TW545885U - Heat dissipation assembly - Google Patents

Heat dissipation assembly

Info

Publication number
TW545885U
TW545885U TW091219298U TW91219298U TW545885U TW 545885 U TW545885 U TW 545885U TW 091219298 U TW091219298 U TW 091219298U TW 91219298 U TW91219298 U TW 91219298U TW 545885 U TW545885 U TW 545885U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation assembly
assembly
heat
dissipation
Prior art date
Application number
TW091219298U
Other languages
English (en)
Inventor
Hsieh-Kun Lee
Wan-Lin Xia
Gen-Cai Wang
Tao Lee
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091219298U priority Critical patent/TW545885U/zh
Priority to US10/629,232 priority patent/US7277288B2/en
Publication of TW545885U publication Critical patent/TW545885U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW091219298U 2002-11-29 2002-11-29 Heat dissipation assembly TW545885U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091219298U TW545885U (en) 2002-11-29 2002-11-29 Heat dissipation assembly
US10/629,232 US7277288B2 (en) 2002-11-29 2003-07-28 Heat sink assembly with retention module and clip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091219298U TW545885U (en) 2002-11-29 2002-11-29 Heat dissipation assembly

Publications (1)

Publication Number Publication Date
TW545885U true TW545885U (en) 2003-08-01

Family

ID=29730950

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091219298U TW545885U (en) 2002-11-29 2002-11-29 Heat dissipation assembly

Country Status (2)

Country Link
US (1) US7277288B2 (zh)
TW (1) TW545885U (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7133288B2 (en) * 2004-05-19 2006-11-07 Tyco Electronics Corporation Processor heat sink retention module and assembly
US7113406B1 (en) * 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
CN2736926Y (zh) 2004-10-09 2005-10-26 鸿富锦精密工业（深圳）有限公司 散热器固定装置
US7647960B2 (en) * 2006-02-08 2010-01-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
US7492598B2 (en) * 2006-09-20 2009-02-17 Cisco Technology, Inc. Heatsink attachment mechanism
US20080084662A1 (en) * 2006-10-05 2008-04-10 Giga-Byte Technology Co., Ltd. Heat-dissipating device
US7729122B2 (en) * 2006-10-13 2010-06-01 Illinois Tool Works Inc. Fastener for heat sinks
US20080223567A1 (en) * 2007-03-13 2008-09-18 Robert Liang Heat Dissipating Device
US7564687B2 (en) * 2007-03-22 2009-07-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fixing base
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
US7589972B2 (en) * 2007-05-26 2009-09-15 Hon Hai Precision Ind. Co., Ltd. Electrical connector with clip mechanism
US7619892B2 (en) * 2008-02-05 2009-11-17 Malico Inc. Positioning device for heatsink
US7869217B2 (en) * 2008-09-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Toolless locking device
CN101776942B (zh) * 2009-01-13 2013-04-24 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN101825937A (zh) * 2009-03-02 2010-09-08 富准精密工业(深圳)有限公司 散热装置
JP4801758B2 (ja) * 2009-06-02 2011-10-26 富士通株式会社 電子機器および補強部品
US20110079368A1 (en) * 2009-10-06 2011-04-07 Asia Vital Components Co., Ltd. Fixing mount and thermal module thereof
CN102056458A (zh) * 2009-10-30 2011-05-11 鸿富锦精密工业（深圳）有限公司 扣具及使用该扣具的散热装置及电子装置
TWI669480B (zh) * 2019-01-22 2019-08-21 奇鋐科技股份有限公司 固定結構之承載單元及散熱總成之固定結構
US11071195B1 (en) 2020-06-05 2021-07-20 Google Llc Heatsink and stiffener mount with integrated alignment
CN115515295A (zh) * 2021-06-22 2022-12-23 华为技术有限公司 散热装置、电路模组、电子设备及电路模组的装配方法
US11991864B2 (en) 2022-03-16 2024-05-21 Google Llc Load vectoring heat sink

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US654879A (en) * 1900-02-08 1900-07-31 John Dineen Device for dispensing beverages.
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
DE4390783C1 (de) * 1992-02-28 1999-11-25 Aavid Eng Inc Vorrichtung zum Verbinden eines Kühlkörpers mit einem elektronischen Schaltkreis
JP2901867B2 (ja) * 1993-03-19 1999-06-07 富士通株式会社 ヒートシンク及びヒートシンクの取付構造
US5396402A (en) * 1993-05-24 1995-03-07 Burndy Corporation Appliance for attaching heat sink to pin grid array and socket
US5381305A (en) * 1993-12-22 1995-01-10 Wakefield Engineering, Inc. Clip for clamping heat sink module to electronic module
US5833472A (en) * 1995-07-27 1998-11-10 The Whitaker Corporation Socket assembly for an electronic package
US5734556A (en) * 1996-06-26 1998-03-31 Sun Microsystems, Inc. Mechanical heat sink attachment having two pin headers and a spring clip
US5804875A (en) * 1996-12-10 1998-09-08 Dell Computer Corporation Computer system with heat sink having an integrated grounding tab
US5847452A (en) * 1997-06-30 1998-12-08 Sun Microsystems, Inc. Post mounted heat sink method and apparatus
US5870286A (en) * 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
TW477515U (en) * 2000-05-19 2002-02-21 Yau-Huei Lai Improved heat sink holding device
TW475828U (en) * 2000-07-20 2002-02-01 Foxconn Prec Components Co Ltd Heat sink fastening device
TW491500U (en) * 2001-05-30 2002-06-11 Foxconn Prec Components Co Ltd Heat sink buckle device
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
US6644396B2 (en) * 2001-07-10 2003-11-11 Malico Inc. Anchor base for heat sink of IC chipset
TW578981U (en) * 2001-11-30 2004-03-01 Foxconn Prec Components Co Ltd Heat dissipating assembly
TW582568U (en) * 2001-12-12 2004-04-01 Hon Hai Prec Ind Co Ltd Fixing apparatus of back-plate
US6542369B1 (en) * 2001-12-27 2003-04-01 Nextronics Engineering Corp. Fixing frame for CPU cooling devices
US6728103B1 (en) * 2002-02-05 2004-04-27 Calix Networks, Inc. Heat sink with a cutout
US6570763B1 (en) * 2002-02-12 2003-05-27 Hon Hai Precision Ind. Co., Ltd. Heat sink securing means
TW532516U (en) * 2002-04-18 2003-05-11 Hon Hai Prec Ind Co Ltd Fastener for heat sink
US6639800B1 (en) * 2002-04-30 2003-10-28 Advanced Micro Devices, Inc. Heat sink subassembly
TW532714U (en) * 2002-06-28 2003-05-11 Hon Hai Prec Ind Co Ltd Position-adjusting device
US6574109B1 (en) * 2002-07-03 2003-06-03 Hon Hai Precision Ind. Co., Ltd. Retainer device for heat sink assembly
TW536121U (en) * 2002-07-26 2003-06-01 Hon Hai Prec Ind Co Ltd Retaining device
TW540988U (en) * 2002-10-04 2003-07-01 Hon Hai Prec Ind Co Ltd A heat dissipating assembly
US6859367B2 (en) * 2003-01-03 2005-02-22 Intel Corporation Heat sink attachment device
US6906923B2 (en) * 2003-03-31 2005-06-14 Intel Corporation Heat sink clip and method

Also Published As

Publication number Publication date
US20040105236A1 (en) 2004-06-03
US7277288B2 (en) 2007-10-02

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004