TW548232B - MEMS-based wavelength equalizer - Google Patents
MEMS-based wavelength equalizer Download PDFInfo
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- TW548232B TW548232B TW090125548A TW90125548A TW548232B TW 548232 B TW548232 B TW 548232B TW 090125548 A TW090125548 A TW 090125548A TW 90125548 A TW90125548 A TW 90125548A TW 548232 B TW548232 B TW 548232B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
- G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
- G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0866—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by thermal means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
- G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12104—Mirror; Reflectors or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29304—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating
- G02B6/29305—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating as bulk element, i.e. free space arrangement external to a light guide
- G02B6/2931—Diffractive element operating in reflection
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29304—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating
- G02B6/29305—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating as bulk element, i.e. free space arrangement external to a light guide
- G02B6/29313—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating as bulk element, i.e. free space arrangement external to a light guide characterised by means for controlling the position or direction of light incident to or leaving the diffractive element, e.g. for varying the wavelength response
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29379—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device
- G02B6/2938—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device for multiplexing or demultiplexing, i.e. combining or separating wavelengths, e.g. 1xN, NxM
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
- G02B6/356—Switching arrangements, i.e. number of input/output ports and interconnection types in an optical cross-connect device, e.g. routing and switching aspects of interconnecting different paths propagating different wavelengths to (re)configure the various input and output links
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
- G02B6/3576—Temperature or heat actuation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3594—Characterised by additional functional means, e.g. means for variably attenuating or branching or means for switching differently polarized beams
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
Description
548232 A7 B7 五、發明説明(1 ) 概略而言本發明係有關基於MEMS之波長特定等化器,特 別係有關一種使用基於MEMS之裝置俾駕馭以及操控於波 長等化器之光束之方法及裝置。 於波長劃分多工化(Γ WDM」)網路中,單一光纖經常載 有多個獨立無關的資料頻道,其中各資料頻道係指定給— 個離散光學波長。於光纖電信網路中,不同波長可能不具 有相同振幅。舉例言之隨著信號的傳播通過光纖網路,信 號遭遇網路内部點至點的傳輸耗損以及耦合耗損。爲了補 償傳輸耗損及耦合耗損,光纖所在多工化信號經常於網路 的各點使用铒攙雜纖維放大器等放大。 铒攙雜纖維放大器放大多工化信號内部所含各個光學波 長。但由餌攙雜纖維放大器提供的放大增益並非與頻率均 一。反而某些波長被放大的程度遠比其它波長被放大的程 度更大。當多工化信號經歷多個週期的傳輸耗損、耦合耗 損然後放大時,各個波長間的強度變化增長。若未經校正 ,則非均一的信號強度可能導致頻道間的_音以及傳輸資 料的漏失。 爲了減少此等放大器之非線性影響以及允許使用常用通 訊環路用於全部頻道,需要各個波長頻道具有類似的功率 位準。但當各個波長於網路的各個節點被增刪時,各個頻 道的功率位準改變,其又變更放大器的增益譜。此種網路 變化於顧客増刪時爲緩慢,或當網路的資料流量係動態重 新路由俾便改良效率時此種網路變化快速。經常功率的變 化就波長方面而言爲粗略單調,而可藉由隨著波長改變之 -4 -548232 A7 B7 V. Description of the invention (1) Generally speaking, the present invention relates to a wavelength-specific equalizer based on MEMS, and particularly to a method and device for using a MEMS-based device to steer and control a beam of light that is equalized by the wavelength equalizer. . In a wavelength division multiplexed (Γ WDM) network, a single fiber often carries multiple independent and unrelated data channels, where each data channel is assigned to a discrete optical wavelength. In fiber optic telecommunication networks, different wavelengths may not have the same amplitude. For example, as the signal propagates through the fiber optic network, the signal encounters point-to-point transmission loss and coupling loss within the network. In order to compensate for transmission loss and coupling loss, the multiplexed signal where the fiber is located is often amplified at various points on the network using a doped fiber amplifier. The hybrid fiber amplifier amplifies each optical wavelength contained in the multiplexed signal. However, the gain provided by the bait-doped fiber amplifier is not uniform with frequency. Instead, some wavelengths are amplified much more than others. When a multiplexed signal experiences multiple periods of transmission loss, coupling loss, and then amplifies, the intensity change between each wavelength increases. Without correction, non-uniform signal strength may cause inter-channel tones and leakage of transmission data. In order to reduce the non-linear effects of these amplifiers and allow the use of common communication loops for all channels, similar power levels are required for each wavelength channel. But when each wavelength is added to or deleted from each node of the network, the power level of each channel changes, which in turn changes the gain spectrum of the amplifier. This kind of network changes slowly when the customer deletes it, or when the data traffic of the network is dynamically rerouted to improve efficiency, the network changes quickly. Frequent power changes are roughly monotonic in terms of wavelength, but can be changed by changing with wavelength -4-
548232 A7 B7 五、發明説明(2 ) 衰減單調變化,換言之藉由光譜的衰減傾斜而獲得充分補 償。 已經發展出系統及方法俾補償餌攙雜纖維放大器於光纖 通訊上的非均一波長相依性增益。此種先前技藝之一係經 由前置加強由光纖載波信號的輸入位準而預備性補償铒攙 雜纖維放大器的非均一增益。此種先前技藝技術舉例説明 於「於放大光波系統之端至端等化實驗」,作者 A · R · Chraplyvy 等人,IEEE 光子技術函件,4(4),428-429 頁 (1993 年4 月)。 第二種先前技藝補償铒攙雜纖維放大器之非均一增益之 技術係使用線上光學濾波器。光纖可篩檢具有最大放大程 度的波長,藉此跨全部信號波長形成更爲均一的信號強度 。此種先前技藝技術舉例説明於「於多階段式纖維放大器 使用MACH-ZENHDER光學濾波器之可調諧增益等化」,作 者R.Inoue等人,IEEE光子技術函件,3(8),718-720頁, (1991年4月)。也參考美國專利第5,430,817號(Vengsarker)。 美國專利第5,500,761號(Goossen等人)揭示可用於光學功 率等化之機械抗反射開關調變器(Γ MARS調變器」)。 MARS調變器基本上爲Fabry- Perot空腔包含光學膜與基板間 的間隙。調變係基於膜相對於基板之電壓控制垂直移動。 MARS調變器提供速率超過每秒數百萬位元的寬頻高對比度 反射調變。具有低插入耗損以及寬操作頻寬的MARS調變器 ,特別可有利地用於光學通訊應用用途之具有低插入耗損 以及寬操作頻寬之MARS調變器述於美國專利第5,870,221號。 -5- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232548232 A7 B7 V. Description of the invention (2) Monotonic change in attenuation, in other words, full compensation is obtained by the attenuation slope of the spectrum. Systems and methods have been developed to compensate for the non-uniform wavelength-dependent gains of bait and hybrid fiber amplifiers in fiber optic communications. One of such previous techniques is to pre-compensate the non-uniform gain of the hybrid fiber amplifier by pre-emphasizing the input level of the fiber carrier signal. This prior art technique is exemplified in "End-to-End Equalization Experiments in Amplified Lightwave Systems" by author A · R · Chraplyvy et al. IEEE Photonic Technology Letters, 4 (4), pages 428-429 (April 1993) ). The second prior art technique to compensate the non-uniform gain of a doped fiber amplifier is to use an in-line optical filter. The fiber can screen wavelengths with the greatest amplification, thereby forming a more uniform signal strength across all signal wavelengths. This prior art technique is exemplified in "Tuneable Gain Equalization Using MACH-ZENHDER Optical Filters in Multi-stage Fiber Amplifiers", author R. Inoue et al., IEEE Photonics Technology Letters, 3 (8), 718-720 P. (April 1991). See also US Patent No. 5,430,817 (Vengsarker). U.S. Patent No. 5,500,761 (Goossen et al.) Discloses a mechanical anti-reflection switch modulator (Γ MARS modulator) that can be used for optical power equalization. The MARS modulator is basically a Fabry-Perot cavity containing a gap between the optical film and the substrate. Modulation is based on the vertical voltage control of the film relative to the substrate. MARS modulators provide broadband, high-contrast reflection modulation at rates in excess of millions of bits per second. MARS modulators with low insertion loss and wide operating bandwidth, MARS modulators with low insertion loss and wide operating bandwidth that are particularly advantageous for use in optical communication applications are described in US Patent No. 5,870,221. -5- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 548232
參附圖,圖1爲Goossen專利案所述該類型單一單元 MARS調變器之示意剖面圖。裝置9包含基板1〇以及膜15, 其彼此隔開而界定一個間隙20介於其間。基板1〇爲導電材 料例如攙雜矽,膜15包含一或多層導電材料例如氮化矽頂 層15a以及多晶矽底層丨5b。頂層具有折射率約等於基板折 射率的方根,以及底層具有折射率約等於基板折射率。i5a 及15b厚度各自小於操作波長a的四分之一。膜μ及基板 1 〇係藉絕緣材料的周邊支持層i 2彼此隔開。電極3 〇及3 i 允許膜15及基板10分別連接至偏壓源29端子。 氣隙2 0可由基板與膜間的偏壓控制。當間隙2 〇爲操作波 長;I的四分之一的奇整數倍數時產生相對反射最高峰。當 間隙20爲零或爲A /4之偶整數倍數時產生最低値。 本發明係有關一種波長等化器,其係用於選擇性衰減波 長劃分多工化信號内部所含多個離散波長信號而未影響毗 鄰信號。 一個具體實施例中,波長等化器包括一個解多工器,其 適合將波長劃分多工化信號分離成爲多個離散波長信號, 以及導引各個離散波長信號順著多條第一光徑。一種包含 至少一個微鏡之微機裝置係光學輕合各條第一光徑。各條 第二光徑係位於可接收由各別微鏡反射的離散波長信號位 置。至少一個致動器係以機械方式耦合各個微鏡。致動器 適合選擇性替換一或多個微鏡俾轉向至少部分離散波長遠 離對應第二光徑。微鏡方向決定反射至對應第二光徑之該 離散波長信號的信號強度。設置多工器俾將於多條第二光 -6- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Referring to the drawings, FIG. 1 is a schematic cross-sectional view of a single-unit MARS modulator of the type described in the Goossen patent. The device 9 includes a substrate 10 and a film 15 which are spaced apart from each other and define a gap 20 therebetween. The substrate 10 is a conductive material such as doped silicon, and the film 15 includes one or more conductive materials such as a silicon nitride top layer 15a and a polycrystalline silicon bottom layer 5b. The top layer has a square root having a refractive index approximately equal to the refractive index of the substrate, and the bottom layer has a refractive index approximately equal to the refractive index of the substrate. i5a and 15b are each less than a quarter of the operating wavelength a. The film μ and the substrate 10 are separated from each other by a peripheral support layer i 2 of an insulating material. The electrodes 3 0 and 3 i allow the film 15 and the substrate 10 to be connected to the bias source 29 terminals, respectively. The air gap 20 can be controlled by the bias voltage between the substrate and the film. The highest peak of relative reflection occurs when the gap 20 is the operating wavelength; an odd multiple of a quarter of I. The lowest chirp occurs when the gap 20 is zero or an even multiple of A / 4. The present invention relates to a wavelength equalizer, which is used for selectively attenuating wavelengths and dividing a plurality of discrete wavelength signals contained in a multiplexed signal without affecting adjacent signals. In a specific embodiment, the wavelength equalizer includes a demultiplexer, which is adapted to separate the wavelength division multiplexed signal into a plurality of discrete wavelength signals, and guide each discrete wavelength signal along a plurality of first optical paths. A microcomputer device including at least one micromirror optically closes each first optical path. Each of the second optical paths is located at a position capable of receiving a discrete wavelength signal reflected by a respective micromirror. At least one actuator is mechanically coupled to each micromirror. The actuator is adapted to selectively replace one or more micromirrors, turning at least partly discrete wavelengths away from the corresponding second optical path. The direction of the micromirror determines the signal intensity of the discrete wavelength signal reflected to the second optical path. Set the multiplexer to be used for multiple second lights -6- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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548232548232
輕的離散波長信號組合成爲一個重新組構的波長劃分多工 化信號。 一個具體實施例中,第一光徑包含第二光徑。換言之離 散波長被反射偏離微鏡背面沿著第一光徑向下。設置多個 ^唬強度偵測器俾偵測離散波長信號之光學信號強度。一 個具體實施例中,分束器係位在順著多條第一光徑。信號 強度偵測器係以光學方式耦合至分束器俾偵測離散波長信 號的信號強度。控制器係視需要而耦合至致動器以及信號 強度偵測器。控制器可回應於監測得的信號強度而選擇性 衰減一或多個離散波長信號。 微鏡及致動器較佳係建構於基板表面上。微鏡係藉鉸鏈 、萬向接頭或扭轉彈簧附接至基板表面。微鏡適合移動通 過至少一自由度。 致動器較佳爲熱致動器。熱致動器包含至少一熱臂其具 有錨足於該表面之第一端和位在該表面上方的游離端,以 及一冷臂其具有錨定於表面的第一端以及游離端。冷臂相 對於表面係位在熱臂上方。一構件以機械及電力方式耦合 熱臂與冷臂的游離端。該構件係位於當電流至少施加於熱 臂時可接合鏡位置。一個具體實施例中,熱致動器包含至 少一種’度其適合提供經過控制的弯曲。另一具體實施例 中,熱致動器包含至少一加強件。 當致動器係於未經活化組態時,微鏡實質上反射全部離 散波長仏號由弟'一光徑之一至對應的第二光徑。當致動器 係於激活組態時,微鏡僅反射部分離散波長信號由第一光 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232 A7 B7 五、發明説明Light discrete wavelength signals are combined into a restructured wavelength division multiplexed signal. In a specific embodiment, the first optical path includes a second optical path. In other words, the scattered wavelength is reflected off the back side of the micromirror along the radial direction of the first light. Set multiple intensity detectors to detect the optical signal intensity of discrete wavelength signals. In a specific embodiment, the beam splitter is located along a plurality of first optical paths. The signal strength detector is optically coupled to the beam splitter and detects the signal strength of discrete wavelength signals. The controller is coupled to the actuator and signal strength detector as needed. The controller may selectively attenuate one or more discrete wavelength signals in response to the monitored signal strength. The micromirror and the actuator are preferably constructed on the surface of the substrate. The micromirror is attached to the surface of the substrate by a hinge, a universal joint or a torsion spring. The micromirror is adapted to move through at least one degree of freedom. The actuator is preferably a thermal actuator. The thermal actuator includes at least a hot arm having a first end anchored to the surface and a free end located above the surface, and a cold arm having a first end anchored to the surface and a free end. The cold arm is positioned above the hot arm relative to the surface. A component mechanically and electrically couples the free ends of the hot and cold arms. The member is in a position that can engage the mirror when current is applied to at least the hot arm. In a specific embodiment, the thermal actuator comprises at least one ' degree which is adapted to provide controlled bending. In another embodiment, the thermal actuator includes at least one reinforcing member. When the actuator is in an unactivated configuration, the micromirror reflects substantially all of the discrete wavelengths, from one of the optical paths to the corresponding second optical path. When the actuator is in the active configuration, the micromirror only reflects part of the discrete wavelength signals from the first light. The paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 548232 A7 B7 V. Description of the invention
徑之一至對應的第二光徑。一個具體實施例中,當致動器 係於激活組態時,微鏡實質上並未反射任何離散波長信號 由第一光徑·之一至對應的第二光徑。 另一具體實施例中,波長等化器包含解多工器,其適合 將波長劃分多工化信號分離成爲多個離散波長信號,以及 導引各個離散波長信號順著對應多條第一光徑。多條第二 光徑係位於接收離散波長信號的位置。微機裝置包含熱致 動器,其適合選擇性轉向至少部分離散波長由一或多條第 一光徑遠離對應的第二光徑。設置多工器俾組合於多條第 一光徑之離散波長信號成爲一個重新組構的波長劃分多工 化信號。 、一個具體實施例中,微機裝置包含多個微鏡其係以機械 万式耦合至多個熱致動器。於另一具體實施例中,多條第 光I各自係沿對應熱致動器表面延伸。當熱致動器 未經激發條件時,第二光徑係光學對準對應的各第一光徑 。當熱致動器係於激活條件時,第一光徑分別係由各對應 的第一光徑轉向。 〜 本發明亦係針對一種利用本發明之波長等化器之光學通 :系統:光學通訊系統之一具體實施例爲交換式波長劃分 二工化光學通訊系統,其包含至少-根光纖載有波長劃分 多工化信號以及本發明之波長等化器。 其它本發明之特色由後文特定具體實施例之細節説明連 同附圖研讀將更爲彰顯。 圖1爲先則技藝機械抗反射交換調變器之側視圖。One of the paths to the corresponding second optical path. In a specific embodiment, when the actuator is in an activated configuration, the micromirror does not substantially reflect any discrete wavelength signal from the first optical path · one to the corresponding second optical path. In another specific embodiment, the wavelength equalizer includes a demultiplexer, which is suitable for separating the wavelength division multiplexed signal into a plurality of discrete wavelength signals, and guiding each discrete wavelength signal along a corresponding plurality of first optical paths. . The plurality of second optical paths are located at positions where discrete wavelength signals are received. The microcomputer device includes a thermal actuator adapted to selectively steer at least a portion of the discrete wavelengths away from the corresponding second optical path by one or more first optical paths. A multiplexer is set up to combine the discrete wavelength signals of multiple first optical paths into a restructured wavelength division multiplexed signal. In a specific embodiment, the microcomputer device includes a plurality of micromirrors which are mechanically coupled to a plurality of thermal actuators. In another specific embodiment, each of the plurality of first lights I extends along the surface of the corresponding thermal actuator. When the thermal actuator is not excited, the second optical path is optically aligned with the corresponding first optical path. When the thermal actuator is in an activated condition, the first optical paths are respectively turned from the corresponding first optical paths. ~ The present invention is also directed to an optical communication system using the wavelength equalizer of the present invention: System: One embodiment of an optical communication system is a switched wavelength division duplex optical communication system, which includes at least one optical fiber carrying a wavelength Divide the multiplexed signal and the wavelength equalizer of the present invention. Other features of the present invention will be more apparent from the following detailed description of specific embodiments and the accompanying drawings. FIG. 1 is a side view of an anti-reflection switching modulator of a prior art machine.
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圖2爲根據本發明之交換式波長劃分多工化光學通訊系統 之示意説明圖。 … 圖3爲圖2波長等化器之光纖之端視圖。 圖4爲於圖2波長等化器之光纖之另一幅端視圖。 圖5爲根據本發明之波長等化器之第二具體實施例之示意 説明圖。 ~ 圖6爲根據本發明之波長等化器之第三具體實施例之示意 説明圖。 ~ 圖7爲根據本發明之波長等化器之第四具體實施例之示意 説明圖。 ~ 圖8爲根據本發明之微機裝置之頂視圖。 圖9爲根據本發明之萬向接頭之頂視圖。 圖1〇爲圖8之微機裝置帶有鏡呈非共面組態之透視圖。 圖11爲根據本發明之另一微機裝置之透視圖。 圖12爲圖1 1之微機裝置之非共面組態之透視圖。 圖13爲用於根據本發明之萬向接頭微鏡之熱致動器之頂 視圖。 圖14爲圖13之熱致動器之側視圖。 圖15爲圖13之熱致動器之剖面圖。 圖16爲圖13之熱致動器之剖面圖。 圖17爲圖14之熱致動器於致動位置之側視圖。 圖18爲根據本發明包括導波管之另一熱致動器之頂視圖。 圖1 9爲圖1 8之熱致動器之側視圖。 圖20爲根據本發明之波長等化器之第五具體實施例之示 -9- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公爱)FIG. 2 is a schematic explanatory diagram of a switched wavelength division multiplexed optical communication system according to the present invention. … Figure 3 is an end view of the optical fiber of the wavelength equalizer of FIG. 2. FIG. 4 is another end view of the optical fiber in the wavelength equalizer of FIG. 2. Fig. 5 is a schematic explanatory diagram of a second embodiment of the wavelength equalizer according to the present invention. Fig. 6 is a schematic explanatory diagram of a third embodiment of the wavelength equalizer according to the present invention. Fig. 7 is a schematic explanatory diagram of a fourth embodiment of the wavelength equalizer according to the present invention. ~ FIG. 8 is a top view of a microcomputer device according to the present invention. Fig. 9 is a top view of a universal joint according to the present invention. FIG. 10 is a perspective view of the microcomputer device of FIG. 8 with a mirror in a non-coplanar configuration. FIG. 11 is a perspective view of another microcomputer device according to the present invention. FIG. 12 is a perspective view of a non-coplanar configuration of the microcomputer device of FIG. 11. FIG. Fig. 13 is a top view of a thermal actuator for a universal joint micromirror according to the present invention. FIG. 14 is a side view of the thermal actuator of FIG. 13. FIG. 15 is a sectional view of the thermal actuator of FIG. 13. FIG. 16 is a sectional view of the thermal actuator of FIG. 13. FIG. 17 is a side view of the thermal actuator of FIG. 14 in an actuated position. 18 is a top view of another thermal actuator including a waveguide according to the present invention. FIG. 19 is a side view of the thermal actuator of FIG. 18. Figure 20 shows a fifth specific embodiment of the wavelength equalizer according to the present invention. -9- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public love)
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548232 五、發明説明 A7 B7548232 V. Description of invention A7 B7
意説明圖。 本發明係關於一種用於光學通訊系統之波長等化器。雖 然本方法及裝置可用於希望衰減於多工化信號之特定波長 的任何應用用途,但本發明特別適合用於選擇性衰減俨號 俾補償於多工化光纖通訊系統之光徑相依性耗損。如^匕: 本方法及裝置將就叉換式波長劃分多工化光學通訊系統之 應用用途説明,該系統含有多條光徑而各光徑含有一個獨 特的信號耗損程度。 用於此處,「波長等化器」表示可選擇性降低任何波長 信號振幅達任意量而未影響毗鄰波長之裝置。雖然「等化 器」爲業界術語暗示具有相等強度的信號,但等化器無需 讓毗鄰波長的信號強度變相等。舉例言之,於某些應用用 途,等化器可用於維持毗鄰波長間的差異信號強度。 圖2爲根據本發明耦合至波長等化器52之交換式波長劃 分多工化光學通訊系統5 〇之示意説明圖。通訊系統5 〇包含 可承載多工化#號之輸入光纖54。光纖54具有指定傳輸耗 損、耦合耗損、分頻耗損,而可通過或未通過任何數目的 餌攙雜纖維放大器5 6。 輸入光纖5 4係以光學方式耦合至波長劃分解多工器5 8。 解多工器5 8將輸入光纖54承載的多工化光學信號6〇轉成多 個離散波長或頻道7〇。用於此處「離散波長」或「頻道」 表示電磁頻請的一個節段或截片。於目前技術水平用於電 信用途的節段或截片典型大小爲約〇 5毫微米或以上。解多 工器表不一種接收多重波長組成的光束且將光束分離成爲 -10-Intention illustration. The present invention relates to a wavelength equalizer for an optical communication system. Although the method and device can be used for any application where it is desired to attenuate to a specific wavelength of a multiplexed signal, the present invention is particularly suitable for selectively attenuating the signal number 俾 to compensate for the optical path dependence loss of a multiplexed optical fiber communication system. For example, the method and device will explain the application of the switched wavelength division multiplexed optical communication system. The system contains multiple optical paths and each optical path contains a unique degree of signal loss. As used herein, "wavelength equalizer" means a device that can selectively reduce the signal amplitude of any wavelength by any amount without affecting adjacent wavelengths. Although "equalizer" is an industry term that implies signals of equal strength, equalizers do not need to equalize signal strengths at adjacent wavelengths. For example, for some applications, equalizers can be used to maintain differential signal strength between adjacent wavelengths. Fig. 2 is a schematic illustration of a switched wavelength division multiplexed optical communication system 50 coupled to a wavelength equalizer 52 according to the present invention. The communication system 50 includes an input fiber 54 capable of carrying a multiplexed # number. The optical fiber 54 has a specified transmission loss, coupling loss, and frequency division loss, and may or may not pass any number of bait-doped fiber amplifiers 56. The input fiber 5 4 is optically coupled to the wavelength division demultiplexer 5 8. The demultiplexer 58 converts the multiplexed optical signal 60 carried by the input fiber 54 into a plurality of discrete wavelengths or channels 70. "Discrete wavelength" or "channel" is used here to indicate a segment or slice of electromagnetic frequency. Segments or fragments used for telecommunications purposes at the current state of the art typically have a size of about 0.05 nm or more. The demultiplexer means a beam that receives multiple wavelengths and splits the beam into -10-
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線 本紙張尺度適用巾® ® *標準(CNS) A4規格(21GX297公爱) 548232 A7 B7 五、發明説明( ) 離散波長或頻道的裝置。多工器表示一種其功能恰爲相反 方式的裝置。多工器接受多種光學波長且將其會聚成爲一 道光束。被動解多工器係基於棱鏡、繞射光柵、陣列波導 光柵及頻譜遽波器。主動解多工器係基於被動組件與可調 諧偵測器的組合,各個偵測器被調諧至特定頻率。 離散波長7 0各自傳輸通過離散光纖6 2,光纖係位於可與 微機裝置68的對應數目微機鏡66作光學耦合位置。圖2説 明之組態中,實質上整個由光纖6 2發送的光學信號7 〇係反 射偏離微機鏡6 6至對應光纖6 4。微鏡6 6較佳相對於微機裝 置6 8係於共面組態。用於此處「共面組態」表示概略平行 基板表面的組態。如圖3舉例説明,光學信號7 〇實質上反 射至光纖64。反射的光學信號70通過多工器72,於該處離 散波長7 0重組成爲重新組構的多工化信號7 §。 其中一或多個鏡66可相對於微機裝置68旋轉非共面。用 於此處’ Γ非共面」一詞表示相對於基板表面大於〇度至 90度角。說66典型係移動通過一或多個自由度。經由變更 一或多個微鏡66相對於微機裝置68的角度,如此相對於對 應光纖62、64的角度,部分光學信號70由光纖64轉向。 用於此處Γ轉向」一詞表示由光徑重新導向或錯誤導向部 分光學信號結果導致部分或全部衰減。如圖4最明白顯示, 只有部分由非共面鏡66反射的光學信號70係與光纖64作光 學耦合。其餘光學信號70被轉向至光纖64護罩76上的區 74,因而由多工器72上游衰減光學信號7〇。 典型只有某些波長需要衰減。結果部分光學信號7 〇被衰 -11- 本紙張尺度適用中國國家標準(CNS) A4規格(21〇X297公釐) 548232 A7 B7 五、發明説明(9 ) 減’而其它光學信號則否。舉例言之,部分微鏡係於共面 組態,而其它微鏡係處在非共面組態。衰減後的以及未經 衣減的光學· #號7 0混合通過多工咨7 2而形成重新組構的波 長劃分多工化信號7 8。用於此處,「重新組構後的波長劃 分多工化信號」表示由波長等化器送出的多數離散波長形 成的多工化信號。 回頭參照圖2,解多工器58及多工器72可視需要地含有 一系列分束器或耦合裝置,分束器或耦合裝置將小部分離 散波長7 0轉向至偵測器,偵測器測量離散波長的信號強度 (或光功率)。測量得的信號強度傳遞至控制器8 〇。控制器 8 0隨後選擇性控制鏡6 6位置而達成光學信號7 0的預定衰減 程度。 另一具體實施例中,有關輸入或輸出光學信號波長強度 資訊可於解多工器5 8上游及/或多工器7 2下游測量。控制 器8 0回應於偵測得的信號強度而即時調整各別波長的信號 強度。結果本波長等化器52適合用於於交換式波長劃分多 工化光學通訊系統5 〇動態改變離散波長的信號強度。 圖5爲根據本發明之波長等化器1〇〇之第二具體實施例之 示意説明圖。輸入的準値多工化光學信號1〇2被導引至繞射 光柵104。準値多工化光學信號1〇2衝擊繞射光柵1〇4,因而 光之各個波長係以與其波長成比例的角度分散。各個波長 106被導引朝向微機裝置u〇多個離散鏡1〇8。 於圖5所示名目組態,實質上全部波長1〇6皆被反射離鏡 108而直接反射回光柵1〇4,此處波長ι〇6被多工化成爲輸出 -12- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232 A7 ______B7 五、發明説明(1Q ) 光學信號112。波長106實質上係沿相同光徑來去於微鏡1〇8 ° 4¾ 108相對於光柵i〇4的角向關係作小量調整將偏向部分 光束106,且避免偏向部分於光柵ι〇4重組成爲輸出光學信 5虎112。控制器(參考圖2)典型用於調整鏡ι〇8位置。 圖6爲根據本發明之波長等化器ι2〇之第三具體實施例之 不意圖。輸入準値多工化光學信號122撞擊光柵124,光柵 將光t各波長以與其波長成比例的角度分散。各波長126被 導引撞擊微機裝置13〇之鏡128。波長126被反射離鏡128, 被導引至第二光栅132,其將波長ι26組合成爲輸出光信號 134。波長126於反射偏離微鏡128之前及之後行經不同光徑 。再度,鏡128相對於光柵132的角向關係作小量調整將偏 向部分光束126,且防止偏向部分於光栅132重新組合成爲 輸出光信號134。 圖7説明根據本發明之另一波長等化器14〇之第四具體實 施例。棱鏡142將輸入準値多工化光信號144劃分成爲離散 組成波長146。分束器148視需要地位在棱鏡142下游而重新 導向小邪分波長146至控制器150的偵測器151。如前文討論 ’波長146撞擊鏡152,波長146反射至棱鏡154,棱鏡154將 波長146組合成爲輸出信號I%。 分束器158視需要地位在棱鏡154下游。分束器將小部分 輸出光信號156轉向至棱鏡i6〇,棱鏡160將光信號分離成爲 其組成波長。然後波長被導引至控制器丨5〇的偵測器丨5 1, 俾測量於輸出光信號156的各波長強度。控制器150可使用 由收集於分束器148及158的光信號測量得的強度來控制鏡 -13- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 548232 A7 B7 五、發明説明(11 152位置。 用於此處’ 「微機裝置」表示於基板上建構的微米尺寸 機械、光機、電機或光電機裝置。可利用多種製造微機裝 置的技術,例如得自可諾斯(Cr〇n〇s)積體微系統公司(北卡 羅菜那州研咒三角公園)的多使用者MEMS製程(MUMPs)。 組裝程序之一説明於rMUMPs設計手術」修訂5 〇(2〇〇〇年 )得自可諾斯積體微系統公司。 多晶矽表面爲切削適合積體電路(IC)業界已知平面製程 步驟用於製造微電機或微機裝置。多晶矽表面之微切削標 準積木組合製程爲沉積以及微影蝕刻術圖樣化低應力多晶 碎(稱作少石夕),以及保護材料(例如二氧化梦或梦酸鹽玻 璃)交替層。蝕穿保護性層預定位置的通孔提供錨定至基板 的錨定點以及各層多晶矽層間的機械及電互連。裝置的功 能元件係使用一系列沉積及圖樣化製程步驟塗層累積。於 裝置結構完成|,可經由纟用選擇性蝕刻射除保護性材 料而移動釋放,蝕刻劑例如爲實質上不會攻擊多晶矽層的 氫氟酸(HF)。 結果爲一種建構系統其概略係由第一多晶矽層其提供電 互連及/或電壓參考平面,以及額外多層機械多晶矽組成, 多層多晶矽可用於形成功能元件,此等功能元件包括單純 的懸臂樑至複雜的電機系統。微鏡係位於與基板共面位置 。由於整個製程係基於標準1(:製造技術,故可於矽基板上 以批次式製造大量完整組裝的裝置而無需片段總成。 圖8爲適合用於本波長等化器之微機裝置22〇之頂視圖, -14- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232 A7 B7 五、發明説明( 其包括一個帶有萬向接頭的微鏡221以及一或多個熱致動器 252A-252L(合稱爲「252」)。帶有萬向接頭的微鏡221上的 鏡222係形成爲讓表面224具有高度反射性。鏡222係藉多個 扭轉鉸鏈或萬向接頭228A-228D(合稱爲「228」)而固定於 基板226。用於此處,「萬向接頭」表示一種以機械方式搞 合鏡或其它結構至基板表面同時允許相對於該基板表面移 動通過至少二自由度(典型爲投擲與滾動)的微機裝置。 該具體實施例中,鏡222概略爲方形,萬向接頭228位置 沿其四邊。鏡形狀、萬向接頭數目、以及萬向接頭所在位 置可隨帶有萬向接頭之微鏡221的應用用途變更。舉例言之 萬向接頭228可位於帶有萬向接頭之微鏡221角落。本發明 之微鏡221較佳係成形爲允許緊密填裝陣列,例如角形包括 三角形、矩形或有五邊或更多邊、六角形、八角形等。另 外帶有萬向接頭的微鏡22 1也可爲圓形。 如圖9最明白説明,萬向接頭228各自包括一對第一臂230 、232由鏡222懸臂至構件234、236。第二臂23 8、240係由 構件234、236懸臂至錨242。雖然臂232、240及230、23 8於 具體實施例中係概略垂直於鏡222且概略平行,但此種組態 並非必要。臂230、232、238、240可相對於鏡222夾角及/ 或相對於彼此夾角。此外,臂230、232、238、240可爲曲 線形。一個具體實施例中,萬向接頭228將鏡222懸吊於基 板226表面上方。另一具體實施例中,鏡222停靠於基板226 表面上,但由萬向接頭228活動式固定於基板226。 襯墊244可視需要地設置於構件234、236下方俾支持臂 -15- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 裝 訂Line This paper size is suitable for Towel ® ® * Standard (CNS) A4 specification (21GX297 public love) 548232 A7 B7 V. Description of the invention () Device with discrete wavelength or channel. A multiplexer means a device whose function is exactly the opposite. The multiplexer accepts multiple optical wavelengths and converges them into a single beam. Passive demultiplexers are based on prisms, diffraction gratings, arrayed waveguide gratings, and spectral chirpers. The active demultiplexer is based on a combination of passive components and a tunable detector. Each detector is tuned to a specific frequency. The discrete wavelengths 70 are transmitted through the discrete optical fibers 62 respectively, and the optical fibers are located at optical coupling positions with a corresponding number of microcomputer mirrors 66 of the microcomputer device 68. In the configuration illustrated in FIG. 2, substantially the entire optical signal 70 transmitted by the optical fiber 62 is reflected away from the microcomputer mirror 66 to the corresponding optical fiber 64. The micromirror 6 6 is preferably in a coplanar configuration relative to the microcomputer device 6 8. The term “coplanar configuration” used here indicates the configuration of roughly parallel substrate surfaces. As illustrated in FIG. 3, the optical signal 70 is substantially reflected to the optical fiber 64. The reflected optical signal 70 passes through the multiplexer 72, where the scattered wavelength 70 is recombined into a restructured multiplexed signal 7 §. One or more of the mirrors 66 can be rotated non-coplanar with respect to the microcomputer device 68. As used herein, the term 'Γ non-coplanar' means an angle greater than 0 to 90 degrees relative to the surface of the substrate. Say 66 is typically moving through one or more degrees of freedom. By changing the angle of the one or more micro-mirrors 66 relative to the microcomputer device 68 and thus the angles corresponding to the corresponding optical fibers 62, 64, part of the optical signal 70 is turned by the optical fiber 64. The term "steering" is used here to indicate that a portion of or all of the optical signal is attenuated as a result of redirecting or misdirecting a portion of the optical signal. As best shown in Fig. 4, only a portion of the optical signal 70 reflected by the non-coplanar mirror 66 is optically coupled to the optical fiber 64. The remaining optical signals 70 are diverted to the area 74 on the shield 64 of the optical fiber 64, and thus the optical signals 70 are attenuated upstream of the multiplexer 72. Typically, only certain wavelengths require attenuation. As a result, part of the optical signal 7 is attenuated -11- This paper size is in accordance with the Chinese National Standard (CNS) A4 specification (21 × 297 mm) 548232 A7 B7 V. Description of the invention (9) minus ’and other optical signals are not. For example, some micromirrors are in a coplanar configuration, while other micromirrors are in a non-coplanar configuration. The attenuated and undecreased optics ## 7 0 is mixed with the multiplexer 7 2 to form a restructured wavelength division multiplexed signal 7.8. As used herein, "restructured wavelength division multiplexed signal" means a multiplexed signal formed by a plurality of discrete wavelengths sent from a wavelength equalizer. Referring back to FIG. 2, the demultiplexer 58 and the multiplexer 72 may optionally include a series of beam splitters or coupling devices, and the beam splitters or coupling devices turn a small part of the discrete wavelength 70 to the detector, the detector Measure signal strength (or optical power) at discrete wavelengths. The measured signal strength is passed to the controller 80. The controller 80 then selectively controls the position of the mirror 66 to achieve a predetermined degree of attenuation of the optical signal 70. In another specific embodiment, the information about the wavelength intensity of the input or output optical signal may be measured upstream of the demultiplexer 58 and / or downstream of the multiplexer 72. The controller 80 adjusts the signal intensity of each wavelength in real time in response to the detected signal intensity. As a result, the present wavelength equalizer 52 is suitable for use in a switched wavelength division multiplexed optical communication system 50 to dynamically change the signal strength of discrete wavelengths. Fig. 5 is a schematic illustration of a second specific embodiment of the wavelength equalizer 100 according to the present invention. The input quasi-chirped multiplexed optical signal 102 is guided to the diffraction grating 104. The quasi-multiplexed optical signal 102 impacts the diffraction grating 104, and thus each wavelength of light is dispersed at an angle proportional to its wavelength. Each wavelength 106 is directed toward a microcomputer device uo a plurality of discrete mirrors 108. In the name configuration shown in Figure 5, virtually all wavelengths 106 are reflected off the mirror 108 and directly reflected back to the grating 104. Here, the wavelength ι〇6 is multiplexed to output -12. This paper scale applies China National Standard (CNS) A4 specification (210X 297 mm) 548232 A7 ______B7 5. Description of the invention (1Q) Optical signal 112. The wavelength 106 is essentially along the same optical path from the micromirror 108 ° 4¾ 108. The angular relationship of the 108 with respect to the grating i04 is adjusted by a small amount to bias the partial beam 106, and avoid recombining the biased portion to the grating ι04 Output optical letter 5 tiger 112. The controller (refer to FIG. 2) is typically used to adjust the position of the mirror 08. FIG. 6 is a schematic diagram of a third embodiment of the wavelength equalizer ι20 according to the present invention. The input quasi-multiplexed optical signal 122 strikes the grating 124, and the grating disperses each wavelength of light t at an angle proportional to its wavelength. Each wavelength 126 is guided to strike the mirror 128 of the microcomputer device 130. The wavelength 126 is reflected off the mirror 128 and guided to the second grating 132, which combines the wavelength ι26 into an output optical signal 134. The wavelength 126 passes through different optical paths before and after the reflection deviates from the micromirror 128. Again, a small adjustment of the angular relationship of the mirror 128 with respect to the grating 132 will bias the partial beam 126 and prevent the deflected portions from being recombined into the grating 132 into an output optical signal 134. Fig. 7 illustrates a fourth specific embodiment of another wavelength equalizer 14o according to the present invention. The prism 142 divides the input pseudo-multiplexed optical signal 144 into discrete component wavelengths 146. The beam splitter 148 is positioned downstream of the prism 142 and redirects the small sub-wavelength 146 to the detector 151 of the controller 150 as needed. As discussed earlier, the wavelength 146 hits the mirror 152, and the wavelength 146 reflects to the prism 154. The prism 154 combines the wavelength 146 into an output signal I%. The beam splitter 158 is positioned downstream of the prism 154 as necessary. The beam splitter diverts a small portion of the output optical signal 156 to the prism i60, and the prism 160 separates the optical signal into its constituent wavelength. The wavelength is then guided to the detector 501 of the controller 501, and the intensity of each wavelength of the output optical signal 156 is measured. The controller 150 can use the intensity measured by the optical signals collected from the beam splitters 148 and 158 to control the mirror-13- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 548232 A7 B7 V. Invention Description (11 152 positions. Used here '"microcomputer device" means a micron-sized machine, opto-mechanical, motor, or opto-electric device constructed on a substrate. A variety of techniques for making microcomputer devices can be utilized, such as available from Konos ( Cronos) Multi-user MEMS processes (MUMPs) by Integrated Microsystems Inc. (Scientific Research Triangle Park, North Carolina). One of the assembly procedures is described in rMUMPs Design Surgery, "Rev. 5 (200). (Years) available from Konos Microsystems. Polycrystalline silicon surface is suitable for cutting integrated circuit (IC) industry-known planar process steps for manufacturing micromotors or microcomputer devices. The standard microblock cutting process for polycrystalline silicon surfaces is deposition And lithographic patterning of low-stress polycrystalline debris (called Shao Xixi), and alternate layers of protective materials (such as dream dioxide or dream glass). Provides anchor points anchored to the substrate and mechanical and electrical interconnections between the layers of polycrystalline silicon. The functional elements of the device are deposited using a series of deposition and patterning process steps. Completed in the device structure | The protective material is ejected and moved away, and the etchant is, for example, hydrofluoric acid (HF) which does not substantially attack the polycrystalline silicon layer. The result is a construction system whose outline is provided by the first polycrystalline silicon layer which provides electrical interconnection and / Or voltage reference planes, as well as additional layers of mechanical polysilicon, which can be used to form functional elements, ranging from simple cantilever beams to complex motor systems. The micromirror system is located coplanar with the substrate. Since the entire process system is based on Standard 1 (: manufacturing technology, so a large number of fully assembled devices can be manufactured in batches on a silicon substrate without a fragment assembly. Figure 8 is a top view of a microcomputer device 22o suitable for this wavelength equalizer,- 14- This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 548232 A7 B7 V. Description of the invention (It includes a The micromirror 221 of the joint and one or more thermal actuators 252A-252L (collectively referred to as "252"). The mirror 222 on the micromirror 221 with the universal joint is formed to make the surface 224 highly reflective. The mirror 222 is fixed to the base plate 226 by a plurality of torsional hinges or universal joints 228A-228D (collectively referred to as "228"). As used herein, the "universal joint" means a mechanically engaged mirror or other structure To the substrate surface, at the same time, it is allowed to move through the microcomputer device with at least two degrees of freedom (typically throwing and rolling) relative to the substrate surface. In this specific embodiment, the mirror 222 is roughly square, and the universal joint 228 is positioned along its four sides. The shape of the mirror, the number of universal joints, and the position of the universal joints can be changed according to the application of the micromirror 221 with the universal joint. For example, the universal joint 228 may be located at the corner of the micromirror 221 with the universal joint. The micromirror 221 of the present invention is preferably shaped to allow a tight packing array, such as a triangle including a triangle, a rectangle or having five or more sides, a hexagon, an octagon, and the like. The micromirror 22 1 with a universal joint may be circular. As best shown in FIG. 9, the universal joints 228 each include a pair of first arms 230, 232 cantilevered from a mirror 222 to members 234, 236. The second arms 23 8, 240 are cantilevered from the members 234, 236 to the anchor 242. Although the arms 232, 240 and 230, 238 are roughly perpendicular to the mirror 222 and roughly parallel in the specific embodiment, this configuration is not necessary. The arms 230, 232, 238, 240 may be angled relative to the mirror 222 and / or angled relative to each other. Further, the arms 230, 232, 238, 240 may be curved. In a specific embodiment, the universal joint 228 suspends the mirror 222 above the surface of the base plate 226. In another specific embodiment, the mirror 222 is docked on the surface of the substrate 226, but is movably fixed to the substrate 226 by a universal joint 228. The spacer 244 can be set under the members 234 and 236 as needed. Support arm -15- This paper size applies to China National Standard (CNS) A4 (210X297 mm) binding
線 548232 A7 B7 五 、發明説明( 230、232、23 8、240 ° 襯墊 244也可作爲臂 230、232、238 、240及/或鏡222偏向的極限或末端止塊。操作期間萬向接 頭228的阻力及勁度係經由增減臂數目、長度及截面積以及 多種其它因數而予修改。舉例言之錨242可移動更接近構件 234、236。另一具體實施例中可刪除臂232、240。Line 548232 A7 B7 V. Description of the invention (230, 232, 23 8, 240 ° The gasket 244 can also be used as the limit or end stop of the arm 230, 232, 238, 240 and / or mirror 222. Universal joint during operation The resistance and stiffness of 228 are modified by increasing or decreasing the number, length, and cross-sectional area of the arm and various other factors. For example, the anchor 242 can be moved closer to the members 234, 236. In another embodiment, the arms 232, 240.
回頭參照圖8之具體實施例,多個支持件或承力支架246 由鏡222的周邊248伸出。一個具體實施例中,支持件246包 括襯墊250,當鏡222位於中性位置時,襯墊250適合用於接 合基板226表面。另一具體實施例中,襯誓250係位於基板 226表面上。另一具體實施例中,襯墊250也作爲鏡222的移 動極限或末端止塊。另一具體實施例中,襯墊250於鏡222 位在中性位置時,可維持鏡222相對於基板226呈固定的可 重複的關係。 用於此處,「中性位置」一詞表示當熱致動器係位在未 激活位置時鏡相對於基板表面的關係。一個具體實施例中 ,承力支架246係停靠在中性位置襯墊250上。中性位置也 可爲共面組態或非共面組態。Referring back to the specific embodiment of FIG. 8, a plurality of supporting members or bearing brackets 246 protrude from the periphery 248 of the mirror 222. In a specific embodiment, the support member 246 includes a spacer 250, and the spacer 250 is suitable for joining the surface of the substrate 226 when the mirror 222 is in a neutral position. In another embodiment, the substrate 250 is located on the surface of the substrate 226. In another embodiment, the spacer 250 also serves as the movement limit or end stop of the mirror 222. In another specific embodiment, when the spacer 250 is in the neutral position of the mirror 222, the fixed and repeatable relationship of the mirror 222 with respect to the substrate 226 can be maintained. As used herein, the term "neutral position" means the relationship of the mirror to the surface of the substrate when the thermal actuator is in an inactive position. In a specific embodiment, the bearing bracket 246 is docked on the neutral position cushion 250. The neutral position can also be coplanar or non-coplanar.
多個熱致動器252位置環繞鏡222周邊。熱致動器252的數 目、位置及組態可隨應用用途變化。於該具體實施例中, 熱致動器252可位於方形鏡222的角隅。 熱致動器252的游離端253係位在鏡222角隅的支持件257 下方,但未附著於支持件257。鏡222係藉與熱致動器252獨 立無關的萬向接頭228而附著於基板226。當任何熱致動器 252被激活時,一或多個游離端253接合毗鄰支持件257,且 -16- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232 A7 B7 五 、發明説明(14 舉升鏡222離開平面(參考圖10)。當熱致動器252係於非激 活位置時,鏡222返回中性位置(參考圖8)。當致動器252係 於未激活位置時,由於萬向接頭的扭力,鏡222實質返回中 性位置。一個具體實施例中,鏡222可藉靜電力輔助返回中 性位置。A plurality of thermal actuators 252 are positioned around the periphery of the mirror 222. The number, location, and configuration of the thermal actuators 252 can vary depending on the application. In this embodiment, the thermal actuator 252 may be located at a corner of the square mirror 222. The free end 253 of the thermal actuator 252 is located under the support member 257 of the corner of the mirror 222, but is not attached to the support member 257. The mirror 222 is attached to the substrate 226 by a universal joint 228 independent of the thermal actuator 252. When any thermal actuator 252 is activated, one or more free ends 253 engage adjacent support members 257, and -16- this paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 mm) 548232 A7 B7 5 Explanation of the invention (14 Lifting mirror 222 leaves the plane (refer to FIG. 10). When the thermal actuator 252 is in the inactive position, the mirror 222 returns to the neutral position (refer to FIG. 8). When the actuator 252 is in the non-active position When the position is activated, due to the torsion of the universal joint, the mirror 222 substantially returns to the neutral position. In a specific embodiment, the mirror 222 can be returned to the neutral position by electrostatic force.
各個熱致動器252包括一或多個錨254、256。電軌跡25 8 連接錨254至接地軌跡260。電軌跡262連接錨256至電流源 2 6 4。如圖1 0舉例説明,經由選擇性施加電流至部分熱致 動器252,鏡222可以投擲及/或滾動或其組合而移動離開平 面。當熱致動器252A、252B、252C移動至非共面組態時, 游離端253 A-253C接合支持件257俾升高鏡222。Each thermal actuator 252 includes one or more anchors 254, 256. The electrical track 25 8 connects the anchor 254 to the ground track 260. The electrical track 262 connects the anchor 256 to the current source 2 6 4. As exemplified in FIG. 10, the mirror 222 may be moved and / or rolled away from the plane by selectively applying a current to a portion of the thermal actuator 252. When the thermal actuators 252A, 252B, 252C are moved to a non-coplanar configuration, the free end 253 A-253C engages the support member 257 and raises the mirror 222.
若干具體實施例中,游離端253A-253C係於激活位置移動 通過弧,因此游離端253相對於支持件257有若干橫向位移 (平行基板表面方向)。結果當鏡222被舉高時,游離端253 可沿支持件257(或鏡222)下表面滑動。部分或全部萬向接 頭228變形俾補償鏡222的位移。由於游離端253A-253C並未 附著於支持件257,故鏡222可以較少力以及較高準確度移 動。 圖11爲根據本發明之微機裝置290之第二具體實施例之透 視圖。一對熱致動器300、302以機械方式耦合至形成於基 板306上的微鏡304。鏡304係藉一或多個形成於第一端310 的彎曲部分或鉸鏈308而附著於基板306。用於熱致動器上 的彎曲部分適合用於此項目的。否則鏡304未附著於基板。 鉸鏈308對微鏡提供至少一自由度。 -17- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232 A7 _______B7 五、發明説明(15 ) 叙鍵308名目上係平坦位於基板3〇6表面上,但可旋轉偏 離平面。可使用具有不同大小、形狀以及基板上不同位置 的多種鉸接·板。鉸鏈308可爲扭轉鉸鏈或彎曲部分其提供回 復力將鏡移動回共面位置(參考圖11)。另外鏡304可藉重力 、形成於基板3 06上的微機彈簧構造、靜電力或多種其它機 制而恢復共面組態。此種鉸接板的形成揭示於pister等人, 「微機製鉸鏈」,第3 3期感應器及致動器a,249-256頁, 1992年以及美國專利第5,923,798及5912〇94號。 軸312附接於鏡3〇4接近第一端31〇。軸312可藉多個錨314 支持而允許軸3 12在某個極限以内轉動。一或多根翻轉槓桿 316定錨於軸312。熱致動器3〇〇、302的游離端318、320分 別位在翻轉槓桿316下方。游離端318、320之位置較佳接近 軸312’因而獲得最大機械優勢。 圖12爲圖11之熱致動器30〇、3〇2於激活組態之透視圖。 當電流施加至熱致動器300、302時,前文討論之舉升力升 高翻轉槓桿316,翻轉槓桿316又將微鏡304升高至偏離平面 位置。當電流被去除時,微鏡3〇4返回實質共面位置,如圖 11所示。雖然圖11及12説明帶有二熱致動器之鏡,但也可 使用單一熱致動器或多重熱致動器。 本發明之微機裝置可利用多個致動器來定位鏡,包括: 利用靜電、壓電、熱及磁力致動器。例如美國專利第 6,028,689號(Michalicek等人)揭示藉靜電電位操縱的多重移 動微鏡。一個具體實施例中鏡係藉熱致動器定位。微米大 小的熱致動器可重複快速移動微鏡偏離平面俾準確地重複 -18- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 548232 A7 B7 五、發明説明( 駕馭光束。 圖13至17説明適合用於本發明之熱致動器450之具體實 施例。用於此處「熱致動器」表示可重複移動光學裝置, 例如本微鏡介於共面位置以及非共面位置間的熱激活微機 裝置。該具體實施例中,熱致動器450設計成可提供經過控 制的彎曲。用於此處「經過控制的彎曲」表示主要出現在 離散位置而非沿熱致動器樑分布的彎曲。 熱致動器450係於基板452表面共面取向,基板452典型包 含帶有一層氮化矽456沉積其上的矽晶圓454。致動器450包 括位於氮化矽層456上的第一多晶矽層460。如圖1 6最明白 顯示,第一層460包含凸塊,凸塊形成冷樑484的加強件485 。第二多晶矽層462係配置成有第一及第二錨464、466以及 一對樑468、470以懸臂方式由錨464、466設置。 圖13所示具體實施例中,錨464、466包括形成於基板452 上的電接點476、478,電接點適合承載電流至樑468、470 。軌跡476、478典型係延伸至基板452邊緣。另外,多種電 接觸裝置及/或封裝方法例如球柵陣列(BGA)、陸栅陣列 (LGA)、塑膠引線晶片載具(PLCC)、針柵陣列(PGA)、緣 卡、小輪廓積體電路(SOIC)、雙重線上封裝體(dip)、四元 組平坦封裝體(QFP)、無引線晶片載具(LCC)、晶片大小封 裝體(CSP)可用於傳輸電流至樑468、470。 樑468、470係藉構件472以電力及機械方式耦合於各別游 離端471、473而形成電路。另一具體實施例中,樑468、 470係電輕合至接地標記477。接地標記477電耦合樑468、 -19- 裝 訂In some specific embodiments, the free ends 253A-253C move through the arc at the active position, so the free ends 253 have a number of lateral displacements (parallel to the substrate surface direction) relative to the support 257. As a result, when the mirror 222 is raised, the free end 253 can slide along the lower surface of the support member 257 (or the mirror 222). Part or all of the universal joint 228 is deformed, and the displacement of the mirror 222 is compensated. Since the free ends 253A-253C are not attached to the support member 257, the mirror 222 can move with less force and higher accuracy. Fig. 11 is a perspective view of a second embodiment of a microcomputer device 290 according to the present invention. A pair of thermal actuators 300, 302 are mechanically coupled to a micromirror 304 formed on a substrate 306. The mirror 304 is attached to the substrate 306 by one or more curved portions or hinges 308 formed on the first end 310. The curved part used on the thermal actuator is suitable for this project. Otherwise, the mirror 304 is not attached to the substrate. The hinge 308 provides at least one degree of freedom to the micromirror. -17- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X 297 mm) 548232 A7 _______B7 V. Description of the invention (15) The 308 keys of the Syrian keys are flat on the surface of the substrate 306, but can be rotated away from flat. A variety of hinges and plates with different sizes, shapes, and positions on the substrate can be used. The hinge 308 may provide a return force to the twisted hinge or curved portion to move the mirror back to a coplanar position (refer to FIG. 11). In addition, the mirror 304 can restore the coplanar configuration by gravity, a microcomputer spring structure formed on the substrate 306, electrostatic force, or a variety of other mechanisms. The formation of such a hinge plate is disclosed in Pister et al., "Micromechanical Hinge", No. 33, Sensors and Actuators a, pp. 249-256, 1992, and US Patent Nos. 5,923,798 and 5,912,094. The shaft 312 is attached to the mirror 304 near the first end 31. The shaft 312 may be supported by multiple anchors 314 to allow the shaft 3 12 to rotate within a certain limit. One or more flip levers 316 are anchored to the shaft 312. The free ends 318, 320 of the thermal actuators 300, 302 are located below the flip lever 316, respectively. The positions of the free ends 318, 320 are preferably close to the shaft 312 'so as to obtain the greatest mechanical advantage. FIG. 12 is a perspective view of the thermal actuators 30 and 30 of FIG. 11 in an activated configuration. When a current is applied to the thermal actuators 300, 302, the lifting force discussed above raises the flip lever 316, which in turn raises the micromirror 304 to an off-plane position. When the current is removed, the micromirror 30 returns to a substantially coplanar position, as shown in FIG. 11. Although Figures 11 and 12 illustrate a mirror with two thermal actuators, a single thermal actuator or multiple thermal actuators may be used. The microcomputer device of the present invention can use multiple actuators to position the mirror, including: using electrostatic, piezoelectric, thermal, and magnetic actuators. For example, U.S. Patent No. 6,028,689 (Michalicek et al.) Discloses multiple moving micromirrors manipulated by electrostatic potentials. In a specific embodiment, the mirror is positioned by a thermal actuator. Micron-sized thermal actuator can repeat the rapid movement of the micro-mirror off the plane, repeat exactly -18- This paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 mm) 548232 A7 B7 V. Description of the invention (Controlling the beam 13 to 17 illustrate a specific embodiment of a thermal actuator 450 suitable for use in the present invention. The term "thermal actuator" as used herein means a removable optical device, such as the micromirror in a coplanar position and a non- Thermally-activated microcomputer device between coplanar locations. In this specific embodiment, the thermal actuator 450 is designed to provide controlled bending. "Controlled bending" as used herein means that it occurs mainly in discrete locations rather than along the The bending of the actuator beam distribution. The thermal actuator 450 is coplanarly oriented on the surface of a substrate 452, which typically includes a silicon wafer 454 with a layer of silicon nitride 456 deposited thereon. The actuator 450 includes a nitride The first polycrystalline silicon layer 460 on the silicon layer 456. As shown most clearly in FIG. 16, the first layer 460 includes bumps, which form a reinforcement 485 of the cold beam 484. The second polycrystalline silicon layer 462 is configured as Have first and second anchors 464, 466 and A pair of beams 468, 470 are cantilevered by anchors 464, 466. In the specific embodiment shown in FIG. 13, the anchors 464, 466 include electrical contacts 476, 478 formed on the substrate 452, and the electrical contacts are suitable for carrying current to Beams 468, 470. The tracks 476, 478 typically extend to the edge of the substrate 452. In addition, various electrical contact devices and / or packaging methods such as ball grid array (BGA), land grid array (LGA), plastic lead chip carrier (PLCC) ), Pin grid array (PGA), edge card, small outline integrated circuit (SOIC), dual online package (dip), quad flat package (QFP), leadless chip carrier (LCC), chip size The package (CSP) can be used to transmit current to the beams 468, 470. The beams 468, 470 are electrically and mechanically coupled to the respective free ends 471, 473 to form a circuit. In another specific embodiment, the beam 468 , 470 series electric light closing to the ground mark 477. The ground mark 477 is electrically coupled to the beam 468, -19- binding
線 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 548232 A7 B7 五 、發明説明( 470至基板452的接點479係呈未經激活組態(參考圖14)以及 經激活組態(參考圖17)。接地標記477可爲撓性件或彈簧件 ,接地接腳適合與接點479維持接觸。接地接腳可用於此處 揭示之任一具體實施例。The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 548232 A7 B7 V. Description of the invention (The contact 479 from 470 to the substrate 452 is in an unactivated configuration (refer to Figure 14) and the activated group (Refer to FIG. 17). The grounding mark 477 may be a flexible or spring piece, and the grounding pin is suitable for maintaining contact with the contact 479. The grounding pin may be used in any of the specific embodiments disclosed herein.
樑468、470係與第一層460實體分開,故構件472係位於 基板452上方。一或多個凹窩474可視需要形成於構件472俾 支持樑468、470於基板452上方。另一具體實施例中,凹窩 或凸塊474可形成於基板452上。於圖14所示,未經激活組 態,樑468、470概略平行基板452表面。用於此處「未經激 活組態」表示實質並無電流流經樑468、構件472及樑470形 成的電路。The beams 468, 470 are physically separated from the first layer 460, so the member 472 is located above the base plate 452. One or more dimples 474 may be formed on the member 472 俾 support beams 468, 470 above the base plate 452 as needed. In another embodiment, the dimples or bumps 474 may be formed on the substrate 452. As shown in Fig. 14, the beams 468, 470 are substantially parallel to the surface of the substrate 452 in an unactivated configuration. The "unactivated configuration" used herein means that there is substantially no current flowing through the circuit formed by the beam 468, the member 472, and the beam 470.
第三層多晶矽480配置有錨482,錨482附著於基板452的 錨464、466附近。第三層480形成上樑484由錨482懸臂,錨 482有個游離端483係機械式耦合至樑468、470上方的構件 472。若干具體實施例中,加強件485係形成於上樑484沿其 長度至少一部分;以及彎度部分4 8 7係視需要形成於上樑 484的錨482附近。一個具體實施例中,金屬層視需要施加 於上樑484。 用於此處,「加強件」表示一或多個可增加對彎曲抗性 的脊、凸塊、溝或其它結構。加強件典型係於MUMPs製程 過程中形成,故與上樑484—體成形。所示具體實施例中, 加強件485爲沿部分上樑484延伸的彎曲脊(參考圖1 6 ),但 也可爲矩形、方形、三角形或多種其它形狀。此外加強件 485可位於上樑484中心或沿其邊緣。也可使用多個加強件。 -20- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 548232 五 A7 B7、發明説明(18 ) 用於此處「彎曲部分」表示又窄又細或脆弱的材料、其 它材料或其它結構或材料變化的凹部、凹陷、孔、開槽、 切除部其可於特定位置提供經過控制的彎度。其它適合用 作爲彎曲部分的材料包括多晶矽、金屬或聚合材料。如圖 13及15最明白説明,彎曲部分487爲凹部489。凹部489包 含上樑484的最脆弱區段,如此於熱致動器450致動期間該 位置最可能彎曲。 上樑4 8 4剛性相對於彎曲部分487的剛性決定熱致動器450 經過控制的彎曲幅度(位置及方向)至極大程度。一具體實 施例中,加強件485組合彎曲部分487使用。另一具體實施 例中,加強件485係沿部分上樑484延伸但未使用彎曲部分 。不含加強件485之上樑484部分爲可控制彎度的位置。又 另一具體實施例中,彎曲部分487形成於不含加強件485的 樑484,故彎曲部分487爲具有控制彎度位置。熱致動器450 也可不含加強件485或彎曲部分487使用。 通孔488形成於構件472及/或游離端483以機械方式耦合 上樑484游離端483至構件472。其它結構可用於以機械方式 耦合上樑484之構件472。上樑484於未經激活组態概略平行 於基板452表面。 圖17爲圖13-16之熱致動器450於非共面或經激活組態的 側視剖面圖。「激活組態」表示施加電流至一或多樑。所 示具體實施例中,電流係施用至樑468、構件472及樑470形 成的電路(參考圖I3)。樑468、470爲「熱臂」,而樑484爲 冷臂。用於此處「熱臂」或「多根熱臂」表示當施加電壓 裝 訂The third layer of polycrystalline silicon 480 is provided with anchors 482 which are attached to the anchors 464 and 466 of the substrate 452. The third layer 480 forms an upper beam 484 cantilevered by an anchor 482. The anchor 482 has a free end 483 which is mechanically coupled to a member 472 above the beams 468,470. In several specific embodiments, the reinforcing member 485 is formed at least a part of the length of the upper beam 484; and the curved portion 4 7 7 is formed near the anchor 482 of the upper beam 484 if necessary. In a specific embodiment, a metal layer is applied to the upper beam 484 as needed. As used herein, "reinforcement" means one or more ridges, bumps, grooves, or other structures that increase resistance to bending. Reinforcement is typically formed during the MUMPs process, so it is integrally formed with the upper beam 484. In the illustrated embodiment, the reinforcing member 485 is a curved ridge (refer to FIG. 16) extending along a part of the upper beam 484, but may be rectangular, square, triangular, or various other shapes. In addition, the stiffener 485 may be located at the center of the upper beam 484 or along its edge. Multiple reinforcements can also be used. -20- The size of this paper applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) 548232 Five A7 B7. Description of the invention (18) The "curved part" used here means narrow, thin or fragile materials, Recesses, depressions, holes, slots, cutouts of other materials or other structures or material changes that can provide controlled camber at specific locations. Other materials suitable for use as curved parts include polycrystalline silicon, metal or polymeric materials. As best shown in Figures 13 and 15, the curved portion 487 is a recessed portion 489. The recess 489 contains the most vulnerable section of the upper beam 484, so that this position is most likely to bend during actuation of the thermal actuator 450. The rigidity of the upper beam 4 8 4 relative to the rigidity of the bent portion 487 determines the controlled bending amplitude (position and direction) of the thermal actuator 450 to a great extent. In a specific embodiment, the reinforcing member 485 is used in combination with the curved portion 487. In another embodiment, the reinforcing member 485 extends along a portion of the upper beam 484 without using a curved portion. The portion of the upper beam 484 excluding the reinforcing member 485 is a position where the camber can be controlled. In yet another embodiment, the bent portion 487 is formed on the beam 484 without the reinforcing member 485, so the bent portion 487 has a controlled camber position. The thermal actuator 450 may also be used without the reinforcement 485 or the bent portion 487. A through hole 488 is formed in the member 472 and / or the free end 483 to mechanically couple the free end 483 of the upper beam 484 to the member 472. Other structures may be used to mechanically couple the member 472 of the upper beam 484. The upper beam 484 is substantially parallel to the surface of the base plate 452 in an unactivated configuration. FIG. 17 is a side cross-sectional view of the thermal actuator 450 of FIGS. 13-16 in a non-coplanar or activated configuration. "Active configuration" means the application of current to one or more beams. In the illustrated embodiment, a current is applied to a circuit formed by the beam 468, the member 472, and the beam 470 (refer to FIG. I3). Beams 468, 470 are "hot arms" and beams 484 are cold arms. Used here "hot arm" or "multiple hot arms" means when the voltage is applied
線 -21 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 548232 五 A7 B7 、發明説明(u ) 時,具有比冷臂更高電流密度的樑或構件。「冷臂」或「 多根冷臂」表示施加電壓時,具有比熱臂更低電流密度的 樑或構件。若干具體實施例中,冷臂具有電流密度爲零。 結果熱臂具有比冷臂更大的熱膨脹。 電流加熱熱臂468、470,讓熱臂於方向490的長度延長。 樑468、470的膨脹讓熱致動器450游離端471、473於向上弧 492移動,產生舉升力494及位移495。但冷臂484係固定於 錨482且電隔離,因此電流完全或實質完全通過由熱臂468 、470及構件472形成的電路。 由於冷臂484與熱臂468、470間的高度差異,力矩施加於 冷臂484的錨482附近。冷臂484於彎曲部分487附近彎曲, 結果導致接近游離端483的位移比不含彎曲部分487位移更 大。熱臂468、470也容易彎曲,對冷臂484的移動492極少 產生阻力。加強件485對抗沿冷臂484的彎曲,當負荷置於 游離端483時,沿冷臂484常發生接近構件472位置彎曲。所 示具體實施例中,位移495爲0.5微米至4微米。當電流結 束時,熱致動器450回到其原先未經激活的組態,如圖1 4 所示。 另一具體實施例中,錨482及冷臂484電耦合至構件472。 至少部分流經熱臂468、470的電流係沿冷臂484流至錨482 。也可能全部流經熱臂468、470的電流經由冷臂484而由熱 致動器450流出。冷臂484的材料及/或幾何適合用於具有比 熱臂468、470更低的電流密度,即使施加相等電壓電流密 度也比熱臂更低。一個具體實施例中,冷臂484係由一種具 -22- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)Line -21-This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) 548232 Five A7 B7, In the invention description (u), beams or members with higher current density than cold arms. A "cold arm" or "multiple cold arms" means a beam or member that has a lower current density than a hot arm when a voltage is applied. In some embodiments, the cold arm has a zero current density. As a result, the hot arm has greater thermal expansion than the cold arm. The current heats the hot arms 468, 470, extending the length of the hot arms in the direction 490. The expansion of the beams 468, 470 causes the free ends 471, 473 of the thermal actuator 450 to move in an upward arc 492, generating a lifting force 494 and a displacement 495. However, the cold arm 484 is fixed to the anchor 482 and is electrically isolated, so the current is completely or substantially completely passed through the circuit formed by the hot arms 468 and 470 and the member 472. Due to the height difference between the cold arm 484 and the hot arms 468, 470, a moment is applied near the anchor 482 of the cold arm 484. The cold arm 484 is bent near the bent portion 487, and as a result, the displacement near the free end 483 is larger than the displacement without the bent portion 487. The hot arms 468 and 470 are also easily bent, and there is little resistance to the movement 492 of the cold arms 484. The reinforcing member 485 resists bending along the cold arm 484. When the load is placed at the free end 483, bending along the cold arm 484 near the member 472 often occurs. In the illustrated embodiment, the displacement 495 is from 0.5 micrometers to 4 micrometers. When the current is over, the thermal actuator 450 returns to its previously unactivated configuration, as shown in Figure 14. In another embodiment, the anchor 482 and the cold arm 484 are electrically coupled to the member 472. The current flowing at least partially through the hot arms 468, 470 flows along the cold arms 484 to the anchor 482. It is also possible that all of the current flowing through the hot arms 468, 470 flows out of the thermal actuator 450 through the cold arms 484. The material and / or geometry of the cold arm 484 is suitable for having a lower current density than the hot arms 468, 470, and lower current density than the hot arms even when the same voltage is applied. In a specific embodiment, the cold arm 484 is made of a paper with a size of -22-. This paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm).
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548232 五 A7 B7 、發明説明(% ) 有線性熱膨脹係數比熱臂468、470的線性熱膨脹係數更小 的材料製成。又另一具體實施例中,冷臂484經由具有較大 截面積而提供較低電阻係數。另一具體實施例中設置導電 層於冷臂484上。適當導電材料包括金屬如鋁、銅、鎢、金 或銀、半導體以及攙雜有機導電性聚合物例如聚乙炔、聚 苯胺、聚吡咯、聚嘍吩、聚EDOT及其衍生物或其組合。結 果熱臂468、470的淨膨脹係大於冷臂484的淨膨脹。 又另一具體實施例中,全部或部分流經熱臂468、470的 電流流經接地標記477至基板452的接點479。當熱致動器 450如圖1 7所示,由未經激活位置移動至激活位置時,接 地標記477可維持電接觸及實體接觸接點479。 另一熱致動器揭示於共同讓予的美國專利申請案第 09/659,572號,名稱「直接動作垂直熱致動器」,申請曰 2000年9月1 2日;美國專利申請案第09/659,798號,名稱Γ 帶有經控制的彎度之直接作用垂直熱致動器」,申請曰 2000年9月12日;以及美國專利申請案第09/659,282號,名 稱「水平與垂直組合式熱致動器」,申請曰2000年9月12 曰。 圖18及19舉例説明適合用於本發明之波長等化器之另一 熱致動器500。熱致動器500概略舉例説明於圖1 3 - 1 7,包 括導波管502附著於冷臂504。導波管502形成爲製造過程的 一邵分,或添加作爲分開組件。導波管5 0 2典型爲光纖。由 於導波管極少或無熱膨脹,故導波管502可有效定位於冷臂 504上。冷臂504較佳與熱臂506、508電隔離。 -23- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)548232 five A7 B7, the description of the invention (%) is made of a material with a linear thermal expansion coefficient smaller than that of the thermal arms 468, 470. In yet another embodiment, the cold arm 484 provides a lower resistivity by having a larger cross-sectional area. In another embodiment, a conductive layer is disposed on the cold arm 484. Suitable conductive materials include metals such as aluminum, copper, tungsten, gold or silver, semiconductors, and doped organic conductive polymers such as polyacetylene, polyaniline, polypyrrole, polyfluorene, polyEDOT, and derivatives or combinations thereof. As a result, the net expansion of the hot arms 468, 470 is greater than the net expansion of the cold arms 484. In yet another embodiment, all or part of the current flowing through the hot arms 468, 470 flows through the ground mark 477 to the contact 479 of the substrate 452. When the thermal actuator 450 is moved from an unactivated position to an activated position as shown in FIG. 17, the ground mark 477 can maintain electrical contact and physical contact 479. Another thermal actuator is disclosed in commonly assigned U.S. Patent Application No. 09 / 659,572, entitled "Direct Action Vertical Thermal Actuator", application dated September 12, 2000; U.S. Patent Application No. 09 / No. 659,798, name Γ Direct-acting vertical thermal actuator with controlled camber ", application dated September 12, 2000; and U.S. Patent Application No. 09 / 659,282, name" Combined Horizontal and Vertical Thermal Actuator ", application date is September 12, 2000. 18 and 19 illustrate another thermal actuator 500 suitable for use with the wavelength equalizer of the present invention. The thermal actuator 500 is schematically illustrated in FIGS. 1 to 17 and includes a waveguide 502 attached to a cold arm 504. The waveguide 502 is formed as a part of the manufacturing process or added as a separate component. The waveguide 50 2 is typically an optical fiber. Since the waveguide has little or no thermal expansion, the waveguide 502 can be effectively positioned on the cold arm 504. The cold arm 504 is preferably electrically isolated from the hot arms 506, 508. -23- This paper size applies to China National Standard (CNS) A4 (210X297 mm)
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548232 五 A7 B7 、發明説明(21 ) 如圖19最明白顯示,當熱致動器500係於未激發組態或共 面組態時,導波管502係設置成可光學耦合鄰近導波管5 10 (參考圖3)。於經過激活或非共面組態,導波管502可由毗 鄰導波管510轉向(參考圖4)。經由變更施加於熱致動器500 的電流,離散波長信號512可視需要被衰減。 圖20説明利用概略如圖1 8及19所示之熱致動器之另一波 長等化器520之第五具體實施例。輸入光纖522承載多工化 信號526。輸入光纖522係光學耦合至波長劃分解多工器524 。解多工器524將輸入光纖522承載的多工化光信號526轉成 多個離散波長或頻道528。離散波長528各自係經由離散光 纖530傳輸,離散光纖各自係架設於熱致動器532上。 當熱致動器532係於圖1 9所示名目組態上,實質整個光信 號528係由光纖530傳輸至對應光纖534。於名目組態,熱致 動器532較佳係於共面且未經激活的組態。光纖534耦合至 多工器536,多工器536將離散波長528組合成爲輸出信號 538 〇 電流可施加於一或多部熱致動器532,因此光纖530及534 未排齊,結果導致信號528的部分或完全衰減(參考圖4 )。 一個具體實施例中,控制器540監視光纖530、534的上游及 /或下游信號強度,以及控制熱致動器532位置俾等化信號 強度。 雖然此處已經顯示及説明本發明之特定具體實施例,但 需了解此等具體實施例僅供舉例説明於本發明原理之應用 設計上的多項可能的特定配置。熟諳技藝人士未悖離本發 -24- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 裝 訂548232 Five A7 B7, description of the invention (21) As shown most clearly in Figure 19, when the thermal actuator 500 is in an unexcited configuration or a coplanar configuration, the waveguide 502 is set to be optically coupled to the adjacent waveguide. 5 10 (refer to Figure 3). Upon activation or non-coplanar configuration, the waveguide 502 can be steered by the adjacent waveguide 510 (refer to Figure 4). By changing the current applied to the thermal actuator 500, the discrete wavelength signal 512 can be attenuated as necessary. Fig. 20 illustrates a fifth specific embodiment of another wavelength equalizer 520 using the thermal actuator shown schematically in Figs. The input fiber 522 carries a multiplexed signal 526. The input fiber 522 is optically coupled to a wavelength division demultiplexer 524. The demultiplexer 524 converts the multiplexed optical signal 526 carried by the input optical fiber 522 into a plurality of discrete wavelengths or channels 528. The discrete wavelengths 528 are each transmitted via a discrete optical fiber 530, and the discrete optical fibers are each mounted on a thermal actuator 532. When the thermal actuator 532 is in the name configuration shown in FIG. 19, substantially the entire optical signal 528 is transmitted from the optical fiber 530 to the corresponding optical fiber 534. In the name configuration, the thermal actuator 532 is preferably a coplanar and inactive configuration. The optical fiber 534 is coupled to the multiplexer 536. The multiplexer 536 combines discrete wavelengths 528 into an output signal 538. The current can be applied to one or more thermal actuators 532. Therefore, the optical fibers 530 and 534 are not aligned. Partial or complete attenuation (refer to Figure 4). In a specific embodiment, the controller 540 monitors the upstream and / or downstream signal strength of the optical fibers 530, 534, and controls the position of the thermal actuator 532 to equalize the signal strength. Although specific specific embodiments of the present invention have been shown and described herein, it should be understood that these specific embodiments are merely examples to illustrate a number of possible specific configurations in the application design of the principles of the present invention. Those skilled in the art have not deviated from this hair -24- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) binding
548232 五 A7 B7 發明説明(22 ) 明之範圍及精髓可根據此等原理做出無數多變的其它配置 。例如此處揭示的任何彎曲部分、加強結構、錨位置及樑 組態皆可組.合而產生多種熱致動器。548232 Five A7 B7 Description of the Invention (22) The scope and essence of the invention can make countless other configurations based on these principles. For example, any of the curved sections, reinforcement structures, anchor locations, and beam configurations disclosed herein can be combined to produce a variety of thermal actuators.
-25- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)-25- This paper size applies to China National Standard (CNS) A4 (210X297 mm)
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JP (1) | JP2004524549A (en) |
AU (1) | AU2001296985A1 (en) |
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FR2849919B1 (en) * | 2003-01-15 | 2006-02-17 | Jobin Yvon Sas | DEVICE FOR INJECTING SUBTRACTION OF SPECTRAL COMPONENTS FOR OPTICAL FIBERS. |
FR2858405B1 (en) * | 2003-07-30 | 2006-05-26 | Get Enst Bretagne | INTERFEROMETRIC SYSTEM FOR SELECTING OPTICAL BEAM SPECTRAL COMPONENTS |
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EP2423720B1 (en) * | 2010-08-25 | 2013-07-10 | Sercalo Microtechnology Ltd. | Wavelength-tuneable optical filter and reflective element |
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2001
- 2001-10-05 EP EP01977902A patent/EP1332399A2/en not_active Withdrawn
- 2001-10-05 CA CA002427234A patent/CA2427234A1/en not_active Abandoned
- 2001-10-05 WO PCT/US2001/042504 patent/WO2002037161A2/en not_active Application Discontinuation
- 2001-10-05 JP JP2002539862A patent/JP2004524549A/en active Pending
- 2001-10-05 AU AU2001296985A patent/AU2001296985A1/en not_active Abandoned
- 2001-10-05 IL IL15567501A patent/IL155675A0/en unknown
- 2001-10-16 TW TW090125548A patent/TW548232B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11131794B2 (en) | 2012-07-16 | 2021-09-28 | Viavi Solutions Inc. | Optical filter and sensor system |
TWI756606B (en) * | 2012-07-16 | 2022-03-01 | 美商唯亞威方案公司 | Optical filter and sensor system |
US12055739B2 (en) | 2012-07-16 | 2024-08-06 | Viavi Solutions Inc. | Optical filter and sensor system |
TWI826005B (en) * | 2021-09-22 | 2023-12-11 | 荷蘭商Asml荷蘭公司 | Source selection module and associated metrology and lithographic apparatuses |
Also Published As
Publication number | Publication date |
---|---|
IL155675A0 (en) | 2003-11-23 |
CA2427234A1 (en) | 2002-05-10 |
JP2004524549A (en) | 2004-08-12 |
WO2002037161A3 (en) | 2003-02-27 |
EP1332399A2 (en) | 2003-08-06 |
WO2002037161A2 (en) | 2002-05-10 |
AU2001296985A1 (en) | 2002-05-15 |
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