543134 第4頁 A7 五、發明説明（1 ) 【發明領域】 本發明係關於一種BGA錫球共面性檢測系統及方法，尤 指一種利用透明玻璃高平整度且不易變形之特性，以提供一 精確參考基準面之BGA錫球共面性檢測系統及方法。 【習知技藝說明】 一般以球柵陣列（BGA)技術構裝於電子元件之錫球檢測 方式，多藉其光學影像方式為判別基準。如第一圖所示我國 第89114431號專利案，即揭示一種BGA積體電路元件錫球檢 測方法，其步驟主要包括： 將一私準積體電路元件（圖未示）底面錫球狀態影像資料 輸入一視覺檢測機91之電腦92内作為檢測比對依據； 將複數構裝完成之積體電路元件93以底面錫球931朝 上方式陳列於一盛載盤94上，於盛載盤94上方逐一擷取各 元件93錫球931佈設狀態影像；及 由電腦92根據視覺檢測系統91擷取之錫球93ι佈設狀 態影像資料與原預設錫球佈設狀態影像資料比對，完成檢測 作業。 唯因-般電子it件外部多經樹脂或塑膠等易受溫度變化 或其他外力而撓曲變形之絕緣材料封裝（如中央處理單元晶 片）—，或直接以該等材料作為結構主體（如連接器），故當以電 子7L件之絕緣本體表面作為錫球檢測判別基準面曰夺，往往易 因絕緣本體本身受外力或熱應力之少量變形，而導致檢測結 果不精確，而於良品與不良品間產生誤判。 【發明概要】 本紙張尺度適财關家辟（⑽）543134 Page 4 A7 V. Description of the invention (1) [Field of the invention] The present invention relates to a BGA solder ball coplanarity detection system and method, especially a feature that uses the high flatness of transparent glass and is not easily deformed to provide a BGA solder ball coplanarity detection system and method for accurately referencing reference plane. [Description of Know-how] Generally, ball grid array (BGA) technology is used to detect the solder ball of electronic components, and the optical image method is often used as the criterion. As shown in the first figure, China's patent No. 89114431 discloses a method for detecting solder balls of BGA integrated circuit components. The steps mainly include: image data of the state of solder balls on the bottom surface of a private quasi-integrated circuit component (not shown). Entered into the computer 92 of a visual inspection machine 91 as the basis for detection and comparison; the integrated circuit components 93 that have been constructed in a plural number are displayed on a carrying tray 94 with the bottom solder balls 931 facing upward, and above the carrying tray 94 The 93-ball 931 deployment status images of each component are captured one by one; and the computer-operated 92 compares the solder ball deployment status image data acquired by the visual inspection system 91 with the original preset solder ball deployment status image data to complete the detection operation. Only because of the external parts of electronic components such as resin or plastic, which are susceptible to temperature changes or other external forces, they can be flexed and deformed (such as central processing unit wafers) —or directly use these materials as structural bodies (such as connections Device), so when the surface of the insulating body of the electronic 7L piece is used as the reference for the detection of the solder ball, it is often easy to cause the detection result to be inaccurate because the insulating body itself is deformed by external forces or thermal stress. Misjudgment between good products. [Summary of the invention]
tr— (請先閲讀背面之注意事項再填寫本頁) 543134 五、發明説明（2 ) 因此，本發明之主要目的係提供一種檢測結果精確可靠 之BGA錫球共面性檢測系統及方法。 本發明之次一目的係提供一種BGA錫球共面性檢測系統 及方法，其係利用透明玻璃高平整度且不f變形之特性，以 長1供精確之參考基準面。 本發明之另一目的係提供一種BGA錫球共面性檢測系統 及方法，而可縮減操作時間及節省設備成本。 為達上述目的，本發明BGA錫球共面性檢測系統及方法， 其方法包括下述步驟：提供一頂面呈水平之透明玻璃平板； 將構裝於一電子元件之複數錫球朝下置於該平板之該頂面； 水平擷取該電子元件—最外排之至少_第_錫球及該錫球於 該玻璃平板之一相對倒影之一第一影像資訊；相對該平板頂 面以一傾斜角而擷取該電子元件所有該等錫球之第二影像資 讯，將該第一及第二影像資訊經判別及運算處理，以獲得各 該錫球最低點與該平板頂面於垂直方向上之高度差，依此檢 測該等錫球之共面性。 於一較佳實施例中，該將第一及第二影像資訊經判別及 運算處理之步驟更包括：自該第一影像資訊判別該第一錫球 最低點及其於該平板之倒影最高點之位置；自該第一錫球最 低點及該倒影最高點位置計算該第一錫球最低點至該平板頂 面之一第一高度差；自該第一高度差及該傾斜角之三角函數 關係，計算該第二影像資訊中該第一錫球最低點至該平板頂 面之一第二高度差；自該第二影像資訊判別該等所有錫球最 低點位置；自該第二高度差及該第二影像資訊中該第一錫球 —_____第5 頁 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 543134 A7 -*--------B7 五、發明説明^—) "—"' --- 最低點位置’計算該平板頂面位置；自該平板頂面及該第- 錫球外之其他各該錫球最低點位置，計算該第二影像資訊中 (請先閲讀背面之注意事項再填寫本頁) 第錫球外之其他各該錫球最低點至該平板頂面之一第三高 ^差，及自各該第三高度差及該傾斜角之三角函數關係，計 算第一錫球外之其他各該錫球最低點與該平板頂面於垂直方 向上之一第四高度差。 【圖式簡單說明】 有關本發明之其他特徵及優點，及為達上述目的、特徵 =採用的技術手段及其功效’將在以τ配合參考圖式之較佳 實施例詳細說明如下·· 第一圖係一習知BGA積體電路元件錫球檢測方法之配置 側視示意圖； 第二圖係本發明BGA錫球共面性檢測系統及方法之一較 佳實施例之系統配置示意圖； 第三圖係第二圖中之一電子元件之立體示意圖； -第四圖係第二圖中―第—影像判別單元之顯示器榮幕所 示之視窗内容示意圖；及 第五圖係與第四圖類似之-示意圖，其中—定位點經使 用者之操控而移動至一最外排錫球最低點處； 第六及第七圖係分別自第一、第二影像擷取單元所得影 像之對照示意圖’以顯示二者之幾何對應關係，其中第六圖 右側之錫球81b僅係為便於比對解說，而實質未為第一料 掏取早兀所榻取，且第六、七圖中第二影像擷取裝置實質係 係自圖中水平旋轉九十度；及 ------------頁 本紙張尺度翻巾_家鮮(CNS) Α4^ (210Χ297^ίΓ ------- 543134 A7 B7 五、發明説明 ， 第八圖係本發明之主要實施步驟流程圖。 【較佳實施例詳細說明】 本發明BGA錫球共面性檢測系統及方法之較佳實施例， 其系統架構係如第二圖所示，而主要包括一透明破璃平板1、 一第一影像擷取單元2、一第一影像判別單元3、一第二影像 擷取單元4、第二影像判別單元5、一運算單元6，及一供該 玻璃平板1及其他構件設置之機台7，而用以檢測第三圖所 示一以球柵陣列（BGA)技術構裝於一電子元件8之複數錫球 81。本貫轭例中電子元件8係以一電腦中央處理單元（CM)晶 片為例，然不限於該應用。 透明玻璃平板1具有上、下互呈平行之一頂面n及一 底面12，而以其外緣下側固定支撐而水平設置於該機台7上 之一活動框座71，活動框座71則可受一步進機構（圖未示） 之帶動，可於機台7上連同玻璃平板丨依一預設間距水平步 進位移，本實施例中該步進間距係設定為電子元件8上任相 鄰兩排錫球81(如第三圖中一最外排u與其一較内排L2兩 排錫球）之球心水平設計間距。玻璃平板丨之頂面u則供電 子元件8之複數錫球81朝下承載設置，使電子元件8亦可隨 玻璃平板1而同步水平移動。 第一影像擷取單元2主要具有一第一光源21、一反射鏡 22及一第-影像擷取裝f 23。第一光源、21係固設於玻璃平 板1下方之機台7對應處，而可產生向上通過玻璃平板j之 複數光束，以提供第-影像掏取裝置23#|取影像所需足夠亮 度。反射鏡22係固定於玻璃平板丨外側而呈“度斜角設置= 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公复） (請先閲讀背面之注意事項再填寫本頁) 、一-T· 第7頁 543134 B7 五、發明說明（ 第一影像擷取裝詈？ 1目丨丨& 置23則為一固設於反射鏡22上方之數位式 攝影機。藉此 人 j 3頂面1 _ σ苐四圖所示，玻璃平板1對應之一側邊 外排l 11上方之成排錫球…（即位於電子元件8於該侧最 為1其他如較内排L2及其他排之錫球81b影像則相對 ^而不易獲仔）’及該等錫球^於該側邊13形成之複 $錫球倒影81a，，將共同經反射鏡22向上垂直反射而由第一 二像擷取袈置23所接收成像，該等影像資訊並進—步輸出至 第一影像判別單元3。 本實施例中第—影像判別單元3及運算單元6係共同建 置於-與第-影像擷取裝置23電性連接之電^卜其中第 一衫像判別早兀3主要包含該電腦31之一顯示器3U，而可 、左電月自31内特定軟、硬體之配合運作，將於攝影機23成像 之影像同步顯示於顯示器311螢幕，運算單元6則為安裝儲 存於電腦31之特定運算程式。配合第四、五圖所示，顯示器 311螢幕同時顯示_可由使用者透過鍵盤（圖未示）或其他輸 入設備控制於一定視窗範圍内移動之兩正交定位軸312、 ?3，於該等定位車由312、313相交處並形成一定位點314。 藉此，使用者可於顯示器311螢幕上以肉眼判斷任一錫球^ 最低點811a位置，並操縱鍵盤令定位點314矛多動至該位置， 則該最低點811a相對一預設第一座標系統（χι、γι、ζι)之座 標即可自動定出，同理錫球倒影81a，之最高點8山，位置及 座標亦可獲得，其中第一座標系統（χι、γι、21)之ζι轴係垂 直向上而X1 Y1、Z1軸則互呈正交。錫球81a最低點811a 及錫球倒影81a’最高點811a，座標皆獲得後，經運算單元、 第8頁 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公董） 543134tr— (Please read the notes on the back before filling this page) 543134 V. Description of the invention (2) Therefore, the main purpose of the present invention is to provide a BGA solder ball coplanarity detection system and method with accurate and reliable detection results. A second object of the present invention is to provide a BGA solder ball coplanarity detection system and method, which utilizes the characteristics of high flatness of transparent glass and no f-deformation, with a length of 1 for an accurate reference datum. Another object of the present invention is to provide a BGA solder ball coplanarity detection system and method, which can reduce operation time and save equipment cost. In order to achieve the above object, the BGA solder ball coplanarity detection system and method of the present invention include the following steps: providing a transparent glass flat plate with a horizontal top surface; and placing a plurality of solder balls arranged on an electronic component face down On the top surface of the plate; horizontally fetch the electronic components—at least the __th solder ball in the outermost row and one of the first image information of the solder ball ’s relative reflection on the glass plate; relative to the top surface of the plate, The second image information of all the solder balls of the electronic component is captured at an oblique angle, and the first and second image information are determined and processed to obtain the lowest point of each solder ball and the top surface of the plate. The height difference in the vertical direction is used to detect the coplanarity of the solder balls. In a preferred embodiment, the step of determining and calculating the first and second image information further includes: determining the lowest point of the first solder ball and the highest point of its reflection on the plate from the first image information. A first height difference from the lowest point of the first solder ball and the highest point of the reflection to a first height difference between the lowest point of the first solder ball and the top surface of the flat plate; a trigonometric function from the first height difference and the tilt angle Relationship, calculate a second height difference between the lowest point of the first solder ball in the second image information and the top surface of the flat plate; determine the lowest point positions of all the solder balls from the second image information; from the second height difference And the first solder ball in the second image information — _____ Page 5 This paper size applies to China National Standard (CNS) A4 (210X297 mm) 543134 A7-* -------- B7 V. Description of the invention ^ —) " — " '--- The lowest point position' calculates the top surface position of the plate; from the top surface of the plate and the lowest point positions of the solder balls other than the-solder ball, calculate the first Second image information (Please read the precautions on the back before filling this page) Calculate the third height difference between the lowest point of the solder ball to the top surface of the flat plate and the trigonometric function relationship between the third height difference and the inclination angle to calculate the other solder balls outside the first solder ball. A fourth height difference between the lowest point and a top surface of the flat plate in a vertical direction. [Brief description of the drawings] With regard to other features and advantages of the present invention, and to achieve the above-mentioned object, the feature = the technical means adopted and its effects' will be described in detail in the preferred embodiment with reference to the drawings in conjunction with τ. A diagram is a schematic side view of a configuration of a conventional BGA integrated circuit component solder ball detection method; a second diagram is a system configuration diagram of a preferred embodiment of the BGA solder ball coplanarity detection system and method of the present invention; the third The figure is a schematic perspective view of one of the electronic components in the second figure;-The fourth figure is a schematic view of the contents of the window shown in the second picture-the first screen of the image discrimination unit; and the fifth figure is similar to the fourth figure -A schematic diagram, in which-the positioning point is moved to the lowest point of an outermost solder ball by the user's control; the sixth and seventh diagrams are comparison diagrams of the images obtained from the first and second image capturing units, respectively. To show the geometric correspondence between the two, the solder ball 81b on the right side of the sixth picture is only for the convenience of comparison and explanation, but it is not the first material to be taken early, and the second one in the sixth and seventh pictures Image capture The essence is the horizontal rotation of 90 degrees from the figure; and ------------ page size paper towel _ 家 鲜 (CNS) Α4 ^ (210Χ297 ^ ίΓ ------ -543134 A7 B7 5. Description of the invention, the eighth diagram is a flowchart of the main implementation steps of the present invention. [Detailed description of the preferred embodiment] The preferred embodiment of the BGA solder ball coplanarity detection system and method of the present invention, its system The architecture is shown in the second figure, and mainly includes a transparent broken glass plate 1, a first image capture unit 2, a first image determination unit 3, a second image capture unit 4, and a second image determination unit. 5. An arithmetic unit 6 and a machine 7 for setting the glass plate 1 and other components, and used to detect a plurality of electronic components 8 assembled with a ball grid array (BGA) technology as shown in the third figure Solder ball 81. The electronic component 8 in the present yoke example is a computer central processing unit (CM) chip as an example, but it is not limited to this application. The transparent glass flat plate 1 has a top surface n and a top surface parallel to each other. The bottom surface 12 is a movable frame base 71 and a movable frame base which are horizontally arranged on the machine 7 with fixed support on the lower side of its outer edge. 71 can be driven by a stepping mechanism (not shown), and can be horizontally stepped with a predetermined distance along with the glass plate on the machine 7; in this embodiment, the stepping distance is set as the electronic component 8 The horizontal design distance between the centers of the two adjacent rows of solder balls 81 (such as the outermost row u and the inner row L2 two rows of solder balls in the third figure). The top surface u of the glass plate 丨 is the plural number of the electron donor element 8. The solder ball 81 is mounted downward, so that the electronic component 8 can also move synchronously and horizontally with the glass plate 1. The first image capturing unit 2 mainly includes a first light source 21, a reflecting mirror 22, and a first-image capturing device. f 23. The first light source 21 is fixed at the corresponding position of the machine 7 under the glass plate 1, and can generate a plurality of light beams passing upward through the glass plate j to provide a first-image extraction device 23 # | Enough brightness. Reflector 22 is fixed on the outside of the glass plate and has a "degree bevel setting = This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 public copy) (Please read the precautions on the back before filling this page)." -T · Page 7 543134 B7 V. Description of the invention (the first image capture device? 1 head 丨 丨 & Set 23 is a digital camera fixed above the reflector 22. This person j 3 top Face 1 _ σ 苐 As shown in the four figures, the glass plate 1 corresponds to a row of solder balls above one side of the outer row l 11 ... (that is, the electronic component 8 is on this side and the other one is the inner row L2 and the other rows. The image of the tin ball 81b is relatively ^ difficult to obtain) and the complex tin ball reflection 81a formed by the tin balls ^ on the side 13 will be reflected vertically upward through the mirror 22 and captured by the first two images. The image received by the device 23 is taken, and the image information is further output to the first image discriminating unit 3. In this embodiment, the first-image discriminating unit 3 and the arithmetic unit 6 are co-built in-and-image capturing Device 23 is electrically connected electrically. The first shirt image is distinguished as early as 3, which mainly includes the computer 31. The display is 3U, and can cooperate with specific software and hardware within Zuo Dianyue 31. The image formed by the camera 23 is displayed on the display 311 screen synchronously, and the arithmetic unit 6 is a specific arithmetic program installed and stored in the computer 31. In accordance with the fourth and fifth figures, the display 311 screen simultaneously displays _ two orthogonal positioning axes 312,? 3 that can be controlled by the user through a keyboard (not shown) or other input devices to move within a certain window range. The positioning vehicle consists of the intersection of 312 and 313 and forms a positioning point 314. This allows the user to judge the position of any solder ball on the display 311 with the naked eye ^ The lowest point 811a and use the keyboard to make the positioning point 314 move more quickly At this position, the coordinates of the lowest point 811a relative to a preset first coordinate system (χι, γι, ζι) can be automatically determined. Similarly, the solder ball reflection 81a, the highest point is 8 mountains, and the position and coordinates can also be obtained. Among them, the ζι axis of the first coordinate system (χι, γι, 21) is vertically upward and the X1 Y1 and Z1 axes are orthogonal to each other. The lowest point 811a of the solder ball 81a and the highest point 811a of the solder ball reflection 81a, the coordinates are obtained After Unit, page 8 paper scale applicable to Chinese National Standard (CNS) A4 size (210X297 male directors) 543 134
A7 B7 五、發明説明（6 ) 簡單運算即可獲得該最低點811與最高點811a，中央處，即虛 擬之玻璃平板1頂面π對應點111 a座標（「虛擬」一詞表由 於玻璃之透明特性，玻璃平板1頂面Η包括該對應點ma 實質並未成像顯示於顯示器31丨螢幕，故於圖中以虛線表 不）並進而運鼻最低點811至玻璃平板1頂面11對應點 之高度差（以h表之，即Z1軸座標差值）。 再如第二、六圖所示，第二影像擷取單元4主要具有一 第二光源41及一第二影像擷取裝置42。第二光源41係固設 於玻璃平板1下方之機台7對應處，而可與水平面依一預定 俯角0產生斜上通過玻璃平板丨之複數光束，以提供第二影 像擷取裝置42擷取影像所需足夠亮度。本實施例中第二影像 擷取裝置42為一固設於玻璃平板丨下方之數位攝影機，當上 述活動框座71帶動玻璃平板丨及電子元件8依任相鄰兩排錫 球81中央間距而水平步進位移時，第二影像擷取裝置42即 同樣依特定俯角0逐一接收由第二光源41產生而經各錫球Η 反射之光束而成像，並將該等影像資訊輸出至第二影像判別 單元5。 本實施例中第二影像判別單元5係建置於電腦31之一 影像判別軟體，其係依各錫球81最低點處81丨光線反差最大 之原理，就來自第二影像擷取裝置之各排錫球81(包括位於 電子70件8最外排L1之錫球81a、較内排L2之錫球81b及 其他各排錫球）影像資訊，而自動定出錫球81a、8lb最低點 811a、811b相對一第二座標系統（Χ2、γ2、Z2)之座標，並將 该座標輸出至運算單元6以供進一步運算，其中如第上 (請先閲讀背面之注意事項再填寫本頁) 訂丨 參- 五、發明説明（7 ) 圖所示’第二座標系統〇(2]2、22)之^軸係與第二影像擷 取裝置42至各錫球81a、81b最低點811a、8u^_假想線 L3及L4重合，而與水平面亦呈一俯角0。 配合第人圖所示之主要步驟流程，本發明之執行步驟係 先如第四、五圖所述，藉第一影像擷取單元2、第一影像判 別單元3及運算單元6之配合運作，獲得電子元件8最外排 L1之任一錫球81a最低點811a至玻璃平板丨頂面n對應點 Ula之高度(以ha示之)後，運算單元6可藉⑹咖㈣ 之三角函數關係、進而求得第六圖巾da值。而該dam就第七 圖所示自第二影⑽取裝置42所獲得之影像而言，即為同一 錫球81a最低點811a至虛擬玻璃平丨（因自第二影像掘取 震置42角度視之玻璃平板】亦因為透明而未成像）頂面^對 應點111a沿Z2軸方向之座標高度差，故配合前述第二影像 判別單元5所自動定出錫球81a最低點⑴“目對第二座標系 統之座標’經運算單元6之運算’即可自錫球81a最低點8山 於Z2軸向座標及da值之差值’反推出第七圖中虛擬玻璃平 板1頂面11對應點llla於22軸向上之座標。 ，而後，基力玻璃平板之材料平整特十生，可直接假設玻璃 平板1之頂面11為-理想真平面，故第七圖中虛擬玻璃平板 1頂面11上任一點於Z2軸向上之座標完全相同，故可令該 頂面11上對應另一位於電子元件"交⑽L2之一錫球_ 最低點811b之對應點丨丨化與上述求得之點丨丨“之z2座標 相同’配合前述第二影像判別單元5可自缺出錫球⑽最 低點811 b相對第二座標系統之座標，經運算單元6之運算， 第10頁 本紙張尺度適财關家鮮（_ A4規格(^^97公釐) 543134 A7 B7 五、發明説明（8 ) "—"' ~— 即可求得錫球81b最低點811b及頂面丨丨對應點⑽於22 軸向座標差值db 〇 獲得上述差值db後，如第六圖所示，運算單元6可再 藉月J述hbxcos 0 -db之二角函數關係，反求得錫球训最低 點8Ub至玻璃平板！頂自u高度沾值，故可同理依上述步 驟自動運算求得電子元件8最外排L1其他锡球…、較内排 L2其他錫球81b、及其他内排任一錫球81至玻璃平板（頂面 11高度h值’依此作為判定電子元件6各錫球61構装成品 共面度良率依據。 〇 惟須指明者，即如前述，錫球81b因位於電子元件8内 排而為最外排絲81a所_，故其影像實f並無法為第一 影像擷取單元2所攝取而出現於第一影像判別單元㈣窗内， 於第六圖中將錫球81b示出僅係便於與錫球…比對及解說， 而不代表自第-影像判別單元3視窗可觀得該内排錫球训。 此外，本實施射第―、第二影像錄單元2、4可為 其他任何適當光學成像裝置 一 I尸π取代第一、第二影像判別單 ::5亦可改以其他人工或自動而可用之影像判別裝置及技 之，·尤其重要者’第一、第二影像判別單元3、5及運算 ^ 6不㈣本實_所舉係由單-電料完成，而亦可為 其他設備或若干分開獨立運作 恭⑽… 逆作之衷置所共同完成’而皆屬冰 發月之貫質技術範轉。 於本案另一實施例中，係先求 夕沉士 μ丄。 > 印电子凡件8最外排L1 之所有錫球gla之ha值後，再依同理 一 u里來出電子兀件8位於同 列（如第三圖所示们列）上較 u上早又内排L2對應之各錫球81b及 1----—-：--一 —__第 11 頁 本紙張尺度適财_家標準（哪）A4規格⑵0X297公酱）A7 B7 V. Description of the invention (6) The simple point can be used to obtain the lowest point 811 and the highest point 811a, in the center, which is the coordinate 111a of the point π on the top surface of the virtual glass plate 1 (the word "virtual" because of the glass Transparency, the top surface of glass plate 1 includes the corresponding point ma, which is not actually displayed on the screen of the display 31, so it is indicated by a dotted line in the figure), and then the lowest point 811 to the corresponding point of the top surface 11 of glass plate 1 The height difference (in h, that is, the Z1 axis coordinate difference value). As shown in the second and sixth figures, the second image capturing unit 4 mainly includes a second light source 41 and a second image capturing device 42. The second light source 41 is fixed at the corresponding position of the machine 7 under the glass plate 1 and can generate a plurality of light beams that pass through the glass plate 丨 obliquely upward at a predetermined depression angle 0 with the horizontal plane to provide a second image capture device 42 for capturing The image needs sufficient brightness. In this embodiment, the second image capturing device 42 is a digital camera fixed below the glass plate. When the movable frame base 71 drives the glass plate and the electronic component 8 horizontally according to the central distance between the two adjacent rows of solder balls 81, During the displacement, the second image capturing device 42 also receives the light beams generated by the second light source 41 and reflected by the tin balls 成像 one by one according to a specific depression angle 0, and outputs the image information to the second image discrimination unit. 5. In this embodiment, the second image discriminating unit 5 is built in one of the computer 31 image discriminating software, and it is based on the principle of the highest light contrast at the lowest point 81 of each solder ball 81. Row of solder balls 81 (including solder balls 81a in outermost row L1 of electronic 70 pieces, solder balls 81b in inner row L2 and other rows of solder balls) image information, and automatically determine the lowest point of solder balls 81a, 8lb 811a And 811b are relative to the coordinates of a second coordinate system (X2, γ2, Z2), and the coordinates are output to the arithmetic unit 6 for further calculation, which is as above (please read the precautions on the back before filling this page).丨 Reference-V. Description of the invention (7) The axis system of the second coordinate system 0 (2) 2, 22) and the second image capturing device 42 to the lowest points 811a, 8u of each solder ball 81a, 81b ^ _ The imaginary lines L3 and L4 coincide, and they are at a depression angle 0 with the horizontal plane. In accordance with the main step flow shown in the second figure, the execution steps of the present invention are performed by the cooperation of the first image acquisition unit 2, the first image discrimination unit 3, and the operation unit 6 as shown in the fourth and fifth diagrams. After obtaining the height (shown by ha) of the lowest point 811a of any of the solder balls 81a of the outermost row L1 of the electronic component 8 to the corresponding point Ula of the top surface n of the glass plate, the computing unit 6 may use the trigonometric relationship of Then, the sixth figure da value is obtained. As for the image obtained from the second image capturing device 42 shown in the seventh figure, the dam is the lowest point 811a of the same solder ball 81a to the level of the virtual glass. Seeing the glass flat plate] It is also transparent because it is not imaged.) The height difference between the coordinates of the top surface ^ corresponding point 111a along the Z2 axis direction, so the lowest point of the solder ball 81a is automatically determined by the second image determination unit 5 above. The coordinates of the two-coordinate system 'calculated by the arithmetic unit 6' can be used to infer the corresponding point of the top surface 11 of the virtual glass flat plate 1 in the seventh figure from the lowest point 8 of the solder ball 81a to the difference between the axial coordinate of Z2 and the da value ' The coordinates of llla on the 22 axis. Then, the material of the base glass plate is flat for ten years. It can be directly assumed that the top surface 11 of the glass plate 1 is an ideal true plane, so the top surface 11 of the virtual glass plate 1 in the seventh figure The coordinates of any of the points on the Z2 axis are exactly the same, so that the top surface 11 can correspond to another solder ball located at the electronic component " Intersection L2 _ the corresponding point of the lowest point 811b 丨 丨 and the point obtained above 丨丨 "Z2 coordinates are the same" with the aforementioned second image discrimination The lowest point 811 b of the tin ball ⑽5 from the missing element can be calculated from the coordinate of the second coordinate system of the second coordinate system, calculated by the arithmetic unit 6, page 10. This paper size is suitable for wealth and family (_ A4 size (^^ 97mm) 543134 A7 B7 V. Description of the invention (8) " — " '~ — The lowest point 811b and top surface of the solder ball 81b can be obtained. The corresponding point is 22 the 22 axis coordinate difference value db. 〇 The above difference value db is obtained. Then, as shown in the sixth figure, the arithmetic unit 6 can further describe the dihedral function relationship of hbxcos 0 -db by month J, and inversely obtain the lowest point of tin ball training from 8Ub to the glass plate! In the same way, according to the above steps, the other solder balls of the outermost row L1 of the electronic component 8 are obtained, the other solder balls 81b of the inner row L2, and any other solder balls 81 of the inner row 81 to the glass plate (the height h of the top surface 11 ' This is used as the basis for judging the yield of the coplanarity of the finished product of each solder ball 61 of the electronic component 6. 〇 However, it must be specified, that is, as mentioned above, the solder ball 81b is located in the inner row of the electronic component 8 and is the outermost wire 81a. Therefore, its image f cannot be captured by the first image capturing unit 2 and appears in the window of the first image discriminating unit. The lieutenant solder ball 81b is shown only for the convenience of comparison and explanation with the solder ball ... It does not mean that the in-line solder ball training can be observed from the 3rd window of the first-image discrimination unit. In addition, the first and second images are shot in this implementation. The recording units 2 and 4 can be any other suitable optical imaging device. Instead of the first and second image discrimination list:: 5, it can also be replaced with other manual or automatic and available image discrimination devices and techniques. It is particularly important. The 'first and second image discriminating units 3, 5 and operation ^ 6 are not true. The examples are completed by single-electric materials, but also can be operated independently for other equipment or several separate ... The homes are completed together, and all belong to Bingfayue's consistent quality technology transfer. In another embodiment of the present case, the first step is to find the sun sinker μ 丄. > After the ha values of all the solder balls gla in the outermost row L1 of the printed electronic parts 8, the electronic parts 8 are located in the same row (as shown in the third figure) in the same way. Each of the solder balls 81b and 1 corresponding to the inner row L2 has long been in line —--------: --—————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————————— Page 11
、τ_ (請先閲讀背面之注意事項再填寫本頁) 543134 五、發明説明（ 其他排各對應錫球81之h值。其與上述較佳實施例差別者， 在於其第二影像擷取單元4係自第二圖所示該較佳實施例設 置位置水平旋轉九十度，於該位置下第二影像擷取裝置“所 擷取之同列上錫球81 a、錫球81 b及其他排對應錫球8丨之 Θ角皆相同，故藉此可省去令活動框座71帶動玻璃平板】及 電子元件8依相鄰兩排錫球8丨間距而水平步進位移之步驟， 而可更快速獲得電子元件8最外排L1錫球81a以外之各排錫 球之h值。 藉上述系統及運作步驟，本發明利用透明玻璃高平整度 且不易變形之材料特性，提供一趨近真平面之電子元件bga 錫球構裝咼度參考基準面，使錫球共面性檢測結果更屬可靠 精確，而不致於良品與不良品間產生誤判。再者，該透明玻 璃於一機台獲得其頂面相對一預設座標系統之座標並予儲存 後，亦可直接裝設使用於其他同型機台，而可直接讀取上述 頂面座標而無須再行反覆量測，故可大幅縮減整體檢測時間 並省略其他機台上如第一影像擷取單元等設備之設置成本。 惟，上揭圖式及說明，僅為本發明之實施例而已，非為 限定本發明之實施；大凡熟悉該項技藝人仕，依本發明特徵 範疇所作其他等效變化或修飾，皆應涵蓋在以下本案之申請 專利範圍内。 第12頁 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 、^τ— 543134 A7 B7 五、發明説明（10 元件符號對照表： 1… 玻璃平板 2… 第一影像1 3··. 第一影像判別單元 4". 第二影像导 5 第二影像判別單元 6 計算單元 7 機台 8 電子元件 81 錫球 11 頂面 12 底面 71 框架 L1 最外排 L2 較内排 21 第一光源 22 反射鏡 23 第一影像擷取裝置 81a、 81 b 錫球 81a， 錫球倒影 31 電腦 311 顯示器 312、 313定位軸 314 定位點 811a 、811a’、811b 錫球最低點 111a 頂面對應點 41 第二光源 42 第二影像擷取單元 L3、 L4 假想線 (請先閲讀背面之注意事項再填寫本頁) 第13頁 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐）Τ_ (Please read the notes on the back before filling this page) 543134 V. Description of the invention (the other rows correspond to the h value of the solder ball 81. The difference from the above-mentioned preferred embodiment lies in its second image capture unit Series 4 is rotated 90 degrees horizontally from the setting position of the preferred embodiment shown in the second figure. At this position, the second image capturing device "captured on the same row of solder balls 81a, 81b and other rows The Θ angles corresponding to the solder balls 8 丨 are all the same, so the step of horizontally shifting the electronic components 8 according to the distance between the two adjacent rows of solder balls 8 丨 can be omitted. The h value of each row of solder balls other than the outermost L1 solder ball 81a of the electronic component 8 is obtained more quickly. With the above system and operation steps, the present invention utilizes the high flatness of the transparent glass and the material characteristics that are not easily deformed to provide a near-true Planar electronic component bga solder ball mounting reference degree reference plane, making the solder ball coplanarity test result more reliable and accurate, without causing misjudgment between good and bad products. Furthermore, the transparent glass was obtained on a machine Its top surface is relative to a preset coordinate system After the coordinates are stored, they can also be directly installed and used on other machines of the same type, and the above-mentioned top coordinates can be directly read without repeated measurement. Therefore, the overall inspection time can be greatly reduced and other machines can be omitted. The installation cost of an image capture unit and other equipment. However, the figures and descriptions above are only examples of the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art should follow the characteristics of the present invention. All other equivalent changes or modifications should be covered by the scope of the patent application in the following case. Page 12 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out This page), ^ τ— 543134 A7 B7 V. Description of the invention (10 component symbol comparison table: 1… glass plate 2… first image 1 3 ··. First image discrimination unit 4 ". second image guide 5 second Image discriminating unit 6 Computing unit 7 Machine 8 Electronic component 81 Solder ball 11 Top surface 12 Bottom surface 71 Frame L1 Outer row L2 Inner row 21 First light source 22 Reflector 23 First image capture Set 81a, 81 b solder ball 81a, solder ball reflection 31 computer 311 display 312, 313 positioning axis 314 positioning point 811a, 811a ', 811b lowest point of the solder ball 111a top surface corresponding point 41 second light source 42 second image capturing unit L3, L4 imaginary lines (please read the precautions on the back before filling this page) Page 13 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)