TW531853B - Package method of a laser device - Google Patents

Abstract

A package method for packaging tails and a base of a laser device comprises: firstly, providing four tails and a base with three holes and a channel defined therein, secondly, making three tails respectively pass through the three holes of the base and a part of them extend beyond a first surface of the base, fastening the tails in the holes of the base and keeping contactless therebetween by an apparatus, thirdly, filling melted material into the three holes of the base to fix the tails, finally, connecting another tail with a second surface of the base.

Description

V. Description of the Invention (1) Field of the Invention The present invention relates to a packaging method for lightning. Packaging method ②, especially the method of packaging laser split pins and bases [Background of the Invention] With the continuous development of society, + big, involving optical fiber communication, sharp field shooting and putting in the field and military aspects such as laser testing Distance field shooting sensor 丄 / Extend friend t ^ ^ The polar body is relatively fragile, etc. However, Lei Xun will be damaged, so it must be two to mechanical = there is a light transmission window, the laser light can be sealed in the-housing:; = usually also includes-light detection diode I :::. Hair emission device of stomach shot device first light intensity or wavelength, and convert the laser diode's beam injection signal into electrical signal diode's emission light through the external circuit after controlling the laser diode Signal intensity or wavelength 稃 ^ current to ensure that the laser passes through the corresponding base through the pin to the external circuit 22 + so the laser device needs to be sealed by the 'pin and the base need to be used; Bu Mi = company #, In order to ensure that please refer to the first to third drawings, the conventional laser packaging :: The package structure includes a base 10 and four pins 11, 12, 1 lame and the base holder 15, the base 10 is generally- Metal material, roughly two through holes 103 passing through the base 10 to penetrate the pins u, 12, 3, and the bottom of the opening 10 extends outwardly to form a flange 101 'which can fit the housing 18 ^^ (未 彳Not shown) The laser diode 16 and the photodiode I? Are encapsulated in the case μ. A bump is further extended at a specific position on the edge of the flange 1 0 1 丨 〇 2 r⑥ It shows that the pins 11, 1 2, 1 3, 1 4 are distinguished, and it can be welded to the laser device == page 5 531853

531853 V. Description of the invention (3) The function of sealing and sealing. However, it uses glass powder for sintering. First, it is necessary to press the glass powder into the gap between the pins 11, κ, 13 and the base 10, because the glass powder is easily scattered. Therefore, it needs to borrow special tools, and the softening temperature and melting temperature of glass powder are relatively high, which usually needs to reach 800 ° C. Secondly, since the metal pins 1 1, 1, 2, 13 and the base 10 are highly susceptible to oxidation reaction in a high-temperature environment, and then affect the shielding function and conduction function of the base 10, they must be at low w =, OK, the manufacturing environment is high. Once again, 'the rapid heating or cooling will cause uneven heating and cause uneven distribution of the internal stress of the device, making the fixation unstable or even fracture, which can only be achieved by slow heating and natural Cooling 3: Yao Jie, this process generally takes 8-10 hours, resulting in a long production cycle for this device, which is difficult to mass produce and costly.

Another ^: The conventional packaging method of the laser device pins and base is a thinner glass powder that replaces the conventional technology. It does not need to use external glass powder in the gap between the pin and the base 10, only the glass The end of the tube sleeve :::, the pin with the glass tube is inserted into the bottom two-way U03 and sintered. It simplifies the aforementioned conventional art to a certain extent. However, defects such as high manufacturing environment requirements and high production costs have not been improved. (... it is difficult to purchase, and in view of this, it is necessary to provide a laser package with low manufacturing environment and low cost; 1; mass production and low cost: package of foot and base: method [Objective of the Invention] The purpose of the present invention is to Provide a seal for laser device pin and base

Page 7 531853 V. Description of the invention (4) The Ling method requires low manufacturing environment, short production cycle, easy mass production and low cost. [Features of the invention] ^ = A method for packaging laser device pins and base, which includes the following steps. First, a base and four pins are provided. The base includes three through holes and one channel. Second, three pins are provided. They are inserted into the three through holes of the base and bows respectively ": the end protrudes from a part of the upper surface of the base to ensure that the bow and the foot are in thermal contact with the base and fixed by a jig; Inject holes into the hole; finally, connect another pin to the table below the base. [Preferred embodiment] According to the fourth to sixth figures, the package structure of the laser device pins and the base according to the present invention includes a base 20 and four pins 21, 22, 23, 24, two cigarettes, and a holding object 25. . ♦ * The base 20 is generally made of metal, and is roughly circular. A three-hole through hole 20 of the base 20 is opened to insert the pins 2 i, 22, 23, and the bottom edge of the base extends outward. A flange 201, which can be fitted with the cap 28 of the casing 28 (not marked) to encapsulate the laser diode 26 and the photodiode 27 in the casing M. Further, the flange 201 is further positioned at a specific position on the edge. A bump 200 is extended to the knife pins 21 a, 22, 23, 24, and at the same time, it can be used for positioning when the laser device is soldered to a circuit board (not shown) or fixed to other objects. Base 2 The bottom surface of the bottom surface is provided with a flow channel 204 communicating with the three through holes 203, which is formed in a groove on the bottom surface of the base 20, and the groove may be, Γ, a font, or a triangle. ^ Pins 21, 22, and 23 are used for laser diode 26 and photodiode

531853 V. Description of the invention (5) ~ — 2 7 It is electrically connected to the external circuit board, and its diameter is smaller than that of the through hole 2 of the base 2 〇3. This can ensure that the pins 21, 22, 23 pass through the base 20 There is a certain gap between the pins 21, 22, 23 and the base 20 after the three through holes 203, so as to ensure the electrical isolation between the pins 21, 22'23 and the base 20. At the same time, the ends of the pins 21, 22, and 23 protrude from the upper surface of the base 20 so as to connect the pins 21, 22, and 23 with the laser diode 26 and the photodiode 27 through wires (not shown). In addition, the laser diode 26 and the photodetection diode 27 usually each have an electrode and a pin connected to an external circuit. The pin 24 is connected to the bottom surface (not shown) of the base 20 by a welding process to ground the base 20 through the pin 24. It can also pass through the base 20 and be fixed to the base. The holder 25 is a plastic material, which is used to hold the pins 2 丨, 22, and 23 in the through hole 203 of the base 20 and electrically isolate them, and form a good seal. Yamamoto's method for packaging a laser device pin and base mainly includes the following steps: First, insert three pins 21, 22, and 23 into the three through holes 203 of the base, and the ends of the three pins 21, 22, and 23, respectively. A part of the upper surface of the base 20 is protruded to ensure that the pins 21, 22, 23 and the base 20 have no contact with each other and are fixed by a jig. Secondly, the sealed laser device is fixed by insert molding. It injects molten plastic into the three through holes through the flow channel 204 at the same time. After the molten plastic is cooled, the pins 21, 22, 23 and the base 20 are fixed and electrically isolated, and a good seal is formed. Finally, connect the other pin 24 to the lower surface of the base 20, the 4-way

531853 V. Description of the invention (6) It can be realized by welding, drilling and fixing in base 20. There is no need to increase the temperature for packaging the pins and the base. The requirements for clothing k% & are relatively low. At the same time, the flow channel 4 provided on the bottom surface of the base 2G is connected to the two through holes ^ 03. Road 204 to the three through-holes 203 is the same as :: Injection of melted sad plastic 'The use of injection molding #, which makes the molten plastic cold material fast ... like "6 seconds of poem, making the laser device of the present invention The production cycle of the package structure of the pin and the base is greatly shortened: it is easy to mass-produce, thereby making its production cost lower. It can be understood that the y package of the laser device pin and the base of the present invention has a multiple pin package structure, # 可 于 — In the package structure = plural laser diodes and photodetection diodes can also be used if there is no need for 2. The base of the package structure is not limited to square and oval, etc. ^ The above summary It is stated that the present invention meets the requirements of the invention patent, and Yili applies. However, the above are only those who are better at the present invention. Those who are familiar with the skills of this case are supporting the spirit of the issue of this case. ^ Decorations or changes should be included in the scope of patent application below. Fo

Page 10 531853 Schematic description [Schematic description] The first diagram is a perspective view of the conventional laser device pin and base package structure. The second figure is a perspective view of the conventional laser device pin and the base packaging structure in the other direction. The third figure is a schematic sectional view of a conventional laser device. The fourth figure is a perspective view of the packaging structure of the pins and the base of the laser device of the present invention. The fifth figure is another perspective view of the package structure of the laser device pins and the base of the present invention. The sixth figure is a schematic cross-sectional view of a laser device. [Description of main component symbols] Base 20 pins 21 > 22 ^ 23 ^ 24 Flange 201 Bump 202 Through hole 203 Flow channel 204 Holder 25 Laser diode 2 26 Photodetector diode 27 Housing 25

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Claims (1)

531853 Scope of patent application1. A method for packaging laser device pins and base, including the following steps: 1) Provide-base and four pins' the base includes three through holes and first-class road; 2) among them The three pins are inserted into the three through holes of the base, and the ends of the three legs protrude from the first part of the base. 卬 A part of the surface of your Zhuang Xinle, to ensure that the pins are fixed to the base without contact with the fixture; 3 ) Inject a molten holder into the three through holes of the base; 4) Connect the other pin to the second surface of the base. 2. The method of packaging a laser device pin and a base as described in item 丨 of the patent scope, wherein the flow path of the base is provided on the second surface of the base and is connected to the three through hole. 3. The method of sealing a laser device pin and a base as described in item 1 of the scope of patent application ', wherein the base is made of a metal material. 4. The method for packaging the laser device pins and the base as described in item 3 of the scope of the patent application, wherein the bottom of the base extends outwardly from the flange. 5. The method of packaging laser device pins and bases as described in item 4 of the scope of the patent application, wherein a bump is extended at a specific position on the edge of the flange to indicate the four pins and positioning. 6. The packaging method of laser device-inducing mochi and base as described in item 1 of the scope of patent application, wherein the four pins are made of metal material. 7 · The method of packaging laser device pins and base as described in item 1 of Shenjing's patent scope, in which the bow arched through the three through holes of the base is smaller than the inner diameter of the through hole of the base and is electrically conductive with the base. isolation. Page 12 531853 VI. Application patent scope 1---8. The method of packaging laser device pins and base as described in item 丨 of the patent application scope, wherein the pins connected to the base are fixedly connected to the base by welding. Base. 9. The packaging method for a laser device pin base as described in item 丨 of the patent application scope, wherein the pins connected to the base are fixedly connected by the bottom. -Μ 10 · If = please refer to the method for packaging laser device pins and base as described in item 2 of the patent scope, wherein the holder is made of plastic material. 11 · If = Please refer to the method for packaging laser device pins and base as described in Item 10 of the patent scope, wherein the molten state holder is injected into the three through holes of the base through the flow channel to the middle three through holes at the same time. Injected into the molten state. 12 * A method for packaging laser device pins and base, which includes the following steps: ^ 1) Provide a base and multiple pins, the base includes multiple through holes and first-class channels; 2) Insert some of these pins in In the plurality of through holes of the base, and the ends of the pins of the part protrude from a part of the first surface of the base, to ensure that the pins and the base are fixed by a fixture after no contact; 3) In the plurality of through holes of the base Inject the molten holder; 4) Connect the pin to the second surface of the base.