the flange 254 of the catalytic reactor 250. The flange may be a clip such as a conventional KF, or secured in any suitable manner. The reactor vessel wall 760 may include a plurality of grooves 770, 780 that can receive stabilizers 710, 720 on the catalytic reactor 250. As shown in FIG. 23, the stabilizer plate may be parallel plates 710 and 720 connected to the wall 253 of the catalytic reactor 250 so as to be connected to the grooves 770 and 780 by sliding joints, respectively. Catalytic reaction page 59 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

· Ϋ ϋ I _1 ϋ n 1 ^ ffJ «n · 1 l I nnn I 553761 A7 B7 V. Description of the invention () The reactor 250 may have one or several such stabilizer plates and corresponding grooves' or , Also without any stabilizer and groove. When the catalytic substance 255 in the catalytic reactor 250 needs to be refilled, the catalytic mitigation system can be cooled by N2. Thereafter, the operator can release the clip to remove the catalytic reactor 250 from the reactor vessel 750, and fix the ends 251, 252 with the cover 790. In this way, the catalytic reaction benefit 250 can be securely fixed. In one example, the cover 790 is similar in design to the access covers 630,635. After that, the catalytic reactor 250 refilled with the new catalytic substance 255 is put back into the reactor container 750. At this time, the catalytic reduction system 200 is ready, and the process can be discharged from the gas stream 100. Mitigation procedures. Alternatively, the catalytic reactor 2 50 having the used catalytic substance 2 5 5 may be removed from the reactor vessel 750 and the catalytic substance 255 may be removed from the catalytic reactor 250 in a vacuum manner. After adding the new catalytic substance 255, the catalytic reactor 250 is returned to the reactor vessel 750. Figures 24 and 25 show other variations of the embodiment shown in Figures 22 and 23. In this example, the cross sections of the catalytic reactor 250 and the reactor vessel 850 are rectangular. The reactor vessel 850 includes a number of walls 860 that define a space 865 that can accept the catalytic reactor 250 and the flange 864 to connect it to the flange 254 of the catalytic reactor 250. The reactor vessel 850 includes a side 875 extending from the 250 reactor section of the catalytic reactor. The catalytic reactor 250 also includes fine grooves 880 at the ends 251,252. As shown in Figure 25 (Attention ... • Page 60 here (please read the notes on the back before filling out this page) · 1111111 — — — — — — — — I. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Wife I? Photo by Tian Youpu (CMS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 B7 V. Description of the invention () In order to make the graphics clear, it has been omitted The flange is not shown), the fine groove 8 8 0 extends through the top 256 of the catalytic reactor 250, and a thin plate 895 can be inserted into the fine groove opening 885 and penetrate the fine groove 88 ° to cover and seal the catalytic reactor. 250 的 端 部 251、252。 250 end 251,252. A 0-shaped sealing ring 8 90 can be used to surround the opening 885 so that the thin plate 895 is tightly fixed on the narrow groove 880 and prevents any leakage. : When replacing the catalytic reactor 250, first cool the catalytic reduction system 200 with nitrogen as described above. The thin plate 895 is inserted into the narrow groove 880, and then the catalytic reactor 250 is taken out of the reactor vessel 850 and discarded. A catalytic reactor 250 containing the new catalytic substance 255 is placed in a reactor vessel 850. The sheet may be attached to the top 256, for example, the catalytic reactor 250 to cover the opening 885, and / or prevent misplacement. As shown in the embodiments of Figs. 22 and 23, a new catalyst 255 can also be used to replace the used catalyst 255 in the catalytic reactor 250, instead of discarding the entire catalytic reactor 250. Gas Reduction Another embodiment of the substrate processing apparatus 925 capable of processing the substrate 30 is shown in FIG. It includes a process chamber 935 such as a chemical vapor deposition chamber (CVD), such as the SACVD chamber and the HDP CVD chamber, both of which are sold by American Applied Materials, Inc. of Santa Clara, California, and Details are described in the following patents: U.S. Patent No. 5,207,836 to Chang et al., U.S. Patent No. 5,788,778 to Shang et al., U.S. Patent No. 5,843,239 to Shrotriya et al., P. 61 China National Standard (CNS) A4 Specification (210 X 297 Public Love) (Please read the precautions on the back before filling this page)

Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 V. Description of the invention () US Yuan Xuan, approved by Robles et al.

Mlaad et al., U.S. Patent No. 6,010,3,584, the contents of these patents are incorporated herein by reference. This type of process chamber can be used in a multi-chamber integrated processing system. You, for example, U.S. Patent No. 4,951,601, approved to Maydan et al., Such as —. ^ The content of which is incorporated herein by reference. . The process chamber 935 'shown here is, for example, a system suitable for processing substrates such as semiconductor wafers 30, such as dream or Kunhua gallium wafers or glass or ceramic substrates. The illustrations are merely to illustrate the purpose of the present invention, and the present invention is not limited to this. The process chamber 935 can be designed to deposit a dream-containing layer on a substrate, such as a polymer, nitrogen cut, oxidized dream, or metal dream; or it can deposit a metal layer or a thin layer containing metal on the substrate or any Form of thin layer. As shown in FIG. 26, the CVD system includes a deposition chamber 935. In the deposition chamber 935 there is a gas disperser 94 that can introduce the process roll into the system. In another example of the figure 26 shown, the plutonium dispersion $ 940 can be a manifold or nozzle 942. Alternatively, the salute entrance can be extended from the wall 944 or floor 964 of the process room 935. The gas disperser 940 can disperse the process gas into the processing area 950 near the substrate 30. When the process controller 958, such as a computer control system, opens the air flow valve, the process gas is transferred from the process gas supply source 954 to the process chamber 935 via the supply line 952. The support 960 in the process chamber 935 can support the substrate 3 (a support electrode 962 can also be provided on the support 96. The electrode 962 can be combined with an electrode 964 above the substrate 30 to form a mutual capacitance to stimulate processing. Zone 950, page 62 This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) --- II --- I I--install -------order --- III! ( Please read the notes on the back before filling this page) 553761 A7 --- B7 V. Description of the invention () (Please read the notes on the back before filling this page) The gas in the t-process is plasma. In Figure 26 In the example shown, the electrode 964 is the ceiling of the process room 935. The power source 970 can provide power to the electrode 964 through a power supply network 972, and the support electrode 962 is grounded; or the above arrangement can be reversed. Typically, the electrodes 962, 964 are powered by an RF power source. The support 960 may include a heating mechanism 976, which includes a resistance heater or a heat-transmitting gas that can be attached to the substrate 30. Near circulation. The 960 can also optionally include a mechanical device or electrostatic clip (not shown). These devices or The surfaces of the electrostatic clips can be bonded to the substrate 30. These surfaces can also contain grooves that can retain heat transfer gases (eg, turbulent gas) to control and maintain the temperature of the substrate 30. Consumption by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs During the cooperative printing operation, the process chamber 935 is evacuated to a low pressure, and then a substrate 30 is moved from a vacuum loading chamber (not shown) to a processing zone 950 of the process chamber 93 5. The process gas is passed through the process gas The supply source 954 and the gas disperser 9 40 are introduced into the process chamber 935. The gas in the process chamber 935 is generally maintained at a low pressure. The process gas located in the processing zone 95 0 will form an electric 1. The plasma in the process chamber 935 is composed of The RF potential supplied to the electrode 964 is generated in a capacitive manner. Alternatively, an RF current may be applied to a conducting coil (not shown) to conduct the coupled electric energy into the process chamber 935 and collect the electricity in the process chamber. An electric device is formed at the region 950. The frequency of the RF current applied to the electrode 964 or the conducting coil (not shown) is generally between about 50 kHz and about 60 MHz, and preferably about 13.56 MHz. In another example, it can also be In a magnetically enhanced reactor Electron cyclotron, resonance to increase the plasma generated by the capacitive method, it uses a magnetic field generator such as a permanent magnet or a magnetic coil to provide a plasma density and uniformity that can increase the processing area 95 0 Paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 553761 A7 ------ B7 V. Description of the invention () Magnetic field (Please read the precautions on the back before filling this page) The exhaust gas stream 98 8 containing the process gas and process by-products is discharged out of the process chamber 935 via an exhaust system 982 that can reduce the pressure in the process chamber 935 to 10.3 Torr. The exhaust system 982 includes an exhaust pipe 9 85 that can lead to one or more pumps (e.g., high vacuum pumps) that can extract process chamber gases. The exhaust pipe 985 contains a throttle valve 987, which can control the air pressure in the process chamber 935. At the same time, it is also possible to selectively use optical endpoint detection technology to determine whether the process has been completed, which is measured by measuring the light emission intensity of the gas in the process chamber 93 5 or the reflected light intensity of the film processed on the substrate 30 To reach. In a typical substrate processing process, the substrate 30 is placed on a support 960 in a process chamber 935, and a process gas containing a reactive gas is introduced to a processing zone 950 via a gas disperser 940. For example, a process gas containing one or more of SiH4, C02, SiClH2, H2, N20, Si (OC2H5) 4, NH3, printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and N2 can be used in chemical vapor deposition ( A CVD) process produces an insulating or dielectric material such as SiO2 or SisN4. Additionally or alternatively, a metal layer containing a metal element, a metal compound or a metal alloy may be formed in the deposition chamber. For example, a layer of tungsten-containing material can be deposited with one or more of WF0, &, and S1H4 process gases; a process gas containing MoCU and I or the like can be used to deposit a layer of molybdenum-containing material; or mixed Ar or thorium: or aic13 or A1 (CH3) 3 process gas to deposit a layer of aluminum-containing material. As described above, the process gas &apos; may be excited in the process chamber 935 or may be excited in another chamber, for example, the substrate 30 may be treated under a plasma gas or a microwave excitation gas. Excited anti-page 64 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 3761 A7 V. Description of the invention (Responsible gas decomposes and deposits material on the surface of the substrate 30. Process After or during the process, the exhaust gas stream 100 consisting of the used process gas and gaseous by-products will be discharged out of the process chamber 9 3 5. Although the deposition process system is designed to preferably deposit the substance to be deposited on the substrate Material 30 on the surface, but these materials will also be deposited in the process chamber 935. In order to synchronize the process chamber 935, the dry cleaning process can be used periodically to clean or leave these undesired deposits. An example This cleaning procedure is performed by activating or exciting a cleaning gas in another distant process chamber 990. A microwave generator 992, as described in US Patent No. 5,788,778, can activate a cleaning gas. When the valve 958 opens the throttle valve 996, the activated cleaning gas can be supplied through the cleaning gas supply source 9 94 and transmitted to the remote process chamber 99. Alternatively, the cleaning gas can also be defensively grounded or capacitive. The ground is excited in the process chamber 935. Activated cleaning gas is introduced into the process chamber 935 via a gas disperser 940 to clean or etch any deposits remaining in the process chamber 935. A flow restrictor may be provided to allow A pressure difference may form between the process chamber 935 and another distant process chamber 990. In one example, the cleaning gas may include NF3 at a flow rate of about 1 to 2 liters per minute. It is generally considered that at another distant NF3, which is dissociated and decomposed in process chamber 990 (or process chamber 935), can provide fluorine radicals I capable of engraving silicon residues in process chamber 935. However, about 9qA or 90% or more of fluorine radicals will As a result, the £ 2 gas is discharged into the exhaust gas stream 100. The composition of the exhaust gas stream 100 is quite different from the exhaust gas stream 80, and the exhaust gas stream 80 is mainly composed of the used process gas and process by-products. Page 65 This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) · H 1 I n ϋ an n Order ----- ---- 553761 A7 B7 Consumer Cooperatives of Intellectual Property Bureau, Ministry of Economic Affairs Preparation of the invention (opposite; p2 exhaust gas stream 100 contains a relatively high proportion of f2. For example, depending on the process, the concentration of F2 in the exhaust gas stream i 00 can be as high as about 90%. Other processes Or process conditions, an exhaust gas stream with an F2 ratio of 50% or more, or an exhaust gas stream with an &amp; ratio of 10% or more can be produced. Or, when using a process gas containing fluorine, it will also Generate F2, such as process gases such as CF4, c2F6, CHIV,%, CH3P, c4: f8 'ch2: f2, c4; p6. Furthermore, in a process chamber 935 that can handle other substrate manufacturing processes (e.g., etching or post-etching processes), an exhaust gas stream containing h is also generated. The exhaust airflow can be generated during substrate processing, during processing, or after processing. In one example, the exhaust air flow is generated after the substrate is processed, or when the process chamber is cleaned. It is best to reduce the F2 content in the exhaust gas stream 100 before exhausting the exhaust gas stream 100. It is known that passing the exhaust gas stream over a catalyst can reduce the F2 content in the exhaust gas stream 1000. This catalytic mitigation step can also be performed in the presence of additives. In one example, the additives include hydrogen-containing and milk-containing substances, such as h2o, H202, alcohols, gases containing several groups, H2 and O2, and so on. In the presence of a catalyst, water and water can be converted into easily clean and / or HF and oxygen that can be emitted. It is generally believed that its hydroxyl group is achieved by the following reaction formula: _ 4 F2 + 2 H20 + catalyst 4 HF + 02 〇2 can be exhausted, and HF can be easily discharged by dissolving in water. Therefore, it is known that the exhaust gas stream 100 containing F2 can be moderated by additives containing hydrogen and oxygen. After adding additives such as water to the exhaust air stream containing F2, it can be slowed down on page 66. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before reading) Fill out this page) One outfit! I order! -

553761 A7 — _______ B7 V. Description of the Invention () The effect of reducing the emission of air stream 1 0 0 is unexpected. Generally try to prevent water and other oxygen-containing additives from coming into contact with the exhaust gas containing F2, because OF2 will react with F2 to form OF2 gas. Generally, the concentration of this p2 gas must be reduced below 50 ppb to release it. Into the environment. However, the 0f2 gas did not form. Instead, HF and oxygen were formed. In one example, the catalyst was placed in the catalytic reactor 250, and then the exhaust gas stream containing the {7 2 and the additive gas stream were passed through. . In one example, the catalytic reactor 250 is a part of the catalytic reduction system 2000. In this example, one or more of the flow regulating system 215, the additive gas supply chamber 220, and / or the front clean room 230 can be used to direct the appropriate additive gas to the exhaust gas. W in. For example, under the control of a valve 224, a suitable additive gas supply chamber 220 including a pipe 223 may allow additive gas or liquid from a gas supply source to flow into the channel 210. Add additives that react with toxic gases in the exhaust gas stream 1000. For example, in one example, water is added in the exhaust gas stream 100 in a volume ratio of about 0.2% to about 20% to decompose F2; preferably, about 3.5% to about 10% of water is added; more preferably, Water between about 4 ° / 0 and about 5%. Other additive gases, such as oxygen, can also be added to the exhaust gas stream in the form of 02 or air or other forms or compounds that can release oxygen. Alternatively, an inactivated gas such as nitrogen may be added. Another embodiment of a clean room 230 previously useful for a catalytic mitigation system 200 capable of mitigating F2 is shown in FIG. In this example, a recirculation system 402 can pass clean liquids (such as water and reaction products) through Preclean. Page 67 This paper applies Chinese National Standard (CNS) A4 specifications (21 × 297 mm) (Please read first Note on the back, please fill out this page again) 1- 1 n one SOT s emmmg i— f · — 1 emme mmMmm i

Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 A7 B7 V. Description of the Invention (Printed by the Consumers’ Cooperatives of the Intellectual Property Bureau of the Ministry of Economics 々 to 230 for recycling. First, connect to a clean liquid source (such as water): fill the unit Fill the storage tank 350 to a desired height. Desire: depends on the height of the flow channel 370. After that, open the pump 406. The pump 406 can draw fluid from the storage tank 350. In the example shown, the The fluid is a mixture of water and reaction products such as silicon dioxide and HF. Under the negative pressure of the pumping pump, these fluids pass through the inlet 411 and pass through the filter 421 to remove the reaction product particles. The particle filter has 4 doors Contains a filter that can remove about 2μπχ to 1mm particles. In the example, the particle filter 421 can remove particles with a volume of more than about 70μιη. After that, the filtrate is pumped through the pipeline 431 and then individually through the pipelines 432, 434, and 433. To the fluid nozzles 322, 342, and the throat 332. Fanpu 406 can also draw fresh cleansing liquid from the cleaning liquid supply source 441 (for example, water source) at a preset rate, in this example, water. Newly added The water will cause the storage tank 350 to flow into the overflow channel 370, and the overflow channel 37 can send the overflow part to the sewer. The newly added water can be used to maintain or adjust the storage tank 35, the preset pH value In one example, the newly added water system is introduced at a rate of about 025 gallons to about 1 gallon per minute, or at a rate sufficient to maintain the pH between about 2 and about 3. Alternatively, the pH may be Meter or a controller to adjust the rate of the introduced water according to the measured pH value. A control system 500 including a stylized controller 510 can also be used to control the operation of the pump 406. The controller 5 丨 〇 It can be a central processing unit (CPU). The pump 406 is operated according to a preset program instruction, and a certain amount of water is introduced into the exhaust air flow 100. For example, when the exhaust flow 10G to be reduced contains In F2, you can choose to provide more than about 2%, or about 2% of the amount of net overflow acid (please read the precautions on the back before filling this page) -------- ^ ---- ----- Page 68 This paper is applicable to National Standard (CNS) A4 specifications (210 χ 297 Public Love) 553761 Member of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Industrial and Consumer Cooperatives A7 B7 V. Description of the invention () The amount of water between about 20%, or about 4% to about 5%, to the pumping speed in the exhaust air stream 100. In another example, A gas analyzer 521 is provided at the exit of the front clean room 230. The controller 510 responds appropriately based on the output signal of the gas analyzer 521, and operates the Fanpu 406 and maintains a predetermined amount of water based on the output signal. For example, When the water gas or additive gas content (as measured by the gas analyzer 52 1) drops below the preset value, the controller 5 1 0 will automatically adjust the pumping rate of the pump 406. Alternatively, a gas analyzer (not shown) is installed downstream of the catalytic reactor 250, so that the controller 5 10 can operate according to the level indicated by the gas analyzer. For example, when the F2 content is higher than a preset value, the amount of water introduced into the exhaust gas flow 100 may be increased. The controller 510 includes a computer-readable medium having a built-in computer-readable program that can monitor the output signal of the gas analyzer 521. The controller 51 can also be incorporated into the system controller as described above. The catalytic mitigation system 200 may also be a self-contained integrated unit that is compatible with various process chambers. The catalytic mitigation system 2000 can be used to reduce the content of many toxic gases, including almost all types of PFCs and F2. The catalytic mitigation system 200 does not affect the operation of the process chamber and can be used with any process chamber that emits toxic gases. This catalytic mitigation system is simple to operate and takes up less than 40 cubic feet of space. Although the present invention has been described in detail through the embodiments, other variations are also within the scope of the present invention. Therefore, the scope of the following patent applications is not limited to the embodiments described. Page 69 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) -III n — II — 5J — — — — — — I. (Please read the precautions on the back before filling this page) line

Claims (1)

553761 Α8 Β8 C8 D8 Patent No. 89122496 Amended in May 1992 • 7 i whether you move. 1 more original printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Small and Medium Economy 6. Application scope of patents; U r, ( (&gt; I 1 · An equipment capable of processing the exhaust gas flow of a process chamber, the equipment includes at least the following: a process processing chamber capable of processing a substrate in a stimulated gas and thereby generating an exhaust gas flow; and a silicon component in the exhaust gas flow can be removed And a fluorine-containing first reactor; and a second reactor capable of removing the second component in the exhaust gas stream. 2 · The device according to item 1 of the patent application scope, wherein the first reactor is capable of removing the exhaust SiF4 in the gas stream. 3. The equipment as described in the first scope of the patent application, wherein the first reactor is capable of removing at least 80% of the SiF4 in the exhaust gas stream. 4 · The equipment as described in the first scope of the patent application. Among them, the second reactor is capable of removing perfluoride in the exhaust gas stream. 5. The device according to item 1 of the scope of the patent application, wherein the second reactor includes at least one capable of processing the exhaust gas stream. 6) The equipment as described in item 1 of the scope of the patent application, wherein the first reactor contains a cleaning liquid that can be carried in the opposite direction to the exhaust air flow. Page 71 This paper applies Chinese national standards ( CNS) A4 specification (21 × 297 mm) (Please read the precautions on the back before filling out this page). May _ 耱 · 553761 ABCD Patent No. 89122496 Amendment May 1992 6. Spraying nozzles for patent application (Please read the notes on the back before filling this page) 7. The equipment described in item 1 of the scope of patent application, where the first reactor contains a throat nozzle that can spray the cleaning liquid into the exhaust gas stream. 8. The equipment described in item 7 of the scope of the patent application, wherein the throat nozzle is capable of spraying the cleaning liquid in the direction almost the same as the exhaust air flow. 9 · The equipment described in the scope of the patent application, item 1, It further includes a third reactor capable of removing the third component in the exhaust gas stream. 1 0 · The device described in item 9 of the scope of the patent application, wherein the third reactor is a clean room. 1 1. A device capable of processing the exhaust gas flow from a process chamber, the device includes at least the following: The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs has printed a first reactor capable of removing silicon and fluorine components in the exhaust gas flow. The first reactor includes An inlet and an outlet; and a heater located downstream of the outlet. 1 2 · The equipment described in item 11 of the scope of the patent application, in which the reactor is on page 72. This paper applies the Chinese National Standard (CNS) A4 Specifications (210X297 mm) 553761 A8 B8 C8 Patent No. 89122496 May 1992 Amendment A. Patent application domain can remove silicon-containing components in the exhaust air stream. 1 3 · A device capable of cleaning the exhaust air of a process chamber, the device includes at least the following: a reactor capable of receiving the exhaust air; a nozzle capable of spraying the cleaning liquid in the opposite direction to the exhaust air; and a nozzle capable of removing the exhaust Filters for reaction products in a gas stream. 14. The device according to item 13 of the patent application park, further comprising a second nozzle capable of spraying the cleaning liquid into the reactor in the same direction as the exhaust gas stream. 15. The device according to item 14 of the scope of patent application, wherein the first and second nozzles are capable of spraying the cleaning liquid in almost parallel directions. 16. The device according to item 15 of the scope of patent application, wherein the second nozzle is a throat nozzle. (Please read the notes on the back before filling out this page) Printed by Fan Li from the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, please ask Zhongruqi to add 13 tables that can be included in the table and update their settings. The content of the description includes as little as possible to provide the equipment, the outgas hr, room cleaning system clean energy types listed on the next page 3 This paper size applies to China National Standard (CNS) A4 specifications (210X297 public love) 553761 ABCD No. 89122496 The patent case in May 1992 revised the scope of the patent application for a reactor capable of receiving exhaust gas flow; and a throat nozzle capable of injecting clean liquid into the reactor. Please read the precautions on the back before filling 1 9. The equipment as described in item 18 of the scope of patent application, where the reactor can accept the exhaust gas stream, and the throat nozzle can clean the liquid with the exhaust gas stream Injected into the reactor in the same direction. 20. The device according to item 18 of the scope of the patent application, wherein the reactor further comprises a plurality of channels and a throat nozzle capable of injecting a clean liquid into the channels. 2 1. —A device capable of cleaning the exhaust air from the process chamber. The device contains at least the following: A reactor containing at least four clean liquid channels. 2 2. —A kind of equipment capable of cleaning the exhaust air of the process chamber, the equipment includes at least the following: a reactor capable of receiving the exhaust air and the cleaning liquid; a filter; and a device capable of extracting the cleaning liquid from the reactor and passing through the filter Printed Pu for the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative. 23. The device according to item 22 of the scope of patent application, wherein the filter is capable of removing particles having a diameter of about 2 μm or more and about 1 mm. Page 74 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 553761 ABCD Patent No. 89122496 May 1992 revision of the scope of patent application 24. The equipment described in item 22 of the scope of patent application, of which The pump system can extract clean liquid from the reactor, pass through the filter, and then return to the reactor. 25. The device according to item 24 of the scope of patent application, further comprising a clean liquid source, and wherein the pump system can extract clean liquid from the clean liquid source into the reactor. 26. The device according to item 25 of the scope of patent application, further comprising a controller capable of adjusting the amount of clean liquid to be drawn from the clean liquid source into the reactor. 27. The device as described in item 26 of the scope of patent application, further comprising a detector capable of detecting the condition of the cleaning liquid in the reactor, and the controller therein can respond appropriately to the signal of the detector . 28. The device according to item 27 of the patent application, wherein the detector is a pH meter. Printed by the member of the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative, 29.-A device that can clean the exhaust air from the process room, which contains at least the following = a first clean room, which contains at least one first reactor that can receive the exhaust air; The second clean room contains at least one that can accept exhaust gas. Page 75 The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 553761 A8 B8 C 8 Patent No. 89122496 Amendment May 1992 --- ---- Ef ---- 6. The second reactor with a patent application flow; and (please read the precautions on the back before filling this page). A clean liquid can be drawn from the first reactor to the second reaction. Fan Pu in the device. 30. The device according to item 29 of the patent application park, further comprising a pressure compensator capable of compensating the pressure difference between the first and second reactors. 3 1 · The device described in item 29 of the patent application park, wherein the pump system can extract the cleaning solution from the first reaction and return the extracted cleaning solution to the first reaction. 32. The device according to item 29 of the scope of patent application, further comprising a clean liquid source, and wherein the pump system can extract the clean liquid from the clean liquid source into the second reactor. 3 3 · The device according to item 29 of the scope of patent application, further comprising a controller capable of adjusting the amount of clean liquid drawn from the clean liquid source into the reactor. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, the main consumer co-operative society printed a package containing as little as the equipment, the outflow hr, the room cleaning system, the clean energy, Ly.t, a kind of 4. · The middle flow gas out of the column. Flow out of the air «Received energy should be detected by the device and the condition of the liquid cleaner and clean the internal device should be detected by the energy detection page 76 117 This paper size applies to China National Standard (CNS) A4 specifications (210X297 mm); 53761 A8 B8 C8 D8 Patent No. 89122496 Amended in May 1992. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs X Printed by Consumer Cooperatives 6. Application for a patent scope 35 · The device described in item 34 of the scope of patent application 'includes a controller, It is a controller that can adjust the properties of the cleaning liquid according to the detected feelings. 36. The device according to item 35 of the scope of patent application, wherein the detector includes a pH meter. 3 7 · ~ A kind of equipment capable of processing the exhaust gas flow from the process chamber 'The equipment includes at least the following: a first reactor capable of receiving exhaust gas; a second reactor capable of receiving exhaust gas' and a device capable of compensating the first and Pressure compensator for the pressure difference between the second reactors. 3 8 · A method capable of processing the exhaust gas flow from a process chamber, the method includes at least the following: (a) processing a substrate to generate an exhaust gas flow; (b) removing silicon and fluorine-containing components from the exhaust gas flow in the first reactor ; And (c) removing the second component from the exhaust gas stream in the second reactor. 39. The method according to item 38 of the scope of patent application, wherein step (0 includes at least, before or after step (b), catalyzing a reaction in the exhaust gas stream to remove a component of the exhaust gas stream. Article 77 The paper size of this page applies to the Chinese National Standard (CNS) A4 specification (210X297) .............. Fees ......... 、 耵 ...... ... S (Please read the notes on the back before filling out this page) 553761 A8 B8 C8 D8 Patent No. 89122496 Patent Amendment May 1992 ...... ..... Order (Please read the notes on the back before filling in this page: &gt; Read the patent scope 4 〇 · The method described in item 38 of the patent scope, where step (b) includes at least The clean liquid is sprayed into the discharge air in the opposite direction to the discharge air. 4 1 · The method described in item 38 of the patent application scope, wherein step (b) at least Ci Inject into the exhaust fluorine stream. 42. A method capable of treating the exhaust gas stream from the process chamber, the method includes at least the following steps: (a) removing one of the exhaust gas streams in the reactor Components; and (b) heating the exhaust gas stream downstream of the reactor. 43. The method according to item 42 of the scope of patent application, wherein steps (a) to! Include at least a step of removing silicon-containing substances in the exhaust gas stream; ^ i Contains as little as the French side. The French side's outflow «E— Room process netting · · Jie Suo energy step box 歹 \ Under the Ministry of Economic Affairs, the Intellectual Property Bureau employee consumer cooperative printed kr to scattered points to the opposite side • In the bow phase, the device &gt; jf should be reversed to M. To the miscellaneous flow and the air flow; the net flow will be discharged from the outlet gas. The clean air filter will pass V} V) abc / IV / IV / IV Page 8 117 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 553761 ABCD 89122496 patent case May 1992 amendments, patent application scope 4 5. A method for exhausting airflow in a clean process chamber, the method at least It includes the following steps: (Please read the precautions on the back before filling out this page) (a) Direct the exhaust air flow into the reactor; and (b) Inject the cleaning solution into the reactor through the throat. 46 · —A clean process Chamber exhaust method, the The method includes at least the following steps: (a) directing the exhaust gas stream into the reactor; (b) dispersing the cleaning liquid into the reactor; and (c) extracting the cleaning liquid from the reactor and passing it through a filter. 47. If applied The method according to item 46 of the patent, wherein step (c) includes at least the step of returning the extracted clean liquid to the reactor again. 4 8. A method for exhausting a gas stream from a clean process chamber, the method comprising at least the following steps: (a) introducing the exhaust gas stream into the first reactor; (b) introducing the exhaust gas stream into the second reactor; and economically Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau (c) Let the cleaning liquid flow from the first reactor to the second reactor. 49. The method according to item 48 of the scope of patent application, further comprising the step of returning the clean liquid extracted from the first reactor back to the first reactor. 5 0. — A method for exhausting air from a clean process chamber. The method includes at least the following page 79. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 553761 A8 B8 C8 D8 Patent No. 89122496 92 In May, amendments were made by the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative to print the scope of patent applications: U) Direct the exhaust gas flow into the reactor; (b) Direct the clean liquid into the reactor; and (C) Detect the clean Liquid or reactor. 51. The method according to item 50 of the scope of patent application, further comprising the step of adjusting the cleaning liquid according to the reaction of step (c). 52. The method according to item 50 of the scope of patent application, wherein step (0) further includes a step of detecting the pH value of the cleaning liquid. 5 3-A method for processing the exhaust gas from the process chamber, the method includes at least the following steps: (a) processing the exhaust gas flow in the first reactor; (b) processing the exhaust gas flow in the second reactor; and (0) compensating the pressure difference between the first and second reactors. 54. A kind of exhaust gas heating An apparatus comprising at least: an exhaust gas inlet; an exhaust gas outlet; a wall adjacent to a gas flow channel; and a heater capable of heating the wall; wherein an exhaust gas introduced by the exhaust gas inlet , When it flows along the gas flow channel to the exit of the exhaust airflow, page 80 This paper is sized to the Chinese National Standard (CNS) A4 (210X297 public love) ............. Feng ......... 、 Order ......... (Please read the notes on the back before filling this page) 553761 8 8 8 8 ABCD Patent No. 89122496 Amended May 1992 Scope of patent application Employees' cooperation in intellectual property bureau of the Ministry of Economic Affairs The printing is heated. The device as described in item 54 of the Lingqing Patent Fanyuan, wherein the length of the gas flow channel is sufficient to warm the exhaust gas stream to at least about 4,000c 〇5 6 The device described in Patent Model 帛 54, wherein the length of the gas flow channel is sufficient to make the exhaust gas flow reach the desired temperature only through the gas flow passage for 5 times. The device according to item 6, wherein the length of the gas flow channel is sufficient to heat the exhaust gas flow to a temperature between about 400 ° C and about 700 ° C. 5 8 · Please refer to the device according to item 54 of the patent scope The heater is sufficient to heat the exhaust airflow to at least about 400, and the residence time of the exhaust airflow is less than 3 seconds. 5 9 · As described in the patent scope of item 58, The heater occupies less than 1,300 cubic inches of volume. 60. The device described in item 54 of the patent scope, where the gas flow channel is spiral. Page 81 This paper applies to China National Standard (CNS) A4 specification (210X297 mm) ......... 嚷........., OK ......... S (Please read the notes on the back before filling out this page) 553761 ABCD Patent No. 89122496 May 1992 Revises Intellectual Property of the Ministry of Economic Affairs Member X Consumer Cooperative Co., Ltd. printed and applied for the patent scope 1 · As described in the 54th case of the scope of the patent application, + ,,,, ;; this ^. The equipment described in Gang D D4, where the gas flow channel is located in several internal Within interconnected channels. 62. According to the scope of the patent application No. 54 (Extrusion, + ,, VW, I), the gas flow channel is defined by the intersecting portions of the channel. 63. The device according to item 54 of the patent application, wherein the wall includes at least one inner surface that is resistant to damage from the exhaust airflow. 64. The device according to item 54 of the patent application, wherein the wall and the heater are separated by at least about 2 mm. 65 · A substrate processing equipment, which includes at least the following: a process processing room capable of processing a substrate in an excited gas and thereby generating an exhaust gas stream; 'a heating furnace, which includes at least an exhaust gas inlet, an exhaust gas stream An outlet, a wall adjacent to the gas flow channel, and a heater capable of heating the wall; wherein the exhaust air supplied from the exhaust air inlet is flowed along the gas flow channel to the exhaust air outlet Heated by a heater. 66. The equipment described in item 65 of the scope of patent application, in which the heating furnace has a length L, and the gas flow passage has an inlet to an outlet. Page 82 This paper applies the Chinese National Standard (CNS) A4 specification. (210 X 297 Gongchu) ---------............ Order ......... ( Please read the notes on the back before filling out this page} 553761 A8 B8 C8 D8 Patent No. 89122496 Amended May 1992 Sixth, the length of the patent application scope is at least about 1.5L. 07 · As for the 65th patent application scope The device described above, wherein the gas flow channel is a spiral type. 68. The device described in the scope of the patent application No. 65, further comprises a catalytic reactor capable of receiving the exhaust gas stream heated by the furnace. 69 · The device according to item 65 of the scope of patent application, further comprising a heat exchanger capable of accepting the exhaust gas stream. 70 · —A method for treating a substrate and an exhaust gas stream, which includes at least the following steps: (a) in processing Processing a substrate in the zone, and thereby generating an exhaust gas stream, (b) passing the exhaust gas stream through a gas flow channel; and ( c) The exhaust gas is heated to a preset temperature within the time when the exhaust gas flows through the gas flow channel only once. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs. Printed by the Industrial and Consumer Cooperatives. A method comprising at least passing an exhaust gas flow through the gas flow channel so that the residence time of the exhaust gas flow in the gas flow channel is less than about 3 seconds. 72-The method according to item 70 of the scope of patent application, which at least Contains that the paper size on page 83 is applicable to the Chinese National Standard (CNS) A4 specification (210X297 public attack.) 553761 ABCD No. 89122496 Patent Case Amendment May 1992 Sixth, patent application scope Exhaust airflow through the spiral gas flow channel 73. An equipment capable of processing exhaust gas from a process chamber, the equipment comprising at least the following: a catalytic reactor including at least an exhaust gas inlet, an exhaust gas outlet, and an interior capable of containing the catalytic substance; and An opening that opens into the catalytic reactor and is used to remove or transport the catalytic substance. The device according to item 73 of the patent, further includes a cover that can cover the opening. 7 5 · The device according to item 73 of the patent application, further includes a device that can pass to the catalytic reactor. Two openings, the second opening can be used to remove or transport the catalytic substance. 76. The device described in item 73 of the scope of patent application, which further includes a vacuum system communicating with the opening. 77. If the scope of patent application is The device of item 73, further comprising a source of catalytic material in communication with the opening. 78 · The device as described in item 73 of the scope of patent application, where the opening is on page 84 "This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) • ......... .. · $ ........., order ......... (Please read the notes on the back before writing this page) Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Industrial and Consumer Cooperatives Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative, Patent No. 89122496 Amended in May 1992. The scope of patent application is located between the exhaust air inlet and the exhaust air outlet. 79. A method for removing catalytic substances from a reactor that can accept an exhaust gas stream, the method comprising at least the following steps: (a) providing an opening into the reactor; and (b) removing through the opening At least part of the catalytic substance. 8 〇 The method according to item 79 of the scope of patent application, further comprising the step of filtering at least a part of the reactants and the catalytic substance at or after the step (b) is performed. 8 1 · The method according to item 79 of the scope of patent application, further comprising the step of filtering at least a part of the reactants and the catalytic substance through the second opening at or after performing step (b). 8 2. The method according to item 79 of the scope of patent application, wherein step (b) includes at least a step of removing at least a part of the catalytic substance in a vacuum manner. 8 3 · —A device capable of processing the exhaust gas flow from the process chamber, the equipment contains at least the following: (a) a catalytic reactor, which has an exhaust gas inlet and an exhaust gas outlet; (b) — a reactor Container, which can hold the reminder on page 85. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page). Order # 553761 A8 B8 C8 D8 Patent No. 89122496 Amended in May 1992 Sixth, apply for the scope of the Zaoli benefits reactor. (Please read the precautions on the back before filling out this page.) 4 • The device as described in item 83 of the scope of patent application, where the reactor vessel contains an exhaust air inlet and an exhaust air outlet. 8 5 · The device according to item 83 of the patent application, wherein the catalytic reactor comprises a flange located in a groove of the reactor vessel. 86. The device according to item 83 of the scope of patent application, further comprising a cover covering the exhaust air inlet or the exhaust air outlet. 8 7 · The device according to item 83 of the scope of patent application, wherein the catalytic reactor includes a slot near the exhaust gas inlet or the exhaust gas outlet, and a slot located in the groove can cover the exhaust gas The inlet or the cover of the exhaust air outlet. 8 8 · A method for removing catalytic substances from a system capable of processing exhaust air from a process chamber, the method includes at least the following steps: printed by the Intellectual Property Bureau of the Ministry of Economic Affairs X Consumer Cooperative (a) the catalyst is contained in a container; And (b) removing the catalyst from the container. 89. The method of claim 88, wherein step &amp; includes at least the inclusion of a catalytic reactor in a container, the catalytic reactor containing a catalyst. P.86 The paper size applies to National Standard (CNS) A4 (210X297 mm)-553761 Patent case No. 122496 Amended in May 1992 Sixth, the scope of patent application 90. The method described in the 88th scope of the patent application, wherein steps ("to y include a catalyst in a catalytic reactor, and steps ( b) contains at least the catalyst removed through the opening of the catalytic reactor. A device that also processes the exhaust gas flow from the process chamber, the device includes at least the following: (a) a substrate capable of processing a substrate in a stimulated gas and therefore A process processing chamber for generating an exhaust gas stream; and 〇 &gt;)-a catalytic reactor 'which at least includes-an exhaust gas inlet, an exhaust gas outlet, and a catalytic substance therein, wherein the catalytic substance can be obtained from the equipment; 92. The device according to item 91 of the patent application, which further includes a heater capable of heating the exhaust air stream. 93 The device according to item 92 of the patent application, wherein the catalytic substance is It is separated from the heater. 94. The device according to item 92 of the scope of the patent application, wherein the catalytic reactor is separated from the heater. 95 ·-A process chamber row capable of processing Airflow equipment, the equipment contains at least page 87. The paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) &quot; &quot; --- (Please read the precautions on the back before filling this page)-Order · The Intellectual Property Bureau employee ministry of the Ministry of Economic Affairs printed 553761 ABCD No. 89122496 patent in May 1992, amending the patent application for a / V kr listed in the patent park. Due to the material base 1S. The energy of the process is controlled by the flow of energy I. Outflow gasification and exhaustion containment can contain a minimum of one to its mouth. I The materials that should be anti-sexualized in the entrance and space parts should be urged to send sexually transmitted materials or to dispel the detachment energy or the species_ 器 \ — / C / V (Please read the note on the back first Matters are reproduced on this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative, 96. The equipment described in item 95 of the scope of patent application, wherein the means for removing or transferring the catalytic substance includes at least one located in the catalytic reactor Opening 9 7. The device according to item 95 of the scope of patent application, wherein the means for removing or transferring the catalytic substance includes at least one separate connector between the process chamber and the catalytic reactor. 98. — A method for processing exhaust gas from a process chamber, the method includes at least the following steps: (a) processing a substrate in an excited state, and thereby generating an exhaust gas; (b) catalyzing a reaction in the exhaust gas to catalyze a reaction Treating the exhaust gas stream in a catalytic area; and (c) removing catalytic substances from the catalytic area. Page 88 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). The patent scope of the 6th China Patent 99 8 8 8 8 ABCD No. 22496 patent may be amended in May 1992. If the scope of the patent is 98 The method further includes a step of exhausting the air flow. Heating 〇. The method according to item 98 of the patent application scope, further comprising the step of transferring a catalytic substance to the catalytic region. 01 · A method for forming and processing an exhaust gas flow in a process chamber, the method includes at least the following steps ... Before, during, or after processing the substrate in the process chamber, introduce a process gas into the process processing chamber and form an F 5 containing 2 the exhaust airflow of the milk body; and passing the exhaust airflow over a catalyst to reduce the f2 gas content in the exhaust airflow. 102. The method as described in item 101 of the scope of patent application, which at least includes setting process conditions in the process processing chamber to generate an exhaust gas stream with a gas content of at least about 10%. .............. • Install ......... Order (Please read the notes on the back before filling out this page} § Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 103. The method according to item 101 of the scope of patent application, further comprising the step of introducing an additive into the exhaust gas stream, the additive including at least one hydrogen-containing substance and one oxygen-containing substance. Method for processing the exhaust air from the process chamber, page 89. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 553761 A8 B8 C8 D8 Patent No. 89122496 Patent May 1992 Amendment VI. Application The scope of the patent includes at least the following steps: (Please read the notes on the back before filling out this page) Before, during or after processing the substrate in the process chamber, introduce the process gas into the process processing chamber and form a F2 gas-containing Exhaust gas flow; and introducing an additive to the exhaust gas flow, the additive contains at least one hydrogen-containing substance and one oxygen-containing substance to reduce the F2 gas content in the exhaust gas stream. Way, It at least includes setting process conditions in the process processing chamber to generate an exhaust gas stream with an F2 gas content of at least about 10%. 106. The method as described in item 104 of the patent application scope, wherein the volume of the additive in the exhaust gas stream The ratio is higher than about 2%. 107. — A method for forming and processing the exhaust air from the process room, which includes at least the following steps: The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints before and when the substrate is processed in the process room Or after that, the process gas is introduced into the process processing chamber and an exhaust gas stream containing? 2 gas is formed; the exhaust gas stream is heated; and the exhaust gas stream is passed over a catalyst to reduce the F2 gas content in the exhaust gas stream. Page 90 of this Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 553761 ABCD Patent No. 89122496 May 1992 amendment 6. Application scope (please read the precautions on the back before filling this page) 108. If you apply The method described in item 107 of the patent scope includes at least setting process conditions in the process processing room to generate a F2 Exhaust gas flow with a gas content of at least about 10%. 1 09. The method described in item 107 of the patent application scope further includes the step of introducing an additive into the exhaust gas stream, the additive including at least one hydrogen-containing substance and An oxygen-containing substance. 1 10. A method for forming and processing an exhaust gas stream in a process chamber, the method comprising at least the following steps: Introducing a clean gas into the process chamber and forming an exhaust gas stream containing F2 gas; and letting this exhaust The gas stream passes over a catalyst to reduce the F2 gas content in the exhaust gas stream. 111. The method according to item 110 of the scope of patent application, wherein the cleaning gas contains at least nf3. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative 1 12. The method as described in item 110 of the scope of patent application, which further comprises exciting the clean gas in a remote process room. 113. The method according to item 110 of the scope of patent application, further comprising the step of introducing an additive into the exhaust gas stream, the additive including at least a hydrogen-containing substance and an oxygen-containing substance. Page 91 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 553761 A8 B8 C8 D8 Patent No. 89122496 Patent May 1992 Amendment 6. Scope of patents (please read the precautions on the back first) (Written on this page) 1 14. A method for forming and processing exhaust air from a process chamber, the method includes at least the following steps: introducing a gas into the process chamber to treat a substrate or cleaning the process chamber; forming an f2 gas Introducing an additive to the exhaust gas stream, the additive contains at least one hydrogen-containing substance and an oxygen-containing substance; passing the exhaust gas stream over a catalyst to form HF; introducing water into the exhaust gas stream to dissolve HF. 115. The method according to item 114 of the scope of patent application, wherein the treatment gas includes at least one cleaning gas containing NF3. 1 16. The method according to item 114 of the scope of patent application, further comprising exciting the clean gas in a remote processing chamber. Printed by a member of the Intellectual Property Bureau of the Ministry of Economic Affairs · Industrial and Consumer Cooperatives1 17. A substrate processing equipment, which includes at least the following: a process gas source; a process gas can be used to perform this process and form an exhaust containing F2 gas A gas processing chamber; and a catalytic reactor adapted to process the exhaust gas stream to reduce the F2 gas content therein. Page 92 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 553761 ^ C8 Patent No. 1224% Amendment May 1992 Garden 1 1 8. The device according to item 11 of the scope of patent application, further comprising an additive source capable of introducing additives into the exhaust gas stream, the additives including at least one hydrogen-containing substance and one oxygen-containing substance . 1 19. A substrate processing equipment comprising at least the following: a process processing chamber capable of performing the process with a process gas and forming an exhaust gas stream containing f2 gas; and a processing chamber capable of introducing additives to the exhaust gas stream In order to reduce the F2 gas content of the additive source, the additive contains at least a hydrogen-containing substance and an oxygen-containing substance. 120. The device according to item 119 of the scope of patent application, further comprising a controller capable of controlling the addition of hydrogen-containing substances and oxygen-containing substances in the exhaust gas stream. 121. The equipment described in item 120 of the scope of patent application, wherein the dry device is capable of maintaining at least about 2% of the volume of the additive in the exhaust air stream. ○ page 93 This paper applies Chinese National Standard (CNS) A4 Specifications (210X297mm) ------------- install tr (Please read the precautions on the back before filling this page}