TW546418B - Method of producing AuCuGa alloy coating using electrolysis, and alloys produced by such a method - Google Patents

Method of producing AuCuGa alloy coating using electrolysis, and alloys produced by such a method Download PDF

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TW546418B
TW546418B TW90110429A TW90110429A TW546418B TW 546418 B TW546418 B TW 546418B TW 90110429 A TW90110429 A TW 90110429A TW 90110429 A TW90110429 A TW 90110429A TW 546418 B TW546418 B TW 546418B
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Taiwan
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gallium
patent application
copper
scope
electrolytic bath
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TW90110429A
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Chinese (zh)
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Stephanie Dimpre
Philippe Marcus
Pierre Lalanne
Jacques Biau
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Enthone Omi Inc
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The present invention relates to a method of producing a gold-copper-gallium (AuCuGa) alloy coating by electrodeposition on a substrate (2), using an aqueous electrolytic bath. The method is characterized in that the aqueous electrolytic bath comprises potassium aurocyanide (KAu(CN)2), copper cyanide (CuCN), potassium cyanide (KCN) or sodium cyanide (NaCN), and a gallium salt (e.g. gallium sulfate Ga2(SO4)3). In particular, the molar concentration of gold cations ([Au+]), copper cations ([Cu+]) and gallium cations ([Ga3+]) in the electrolytic bath is respectively comprised within the following ranges: 0.19 g/l <= [Au+] <= 2.17 G/L (0.1X10<-2> mol/l <= [AU+] ≤ 1.1X10<-2> mol/l); 0.31 g/l <= [Cu+] <= 1.59 G/L (0.5X10<-2> mol/l <= [CU+] ≤ 2.5X10<-2> mol/l); and 0.69 g/l <= [Ga3+] <= 2.79 G/L (1X10<-2> mol/l <= [GA3+] ≤ 4X10<-2> mol/l). Such a method allows to provide an AuCuGa alloy coating having brightness and ductility properties which are equivalent to those of the prior art AuCuCd alloy coatings.

Description

546418 A7 B7 五、發明説明(1 ) 發明領域: · (請先閱讀背面之注意事項再填寫本頁) 本發明係相關於一種利用電解方法製造金一銅-鎵( A u C u G a )合金塗層之方法,具有特別適用於珠寶及 金飾業買賣必要條件之展延性及亮度。 發明背景: 珠寶及金飾業買賣上,由於它的亮度及展延性性質原 因,故基於金一銅—鎘(A u C u C d )合金之塗層,其 技術已爲人所習知。譬如,最常用之1 8 —開(1 8 — K )金-銅一鎘(AuCuCd)合金塗層,其金、銅及鎘 所含重量百分率分別爲7 5%、1 8%及7% (原子百分 率分別爲5 2 · 4 %、3 9 %及8 · 6 %。此類合金塗層 具有理想的亮度、硬度(4 0 0維克二4 0 0 Vickers )及 展延性’使它極具吸引力,以至於自上世紀以來即廣被使 用。 經濟部智慧財產局g:工消費合作社印製 利用電解方法金一銅一鎘(A u C u C d )之共沈積 作一 ’ S爲所習知。許多電解方法使用不同形態的電解質 ’ 1者g変性、鹼性及中性的氰化物或硫酸的電解質,當使 用上述電解浴時,爲了要獲得金一銅一鎘(A u C u C d )i塗層’在金、銅及鎘陽離子之電沈積作用,所需電 位範圍全都相同。 料 Μ 是 US Patent application No. 72/237513 ( C Η 5 5 6 9 1 6 &amp; CH542934 )揭示一塗層 方法及一電解浴沈積 '、低一開&quot;【(Low-cam,1 4〜 -4- 本紙張尺度適用中國g家標準(CNS ) A4規格(2iGx297公瘦) 546418 A7 B7 五、發明説明(2 ) (請先閲讀背面之注意事項再填寫本頁) 19K (開)】而厚的金—銅一鎘(AuCuCd)合金 塗層(2 0〜4 0 // m ),其以自含有可溶性氰化金錯合 物、可溶性氰化銅 '可溶性鎘化合物、游離氰化物及水溶 解性聚氧醇(Polyoxyalcoylenic )亮光劑之鹼性水溶液浴 ,電沈積金一銅一鎘(A u C u C d )合金而成。當沈積 ''低-開〃合金時(如具有低濃度的金及高濃度的銅及鎘 ),使用亮光劑可使最終厚的塗層得到很理想的亮度。 無論如何,不管金一銅—鎘(Au C u C d)合金塗 層之優點爲何,然鎘是非常揮發性及毒性的。當軟焊此合 金塗層所製珠寶時,此問題即產生不良結果。尤其在製造 此合金之電鑄件時’其必須作兩孔以減少其底材,而其後 又需以軟焊塡滿時,鎘的揮發性及毒性即產生非常嚴重的 問題。更且自1 9 8 0年以來,基於健康理由歐洲管制趨 於限制此種化合物之使用。 因此’爲可避免上述習知技術金-銅-鎘( 經濟部智慧財產局負工消費合作社印製 A u C u C d )合金揮發性及毒性問題,提供具有與那些 金—銅—細(A u C u C d )合金品質相當的一*種新合金 ,是有其實際需要的。 不使用任何鍋之金一銅(A u C u )二元素合金,已 在著作 Galvano-Organo Traitement de Surface &quot;,p.379 〜 3 82, April 91/615中提及。然而,商場上都得不到該合金。 確實’該二元素合金之顏色似乎是趨於紅色些,因爲爲了 補充缺鎘的量所需多加之銅,使該二元素合金對氧化作用 非常敏感。結果使該合金幾乎無法考慮作爲適合珠寶上之 -5- 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 546418 A7 B7 五、發明説明(3 ) 應用。 (請先閱讀背面之注意事項再填寫本頁) 直到現在,一些化合物曾被提議取代以金爲基礎之三 元素合金中的鎘,諸如金一銅一鋅(A u C u Ζ η )合金 中之鋅(US 5 ,〇85,744, E P 〇 3 0 4 3 15,or EP 〇 4 8 0 876)、金一銅一鉍(546418 A7 B7 V. Description of the invention (1) Field of invention: (Please read the notes on the back before filling out this page) The present invention is related to the production of gold-copper-gallium (A u C u G a) by electrolytic method The method of alloy coating has the ductility and brightness which are particularly suitable for the necessary conditions for the sale of jewelry and gold jewelry. Background of the Invention: In the jewellery and gold jewelry industry, because of its brightness and ductility, the technology based on gold-copper-cadmium (Au C u C d) alloy coatings is well known. For example, the most commonly used 18-K (18-K) gold-copper-cadmium (AuCuCd) alloy coatings have weight percentages of gold, copper, and cadmium of 75%, 18%, and 7% ( The atomic percentages are 52. 4%, 39% and 8.6%, respectively. Such alloy coatings have ideal brightness, hardness (400 Vickers 2 400 Vickers) and ductility, which makes it extremely It ’s so attractive that it has been widely used since the last century. The Intellectual Property Bureau of the Ministry of Economic Affairs g: Industrial and Consumer Cooperatives printed the gold-copper-cadmium (A u C u C d) co-deposition using electrolytic method as a 'S is It is known that many electrolytic methods use different types of electrolytes, such as alkaline, alkaline and neutral cyanide or sulfuric acid electrolytes. When using the above electrolytic baths, in order to obtain gold-copper-cadmium (A u C u C d) i coating 'for the electrodeposition of gold, copper and cadmium cations, the required potential ranges are all the same. Material M is US Patent application No. 72/237513 (C Η 5 5 6 9 1 6 & CH542934 ) Reveals a coating method and an electrolytic bath deposition ', low one open &quot; [(Low-cam, 1 4 ~ -4- This paper is applicable in the standard Standard G (CNS) A4 (2iGx297 male thin) 546418 A7 B7 V. Description of the invention (2) (Please read the precautions on the back before filling this page) 19K (On)] and thick gold—copper-cadmium ( AuCuCd) alloy coating (2 0 ~ 4 0 // m), which contains soluble gold cyanide complex, soluble copper cyanide, soluble cadmium compound, free cyanide, and water-soluble polyoxyalcoylenic Bath of alkaline aqueous solution of brightener, electrodeposited gold-copper-cadmium (Au C u C d) alloy. When depositing `` low-open alloy '' (such as low concentration of gold and high concentration of copper and Cadmium), the use of brighteners can make the final thick coating very ideal brightness. However, regardless of the advantages of gold-copper-cadmium (Au C u C d) alloy coating, cadmium is very volatile and toxic This problem produces undesirable results when soldering jewellery made of this alloy coating. Especially when manufacturing electroformed parts of this alloy, 'it must make two holes to reduce its substrate, and then it needs to be soldered. When full, the volatility and toxicity of cadmium will cause very serious problems. Moreover, since 1 Since 1988, European regulations for health reasons have tended to limit the use of such compounds. Therefore, 'Au C u is printed to avoid the conventional technical gold-copper-cadmium (the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs) C d) alloy volatility and toxicity issues, it is necessary to provide a new alloy with the same quality as those of gold-copper-fine (A u C u C d) alloys. The gold-copper (Au Cu) two-element alloy without using any pots has been mentioned in the book Galvano-Organo Traitement de Surface &quot;, p.379 ~ 3 82, April 91/615. However, the alloy is not available in shopping malls. Indeed, the color of the two-element alloy seems to be red, because the additional copper required to supplement the cadmium deficiency makes the two-element alloy very sensitive to oxidation. As a result, the alloy can hardly be considered as suitable for jewelry. -5- The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 546418 A7 B7 5. Application of the invention (3). (Please read the notes on the back before filling out this page.) Until now, some compounds have been proposed to replace cadmium in gold-based three-element alloys, such as gold-copper-zinc (A u C u Z η) alloys. Zinc (US 5,008,744, EP 0303 0 3 15, or EP 048 0 876), gold-copper-bismuth (

AuCuBi)合金中之鉍(ep 〇 1 2 6 9 2 1 )及金一銅一銀(Au CuAg)合金中之銀( EP 〇 566 054)。無論如何’該等合金無~ 可考慮適合作爲珠寶及金飾買賣之用。特別是鎵(G a ) ,由於其熔點關係(鎵在4 5 t熔化),從未被考慮作爲 取代以金爲基礎合金中鎘之可能的替代物。這使得對最終 合金特色所需的量測非常困難,以致於在該金一銅一鎵( A u C u G a )三元素合金中鎵的功效難以控制。 金一銅—鎵(A u C u G a )塊體合金係用於牙科領 域,然而,此塊體合金是以金、銅及鎵一起熔化成錠產製 ,此生產方法並不能應用於珠寶業。 經濟部智慧財產局a(工消費合作社印製 發明之槪述: 爲了克服先前技術之合金塗層的上述問題,本發明主 要目的爲提供相似於那些A u C u C d合金塗層所具有之 亮度及展延性性質之A u C u G a合金塗層,如此則使該 A u C u G a合金塗層,特別是在珠寶應用上,可被用作 A u C u C d合金塗層之替代物。 -6- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 54641ο Α7 Β7 ' ~ ~~ -----— 五、發明説明(4 ) 本目的係提供一種利用水溶液電解浴以電沈積作用於 一底材(受體)製造A u C u G a合金塗層之方法。其特 徵爲前述的水溶液電解浴包含:亞金氰化鉀 [K A u ( C N ) 2 ]、氰化銅(CuCN)、氰化鉀( K C N )或氰化鈉(N a C N )及可溶性鎵化合物。 上述可溶性鎵化合物可能至少是一種鎵鹽或下列鎵鹽之混 合物:硫酸鎵(G a 2 ( S〇4 ) 3 )、氯化鎵(G a C 1 3 )、2,3 -水楊酸萘酯藍素氯化鎵鹽〔(2,3 — naphthalocyanine gallium monochloride salt ), (C 4 8 H 2 4 C 1 G a N 8 ))、九水合硝酸鎵 (G a ( N〇3 ) 3 · 9 Η 2〇)、水合硝酸鎵 (G a ( N〇3 ) 3 · a q )、氮化鎵(G a N )、氧化鎵 (G a 2 0 3 )、磷化鎵(G a P )及苯二甲藍素氯化鎵鹽 〔(p hthalocya nine gallium monochloride salt ), (C32H16C 1 GaNe)]。 (請先閲讀背面之注意事項再填寫本頁)AuCuBi) alloy in bismuth (ep 0 1 26 9 2 1) and gold in copper-silver (Au CuAg) alloy (EP 0 566 054). In any case, these alloys are not suitable for consideration as jewelry and gold jewelry. In particular, gallium (G a), due to its melting point (gallium melts at 4 5 t), has never been considered as a possible substitute for cadmium in gold-based alloys. This makes the measurement required for the characteristics of the final alloy very difficult, so that the efficacy of gallium in the gold-copper-gallium (AuCuGa) three-element alloy is difficult to control. Gold-copper-gallium (Au C u G a) bulk alloy is used in the field of dentistry. However, this bulk alloy is produced by melting gold, copper and gallium into an ingot. This production method cannot be applied to jewelry. industry. The Intellectual Property Bureau of the Ministry of Economic Affairs a (Industrial and Consumer Cooperatives printed invention description: In order to overcome the above-mentioned problems of alloy coatings of the prior art, the main purpose of the present invention is to provide similar to those of AuCuCd alloy coatings. Au C u G a alloy coating with brightness and ductility properties, so that this Au C u G a alloy coating, especially in jewelry applications, can be used as Au C u C d alloy coating -6- This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 54641ο Α7 Β7 '~ ~~ ------5. Description of the invention (4) This purpose is to provide a use Aqueous solution electrolytic bath is a method for producing Au C u G a alloy coating by electrodeposition on a substrate (acceptor). It is characterized in that the aforementioned aqueous solution electrolytic bath contains: potassium gold cyanide [KA u (CN) 2 ], Copper cyanide (CuCN), potassium cyanide (KCN) or sodium cyanide (N a CN) and soluble gallium compounds. The above soluble gallium compounds may be at least one gallium salt or a mixture of the following gallium salts: gallium sulfate (G a 2 (S〇 4) 3), gallium chloride (G a C 1 3), 2,3-salicylic naphthyl ester Cyanogen gallium chloride salt ((2,3 — naphthalocyanine gallium monochloride salt), (C 4 8 H 2 4 C 1 G a N 8)), gallium nitrate nonahydrate (G a (N〇3) 3 · 9 Η 20), gallium nitrate hydrate (G a (N〇3) 3 · aq), gallium nitride (G a N), gallium oxide (G a 2 0 3), gallium phosphide (G a P), and benzene dichloride Methyl blue pigment gallium chloride [(phthalocya nine gallium monochloride salt), (C32H16C 1 GaNe)]. (Please read the notes on the back before filling this page)

、1T, 1T

U C 子 離 c 金 c 中子 子離 離鎵 陽及 浴} 解3U C ion ion c gold c neutron ion ion gallium cation and bath} solution 3

G aG a

含 c 包 c 別 子各 離度 銅濃 、 耳 )莫 — 之 \)/ U /—\ A 經濟部智慧財產局員工消費合作社印製 列 下 於 〇 〇 ΊΧ : X 圍 1 範 · 〇 g 9 m 〇Contains c, c, c, and zi respectively, copper concentration, ear) Mo — of \) / U / — \ A Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is listed below: 〇〇 ×: X Wai 1 Fan · 〇g 9 m 〇

〇m 2 〇 1X g 9 5 r—i U A N-f &lt;| &lt;| s τ—I 3 〇〇m 2 〇 1X g 9 5 r—i U A N-f &lt; | &lt; | s τ—I 3 〇

/ X τ—I 7 · 1~II .Vli 2 ] VII + J u + A &lt;- u c νιι 〇m 2 〇 IX X 5 o o 〇 。 及 1 } 、 X 1 )1/ '—_ /V '~~_ /101/m 2 g I 9 〇 2 7 1 〇 · X 12 4 X&lt;i VII 5 ] ] 3 3 2&lt;一 om/ X τ—I 7 · 1 ~ II .Vli 2] VII + Ju + A &lt;-u c νm 〇m 2 〇 IX X 5 o o 〇. And 1}, X 1) 1 / '—_ / V' ~~ _ / 101 / m 2 g I 9 〇 2 7 1 〇 X 12 4 X &lt; i VII 5]] 3 3 2 &lt;-om

a G &lt;l u c g 9 6 〇m VII&lt;l 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 經濟部智慧財產苟g(工消費合作社印製 546418 A7 B7___一— 五、發明説明(5 ) 較佳實施例中,電解浴陽離子中金離子(〔A u +〕) 、銅離子(〔C u 1〕)及鎵離子(〔G a p〕)之莫耳 濃度分別爲.〔Auf〕. (ΐχΐ〇 2 m ο 1 / 1 )、CCu']^li27g/1 ( 2 x 10 2 m ο 1 / 1 )、及〔G a 3 +〕=工· 3 9 g / 1 ( 2xl〇 2 m 〇 1 / i )。 此外’電解浴中氰化鉀(K c N )之莫耳濃度,至少 必須爲氣化銅(C u C N )莫耳濃度之1 · 5倍。 電解浴之p Η値範圍爲7〜1 3 ,有利者爲高於或等 於1 0 (更佳者爲1 2 );電解浴之溫度範圍爲1 5〜 8 0 °c,較佳者爲5 〇〜7 〇 °C或約6 0 °C ;電解作用時 黾流松、度範圍爲1 · 1〜1 · 8 A / d m 2 (較佳者爲 1.4dm2)。 爲改善合金的亮度、顏色及或化學性質,某些錯合劑 如螯合劑或其一些混合物,可以加入水溶液電解浴中。a G &lt; lucg 9 6 〇m VII &lt; l This paper size applies Chinese National Standard (CNS) A4 specification (210 × 297 mm) Intellectual property of the Ministry of Economic Affairs (printed by the Industrial and Consumer Cooperatives 546418 A7 B7___) Explanation (5) In a preferred embodiment, the molar concentrations of gold ions ([A u +]), copper ions ([C u 1]), and gallium ions ([G ap]) in the electrolytic bath cations are respectively. [ Auf]. (Ϊ́χΐ〇2 m ο 1/1), CCu '] ^ li27g / 1 (2 x 10 2 m ο 1/1), and [G a 3 +] = work · 3 9 g / 1 (2xl 〇 2 m 〇 1 / i). In addition, the molar concentration of potassium cyanide (K c N) in the electrolytic bath must be at least 1.5 times the molar concentration of copper gaseous copper (C u CN). The range of p Η 値 is 7 ~ 1 3, which is favorable to be higher than or equal to 10 (more preferably, 1 2); the temperature range of the electrolytic bath is 1 5 to 8 0 ° c, and preferably 5 0 to 7 〇 ° C or about 60 ° C; when the electrolysis is performed, the flow rate is loose, and the degree range is 1 · 1 ~ 1 · 8 A / dm 2 (preferably 1.4 dm 2). In order to improve the brightness, color and or chemistry of the alloy Properties, certain complexing agents such as chelating agents or some mixtures thereof Aqueous electrolytic bath may be added.

例如’前述至少一種螯合劑係爲有機磷酸鹽螯合劑或 氨基羧酸或氨基聚羧酸,特別爲乙二胺四乙酸(E D T A ) '腈三乙酸(N T A )及或2 -氨基乙磺酸(taimne ) 〇 本發明亦關切任何A u C II G a合金以該法產製之。 本發明其他特徵及優點,在讀過本發明實施例之下列 詳細描述後’將變爲更明顯,參考圖1爲依本發明實施例 適用於產製1 8 -開(1 8 - K)金—銅一鎵 A u C u G a合金塗層方法之代表模範的靜電設備。 (請先閱讀背面之注意事項存填寫本頁)For example, 'the aforementioned at least one chelating agent is an organic phosphate chelating agent or an aminocarboxylic acid or aminopolycarboxylic acid, particularly ethylenediaminetetraacetic acid (EDTA), nitriletriacetic acid (NTA), and 2-aminoethanesulfonic acid ( taimne) The present invention is also concerned about any Au C II Ga alloy produced by this method. Other features and advantages of the present invention will become more apparent after reading the following detailed description of the embodiments of the present invention, and referring to FIG. 1, it is applicable to the production of 18-K (18-K) gold according to an embodiment of the present invention— The copper-gallium A u C u G a alloy coating method represents a model electrostatic device. (Please read the precautions on the back and save this page)

本纸張尺度適用中國國家標準(CNS ) A4規格(2i〇X297公釐) —8 _ 546418 A7 B7 五、發明説明(6 ) 較佳實施例之詳細描述: (請先閲讀背面之注意事項再填寫本頁) 圖1所不,一模範的靜電設備包含:含有電解浴槽3 ’其中陽極1 、陰極2均浸入電解浴內,馬達4可旋轉驅 動—極2,電流發生器5連接到陽極1及陰極2。熱電偶 6偶合到電熱裝置7去保持電解浴預定之溫度。當電解作 用時及之前,以磁攪拌器8維持電解浴之穩定均勻度。 在所描述之實施例中,陰極2是覆以薄金膜之銅板, 其厚度爲0 · 1〜〇 · 2 // m,而當底層用。此銅板以銅 線懸掛之’並以馬達4用7 · 5轉/分鐘之轉速旋轉驅動 。此陰極可用任何其他電導性材料作成,例如鎳可以任何 其他適當的底層覆之。陽極1是以鈾塗層之鈦(T i -p t ),磁攪拌器8用1 2 5轉/分鐘之轉速可得期望的 攪拌’熱電偶保持電解浴溫度在6 0 t。 事先’陰極2之底材(受體),爲了要溶解乳化之油 脂’以撇取在底材上之任何油脂而準備之,並實施活化作 用及使用超音波淋洗程序去除雜質,接著以蒸餾水淋洗底 材。 經濟部智慧財產局g(工消費合作社印製 根據本發明之特別實施例,爲了依本發明電解浴, P Η値1 2之電解浴配製於上述電解浴槽3中,如此後順 序描述再加入氰化物錯合物。亞金氰化鉀 〔K A u ( C Ν ) 2〕、氰化銅(C u C Ν )、氰化鉀 (K C N )及硫酸鎵(G a 2 ( S〇4 ) 3 )在前述攪拌、 旋轉陰極、溫度及p Η値條件下,加入電解液中,如此可 獲得下列陽離子之莫耳濃度:〔Au1〕二1 · 97g/l 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -9 - 546418 A7 B7 五、發明説明(7 ) (1x10 2 m 〇 1/1 )、〔Cu4〕:!* · 27g/ 1· (2x10 21]〇1/1)、及〔〇33+〕二1,39 g / 1 (2x10 2 m 〇 1 / 1 )。 在此特別實施例中,爲了要提供電解浴鎵陽離子而使 用無水硫酸鎵(G a 2 ( S〇4 ) 3 ),然而許多其他種類 之鎵鹽或該等鹽類之混合物均可使用,例如:氯化鎵( G a C 1 3 ) 、2,3 -水楊酸萘酯藍素氯化鎵鹽〔(2, 3 — naphthalocyanme gallium monochloride salt ), (C 4 8 Η 2 4 C 1 G a N 8 )〕、九水合硝酸鎵 (G a ( N〇3 ) 3 · 9 Η 2〇)、水合硝酸鎵 (Ga (N〇3)3.aq)、氮化鎵(GaN)、氧化鎵 (G a 2 0 a )、磷化鎵(G a P )或苯二甲藍素氯化鎵鹽 〔(phthalocyanine gallium monochloride salt ), (C32H16C 1 GaNe)〕0 電解浴中爲了要使氰化銅(C u C N )呈可溶性,加 入氰化鉀(K C N )或氰化鈉(N a C N )是需要的。電 解浴中氰化鉀(K C N )之莫耳濃度,至少必須爲氰化銅 (C u C N )莫耳濃度之1 · 5倍。那就是此特別實施例 中,〔K .1〕二 1 , 1 7 3 g / 1 ( 3 X 1 0 - 2 m ◦ 1 / 1 )。然而,任何可促進氰化銅(C u C N )溶解性之其 他氰化物錯合物,均可用於電解浴。 然而,在仍然維持相同試驗條件下,陽極1及陰極2 間用1 . 4 d m 2電流密度作爲電解作用溶液的催化之用。 電解浴之攪拌及陰極之旋轉有助於阻撓耗盡擴散層陽 (請先閱讀背面之注意事項再填寫本頁)This paper size applies Chinese National Standard (CNS) A4 specification (2i × 297mm) — 8 _ 546418 A7 B7 V. Description of the invention (6) Detailed description of the preferred embodiment: (Please read the precautions on the back first (Fill in this page) As shown in Figure 1, an exemplary electrostatic device contains: an electrolytic bath 3 ', in which the anode 1 and cathode 2 are immersed in the electrolytic bath, the motor 4 can be driven to rotate-pole 2, and the current generator 5 is connected to anode 1 And cathode 2. The thermocouple 6 is coupled to the electric heating device 7 to maintain a predetermined temperature of the electrolytic bath. When and before the electrolysis, the magnetic stirrer 8 is used to maintain the stable uniformity of the electrolysis bath. In the described embodiment, the cathode 2 is a copper plate covered with a thin gold film, and its thickness is 0 · 1 ~ 0 · 2 // m, and it is used as the bottom layer. This copper plate is suspended by a copper wire 'and is driven to rotate by a motor 4 at a speed of 7 · 5 rpm. This cathode can be made of any other electrically conductive material, e.g. nickel can be coated with any other suitable substrate. The anode 1 is titanium (T i -p t) coated with uranium, and the magnetic stirrer 8 can be obtained at a speed of 125 revolutions per minute. The desired thermocouple is used to maintain the electrolytic bath temperature at 60 t. Prepared in advance 'the cathode 2 substrate (receiver) in order to dissolve the emulsified grease' to skim off any grease on the substrate, and implement activation and use of ultrasonic washing procedures to remove impurities, followed by distilled water Rinse the substrate. The Intellectual Property Bureau of the Ministry of Economic Affairs (industrial and consumer cooperatives prints a special embodiment of the present invention. In order to electrolyze the bath according to the present invention, the electrolytic bath of P Η 値 12 is prepared in the electrolytic bath 3 described above, and the cyanide is added in the order described later. Compound complex. Potassium cyanide [KA u (C Ν) 2], copper cyanide (C u C Ν), potassium cyanide (KCN), and gallium sulfate (G a 2 (S〇4) 3) Under the aforementioned conditions of stirring, rotating the cathode, temperature and p 加入, adding the electrolyte to the solution, the Molar concentration of the following cations can be obtained: [Au1] 2 1 · 97g / l This paper is applicable to Chinese National Standard (CNS) A4 Specifications (210X 297 mm) -9-546418 A7 B7 V. Description of the invention (7) (1x10 2 m 〇1 / 1), [Cu4]:! * 27g / 1 (2x10 21) 〇1 / 1) And [〇33 +] 2,39 g / 1 (2x10 2 m 〇1 // 1). In this particular embodiment, in order to provide an electrolytic bath gallium cation, anhydrous gallium sulfate (G a 2 (S. 4) 3), however, many other types of gallium salts or mixtures of these salts can be used, for example: gallium chloride (G a C 1 3), 2,3-salicylate naphthoate blue Gallium salt [(2, 3 — naphthalocyanme gallium monochloride salt), (C 4 8 Η 2 4 C 1 G a N 8)], gallium nitrate nonahydrate (G a (N〇3) 3 · 9 Η 2〇) , Hydrated gallium nitrate (Ga (N03) 3.aq), gallium nitride (GaN), gallium oxide (G a 2 0 a), gallium phosphide (G a P), or xylolium gallium chloride Salt [(phthalocyanine gallium monochloride salt), (C32H16C 1 GaNe)] 0 In order to make copper cyanide (C u CN) soluble in the electrolytic bath, potassium cyanide (KCN) or sodium cyanide (N a CN) is added. Required. The molar concentration of potassium cyanide (KCN) in the electrolytic bath must be at least 1.5 times the molar concentration of copper cyanide (C u CN). That is [K .1] in this particular embodiment. 22, 1 7 3 g / 1 (3 X 1 0-2 m ◦ 1/1). However, any other cyanide complex which can promote the solubility of copper cyanide (C u CN) can be used for electrolysis However, under the same test conditions, a current density of 1.4 dm 2 was used between the anode 1 and the cathode 2 to catalyze the electrolytic solution. The stirring of the electrolytic bath and the rotation of the cathode can help obstruct the depletion of the diffusion layer (please read the precautions on the back before filling this page)

、1T 經濟部智慧对產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) -10- 546418 A7 B7 五、發明説明(8 ) (請先閲讀背面之注意事項再填寫本頁) 離子之擴散。攬拌愈激烈,則維持電解作用所需要之電流 密度愈高,於是達成最快的塗層。無論如何,在本 A u C u G a合金塗層之案例中,電解浴之攪拌及陰極之 旋轉條件,更有利於助其當水還原時,陰極表面減少可會g 發生之氯氣泡沫。該等氯氣泡沫通常會干擾二金屬陽離子 之共同沈積作用,而損害最終合金塗層性質。因鎵的還原 發生超過水的還原(水的還原電位爲一 2 V ),故爲了要 還原三金屬,需要提供大於L 2 V之操作電位。在本發明 之此特別實施例中,操作電位約爲一 2 . 7 5 V。 依據所期望的塗層厚度,上述沈積條件係維持某一定 的時間。本實施例中,依前述電流密度保持1 〇分鐘後, 所得塗層厚度爲4 // m。陽極及陰極間增加應用電位時間 ,即可得更厚之塗層。 電解作用停止及塗層厚度爲4 # m後,將陰極銅板2 自電解浴移除且洗滌之,陰極銅板留待將來之用。 在此特別實施例中,最終合金塗層係爲金、銅及鎵原 子百分率分別爲6 2 %、2 7 · 3 %及1 〇 . 7 %的化學 經濟部智慧財產局員工消費合作社印製 組成之1 8 —開(1 8— K)金—銅一鎵Au CuGa三 元素合金。 此合金硬度適用於珠寶及金飾買賣。其測定的平均粒 徑爲0 · 3 Α πι ’結果所得A u C u G a合金塗層之売度 ,相似於那些先前技術之A u C u C d合金塗層所具有之 亮度。而且,因爲其表面不再粗糙,當然增加其抗腐蝕作 用,亦成爲它的優點。依本發明A u C u G a合金塗層之 -11 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210x297公釐) 546418 五、發明説明(9 ) 頌色’其金黃色稍微低於先前技術之A u C u C d合金。 (請先閱讀背面之注意事項再填寫本頁) 再者,根據本發明A u C u G a合金塗層所實施之陳 化4驗顯示,以空氣、汗水及乙酸所作之試驗,導致腐蝕 及變色並不敏感。 本發明並不限定上述模範的較佳實施例,特別是許多 不同形態的A u C u G a合金具有不同開(K )含量(如 從8〜2 4開(K ))及相似的亮度,可依本發明之方法 獲得。電解浴中不同陽離子之莫耳濃度,分別包含於下列 範圍:0.19忌/1^〔八11 +〕$2.17忌/1( 〇· lxi0&quot;2m〇 1/1^ [AuM · lx 10 2m〇l/l)、〇.31g/lS〔Cu + 〕S 1 · 59g/l (〇· 5xl〇—2m〇 1/1S 〔Cu + 〕=2·5χ1〇— 2mol/l)、及 〇,69g/lS 〔Ga3l〕S2.79g/l (lxl〇— 2m〇l/lS 〔G a 3 丨〕$ 4 x 1 〇-2 m o 1 / 1 )。 經濟部智慧財產局員工消費合作社印製 根據本發明,電解作用可實施於水溶液的電解浴之 P Η値爲高於或等於1 〇,電解浴p Η値可能之變化,會 影響電解作用的產量(m g / A · m i η ·)及塗層厚度 電解浴之溫度範圍爲5 0〜7 0 °C。溫度升高時,它 可能增加認可的最大電流密度,黏度將因而減低,並因此 增加電化學反應及擴散速度。因此之故,電解沈積作用可 以較高濃度之電解質達成。操作之電流密度範圍爲1 · 1 〜1 . 8 A / d m 2。 本紙張尺度適用中國國家標準(CNS ) A4規格(210x 297公釐)-12 - 546418 A7 B7 五、發明説明(1〇 ) 根據本發明上述性質可提供A u C u G a合金塗層沈 積條件,並曾以檢測分析最終合金不同的熟知化學及結構 特徵技術:諸如化學分析之電子分光分析法(E S C A ) '能量分散X光分光分析法(E D X S )、原子吸收光譜 分析法(A A S )、或X光繞射分析法(X R D )及掃瞄 式電子顯微分析法(S E Μ )。 控制變化電位下,不同沈積試驗之完成,可以 E S C Α測定其參數之正確範圍。ε s C Α測定分析顯示 陽離子還原作用之次序(電位由金而銅至鎵更趨負數)及 E D X S給與最終合金化學組成測定其厚度爲1〜4 # 1Ί1 ’ E D X S分析可以測定出合金表面之組成。對於較厚之 合金’就如大於4 4 // m者,整個沈積之化學組成可以 A A S檢測分析。X R D圖譜分析可建立依本發明電沈積 週期結構之實體。 此外,在A u C u G a合金中,銅含量可以或增加電 解浴之濃度方式(結果產生明顯變化),或增加電流密度 方式(結果產生稍微變化)。另一方面,它建立了當增加 電流密度’合金鎵含量並不改變之簡單作法。如此電流之 增加則有利於鎵及銅之共同沈積作用。因此本發明之另一 優點爲金含量(開數或銅及鎵含量)之變化,可以調節兩 電極間電流密度方式得到控制。 某些添加劑(磨光顆粒之売光劑、如可溶解性硒或碲 之化合物的調平劑、膠體、潤濕劑等),根據本發明均可 加入電解浴中。爲了要改進產量或修飾共同沈積結構及改 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局g(工消費合作社印製 -13- 546418 A7 B7 五、發明説明(11 ) 善売度,及或a u c u G a合金塗層之顏色,例如一些聚 ( Polyoxyalcoylemc )化合物可用來當亮光劑,及一 (請先閱讀背面之注意事項再填寫本頁) 合劑如有機磷酸鹽螯合劑或氨基羧酸或氨基聚羧酸, 均可用之。 例如,添加乙二胺四乙酸(E D T A,Η 2 Y )或腈三 乙酸(ΜΤΑ,Η3Χ)(莫耳濃度範圍爲0 · 1〜2 m ◦ 1 / 1 )於電解浴中可改善亮光度及得一玫瑰色塗層 。試驗顯示當電解作用時電流密度爲1 · 4 A / d m 2,增 加E D T A或N T A時會降低金及鎵之還原,而增加銅之 還原’增加電流密度時,則只稍微增加銅之還原。 尤其,添加2 -氨基乙擴酸(taunne )於電解浴中試 驗’在電流密度爲1 A / d m 2及增加本法陰極效率下,使 它可能獲得金一銅一鎵A u C u G a三元素合金。增加 taunne之使用會降低金的還原,而增加鎵及銅的還原。增 加電流密度時,則只稍微增加銅之還原。 經濟部智慧財產局員工消費合作社印製 根據本發明之合金是特別適用於珠寶及金飾買賣之 1 5 - K〜2 4 - K的塗層,它也適用於其他需要用到此 等合金者,譬如說在微電子技術上之應用。 圖示簡單說明 圖1顯示靜電設備之例不圖。 元件對照表 1 陽極 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)-14 - 546418 A7 五、發明説明(12 ) 經濟部智慧財產局員工消費合作社印製 2 陰 極 3 電 解 浴 槽 4 馬 達 5 電 流 發 生器 6 熱 (¾ 偶 7 電 埶 裝 置 8 磁 攪 拌 器 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐)_ 15 -、 1T Wisdom of the Ministry of Economic Affairs printed on the paper printed by the Consumer Cooperatives of the Bureau of Industry to apply the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -10- 546418 A7 B7 V. Description of the invention (8) (Please read the first Please fill in this page again.) Ion diffusion. The more intense the mixing, the higher the current density required to maintain the electrolysis, and thus achieve the fastest coating. In any case, in the case of the A u C u G a alloy coating, the stirring conditions of the electrolytic bath and the rotating conditions of the cathode are more conducive to helping the surface of the cathode to reduce chlorine gas bubbles that may occur when water is reduced. These chlorine gas foams often interfere with the co-deposition of dimetallic cations and impair the properties of the final alloy coating. Because the reduction of gallium occurs more than the reduction of water (the reduction potential of water is-2 V), in order to reduce the trimetal, it is necessary to provide an operating potential greater than L 2 V. In this particular embodiment of the invention, the operating potential is approximately 2.75 V. The above deposition conditions are maintained for a certain period of time depending on the desired coating thickness. In this embodiment, after the current density is maintained for 10 minutes, the thickness of the obtained coating is 4 // m. Increasing the applied potential time between the anode and the cathode results in a thicker coating. After the electrolysis stops and the thickness of the coating is 4 #m, the cathode copper plate 2 is removed from the electrolytic bath and washed, and the cathode copper plate is reserved for future use. In this particular embodiment, the final alloy coating is a printed composition of employees ’cooperatives of the Intellectual Property Bureau of the Ministry of Chemistry and Economy, with a percentage of gold, copper, and gallium atoms of 62%, 27.3%, and 10.7%, respectively. No. 18-K (1 8-K) gold-copper-gallium Au CuGa three-element alloy. This alloy hardness is suitable for jewelry and gold jewelry trading. The average particle size measured is 0. 3 Απι ', and the thickness of the Au C u G a alloy coating is similar to the brightness of those Au C u C d alloy coatings of the prior art. Moreover, because its surface is no longer rough, of course, its increased corrosion resistance is also its advantage. According to the invention of A u C u G a alloy coating -11-This paper size is applicable to Chinese National Standard (CNS) A4 specification (210x297 mm) 546418 5. Description of the invention (9) The color of the song is slightly lower than its golden yellow A u C u C d alloy of the prior art. (Please read the precautions on the back before filling this page.) Furthermore, the aging test carried out according to the A u C u G a alloy coating of the present invention shows that the test with air, sweat and acetic acid caused corrosion and Discoloration is not sensitive. The present invention is not limited to the above-mentioned exemplary preferred embodiments, in particular, many different forms of A u C u G a alloys have different K (K) contents (such as from 8 to 24 K (K)) and similar brightness, It can be obtained according to the method of the present invention. The molar concentrations of different cations in the electrolytic bath are included in the following ranges: 0.19 bogey / 1 ^ 〔八 11 +] $ 2.17 忌 / 1 (〇 · lxi0 &quot; 2m〇1 / 1 ^ [AuM · lx 10 2m〇l / l), 0.31 g / lS [Cu +] S 1 · 59 g / l (0.5 x 10-2 m〇1 / 1S [Cu +] = 2.5 x 10-2 mol / l), and 0.99 g / lS [Ga3l] S2.79 g / l (l × 10—2mmol / lS [G a 3 丨] $ 4 x 1 〇-2 mo 1/1). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs According to the present invention, P Η 値 of the electrolytic bath which can be performed in the electrolytic solution of the aqueous solution is higher than or equal to 10, and the possible change of the electrolytic bath p Η 値 will affect the production of the electrolytic action. (Mg / A · mi η ·) and coating thickness electrolytic bath temperature range is 50 ~ 70 ° C. When the temperature is increased, it may increase the approved maximum current density, which will reduce the viscosity and therefore increase the electrochemical reaction and diffusion rate. For this reason, electrolytic deposition can be achieved with a higher concentration of electrolyte. The operating current density ranges from 1 · 1 to 1.8 A / d m 2. This paper size applies Chinese National Standard (CNS) A4 (210x 297 mm) -12-546418 A7 B7 V. Description of the invention (10) According to the above properties of the present invention, A u C u G a alloy coating deposition conditions can be provided , And has used different well-known chemical and structural characteristics to detect and analyze the final alloy: such as electronic spectroscopic analysis of chemical analysis (ESCA) 'energy dispersive X-ray spectrometry (EDXS), atomic absorption spectrometry (AAS), or X-ray diffraction analysis (XRD) and scanning electron microscopy (SE M). Under the control of varying potentials, the completion of different deposition tests can be used to determine the correct range of its parameters. ε s C Α measurement analysis shows the order of cation reduction (the potential is more negative from gold and copper to gallium) and EDXS gives the final alloy chemical composition. Its thickness is 1 ~ 4 # 1Ί1 'EDXS analysis can determine the surface of the alloy composition. For thicker alloys' such as greater than 4 4 // m, the chemical composition of the entire deposit can be analyzed by A A S. X R D pattern analysis can establish the entity of the electrodeposition periodic structure according to the present invention. In addition, in the Au C u G a alloy, the copper content can either increase the concentration of the electrolytic bath (resulting in a significant change) or increase the current density (resulting in a slight change). On the other hand, it establishes a simple method that does not change the gallium content of the alloy when the current density is increased. This increase in current is beneficial to the co-deposition of gallium and copper. Therefore, another advantage of the present invention is the change in the gold content (open number or copper and gallium content), which can be controlled by adjusting the current density between the two electrodes. Certain additives (calenders for polished particles, leveling agents such as soluble selenium or tellurium compounds, colloids, wetting agents, etc.) can be added to the electrolytic bath according to the present invention. In order to improve the yield or modify the co-deposition structure and the paper size, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied (please read the notes on the back before filling this page). Printed by the Consumer Cooperatives-13- 546418 A7 B7 V. Description of the invention (11) Goodness and or color of the aucu G a alloy coating, for example, some polyoxyalcoylemc compounds can be used as brighteners, and one (please first Read the notes on the back and fill in this page) Mixtures such as organic phosphate chelating agents or aminocarboxylic acids or aminopolycarboxylic acids can be used. For example, add ethylenediaminetetraacetic acid (EDTA, Η 2 Y) or nitrile triacetic acid (ΜΤΑ, Η3χ) (Molar concentration range is 0 · 1 ~ 2 m ◦ 1/1) in the electrolytic bath can improve the brightness and get a rosy coating. The test shows that the current density is 1 · 4 when electrolysis A / dm 2 increases the reduction of gold and gallium when EDTA or NTA is increased, but increases the reduction of copper 'and increases the current density, but only slightly increases the reduction of copper. In particular, the addition of 2-aminoethanoic acid (taunne) to Electrolytic bath Medium test 'with a current density of 1 A / dm 2 and an increase in the cathode efficiency of this method, it is possible to obtain a gold-copper-gallium A u C u G a three-element alloy. Increasing the use of taunne will reduce the reduction of gold, and The reduction of gallium and copper is increased. When the current density is increased, the reduction of copper is only slightly increased. The printing of the alloy according to the present invention by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is particularly suitable for the sale of jewelry and gold jewelry. 2 4-K coating, it is also suitable for other people who need to use these alloys, such as in the application of microelectronics technology. The diagram is a simple illustration. Figure 1 shows an example of an electrostatic device. Component comparison table 1 Anode This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -14-546418 A7 V. Description of the invention (12) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 2 Cathode 3 Electrolytic bath 4 Motor 5 Current generation Device 6 heat (¾ couple 7 electric device 8 magnetic stirrer (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) _ 15-

Claims (1)

546418 A8B8C8B8 六、申請專利範圍 It件2:第901 10429號專利申請案 中文申請專利範圍無劃線546418 A8B8C8B8 6. Scope of patent application It Part 2: Patent application No. 901 10429 Chinese application patent scope is not underlined 經濟部智慧財產局員工消費合作社印製 修正 1 . 一種利用水溶液電解浴電沈積作用於一底材(受 體)製造金一銅一鎵(AuCuGa)合金塗層之方法, 其特徵爲水溶液電解浴係包含:亞金氰化鉀 [K A u ( C N ) 2 )、氰化銅(CuCN)、氰化鉀 (K C N )或氰化鈉(N a C N )及可溶性鎵化合物。 2 .如申請專利範圍第1項之電沈積作用於一底材( 受體)製造金—銅一鎵(Au C uGa )合金塗層之方法 ,其中可溶性鎵化合物至少是一種鎵鹽或下列鎵鹽之混合 物:硫酸鎵(G a 2 ( S〇4 ) 3 )、氯化鎵(G a C 1 3 ) 、2 ,3 -水楊酸萘酯藍素氯化鎵鹽〔(2 ’ 3 - naphthalocyanine gallium monochloride salt ) ’ (C48H24C 1 GaNs)〕、九水合硝酸鎵 (Ga (Ν〇3)3·9Η2〇)、水合硝酸鎵 (Ga (N〇3)s-aq)、氮化鎵(GaN)、氧化鎵 (G a 2 0 3 )、磷化鎵(GaP)及苯二甲藍素氯化鎵鹽 〔(phthalocyanine gallium monochloride salt ) ’ (C32H16C 1 GaNs)〕。 3 .如申請專利範圍第1項之方法,其中電解浴陽離 子中金離子(〔Au +〕)、銅離子(〔C^ +〕)及嫁離 子(〔G a 3 +〕)之莫耳濃度分別包含於下列範圍·· 0 . g 7 g 〇 τ : Aw1T— (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X:Z97公釐) 546418 A8 B8 C8 D8 六、申請專利範圍 1〇 一 2mo Ι/Mg 〔Au + 〕 · lx 1〇 一 2mo 1 /l)、0.3lg/l$〔Cu +〕$1.59g/l( Ο-δχΙΟ'^Ώοΐ/ι^ίΟηΜ^^.δχ 10 一 2m o l/i)、及 〇.69g/1$〔Ga3+〕= 2 . 7 9 g / 1 (lx l〇_2m〇 l/1^ [Ga3+] ^ 4xl0'2m〇i/i) 〇 4 ·如申請專利範圍第i項之方法,其中較佳電解浴 陽離子中金離子(〔Au +〕)、銅離子(〔Cu +〕)及 鎵離子(〔Ga3+〕)之莫耳濃度分別爲:〔Au +〕= 1.97g/l (lx 1〇-2 m〇 1/1)、〔Cu +〕= 1.27g/l (2xl〇_2m〇l/l)、及 [G a 3 + ] = i · 3 9 g / i (2xl〇~2mol//l)。 5 ·如申請專利範圍第i項之方法,其中電解浴中氰 化鉀(K C N )之莫耳濃度,至少必須爲氰化銅 (CuCN)莫耳濃度之1·5倍。 6 .如申請專利範圍第1項之方法,其中電解浴之 pH値範圍爲7〜1 3。 7 .如申請專利範圍第6項之方法,其中電解浴之有 利P Η値爲高於或等於1 〇。 8 ·如申請專利範圍第1項之方法,其中電解浴之溫 度車β圍爲1 5〜8 0°C。 9 ·如申請專利範圍第8項之方法,其中電解浴之較 佳溫度範圍爲5 0〜7 0 °C。 1 0 ·如申請專利範圍第9項之方法,其中電解浴之 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -------;------- (請先閱讀背面之注意事項再填寫本頁) 、1T 經濟部智慧財產局員工消費合作社印製 546418 A8 B8 C8 D8 六、申請專利範圍 更佳溫度範圍爲6 〇它。 1 1 .如申請專利範圍第1項之方法,其中電解作用 時電流密度範圍爲1 · 1〜1 · 8 A / d m 2。 1 2 .如申請專利範圍第1項之方法,其中前述的水 溶液電解浴包含至少一種鰲合劑。 1 3 _如申請專利範圍第1 2項之方法,其中前述至 少一種螯合劑係爲有機磷酸鹽螯合劑或氨基羧酸或氨基聚 羧酸。 1 4 ·如申請專利範圍第1 3項之方法,其中前述一 種螯合劑係特別爲乙二胺四乙酸(E D T A )、腈三乙酸 (NTA)及或2 —氨基乙磺酸(taurine )。 1 5 _ —種金—銅一鎵合金塗層,其係藉由如申請專 利範圍第1至1 4項中任一項之方法所製得者。 —^;-----— (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210Χ:Ζ97公釐) -3-Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs The system contains: potassium gold cyanide [KA u (CN) 2), copper cyanide (CuCN), potassium cyanide (KCN) or sodium cyanide (N a CN), and soluble gallium compounds. 2. A method for producing a gold-copper-gallium (Au C uGa) alloy coating on a substrate (acceptor) by electrodeposition on the substrate (acceptor) according to item 1 of the patent application scope, wherein the soluble gallium compound is at least one gallium salt or the following gallium Mixture of salts: gallium sulfate (G a 2 (S04) 3), gallium chloride (G a C 1 3), 2, 3 -salicyl naphthalate blue pigment gallium chloride salt [(2 '3- naphthalocyanine gallium monochloride salt) '(C48H24C 1 GaNs)], gallium nitrate nonahydrate (Ga (N〇3) 3.9.20), gallium nitrate hydrate (Ga (N〇3) s-aq), gallium nitride (GaN ), Gallium oxide (G a 2 0 3), gallium phosphide (GaP), and phthalocyanine gallium monochloride salt [(C32H16C 1 GaNs)]. 3. The method according to item 1 of the scope of patent application, wherein the molar concentration of gold ions ([Au +]), copper ions ([C ^ +]) and graft ions ([G a 3 +]) in the cation of the electrolytic bath They are included in the following ranges: · 0. G 7 g 〇τ: Aw1T— (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X: Z97 mm) 546418 A8 B8 C8 D8 VI.Applicable patent scope: 10-2mo Ι / Mg [Au +] · lx 102- 2mo 1 / l), 0.3lg / l $ [Cu +] $ 1.59g / l (〇-δχΙΟ '^ Ώοΐ / ι ^ ίΟηΜ ^^. Δχ 10-2m ol / i), and 0.69g / 1 $ [Ga3 +] = 2. 7 9 g / 1 (lx l〇_2m〇l / 1 ^ [Ga3 +] ^ 4xl0'2m〇i / i) 〇4. According to the method of item i in the scope of the patent application, among them, gold ion ([Au +]), copper ion ([Cu +]) and gallium ion ([ Ga3 +]) The molar concentrations are: [Au +] = 1.97g / l (lx 1〇-2 m〇1 / 1), [Cu +] = 1.27g / l (2xl〇_2m〇l / l ) And [G a 3 +] = i · 39 g / i (2xl0 ~ 2mol // l). 5. The method according to item i of the patent application, wherein the molar concentration of potassium cyanide (K C N) in the electrolytic bath must be at least 1.5 times the molar concentration of copper cyanide (CuCN). 6. The method according to item 1 of the patent application range, wherein the pH of the electrolytic bath ranges from 7 to 13. 7. The method of claim 6 in the scope of patent application, wherein the favorable P 电解 of the electrolytic bath is higher than or equal to 10. 8. The method according to item 1 of the scope of patent application, wherein the β-circle of the temperature bath of the electrolytic bath is 15 ~ 80 ° C. 9 · The method according to item 8 of the scope of patent application, wherein the preferred temperature range of the electrolytic bath is 50 to 70 ° C. 10 · If the method of the 9th scope of the patent application, the paper size of the electrolytic bath applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -------; ------- ( Please read the notes on the back before filling out this page), 1T printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, 546418 A8 B8 C8 D8 6. The range of patent application is better. The temperature range is 60 °. 1 1. The method according to item 1 of the scope of patent application, wherein the current density during electrolysis ranges from 1 · 1 to 1 · 8 A / d m 2. 12. The method according to item 1 of the patent application range, wherein the aforementioned water solution electrolytic bath contains at least one chelating agent. 1 3 _ The method according to item 12 of the scope of patent application, wherein at least one of the aforementioned chelating agents is an organic phosphate chelating agent or an aminocarboxylic acid or aminopolycarboxylic acid. 14. The method according to item 13 of the scope of patent application, wherein the aforementioned chelating agent is particularly ethylenediaminetetraacetic acid (EDTA), nitriletriacetic acid (NTA), or 2-aminoethanesulfonic acid (taurine). 15__ A kind of gold-copper-gallium alloy coating, which is produced by the method according to any one of the claims 1 to 14 of the patent application. — ^ ; -----— (Please read the notes on the back before filling out this page) Order the paper size printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs to apply the Chinese National Standard (CNS) A4 Specification (210 ×: Z97) Centimeters) -3-
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US7507321B2 (en) * 2006-01-06 2009-03-24 Solopower, Inc. Efficient gallium thin film electroplating methods and chemistries
US7892413B2 (en) * 2006-09-27 2011-02-22 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
EP1983077B1 (en) 2007-04-19 2016-12-28 Enthone, Inc. Electrolyte and method for electrolytic deposition of gold-copper alloys
US8425753B2 (en) 2008-05-19 2013-04-23 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films

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US3056733A (en) * 1960-04-23 1962-10-02 Degussa Process for electrolytic deposition of gold-copper-cadmium alloys
CH555894A (en) * 1972-08-10 1974-11-15 Oxy Metal Industries Corp USE OF ORGANOPHOSPHORUS DERIVATIVES IN SULPHIC BATHS FOR THE ELECTRODEPOSITION OF GOLD AND GOLD ALLOYS.
GB1444350A (en) * 1972-10-03 1976-07-28 Johnson Matthey Co Ltd Dental alloys
CH626410A5 (en) * 1977-09-07 1981-11-13 Metaux Precieux Sa Bath for the electrolytic deposition of gold or gold alloys and use of this bath
GB1594011A (en) * 1977-10-06 1981-07-30 Oxy Metal Industries Corp Gold alloy plating bath
FR2405312A1 (en) * 1977-10-10 1979-05-04 Oxy Metal Industries Corp Bath for electrodeposition of gold-zinc alloys - contains alkali sulphite, gold-sulphite complex, zinc salt, complex or chelate, complexing or chelating agent and metal
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US5288456A (en) * 1993-02-23 1994-02-22 International Business Machines Corporation Compound with room temperature electrical resistivity comparable to that of elemental copper

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