TW531631B - Adhesive removing furnace for electronic parts - Google Patents

Abstract

This invention provides an adhesive removing furnace for an electronic part such as a ceramic chip condenser, capable of shortening adhesive removing processing time, without producing crack in the electronic part such as a ceramic chip condenser. In this adhesive removing furnace, a setter 1 mounting the ceramic chip condenser 3 is arranged in a plane, and the ceramic condenser 3 is continuously transported while being heated, thereby eliminating adhesive component contained in the ceramic chip condenser 3. A far-infrared heater 5 is placed on a ceiling portion in the furnace as a heating source.

Description

531631 V. Description of the invention (1) Field of the invention — The present invention relates to a de-binder furnace, which is used to remove the binder component contained in electronic parts such as Taumann chip capacitors. Background of the invention (hereinafter referred to as, before the capacitor, the de-binder is separated and removed. In the past, this type of electric heater or gas introduced the outside gas and heated it into the agent furnace, which contained a capacitor on the positioner or Gasification, and then the surface of this liquid is removed. The adhesive removed from the container is discharged out of the furnace (called "Single '. Most of them are used to make the content of the adhesive in the hot air exceed a certain amount and attract the wind to discharge. The higher the processing temperature , The higher it is. However, in the manufacturing process of some electric components in electronic parts and ceramic chip capacitors'), it is necessary to perform the firing process. The process of forming the binder contained in the capacitor into an adhesive is performed in this way. That is, the hot air generator that uses the combustion furnace as a heating source, sucks a predetermined temperature, and introduces it into a capacitor that is debonded and treated as a processing object. The hot air drawn into the furnace is heated side by side, so that the There are also occasions when the adhesive component is liquefied or vaporized from the capacitor, that is, the hot air containing electricity from After contact, direct flow). From the viewpoint of reducing energy loss, a process in which the wind loops in the furnace. In the case where the hot air is looped, the heat gradually increases, so that the adhesive contains a small amount of outside gas, and the equivalent heat treatment of the capacitor's de-adhesive agent can shorten the processing time. Make production efficient

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In order to oxidize the electrodes in the tube at high temperature, when these capacitors are treated with high temperature and de-binder, in order to prevent oxidation, the internal atmosphere must be processed into a low oxygen concentration / passive, low oxygen concentration atmosphere. This is done by introducing nitrogen into the furnace ^. However, in the existing state, a hot air generator is used to attract outside air = the former debonding port that generates hot air and introduces it into the furnace. The d furnace L full-type debonding furnace cannot maintain a low oxygen concentration atmosphere. Furthermore, there is a problem that a fan for circulating hot air must be installed in the furnace, and the fan cannot be sufficiently durable at high temperatures. In order to solve such a problem, the family name has formed a structure that does not allow outside gas to invade the furnace body, and has also developed an electric heater as a heating source, and a de-binder furnace for capacitors in the furnace. Atmospheric milk with low oxygen concentration “medium” C (carbon) contained in the gasified adhesive = two (adhesive gas) · released from the capacitor by heating will not become CI, it is a monomer of carbon The form precipitates in the furnace, and once it is attached to the surface of the heater, it will cause a short circuit of the heating wire or a reduction in the insulation to the ground. Say

Therefore, 'the heating wire should be isolated from the atmosphere in the furnace, and the covered heater is used as the heating source in a muffle furnace made of stainless steel. In this way, even at high temperatures and in low oxygen concentrations, Debinding treatment can also be performed without causing problems such as short circuit of the heating wire. However, in such a field, there is a problem that the debinding processing takes a long time and it is difficult to achieve high productivity. In order to shorten the processing time, when the temperature is set to a higher processing temperature, since the debinding treatment is performed violently, thermal stress occurs in the capacitor, and cracks are likely to occur. X

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V. Description of the invention (3) Summary of the invention ~ The present invention is made to solve the problems existing in the above-mentioned prior art, and its purpose is to provide a descaling furnace for electronic parts such as ceramic chip capacitors, which does not make ceramics Cracks occur in electronic parts such as chip capacitors: Moreover, the time required for debinding treatment can be shortened compared to before. According to the debonding furnace for electronic parts of the present invention, the positioner on which the electronic parts are placed is arranged in a flat shape, and while being continuously conveyed and heated, the electronic parts contained in the electronic parts are contained. The binder component removal method is characterized in that a far-infrared heater that is a heating source is provided on the ceiling portion of the furnace. Detailed description of the invention As described above, the main characteristic of the de-binder furnace of the present invention is that a far-infrared heater as a heating source is provided in the ceiling portion of the furnace. Here, the "back infrared" is an electromagnetic wave having a wavelength of 3 to 100 m // m. The so-called π far-infrared heater "refers to a heater in which the wavelength region showing the maximum emissivity is in the above-mentioned region. This heater is made by burying a metal heater in Taunman and heating it with a metal heater The above-mentioned ceramics emit far-infrared rays due to their radiation characteristics. As in the case of conventional de-binder furnaces, when hot air or ordinary heaters are used for convection heating, the surfaces of electronic components such as capacitors are first dried, and the internal It is difficult for the adhesive component to move to the surface, and it is easy to form a so-called "heart" state. Therefore, it takes a long time to remove the adhesive, and it is easy to be subjected to internal thermal stress.

Page 6 531631 V. Description of the invention (4) A crack occurs. This phase is a heating source, and the far-infrared immersion depth is several tens of states. It can also be shown in Figure 1; The adhesive is processed into a flat shape and used as a furnace ceiling in the furnace. Metal is directly attached to the heater because of carbon. It is best to be in the above heater! This chamber is supplied to the furnace voltage introduction part by adjoining uniformly. Well put institutions. When a plurality of pairs are used, as in the present invention, when a far-infrared heater is used to lightly heat the electronic component, it penetrates into the interior of the electronic component such as a capacitor (μm from the surface), from the penetration point. Conductive heating makes it difficult to form ", and the debinding agent can be efficiently removed in a relatively short time to prevent cracks. The embodiment of the debinding agent furnace of the present invention is a schematic view of a debinding agent furnace. On the positioner 1, a plurality of capacitors 3 constituting a disconnected object are placed, and the positioner 1 in this state is arranged and continuously transported in the furnace. A plurality of far-infrared heaters 5 of the sub heating source are disposed close to each other. As described above, the far-infrared heating source 5 heater is buried in the ceramic, so the carbon precipitated in the furnace is difficult to heat, and even in a low-concentration oxygen atmosphere, it adheres to cause short circuits and other problems. A chamber 9 is provided above the far-infrared heater 5 for receiving] a terminal portion 7. A gas prepared into a predetermined composition is introduced into and supplied by a gas provided in a lower portion of the chamber. 1 1. The gap between the heaters 5 can all contain the above atmosphere, so that adhesive components such as carbon can be prevented from adhering to the terminal portion 7 of the heater 5 and electrical failure can be avoided. Drum 1 3 It is used as a conveyer for continuous conveying of the positioner 1 in the furnace. A roller 1 is used as the conveying mechanism in the furnace. The positioner 1 on the top 1 moves the exit direction of the furnace one by one. In this way, when the drum is used as the conveying mechanism, dust is hard to occur in the furnace, which can effectively prevent product pollution caused by the dust. The following is based on the embodiment The present invention will be described in detail. The present invention is not limited to this embodiment. Φ A de-binder furnace using a general metal heater as a heating source, and a far-infrared heater in which the metal heater is embedded in a ceramic are used, respectively. As the heating source of the de-binder furnace, under the same conditions, the capacitor is de-binder treated. The processing conditions are shown in the following table. (Table 1) The size of the capacitor 1.5 Xl. 5 Xl. O mm Capacitor weight 0.15kg Number of capacitors placed per positioner 2 6 0 0 Positioner weight 0.75kg Positioner configuration in the furnace 4 columns in the width direction X length direction 1 2 atmospheres in the furnace N2 9 3 %, H2 7% Processing time 3 hours

Processing temperature 5 0 0 ° C The result of this de-adhesive treatment is that in a de-adhesive furnace using a normal metal heater as a heating source, turtles occur on a part of the capacitor.

531631 V. Description of the invention (6) It is also cracked, and discrete cases are also seen in the residual carbon content of the capacitor after processing. On the other hand, in the de-binder furnace using the far-infrared heater as a heating source of the present invention, cracks do not occur in the capacitor, and there is almost no dispersion in the amount of carbon remaining in the capacitor after the treatment. Although the above description has been made by taking an example in which a ceramic chip capacitor is used as an electronic part, it is clear that the present invention is not limited to this embodiment, and it can also be applied to other electronic parts and ferrites.体 等。 Body and so on. As described above, if the de-binder furnace of the present invention is used, the efficiency of the de-binder can be improved compared with the case where a conventional de-binder furnace is used, and cracks do not occur in electronic parts such as capacitors, which can shorten Debinder processing time.

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Claims (1)

531631 6. The scope of patent application is to continuously transport the electronic parts while removing the adhesive components. It is characterized by a de-binder furnace for electric infrared parts heated by the C7 heat source. The atmosphere gas containing the heated gas is introduced into the lower gas supply hole, and the atmosphere gas is uniformly supplied to a positioner of a de-binder furnace for electronic parts. What is included in the electronic component is that a writing instrument is provided on the ceiling portion of the furnace. 2 · The method according to item 1 of the scope of patent application, characterized in that the cavity in the terminal part of the far-infrared heater is prepared into the cavity, and is arranged between heaters adjacent to the cavity. Can be inside the furnace. 3. The debonding furnace for electronic parts as described in item 1 or 2 of the scope of patent application, characterized in that the roller is used as the conveying mechanism of the speedy positioner. 4. The debinder furnace for electronic parts according to item 1 or 2 of the scope of patent application, characterized in that the mysterious electronic parts are capacitors. 5 · The electric furnace as described in item 3 of the scope of application for a patent | cry-off adhesive furnace, characterized in that the electronic part is a ceramic sheet · °