TW530334B - Optical exposure apparatus, lithographic projection tool, substract coating machine, and device manufacturing method - Google Patents

Abstract

An optical exposure apparatus comprising: a radiation system for providing a beam of radiation; a substrate table for holding a substrate; a projection system for projecting said beam onto a portion of said substrate, wherein: the radiation system is embodied to provide a plurality of component beams of radiation; the projection system correspondingly comprises a plurality of component projection systems, each of which serves to project one of said component beams onto the substrate; at least one of said component projection systems is flexible in such a manner that an extremity thereof proximal the substrate can be displaced in a direction parallel to the plane of the substrate, while an extremity thereof distal the substrate remains fixed relative to said plane; said substrate table can be rotated parallel to said plane. Such an apparatus can be incorporated as a module into a lithographic projection tool or a wafer track, for example, but can also be used in a stand-alone fashion.

Description

530334 V. Description of the invention (1) The present invention relates to an optical exposure device, which includes: a radiation system that provides a radiation beam; 'a substrate table' for fixing a substrate; a projection system for projecting a light beam onto the substrate table . The invention also relates to a lithographic projection tool, which includes: a main light-emitting system that provides a main radiation projection light beam; a holder of a patterning device, the patterning device is patterned according to a required pattern A main projection beam; a main substrate table for fixing the substrate; a main projection system for projecting the patterned main projection beam onto at least a target portion of the substrate. The invention also relates to a substrate coating machine, comprising: a base of the substrate; a device for moving the substrate back and forth between the base and the conversion table; when the substrate is placed on the base, it is used to add liquid to the substrate main Dispensing device on the surface. The term "patterning device used herein" should be broadly interpreted as a pre-incidence radiation beam-a patterned cross section corresponding to the target 11 on the substrate; in this connection, "light valve (1 ig) The word "va 1 ve)" can also be used in the Kuta & head section. Generally speaking, the pattern corresponds to the other pieces: (see action layers below, such as integrated circuits or local installations. This strike) w Examples of such patterning devices include: The concept of a large dry mask in the lithography type, including such as the two-opened: the "father mutual phase shift" of the photomask, and the attenuation phase Shifted,

530334

And various mixed types. Placing such a mask in a radiation beam causes the radiation hitting the mask to be selectively conducted (conductive mask) or reflected (reflective mask) according to the pattern on the mask. In the case of a reticle, the fixation ^ is generally a reticle stage to ensure that the reticle can remain at the desired position in the incident radiation beam 'and can be moved relative to the beam if necessary. A set of programmable mirror arrays. Such a component is, for example, a matrix-addressable surface with a viscoelastic control layer and a reflective surface. The basic principle behind the above device (for example) is that the selected area of the reflective surface reflects incident 1 as diffracted light, while the unselected area reflects incident light as non-diffracted light. 2 With an appropriate filter, the non-diffracted light can be self-reflected and the diffracted light below the outgoing light; in this way, the light beam is patterned according to the addressing pattern of the matrix-selectable surface. The required matrix location can be implemented with the proper electronics. Other more detailed information on mirror arrays can be collected from U.S. Patents 5,296,89 1 and,!! 523 '193, which are listed in the references of this case. In the case of a programmable mirror array, it can be made on demand. For example, @ 定 式 or mobile frame programmable LCD display (LCD) array. Such a structure can be found in U.S. Patent No. 5,2 29,872, which is listed in this reference. As mentioned above, the holder can be on demand, for example = frame or platform. Oral and mobile ground :::: The rest of the J ^ t text in some places is a clear example of the 丨 S S mask stage; however, in this example, " The general principle should be the same as the patterning device 2 described above.

530334 V. Description of the invention (3) '-In a broader narrative. The lithographic projection tool, for example, can be used in the manufacture of integrated circuits. In this example, the patterning device generates a circuit pattern of a single-layer integrated circuit, and the pattern can be mapped to a target portion (such as a silicon wafer) of a substrate (silicon wafer) that has been coated with a layer of photosensitive material (photoresist). Including one or more chips). Generally speaking, a single wafer contains the entire network of adjacent target portions and is continuously illuminated by the projection system one at a time. In the existing tools, a reticle is used for patterning on the reticle stage, and different operating principles will cause differences. In a type of lithography projection tool, each target portion is irradiated in such a way that the entire reticle pattern is exposed to the eye at a time; such a tool is usually referred to as a crystallizer. Among other tools—often referred to as step-and-scan tools—scan a reticle pattern progressively in a given reference direction (scanning direction), in parallel or antiparallel In this direction / synchronous scanning of the substrate stage, Xiao shots each target A; because

A magnification factor M (usually less than n, the speed at which the substrate stage is concealed, and the speed at which the photomask stage is scanned multiplied by M == can be included in the reference in this case. Collected in US 6,046, 792. ^ During the manufacturing process of the lithographic projection tool, the pattern (the second step of the imaging step of the L light (photoresist) on the substrate. The U substrate may undergo various procedures such as removing Moisture, light sequence II i == and soft baking treatment. After exposure, the substrate will go through other processes as post-exposure bake (PEB), ”,, ~, hard baking treatment and image Detailed measurement / inspection. This whole process

Page 8 530334 V. Description of the invention (4) ίΐΐΐ is used as a pattern to individually conduct electrical components of an integrated circuit: away from 2 i. The target-like target layer is then subjected to many processes, such as etching, implantation (doping), metal north, oxidation, chemical mechanical polishing, etc., 敫: ΐ a single layer. If many [are needed, then each new layer must repeat one or different procedures. Finally, the array of components is presented on the substrate (crystal $). These components are then separated from each other by a technique, such as cutting, opening, so that the individual components can be fixed on the carrier, connected to the leads, and so on. Further information on such a process can be obtained from the book, for example, "Microchip Manufacturing: A Guide to Dual Use of Semiconductor Manufacturing", referenced in this case, third edition, by van Zant Peter, McGraw Hill Publishing House, 1997, ISBN 0107 1067250.4. For the sake of early purity, hereafter the projection system is referred to as "lens"; however, the term should be broadly interpreted to include various types of projection systems, including refractive optics, reflective optics, and reflective refractive systems. Light-emitting systems may also include components that operate according to any of these design types to guide, shape, or control the radiation projection beam, and such components may also be used collectively or individually as lenses. In addition, the lithography tool is of a type having two or more substrate stages (and / or two or more photomask stages). In such a "multi-stage" component, other stages can be used in parallel, or when one or more stages are being used for exposure, the preliminary steps can be performed before the other two or more stages. Two-stage lithography tools are described in U.S. Patents 5,969,441 and WO 98/40791, which are incorporated by reference in this case. As described above, before the substrate is exposed in the lithography process, the main surface of the substrate to be exposed is coated with a layer of a photosensitive material (hereinafter referred to as a photoresist). Traditionally this

Page 9 530334 V. Description of the invention (5) The spin coating process is used. The substrate rotates at a high speed and the liquid nozzle is dosed to the rotating main surface. Due to the centrifugal force, the liquid migration = in the main table Φ ° = over L ' The crescent effect of the force and the edge of the substrate causes the photoresist to accumulate along the periphery of the main surface. This is extremely bad, because it makes the light of several target areas close to the surrounding even; this not only affects the image quality during lithographic exposure, but also undesired chemical effects during the development of the exposed photoresist layer. So = remove the surrounding photoresist buildup before starting. This procedure is passed for edge bulb removal. ^ In addition, the problems that may occur in the photoresist layer are related to on the main surface of the substrate. In microf 彡 exposure material, such marks are used to connect with the following: Lian Fan's mask pattern on the substrate (existing pattern, μ Yu ^) usually uses an optical detection system (alignment system) to reach Tianguang The image of the alignment mark of the mask / Japanese yen and the wafer / photomask = interference effects that occur when they overlap. However, the presence of these anti-layers on the substrate can cause interference. This is because of the alignment pair 1 pair The thin film effect of the photoresist layer that occurs on the mark is sensitive to effects such as interference, diffraction, and refraction. Here, the so-called ^ and 'can cause errors in the signal generated by the alignment system, which will usually cause the Periodically remove localized layers under the alignment marks on the main surface. This procedure is traditionally called mark cleaning. As used herein, refers to the partial removal of a photoresist layer on a substrate with reference marks. Note: Such as substrate ID marks (Such as the form of a bar code) and so on. In the monthly craftsmanship, the "edge ball removal and mark cleaning can be done with a resist. It can be divided and applied, often with an ideal thickness, and it can not afford to subsequently seek to collectively call the alignment mark on the mask." The integrity of), some alignment The light of the quasi-marking method is exemplified by the use of the Γ method's quasi-error region, and ′ instead of 530334. It is implemented in the manner of (6) in the description of invention (6). For example, the substrate is sprayed around the so-called wafer handling machine and connected to it. Dry it first and remove it after exposure. The use of solvent may include inadvertent drops, which will cause these dimensions to increase and increase. Similar procedures can be more risky. That is, the area around each mark is exposed; it is also developed at. This shadow exposure is required for production (usually very expensive) following a lithographic process. It is an object of the present invention to provide edge spheres. In addition, the present invention is as high as possible, so that the above mentioned and other uses are marked, the implementation rate of the subsequent record cleaning sequence of the target cell is almost 'so the purpose of processing the removal time and the purpose is to say' edge ball to go appropriate ' The solution (such as propidium) comes to the machine in the wafer track, and the substrate is dried in it. However, the liquid method is a rather missed and further process of flat wafers that land on the substrate. Because the wafers are cleaned by the dissolution of the land, the cleaning technique is based on the proper development of the substrate, so it completely determines the time above. Question mark cleaning is the cost of this package due to implementation in a manner that can be controlled in addition to the application. This is usually used in a process that is spin-coated on a lithographer and before exposure to understand that the edge ball is a dangerous process because the solution in the wafer area is depleted. This risk depends on the probability of hitting the liquid droplets of the wafer ruler, but it will be achieved more often by using exposure technology than on the edge of the ball. The radiation of wavelength / energy makes the exposure area on the substrate marked with a photomask during the exposure period. Standard micro causes time. Because the cost of the lithography tool owner's expenses is kept to a minimum is extremely heavy. In particular, the purpose of the present invention is to make a single exposure device that can be used both fast and efficient in operation, and use it as small as possible. Optical Exposure in Patent Scope Item 1

Page 11 530334 V. Description of the invention (7) Defined in the light device The inventors of this case are known to avoid considerable time wastage caused by the edge ball removal (E β r) and mark cleaning (MC) procedures. The present invention operates these The exposure device for force 1 must be at least as fast as the (fastest) lithographic projection tool used to perform imaging on the substrate when processing the substrate. Since modern technology's lithographic tools can achieve orders of magnitude of 120 substrates per hour, this means that the edge ball removal / marking and cleaning device must be able to process one substrate in up to 30 seconds. The edge ball removal / marking according to the present invention: the self-cleaning device can achieve this goal, especially when using its ability to perform parallel processing, because there are many component projection systems, they can simultaneously process different tasks on the same substrate. program. Furthermore, because at least one component = ㈣ ′ can move the (each) flexure relative to the substrate, the proximal end of the system can pass through different ㈣ on the substrate instead of necessarily moving the substrate due to the ΪΪ! System. This has obvious advantages: such a ΐ = not only has to move a large substrate diameter sideways, the 乂 -like device occupies less space; base: m,: (relatively lighter) side movement can It can be rotated in time when moving the 移动 ^^ points according to the present invention more sideways and sideways. Further options (edge ball removal / marking cleaning) device = Xi Guangcai's work and advantages will be discussed below. Splitting ί ΐ 1 :: ί i's component beam 'for example, ▼ can be generated using 稜鏡 and different two light beams and two public light beams; examples of such devices are provided with or without JL # $ #: 70 Cattle (Fresnel lens array or lens arc), do not have additional beam adjustment optics, such as collimation, focusing and / 530334 V. Description of the invention (8) or focusing lens or lens. Alternatively, the multi-beam can be made by Many individual radiation sources are provided. In a particular embodiment of the optical exposure device according to the invention, the proximal end of the (each) flexible component projection system is radially transferable relative to the plane of the substrate because the substrate The stage can be rotated in a plane, such a radial movement allows the proximal end to pass through any point (r, 0) on the outward surface of the substrate. In another specific embodiment of the optical exposure device according to the present invention, each component projection system It is as flexible as possible. This allows to optimize parallel processing in the device. (Each) Contains one or a bundle of this liquid-filled light guide, each or more of the mirror focus comes from the radiation that is scratched between the system and the substrate. Or Rectangular (And / or coincidentally conform to the 0 π 篁 flexible light sample of each component end of the light guide may be a component light guide between the other components of this module aperture substrate ID projection projection system obtained The required deflection is achieved. This optical fiber. However, this case is generally compatible with the projection system. This focusing system is usually projected onto the substrate. An example of 'providing a stencil pattern' pattern is 'hole control'. It is better to select the range of the projected image near the near end, but an example can be made so that it (or them) is guided. An example of a thick optical fiber has been noticed by the inventor. In addition to the scratch It includes a focusing system, which consists of a radiation that is often placed at the near end to focus. 'The template holder is placed in the radiation system to pass a circular, square shape in the dark field of each component projection system relative to the substrate. Alignment mark • This makes each alignment mark fine. The stencil holder is placed close to it, for example, and it may be placed far away.

530334 V. Description of the invention (9) In the further detailed part of the previous embodiment, there are two component projection systems;-each template pattern includes an aperture in the opaque field; the aperture of one component projection system is larger than the others . Such a structure allows edge bulb removal (EBR) and marking clear (upper and finer). Especially in the case of edge ball removal (EBR), rough (larger) holes are used in one or more scans to expose the-two-centered (with slightly overlapping) photoresist along the periphery of the substrate Stripe, and at the same time, it is used to perform the scan on the substrate closest to the wafer area, the second small) aperture scanning. Λ j is taken from a wooden place and is limited. In another specific embodiment of the present invention, an exposure device is used to measure the position of the substrate relative to the rotation axis of the substrate table = the device. $ Direction. In this way, the sub-detection uses, for example, a charge-coupled device, a light source, and a light source side by side to the optical sensor, so that the substrate edge portion attenuates the beam; at the same time, the substrate and the substrate on the output from the photodetector are measured simultaneously. The eccentricity and the edge number of the substrate can measure substrates on the workbench. Embodiments are usually more optical :; II ;: sensing element 'even if this-specifically in the previous paragraph specific embodiment, a cow board moving device can be adjusted, thereby adjusting the A2 ': 2: The device includes a base direction. This makes a bit of the ball at the edge;

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Page 14 530334 V. Description of the Invention (ίο) The eccentricity measurement is correct. The present invention also relates to a lithographic projection tool, which includes: a main radiation system that provides a main radiation projection beam; a holder of a patterning device that patterns the main projection beam according to a required pattern; a The main substrate table is used to fix the substrate; a main projection system is used to project the patterned main projection beam onto at least the target portion of the substrate. The shadow projection shirt tool further includes an optical exposure device according to the present invention. Incorporating the exposure device in the lithography tool in this manner allows edge ball removal and / or mark sweeping to be performed in an efficient manner between the entrance of the substrate to the tool and the projection of the mask image. In addition, the lithography tool usually includes a substrate operating module that enables the exposure device of the present invention to be very successfully combined; such a substrate operating module usually includes a turntable, a line aligner, and a substrate operating machine. It is used from the exposure apparatus of the present invention. An example of such a substrate operating mold is provided in the European patent application EP i 0 52 546 flap i 0552 548 'although many modifications have been made. When necessary, the present invention of the book wins. TT This is not the exposure device of the substrate operation mode. The lithography tool can be combined with the lithography tool and the device of the present invention is transferred to the lithography tool and the tool's main light-emitting system is transferred :: 辕 射 2r The advantage is that it can make Expensive) Excimer Ray :::: and money 'especially when talking about working under 193nm or 157nm). Wavelength (for example 530334

The invention also relates to a substrate coating machine, which comprises: a base of a substrate; a rack for moving the substrate back and forth between the base and the conversion table; and when the substrate is placed on the base, it is used to add liquid to the substrate Point ^ device on the main surface. "Among them, the substrate coating machine also includes an optical exposure device according to the present invention. Such a substrate coating device is generally referred to as a wafer track machine. In this way, the exposure device is combined with the substrate coating machine, allowing the edges to be spherical. Object removal and / or mark cleaning is done in an efficient manner before the substrate is removed from the machine and before entering the lithographic tool adjacent to Z. In addition, substrate coating machines usually include a turntable and a substrate operation robot, which can be the subject of the present invention. An exposure device is used. An example of the substrate coating machine here & described, for example, is described in the international patent application wo 97/05527 (corresponding to the US patent US 5,766, 824 listed in the reference of this case). ). According to another aspect of the present invention, a component manufacturing method is provided, comprising the steps of: (a) providing a substrate at least partially covered with a layer of photosensitive material; (b) providing a radiation projection beam using a radiation system; (c) using patterning The device imparts a cross-section pattern of the projected beam; ⑷ projects the patterned radiation beam onto the target portion of the photosensitive layer; ❶ where 'between step (a) and ⑷' Completed at least the following actions irradiating the photosensitive material layer on a substrate in surrounding j Irradiation at least one alignment mark on the substrate Xi-hexyl

Page 16 530334 V. Description of the invention (12) *-At least one action is performed using the optical exposure device according to the present invention. Although a specific reference use in the manufacture of integrated circuits may be specified for a device according to the invention herein, it should be clearly understood that there are many other possible applications for such a device. For example, it can be used in the production of integrated optical systems, detection patterns of catheters and magnetic memories, liquid crystal display panels, film magnetic heads, and the like. Those skilled in the art know that in making other applications, any terms used in this article such as “reticle”, “wafer”, or “die” should be considered separately. The more general term "mask", "substrate" is replaced with the "target portion". In this document, the terms "radiation" and "beam" are used to encompass all forms of 'electromagnetic radiation' including ultraviolet radiation (such as wavelengths 36 5, 248, 193, or nanometers) and extreme ultraviolet radiation (EUV, such as With a wavelength in the range of 5 to 20 nm). # ί = An example is described with reference to the accompanying schematic diagram of a specific example of the present invention, where ... = 'Two write a lithographic projection tool according to a specific embodiment of the present invention; two j two optical exposure according to a specific embodiment of the present invention Plan; Partially using the exposure device according to the present invention to accomplish edge ball removal and & A cleaning of part of the substrate; a plan view of a component projection system not in the optical exposure device according to the present invention The symbol indicates the corresponding component. .

A body through U

530334 V. Description of the invention (13) Fig. 1 outlines a lithographic projection tool having an optical exposure device according to the present invention. The projection tool includes: a main radiation system Ex'IL for providing a main projection beam (PB). In this particular example, the main radiation system also includes a radiation source LA; the first inspection stage (mask stage) MT, a mask holder with a fixed mask MA (such as a network cable), and is connected to The first positioning device for precise positioning of the photomask relative to the PL.

The second inspection stage (main substrate stage) WT has a substrate holder to hold the substrate W (such as a silicon wafer coated with a photoresist layer), and is connected to a second positioning device for accurately positioning the substrate relative to the PL . The main projection system (lens) PL (such as a system of refractive, reflective, or refracting optics) is used to project the irradiated portion of the mask MA to the target portion C of the substrate w (such as including one or more wafers). As described here, the tool is of the transmission type (ie, has a transmission mask). However, in general, it can also be reflective, for example (with a reflective mask). Alternatively, the tool may utilize other patterning devices, such as a programmable mirror array of the type described above.

The radiation source LA (such as a mercury lamp or excimer laser) generates a radiation beam. This light beam directly enters the lighting system (lighting device) IL, or enters IL after passing through adjustment devices such as the beam expander Ex. The lighting device ^ may include an adjustment device AM for setting the intensity distribution of the external and / or internal rays of the light beam (commonly referred to as σ outside and σ inside respectively). In addition, it usually includes a variety of straight components, such as the integrator IN and the condenser

530334 V. Description of the invention (14) The beam PB has the desired uniformity and intensity distribution on the cross section. It should be noted that with regard to Figure 1, the radiation source! ^ May be in the shell of the lithographic projection tool (for example, usually when the radiation source LA is a mercury lamp), but it may also be from the lithographic projection tool. Remove and direct the radiation beam it produces to the tool (eg, by properly directing the lens); the latter is usually the radiation source LA as an excimer laser (eg, based on fluorinated £ 1 ^, argon fluoride

ArF or F2 laser). Both the invention and the scope of the patent application cover both scenarios. The light beam PB then intercepts the mask MA fixed by the mask holder. After passing through the mask MA, the light beam PB passes through the lens PL and is focused on the target portion ^ of the substrate w. With the help of the second positioning device (and the interferometric measuring device IF), the main substrate table can be accurately moved so as to place different target portions c in the path of the light beam. Similarly, the first positioning device can be used to accurately Position the mask MA on the path of the beam ρβ, such as after the mechanical correction of the mask library or during the sighting. Generally, the movement of the inspection table MT and the main substrate table WT can be achieved by the stroke module (rough positioning) and The short-stroke module (fine positioning) comes: not explicitly depicted in Figure}, however, in the wafer stepper ^ 进 ^

Opposite aiming tool) The photomask table MT may be connected to the short-stroke drive 詈, ~ can be fixed. ~ The tools described in AT can be used in two different modes: 1. In the step mode, the reticle holder Mτ * keeps a reticle pattern projected once (ie, a single flash) onto the target part C. ^ , And the entire WT then moves in the X and / or Y direction, so that the light beam "can reach the target portion of the substrate",

Page 19 530334 V. Description of the invention (15) 2 • In the concealment mode, basically the same scenario is applied, except that the given target part is not a single flash exposure. Conversely, the mask holder Mτ can move at a speed v in a known direction (the so-called scanning direction, such as the γ direction), so that the projection beam PB is scanned across the mask image; at this time, the main substrate table WT is at the same time Or move in the opposite direction at speed V = Mv, where M is the magnification of the lens PL (typical M value, M = 1/4 or 1/5). In this case, a relatively large target portion C can be exposed without having to compromise on resolution. This tool also has a substrate operation platform. The station WH includes a turntable (substrate stage) 2 ′ substrate operation robot 4, input / output port 6 and front aligner 10. In this particular case, it already has the optical exposure device 8 according to the present invention, and therefore efficiently uses the turntable 2, the robot 4, and the alignment device (front linear aligner) 10. Base_body example 2 Figure 2 shows a part of an optical exposure device according to a special embodiment of the present invention: Mercury ^ 2 ^ generates broadband ultraviolet radiation, which is collected by an elliptical lens 2 3 and 'guided to the withered lens 2 5. The adjusting lens 25 has a selective optical coating. Cooling-most of the spectrum generated by the lamp 21 is reflected by the lens 2 and only the narrow portion of the spectrum is reflected along the axis 27.

Element 29 includes a beam splitting device m ^ Cheng Xi Ba Dan swelling device, which is used to further subdivide the light beam along the axis 27 in the knife beam, in this example. The beam splitting device 29 is guided to the 18th theta! What's in the knife? 釆 剡 剡 a 剡 π + Master 1 knife 1 projection system, 2 11 a and 2 11 b. ”Interstitial splitting operation can use component splitters, knife-edge wedge-shaped couples:‘ for example ’such as polarized beams, ^ ^ ^ ^ W9Q ^ -T or, a-radiation optical components. In addition to these components:

Fruit splitting device 29 may also include one or more lenses to separate component beams;

530334 V. Description of the invention (17) 2 1 7 a, 2 1 7 b are also provided with a shutter device, allowing the exposure to be started and ended (individually) via the component projection system 2 11 a, 2 1 1 b at will. The actuating devices 213a, 213b allow the proximal ends 215a, 215b to move accurately forward and backward in a direction parallel to the radius of the (circular) table 2. Therefore, in combination with the rotatable table 2, the proximal ends 215a, 215b can be passed through any coordinate point (r, 0) on the substrate table 2 at least once. In the elaborate part of this scheme, the proximal ends 21 5a, 21 5b can be actuated together, each passing completely through the coordinate points (r, Θ) on all the planes of the table. Assuming that the coordinates (r, 0) of a special point (such as the center of the alignment mark) on the substrate of the table 2 are known, the actuators 21 3a and 213b can be used in combination with the appropriate rotation of the table 2 to f The proximal end 213a or 21 3b passes through a special point. Prior to this, the alignment step using the alignment device 210 has been completed, so the following can be determined: (1) The substrate may be placed on the table 2 by centrifugation, that is, the center of the substrate is not placed on the rotation axis of the table 2; ( 2) The position of reference features (such as notches or flat parts) around the substrate. Using these data, the eccentricity can be corrected (such as using the arm 4 in Figure i to adjust the position of the substrate on the table), and (2) The reference to the position of Santeco was used as a basis for determining 0. 1 test focus can be adjusted by moving the table vertically up to the plane 2, 9 section 213a '213b so that the proximal ends 215a, 215b in this side ^ 3 疋

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Fig. 3 shows a partial plan view of a substrate W, in which there is a notch n at a known position surrounding the E. Also show Qian Qian /, along with some goals

O: \ 71 \ 71304-920102.ptc Page 1: ^ 0354 7 / year Amendment 90111965 > Amendment to component projection system 2 1 1 a Loss of productivity due to loss of intensity. The component projection system 2 1 1 a, the ends 215a, 215b can be transferred and the flexibility of the distal end 217a of the table 2 can be achieved by making each such as a fiber bundle of light; this proper liquid is liquid, and the fiber / soft OK. In this specific embodiment, the light guides are 3 mm and 8 mm, respectively, in 2 1 1 b to improve efficiency; in this respect, the production rate, so people will want to reach as high as 2 1 1 b are flexible to make them work The direction of the platform 2 near to the plane of the worktable 2, 2 1 7 b remains fixed on this plane. Such a component projection system includes a flexible light guide, fiber, or hollow tube filled with a suitable liquid to slightly acidic salt with a pH of about 5 including, for example, silicon dioxide or PMMA. The diameters of the flexible meters of the component projection systems 2 1 1 a, 2 1 1 b, and the length of about 1 meter are also included in the projection to include radiation, and the device 4 1 is also near the entrance 2 孑 L. Use it properly, and now each system 2 1 1 b or more transparent focus to the base system can be used in each 5a, 2i5b diameter (2 1 7 a 'in the template form and ruler their specific embodiment is The focusing system is shown in more detail in Figure 4. This focusing system 4 3 (packet lens 45) is placed at the proximal end 215b to plate 2 in an appropriate manner; the details of the focusing system 43 are design choices The decision of the person in the art. The template fixed flexible light guide as described above is combined with an individual focusing system. In addition, each component projection system 2 1 1 a, 2 1 1 b 2 1 7 b) may have One such stencil holder 4 1 The stencil of the holder may, for example, include a (interchangeable) drawing plate with an inch aperture. An example of this pattern will be discussed in the next embodiment. At the end

Q: \ 71 \ 71304-910802.ptc Page 21 5 Swallow 0334 Amendment No. 90111965 > Name Amendment V. Description of the Invention (18) Area C and an alignment mark P1. As described herein, ball removal (E B R) has been completed in the surrounding area / along the edge of the ring R extending just inside the periphery, and mark cleaning (MC) of the alignment mark Pi has been completed. This has been achieved by providing a stencil pattern to the component projection system 2 1 1 a, 2 1 1 b of FIG. 2 in this way to project individual images (points) 2 1 9 a, 2 1 9 c on the plane of the substrate. As described herein, point 2 1 9a measures approximately 2.4 X 2.4 square millimeters, and point 2 1 9b measures approximately 0.9 X 0.9 square millimeters. As described herein, the edge ball removal (EBR) has been completed in multiple strokes, and each of the fixed points 219a, 219b (or both) is fixed to an appropriate one in the periphery E on the surface of the substrate W. Radial position, and rotate the substrate W about the center q. Use points 2 1 9 a to complete the rough rings A 1, A 2 and fine rings A 3 to use points 2 1 9 b to save time and increase productivity. Mark cleaning is also performed on the alignment mark Pi. For this purpose, has point 2 1 9a been used to expose the mark? Area I near 1. Although specific embodiments of the present invention have been described above, it should be understood that the present invention may be implemented beyond what is described. These descriptions are not intended to limit the invention.

0: \ 71 \ 71304-9108 () 2.prc Page 23 530334 Case No. 9011 1965 / Month Modified drawing Brief description Graphic component symbol description 2 Turntable (base plate) 4 Base operation robot 6 Input / output port 8 Optical exposure device 10 Front linear aligner 2 1 Mercury lamp 23 Elliptical lens 25 Adjusting lens 27 Axes 29 Beam splitting device 41 Stencil holder 43 Focusing system 45 Lens 210 Alignment device 211a Component projection system 211b Component projection system 213a Actuation Device 213b Actuator 2 15a Proximal 2 15b Proximal 2 17a Distal 217b Distal 2 19a Image (spot)

O: \ 71 \ 71304-920102.ptc page 24 530334 Amendment No. 9011 1965, month ^ day Simple illustration of the drawing 2 19b image (point) ΙΒΪ O: \ 71 \ 71304-920102.ptc page 25

Claims (1)

5303 Material 1 No. 901Π965 / > Year, Month > Correction 1. When placed on the radiation of the projection beam to the end, there should be 2 · root plane 3. root system 4. root projection 5 · root radiation substrate The projection light shot has the following: the radiation system component is less than one in the plane and the substrate is divided into two equal parts. It can be used as a general application system. The application exposure system is provided. It is used to fix the system. The system and substrate template pattern includes: a radiation beam; a fixed substrate; projecting the beam onto the substrate; between the template holder and the stage, so as to provide multiple radiation beam components through each component projection system; including multiple components Projection systems, each of which is used to project each system is flexible, so that it moves in the direction close to the proximal surface of the substrate, while the far surface away from the substrate remains fixed; parallel to the plane; j the opaque field includes an aperture One of the pore sizes is larger than the other. The device of item 1, wherein the device of item 1 or 2 of the proximal end to the substrate, wherein each component projection system is used to correspondingly package the substrate; the component projections are arranged on the substrate flat to the substrate platform. The rotation vector projection system version of the pattern requires a patent range to be transferred radially. Please patent scope flexible. Claim the device in scope 1 or 2 where at least one component includes a flexible light guide. Patent for the device of item 1 or 2 where the device has alignment O: \ 71 \ 71304-920102.ptc Page 26 90111965 ΤΤϊΤ device, borrowed 6. According to the application Benefit range Beam to patent range Used to fix and correct the position and direction of the board's rotation axis to the substrate. The device of item 5 further includes the position and / or direction of the substrate on the substrate moving stage. , Including:, providing the main radiation projection beam; a fixture, the patterning device is used to fix the substrate according to the required pattern;, used to project the patterned main projection beam to the sub-; Item 7. The lithographic projection tool of item 7, including a device for turning a radiation system of an optical exposure device. The lithographic projection tool of item 7 or 8, wherein a reticle holder for fixing a reticle is fixed. 10. The lithographic projection tool according to item 7 or 8 of the patent application, wherein the radiation system includes a radiation source. 1 1. A substrate coating machine, comprising: a base of a substrate; a device for moving the substrate back and forth between the base and the conversion table; when the substrate is placed on the base, it is used to add liquid to the substrate main Liquid dispensing device on the surface; the substrate coating machine also includes a O: \ 71 \ 71304-920102.ptc Page 27 5 & 0334 (h > ::: last taxi · ι 90111965 /-Correct optical exposure device. 12. A method for manufacturing a component, including the following steps : Providing a substrate at least partially covered with a layer of radiation-sensitive material; using a radiation system to provide a radiation projection beam; using a patterning device to impart a cross-sectional pattern to the projection beam; projecting the patterned radiation beam onto a target portion of the radiation-sensitive layer to irradiate radiation The surrounding ring of the sensitive material layer; and irradiating at least one alignment mark on the substrate; both of the irradiation steps are performed when the substrate is positioned at the same position. O: \ 71 \ 71304-920102.ptc Page 28