552830 A7 B7 五、發明説明（） 經濟部智慧財產局員工消費合作社印製 本發明係與電路板有關，更詳而言之，乃是指一種使 用於印刷電路板之薄片狀背膠載體。 按，第一圖所示者，係為習知之背膠銅箔（7〇)實施於一 印刷電路基板(80)之配置狀態，纟主要係於該基板⑽之雨 5端面分別貼設-鋼洛（7〇)，該二銅结⑽在貼設前係預先於 其貼合面均勻的塗怖膠體⑽如第二圖所示，藉三表面光 滑之模具（79)(俗稱鏡板）自兩面將該二銅箔（7〇)壓貼於該基 板（80)，並加熱使該膠體（75)將該等銅箔（7〇)黏貼於該印刷 電路基板(80)，#該等銅箱（7〇)所涵蓋面積大於該基板(8〇)， 1〇則再另行將多餘的部份裁切去除，於裁切完成後，即可供 進行印刷電路之钱刻。 前述之背膠銅箔（70)在實施時之缺失在於·於該二模 具（79)將該二銅搭（70)壓抵於該基板（8〇)時位於銅结（7〇) 與基板(8〇)間之膠體(75)會有少量受擠壓而向外溢出，如第 15二圖所示，溢出之膠體（75)在加熱產生黏性後會將上下二 銅羯（7〇)相互黏接，增加裁切時的困難度；再者，由於該等 用來壓抵之模具(79)表面必須平整光滑，才能保持鋼謂⑽ 均勻的壓抵於該基板（80)，若溢出之膠體（75)流至模具(79) 表面，則會造成模具（79)表面不平，須另行加工去膠此又 2〇會產生去膠時是否會傷及模具（79)表面的問題，故習知背 膠銅络（70)之膠體(75)設置方式並不理想；再者，為了防I 溢膠污染該模具(79)，業者通常會於模具（79)與鋼箔（7〇)之 間叹置一清潔墊(release fUm)(圖中未示），在溢膠時承接膠 體，直接阻隔膠體沾黏至模具(79)，該清潔墊之設置亦造成 -3- ^紙張尺度適用中國iSi ( CNS )八4祕777^297公釐) ---一-一~-_ (请先聞«背面之注意事項存填寫本買) •装 訂 4 552830 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 了成本的增加。 本發明之主要目的即在提供一種使用於印刷電路板之 薄片狀背膠載體，其在壓抵於印刷電路基板時，膠體不會 向外溢出。 5 本發明之次一目的乃在提供一種使用於印刷電路板之 薄片狀背膠載體，其黏貼於印刷電路基板後外露之外緣較 習用者更易於裁切，且不會有鏡板受膠體污染的問題。 本發明之再一目的係在提供一種使用於印刷電路板之 薄片狀背膠載體，其無須使用清潔墊(release film)，較習用 10 者更節省成本。 緣是，依據本發明所提供之一種使用於印刷電路板之 薄片狀背膠載體，係用以配合設置於一印刷電路基板上， 該印刷電路基板係為絕緣材質，該背膠載體包含有：一片 狀主體，其大小至少相等於該印刷電路基板，於該片狀主 15 體接合至該印刷電路基板之端面係為一接合面，該接合面 上設有膠體，該膠體係平坦鋪設於該片狀主體，且形狀對 應並略小於該印刷電路基板，於該片狀主體貼置於該印刷 電路基板時，該印刷電路基板係罩蓋於該膠體所設之區 域。 20 有關本發明之詳細結構，特徵及功效，以下茲舉二較 佳實施例，並配合圖式作進一步之說明，其中： 第一圖係習用背膠銅板實施於一印刷電路基板之配置 示意圖； 第二圖係習用背膠銅板實施動作圖； -4- (請先聞讀背面之注意事項再填寫本頁) 4 項再填· 裝. if 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 552830 A7 B7 五、發明説明（） 第三圖係本發明第一較佳實施例之立體圖； 第四圖係本發明第一較佳實施例之配置狀態圖； 第五圖係本發明第二較佳實施例之立體圖。 請參閱第三圖至第四圖，本發明第一較佳實施例所提 5供之一種使用於印刷電路板之薄片狀背膠載體（1〇)，主要 係用以配合設置於一印刷電路基板（21)上，該印刷電路基 板(21)係為絕緣材質； 該背膠載體（10)，本實施例中係為一背膠銅箱，包含 有： 10 一片狀主體（11)，其形狀對應於该該印刷電路基板(21) 之形狀，於其接合至該印刷電路基板（2丨）之端面係為一接 合面（12)，該接合面（12)上設有膠體（19)，該膠體（19)係平 坦鋪設於該片狀主體（11)，且形狀對應並略小於該印刷電 路基板(21)，於該片狀主體（11)貼置於該印刷電路基板(21) 15 時，該印刷電路基板(21)係罩蓋於該膠體（19)所設之區域。 請再參閱第四圖，本發明於使用時，係以二本發明 (1〇)(即背膠載體）預設於該印刷電路基板(21)之兩端面，並 藉由二鏡板（31)由外將該二銅箔向該印刷電路基板(21)推 壓加熱，藉以使膠體（19)產生黏性將該二背膠載體（1〇)黏設 20於該電路基板(2丨)之二端面；其中，由於各該背膠載體（1〇) 之膠體（19)並未完全涵蓋該片狀主體⑴)之表面，聽對應 並略小於該電路基板(21)之形狀，因此，在膠體（19)受擠壓 的過程中雖會略向外延伸，但卻不會溢出於該電路基板(21) 外，不會造成習用者之缺失；亦即，透過本發明所提供之 -5- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 0請先閲讀背面之注意事項再填寫本頁) •裝.552830 A7 B7 V. Description of the invention () Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This invention is related to circuit boards. More specifically, it refers to a sheet-shaped adhesive carrier for printed circuit boards. As shown in the first figure, it is a conventional configuration state in which a self-adhesive copper foil (70) is implemented on a printed circuit board (80), which is mainly attached to the 5 end faces of the substrate-steel. Luo (70), the two copper knots are coated with colloids evenly on the bonding surface before being placed. As shown in the second figure, a three-surface smooth mold (79) (commonly known as a mirror plate) is used on both sides. The two copper foils (70) are pressed against the substrate (80), and the colloid (75) is heated to adhere the copper foils (70) to the printed circuit board (80), and the copper boxes The area covered by (70) is larger than that of the substrate (80), and then the extra part is cut and removed separately. After the cutting is completed, the printed circuit can be engraved. The aforementioned implementation of the adhesive-backed copper foil (70) is lacking in that: when the two molds (79) press the two copper straps (70) against the substrate (80), they are located at the copper junction (70) and the substrate A small amount of colloid (75) between (80) will be squeezed out and spilled out, as shown in Figure 15-2, the overflowed colloid (75) will be viscous after heating up to produce copper (70). ) Stick to each other, increasing the difficulty in cutting; further, because the surface of the mold (79) used for pressing must be flat and smooth, in order to maintain the steel ⑽ evenly pressed against the substrate (80), if The overflowed colloid (75) flows to the surface of the mold (79), which will cause the surface of the mold (79) to be uneven. It must be processed separately to remove the glue. This will cause the problem of whether the surface of the mold (79) will be injured when the glue is removed. Therefore, it is known that the setting method of the colloid (75) of the adhesive-backed copper network (70) is not ideal. Moreover, in order to prevent the mold (79) from being contaminated by I overflow, the industry usually uses the mold (79) and the steel foil (70). ), A cleaning pad (release not shown in the figure) is sighed. When the gel overflows, it accepts the gel and directly blocks the gel from sticking to the mold (79). The setting of the cleaning pad also causes -3. -^ Paper size applies to Chinese iSi (CNS) 8 4 secrets 777 ^ 297 mm) --- One-One ~ -_ (please first listen to «Notes on the back to save and fill in this purchase) • Binding 4 552830 A7 B7 Economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau of the People's Republic of China. 5. Description of Invention () Increased costs. The main object of the present invention is to provide a sheet-shaped adhesive-backed carrier for a printed circuit board, which does not spill out when pressed against a printed circuit board. 5 A second object of the present invention is to provide a sheet-shaped adhesive backing carrier for printed circuit boards, which is easier to cut than the user's exposed outer edge after sticking to the printed circuit board, and there is no mirror plate contaminated by colloids. The problem. Another object of the present invention is to provide a sheet-shaped adhesive backing carrier for printed circuit boards, which does not require the use of a release film, and is more cost-effective than the conventional one. The reason is that a sheet-shaped adhesive carrier for a printed circuit board provided in accordance with the present invention is used to be cooperatively disposed on a printed circuit board. The printed circuit board is an insulating material. The adhesive carrier includes: A piece of body having a size at least equal to that of the printed circuit board. An end surface where the piece of main body 15 is bonded to the printed circuit board is a joint surface. A gel is provided on the joint surface, and the glue system is laid on the flat surface. The sheet-shaped body has a shape corresponding to and slightly smaller than the printed circuit board. When the sheet-shaped body is attached to the printed circuit board, the printed circuit board is covered in an area provided by the gel. 20 With regard to the detailed structure, features, and effects of the present invention, two preferred embodiments are described below, and further illustrated in conjunction with the drawings, where: The first diagram is a schematic diagram of the configuration of a conventional adhesive-backed copper plate implemented on a printed circuit board; The second picture is the action diagram of the conventional adhesive-backed copper plate; -4- (Please read the precautions on the back before filling out this page) 4 items are refilled. If this paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) 552830 A7 B7 V. Description of the invention () The third diagram is a perspective view of the first preferred embodiment of the present invention; the fourth diagram is a configuration state diagram of the first preferred embodiment of the present invention; the fifth diagram is the present A perspective view of a second preferred embodiment of the invention. Please refer to the third to fourth figures. A sheet-shaped adhesive carrier (10) for a printed circuit board provided in 5 in the first preferred embodiment of the present invention is mainly used for cooperating with a printed circuit board. On the substrate (21), the printed circuit board (21) is made of insulating material; the adhesive-backed carrier (10), in this embodiment, is an adhesive-backed copper box, including: 10 one-piece body (11), Its shape corresponds to the shape of the printed circuit board (21), and an end surface bonded to the printed circuit board (2 丨) is a bonding surface (12), and a gel (19) is provided on the bonding surface (12). ), The colloid (19) is laid flat on the sheet-like body (11), and the shape corresponds to and is slightly smaller than the printed circuit board (21), and the sheet-like body (11) is placed on the printed circuit board (21) ) At 15 o'clock, the printed circuit board (21) is covered on the area provided by the colloid (19). Please refer to the fourth figure again. When the present invention is used, the present invention (10) (that is, the adhesive carrier) is preset on both end surfaces of the printed circuit board (21), and the two mirror plates (31) are used. The two copper foils are pressed and heated from the outside to the printed circuit board (21), so as to make the colloid (19) sticky. The two backing carriers (10) are attached to the circuit board (2 丨). Two end faces; among them, since the colloid (19) of each of the adhesive carriers (10) does not completely cover the surface of the sheet-like body (i), the shape corresponding to and slightly smaller than the shape of the circuit substrate (21), Although the colloid (19) will slightly extend outward during the process of being squeezed, it will not spill out of the circuit substrate (21) and will not cause the user to lose; that is, -5 provided by the present invention -This paper size applies Chinese National Standard (CNS) Α4 specification (210X 297 mm) 0 Please read the precautions on the back before filling in this page) • Packing.
、1T 經濟部智慧財產局員工消費合作社印製 552830 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 背膠載體（10)結構，可確保膠體（19)不會在銅箔黏貼於電路 基板(21)時向外溢出。 煩請再參閱第五圖，本發明第二較佳實施例所提供之 一種使用於印刷電路板之薄片狀背膠載體（4〇)，主要概同 5 於前揭實施例，不同之處在於： 该片狀主體(41)係呈長條片狀，而可捲繞成卷，於該片 狀主體（41)之接合面（42)係依序設有相隔預定距離之平坦 膠體(49)，而該等膠體(49)之形狀大小亦對應且略小於配合 黏貼之電路基板（圖中未示）；由於該等膠體(49)須經加熱才 10會產生黏性，故在捲繞時該片狀主體(41)不會自相黏貼； 本實施例之使用狀態亦概同於前揭實施例，僅須在黏 貼前預先裁切，即可使用，其餘之使用方式亦概同於前揭 實施例，容不贅述。 本發明所揭之背膠載體，除了可應用在背膠銅箔之外， 15亦可應用在PET塑膠膜或其他使用在印刷電路板領域中之 片狀背膠載體，亦即，本發明所揭之結構所能應用之領域 並不以背膠銅箔單一種材質為限。 由上述二實施例所揭可知，本發明可產生之優點為： 膠體（19)在壓擠加熱的過程中不會溢出於印刷電路基板(21) 20外，不會造成上下銅箔間相互黏貼，亦不會造成鏡板(31)污 染；此外，本發明在不使用清潔墊(rd ease film)的情況下， 即可有效的避免鏡板(31)遭到膠體污染，較習用者更為節 省成本，亦即，本發明確實改善了習用者之缺失。 综上所述，本發明所提供之使用於印刷電路板之薄片 -6- 本紙張尺度賴巾國國家標準（CNS )八4胁（210X297^57 I-------#~批衣------1T-----·# (請先閲讀背面之注意事項再填寫本買) 552830 A7 B7 五、發明説明（） 狀背膠載體，其具有前述優於習用者之各項優點，實用性 及進步性自已毋庸置疑，此外，該種結構從來未被公開使 用或揭露於各種文獻資料，揆諸新型專利要件，本案應已 具備，祈請貴審查委員撥冗詳為審查，並早日賜准專利 5 為禱。 ~裝 訂 線 C請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 552830 A7 B7五、發明説明（） 圖式之簡單說明： 第一圖係習用背膠銅板實施於一印刷電路基板之配置 不意圖； 第二圖係習用背膠銅板實施動作圖； 5 第三圖係本發明第一較佳實施例之立體圖； 第四圖係本發明第一較佳實施例之配置狀態圖； 第五圖係本發明第二較佳實施例之立體圖。 圖號說明部份： 10 (10)背膠載體 （11)片狀主體 （12)接合面 (19)膠體 （21)印刷電路基板 (31)鏡板 (40)背膠載體 （41)片狀主體 （42)接合面 (49)膠體 (·請先閱讀背面之注意事· •Ί •項再填· 裝—— :寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）1T printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 552830 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () The structure of the adhesive carrier (10) can ensure that the colloid (19) will not be on the copper foil When sticking to the circuit board (21), it overflows outward. Please refer to the fifth figure again. A sheet-shaped adhesive carrier (40) for a printed circuit board provided by the second preferred embodiment of the present invention is mainly the same as the previous embodiment 5 except that: The sheet-like body (41) is in the form of a long sheet and can be wound into a roll. The joint surface (42) of the sheet-like body (41) is sequentially provided with flat colloids (49) separated by a predetermined distance. The shape and size of the colloids (49) are also corresponding and slightly smaller than the circuit substrates (not shown in the figure). Because the colloids (49) need to be heated to be 10, they will be sticky. The sheet-like body (41) will not be self-adhesive; the usage status of this embodiment is also the same as that of the previous release embodiment. It only needs to be cut before use and can be used, and the remaining use methods are also the same as those of the previous release. The embodiment will not be described in detail. In addition to the adhesive backed copper foil disclosed in the present invention, in addition to adhesive backed copper foil, 15 can also be applied to PET plastic film or other sheet-shaped adhesive backed carriers used in the field of printed circuit boards, that is, the present invention The field of application of the exposed structure is not limited to a single material of adhesive-coated copper foil. It can be known from the above two embodiments that the present invention can produce the following advantages: The colloid (19) will not overflow the printed circuit board (21) 20 during the extrusion heating process, and will not cause the upper and lower copper foils to stick to each other. It will not cause the mirror plate (31) to be polluted. In addition, the invention can effectively prevent the mirror plate (31) from being contaminated by colloid without using a cleaning pad (rd ease film), which saves costs more than the user. That is, the present invention does improve the lack of users. In summary, the sheet for printed circuit boards provided by the present invention is a national standard (CNS) 8-4 (210X297 ^ 57 I ------- # ~) ------ 1T ----- · # (Please read the precautions on the back before filling out this purchase) 552830 A7 B7 V. Description of the invention () The shape of the adhesive carrier, which has the aforementioned advantages over the conventional ones There are no doubts about the advantages, practicability, and advancement. In addition, this structure has never been publicly used or disclosed in various documents and new patent elements. This case should already be available. I ask your reviewers to set aside time for review. As soon as possible, pray for the grant of quasi-patent 5. ~ Gutter C, please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs This paper applies Chinese National Standard (CNS) A4 specifications (210X 297 (Mm) 552830 A7 B7 V. Description of the invention () Brief description of the drawing: The first picture is a layout of a conventional adhesive-backed copper plate implemented on a printed circuit board; the second diagram is an action diagram of a conventional adhesive-backed copper plate; 5 The third diagram is the first preferred embodiment of the present invention. A perspective view of the; FIG fourth system of the first preferred embodiment of a state diagram of the configuration of the present invention; FIG fifth preferred system a second perspective view of an embodiment of the present invention. Description of drawing number: 10 (10) Adhesive carrier (11) Sheet body (12) Joint surface (19) Colloid (21) Printed circuit board (31) Mirror plate (40) Adhesive carrier (41) Sheet body (42) Joint surface (49) Colloid (· Please read the notes on the back · • Ί • Refill the item · Packing —: Write this page) Order Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs This paper applies to China National Standard (CNS) A4 specification (210X297 mm)