550858 _案號90133146_年月日__ 五、發明說明（2) 免缺失的存在，本發明可使接觸端子之電鍍區域電鍍層較 為平均與確實，俾利日後接觸端子與錫球之熔接，並防止 曰後接觸端子電鍍區域產生氧化之鏽斑而使接觸端子無法 確實導通者，及可有效降低接觸端子因電鍍程序不確實與 不均勻者。 為達上述之目的，本發明其主要先將素材作一裁切及 沖壓形成一端子半成品，隨即再對該端子半成品之電鍍區 域作電鍍程序，最後再將該端子半成品作彎折程序形成一 成品。550858 _Case No. 90133146_ 年月 日 __ V. Description of the invention (2) Free from the existence of the invention, the present invention can make the plating layer of the plating area of the contact terminal more even and reliable, and benefit the future welding of the contact terminal and the solder ball. It also prevents those who have oxidation rust spots on the electroplated area of the contact terminals from making contact terminals unable to be surely connected, and can effectively reduce the contact terminals due to inaccurate and uneven electroplating procedures. In order to achieve the above purpose, the present invention mainly cuts and punches the material to form a terminal semi-finished product, and then performs a plating process on the plating area of the terminal semi-finished product, and finally bends the terminal semi-finished product to form a finished product. .
【發明說明】 請參閱『第1圖』、『第2A〜2B圖』所示，係本 發明之製作流程圖及本發明之製程實施示意圖（一）〜 (二），如圖所示： 本製程主要先裁切一適當面積之素材1 (可為銅材 類）；再對其沖壓線1 1作沖壓成一接觸端子2之半成 品；隨即再對該接觸端子2半成品之電鍍區域2 4 (及二 夾持部2 1 、基板2 2與承載部2 3 )作電鍍程序；最後 再將該接觸端子2半成品依其彎折線1 2作彎折程序形成 接觸端子2之成品； 其中，該電鍍程序可為點鍍或刷鍍之方式。[Explanation of the invention] Please refer to "Figure 1" and "Figures 2A ~ 2B", which are the manufacturing flow chart of the present invention and the schematic diagram of the process implementation of the present invention (1) ~ (2), as shown in the figure: The manufacturing process first cuts an appropriate area of material 1 (could be copper); then punches its stamping line 11 into a semi-finished product of contact terminal 2; and then plating area 2 4 of the semi-finished product of contact terminal 2 (and The two clamping portions 21, the substrate 22, and the bearing portion 23 are subjected to a plating process; finally, the semi-finished product of the contact terminal 2 is subjected to a bending process according to its bending line 12 to form a finished product of the contact terminal 2. Among them, the plating process Can be spot or brush plating.
如是，藉由本製程使接觸端子2之電鍍過程更為確 實，並使該接觸端子2之電鍍區域2 4電鍍層較為平均與 確實； 請參閱『第3圖』所示，係本發明之應用例使用狀態If so, the plating process of the contact terminal 2 is made more reliable by this process, and the plating layer 24 of the contact terminal 2 is more even and reliable; please refer to "Figure 3", which is an application example of the present invention status of use
第5頁 550858 五、發明說明（3) 示意圖，如 中該接觸端 均有電鍍層 為鑛金層， 其他區域或 位於接觸端 爰是， 材作一裁切 成品之電鑛 折程序形成 域電鍍層較 接，並防止 觸端子無法 佳實施例而 凡依本發明 屬本發明專 綜上所 善習知結構 合新型專利 審查委員撥 德便。 圖所示：藉由本製程所生產出接觸端子2，其 ^ 2之二夾持部2 i、基板2 2與承載部2 ^ (為鍍金層），其中該承載部23之電鍍 止錫球3植入時-，產生錫球3溢流至 子2 =;=:如此更可穩固與確實的定 本發明一種PGA接觸端子之製程，主要先 f沖壓形成一端子半成品’隨即再對該端子半 電鍍程序’最後再將該端子半成品“ 為平均與確實，俾利曰後接觸端子與錫= 確實ί通f…上所述者，僅為 =，备不忐以之限定本發明實施之範圍，^ 作之均等變化與修飾，皆應仍 :種更接λ端：， ”之要件，爰；利π性:請並： 几’·、田審’並盼早曰准予專利以鼓勵發明，實二Page 5 550858 V. Description of the invention (3) Schematic diagram, if the contact end has electroplated layer as mineral gold layer, other areas or at the contact end 爰 Yes, the material is used as a cutting finished product. The plating layer is relatively connected, and the contact terminal is prevented from being a good embodiment. Anyone who is in accordance with the present invention is a well-known structure of the present invention and a patent examination committee of the new type. As shown in the figure: The contact terminal 2 produced by this process has two clamping parts 2 i, a substrate 2 2 and a supporting part 2 ^ (gold-plated), wherein the soldering ball 3 of the supporting part 23 is plated. At the time of implantation, the overflow of the solder ball 3 to the sub 2 =; =: This makes the process of a PGA contact terminal of the present invention more stable and reliable, mainly by f stamping to form a terminal semi-finished product, and then semi-plating the terminal. At the end of the program, the semi-finished product of the terminal is "average and reliable, and the contact terminal and the tin are exactly the same as described above, only =, not to limit the scope of implementation of the present invention, ^ The equal changes and modifications of the work should still be: the species is more connected to the lambda :, "", "; the advantage of π: please and:" Ji, Tian Shen "and look forward to granting patents early to encourage inventions.
550858 圖式簡單說明 為使 貴審查委員對本發明之構造功效、詳細說明及 技術内容有更深一層瞭解，現就配合圖式說明如下： 【圖式之簡單說明】 第1圖，係本發明之製作流程圖、 第2 A圖，係本發明之製程實施示意圖（一）。 第2 B圖，係本發明之製程實施示意圖（二）。 第3圖，係本發明之應用例使用狀態示意圖。 【圖號說明】 f #...................1 沖壓線.................11 彎折線.................12 接觸端子.................2 失持部·· · 21 基板..................2 2 承載部.................2 3 電鍍區域......... 24 @ ;求...................3550858 Brief description of the drawings In order to make your reviewers have a deeper understanding of the structure, efficacy, detailed description and technical content of the present invention, the description with the drawings is as follows: [Simplified description of the drawings] Figure 1 is the production of the present invention The flow chart and FIG. 2A are schematic diagrams (I) of the process implementation of the present invention. Figure 2B is a schematic diagram of the process of the present invention (two). FIG. 3 is a schematic diagram of a use state of an application example of the present invention. [Illustration of drawing number] f # ................... 1 stamping line ........ 11 bending line. 12 Contact terminal ... 2 Mismatch section ... 21 Substrate ... ........ 2 2 Load-bearing section ....... 2 3 Plating area ... 24 @; Seek ... 3
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