TW538073B - Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same - Google Patents

Abstract

An aqueous dispersion of the invention has conductive microparticles and organic particles dispersed in an aqueous medium and can form a conductive layer of a volume resistivity of for example 10<-4> Omega.m or less by electrodeposition. A circuit board of the invention is equipped in an insulating layer and a conducting layer, which includes conducting through parts that pass through the insulating layer, and is favorably manufactured by the invention's method that includes an electrodeposition using an aqueous dispersion of the invention as a electrodeposition solution and using the conductive foil as one of the electrodes after closing the openings at one end of the through holes formed on the insulating layer by means of a conductive foil. A multilayer wiring board of the invention is equipped in a core wiring substrate, having substrate wiring layers that are mutually connected electrically formed on both surfaces of an insulating substrate, an insulating layer that is laminated onto at least one of the surfaces of the core wiring substrate, a wiring layer that is formed on the insulating layer, and interlayer shorting parts that pass through the insulating layer and electrically connect the wiring layer to the abovementioned substrate wiring layer. These interlayer shorting parts are comprised of conductors formed by electrodeposition using an aqueous dispersion of the invention as an electrodeposition solution. Since the conductive layer or the conductor is formed by electrodeposition, the productivity is good and the connection reliability is high.

Description

538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

A _ B7 V. Description of the Invention (1) Technical Field The present invention relates to the formation of an aqueous dispersion of a conductive layer, a conductive layer formed from the aqueous dispersion, an electronic component provided with the conductive layer, and a device formed using the conductive layer. A circuit board with a conductive layer formed using an aqueous dispersion and a method for manufacturing the same, a multilayer wiring board and a method for manufacturing the same. BACKGROUND ART Conventionally, one of the methods for forming a conductive layer such as an electrode or a wiring pattern on a substrate is a metal plating method. In addition, other methods of forming the conductive layer include, for example, applying a conductive paste in which a conductive powder is dispersed in a liquid thermosetting resin material by a method such as coating or printing to adhere the conductive paste to a substrate, and then heat curing the resin. Methods. In addition, Japanese Patent Application Laid-Open No. 9- 1 3489 1 discloses that a metal ultrafine particle dispersion liquid that does not uniformly disperse metal ultrafine particles in an organic dispersion medium is coated on a semiconductor substrate, and the organic ultrafine particles are fused while being heated to melt the metal ultrafine particles. Thin film formation method. In recent years, as electronic devices have been required to be highly functional and miniaturized, electronic components with a high degree of integration and a large number of electrodes have been used, and such electronic components have to be mounted at high density. Therefore, the wiring board for electronic parts or the wiring board for mounting electronic parts is a single-sided printed wiring board formed by forming a wiring layer on only one side of an insulating substrate, or a single-sided or double-sidedly laminated insulating layer and wiring of the substrate The multilayer printed wiring board formed by layers replaces the two-sided printed wiring boards formed by wiring layers on both sides of the substrate. In the past, a method for manufacturing a multilayer printed wiring board, for example, formed a plurality of thick-core wiring substrates formed by insulating two sides with wiring layers electrically connected to each other, -4------------- f-- ------ Order --------- Line · (Please read the notes on the back before filling this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A 'B7 V. Invention Description ( 2) The method of laminating alternately with a thermosetting resin prepreg board, thermocompression bonding, and then laminating most thick core wiring substrates with an insulating layer (hereinafter referred to as "lamination pressing method") is the mainstream. In this laminated pressing method, in order to electrically connect the wiring layers between adjacent thick-core wiring substrates, an interlayer short-circuit portion (bottom hole and non-through hole) extending only in the thickness direction of the insulating layer passing through the wiring layer cannot be formed. However, it is necessary to form an interlayer short-circuit portion (through-hole) extending through the entire thickness of the wiring board, so it is difficult to form a high-density wiring layer. Therefore, recently, a method for manufacturing a multilayer wiring board having a high-density wiring layer, such as a layer-up method of sequentially forming an insulating layer and a wiring layer on a thick-core wiring substrate, has been proposed. According to this build-up method, the electrical connection between the wiring layers can be performed by the short-circuit portion extending only in the direction of the thickness of the insulating layer between the wiring layers, so that a high-density wiring layer can be formed. Specifically, this layer-increasing method is to form an insulating layer having a through hole corresponding to an interlayer short-circuit portion (a via hole) that must be formed on the surface of a thick-core wiring substrate, and then form an interlayer short-circuit portion in the through-hole of the insulating layer. At the same time, a conductive layer is formed on the surface of the insulating layer, and the target multilayer wiring board can be obtained by repeating this step a predetermined number of times. The above-mentioned method for forming an insulating layer having a through-hole on the surface of a thick-core wiring substrate includes, for example, applying a liquid radiation-curable resin material to the thick-core wiring substrate, and then performing an exposure process and a development process on the coating film to have A method of insulating a through-hole corresponding to a short-circuit portion (a via hole) of a target by applying a liquid thermosetting resin material or arranging a thin sheet of thermosetting resin material on the surface of a thick core substrate and subjecting it to heat treatment Form an insulation layer, this paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) -------------------- Order · ----- --- (Please read the precautions on the back before filling out this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 B7 V. Description of the invention (3) Interlayer short circuit between the formation and purpose of the insulating layer with laser irradiation How to deal with holes, etc. The method of forming a conductor on the inner surface of the through hole of the insulating layer, for example, depositing metal on the inner surface of the through hole of the insulating layer to form gold, and using the metal thin film as an electrode to deposit a metal having a thickness of a metal shape by an electroplating method A method for forming a conductive body composed of layers by chemically depositing a metal on the inner surface of a through-hole of an insulating layer to form a conductive body composed of a layer having a desired thickness. For example, the above-mentioned conductive paste is printed by screen printing. A method of filling the through-holes of the insulating layer with a hardening treatment to form a conductive body in which a conductive powder is dispersed in a thermosetting tree is known. However, the above-mentioned plating method is based on the growth rate of the metal ion plating film. Therefore, a conductive layer having a thickness (for example, a film thickness of 10 // m or more) is sufficient as the conductive layer of the above through-hole or via hole, or the above-mentioned interlayer short-circuit portion. A thick metal layer requires a considerable time, and therefore cannot be productive. In particular, in the above-mentioned build-up method, each time an insulating layer is formed, an interlayer short-circuiting portion is formed on the insulating layer through the thickness direction, and the slow deposition rate of the plated metal greatly affects the productivity. When a conductive paste or a metal ultrafine particle dispersion is used to form a conductive layer by painting or the like, it is difficult to precisely control the thickness of the prepared conductive layer and the position where the conductive layer is formed. In particular, a conductive paste composed of a resin and a conductive material generally has a high viscosity (for example, P a · s at 25 ° C), and it is difficult to form a conductive layer in terms of position or shape. When the diameter of the through-hole of the insulation layer is small (for example, the penetration through the metal thin film is formed by the metal film printing method of the electroplating method, the film is slowly formed or when the shape is full, the shape must be high. , The sexual powder of printed layer 1 0 0 into high-precision 1 0 0 -------------------- Order --------- line # (Please Please read the precautions on the back before filling this page) 538073 ___ B7___ V. Description of the invention (4) // m or less), it is difficult to fill this high-viscosity conductive paste into the through-hole. Reliable multilayer wiring board. (Please read the precautions on the reverse side before filling out this page) Although the method described in JP-A-Hei 9-1 3 4 8 9 1 can reduce the viscosity of metal ultrafine particle dispersions, it does not contain resin components. When the conductive layer is thick, cracks may occur in the conductive layer, and the adhesion of the conductive layer to the substrate is also low. An object of the present invention is to provide a conductive dispersion layer that can form a conductive layer with high accuracy by an electrode deposition method to form an aqueous dispersion, a conductive layer formed from the aqueous dispersion, and an electronic part having the conductive layer and Circuit board. Another object of the present invention is to provide a method for producing a circuit board with high efficiency and high precision, which comprises the step of forming the conductive layer using the above-mentioned aqueous dispersion for forming a conductive layer for an electrode deposition solution. Another object of the present invention is to provide a multilayer wiring board having high productivity and high connection reliability, and a method for manufacturing the same. Disclosure of the Invention Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, according to the present invention, an aqueous dispersion for forming a conductive layer, a conductive layer, an electronic component, a circuit board and a manufacturing method thereof, and a multilayer wiring board and a manufacturing method thereof can be provided according to the present invention. Method to achieve the above purpose. (1) An aqueous dispersion for forming a conductive layer, which is characterized by dispersing conductive fine particles having a number average particle diameter of 1 // m or less and organic particles composed of at least one of a polymerizable compound and a polymer in an aqueous medium. In this case, a conductive layer can be formed by electrode deposition. This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) A7 B7_____ V. Description of the invention (5) (2) The aqueous dispersion for forming the conductive layer according to the item (1) above, wherein the volume ratio of the conductive fine particles to the organic particles is 99.9: 1 to 4:60. (3) The aqueous dispersion for forming the conductive layer according to the above item (1), which is a conductive fine particle dispersion liquid in which the conductive fine particles are dispersed in an organic solvent and an organic particle dispersion liquid in which the organic particles are dispersed in an aqueous medium. Made by mixing. (4) A conductive layer characterized by being formed by electrode deposition using an aqueous dispersion of the conductive layer formed in any one of the items (1) to (3) above, with a volume resistivity of 10-4 Ω · cm or less . (5) An electronic component characterized by including a conductive layer formed by electrode deposition of an aqueous dispersion using the conductive layer according to any one of (1) to (3) above. (6) A circuit substrate characterized by having an insulating layer and an electrode deposition method by using an aqueous dispersion formed from the conductive layer according to any one of (1) to (3) as an electrode deposition solution A conductive layer is formed and includes a through conductive portion penetrating the insulating layer. (7) A method for manufacturing a circuit board, which is characterized in that the method for manufacturing a circuit board using the above-mentioned conductive layer to form an aqueous dispersion is provided with (a) a step of forming a through hole in an insulating layer, (b) The surface of one of the insulating layers includes a step of disposing a conductive foil on a part of an open end of the through hole, (c) forming the above conductive layer into an aqueous dispersion for electrode deposition -8-~~ &quot; (Please read the precautions on the back before filling this page) Order --------- Printed by the Consumers Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 B7 V. Description of the invention (6) An electrode deposition method using the conductive foil as one of the electrodes to form a through-hole conductive portion in the through-hole. (8) A method for manufacturing a circuit board, which is characterized in that the method for manufacturing a circuit board using the conductive layer for forming an aqueous dispersion of the above (1) is provided, and (a) an insulating layer is formed on a thick core wiring board for forming a conductor pattern (B) forming a pattern of the insulating layer to form an insulating layer pattern having a through hole exposing a part of the conductor pattern, and (c) electroless plating using the insulating layer pattern as a mask material A step of forming an electroless plating layer on a portion containing the above-mentioned through hole, (d) using the above-mentioned conductive layer forming aqueous dispersion solution for the electrode deposition solution, and using the conductor pattern and the electroless plating layer as one of them The electrode electrodeposition method is a step of forming a conductive layer including the through-hole conductive portion in the through-hole. (9) A method for manufacturing a circuit substrate, characterized in that the circuit substrate prepared by the method of the item (7) or (8) above is laminated in multiple layers. (10) A multilayer wiring board characterized by having a thick core wiring substrate formed by forming a substrate wiring layer electrically connected to both sides of an insulating substrate, and laminating on at least one side of the thick core wiring substrate. Layer, a wiring layer formed on this insulating layer, this wiring layer is a multilayer wiring substrate that electrically connects the substrate wiring layer and the interlayer short-circuiting portion extending through the thickness direction of the insulating layer, the interlayer short-circuiting portion is made of a tube molecular substance The conductive particles made of conductive particles are contained in the conductive system. The conductive particles of this conductive system are in accordance with China National Standard (CNS) A4 (210 X 297 mm). ----------- --------- Order --------- line (please read the notes on the back before filling this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 B7 V. Description of the invention (7) Formed by dispersing organic particles composed of at least one of a polymerizable compound and a polymer in an electrode deposition solution composed of an aqueous medium and subjecting the electrode to deposition. (1 1) The multilayer wiring board according to the item (10) above, wherein the volume fraction of the proportion of the conductive fine particles constituting the conductor in the interlayer short-circuit portion is 40 to 99%. (1 2) The multilayer wiring board according to the item (10) above, which has a thick core wiring substrate formed by forming substrate wiring layers electrically connected to each other on both sides of an insulating substrate, and laminated on the thick core wiring An insulating layer on at least one side of a substrate, and a wiring layer formed on the insulating layer. This wiring layer is a multilayer wiring substrate that electrically connects the substrate wiring layer and the interlayer short-circuiting portion extending through the thickness direction of the insulating layer. The part is composed of a conductive body made of conductive fine particles contained in a polymer substance, and the conductive fine particles of the conductive system are dispersed in an aqueous medium with organic particles made of at least one of a polymerizable compound and a polymer. In the electrode deposition solution, formed by electrode deposition, the thick-core wiring substrate has a substrate wiring layer formed by electrically connecting the two sides of an insulating substrate to each other, and a substrate extending in a thickness direction of the insulating substrate. A short-circuit part, which is composed of a conductive body made of conductive fine particles in a polymer substance, and the conductive system Electrical particles and organic particles composed of at least one of a polymerizable compound and a polymer are dispersed in an electrode deposition solution composed of an aqueous medium, and the paper is formed by electrode deposition treatment to the Chinese national standard ( CNS) A4 specification (210 X 297 mm) -10--------------------- IT --------- ^ · (Please read first Note on the back, please fill out this page again) 538073 A7 ___ B7 V. Description of Invention (8) The person who completed. (Please read the precautions on the back before filling this page) (1 3) The multilayer wiring board as described in (1 2) above, in which the proportion of conductive particles constituting the inter-layer short-circuit portion and / or the substrate short-circuit portion of the conductive particles is 4 0 ~ 9 9%. (1 4) A method for manufacturing a multilayer wiring board, which is a method for manufacturing a multilayer wiring board as described in the above item (1 0), which has the following steps: preparing an insulating substrate, which is formed on one side of the insulating substrate A thick-core wiring substrate is formed on the other surface of the insulating substrate, and is a thick-core wiring substrate made of a metal layer electrically connected to the substrate-wiring layer. The interlayer short-circuit portion formed on the substrate wiring layer corresponds to the insulating layer of the through-hole formed. The substrate wiring layer of the thick-core wiring substrate forming the insulating layer is used as a precipitation electrode, and conductive fine particles and polymerizable compounds and polymers are used. Organic particles composed of at least one of these are dispersed in an electrode deposition solution composed of an aqueous medium, and an electrode deposition process is performed to form a conductive body constituting an interlayer short-circuit portion in a through hole of the insulating layer. The method for manufacturing (1 5) the multilayer wiring board as described in (1 4) above by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, wherein the conductive fine particles of the electrode deposition liquid forming the conductive body constituting the above-mentioned interlayer short-circuit portion and the organic The volume ratio of the particles is 9 9: 1 to 4 0: 60. (16) A method for manufacturing a multilayer wiring board, which is a method for manufacturing a multilayer wiring board such as the item 12 in the scope of the patent application, which is characterized by having the following steps: preparing an insulating substrate and an insulating substrate The substrate forming material of the metal layer formed on at least the other side, the paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 538073 A7 _ B7 V. Description of the invention (9) Forming the material forming the substrate Through-holes in the thickness direction of the insulating substrate. (Please read the precautions on the back before filling this page.) The metal layer of this substrate is used as the electrode for precipitation. The conductive particles are composed of conductive particles and polymer compounds and polymers. At least one kind of organic particles is dispersed in an electrode deposition solution formed in an aqueous medium, and an electrode deposition process is performed to form a conductive body constituting an interlayer short-circuit portion in a through hole of the insulating substrate, and then the above-mentioned insulating property is formed. A substrate wiring layer is formed on one surface of the substrate, and a substrate wiring layer formed on one surface of the insulating substrate is formed; A thick-core wiring substrate formed on the other side and composed of the above-mentioned metal layer electrically connected to the substrate wiring layer. One surface of the thick-core wiring substrate is formed with an interlayer short-circuit portion that should be formed on the substrate wiring layer. Corresponding to the formed insulating layer of the through hole, the substrate wiring layer of the thick core wiring substrate forming the insulating layer is used as a precipitation electrode, and conductive fine particles are dispersed with organic particles composed of at least one of a polymerizable compound and a polymer. The step of forming an electrical conductor constituting an interlayer short-circuited portion in a through hole of the insulating layer in an electrode deposition solution formed in an aqueous medium by electrode deposition. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of the Consumer Cooperatives (1 7) The method for manufacturing a multilayer wiring board as described in (16) above, wherein the electrode deposition solution for forming the conductor constituting the interlayer short-circuiting section is formed and / or the constituent electrode forming solution is formed The volume ratio of the conductive fine particles to the organic particles of the electrode deposition solution of the conductor in the short-circuit portion of the substrate is 99.9: 1 to 4: 600, and the present invention will be described in more detail. (a) Conductive fine particles The paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 538073

Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (10) The conductive fine particles used in the present invention are not limited as long as they have conductivity, but in order to obtain long-term stable conductivity, it is not easy to oxidize The material is ideal. Specific examples of such a material are selected from the group consisting of gold, silver, copper, aluminum, zinc, nickel, palladium, platinum, cobalt, rhodium, iridium, iron, ruthenium, chromium, tungsten, giant, titanium, bismuth, lead, boron , Silicon, tin and barium metals or alloys of these. Two or more kinds of conductive fine particles composed of different materials may be used. The conductive fine particles are made of a material having a volume resistivity of 1 0-5 · c m or less, and more preferably a material having a volume resistivity of 7 χ 1 0-6 Ω · c m or less. As mentioned above, in the items 1 to 9 of the scope of patent application, the number average particle diameter of the above-mentioned conductive fine particles must be 1 μm or less, and 0 · 5 // m or less is more preferable ′ 0 · 3 // m or less. When the number average particle diameter exceeds 1 #m, the particles of the aqueous dispersion of the present invention are liable to settle in the aqueous dispersion of the conductive layer formation of the present invention, and the storage stability of the aqueous dispersion is insufficient. The lower limit of the number average particle diameter is not particularly limited, and is usually 0 · 〇 2 // m or more. For another example, the number average particle diameter of the conductive fine particles in the range of 10 to 17 of the patent application is also within the above range. The "particle size" in this specification refers to the primary particle size. Considering the ease of manufacture of such conductive fine particles, it is desirable to use metal fine particles produced by a gas evaporation method, an electrolytic method, a reduction method, or the like. The conductive particles of the present invention may be spherical, square, scaly, convex, or the like. Among them, square or scaly conductive particles can increase the contact area between the particles. (b) Organic particles The size of this paper applies to China National Standard (CNS) A4 (210 X 297 mm) -------------------- Order ----- ---- Line (Please read the notes on the back before filling this page) 538073 A7 _ B7 V. Description of the invention (11) (b-1) Composition of organic particles (Please read the notes on the back before filling this page ) The organic particles of the present invention are composed of "at least one of a polymerizable compound and a polymer". "Polymerizable compound" as used herein refers to a compound having a polymerizable group, and includes polymers, polymerizable oligomers, monomers, and the like that are precursors before being completely cured. "Polymer" means a compound that substantially completes the polymerization reaction. However, it is also possible to generate crosslinks after electrode deposition by heating, moisture, or the like. In order that the above-mentioned organic particles can be electrode-deposited, those having an electric charge on their surfaces are preferable. This surface charge can be anionic or cationic. When the material of the conductive fine particles is copper and the surface charge of the organic particles is cationic, the aqueous dispersion containing these particles has better storage stability. The organic particles are preferably composed of one or two selected from acrylic resins, epoxy resins, polyester resins and polyimide resins. In addition to these resins, other components may be contained. These resins can be chemically combined with each other or with other ingredients. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs When the resin component is decomposed and removed by heating or the like after electrode deposition, it is particularly preferable to use organic particles containing acrylic resin as the main component. If it is not decomposed and removed, it is easy to form a conductive layer having excellent mechanical properties and chemical and electrical properties. Therefore, it is particularly preferable to use organic particles containing polyimide resin as a main component. "Polyimide resin" refers to a polymer (such as polyamic acid) that can be cured by heating the polyimide resin or electrode after deposition, such as heating, and the monomers used to form the polyimide resin. Copolymer resins of other monomers or their precursor polymers, reactants of polyimide resins or their precursor polymers with other compounds, including polyimide resins-14- This paper applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) 538073 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 ___-____ B7_ V. Description of the invention (12) Monomers, oligomers, etc. for formation, the same for other resins . (b-2) Aqueous latex of organic particles The aqueous dispersion of the present invention is usually adjusted using an aqueous latex in which the above-mentioned organic particles are dispersed in an aqueous medium. The following describes the aqueous emulsion of organic particles mainly composed of acrylic resin ("hereinafter referred to as" acrylic resin latex "), and the aqueous emulsion of organic particles mainly composed of epoxy resin (" hereinafter referred to as "epoxy Resin latex "), water-based latex of organic particles mainly composed of polyester resin (" hereinafter referred to as "polyester resin latex"), and water of organic particles mainly composed of polyimide resin A method for producing latex ("hereinafter referred to as" polyimide resin latex "). (1) Production method of acrylic resin latex The production method of acrylic resin latex is not particularly limited. For example, the reaction solution that is polymerized in an organic solvent such as an alcohol may be added to the reaction solution by stirring in a normal emulsification method. It is produced by a method such as dispersing resin in water. The monomer may be selected from one or two of general acrylic and / or methacrylic monomers. In this case, in order to make the obtained organic particles capable of being electrodeposited, a monomer having an anionic group or a cationic group is usually copolymerized. The copolymerization ratio is an ideal ratio of 5 to 80% by weight (more preferably, 10 to 50% by weight) for the entire monomer used. ° (η) Production method of epoxy resin latex The manufacturing method is not particularly limited, and a conventionally known method can be used, for example, Japanese Unexamined Patent Publication No. 9-1 2 3 5 4 9 5 This paper size applies the Chinese National Standard (CNS) A4 specification (210x 297 public love) --- --------- Cloth -------- Order --------- Line (Please read the precautions on the back before filling this page) 538073

Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (13), the same as the method described in 9-1 7 2 0 8 8 65. (Πι) Production method of polyester resin latex The production method of polyester resin latex is not particularly limited, and a conventionally known method can be used. For example, Japanese Patent Application Laid-Open No. 5 7-1 6 6 3, same as 57-7 1 53, the same as the method contained in 58-17442 1. (1v) Production method of polyimide resin latex There is no particular limitation on the production method of polyimide resin latex. There are two types of polyimide resin latex suitable for the present invention and the production method thereof. 〇 (1) Polyimide-based resin latex composed of (A) organic solvent-soluble polyimide and (B) hydrophilic polymer composite particles. This polyimide-based resin latex can be produced, for example, by a method described in Japanese Patent Application Laid-Open No. 11-49-9551. (2) A polyimide resin latex composed of particles containing composite particles of (C) polyamidic acid and (D) a hydrophobic compound. This polyfluorene-imide-based resin latex can be produced, for example, by the method described in Japanese Patent Application Laid-Open No. 1 1 6 0 9 47. These polyimide resin latexes not only have excellent storage stability of aqueous dispersions, but also the particles in this latex can be formed by electrode deposition to maintain the original heat resistance, electrical insulation, mechanical properties, and resistance of polyimide. Electrode-deposited films for pharmaceutical properties. The method for producing the polyimide-based resin latex used in the method (1) will be described in more detail. -------------------- Order --------- Line (Please read the notes on the back before filling this page) This paper size is applicable to China Standard (CNS) A4 specification (210 X 297 mm) -16- 538073 Λ7 B7 V. Description of the invention (14) (Please read the precautions on the back before filling this page) "(A) Organic Solvent Soluble Polyurethane The synthesis method of "amine" is not particularly limited. For example, in an organic polar solvent, a tetracarboxylic dianhydride is mixed with a diamine compound to cause polycondensation. After obtaining polyamic acid, the polyfluorinated acid is heated by fluorinated imidization Or the chemical dehydration method can produce dehydration ring-closing reaction to synthesize polyfluorene imine. Tetracarboxylic dianhydride and diamine compound are polycondensed in multiple stages to synthesize polyfluorene imine having a block structure. The organic solvent-soluble polyfluorene imide is preferably one or more reactive groups (a) such as a carboxyl group, an amine group, a hydroxyl group, a sulfonic acid group, a sulfonylamino group, an epoxy group, an isocyanate group, and the like. As a method for synthesizing polyimide having a reactive group (a), for example, carboxylic acid anhydride, diamine compound, carboxylic acid-anhydride, and monoamine compound used as a raw material for the synthesis of polyamidic acid can be used. ), And a method of leaving a reactive group (a) after dehydration ring-closure reaction and the like. The "(B) Hydrophilic Polymer" printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs has more than one type of hydrophilic group such as amine group, carboxyl group, hydroxyl group, sulfonic acid group, amido group and the like. The solubility of C is usually made of a hydrophilic polymer of not less than 0.01 g / 1, 000 g, and preferably not less than 0.05 g / 100 g. In addition to the above-mentioned hydrophilic group, it is preferable to have one or more reactive groups (b) capable of reacting with the reactive group (a) in the component (A). Such a reactive group (b) includes, for example, an epoxy group, an isocyanate group, and a carboxyl group, and a same group as the above-mentioned hydrophilic group. This hydrophilic polymer can be prepared by polymerizing or copolymerizing one of the vinyl monomers having a hydrophilic group and / or a reactive group (b), or copolymerizing one of these vinyl monomers with another monomer. . This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 538073 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 137 V. Description of the invention (15) Selection (A) Polyurethane soluble in organic solvents A combination of an amine and (B) a hydrophilic polymer such that the reactive group (a) and the reactive group (b) in the hydrophilic polymer have appropriate reactivity. The polyimide and the hydrophilic polymer are, for example, in The organic solvent is mixed in a solution state, and if necessary, heat is applied to make the two react. Then, the reaction solution is mixed with an aqueous medium, and at least a part of the organic solvent is sometimes removed, to obtain a state in which the polyimide and the hydrophilic polymer are combined with each other, and are composed of composite particles contained in the same particle. Polyimide resin latex. Next, a method for producing a polyimide-based resin latex used in the method (2) described above will be described in more detail. There is no particular limitation on the method for synthesizing the "(C) polyamidic acid" precursor of polyimide. For example, in a polar organic solvent, a polycondensation reaction between a tetracarboxylic dianhydride and a diamine compound can be used to obtain polyamidoamine. acid. In addition, tetracarboxylic dianhydride and a diamine compound are subjected to polycondensation in multiple stages, and a polyamino acid having a block structure can also be synthesized. It is also possible to use dehydration and ring-closing of polyamic acid to synthesize partially polyimidized polyamino acid. The "(D) hydrophobic compound" is a compound having a group (hereinafter referred to as "reactive group") capable of reacting with at least the amino acid group in the polyamino acid. Examples of the reactive group include an epoxy group, an isocyanate group, a carbodiimide group, a hydrogen thio group, a halo group, an alkylsulfonyl group, an arylsulfonyl group, an azo group, a carbonyl group, and the like. These reactive groups may contain more than one kind in a hydrophobic compound. "Hydrophobic" means that the solubility in water at 20 ° C is usually 0.05 g / 100 g or less, preferably 0.0 g / 100 g or less, and more preferably 0.05 g / 100 g or less. . This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 public compound) Clothing -------- 1T --------- ^ · (Please read the precautions on the back before filling (This page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 B7 V. Description of the invention (16) For example, one or two or more kinds of hydrophobic compounds can be selected from epoxy polybutadiene and bisphenol A , Naphthalene-based epoxy resin, fluorene-based epoxy resin, biphenyl epoxy resin, glycidyl ester epoxy resin, allyl glycidyl ether, glycidyl (meth) acrylate, 1, 3, 5 , 6-tetraglycidyl-2,4-hexanediol, N, N, N'N'-tetraglycidyl-m-xylylenediamine, toluene diisocyanate, dicyclohexylcarbodiimide, polycarbide Diimine, cholesterol, T-alcohol, p-toluenesulfonate, ethyl chloroacetate, triazine trithiol, azomethane, diacetone (meth) acrylamide, etc. After the (C) polyamidic acid is mixed with the (D) hydrophobic compound in a solution state in an organic solvent, the reaction solution is mixed with an aqueous medium, and at least a part of the organic solvent is sometimes removed. Polyimide resin latex composed of composite particles in which polyamic acid and a hydrophobic compound are contained in the same particle. The tetracarboxylic dianhydride used in the above methods (1) and (2) is not particularly limited, for example, butane tetracarboxylic dianhydride, 1, 2, 3, 4 monocyclobutane tetracarboxylic dianhydride, 3, 3 ', 4,4'—Dicyclobutanetetracarboxylic dianhydride, 2,3,5-, tricarboxycyclopentylacetic dianhydride, 1,3,3a, 4,5,9b —Hexahydro-5— (Tetrahydro-2,5-dicarbonyl-3-furanyl) -naphthalene [1,2-c] -furan-1,3-dione, etc. aliphatic tetracarboxylic dianhydride or alicyclic tetracarboxylic dicarboxylic acid Anhydride; pyromellitic dianhydride, 3, 3, 4, 4, 4'-benzodione tetracarboxylic dianhydride, 3, 3 ', 4, 4' monobiphenylpyrene tetracarboxylic dianhydride, etc. Group tetracarboxylic dianhydride; etc. These tetracarboxylic dianhydrides can be used alone or in combination with ------------ f -------- order --------- line · (please first Read the notes on the reverse side and fill out this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -IV- 538073 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (17). The diamine compounds used in the above methods (1) and (2) are not particularly limited, for example, p-phenylenediamine, 4,4'-diaminodiphenylmethylamine, 2,2-bis [4 one (4 Monoaminophenoxy) phenyl] propane and other aromatic diamines; 1,1 m-xylenediamine, 1,3-propanediamine'butanediamine, 4,4 'monomethylenebisamine (Cyclohexylamine) and other aliphatic diamines or alicyclic diamines; 2,3-diaminopyridine, 2,4-diamino-6-dimethylamino-1,3,5-tris Zine, 2,4-diamino-5phenylphenylazole, bis (4-monoaminophenyl) aniline, etc. have two primary amine groups and nitrogen atoms other than the primary amine group in the molecule Diamines; monosubstituted phenylenediamines; diamine-based organosiloxanes; etc. These diamine compounds can be used alone or in combination of two or more. (c) Aqueous dispersion The aqueous dispersion of the present invention is obtained by dispersing the above-mentioned conductive fine particles and the above-mentioned organic particles in an aqueous medium. The "aqueous medium" in this specification refers to a medium containing water, and the water content in this aqueous medium is 0.5% by weight or more, and preferably 10% by weight or more. When the water content is 0.5% by weight or less, it is difficult to use the aqueous dispersion directly as an electrode deposition solution. When the water content is too high, the dispersion stability of the conductive fine particles and the like is reduced. Therefore, the water content is 50% by weight or less, preferably 40% by weight or less, and more preferably 20% by weight or less. This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm -------------------- Order --------- Line 4) | ^ (Please read the notes on the back before filling this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 __ B7 V. Description of the invention (18) Other media that can be used with water if necessary Aprotic polar solvents, esters, ketones, phenols, alcohols, amines, etc. for manufacturing polyamic acid or polyimide. When considering the dispersion stability of conductive fine particles and metal particles, it contains 1 0 Alcohols consisting of one or two or more alcohols having 1 to 100 carbon atoms are preferred to 90 wt% (more preferably 20 to 70 wt%). This aqueous medium contains 0. 0 1 to 5% by weight (0 · 0 1 to 1% by weight) of amines such as ethanolamine, diethanolamine, etc. are preferred, thereby improving dispersion stability. The volume of conductive fine particles and organic particles contained in the aqueous dispersion The ratio is 9 9: 1 to 4 0: 60, preferably 9 5 ·· 5 to 4 0: 6 0, and more preferably 8 5: 1 5 to 6 0: 4 0. Conductive fine particles When the proportion of the conductive fine particles in the total amount with the organic particles is 40% by volume or less, the volume resistivity is too large, so it may not be suitable as a conductive layer. When the proportion of the conductive particles exceeds 80% by volume , Film-forming property, shape-maintaining property, insufficient adhesion to the substrate, and cracks may occur on the conductive layer. The ideal P 此 of this aqueous dispersion is 3 to 1 2 (more preferably 3 to 1 0) The ideal solid content concentration is 1 to 50% by weight (more preferably 5 to 30% by weight), and the ideal viscosity of 2 CTC is 1 to 100 m P a · s. Ρ Η, solid content concentration, viscosity Outside the above range, the dispersion of particles may be reduced, or storage stability may be insufficient, or sufficient electrode deposition speed may not be obtained, productivity may be reduced, or workability during operation or use may be reduced, and the fineness in the through holes may be fine. Partially shaped electrodes are difficult to deposit. This aqueous dispersion is used to disperse the above-mentioned conductive fine particles in a paper with the standard of China National Standards (CNS) A4 (2) 〇χ 297 mm). ------ clothing -------- order --------- line ( (Please read the notes on the back before filling in this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 538073 Α7 Β7 V. Description of the invention (19) The organic fine particle dispersion liquid of the organic solvent and the organic particle dispersion liquid (preferably the above-mentioned aqueous latex) in which the organic particles are dispersed in an aqueous medium are prepared. In consideration of dispersion stability and solubility in aqueous latex media, the organic solvent used in the above “conductive fine particle dispersion” is preferably composed of one or two or more alcohols having 1 to 10 carbon atoms. As the alcohol-based solvent, ethanol, isopropanol, or a mixed solvent thereof is particularly preferably used. The method of dispersing conductive fine particles in an organic solvent includes, for example, a method using a homogenizer, a high-pressure homogenizer, an ultrasonic mixer, or a combination of these methods. The conductive fine particle dispersion preferably contains 3 to 40% by weight of conductive fine particles, and more preferably contains 5 to 30% by weight. The aqueous dispersion of the present invention may contain, in addition to the above-mentioned conductive fine particles and organic particles, at least one kind selected from an organic silane represented by the following formula (1), and a part or all of the hydrolyzable groups of the organic silane The hydrolyzed hydrolysate and a part of the condensate of which the hydrolysate is partially dehydrated and condensed (hereinafter referred to as "organic-based sand garden condensate, etc."). The conductive layer formed from such an aqueous dispersion, especially when the electrode is cured by heating, the organic silane condensate in the conductive layer is crosslinked to form a conductive layer having excellent mechanical and chemical properties. (R 1) n S i (OR2) 4-η (!) (Wherein R1 represents a hydrogen atom or a monovalent organic group having 1 to 8 carbon atoms; R is a fluorenyl group having 1 to 5 carbon atoms, carbon A fluorenyl or phenyl group of the number 1 to 6, η is an integer of 1 or 2, R1 and R2 may be the same or different). In the above formula (1), R1 is an example of a monovalent organic group having 1 to 8 carbon atoms. -Line 41 ^ (Please read the notes on the back before filling this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ----- B7____ V. Description of the invention (2) If there is a direct key or support Bonded radicals, halogen-substituted radicals, ethylsulfanyl, phenyl, and 3,4-epoxycyclohexylethyl. R1 may have a carbonyl group. R1 is preferably an alkyl group or a phenyl group having 1 to 4 carbon atoms. Examples of the alkyl group having 1 to 5 carbon atoms or a fluorenyl group having 1 to 6 carbon atoms in R2 include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and second butyl. Butyl, n-pentyl, ethylfluorenyl, propylfluorenyl, butylfluorenyl and the like. R2 is preferably an alkyl group having 1 to 4 carbon atoms. Suitable organic silanes are, for example, dimethylmethoxysilane, dimethyldiethoxysilane, isobutyltrimethoxysilane and phenyltriethoxysilane. These organic silanes can be used alone or in combination of two or more. The above-mentioned "organosilane condensate" is preferably formed in the aqueous dispersion of the present invention to form organic particles and composite particles. The "composite particle" refers to a chemical compound that combines the compound constituting the organic particle with an organic silane condensate or the like, or an organic silane condensate or the like is adsorbed on the surface or inside of the organic particle. In the case where the organic silane condensate is used in an amount of 100 parts by weight of the organic particles, 0.1 to 500 parts by weight is used, and 0.5 to 250 parts by weight is preferably used. When the amount of the organic silane condensate used is less than or equal to 0.1 part by weight, the desired effect may not be obtained, and when it exceeds 500 parts by weight, the adhesiveness and the like of the conductive layer tend to decrease. Such composite particles can be produced by the following method (1) or (2). These methods can also be combined. (1) After adding the above-mentioned organic silane to the latex of the above-mentioned organic particles, so that the above-mentioned organic particles absorb at least a part of the organic-based silane, perform this $ paper. Applicable to China National Standard (CNS) A4 (210 x 297) (Li) Two daggers: ------------- · Clothing -------- Order --------- Line · (Please read the notes on the back before filling (This page) 538073 Λ7 B7 V. Description of the invention (21) Hydrolysis reaction and condensation reaction of organic silane. (Please read the precautions on the reverse side before filling out this page) (2) The reaction to generate the organic particles is performed in the presence of the above-mentioned organic silane condensate dispersed in an aqueous medium. In the method (1) described above, in order to allow the organic particles to absorb the organic silane, an organic silane may be added to the latex, and a method such as sufficient stirring may be used. At this time, it is preferable that the particles absorb 10% by weight or more (preferably 30% by weight or more) of the added organic silane. At the stage of insufficient absorption, in order to avoid the hydrolysis and condensation reaction of the organosilane, the P P of the reaction system can be adjusted to 4 to 10, preferably 5 to 10, and more preferably 6 to 8. The treatment temperature for the organic particles to absorb the organic silane is 70 t or less, ideally 50 t: or less, more preferably 0 to 30 ° C. The processing time is usually 5 to 180 minutes, and ideally 20 to 60 minutes. The temperature at which the absorbed organic silane is hydrolyzed and condensed is usually 30 ° C or less, preferably 50 to 100 ° C, more preferably 70 to 90 t: and the ideal polymerization time is 0. 3 to 15 hours, more preferably 1 to 8 hours. In the method of printing the above (1) by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the above-mentioned organic silane is mixed with an aqueous solution of a strong acidic emulsifier such as alkylbenzenesulfonic acid using a homogenizer, an ultrasonic mixer, etc. By hydrolysis and condensation, an organic silane condensate or the like dispersed in an aqueous medium can be obtained. In the presence of this organic silane condensate or the like, it is desirable to generate the above-mentioned organic particles by emulsion polymerization. (d) Conductive layer The aqueous dispersion of the present invention is usually preferably used as the electrode deposition solution for forming the conductive layer at this concentration, but it is also used after dilution or concentration. Necessary This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 B7 5. In the invention description (22), it can be appropriately matched with previously known additives. The conductive fine particles and organic particle electrodes of the aqueous dispersion can be deposited on the electrode surface by a common electrode deposition method using this electrode deposition solution to produce a conductive layer. After this electrode deposition step, it is preferable to reduce the conductive resistance at the interface of the conductive fine particles by the following method. ① In order to remove non-conductive materials such as metal oxides that are stored on the surface of conductive fine particles, the layer formed by electrode deposition is fired in a reducing atmosphere. For example, metal oxides can be reduced by firing at 2000 to 500 ° C for 30 to 180 minutes under an inert gas atmosphere in which hydrogen is mixed in an amount of 0.1 to 5% by volume. Or the surface of this layer is washed with a 50 to 100% aqueous solution of a weak acid such as acetic acid, formic acid, propionic acid, etc., to dissolve and remove non-conductive materials such as metal oxides. ② Precipitate metal on the surface of conductive fine particles. For example, when immersed in an electroplating solution, a current flows in a pulsed manner, which effectively precipitates the metal out of the particle interface. The ratio of the energization time to one cycle of the pulse is preferably 0.6 or less and more preferably 0.3 or less. As the metal to be plated, known materials such as copper, nickel, gold, lead, silver, tin, and solder alloys can be used. The resin component of the particles after electrode deposition can be thermally decomposed and removed, thereby reducing the volume resistivity of the conductive layer. In this case, it is preferable to use an acrylic resin that can be decomposed and removed at a relatively low temperature. For example, the resin component can be removed by heating at 2000 to 800 ° C for 30 to 180 minutes. For example, when the conductive layer is fired in a reducing atmosphere, the resin component can be decomposed and removed at the same time as the firing. The resin composition is made of thermosetting resin. After the electrode is deposited, this resin can be used in accordance with Chinese National Standard (CNS) A4 (21〇X 297 mm). -------------- ------ Order --------- Line (Please read the precautions on the back before filling this page) 538073

V. Description of the invention (23) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The ingredients are reheated and hardened. In this case, it is preferable to use an aqueous dispersion containing the above-mentioned organosilane condensate or the like. As the thermosetting resin, an epoxy-based resin or a polyimide-based resin can be used. A polyimide-based resin is most preferably used. The conditions for the heat curing are not particularly limited as long as they do not decompose and remove the resin component. The ideal heating temperature is 100 to 400 t, and more preferably 150 to 300 ° C. The heating time is preferably 5 minutes or more, and more preferably 10 minutes or more. The resin component is heat-hardened to improve the mechanical characteristics of the conductive layer, and the conductive layer is compacted by sintering, which can also improve the electrical characteristics. The resin component remaining in the conductive layer has a binder function, so that a conductive layer having excellent adhesion and impact resistance can be formed. When the film is fired in a reducing atmosphere as described above, the resin component can be heated and hardened by using the heat during the fire. When the aqueous dispersion according to the present invention is used, a conductive layer having a volume resistivity of 10-4 Ω · cm or less (more preferably 0.5 × 10 to 4 Ω · cm or less) can be obtained. The thickness of the conductive layer when it is formed into a film is 1 to 8 0 # m (ideally 3 to 5 0 // m, more preferably 5 to 2 0 // m). More ideal. When forming a conductive layer having such a thickness, the use of the aqueous dispersion of the present invention can exhibit the advantage of being manufactured by electrode deposition. (e) Electronic parts When the aqueous dispersion according to the present invention, a conductive layer having a high film thickness accuracy and the like can be produced with high efficiency. It is also possible to form a conductive layer having a high film thickness accuracy and the like with high efficiency by passing through finely shaped portions such as through holes and via holes of the insulating layer. This conductive layer is suitable for electronic circuits such as conductive circuits, bumps, and assembled wiring boards (such as multilayer wiring boards). (f) Circuit board -------- ^ -------- Wire 0 ^ &quot; (Please read the precautions on the back before filling in this page) The paper size applies to Chinese National Standard (CNS) A4 specification (210 X 297 mm) -ZO-538073 A7 ________ B7 V. Description of the invention (24) (f-1) Structure (please read the precautions on the back before filling this page) The circuit board of the present invention is provided with insulation As the layer, a conductive layer formed by using the above conductive layer to form an aqueous dispersion is used. A part of the conductive layer constitutes a through conductive portion penetrating the insulating layer. The material constituting this insulating layer is not particularly limited, and polyimide resin, epoxy resin, bis-cis-butyl diamine resin, phenol resin, etc. can be used for the purpose of the prepared circuit board. For example, a glass epoxy substrate, a B T resin substrate, etc. for a thick core substrate of a general build-up wiring board, or an epoxy-based resin layer, a polyimide-based resin layer, etc. used for the insulation layer of the build-up wiring board can be used. The thickness of the insulating layer is not particularly limited. In the case of a thick-core substrate, it is usually 20 to 150 // m (ideally 50 to 100 // m). In the case of a build-up insulating layer, it is usually 5 to 1 0 / / m (ideally 10 to 50 ^ m). The polyimide resin layer used for the insulation layer printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is particularly suitable for the use of polyimide-based composites with an elastic modulus of 10 G p a or less. Such a polyfluorene-based compound can be used as disclosed in Japanese Patent Application Laid-Open No. 2000-4 4800, which is composed of (A) a polyimide component and (B) another polymer component. . (A) The polyimide component is preferably a polyimide which is soluble in an organic solvent and has a block structure, a terminally modified polyimide, a polyimide having a reactive group, and a polyamic acid, etc. . (B) The other polymer component is preferably one having a reactive group capable of directly reacting with (A) the polyfluorene imine component or indirectly through a crosslinking agent or the like. (B) Specific examples of other polymer components are polymers of vinyl monomers such as acrylic polymers, natural rubber and its epoxides, polybutadiene and its epoxides. CNS) A4 specification (2) 0 X 297 mm) 538073 A7 ------- B7 V. Description of the invention (25) Styrene-butadiene rubber, isoprene rubber, polyurethane rubber, propionitrile, Ethyl-propylene rubber, fluoropolymer, polysiloxane polymer, etc. (Please read the precautions on the back before filling this page.) The above-mentioned through conductive parts are usually filled with through holes that penetrate the above-mentioned insulating layer 'or formed into a film shape along the wall surface of the through hole. The diameter of this through hole is 4 to 15 〇 // m (ideally 6 to 10 〇 m, and more preferably 10 to Θ 0 // m). A through hole having this diameter range can effectively exert the advantage of forming a through conductive portion in the inside by the electrode deposition method using the aqueous dispersion of the present invention. When the film is formed along the wall surface of the through hole, the film thickness is 1 to 5 0 // m (ideally 2 to 3 0 // m, and more preferably 3 to 2 0 # m). (f-2) Manufacturing method The above-mentioned circuit board can be manufactured by, for example, a method (hereinafter referred to as "Method 1") in the scope of patent application. The manufacturing steps of this method will be described using FIG. First, as shown in FIG. 1 (a), a through hole 4 1 1 is formed in the insulating layer 41. Next, as shown in Fig. 1 (b), the other surface 4 1 a of the insulating layer 41 is laminated with a conductive foil 42. This conductive foil 42 may cover the surface of the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, which prints a part or all of the part 1 a, but is provided at least on an open end containing a through hole 4 1 1. In other words, a part of the conductive foil 42 forms the bottom surface 421 of the through hole 411. Then, the substrate shown in FIG. 1 (b) is brought into contact with the electrode deposition solution composed of the aqueous dispersion liquid of item 1 of the patent application, so that the electrode deposition solution fills the through holes 4 1 1, and the conductive foil 42 is used as One of the electrodes is subjected to electrode deposition. As shown in Figure 1 (c), conductive particles and organic particles are deposited on the bottom surface 4 2 1 by electrodes. The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -28-538073 A7 --- B7 V. Description of the invention (26) In the through hole 4 1 1, a through conductive part 4 3 1 is formed. Then, as shown in FIG. 1 (d), the other surface 4 1 of the insulating layer 4 1 (please read the precautions on the back before filling this page) b. Laminate another conductive foil 4 2 and then etch in a conventional way As shown in FIG. 1 (e), a conductive pattern 4 4 formed on the surface 4 1 a and a conductive pattern 4 4 formed on the surface 4 1 b can be obtained by forming a conductive pattern 4 4 from the conductive foil 4 2 to penetrate the conductive portion. 4 3 1 Connected circuit board. In an appropriate step after electrode deposition, moderate heating of the substrate can thermally harden the resin forming the through conductive portion 4 31, and when the insulating layer 41 is composed of a semi-hardened resin, it can be performed at this stage at the same time. Heat hardened. The circuit board of the present invention can be manufactured by a method (hereinafter referred to as "Method 2") as described in the patent application No. 8 range. The manufacturing steps of this method will be described using FIG. 2. In this method, a conductive layer is formed in advance on a thick core wiring substrate on which a conductor pattern is formed. As shown in FIG. 2 (a), a thick-core wiring board can be provided with an insulating layer (also referred to as a thick-core insulating layer) manufactured by the steps shown in FIGS. 1 (a) to (e). The pattern 4 4 and the thick-core wiring board 4 8 penetrating the conductive portion 4 3 1. On both surfaces of the thick-core wiring board 48, as shown in FIG. 2 (b), printed with a photosensitive insulating resin to form an insulating layer 45, printed by a consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, a pattern is formed by a conventional method. As shown in FIG. 2 (c), an insulating layer pattern 46 is formed which has a through hole 4 51 that exposes a part of the conductor pattern 44. Next, as shown in Fig. 2 (d), the chemical mineral layer 47 is formed by electroless plating using a conventional method using the insulating layer pattern 46 as a mask material. The chemical mineral layer 4 7 ′ can be formed on the substrate shown in FIG. 2 (c) in full or only in part, but contains at least the through-holes 4 5 1. The size of this paper is applicable to the Chinese National Standard (CNS) A4 specification (210 x 297g £ 7 538073 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (27) Part of the electroless plating layer 4 7 is used to electrically connect the conductor pattern 4 4 at the bottom of the through hole 4 5 1. Then, Figure 2 The substrate shown in (d) is in contact with the electrode effusion formed by the aqueous dispersion of item 1 of the patent application, so that the electrode 丨 the effusion fills the through hole 4 5 1, and the electroless plating layer 4 7 is one of them. As shown in FIG. 2 (e), conductive fine particles and organic particles are deposited on the chemical mineral layer 47 by the electrode to form a through conductive portion 4 formed in the through hole 4 51. The conductive layer of 3 2 4 3. The substrate shown in Fig. 2 (e) is laminated one by one on both sides of the circuit substrate obtained by the method of item 7 of the scope of patent application. The circuit board prepared by the method of item 8. This state is advanced After the conductive layer 43 is patterned, the steps shown in Fig. 2 (b) ~ (e) can be repeated to laminate the circuit substrate obtained by the method as described in the item 8 of the patent application scope. Only multiple pieces can be laminated. Laminate a circuit substrate made by the method as claimed in item 7 of the patent application scope, or laminate multiple circuit substrates made by the method as described in the item 8 of the patent application scope or One or more circuit substrates produced by the method of the scope of patent application claim 7 are laminated with one or more circuit boards produced by the method of the scope of patent application claim. (G) Multi-layer wiring board The structure and manufacturing method of multilayer wiring board with the scope of application for patent No. 10 ~ 17. (G-1) Structure Figure 3 shows the structure of an example of the multilayer wiring board of the present invention. (CNS) A4 specification (210 X 297 mm) -------------------- Order --------- line ^^ · (Please read first Note on the back, please fill out this page again) -30-538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (28) Use sectional drawing. Multi-layer wiring board This multilayer wiring board has a thick-core wiring substrate 10. This thick-core wiring substrate 10 is formed on a first substrate wiring layer 12 on the insulating substrate 11 and a first substrate wiring layer is formed on the lower surface of the insulating substrate 11 The two substrate wiring layers 1 3, the first substrate wiring layer 12, and the second substrate wiring layer 13 are electrically connected to each other through the substrate short-circuit portion 14 extending through the thickness direction of the edge substrate 11 1. An upper insulating layer 2 0 is formed on the substrate 10. An upper wiring layer 2 1 is formed on the upper insulating layer 20. The upper wiring layer 21 is an interlayer short circuit extending through the thickness direction of the upper insulating layer 20. The section 22 is electrically connected to the first substrate wiring layer 12. On top of the upper wiring layer 21, the upper insulating layer 20 is provided with a solder resist layer 2 having an opening 26 that exposes the pads for component connection of the upper wiring layer 21, and a thick core wiring board 1 is provided. A lower insulating layer 3 0 is formed below, and a lower wiring layer 3 1 is formed below the lower insulating layer 30. The lower wiring layer 3 1 is an interlayer short-circuiting portion 3 2 extending through the thickness direction of the lower insulating layer 30. The second substrate wiring layer 13 is electrically connected. Above the lower insulating layer 30 containing the lower wiring layer 31 is provided a solder-resistant worm-resistant layer 3 5 having an opening 3 6 for exposing the soldering area for connecting the components of the lower wiring layer 31. As the material constituting the insulating substrate 11 of the thick-core wiring substrate 10, for example, an insulating resin material having high heat resistance can be used. Specific examples thereof include glass fiber reinforced epoxy resin, glass fiber reinforced polyimide resin, Glass ------------- clothing -------- order --------- line (please read the precautions on the back before filling this page &gt; this paper Dimensions are applicable to China National Standard (CNS) A4 (210 x 297 mm) 538073

Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (29) Fiber-reinforced phenol resin, glass fiber-reinforced bis-butene diamine triazine resin, polyimide resin, polyimide resin, polyester Resin, etc. The substrate short-circuiting section 14 can use various structures conventionally used in printed wiring boards, for example, a cylindrical metal deposit formed by electroless plating and electroplating, and conductive fine particles are dispersed in a thermosetting resin material. The conductive paste material is composed of a hardened product of the conductive paste material, etc., but the materials constituting the interlayer short-circuiting portion 22 and the interlayer short-circuiting portion 32 described below, that is, at least conductive particles and polymerizable compounds and polymers are used. An organic particle formed is dispersed in an electrode liquid formed in an aqueous medium, and a conductive layer formed by an electrode deposition process is preferable. As the material constituting the upper insulating layer 20 and the lower insulating layer 30, various thermosetting resin materials and radiation curing resin materials conventionally used in printed wiring boards can be used. The interlayer short-circuiting portions 22, 32 formed by the upper insulating layer 20 and the lower insulating layer 30 are composed of a conductive material composed of conductive fine particles in a polymer substance, and the conductive system is composed of a specific electrode deposition liquid. , Formed by electrode deposition. The specific electrode deposition liquid forming the interlayer short-circuiting portions 22, 32 is composed of conductive fine particles and organic particles composed of at least one of a polymerizable compound and a polymer dispersed in an aqueous medium. This electrode depositing liquid is particularly preferably formed with an aqueous dispersion using a conductive layer such as those in claims 1 to 3 of the patent application. Such interlayer short-circuit portions 22, 32 contain conductive fine particles having a volume fraction of 40 to 99%, and preferably 60 to 95%. To meet this paper size, apply Chinese National Standard (CNS) A4 (210 X 297 mm) -------------------- Order ------ --- Wire ^^ (Please read the precautions on the back before filling in this page) 538073 Α7 ___ Β7 V. Description of the invention (30) Under the conditions, high conductivity can be formed, for example, the volume resistivity is 1 X 1〇— 4 Ω · cm or less, and more preferably 0.5 5 × 40 Ω · cm or less, the interlayer short-circuit portions 2 2 and 3 2. (Please read the precautions on the back before filling out this page.) (G — 2) Manufacturing method The multilayer wiring board described above can be manufactured, for example, by the following method. First, as shown in FIG. 4, a first substrate wiring layer 1 2 is formed on the insulating substrate 11, and a first substrate wiring layer 12 is electrically connected to the first substrate wiring layer 1 4 on the lower surface of the insulating substrate 11. The thick-core wiring-based board material 10a formed by the metal layer 1A. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This thick core wiring board 10A can be manufactured, for example, by the following method. In other words, a laminated material 1 0 B formed by forming a metal layer 1 3 A under the insulating substrate 11 is prepared. As shown in FIG. 6, the laminated substrate 1 0 B is formed and should be formed on the insulating substrate 11. Corresponding to the through-hole 1 4 贯通 of the substrate short-circuit portion 1 丨 through the thickness direction of the insulating substrate 11. Next, in the aforementioned electrode deposition solution, using the metal layer 1 3 A as a cathode for precipitation, electrodeposition treatment was performed on this laminated material 10 B to deposit on the surface of the metal layer 1 3 A in the through hole 14 H The conductive fine particles and the organic particles in the electrode deposition liquid form a deposit, and the deposit may be heated to form a substrate short-circuit portion 14 extending through the thickness direction of the insulating substrate 11 as shown in FIG. 7 as necessary. After honing the upper surface of the insulating substrate 11 as necessary, a first substrate wiring layer 1 2 is formed on the insulating substrate 11 to obtain a thick core wiring base plate 10A as shown in FIG. 4. In the above, the method of forming the through-holes 1 4 Η on the insulating substrate 11 is, for example, to obtain the through-holes 1 4 孔径 with a small aperture, the irradiation laser can be applied to the paper standard of China National Standards (CNS) A4 (210 X 297 mm) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Method of Invention Description (31). If the electrode deposition method is considered to be easy to control the thickness, the constant voltage method can be used. The specific conditions of the electrode deposition process are appropriately set in consideration of the material and concentration of the conductive fine particles and organic particles contained in the electrode effusion. For example, the applied voltage is 50 to 5 0 V, and the processing time is 0.5. ~ 2 0 0 minutes. When heating the deposits formed by electrode deposition, the conditions of the heat treatment should be appropriately set in consideration of the material of the organic particles of the electrode deposition liquid, for example, the ideal heating temperature is 100 to 4 0 ° C is more preferably 150 to 300 ° C, and the heating time is preferably 5 minutes or more, and more preferably 10 minutes or more. The method for forming the first substrate wiring layer 12 can be, for example, a conventional method for forming a wiring layer used in the manufacture of a printed wiring board. For example, the insulating substrate 11 can be subjected to electroless plating or copper plating to form a metal layer. The layer is subjected to a photo-etching process to remove a part to form a wiring layer, or an addition method of directly forming a patterned metal layer by applying lithography and chemical plating on the insulating substrate 11 or other methods Method, etc. As shown in Fig. 8, the upper surface of this thick-core wiring base plate 10A is formed with an insulating layer 20 formed on the upper portion corresponding to the interlayer short-circuit portion 22 to be formed, and an upper portion. Next, in the aforementioned electrode deposition solution, the first substrate wiring layer 12 is used as a cathode for deposition, and an electrode deposition process is performed to deposit an electrode deposition solution on the surface of the first substrate wiring layer 12 in the through hole 2 2 Η. The conductive fine particles and organic particles in the medium form a deposit, and the deposit may be heated to form a thickness that penetrates the upper insulating layer 20 as shown in FIG. 9 as required. The paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 x 297 mm) -34--------------------- Order -------- • Line (Please read the notes on the back before filling in this Page) 538073

V. Description of the invention The inter-layer short-circuit portion 22 extending in the direction of (32) degrees. (Please read the precautions on the back before filling in this page.) In the above, the formation method of forming the through hole 2 2 Η upper insulating layer 2 0 can be applied to a thick core wiring substrate by using a liquid radiation-curable resin material, for example. After the upper surface of the board 1 OA, a method for forming an insulating layer 20 on the upper part of the through hole by performing an exposure process and a development process on the coating film, or applying liquid heat curing on the surface of the thick core wiring board board 10 A A heat-resistant resin material or a sheet-shaped thermosetting resin material is formed by heat treatment to form an upper insulating layer 20, and a method of forming a through hole by performing laser irradiation on the upper insulating layer 20. The method and specific conditions for the electrode deposition process are the same as those for forming the substrate short-circuit portion 14 described above. The upper insulating layer 20 and the interlayer short-circuiting portion 22 are formed as described above. After honing the surface of the upper insulating layer 20 as necessary, as shown in FIG. 10, the upper insulating layer 20 is chemically plated or A metal layer 2 1 A is formed by electroplating. Next, a part of the metal layer 1 A of the thick-core wiring base plate 10 A is subjected to photoetching to remove a part, and a second substrate wiring layer 13 is formed under the insulating substrate 10 to form a thick-core wiring substrate 10. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the thick core wiring substrate 10 is formed with a through-hole 3 2 〇 a lower insulating layer 30 corresponding to the interlayer short-circuit portion 32 to be formed as shown in FIG. 12. Next, in the aforementioned electrode source effusion, the second substrate wiring layer 13 is used as a cathode for deposition, and an electrode deposition process is performed, and the electrode deposition liquid is deposited on the surface of the second substrate wiring layer 13 in the through hole 3 2Η. The conductive fine particles and organic particles in the medium form a deposit. If necessary, the deposit is heated to the size of the paper, which applies the Chinese National Standard (CNS) A4 specification (2) 0 × 297 mm. 538073

Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (33) The interlayer short-circuiting section 22 extending through the thickness direction of the upper insulating layer 20 is formed as shown in Fig. 13. In the above, the method of forming the lower insulating layer 30 of the through hole 3 2 ，, the method of electrode deposition and the specific conditions are the same as those of forming the lower insulating layer 30 and the interlayer short-circuiting section 22 described above. Then, a portion of the metal layer 2 1 A formed on the surface of the upper insulating layer 20 is removed by photoetching. As shown in FIG. 14, an upper wiring layer 2 1 is formed, and at the same time, it is under the lower insulating layer 30. After honing if necessary, a lower wiring layer 31 is formed under the lower insulating layer 30. The method for forming the lower wiring layer 31 is, for example, the same as the method for forming the first substrate wiring layer 12 described above. A conventional method for forming a wiring layer used for manufacturing printed wiring boards can be used. The photo-etching process is the same step as forming the metal layer 2 1 A of the upper wiring layer 21. Soldering for connecting the members having the upper wiring layer 21 and the lower wiring layer 31 are formed on the upper wiring layer 21 and the upper insulating layer 20 and the lower wiring layer 31 and the lower insulating layer 30 respectively. The solder-resist layers 2 5 and 3 5 of the openings 2 6 and 36 exposed in the area can obtain a multilayer wiring board as shown in FIG. 3. In the case of such a multilayer wiring board, the substrate wiring layers 12 and 13 are used as electrode for deposition in an electrode deposition solution in which conductive fine particles and organic particles are dispersed, and an interlayer short circuit is formed in a short time by electrode deposition treatment. Department 2, 2, 3 2, so you can get high productivity when manufacturing multilayer wiring boards. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ----------- ----- I --- Order --------- (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 538073 Λ7 Β7 V. Description of the invention ( 34) Low-viscosity electrode source effusion can be easily prepared. When this kind of electrode source effusion is used, even though the through holes 2 1 Η, 3 1 形成 formed by each of the upper insulating layer 20 and the lower insulating layer 30 are In the case of a small diameter, the electrode deposition liquid can also enter the through holes 2 1Η, 3 1Η, and as a result, a desired interlayer short-circuit portion 2 2, 3 2 can be surely formed, and thus high reliability can be obtained. The conductive layer forming aqueous dispersion of the present invention forms a conductive layer by electrode deposition. Therefore, it is easier to form a conductive layer with higher film thickness and position accuracy than conventional techniques such as coating and printing. In addition, plating is not performed, and the film is formed by electrode deposition of fine particles, so the film has a fast growth rate and good productivity. According to this aqueous dispersion, conductive particles and organic particles of a resin component are deposited by an electrode, and a conductive layer having excellent adhesion to a substrate can be obtained. In the present invention, the resin component is dispersed in the form of particles in an aqueous medium. Therefore, unlike the case where the resin component is used in an organic solvent solution or a non-solvent state, the concentration or molecular weight of the resin component has little influence on the viscosity of the dispersion, and can be used as A dispersion liquid suitable for electrode deposition. The conductive layer of the present invention using this aqueous dispersion liquid can obtain one having excellent adhesion to a substrate, high film thickness accuracy, and high position accuracy, as described above. The conductive layer of the present invention exhibits such characteristics and is suitable for electronic parts such as conductive circuits, bumps, and circuit boards combining these. According to the method for manufacturing a circuit board according to the present invention, a circuit board formed from the aqueous dispersion of the present invention and having a through conductive portion penetrating an insulating layer can be manufactured with high efficiency. When the multilayer wiring board according to the present invention is used, the conductive fine particles and organic particles are sized according to the Chinese National Standard (CNS) A4 (210 x 297 mm) ------------ f --- ----- Order --------- Line · (Please read the notes on the back before filling this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (35) In the electrode deposition liquid formed by the sub-dispersion, the substrate wiring layer is used as a deposition electrode, and the interlayer short-circuit portion is formed in a short time by the electrode deposition process. Therefore, high productivity can be obtained when manufacturing a multilayer wiring board. It can easily prepare a low-viscosity electrode deposition solution. When using this electrode deposition solution, the electrode deposition solution can enter the through-holes even if the through-holes formed by the insulating layer have a smaller diameter. Because of the short circuit between layers, high reliability can be obtained. In the method for manufacturing a multilayer wiring board according to the present invention, a substrate wiring layer is used as an electrode for precipitation in an electrode deposition liquid in which conductive fine particles and organic particles are dispersed, and an interlayer short-circuit portion is formed in a short time by electrode deposition processing. Therefore, when manufacturing a multilayer wiring board, high productivity can be obtained. It can easily prepare a low-viscosity electrode deposition solution. When using this electrode deposition solution, the electrode deposition solution can enter the through-holes even if the through-holes formed by the insulating layer have a smaller diameter. The interlayer short-circuiting part makes it possible to manufacture a multilayer wiring board with high connection reliability. Brief Description of Drawings Figs. 1 (a) to (e) are schematic sectional views showing the manufacturing steps of the circuit substrate using the method 1. Figs. 2 (a) to (e) are schematic sectional views showing the manufacturing steps of the circuit board using the method 2; Fig. 3 is an explanatory sectional view showing the structure of an example of a multilayer wiring board of the present invention. Figure 4 shows that in order to obtain the thick core of the multilayer wiring board shown in Figure 3, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)-όό------------ --------- Order -------- 1 (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 ______B7_____ V. Invention Description ( 37) Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. Unless otherwise stated, "%" means "% by weight". (Synthesis Example 1: Dispersion liquid a of copper fine particles a) Copper fine particles (manufactured by Vacuum Metallurgy Co., Ltd., the number-average primary particle diameter of 0.05 0 / m) 2 0 parts by weight and 80 parts by weight of isopropanol were mixed in a homomixer, 0.6 parts by weight of diethanolamine was added, and the particles were dispersed by ultrasonic for 10 minutes to obtain an alcohol dispersion (solid content concentration of 0) of copper fine particles without aggregates. %). (Synthesis Example 2: Dispersion liquid b of copper fine particles) Copper fine particles (manufactured by Sumitomo Metal Co., Ltd., number average primary particle diameter 0 · 3 // m) produced by reduction method 20 parts by weight and isopropanol 2 0 After mixing parts by weight with a homomixer, add 1 part by weight of monoethanolamine and 30 parts by weight of isopropanol, and then use a high-pressure homogenizer (manufactured by Shimizu Chemicals) to obtain an alcohol dispersion of copper particles without solids (solid content) Concentration 20%). (Synthesis Example 3: Dispersion liquid c of copper microparticles) Copper microparticles produced by electrolytic method (Chuantie Mining Co., Ltd., number average primary particle diameter 0 · 5 // m) 2 0 parts by weight and isopropyl alcohol After mixing 30 parts by weight with a homomixer, 50 parts by weight of isopropyl alcohol was added, and then a high-pressure homogenizer (made by Shimizu Chemical Co., Ltd.) was used to obtain an alcohol dispersion of copper particles without agglomerates (solid content concentration 20%). . This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 74u--------------------- Order -------- -Line (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 _ B7 V. Description of the invention (38) (Synthesis Example 4: Dispersion liquid of nickel particles) 10 parts by weight of nickel fine particles (manufactured by Vacuum Metallurgy Co., Ltd., the number-average primary particle size 0 · 020 # m) manufactured by the middle evaporation method and 90 parts by weight of isopropanol were mixed in a homomixer, and then diethanolamine 0 was added. -3 parts by weight, and then ultrasonically dispersed for 10 minutes to obtain an alcohol dispersion (solid content concentration of 10%) of nickel fine particles without aggregates. (Synthesis Example 5: Dispersion liquid of silver fine particles) 20 parts by weight of silver fine particles (manufactured by Vacuum Metallurgy Co., Ltd., the number average primary particle diameter of 0 · 050 # m) and 80 parts by weight of ethanol produced by a gas evaporation method After mixing with a homomixer, 0.3 parts by weight of diethanolamine was added, followed by ultrasonic dispersion for 10 minutes to obtain an alcohol dispersion (solid content concentration of 20%) of silver fine particles without aggregates. [2] Preparation of organic particle latex (Synthesis Example 6: acrylic resin latex) 100 parts by weight of isopropanol was put into a reactor, and the temperature was raised to 80 ° C. In a separate container, 8 parts by weight of ethyl acrylate, 10 parts by weight of methacrylic acid, 5 parts by weight of glycidyl methacrylate, and 1 part by weight of azoisobutyronitrile were mixed, and then the aforementioned isocyanate was continuously added dropwise over 5 hours. In propanol, an alcohol solution of an acrylic resin was obtained. Add 20 parts by weight of this acrylic resin solution (10 parts by weight in terms of solid content conversion) and 0.2 parts by weight of monoethanolamine in a strong stirring state of 90 parts by weight of ion-exchanged water to obtain the acrylic paper standard applicable to Chinese national standards. (CNS) A4 specification (210 X 297 mm) Τ7ΓΡ · (Please read the notes on the back before filling this page) -------- 1T ------ 1 — ^ Intellectual Property Bureau, Ministry of Economic Affairs Printed by employee consumer cooperatives 538073 A7 _ B7 V. Description of the invention (39) is a latex of anionic organic particles with resin polymer as the main component. (Synthesis Example 7: Epoxy resin latex A) 40 parts by weight of an isocyanate composed of toluene diisocyanate and 2-ethylhexanol was mixed with Epycoat 8 2 8 (oilized Sheel

60 parts by weight of an epoxy polycarboxylic acid adduct obtained by the reaction of Epoxy Co., Ltd. with polyunsaturated acid (manufactured by Johnson Polymer), and 3 parts by weight of monoethanolamine as a P Η regulator were added. The above-mentioned mixed solution was added with stirring in 400 parts by weight of ion-exchanged water to obtain a latex of anionic organic particles containing an epoxy resin precursor as a main component. (Synthesis Example 8: Epoxy resin latex B) 35 parts by weight of an interrupted isocyanate composed of toluene diisocyanate and 2-ethylhexanol was mixed with E pycoat 8 2 8 (Oilated Sheel Epoxy Corporation) (Trade name of the system) is 65 parts by weight of epoxyamine adduct obtained by reacting with diethylamine, and 2.5 parts by weight of acetic acid as a p Η regulator is added. The above-mentioned mixed solution was added with stirring in 400 parts by weight of ion-exchanged water to obtain a latex of cationic organic particles containing epoxy resin precursor as a main component. (Synthesis Example 9: Polyfluorene imide resin latex) Tetracarboxylic dianhydride 3,3 ', 4,4, diphenyl tetracarboxylic acid difluoride was charged to 32.29 g (90 mmol) and 1, 3,3a, 4,5,9b —hexahydro-5 — (tetrahydro-2,5 —dicarbonyl — 3) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -42-- --------------- I --- Order -------- I ^ _w (Please read the notes on the back before filling this page) 538073 Intellectual Property Bureau, Ministry of Economic Affairs Printed by employee consumer cooperatives Λ7 B7___ V. Description of the invention (40) —furanyl] -naphthalene [1,2-C] —furan-1, 3-dione 3. 1.00 g (10 mmo 1), diamine Compound No. 2, 2-bis [4-mono (4-aminophenoxy) phenyl] propane 36.95g (90mm ◦ 1) and organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "LP71〇〇 ") 2. 49 g (10 mmo 1) of 4-50 g of N-methyl-pyrrolidone were dissolved and reacted at room temperature for 12 hours. Then, 3 g of pyridine and 71 g of acetic anhydride were added to the reaction solution, and the dehydration ring-closure reaction was performed at 100 ° C for 3 hours. Then, the reaction solution was distilled off under reduced pressure, and after purification, a polyimide solution having a solid content of 10% was obtained. A reaction vessel containing 100 parts by weight of r-butyrolactone was maintained at 85 ° C under a nitrogen gas atmosphere, 65 parts by weight of n-butyl acrylate, and 30 parts by weight of dimethylaminoethyl acrylate, A mixed solution composed of 5 parts by weight of glycidyl methacrylate and 1 part by weight of azobisisobutyronitrile was continuously added to the reaction container for 5 hours, and solution polymerization was performed while stirring. After the dropping was completed, stirring was continued at 85 ° C for 2 hours to complete the solution polymerization to obtain a 50% solids acrylic acid solution. 50 parts by weight of the polyimide solution (solid content), 30 parts by weight of the acrylic polymer solution (solid content) and Epyc 〇at 8 2 8 (trade name manufactured by Sheol Epoxy Corporation) 20 weight After reacting at 70 ° C. for 3 hours, 3 parts by weight of acetic acid was slowly added and mixed to adjust p Η. Next, 1,000 parts by weight of distilled water was added slowly, and vigorous stirring was performed to obtain a latex of cationic organic particles containing polyimide resin as a main component. [Modulation of Aqueous Dispersion] This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) -4 ^--------- Order --------- Line ( Please read the precautions on the back before filling in this page) 538〇73 A7 V. Description of the invention (41) (Example 1) The dispersion liquid of copper fine particles a 5 0 0 parts by weight (converted by solid content) (100 parts by weight) was mixed with 100 parts by weight of the acrylic resin latex obtained in Synthesis Example 6 (100 parts by weight in terms of solid content) to prepare an aqueous dispersion. The volume ratio of the copper fine particles to the acrylic resin in this aqueous dispersion was 5 3/47, and the water content measured by the Karr-Fischer method was 13% by weight. (Example 2) A copper fine particle dispersion liquid b 500 parts by weight (100 parts by weight in terms of solid content conversion) prepared in Synthesis Example 2 and 100 parts by weight of an acrylic resin latex obtained in Synthesis Example 6 ( 10 parts by weight in terms of solid content) was mixed to prepare an aqueous dispersion. The volume ratio of the copper fine particles to the acrylic resin in this aqueous dispersion was 5 3/47, and the water weight measured by the Karr-Fi scher's method was 13% by weight. (Example 3) 10,000 parts by weight (100 parts by weight of solid content conversion) of the dispersion liquid of the nickel fine particles obtained in Synthesis Example 4 and 100 parts by weight of the acrylic resin latex obtained in Synthesis Example 6 ( 10 parts by weight in terms of solid content) was mixed to prepare an aqueous dispersion. The volume ratio of the nickel fine particles to the acrylic resin in this aqueous dispersion is 5 3/47, and the water content measured by the 1 ^^ 4 ^ (: 1 ^^ method is 7% by weight. (Please read the back Please fill in this page again for attention} f -------- Order ———— Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economy 14 _ 538073 Λ7 B7 V. Description of the invention (42) (Example 4) (Please read the precautions on the back before filling out this page) The dispersion liquid of silver fine particles obtained in Synthesis Example 5 is 5 0 parts by weight (solid content 100 parts by weight) was mixed with 100 parts by weight of acrylic resin latex obtained in Synthesis Example 6 (10 parts by weight in terms of solid content) to prepare an aqueous dispersion. The silver particles and acrylic resin in the aqueous dispersion were mixed. The volume ratio is 49/51, and the water content measured by the Karr-Fischer's method is 13% by weight. (Example 5) The dispersion liquid of the silver fine particles obtained in Synthesis Example 5 was 500 parts by weight (solid content) 100 parts by weight) and 50 parts by weight of epoxy resin latex A prepared in Synthesis Example 7 (exchange of solid content) 10 parts by weight) were mixed to prepare an aqueous dispersion. The volume ratio of the silver fine particles to the epoxy resin in the aqueous dispersion was 49/5 1, and the moisture content measured by the Karr-Fischer's method was 7% by weight. (Example 6) The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a dispersion of copper fine particles a (50 parts by weight in solid content conversion) prepared in Synthesis Example 1 and those produced in Synthesis Example 6. 100 parts by weight of epoxy resin latex (10 parts by weight in terms of solid content) is mixed to prepare an aqueous dispersion. The volume ratio of the copper fine particles to the epoxy resin in the aqueous dispersion is 5 3/4 7 in Ka ^ -The amount of water measured by Fischer and France is 6.5 wt%. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 538073 Λ7 B7 V. Explanation of the Invention (43) (Example 7) The copper fine particle dispersion c 50 (parts in solid content conversion) of the copper fine particles prepared in Synthesis Example 3 and the polyisocyanate obtained in Synthesis Example 9 were used. 30.1 parts by weight of amine resin latex (2 · 0 parts by weight in terms of solid content) An aqueous dispersion was prepared by mixing. The volume ratio of the copper fine particles to the polyimide-based resin in the aqueous dispersion was 8 5/15, and the water content measured by the Karr-Fischer's method was 3.7 wt%. Example 8) 100 parts by weight (100 parts by weight of solid content conversion) of the dispersion liquid of the nickel fine particles obtained in Synthesis Example 4 and 100 parts by weight of the epoxy resin latex B obtained in Synthesis Example 8. (10 parts by weight in terms of solid content) An aqueous dispersion was prepared by mixing. The volume ratio of the nickel fine particles to the epoxy resin in the aqueous dispersion was 5 3/47, and the water content measured by the Karr-Fischer's method was 3.5% by weight. (Example 9) 5,000 parts by weight (100 parts by weight of solid content conversion) of the dispersion liquid of the silver fine particles obtained in Synthesis Example 5 and 100 parts by weight of the polyimide resin latex obtained in Synthesis Example 9. Parts (6 · 5 parts by weight in terms of solid content) were mixed to prepare an aqueous dispersion. The volume ratio of the silver fine particles to the polyfluorene-based resin in this aqueous dispersion was 5 9/4 1, and the water content measured by the Karr-Fischer's method was 11% by weight. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -46------------- clothing -------- order ------ --- Line AW (Please read the notes on the back before filling out this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 B7 V. Description of the invention (44) (Comparative Example 1) Ion exchanged water 1 0 0 A part by weight was substituted for 100 parts by weight of the acrylic resin latex of Example 1, and then added to the dispersion liquid a 500 parts by weight (the solid content was converted to 1,000 parts by weight) of the copper fine particles prepared in Synthesis Example 1. Aqueous dispersion. (Comparative Example 2) The alcohol dispersion liquid a of copper fine particles a prepared in Synthesis Example 1 a (50 parts by weight, 100 parts by weight in terms of solid content) was directly used (that is, no aqueous dispersion was added). (Comparative Example 3) 500 parts by weight of ion-exchanged water was used instead of 100 parts by weight of the epoxy-based resin latex of Example 6, and then added to the dispersion liquid a 50 parts by weight of the copper fine particles obtained in Synthesis Example 1. (100 parts by weight in terms of solid content), an aqueous dispersion was prepared. [Formation and Performance Evaluation of the Conductive Layer] [4-1] The electrode deposition on the anode was arranged in the dispersions of Examples 1 to 5 and Comparative Examples 1 and 2 as a copper sputtered sand wafer as an anode and as a countermeasure. On the SUS plate of the electrode (cathode), particles were deposited on the anode electrode (electrode deposition time: 2 minutes) by a constant voltage method of 70 V. Then, it is heated at 100 ° C for 10 minutes, and then heated at 250 ° C for 1 hour in a nitrogen atmosphere mixed with 3% hydrogen. The paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm). Li) ------------ clothing -------- order --------- line (please read the precautions on the back before filling this page) 538073 A7 ______ Β7_ _15. Description of the invention (45) A conductive layer having a thickness of 1 5 // m is obtained. Also, in the alcohol dispersion of Comparative Example 2, a film could not be formed even when a voltage was applied. The storage stability of the dispersions of Examples 1 to 5 and Comparative Examples 1 and 2 were evaluated by the following methods. The performance of the conductive layer obtained by electrode deposition was evaluated by the method described below. The results are shown in Tables 1 and 2. [Storage Stability] Place the dispersion in a plastic bottle and visually observe the dispersion state and viscosity after storage at 20 ° C for 10 days. The evaluation results are expressed in the following two stages. 〇: No change in viscosity and good dispersion state X: Separation into two layers [Volume resistivity] Measured in accordance with J I S K 6 4 8 1. (Read the precautions on the back before filling out this page.) Printed and peeled off layer of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics, conducts electrical conductivity test, and tests the stripped tape. Change in price changes. Sticky review without peeling off the whole part slightly peeled off 1 Luo Ji Wan only sexual race 2 ...... Writing description 0 △ X Sticky C Applicable to China National Standard (CNS) A4 specifications (210 x 297 mm) 538073 A7 B7 V. Description of the invention (46) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economy Table 1 Example 1 Example 2 Example 3 Conductor particle material copper copper nickel volume resistivity &quot; 0.017 0.017 0.070 Primary particle size (// m) Weight 0.05 0.30 0.02 Grain weight (solid content) 100 100 100 Particle material Acrylic carboxyl Acrylic carboxyl Acrylic acid carboxyl functional group 10 10 10 Industry parts by weight (solid content) Water volume Ratio 2) 53/47 53/47 53/47 pH 9.0 9.2 8.9 Viscosity (mPa · s) 10 10 10 Water content (%) 13 13 7 Liquid-solid content concentration (%) 18 18 18 Storage stability. 〇Conductive film thickness (// m) 15 16 15 Electrical volume resistivity &quot; 0.2 0.08 0.9 Layer adhesiveness 0.001) The unit of volume resistivity is (ΗΤ4Ω · cm). 2) The volume ratio is expressed by conductive particles / organic particles. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -49------------- 41k clothing -------- Order ----- ---- Line (Please read the notes on the back before filling this page) 538073 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention (47) Table 2 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Conductor particle material Silver Silver Copper Copper Electrical volume resistivity &quot; 0.016 0.0176 0.017 0.017 Properties-secondary diameter (/ m) 0.07 0.07 0.05 0.05 parts by weight (solid content) 100 100 100 100 Ziyezhengzi material acrylic acrylic-- Organic functional carboxyl carboxyl group--, f / 丄 parts by weight (solid content) 10 10--water volume ratio 2) 49/51 49/51 100/0 100/0 pH 9.0 9.2 9.0-viscosity (m Pa · S) 10 10 10 7 Water content (%) 13 7 17 1 Liquid-solid content concentration (%) 18 18 17 20 Storage stability 〇〇〇 Conductive film thickness (β m) 15 15--Electrical volume resistivity &quot; 0.1 0.2--layer adhesion 〇〇--1) unit of volume resistivity (10 · 4Ω • cm) ° 2) represents a volume ratio based conductive particles / organic particles. -------- Order · -------- (Please read the precautions on the back before filling in this page) This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) -50-538073 Λ7 B7 V. Description of the invention (48) From Tables 1 and 2, it is known that the storage stability of the aqueous dispersions of Examples 1 to 5 are excellent, and thus the conductive formed by the aqueous dispersion by electrode deposition The volume resistivity of each layer is low, and the adhesion of the substrate is also good. However, Comparative Example 1 without an organic particle-containing aqueous dispersion had insufficient film-forming properties, and Comparative Example 2 without an organic particle-containing alcohol dispersion was unable to perform electrode deposition. The storage stability of the dispersions of Comparative Examples 1 and 2 was not good. [4-2] The electrode deposition on the cathode was arranged in the dispersions of Examples 6 to 9 and Comparative Examples 2 and 3, respectively, as a copper sputtered silicon wafer as a cathode and a SUS plate as a counter electrode (anode) Particles were deposited on the cathode using a constant voltage method of 2000 V (electrode deposition time: 2 minutes). Then, it was heated at 100 ° C for 10 minutes, and then heated at 250 ° C for 1 hour in a nitrogen atmosphere mixed with 3% hydrogen to obtain a conductive layer having a thickness of 15%. When the dispersion liquid of Comparative Example 2'3 was also used, a film could not be formed even by electrode deposition. The storage stability of the dispersions of Examples 6 to 9 and Comparative Examples 2 and 3 was evaluated as described above. The performance of the conductive layer obtained by electrode deposition was evaluated by the above method. The results are shown in Tables 3 and 4. -------------------- Order --------- line ^^ (Please read the notes on the back before filling this page) Intellectual Property of the Ministry of Economic Affairs The paper size printed by the Bureau ’s Consumer Cooperatives applies the Chinese National Standard (CNS) A4 (210 x 297 mm) 538073 Λ7 B7 V. Description of the Invention (49) Printed by the Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3 Example 7 Example 8 Conductor, Hepsticks Material Copper Copper Nickel Primary Primary Particle Size (// m) 0.05 0.5 0.02 Sexual Weight (solid content) 100 100 100 Epoxy Polyimide Epoxy Resin Machine Centrifugal content (solid content) 10 2.0 10 Volume ratio of pine nuts (conductivity / organic) 53/47 85/15 53/47 pH 9.0 5.5 8.9 Viscosity (m Pa · s) 10 10 10 Water Amount (%) 6.5 11 3.5 Concentration of liquid and solid content (%) 18 18 10 Storage stability 0.00 Thickness of conductive film (m) 15 16 15 Electrical volume resistivity (1CT4Q · cm) 0.1 0.1 0.2 Layer adhesion 〇〇〇 ----------------------------- ^ (Please read first Please fill in this page again before filling in this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210 x 297 mm) 538073 A7 B7 V. Description of Invention (50) Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 4 Example 9 Comparative Example 2 Comparative Example 3 Conductor particle material: silver copper nickel primary particle size (μm) 0.07 0.05 0.05 Sexual weight part (solid content) 100 100 100 Particle material polyfluorene imide--Machine weight part ( Solid content) 6.5--Volume ratio of water particles in industry 丄 59/41 100/0 100/0 (conductivity / organic) pH 9.0-9.0 Bulk viscosity (mPa · s) 10 7 10 Liquid water content (%) 11 1 56 Solid content concentration (%) 18 20 17 Storage stability 〇X 〇 Conductive film thickness (# m) 15 No film formation No film formation Electrical volume resistivity layer (1 〇'4 Ω · cm) 0.05--Sticky Charging property 0--From Tables 3 and 4, we know the storage of the aqueous dispersions of Examples 6 to 9 (please read the precautions on the back before filling this page) -------- Order ----- ----- · This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 538073 A7 B7 V. Description of the invention (51) The stability is excellent. The conductive layer formed by the aqueous dispersion electrode deposition has good electrical properties and good adhesion. However, the dispersion liquids of Comparative Examples 2 and 3 containing no organic particles did not have film-forming properties, and the storage stability of the dispersion liquid of Comparative Example 2 was not good. [5] Production and performance evaluation of circuit board A circuit board was prepared using the prepared aqueous dispersion, and its performance was evaluated. (Example 10: Production of a circuit board in accordance with Method 1) A glass fiber was impregnated with a BT resin (trade name of Mitsubishi Gas Chemical Co., Ltd.), and a semi-hardened 100 / m thick substrate was used as a thick core. The insulating layer 41 is used. A through-hole 411 having a diameter of 80 // m is formed at a predetermined position of the thick-core insulating layer 41 by a carbon dioxide laser [Fig. 1 (a)]. Next, a conductive foil 4 2 composed of a copper foil of 1 8 // m thick is adhered to the other surface of the thick-core insulating layer 41 by hot pressing [FIG. 1 (b)]. Next, the thick core insulating layer 41 having the conductive foil 4 2 was immersed in the dispersion liquid of Example 6, so that the conductive foil 42 became the cathode, the counter electrode became the anode, and the temperature was 20 ° C under stirring. The electrode was deposited at a distance of 15 cm and a voltage of 200 V for 2 minutes. Next, the epoxy resin accumulated in the through hole 4 1 1 was pre-dried at 100 ° C for 15 minutes to form a through conductive portion 431 [Fig. 1 (c)]. The conductive foil is aligned and laminated on a semi-hardened substrate containing the conductive foil, and heated by vacuum heating in a nitrogen atmosphere mixed with 3% gas and heated at 200 ° C. This paper applies Chinese national standards (CNS) A4 size (210 x 297 mm) (Please read the notes on the back before filling out this page) Order --------- Line-Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economy 538073 Λ7 B7 V. Invention Explanation (52) The substrate is completely hardened in 1 hour, and a substrate [3 (1)] where an interlayer circuit is bonded by penetrating the conductive portion 4 3 1 is obtained. Next, a pattern was formed on the conductive foil 42 using a dry film resist, and then immersed in a ferrous chloride etchant for etching to obtain a hardened circuit-containing substrate [Fig. 1 (e)]. (Example 11: Manufacture of circuit board according to method 2) The substrate of the circuit manufactured in Example 10 was used as a thick-core wiring board 4 8 [Fig. 2 (a)], and the photosensitive epoxy resin was formed to a thickness of 1 0 0 // m is coated on both sides of the thick-core wiring substrate 4 8 to form an insulating layer 4 5 [FIG. 2 (b)]. Then, a through hole 4 5 1 with a diameter of 8 0 // m is formed on the insulating layer 4 5 to form an insulating layer pattern 4 6 [Fig. 2 (c)]. After this was electrolessly plated [Fig. 2 (d)], it was immersed in the dispersion liquid of Example 7 so that the electroless plating layer 47 became the cathode, the counter electrode became the anode, and the electrode was stirred at a temperature of 20 ° C. The electrode was deposited at a distance of 15 cm and a voltage of 2000 V for 2 minutes. Next, the polyimide-based resin deposited by the electrode was pre-dried at 100 ° C for 15 minutes to form a conductive layer 43 on the entire surface of the electroless plating layer 47 [Fig. 2 (e)]. A part of this conductive layer 43 becomes a through conductive portion 432 formed in the through hole 451. The conductive layer 43 was completely hardened by heating in a heat-drying oven in a nitrogen atmosphere mixed with 3% hydrogen at 230 ° C for 1 hour, and a circuit board was obtained by bonding the interlayer circuit with the conductive portion 4 32. (Example 1 2) In Example 10, when the through conductive part 4 3 1 was formed, the paper size of the example was applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back first) Please fill in this page again for matters) —P-shirt -------- Order --------- Printed by the Consumers Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Disclosure of invention (53) 7 is used for electrode deposition, and pre-dried at 1000 ° C for 15 minutes. Then, it was immersed in a copper electroplating bath (manufactured by Japan Electroplating Co., Ltd. under the trade name "Micropharb Cu200") with "conducting foil 4 2 as the cathode and voltage IV 'in one cycle of the energization time of 0 ms (500 ns). 0V) for 5 minutes. The rest of the method was the same as that of Example 10 to obtain a hardened substrate including a circuit. (Comparative Example 4) Unlike Example 10 in which a through-conductive portion 431 is formed by depositing an electrode in a through-hole 411, a copper-based conductive paste (viscosity: 100 Pa · s) is interposed between a metal plate (thickness 100 // m , The aperture 90 // m) is filled in the through hole 4 1 1 by a screen printing machine. The rest was the same as in Example 10 to obtain the circuit board of Comparative Example 4. [Resistivity of Insulating Layer] Measured in accordance with J I S K 6 9 1 1. [Resistance through the conductive portion] The resistivity between the upper and lower layers was measured to obtain the volume resistivity. [Connection Reliability Test of Penetrating Conductive Parts] After the circuit board was left at -5 5 ° C for 30 minutes, it was repeated for 1 2 5 t: the cycle for 30 minutes was repeated 5000 times, and the connection was observed with 500 bumps The amount of change in the resistance of the circuit. The test result is when the resistance is 250 m Ω. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page). ---- Line _ 538073 Λ '------------ __ V. Description of the invention (54) The following are judged as passing (0), and above 250 m Ω are judged as failing (X) . [Solder immersion test] The circuit board was immersed in a solder bath heated to 260 ° C for 10 seconds, and the change in resistance of the circuit connected to 500 bumps was observed. The test result is judged as pass (0) when the resistance of the mother-bump is 0.5 m or less when the resistance is less than 2 5 μm Ω, and it is judged as unsatisfactory (X) when the resistance is 0.5 m or more. Table 5 Example 1 0 Example 11 Example 1 2 Comparative Example 4 Method of making a conductive material forming liquid dispersion liquid dispersion liquid dispersion liquid electric circuit board substrate of a commercially available conductive material of Example 7 and Example 7 of Example 6 of the through-through portion 1 Method 2 Method 1 Printing method (electrode deposition) (electrode deposition) (electrode deposition) 0.2 0.3 0.1 10 resistivity (m Ω · cm) of the through-conducting temperature Ring test connection letter solder immersion 〇〇〇 × Reliability stain test This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) ---- ---- Order --------- Line 1 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 ____ B7 V. Description of the Invention (55) From Table 5 It was found that a circuit board provided with a conductive layer formed from the aqueous dispersion of the present invention is connected with a low resistivity of an interlayer circuit by penetrating a conductive portion and has excellent connection reliability. In addition, in Comparative Example 4 in which a through conductive part was formed by a printing method using a conventional conductive paste, a conductive paste having a relatively high viscosity could not be filled in a through hole with a diameter of 80 / m. Therefore, the resistivity of the through conductive part is high, and Connection reliability is also insufficient. [Manufacturing and Performance Evaluation of Multilayer Wiring Boards] (Example 1 3) (1) Production of thick-core wiring board: First, prepare the insulating property made of glass fiber reinforced epoxy resin with a thickness of 50 0 // m A laminated material made of a copper layer with a thickness of 1 8 // m is formed on the substrate. A carbon dioxide laser device is used to form a through hole with a diameter of 1000 / m (see FIG. 5) on the insulating substrate of the laminated material. And Figure 6). This laminated material was immersed in the dispersion of Example 6 in a state of protecting one side of the metal layer, and the metal layer was used as a cathode for precipitation. The temperature of the electrode deposition solution was 20 ° C, and the distance between the electrodes. 2 5 cm, applied voltage 2 Ο Ο V 'Condition time electrode deposition process under the condition of 60 minutes' Conductive fine particles and organic particles are formed in the through holes of the insulating substrate. After pre-drying at 〇 ° C for 15 minutes, the substrate short-circuit portion was formed by heat treatment at 17 Ot and 30 minutes in a reducing atmosphere (in a nitrogen gas containing 3% hydrogen) (see FIG. 7). . After the honing of the surface of the insulating substrate of the laminated material, the paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------- ^ ----- ---- Line 01 ^ (Please read the notes on the back before filling this page) 538073 A7 _ B? V. Description of the invention (56) (Please read the notes on the back before filling this page) The surface of the marginal substrate Electroless plating or electroplating is performed to form a metal layer with a thickness of 20 vm. The metal layer is subjected to a photo-etching process to form a first substrate wiring layer, and a first substrate wiring layer is produced, and a short circuit portion between the substrate is electrically connected below. A thick-core wiring board with a metal layer of the first substrate wiring layer (see FIG. 4). (2) The upper insulating layer, the interlayer short-circuit portion and the thick core wiring substrate are formed at a temperature of 16 5 t and a pressure of 30 kg / cm 2, and an epoxy prepreg sheet with a thickness of 60 0 // m is formed. Hot pressing is performed on the thick core wiring substrate obtained in the above step (1) to form an upper insulating layer, and a carbon dioxide laser is formed on the upper insulating layer to form a through hole with a diameter of 0 0 // // m (see FIG. 8). Next, the state under the metal layer of the thick-core wiring substrate was protected. In the dispersion of Example 6, the first substrate wiring layer was used as the cathode for precipitation. The temperature of the electrode deposition solution was 20 ° C, and the distance between the electrodes was 25 cm. Under the conditions of an applied voltage of 2 0 0 V and a processing time of 15 minutes, the printed electrode deposition process of the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the Ministry of Economic Affairs was performed with a constant voltage method, and conductive particles and conductive particles were formed in the through holes of the upper insulating layer. The organic particles are pre-dried at 100 ° C for 15 minutes, and then heat-treated at 170 t for 30 minutes in a reducing atmosphere (in a nitrogen gas containing 3% hydrogen). An interlayer short-circuit portion is formed (see FIG. 9). Next, after honing the surface of the upper insulating layer, the surface of the upper insulating layer is chemically plated and electroplated to form a metal layer with a thickness of 20 (see FIG. 10). Then apply a photo-etching place to the metal layer of the thick-core wiring substrate -59-This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) 538073 Λ7 B7 V. Description of the invention (57) Form the second substrate wiring Layer to produce a thick-core wiring board (see FIG. 1 1). (Please read the precautions on the back before filling in this page) (3) The formation of the lower wiring layer, the interlayer short-circuit part, the upper insulation layer and the lower wiring layer is at a temperature of 1 6 5 t: and a pressure of 30 kg / cm 2 Next, an epoxy prepreg sheet with a thickness of 60 / m is thermally adhered to the bottom of the thick-core wiring substrate on which the upper insulating layer and the interlayer short-circuit portion are formed on the upper surface obtained in the step (2) above to form a lower insulating layer. A carbon dioxide laser is used to form a through hole with a diameter of 10 0 // m on the lower insulating layer (refer to FIG. 12). Next, the upper state of the metal layer formed on the upper insulating layer was protected. In the dispersion liquid of Example 6, the second substrate wiring layer was used as the cathode for precipitation, the temperature of the electrode deposition solution was 20 t, and the distance between the electrodes was 2 5 cm, an applied voltage of 200 V, and a processing time of 8 minutes, the electrode deposition process of the constant voltage method was performed to form a deposit of conductive fine particles and organic particles in the through hole of the upper insulating layer. After pre-drying at 15 ° C for 15 minutes, heat treatment is performed at 170 t for 30 minutes in a reducing atmosphere (in a nitrogen gas containing 3% hydrogen) to form an interlayer short-circuit portion (see Figure 13) . Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Second, after the surface of the lower insulating layer is honed, the surface of the lower insulating layer is electrolessly plated and electroplated to form a metal layer with a thickness of 20m. Then, the metal layers formed on the surfaces of the upper insulating layer and the lower wiring layer are subjected to photo-etching to form an upper wiring layer and a lower wiring layer (see FIG. 14). The surface containing the upper insulating layer above the upper wiring layer and the lower wiring- OU-This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 538073 A7 B7 V. Description of the invention (58) The surface of the lower insulating layer is formed The solder resist is used to manufacture the multilayer wiring board of the present invention. The volume fraction of the conductive fine particles in the interlayer short-circuit portion formed by the short-circuit portion of each of the substrates and the upper and lower insulating layers is about 53%. (Example 1 4) In the formation of the substrate short-circuit portion and the interlayer short-circuit portion, the dispersion liquid of Example 7 was used instead of the dispersion liquid of Example 6, and the deposit formed by the electrode deposition process was pre-dried and then immersed in In a copper plating solution (manufactured by Japan Electroplating Co., Ltd. under the trade name "Micropharb Cu200"), a conductive foil 42 is used as a cathode, and a voltage of 1 V is applied for 1 millisecond of conduction time (3,000 milliseconds is 0 millivolts). ). The rest is the same as the method of Example 1 3 to manufacture the multilayer wiring board of the present invention. The volume fraction of the conductive fine particles in the interlayer short-circuit portion formed by the short-circuit portion of each of the substrates and the upper and lower insulating layers is about 85%. (Comparative Example 5) Except that a copper-based conductive paste (viscosity: 100 Pa · s) was interposed between a metal plate (thickness 1 0 0 // m, hole diameter 9 0 // m), the through hole 4 1 was filled with a screen printing machine. 1. In a reducing atmosphere (in a nitrogen gas containing 3% hydrogen), a substrate short-circuit portion and an interlayer short-circuit portion are formed by heat treatment at 170 ° C for 30 minutes to replace the substrate short-circuit formed by the electrode deposition solution. The multilayer wiring board for comparison was manufactured in the same manner as in Example 12 except for the other parts except the interlayer short-circuit part. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -01-------------, clothing -------- order ----- ---- Wire · (Please read the precautions on the back before filling in this page) 538073 Λ7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention (59) [Evaluation of multilayer wiring boards] (1) Wiring Initial resistance: Measure the resistance between the bonding pads on the upper wiring layer of the multilayer wiring board and the bonding pads on the lower wiring layer, and take the average value. (2) Resistance of the wiring after the thermal cycle test: The operation of placing the multilayer wiring board at a temperature of 5 5 t: 30 minutes, and placing it at 30 minutes at 12 5 t is regarded as 1 cycle, and a total of 5 0 cycles are performed. Then, the resistance between the bonding pads on the upper wiring layer and the bonding pads on the lower wiring layer of the multilayer wiring board is measured, and the average 値 of each bonding pad is obtained. The above results are shown in Table 6. Table 6 Example 1 after initial resistance (m Ω) thermal cycle test 1 3 0.2 0.3 Example 1 4 0.1 0.1 Comparative example 5 0.4 1.0 From the results in Table 6, the multilayer wiring boards of Example 1 3 and Example 14 are known. The resistance of the wiring is low, and the resistance change of the wiring is low even after the thermal cycle test, and it has high connection reliability. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 4 ^ clothing -------- order --------- line · (Please read the note on the back first Please fill in this page again for details) 538073 A7 B7 V. Description of the invention (60) The present invention is not limited to the above-mentioned embodiments, and there are various changes. For example, an insulating layer formed on a thick-core wiring substrate may be on one side or the other side of the thick-core wiring substrate, and an insulating layer may be further laminated on the insulating layer. A thick-core wiring substrate may be a multilayer structure as long as it is formed by forming a substrate wiring layer having both sides electrically connected to each other. (Please read the notes on the back before filling in this page) (CNS) A4 size (210 X 297 mm)

Claims (1)

CC 3 5 Sixth, the scope of patent application ^ No. 891 24708 Patent Application Chinese Patent Application Amendment (please read the precautions on the back before filling this page) Amendment on August 30, 1991 1. An aqueous dispersion for conductive layer formation , Characterized in that the number average particle diameter is less than 1 μm selected from gold, silver, copper, aluminum, zinc, nickel, palladium, platinum, cobalt, rhodium, iridium, iron, ruthenium, starvation, chromium, tungsten, molybdenum, titanium '' Conductive fine particles of bismuth, lead, boron, silicon, tin, and barium metals or alloys of these and organic particles composed of at least one of a polymerizable compound and a polymer are dispersed in an aqueous medium. The volume ratio of the organic particles is 99: 1 ~ 40: 60, and a conductive layer can be formed by electrode deposition. 2 · The aqueous dispersion for the formation of the conductive layer according to item 1 of the scope of patent application, which is a conductive fine particle dispersion in which the above-mentioned conductive fine particles are dispersed in an organic solvent, and an organic particle dispersion in which the above-mentioned organic particles are dispersed in an aqueous medium. Made by mixing. 3. A conductive layer, which is characterized by printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economics formed by electrode deposition using an electrically conductive layer such as the first or the second patent application to form an aqueous dispersion. Volume resistivity 1 0 — 4 Ω · cm or less. 4. An electronic part, characterized by having a conductive layer formed by electrode deposition using an electrically conductive layer as described in the first or second aspect of the patent application to form an aqueous dispersion. 5 · A circuit substrate, which is characterized by having an insulating layer, and formed by an electrode deposition method using an aqueous dispersion formed of a conductive layer as described in item 1 or 2 of the patent application as an electrode deposition solution, and containing The paper size penetrating the insulating layer is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -1-^ 3 ^ 〇73 Α8 Β8 C8 D8 R, the conductive layer of the poorly conductive portion of the patent application scope. 6 · A method for manufacturing a circuit board, which is characterized by the method of manufacturing a circuit board using an aqueous dispersion of conductive layer formation as described in the first item of the application_profit scope, and includes (a) a step of forming a through hole in the insulating layer (B) a surface of one of the insulating layers includes a step of disposing a conductive foil on a part of an open end of the through hole, (c) forming the above-mentioned conductive layer into an aqueous dispersion for an electrode deposition solution, A step of forming a through-hole conductive portion in the through-hole by an electrode deposition method using the conductive foil as one of the electrodes. 7 · A method for manufacturing a circuit board, which is characterized by using a method for manufacturing a circuit board using an aqueous dispersion for forming a conductive layer as described in item 1 of the scope of the patent application, and (a) forming a thick core wiring board on which a conductor pattern is formed Step of insulating layer, (b) forming the insulating layer into a pattern, forming an insulating layer pattern having a through hole exposing a part of the conductor pattern, (c) using the insulating layer pattern as a mask The step of chemical plating of materials to form an electroless plating layer in a portion containing the above-mentioned through-holes, (d) using the above-mentioned conductive layer forming aqueous dispersion liquid for the electrode deposition solution, and using the above-mentioned conductor pattern and the above-mentioned electroless plating layer as The electrode deposition method of one of the electrodes is a step of forming a conductive layer including the through-hole conductive portion in the through-hole. 8 · A kind of circuit board manufacturing method, the characteristics of which will apply the Chinese national standard (CNS) A4 specification (210X297 mm) if you apply for a special paper size (please read the precautions on the back before filling this page) Order the Ministry of Economic Affairs Printed by the Intellectual Property Bureau's Consumer Cooperatives 538073 A8 B8 C8 ___ D8 6. Multi-layer lamination of circuit substrates made by the method of patent application scope 6 or 7 09 · A multilayer wiring board, its characteristics are It has: a thick-core wiring substrate formed on both sides of an insulating substrate by substrate wiring layers electrically connected to each other; an insulating layer laminated on at least one side of the thick-core wiring substrate; a wiring layer formed on the insulating layer; The wiring layer is an interlayer short-circuiting portion that electrically connects the substrate wiring layer and extends through the thickness of the insulating layer. The multilayer wiring substrate is composed of a conductive material made of conductive particles in a polymer substance. The conductive fine particles of the conductive system are dispersed in an aqueous medium with organic particles composed of at least one of a polymerizable compound and a polymer. In the electrode deposition liquid formed in the body, the formed one is processed by electrode deposition. 1 〇. The multilayer wiring board of item 9 in the scope of the patent application, wherein the volume fraction of the conductive fine particles of the conductor constituting the interlayer short-circuit portion is 40 to 99%. A multilayer wiring board having a thick-core wiring substrate formed by forming substrate wiring layers electrically connected to each other on both sides of an insulating substrate; an insulating layer laminated on at least one side of the thick-core wiring substrate; and the insulating layer The formed wiring layer electrically connects the substrate wiring layer and the interlayer short-circuit portion extending through the thickness direction of the insulating layer; the multilayer wiring board, the interlayer short-circuit portion is made of conductive particles contained in a polymer substance Consisting of the conductive body, the conductive particles of the conductive system and the size of the paper conform to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page), 1T Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives 538073 A8 B8 C8 D8 6. Scope of Patent Application (Please read the precautions on the back before filling this page) Organic particles composed of at least one of a compound and a polymer are dispersed in an electrode deposition solution composed of an aqueous medium, and formed by an electrode deposition process. The thick-core wiring substrates are electrically connected to each other for insulation. A substrate short-circuiting portion of the substrate wiring layer formed on both sides of the substrate and extending through the thickness direction of the insulating substrate. The substrate short-circuiting portion is made of a conductive body made of conductive particles contained in a polymer substance, and the conductive system is conductive. Organic fine particles and organic particles composed of at least one of a polymerizable compound and a polymer are dispersed in an electrode deposition solution composed of an aqueous medium, and formed by electrode deposition treatment. 12. The multilayer wiring board according to item 11 of the scope of patent application, wherein the volume fraction of the proportion of the conductive fine particles constituting the conductors between the interlayer short-circuit portion and / or the substrate short-circuit portion is 40-99.9%. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A manufacturing method for multilayer wiring boards, which is a method for manufacturing multilayer wiring boards such as the scope of patent application No. 9, which is characterized by the following steps: A substrate; a substrate wiring layer formed on one surface of the insulating substrate; a metal layer formed on the other surface of the insulating substrate and electrically connected to the substrate wiring layer; a thick-core wiring substrate composed of the thick core An insulating layer having a through hole formed corresponding to the interlayer short-circuit portion to be formed on the substrate wiring layer is formed on one surface of the wiring substrate, and the substrate wiring layer of the thick-core wiring substrate forming the insulating layer is used as a precipitation electrode. This paper is made up of conductive fine particles and organic particles composed of at least one of polymerizable compounds and polymers dispersed in an aqueous medium. This paper is applicable to Chinese National Standard (CNS) A4 (210X297 mm) ΓΤΓ 538073 A8 B8 C8 D8 VI. Patent application electrode deposition solution, through electrode deposition treatment in the through hole of the insulation layer The step of short circuit portion of the conductor to constitute the interlayer. (Please read the precautions on the back before filling in this page) 1 4. If you are manufacturing a multilayer wiring board according to item 13 of the scope of patent application, in which the electrode deposition liquid forming the conductor constituting the interlayer short-circuit part described above, conducts electricity The volume ratio of the microparticles to the organic particles is 9 9: 1 to 4 0: 60. 15. A method for manufacturing a multilayer wiring board, which is a method for manufacturing a multilayer wiring board such as item 11 of the scope of patent application, which is characterized by having the following steps: preparing at least an insulating substrate and at least one insulating substrate The substrate forming material of the metal layer formed on the other surface forms a through-hole that penetrates the thickness direction of the insulating substrate of the substrate forming material. The employee's cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the metal layer of the substrate forming material for precipitation. An electrode, which is composed of conductive fine particles and organic particles composed of at least one of a polymerizable compound and a polymer, is dispersed in an electrode deposition solution composed of an aqueous medium, and is passed through the insulating substrate through electrode deposition. A conductive body constituting an interlayer short-circuit portion is formed in the hole, and then a substrate wiring layer is formed on one surface of the insulating substrate, and a substrate wiring layer formed on one surface of the insulating substrate is formed; Thick-core wiring substrate formed by the above-mentioned metal layer electrically connected to the substrate wiring layer An insulating layer having through-holes corresponding to the interlayer short-circuit portions to be formed on the substrate wiring layer is formed on one surface of the thick-core wiring substrate, and the substrate wiring layer of the thick-core wiring substrate forming the insulating layer is used as an electrode for precipitation. It is composed of conductive particles and at least one of the Chinese paper standard (CNS) A4 (210X297 mm) applicable to the paper size of polymerizable compounds and polymers. -5-538073 A8 B8 C8 D8 κ, at least one of the scope of patent application t Organic particles are dispersed in a polar source effusion formed in an aqueous medium, and an electrode deposition process is performed in the through hole of the insulating layer to form a conductive body constituting an interlayer short-circuit portion. 1 6 · A method for manufacturing a multilayer wiring board according to item 15 of the scope of the patent application, wherein the electrode deposition of the conductors constituting the interlayer short-circuit portion is formed, and / or the electrode deposits of the conductors constituting the short-circuit portion of the substrate are formed. The volume ratio of conductive microparticles and organic particles in the liquid and liquid is 9 9: 1 ~ 4 〇: 6 0 〇 (Please read the precautions on the back before filling out this page} Printed by the Intellectual Property Bureau Staff Consumer Cooperative Paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) -6-