535223 A7 °296twf . doc/0〇6 五、發明說明（/ ) 本發明是有關於一種離子植入機台在進行離子植入 前所需之選取及調製離子配方之系統及方法，且特別是有 關於一種離子植入機台在進行離子植入前，可提前自動選 取及調製離子配方之系統及方法。 請參考第1圖，其繪示的即是習知在進行離子植入時 的製程程序。其中當晶圓盒在離子植入機台的機械手臂上 時，操作人員必須控制機械手臂將晶圓盒載入至離子植入 機台（步驟S100)，此載入步驟需耗時90秒（sec)，之 後操作人員會經由離子植入機台的機台控制器選取晶圓 盒中的晶圓進行離子植入時所需之配方（步驟sl02)，然 後控制機台控制器進行配方調製（步驟sl04)，其間選取 步驟sl〇2及調製步驟sl04需費時15〜20分鐘，當配方調 製好後，操作人員才會操作機台控制器控制離子植入機台 對於載入的晶圓進行離子植入動作（步驟sl06)。 經濟部智慧財產局員工消費合作社印製 以上整個離子植入程序皆須有操作人員在一旁監視 及操作，不管是對機械手臂、機台控制器或是離子植入機 台，是以整個過程皆須以人工方式處理，不僅浪費人力亦 浪費時間。另外，由於載入步驟sl〇〇與選取步驟sl〇2之 間並無先後執行關係，是以根本無需先執行載入步驟slOO 再執行選取步驟sl02，可以在執行選取步驟sl02或調製 步驟si 04時，同時執行載入步驟sl00即可，是以習知的 做法無端浪費90秒的時間。 v 有鑒於此，本發明提出一種離子植入機台製程參數自 動預調系統，是將整個離子植入的製程程序予以自動化， 3 本紙張尺度適用中國國家標準（CNS)/Vi規格（210 x 297公,¾ ) 經濟部智慧財產局員工消費合作社印製 535223 8296twf . doc/ 006 A7 B7 五、發明說明（2) 不需浪費人工及時間，且在自動化過程中，是先動態選擇 配方，以減少人工上的誤差，之後再調製配方及載入晶圓 盒至離子植入機台。其中調製配方及載入晶圓盒至離子植 入機台可一起作，以省去90秒的載入時間。 此離子植入機台製程參數自動預調系統包括：資料 庫、資訊處理伺服器及機台控制器。 其中，在資料庫中，至少包括由站別代號、機台代號、 晶盒識別碼及製程參數所形成之資訊，而資訊處理伺服 器，則是用以獲取晶圓盒之識別碼，以及依據所獲取之晶 圓盒之識別碼自資料庫獲取資訊，另外，機台控制器，係 依據資訊中的製程參數，來調製晶圓盒進行離子植入時所 需之配方，且在同一時間資訊處理伺服器亦會控制機械手 臂將晶圓盒載入至離子植入機台中。 本發明又提出一種離子植入機台製程參數自動預調 方法，包括：先獲取晶圓盒之識別碼，再依據識別碼進而 獲取包括站別代號、機台代號、晶盒識別碼及製程參數之 資訊。接著，當經由判斷得知現階段獲取之晶圓盒應該進 行離子植入程序，且再經由判斷資訊中之製程參數是儲存 於機台控制器且爲正確之製程參數値，則資訊處理伺服器 會令機台控制器依據製程參數進行離子調製動作，且在同 一時間，資訊處理伺服器亦令機械手臂將晶圓盒載入至離 子植入機台，以讓離子植入機台進行離子植入動作。 其中在上述之作業流程中，若判斷出現階段獲取之晶 圓盒不應進行離子植入程序，則送出錯誤訊息，表示現階 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） · a^i i·— 1 mmmmmm _1 1 «ϋ · Mmmf emmmm I a— emmm I (請先閱讀背面之注意事:填寫本頁) #· 535223 8296twf.doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（>) 段獲取之晶圓盒不應是在離子植入的程序中，可能是在曝 光或是微影的程序中。另外，若判斷出製程參數是錯誤的 製程參數，則同樣的亦送出錯誤訊息。 本發明又再提出一種離子植入機台製程參數自動預 調方法，依據上述之方法，若在獲取第一晶_盒之識別碼 後的一個短暫時間內，尙有第二晶圓盒存在，則在經由獲 取第二晶圓盒之識別碼得知第二晶圓盒與第一晶圓盒係 同一群組後，再依據識別碼獲取包括站別代號、機台代 號、晶圓識別碼及製程參數之資訊，其中由於是有兩個晶 .圓盒中的晶圓要一起進行離子植入動作，是以會自動調整 植入晶盒所需之離子數量。之後之程序皆與上述方法相 同，在此不加以贅述。 綜上所述，本發明係利用資訊處理伺服器先讀取放置 在機械手臂上的晶圓盒識別碼，再至資料庫中找尋有關於 此晶圓盒識別碼的資訊，包括站別、機台以及製程參數等 等，然後在經由檢測後，判斷出製程參數存在且爲正確的 情況下，才可令機台控制器同時進行配方調製及使機械手 臂將晶圓盒載入離子植入機台。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細 說明如下： 圖式之簡單說明： 第1圖繪示的是習知之一離子植入程序； 第2圖繪示的是本發明之一離子植入機台製程參數自 (請先閱讀背面之注 意事 填寫本頁) -裝535223 A7 ° 296twf. Doc / 0〇5. Description of the invention (/) The present invention relates to a system and method for selecting and modulating an ion formulation required by an ion implantation machine before performing ion implantation, and in particular The invention relates to a system and method for an ion implantation machine to automatically select and modulate ion formulations in advance before performing ion implantation. Please refer to FIG. 1, which shows the process of the conventional ion implantation process. When the wafer cassette is on the robotic arm of the ion implantation machine, the operator must control the robotic arm to load the wafer cassette into the ion implantation machine (step S100). This loading step takes 90 seconds ( sec), after that, the operator selects the wafers in the wafer cassette for ion implantation through the machine controller of the ion implantation machine (step sl02), and then controls the machine controller to perform recipe modulation ( Step sl04), during which it takes 15-20 minutes to select step sl02 and modulation step sl04. After the recipe is prepared, the operator will operate the machine controller to control the ion implantation machine to ionize the loaded wafer. Implantation action (step sl06). The above-mentioned entire ion implantation procedure printed by the Employee Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs must be monitored and operated by the operator. Whether it is a robot arm, a machine controller, or an ion implantation machine, the entire process is It must be handled manually, not only wasting manpower but also time. In addition, because there is no sequential execution relationship between the loading step slOO and the selection step sl02, there is no need to perform the loading step sl100 and then the selection step sl02 at all. You can perform the selection step sl02 or the modulation step si 04. At this time, the loading step sl00 can be performed at the same time, and the conventional method wastes 90 seconds for no reason. v In view of this, the present invention proposes an automatic pre-adjustment system for the process parameters of the ion implantation machine, which is to automate the entire process of ion implantation. 3 This paper size applies the Chinese National Standard (CNS) / Vi specification (210 x 297, ¾) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 535223 8296twf .doc / 006 A7 B7 V. Description of the invention (2) It does not waste labor and time, and in the automation process, it first dynamically selects the formula to Reduce the manual error, and then adjust the recipe and load the wafer cassette into the ion implantation machine. The preparation of the recipe and the loading of the wafer cassette to the ion implantation machine can be done together to save the loading time of 90 seconds. This ion implantation machine process parameter automatic presetting system includes: database, information processing server and machine controller. Among them, the database includes at least information formed by the station type code, machine code, crystal box identification code and process parameters, and the information processing server is used to obtain the identification code of the wafer box, and the basis The obtained identification code of the wafer box is obtained from the database. In addition, the machine controller is based on the process parameters in the information to modulate the formula required for the wafer box for ion implantation, and the information is at the same time. The processing server also controls the robotic arm to load the wafer cassette into the ion implantation machine. The invention also proposes an automatic pre-adjusting method for the process parameters of the ion implantation machine, which includes: first obtaining the identification code of the wafer box, and then obtaining the station code, machine code, crystal box identification code, and process parameters based on the identification code. Information. Then, when it is learned that the wafer cassette obtained at the current stage should be subjected to the ion implantation procedure, and then the process parameters in the judgment information are stored in the machine controller and are correct process parameters, the information processing server It will make the machine controller perform ion modulation according to the process parameters. At the same time, the information processing server will also make the robotic arm load the wafer box into the ion implantation machine, so that the ion implantation machine can perform ion implantation. Into action. Among them, if it is judged that the wafer cassette obtained at the stage should not be subjected to the ion implantation procedure, an error message is sent to indicate that the current paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297). (Centi) · a ^ ii · — 1 mmmmmm _1 1 «ϋ · Mmmf emmmm I a— emmm I (Please read the note on the back: fill in this page first) # · 535223 8296twf.doc / 006 A7 B7 Intellectual Property Bureau, Ministry of Economic Affairs Printed by Employee Consumer Cooperatives 5. The wafer cassette obtained in the (>) paragraph of the invention should not be in the process of ion implantation, it may be in the process of exposure or lithography. In addition, if it is determined that the process parameter is an incorrect process parameter, an error message is also sent in the same way. The present invention further proposes a method for automatically pre-adjusting process parameters of an ion implantation machine. According to the above method, if a second wafer box exists within a short period of time after obtaining the identification code of the first crystal box, After knowing that the second wafer box is in the same group as the first wafer box by obtaining the identification code of the second wafer box, the station code, machine code, wafer identification code, and Information on the process parameters, since there are two wafers. The wafers in the round box need to perform ion implantation together, so the amount of ions needed to implant the box is automatically adjusted. The subsequent procedures are the same as those described above, and will not be repeated here. In summary, the present invention uses an information processing server to first read the wafer box identification code placed on the robot arm, and then to find information about the wafer box identification code in the database, including the station, machine, etc. Platform and process parameters, etc., and after testing, it is judged that the process parameters are present and correct, then the machine controller can perform recipe modulation and the robot arm load the wafer cassette into the ion implanter at the same time. station. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes the preferred embodiments in detail with the accompanying drawings as follows: Brief description of the drawings: FIG. 1 Shown is one of the conventional ion implantation procedures; Figure 2 shows the process parameters of an ion implantation machine of the present invention (please read the precautions on the back first and fill in this page)-
I 1 ϋ^δΊν · ϋ ·ϋ 1 ϋ —9 MmMm ϋ I 舞 本紙張尺度適用中國國家標準（CNSM4規格（210 x 297公餐） 535223 8 2 96 twf . doc/006 經濟部智慧財產局員工消費合作社印裂 8 2 96 twf . doc/ 0 0 6 A7 _B7____ 五、發明說明（^) 動預調系統之一方塊圖； 第3圖繪示的是本發明之一離子植入機台製程參數自 動預調方法之一流程圖；以及 第4圖繪示的是本發明另一離子植入機台製程參數自 動預調方法之一流程圖。 標號說明 200 :離子植入機台 202，204 :植入窗口 206，208 :機械手臂 210，212 :晶圓盒 210a，212a :晶圓 210b，212b :晶舟（cassette) 214，216 :識別碼辨識器 218 :機台控制器 220 :資訊處理伺服器 221 :資訊 222 :資料庫 224 :參數管理系統 步驟slOO至步驟sl06係習知之一實施步驟 步驟s300至步驟s306係本發明之一較佳實施步驟 步驟s400至步驟s430係本發明另一較佳實施步驟 較佳實施例 請參照第2圖，其繪示的是依照本發明一較佳實施例 的一種離子植入機台製程參數自動預調系統，是以完全自 (請先閱讀背面之注意事^填寫本頁) -裝I 1 ϋ ^ δΊν · ϋ · ϋ 1 ϋ —9 MmMm ϋ I The size of the paper is applicable to Chinese national standards (CNSM4 specification (210 x 297 meals) 535223 8 2 96 twf .doc / 006 Intellectual Property Bureau, Ministry of Economic Affairs, Employee Consumption Cooperative print 8 2 96 twf. Doc / 0 0 6 A7 _B7____ V. Description of the invention (^) A block diagram of the dynamic presetting system; Figure 3 shows the automatic process parameters of an ion implantation machine according to the present invention. A flowchart of one of the pre-adjusting methods; and FIG. 4 shows a flowchart of another method for automatically pre-adjusting the process parameters of the ion implantation machine of the present invention. Reference numeral 200: ion implantation machine 202, 204: planting Entry windows 206, 208: Robotic arms 210, 212: Wafer boxes 210a, 212a: Wafers 210b, 212b: Cassette 214, 216: Identification code identifier 218: Machine controller 220: Information processing server 221: Information 222: Database 224: Parameter management system steps sl100 to step sl06 are one of the known implementation steps. Steps s300 to step s306 are one of the preferred implementations of the present invention. Steps s400 to step s430 are another preferred implementation of the present invention. For a preferred embodiment of the steps, please refer to FIG. 2. It shows an automatic pre-adjusting system for the process parameters of an ion implantation machine in accordance with a preferred embodiment of the present invention, which is completely self-contained (please read the precautions on the back first ^ fill this page) -install
·1 - l_i ϋ · 1 1 11 ϋ n mmm§ mmm§ I #· 本紙張尺度適用中國國家標準（CNS)A4規格（21〇χ 297公釐） 經濟部智慧財產局員工消費合作社印製 535223 8296twf.doc/006 _____B7 五、發明說明（f) 動化的方式使晶圓可以進行離子植入動作，且可讓某些過 程並行運作，既省時間又省人力。 本發明的離子植入機台200至少具有一個機械手臂， 例如機械手臂2〇6，會將具有數個晶圓的晶圓盒210，經 由植入窗口 202載入離子植入機台200以進行離子植入製 程，其中每一晶圓盒皆包含晶圓（wafer)及承載晶圓的晶 舟（cassette)。在本發明所提供之離子植入機台製程參數 自動預調系統中包括：資料庫222、資訊處理伺服器220 及機台控制器218。 其中，資料庫222中包括之資訊221，至少包括站別 代號、機台代號、晶盒識別碼及製程參數，其中晶盒識別 碼是對應於晶圓盒的辨識方法，例如晶圓盒210的識別碼 是1 ’可以是由條碼型態呈現於晶圓盒210上，而站別代 號及機台代號是紀錄每一個晶圓盒所應存在之處，也就是 說’假設目前晶圓盒210應該是處於離子植入行程中，則 其目前所在的位置應是歸屬於離子植入站別中的某一台 機台中以進行離子植入，另外，製程參數記載的晶圓盒中 的晶圓在進行離子植入時所需的配方，也就是離子的種類 及濃度等配方資訊。 本發明所提供之資訊處理伺服器220,可以是一個工 Μ 用的個人電腦（Industrial Personal Computer ;簡稱 IPC) ’係用以獲取晶圓盒之識別碼，以及依據所獲取之 識別碼，自資料庫22獲取上述之資訊221。例如，在晶圓 盒21〇上有一識別碼辨識器214，用以辨識放置於機械手 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） · emmf ί _1 n 1 1· 1··· ammf mmmmr emmf a·— I t <請先閱讀背面之注意事珣再填寫本頁) 535223 8296twf.doc/006 A7 B7 五、發明說明（G ) 臂206上之晶圓盒210的識別碼，而資訊處理伺服器220 即可經由識別碼辨識器214已辨識出的識別碼，進而得知 目前待進行離子植入之晶圓盒識別碼。當資訊處理伺服器 220得知目前待進行離子植入之晶圓盒識別碼後，即會自 資料庫222中獲取此晶圓盒目前應存在的站別、機台以及 其製程參數爲何的資訊221。 在資訊處理伺服器220得知晶圓盒的資訊221後，機 台控制器218即會依據晶圓盒，假設爲晶圓盒210，在資 料庫222中的資訊221之製程參數，以調製晶圓盒210在 進行離子植入時所需之配方，且在同一時間資訊處理伺服 器220亦會控制機械手臂206將晶圓盒210經由植入窗口 202載入離子植入機台200中。 雖然上述之裝置已可達到自動化及並行處理的功 能，進而達到省時（即省去90秒的載入晶圓盒至離子植 入機台時間）及省人力的目的，但在運作的過程中，卻有 可能發生獲取的製程參數是錯誤的參數値，於是爲避免有 此情況產生，在本發明中又利用一參數管理系統（Recipe Manager System ;簡稱RMS) 224，係連結於資訊處理伺 服器220。 其中，參數管理系統224包括各個識別碼及各個識別 碼的製程參數，在資訊處理伺服器220自資料庫222獲取 晶圓盒的資訊221後，資訊處理伺服器220會將資訊221 中的製程參數送至參數管理系統224中，在參數管理系統 224經由比對後，會判斷資訊處理伺服器220所獲取之資 本紙張尺度適用中國國家標準（CNS)A4規格（21〇x2y7公餐） (請先閱讀背面之注 I · n n I II 1 n n^dJi ϋ ϋ ϋ ϋ n n ϋ I 填寫本頁) #· 經濟部智慧財產局員工消費合作社印製 535223 8296twf.doc/006 A7 B7 五、發明說明（q) 訊221之製程參數是否正確。 另外’爲了避免實際上在機台控制器218中並無存在 離子植入製程參數的問題，資訊處理伺服器220亦會詢問 機台控制益218是否具有離子植入製程參數及此離子植入 製程參數是否爲正確之製程參數，例如資訊處理伺服器 22〇會將參數管理系統224比對後的製程參數送至機台控 制器218作比對，而機台控制器218即會回傳一個關於離 子植入製程參數存在及正確與否之詢問結果至資訊處理 伺服器220 ’或是另一種情況是資訊處理伺服器22〇自機 台控制器218中擷取離子植入製程參數以進行比對，比對 結果正確即令機台控制器218進行配方調製動作。 經由上述確認過程，可使在自動化的過程中，將錯誤 率降至最低’否則動輒上百萬元的晶圓即可能會因錯誤而 無端耗損。 經濟部智慧財產局員工消費合作社印製 請合倂參照第2圖及第3圖，其繪示的是依照本發明 另一較佳實施例的一種離子植入機台製程參數自動預調 方法，此離子植入機台具有一機台控制器（即圖2的機台 控制器218)及至少一機械手臂，假設爲圖2的機械手臂 2〇6’則機械手臂206就會經由植入窗口 202將晶圓盒210 載入離子植入機台。 此離子植入機台製程參數自動預調方法包括：步驟 s300 ’先獲取晶圓盒210的識別碼，然後在步驟S3〇2中， 依據識別碼的比對獲取資訊221，其中資訊2U包括晶圓 盒210的所在站別代號、機台代號以及晶盒識別碼及在離 本紙張尺度適用中國國家標準（CNS)A4蜆格（210 X 297公,¾ ) 535223 8296twf.doc/006 五、發明說明（A ) 子植入時所需的製程參數。 接著’當確定晶圓盒210是在正確的程序及至站別、 機台出現，且資訊221中的製程參數已是儲存於機台控制 器中，且爲正確之參數値，則在步驟3〇4中，令機台控制 器218依據製程參數進行離子配製動作，且在同一時間， 資訊處理伺服器220亦會令機械手臂206將晶圓盒210載入 至離子植入機台200，使得配置離子動作及載入晶圓盒A的 動作可並行進行，以節省運作時間，之後即可在步驟s306 中，對晶圓盒210進行離子植入動作。 請合倂參照第2圖及第4圖，其繪示的是依照本發明 又一較佳實施例的一種離子植入機台製程參數自動預調 方法，本實施例是爲避免可能發生獲取的製程參數是錯誤 的參數値，以及機台控制器218中並無存在離子植入製程 參數的問題而存在必須之偵錯功能。 此離子植入機台製程參數自動預調方法包括：步驟 s400，先獲取晶圓盒210的識別碼，然後在步驟S302中， 依據識別碼獲取資訊221，其中資訊221包括晶圓盒A的 所在站別代號、機台代號以及晶盒識別碼及在離子植入時 所需的製程參數。其中上述之步驟s4〇〇及步驟S402皆與 圖3之步驟s300與s302相同。 所不同的是在接著的步驟s4〇4中，圖4所繪示的實施例 中需判斷現階段獲取之晶圓盒210是否該進行離子植入動 作，若否，則送出錯誤訊息（步驟s408 )，其中，判斷現 階段獲取之晶圓盒210是否該進彳了離子植入動作，是依據 本紙張尺度適用中國國家標準（CNSM4規格（210 x 297公殳） (請先閱讀背面之注意事:填寫本頁) -裝 #· 經濟部智慧財產局員工消費合作社印敦 535223 8296twf . doc/ 006 A7 B7 五、發明說明（q ) 機台控制器內含之離子植入站別代號及離子植入機台代 號與獲取之資訊221中之站別代號及機台代號是否相符， 若不相符，表示晶圓盒210現下不應出現在離子植入的程 序中，或是晶圓盒210是在離子植入程序中的其他站別或 機台，於是得立即送出錯誤，否則後序之其他晶圓盒不是 會進入錯誤的程序就是會在錯誤的站別或機台出現。 當確定晶圓盒210是在正確的程序及至站別、機台出 現後，則接著必須判斷資訊221中的製程參數是否係儲存 於機台控制器中，以及其參數値是否正確（步驟S306)， 由於現階段是在離子植入程序中，是以所謂的製程參數是 指離子的種類及濃度等數値，若此製程參數是錯誤的製程 參數，則同樣地送出錯誤訊息（步驟S408)，之後的程序 爲暫停載入晶舟210進離子植入機台200以待操作人員修 正，或是跳過目前的晶圓盒A向下一個晶圓盒動作。 若製程參數是正確的製程參數，則令機台控制器218 在步驟S410中，依據製程參數進行離子配製動作，且在同 一時間，資訊處理伺服器220亦會令機械手臂206將晶圓盒 210載入至離子植入機台，使得配置離子動作及載入晶圓 盒210的動作可並行進行，以節省運作時間，之後即可在 步驟s412中，對晶圓盒210進行離子植入動作。 請再次參照第4圖，當在離子植入機台具有兩個機械 手臂’且在另一個機械手臂亦有可能有其他的晶圓盒置於 其上已準備進行離子植入時，則需進行其他的程序。 其中包括：在步驟s400獲取晶圓盒210之識別碼後， 本紙張尺度適用中國國家標準（CNS)A4規格（21〇χ 297公餐） (請先閱讀背面之注意事@填寫本頁) TI·.· 1-l_i ϋ · 1 1 11 ϋ n mmm§ mmm§ I # · This paper size is applicable to China National Standard (CNS) A4 (21〇χ 297 mm) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 535223 8296twf .doc / 006 _____B7 V. Description of the Invention (f) The mobilization method enables wafers to perform ion implantation and allows certain processes to operate in parallel, saving time and labor. The ion implantation machine 200 of the present invention has at least one robot arm, for example, the robot arm 206, will load a wafer cassette 210 having a plurality of wafers into the ion implantation machine 200 through an implantation window 202 for In the ion implantation process, each wafer box includes a wafer and a wafer carrying a wafer. The automatic parameter adjustment system for the process parameters of the ion implantation machine provided by the present invention includes: a database 222, an information processing server 220, and a machine controller 218. Among them, the information 221 included in the database 222 includes at least a station type code, a machine code, a crystal box identification code, and process parameters. The crystal box identification code corresponds to the identification method of the wafer box, such as the wafer box 210. The identification code is 1 'can be presented on the wafer box 210 by a bar code type, and the station code and machine code are records where each wafer box should exist, that is,' assuming the current wafer box 210 It should be in the process of ion implantation, then its current position should be in a certain machine in the ion implantation station for ion implantation. In addition, the wafers in the wafer box recorded in the process parameters The formula required for ion implantation, that is, formula information such as the type and concentration of ions. The information processing server 220 provided by the present invention may be an industrial personal computer (IPC) for industrial use, which is used to obtain the identification code of the wafer box, and according to the obtained identification code, the data The library 22 obtains the above-mentioned information 221. For example, there is an identification code identifier 214 on the wafer box 21, which is used to identify the paper size of the paper placed in the robot. The Chinese National Standard (CNS) A4 specification (210 X 297 mm) applies. · Emmf ί _1 n 1 1 · 1 ··· ammf mmmmr emmf a · — I t < Please read the cautions on the back before filling this page) 535223 8296twf.doc / 006 A7 B7 V. Description of the invention (G) Wafer box 210 on the arm 206 The information processing server 220 can obtain the identification code of the wafer cassette to be ion implanted through the identification code identified by the identification code identifier 214. When the information processing server 220 learns the wafer cassette identification code that is currently undergoing ion implantation, it will obtain from the database 222 information about the station, machine and process parameters of the wafer cassette. 221. After the information processing server 220 learns the information 221 of the wafer cassette, the machine controller 218 will process the process parameters of the information 221 in the database 222 according to the wafer cassette, assuming the wafer cassette 210, to modulate the crystal. The formula required for the round box 210 during ion implantation, and at the same time, the information processing server 220 also controls the robotic arm 206 to load the wafer box 210 into the ion implantation machine 200 through the implantation window 202. Although the above-mentioned device can achieve the functions of automation and parallel processing, and thus achieve the time saving (that is, saving 90 seconds from loading the wafer cassette to the ion implantation machine) and manpower, but in the process of operation However, it may happen that the obtained process parameters are wrong parameters. Therefore, in order to avoid this situation, a parameter management system (Recipe Manager System; RMS for short) 224 is used in the present invention, which is connected to the information processing server. 220. The parameter management system 224 includes each identification code and process parameters of each identification code. After the information processing server 220 obtains the wafer box information 221 from the database 222, the information processing server 220 will process parameters in the information 221 Send it to the parameter management system 224. After the parameter management system 224 passes the comparison, it will determine that the capital paper size obtained by the information processing server 220 is applicable to the Chinese National Standard (CNS) A4 specification (21 × 2y7 meals) (please first Read the note on the back I · nn I II 1 nn ^ dJi ϋ ϋ ϋ ϋ nn ϋ I fill out this page) # · Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 535223 8296twf.doc / 006 A7 B7 V. Invention Description (q ) Whether the process parameters of 221 are correct. In addition, in order to avoid the fact that there is no ion implantation process parameter in the machine controller 218, the information processing server 220 will also ask the machine control 218 if it has the ion implantation process parameters and the ion implantation process. Whether the parameter is the correct process parameter, for example, the information processing server 22 will send the process parameter after the parameter management system 224 compares to the machine controller 218 for comparison, and the machine controller 218 will return an information about The query result of the existence and correctness of the ion implantation process parameters is sent to the information processing server 220 ′, or in another case, the information processing server 22 retrieves the ion implantation process parameters from the machine controller 218 for comparison. If the comparison result is correct, the machine controller 218 will perform the formula modulation action. Through the above-mentioned confirmation process, the error rate can be minimized during the automated process. Otherwise, millions of wafers may be lost for no reason due to errors. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics, please refer to Figure 2 and Figure 3, which illustrate an automatic pre-adjusting method for the process parameters of an ion implantation machine according to another preferred embodiment of the present invention. This ion implantation machine has a machine controller (ie, the machine controller 218 of FIG. 2) and at least one robotic arm. Assuming the robotic arm 206 'of FIG. 2, the robotic arm 206 will pass through the implantation window. 202 Loads the wafer cassette 210 into the ion implantation machine. The method for automatically pre-adjusting the process parameters of the ion implantation machine includes: step s300 'first obtain the identification code of the wafer box 210, and then in step S302, obtain the information 221 according to the comparison of the identification codes, where the information 2U includes a crystal The station code, machine code, and crystal box identification code of the round box 210 and the Chinese national standard (CNS) A4 grid (210 X 297, ¾) 535223 8296twf.doc / 006 are applicable to the paper size. Explain (A) the process parameters required for the sub-implantation. Then 'when it is determined that the wafer box 210 is in the correct procedure and arrival station and machine, and the process parameters in the information 221 have been stored in the machine controller and are the correct parameters, then in step 3. In step 4, the machine controller 218 is configured to perform the ion preparation operation according to the process parameters, and at the same time, the information processing server 220 will also cause the robotic arm 206 to load the wafer cassette 210 into the ion implantation machine 200 so that the configuration The ion operation and the loading operation of the wafer cassette A can be performed in parallel to save operation time, and then the ion implantation operation can be performed on the wafer cassette 210 in step s306. Please refer to FIG. 2 and FIG. 4 for a method for automatically pre-adjusting process parameters of an ion implantation machine according to another preferred embodiment of the present invention. This embodiment is to avoid possible acquisition. The process parameters are wrong parameters, and there is no problem with the ion implantation process parameters in the machine controller 218 and there is a necessary debugging function. The method for automatically pre-setting process parameters of an ion implantation machine includes: step s400, first obtaining an identification code of the wafer box 210, and then obtaining information 221 according to the identification code in step S302, where the information 221 includes the location of the wafer box A Station type code, machine code, crystal box identification code and process parameters required during ion implantation. The above steps s400 and s402 are the same as steps s300 and s302 in FIG. 3. The difference is that in the next step s404, in the embodiment shown in FIG. 4, it is necessary to determine whether the wafer cassette 210 obtained at the current stage should be ion implanted. If not, an error message is sent (step s408). ), Of which, it is judged whether the wafer box 210 obtained at the current stage should be implanted with ion implantation. It is based on the paper size and applies the Chinese national standard (CNSM4 specification (210 x 297 cm)) (Please read the notice on the back first) : Fill in this page)-Install # · Industrial Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, India 535223 8296twf.doc / 006 A7 B7 V. Description of the invention (q) Ion implantation station code and ion implanter included in the machine controller Whether the entry code and the station type code and the machine code in the obtained information 221 match. If they do not match, it means that the wafer cassette 210 should not be present in the ion implantation process, or the wafer cassette 210 is in the The other stations or machines in the ion implantation program must send an error immediately, otherwise other wafer cassettes in the subsequent sequence will either enter the wrong process or appear in the wrong station or machine. When the wafer cassette is determined 210 is in positive After the correct procedure and arrival station and machine appear, you must then determine whether the process parameters in the information 221 are stored in the machine controller and whether their parameters are correct (step S306). In the entry procedure, the so-called process parameters refer to the type and concentration of ions. If the process parameters are the wrong process parameters, an error message is sent in the same way (step S408). The boat 210 enters the ion implantation machine 200 for correction by the operator or skips the current wafer box A to move to the next wafer box. If the process parameters are correct, the machine controller 218 In step S410, the ion preparation operation is performed according to the process parameters, and at the same time, the information processing server 220 also causes the robot arm 206 to load the wafer box 210 into the ion implantation machine, so that the ion operation is configured and the crystal is loaded. The actions of the round box 210 can be performed in parallel to save operating time, and then the ion implantation of the wafer box 210 can be performed in step s412. Please refer to FIG. 4 again. When the implantation machine has two robot arms' and another wafer arm may have other wafer cassettes placed on it, and another ion implantation is prepared, other procedures are required. These include: Step s400 After obtaining the identification code of the wafer box 210, this paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ 297 meals) (Please read the notice on the back first @ fill this page) TI ·.
I · 1·— an ϋ ί n I 1_» 一e,r a n I 1 i βϋ ϋ ϋ I 經濟部智慧財產局員工消費合作社印忽 535223 8296twf.doc/006 A7 B7 五、發明說明（丨G ) 在與步驟s402並行進行狀況下，若在一短暫時間內（步驟 個晶圓盒（步驟s416)，假設爲 s414 經濟部智慧財產局員工消費合作社印製 晶圓盒212，存在於另一個機械手臂上（以上例來說，假 設爲機械手臂208 )，則資訊處理伺服器220會自動讀取 晶圓盒212之識別碼（步驟s418)。 其中若時間已到（步驟s414)且無第二晶圓盒在機械 手臂上（步驟s416)，則在這段時間中，依據第一晶圓盒 之識別碼獲取資訊221(步驟s402)進行離子植入的動作， 但若在這段時間中尙有第二個晶圓盒加入離子植入的程 序中，則在步驟s418，獲取第二個晶圓盒的識別碼後，必 須在步驟s420中，依據獲取的第二晶圓盒的識別碼得知第 二晶圓盒是否與第一晶圓盒係屬同一群組，也就是說，需 判斷第二晶圓盒是否是在進行離子植入的站別及是否與 第一晶圓盒相同的配方，即製程參數需相同，若相同，則 需依據晶圓盒的識別碼獲取資訊221，否則在時間到的狀 況下，會依照第一晶圓盒的識別碼來獲取資訊221 (步驟 s420)，第二晶圓盒將不予處理，且會驅動機械手臂208 上之燈號（未繪出）予以操作人員警示。 接著，在獲得資訊221後的程序皆與上述的實施步驟 相同，在此不加贅述。 綜上所述，本發明的優點在於將整個離子植入的製程 程序予以自動化，以節省時間及人力，且在自動化過程 中，是先動態選擇製程參數，以減少人工上的誤差，之後 再同時調製配方及載入晶圓盒至離子植入機台，以省去90 12 (請先閱讀背面之注 意事 填寫本頁) 丨裝 訂--------- #· 本紙張尺度適用中國國家標準（CNSM4規格（210 X 297公釐） 535223 8296twf.doc/〇〇6 經濟部智慧財產局員工消費合作社印製 五、發明說明（（1 ) 秒的載入時間。 虽隹然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝者，在不脫離本發明之精神 和範圍內’當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者爲準。 ί請先 閲讀背面之 —裝i · 填寫本頁) 訂： 本紙張尺度適用中國國家標準（CNS)/Vi規格（21〇χ 297公坌）I · 1 · — an ί ί n I 1_ », e, ran I 1 i βϋ 印 印 I Imprint of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 535223 8296twf.doc / 006 A7 B7 V. Description of the invention (丨 G) In parallel with step s402, if a wafer box (step s416) is used for a short period of time, it is assumed that the wafer box 212 printed by the consumer cooperative of the employee of the Intellectual Property Bureau of the Ministry of Economic Affairs exists on another robot arm. (In the above example, it is assumed that the robot arm 208), then the information processing server 220 will automatically read the identification code of the wafer cassette 212 (step s418). If the time has passed (step s414) and there is no second wafer The box is on the robot arm (step s416), during this time, the ion implantation operation is performed based on the identification code 221 of the first wafer box (step s402), but if there is no If two wafer cassettes are added to the ion implantation process, after obtaining the identification code of the second wafer cassette in step s418, the first wafer cassette must be obtained in step s420 according to the obtained identification code of the second wafer cassette. Whether the second wafer box is the same as the first wafer box Group, that is, it is necessary to determine whether the second wafer box is the station where the ion implantation is performed and whether it is the same formula as the first wafer box, that is, the process parameters need to be the same. If they are the same, they need to be based on the wafer. Box identification code to obtain information 221, otherwise under the condition of time, information 221 will be obtained according to the identification code of the first wafer box (step s420), the second wafer box will not be processed, and the robot arm will be driven The light on the 208 (not shown) is to warn the operator. Then, the procedures after obtaining the information 221 are the same as the above implementation steps, and will not be repeated here. In summary, the advantage of the present invention is that the entire The process of ion implantation is automated to save time and manpower. In the process of automation, the process parameters are first dynamically selected to reduce manual errors, and then the recipe is simultaneously adjusted and the wafer box is loaded to the ion implantation. Machine to save 90 12 (Please read the notes on the back to fill out this page first) 丨 Binding --------- # · This paper size applies to Chinese national standard (CNSM4 specification (210 X 297 mm) 535223 8296tw f.doc / 〇〇6 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The loading time of the invention description ((1) seconds. Although the present invention has been disclosed in the preferred embodiment as above, it is not used for Limiting the invention "any person skilled in the art can make various modifications and retouching without departing from the spirit and scope of the invention", so the protection scope of the invention shall be determined by the scope of the attached patent application. ί Please read the back—install i · Fill out this page) Order: This paper size applies Chinese National Standards (CNS) / Vi specifications (21〇χ 297 公 坌)