527681 A7 B7 五、發明説明（） 發明領域： 本發明係有關於一種將氣體充入晶盒中之裝置，特別 是有關於一種將氮氣或鈍氣等氣體自動充入置於裝載埠 (load port)上的晶盒中之裝置。 發明背景： 為了以合乎經濟效益的方式製造出高品質的半導體元 件，半導體製造商傾向於生產尺寸愈來愈大的晶圓。無論 是2 00mm晶圓，或是最新的30〇mm晶圓，在各製程機台 的輸送過程中，都必須將晶圓置於晶盒中，以確保晶圓在 輸送過程中，能處於最潔淨的環境中。晶盒中的晶圓裝載 進入製程機台之前，必須先將晶盒置於安裝在機台前端之 裝載埠輸送系統上。此裝載埠輸送系統係一用來暫時放置 稍後將被輸送到製程機台的晶圓之供料系統。裝載埠輸送 系統是屬於標準機械介面（Standardized Mechanical Interface ; SMIF)系統的一種形式。以下對SMIF系統做一 簡介。 SMIF 系統揭露於惠普公司（Hewlett-Packard Company) 所發表的美國專利第4,532,970號以及第4,534,389號中。 SMIF系統的目的是為了要降低半導體晶圓在製造的儲存 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) 着 — — — — — — — — — — I I MW (請先閲4謂背面之注意事項再填寫本頁) -itr ♦ 經濟部智慧財產局員工消費合作社印製 527681 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 以及輸送過程中所沾染的微粒數目。此目的至少可藉著 S ΜIF系統的兩個功能而達成。第一是確保晶圓在儲存與輸 送的過程中’在晶圓周圍的氣體介質（例如空氣或是氮氣） 相對於晶圓必定是靜止不動的狀態。第二是確保大氣中的 微粒不會進入晶圓所處的環境中。 SMIF系統有三個主要的組成元件。第一是具最小體積 且密封的晶盒’用來儲存與輸送晶圓及/或晶圓匣。第二是 一輸入/輸出微型環境（minienvironrnent)，與半導體製程機 台相連接’用以提供一潔淨空間（藉著以潔淨的空氣填入其 中）。暴露在此潔淨空間的晶圓及/或晶圓匣可保持在最潔淨 的狀態下進出製程機台的内部。第三是一介面，用來使晶 圓及/或晶圓E在不暴露於微粒的情況下輸送於SMIF系統 與SMIF微型環境之間。 一般而言，SMIF晶盒包含一裝載埠門與一外殼，用以 提供一密封的環境’使晶圓在此環境中儲存與輸送。目前， 由於晶圓尺寸的不同與晶圓廠中機台介面之方位的不同， 可有不同的SMIF晶盒之形式。除了現有的2〇〇 mm晶圓以 外，300mm晶圓的製程已在最近幾年發展出來。不同的晶 盒與晶盒處理設備可用於200mm晶圓或300mm晶圓之製 程中。此外，SMIF晶盒可以是下開式或是前開式。在下開 式的SMIF晶盒中，裝載埠門水平置於晶盒的底部，且晶 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) —— ——•裝.........訂.........· (請先閲讀背面之注意事項再填寫本頁) 527681 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（) 圓置於晶圓匣中，晶圓匣再置於裝載埠門上。在前開式的 SMIF晶盒中，裝載埠門垂直置於晶盒的側面，且晶圓置於 固定在外殼内壁之數個相互平行的水平板上。這樣的晶盒 一般稱為前開式晶盒（Front Opening Unified Pod ; FOUP)。 與下開式的晶盒配合的裝載皡輸送系統係置於2 0 0 m m 晶圓生產之各製程機台的前端，做為供料與卸料之用。第1 圖為習知200mm晶圓之裝載埠輸送系統之裝載（L〇ad)或卸 下（Unload)狀態之示意圖。在晶圓匣40之裝載或卸下狀態 下，微型環境3 0係升起至如第1圖所示之最高點。此裝載 埠輸送系統主要包含兩個主體，即垂直的支撐結構與驅動 結構。靜止的裝載埠門50固定在支撐結構上，可移動的微 型環境3 0則是固定在驅動結構上。微型環境3 〇的最上端 是裝載埠平台20。裝載埠輸送系統被設計成可透過一介面 板（未繪示）直接連接到製程機台（未繪示）。裝載埠輸送系統 可藉著鬆開插銷（未繪示）快速地與製程機台分離。微型環 境3 0的說明如下所示。 微型環境3 0的上端是裝載埠平台20。一風扇（未繪示） 位於下方。超低微粒空氣（Ultra-Low Particle Air; ULPA) 過濾器裝置（未繪示）用來提供包含一自行維持過濾空氣系 統之微型環境3 0。微型環境3 0之結構主要是由一伺服馬 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) —— ——·裝.........訂.........· (請先閲讀背面之注意事項再填寫本頁) 以/()81527681 A7 B7 V. Description of the invention () Field of the invention: The present invention relates to a device for filling gas into a crystal box, and in particular to a method for automatically filling gas such as nitrogen or inert gas into a load port. The device in the crystal box on). BACKGROUND OF THE INVENTION: In order to produce high-quality semiconductor components in a cost-effective manner, semiconductor manufacturers tend to produce increasingly larger wafers. Whether it is a 200mm wafer or the latest 30mm wafer, the wafer must be placed in a crystal box during the transportation process of each process machine to ensure that the wafer can be at the most In a clean environment. Wafer loading in wafer box Before entering the process machine, the wafer box must be placed on a loading port conveyor system installed at the front of the machine. This loading port transfer system is a feeding system for temporarily placing wafers that will be transferred to a process machine later. The loading port conveyor system is a form of a standardized mechanical interface (SMIF) system. The following is an introduction to the SMIF system. SMIF systems are disclosed in US Patent Nos. 4,532,970 and 4,534,389 issued by Hewlett-Packard Company. The purpose of the SMIF system is to reduce the storage and storage of semiconductor wafers. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210x297 mm). — — — — — — — — — — II MW (Please read 4 (Please refer to the note on the back, please fill in this page) -itr ♦ Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 527681 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () and particles contaminated during transportation number. This objective can be achieved by at least two functions of the SMIF system. The first is to ensure that the gas medium (such as air or nitrogen) around the wafer during the storage and transportation of the wafer must be stationary relative to the wafer. The second is to ensure that particles in the atmosphere do not enter the environment in which the wafer is located. The SMIF system has three main components. The first is a minimally sealed wafer box ' for storing and transporting wafers and / or cassettes. The second is an input / output minienvironrnent, which is connected to the semiconductor process equipment 'to provide a clean space (by filling it with clean air). The wafers and / or cassettes exposed in this clean space can be kept in and out of the process machine in the cleanest state. The third is an interface that allows wafers and / or wafers E to be transported between the SMIF system and the SMIF microenvironment without being exposed to particles. Generally speaking, the SMIF crystal box includes a loading port door and a housing to provide a sealed environment 'for wafers to be stored and transported in this environment. At present, due to the difference in wafer size and the orientation of the machine interface in the fab, there can be different forms of SMIF crystal boxes. In addition to the existing 200 mm wafers, the 300 mm wafer process has been developed in recent years. Different cassettes and cassette processing equipment can be used in the 200mm wafer or 300mm wafer process. In addition, the SMIF crystal box can be a bottom-open type or a front-open type. In the bottom open type SMIF crystal box, the loading port door is horizontally placed on the bottom of the crystal box, and the paper size of the crystal is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) —— —— • ..... .... Order ......... (Please read the notes on the back before filling this page) 527681 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () In the cassette, the cassette is placed on the loading port door. In the front-open type SMIF crystal box, the loading port door is vertically placed on the side of the crystal box, and the wafer is placed on several parallel horizontal plates fixed on the inner wall of the housing. Such a crystal box is generally referred to as a Front Opening Unified Pod (FOUP). The loading / conveying system matched with the bottom-open type crystal box is placed at the front of each process machine for wafer production of 200 mm, for feeding and unloading. Figure 1 is a schematic diagram of the loading (Unad) or unloading state of the conventional 200mm wafer loading port transport system. In the loading or unloading state of the wafer cassette 40, the microenvironment 30 is raised to the highest point as shown in FIG. This loading port conveying system mainly includes two main bodies, namely a vertical supporting structure and a driving structure. The stationary loading port door 50 is fixed to the supporting structure, and the movable micro-environment 30 is fixed to the driving structure. The top end of the mini-environment 30 is the loading port platform 20. The loading port conveyor system is designed to be directly connected to the process machine (not shown) through an interface board (not shown). The loading port conveyor system can be quickly separated from the process machine by releasing the latch (not shown). A description of the microenvironment 30 is shown below. The upper end of the mini-environment 30 is the loading port platform 20. A fan (not shown) is located below. Ultra-Low Particle Air (ULPA) filter device (not shown) is used to provide a micro-environment 30 including a self-maintaining filtered air system. The structure of the mini-environment 30 is mainly composed of a servo horse-made paper scale that applies the Chinese National Standard (CNS) A4 specification (210X297 mm) —— ——......... Order ... .... · (Please read the notes on the back before filling this page) with / () 81
、發明說明( 達（未、纟會示）所券& 、 f^ 以根據裝載或卸下命令做垂直移動。 田對#載埠輸送系统 ^ f玩下達裝載或卸下命令時，微型環境 將裝载埠平a ? π命a ^ 各 口 /、日日盈外殼10升起，且裝載埠門5 〇、晶 ^底座 4 5、獻a问r- 广“ /、曰曰0 E 40留在原地靜止不動。此時，晶盒 的=5與a曰圓匣40依然位在靜止的裝載埠門50上與潔淨 、、，衣兄中。此外，輸送臂6〇係用來將晶圓匣40抓起後輸 g：製轾機台，或將製程機台上的晶圓匣40抓起後輸送至 晶盒底座4 5上。 清參考第2圖所繪示之習知2〇〇mm晶盒置於裝載埠平 〇上之不意圖（未繪示輸送臂）。此第2圖係繪示晶圓匣40 Ρ將進入；^程機台以進行製程前或已完成製程並即將前往 下一站前之閒置狀態（微型環境30降至最低點）。如前所 述’微型環境30具有使晶圓匣40與晶圓70儘可能保持在 最潔淨的狀態下之功能，因而使晶圓7〇在進入製程機台前 能具有最佳之品質。然而此微型環境3 〇主要係在於將固態 微粒排除。至於亦會對晶圓7〇的表面造成危害之腐蝕性氣 體分子則無法完全排除，因而降低晶圓70的品質，因此有 必要針對此一問題尋求解決之道。 I — — — — — — — — — * 一一 ^ — — — — — — — — — (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 的 上 統 系 送 輸 埠 載 裝 於 置 知 習 中 景 背 : 明 述 發 概 述 及 上 的 於 目 鑒 明 發 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 527681 A7 B7 五、發明説明（） (請先閲讀背面之注意事項再填寫本頁) 晶盒雖可經由微型環境將固態微粒排除，然而卻無法完全 排除對晶圓的表面造成危害之腐蝕性氣體分子，因而降低 晶圓的品質。因此本發明之一目的為提供一種將氣體自動 充入裝載埠上的晶盒中之裝置，可用以保護晶盒中的晶圓 免於遭受腐蝕性氣體分子之危害。. 本發明之另一目的為提供一種將氣體自動充入裝載璋 上的晶盒中之裝置，可用以提高晶圓之品質。 經濟部智慧財產局員工消費合作社印製 依據本發明之上述目的，因此本發明提供一種將氣體 自動充入裝載埠上的晶盒中之裝置，適用於將來自氣體提 供裝置之例如為氮氣或鈍氣之氣體充入一 SMIF系統之裝 載埠上的晶盒中，並排氣至抽真空裝置，藉以使晶盒中的 晶圓免於遭受腐蝕性物質之危害，其中此將氣體自動充入 裝載埠上的晶盒中之裝置至少包括：晶盒底座；進氣接頭， 貫穿晶盒底座；排氣接頭，貫穿晶盒底座；裝載埠門，具 有進氣孔與排氣孔，其中進氣孔與排氣孔貫穿裝載埠門， 且進氣接頭與排氣接頭可分別同時由裝載埠門之上方往下 插入進氣孔與排氣孔中；進氣管線，其中進氣管線之一端 由裝載埠門之下方連接至進氣孔；排氣管線，其中排氣管 線之一端由裝載埠門之下方連接至排氣孔；例如為電磁閥 之進氣閥，其中進氣闊之一端連接至進氣管線之另一端， 且進氣閥之另一端連接至氣體提供裝置；例如為電磁閥之 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 527681 A7 B7 五、發明説明（) (請先閲讀背面之注意事項再填寫本頁) 排氣閥，其中排氣閥之一端連接至排氣管線之另一端，且 排氣閥之另一端連接至抽真空裝置；以及控制電路，電性 連接至進氣閥、排氣閥、以及SMIF控制系統。 圖式簡單說明： 本發明的較佳實施例將於往後之說明文字中輔以下列 圖示做更詳細的闡述，其中： 第1圖係繪示習知200mm晶圓之裝載埠輸送系統之裝 載或卸下狀態（微型環境升起）之示意圖； 第2圖係繪示習知200mm晶盒置於裝載埠平台上之示 意圖（未繪示輸送臂）； 第3圖係繪示本發明之一較佳實施例之將氣體自動充 入裝載槔上的晶盒中之裝置之分解圖，其中更包括習知之 晶盒外殼、微型環境、以及SMIF控制系統等元件； 經濟部智慧財產局員工消費合作社印製 第4圖係繪示本發明之一較佳實施例之將氣體自動充 入裝載埠上的晶盒中之裝置之組合圖，其中更包括習知之 晶盒外殼、微型環境、以及SMIF控制系統等元件；以及 第5圖係繪示本發明之另一較佳實施例之將氣體自動 充入裝載埠上的晶盒中之裝置之組合圖，其中更包括習知 之晶盒外殼、微型環境、以及SMIF控制系統等元件。 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 527681 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 圖號對照說明： 10 晶盒外殼 20 裝載埠平台 30 微型環境 40 晶圓匣 45 晶盒底座 50 裝載埠門 60 輸送臂 70 晶圓 80 SMIF控制系統 90 氣體提供裝置 100 抽真空裝置 1 10 進氣接頭 120 排氣接頭 130 進氣孔 140 排氣孔 145 晶盒底座 150 裝載埠門 155 進氣管線 165 排氣管線 170 進氣閥 180 排氣閥 、 190 箭號 200 箭號 210 訊號線 220 訊號線 230 控制電路 240 進氣電磁閥 250 排氣電磁闊 260 第一壓縮乾燥空氣（compressed dry air ; CDA)管線 270 第二CDA管線 280 CDA管線 290 CDA管線 300 CDA提供裝置 發明詳細說明： 本發明係揭露一 種將氣體自 動充入裝載埠上的晶盒 8 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 527681、 Explanation of the invention (up to (not, 纟 会 示) coupons &, f ^ to make vertical movement according to the load or unload command. Tian Du #Load Port Conveying System ^ f When the load or unload command is issued, the miniature environment Raise the loading port a? Π life a ^ each port /, the Riyin shell 10 is raised, and the loading port door 5 〇, the crystal ^ base 4 5, offer a question r-wide "/, said 0 E 40 Leave it still at the same place. At this time, the crystal box = 5 and the a box 40 are still on the static loading port door 50 and in the clean, clean, and cloth. In addition, the conveying arm 60 is used to place the crystal After the round box 40 is picked up, it is conveyed to the g: making machine, or the wafer box 40 on the process machine is picked up and conveyed to the wafer base 45. Refer to the conventional knowledge shown in FIG. 〇mm is not intended to be placed on the loading port level 〇 (the conveyor arm is not shown). This second picture shows that the wafer cassette 40P will enter; ^ process machine to perform the process or has completed the process and The idle state before going to the next station (the mini-environment 30 is reduced to the lowest point). As mentioned earlier, the 'micro-environment 30 has the cassette 40 and the wafer 70 kept as clean as possible. Function, so that the wafer 70 can have the best quality before entering the process machine. However, this micro-environment 30 is mainly to exclude solid particles. As for the corrosiveness that will also harm the surface of the wafer 70 Gas molecules cannot be completely eliminated, thus reducing the quality of wafer 70, so it is necessary to find a solution to this problem. I — — — — — — — — — * 一 ^^ — — — — — — — — — (Please read the precautions on the back before filling out this page.) The upper line of the printed system printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is loaded on the back of Zhizhong Xizhong. Mingfa's paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 527681 A7 B7 V. Description of the invention () (Please read the precautions on the back before filling this page) Although the crystal box can be solidified through the micro environment Particles are eliminated, but corrosive gas molecules that cause harm to the surface of the wafer cannot be completely eliminated, thereby reducing the quality of the wafer. Therefore, an object of the present invention is to provide A device for automatically filling gas into a crystal box on a loading port can protect wafers in the crystal box from being damaged by corrosive gas molecules. Another object of the present invention is to provide an automatic gas filling The device in the crystal box loaded on the wafer can be used to improve the quality of the wafer. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs has printed the above-mentioned object according to the present invention. Therefore, the present invention provides a crystal that automatically fills the gas on the loading port. The device in the box is suitable for filling a crystal box on the loading port of a SMIF system with a gas such as nitrogen or inert gas from a gas supply device, and exhausting it to a vacuum device, so that the crystal in the crystal box The circle is free from the harm of corrosive substances. The device for automatically filling gas into the crystal box on the loading port includes at least: a crystal box base; an air inlet joint through the crystal box base; an exhaust joint through the crystal box base ; Loading port door, with air inlet and exhaust holes, where the air inlet hole and exhaust hole run through the loading port door, and the air inlet connector and exhaust connector can go from above the loading port door at the same time Inserted into the air inlet and exhaust hole below; Intake line, where one end of the inlet line is connected to the inlet port from below the load port door; Exhaust line, where one end of the exhaust line is connected from below the load port door To the exhaust hole; for example, an air inlet valve of a solenoid valve, in which one end of the air inlet is connected to the other end of the air inlet line, and the other end of the air inlet valve is connected to a gas supply device; for example, the paper size of the solenoid valve Applicable to China National Standard (CNS) A4 specification (210X297 mm) 527681 A7 B7 V. Description of the invention () (Please read the precautions on the back before filling this page) Exhaust valve, one end of the exhaust valve is connected to the exhaust The other end of the pipeline and the other end of the exhaust valve are connected to a vacuum pumping device; and a control circuit is electrically connected to the intake valve, the exhaust valve, and the SMIF control system. Brief description of the drawings: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following diagrams, in which: Figure 1 shows a conventional loading port transport system for 200mm wafers. Schematic diagram of the loading or unloading state (raised in a miniature environment); Figure 2 is a schematic diagram of a conventional 200mm crystal box placed on a loading port platform (not shown); Figure 3 is a schematic diagram of the present invention A preferred embodiment of an exploded view of a device for automatically filling gas into a crystal box on a load cell, which also includes components such as a conventional crystal box housing, a micro-environment, and a SMIF control system; consumption by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs The fourth figure printed by the cooperative is a combination diagram showing a device for automatically filling gas into a crystal box on a loading port according to a preferred embodiment of the present invention, which further includes a conventional crystal box shell, a miniature environment, and SMIF. Control system and other components; and FIG. 5 is a combined diagram of a device for automatically filling gas into a crystal box on a loading port according to another preferred embodiment of the present invention, which further includes a conventional crystal box housing, a micro ring And a control element SMIF systems. This paper size applies to China National Standard (CNS) A4 specifications (210X 297 mm) 527681 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Drawing number comparison description: 10 Crystal box housing 20 Loading port platform 30 Mini-environment 40 Wafer cassette 45 Cassette base 50 Loading port door 60 Conveying arm 70 Wafer 80 SMIF control system 90 Gas supply device 100 Evacuation device 1 10 Air inlet 120 Air outlet 130 Air inlet 140 Air outlet 145 Box base 150 Loading port door 155 Intake line 165 Exhaust line 170 Inlet valve 180 Exhaust valve, 190 Arrow 200 Arrow 210 Signal line 220 Signal line 230 Control circuit 240 Inlet solenoid valve 250 Exhaust solenoid valve 260 first compressed dry air (CDA) pipeline 270 second CDA pipeline 280 CDA pipeline 290 CDA pipeline 300 CDA providing device Detailed description of the invention: The present invention discloses a crystal box 8 for automatically filling gas into a loading port 8 (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 5276 81
經濟部智慧財產局員工消費合作社印製 之農置’適用於將來自氣體提供襄置之例如為氮氣或純氣 之乳體充入一標準機械介面系統之裝載埠上的晶盒中，並 排氣至抽真空裝置，藉以使晶盒中的晶圓免於遭受腐蝕性 物質之危害。請參考第3圖以及第4圖分別所繪示之本發 明之-較佳實施例之將氣體自動充入裝載蟑上的晶盒中之 :置：分解圖以及組合圖，其中更包括習知之晶盒外殼、 微型環境、以及SMIF控制系統等元件。本發明之裝置包 括晶盒底座145、進氣接頭11〇、排氣接頭12〇、裝載埠門 1 5 〇、進氣闊1 7 0、排氣閥i 8 0、以及控制電路2 3 〇等。另 外，晶盒外殼ίο、裝載埠平台20、微型環境3〇、以及smif 控制系統80等元件是本發明之裝置在運作時必須同時配 合運作之習知元件。再者，本發明之裝置與習知元件配合 運作之前，必須先組合成如第4圖中所繪示。以下說明本 發明之裝置與習知元件間之連接關係。 曰曰盒外殼ίο係為習知元件，與晶盒底座145共同組成 曰曰盒。晶盒中更包括晶圓匣，且晶圓匣中可放置晶圓（在第 3圖與第4圖未繪示晶圓匣與晶圓，但可參考第1圖與第2 圖中之晶圓匣40與晶圓70)。晶盒底座145原為習知元件， 但經過改良之後，亦為本發明之裝置中的元件之一。進氣 接頭1 1 〇與排氣接頭丨20皆貫穿晶盒底座丨45 ,係分別用 以做為氣體進入與排出晶盒之通道。進氣接頭Π 0與排氣 接頭1 2 0的種類例如為可達到良好氣密性之快速接頭，藉 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) — — — — K'l — —·— — — — I — — — — llll — (請先閲讀背面之注意事項再填寫本頁) 527681 經濟部智慧財產局員工消費合作社印製 A 7 B7 五、發明説明（） 以使技術員能夠將進氣接頭1 1 〇與排氣接頭1 20分別同時 由裝載埠門1 5 0之上方往下快速地插入貫穿裝載埠門1 5 0 之進氣孔1 3 0與排氣孔1 40中而進行氣密性良好之進氣與 排氣功能。而當進氣與排氣結束時，此進氣接頭1 1 〇與排 氣接頭1 2 0又可使晶盒快速地抽離進氣孔1 3 0與排氣孔 140。 進氣管線1 5 5以及排氣管線1 6 5係置於微型環境3 0 中，其中進氣管線1 5 5的一端以及排氣管線1 6 5的一端分 別由裝載璋門1 5 0之下方連接至進氣孔 1 3 0以及排氣孔 140。進氣管線155的另一端以及排氣管線165的另一端則 分別連接至進氣閥1 70之一端以及排氣閥1 80之一端。進 氣閥1 70之另一端以及排氣閥1 80之另一端進一步經由其 它管線分別連接至位於微型環境3 0外的氣體提供裝置90 以及抽真空裝置100。箭號190係表示來自上述氣體提供 裝置90之氣體，其中此氣體例如可為氮氣或鈍氣等。箭號 200則表示來自晶盒外殼1 0中，即將被柚出至抽真空裝置 100之氣體，其中此氣體中包括可對晶圓之表面造成危害 之腐蝕性氣體分子。 本發明之一較佳實施例之進氣闊1 70以及排氣閥180 例如可為電磁閥。若進氣閥1 70以及排氣閥1 80為電磁閥， 則本發明之裝置更包括控制電路2 3 0，經由訊號線2 1 0以 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ---- ----•丨裝.........訂.........· (請先閲讀背面之注意事項再填寫本頁) 527681 A7 B7 五、發明説明（） 及訊號線220分別電性連接至進氣閥} 7〇以及排氣閥1 80。 此控制電路230進一步電性連接至習知之SMIF控制系統 80。因此，相關人員可直接由SMIF控制系統80直接控制 進氣閥1 7 0以及排氣閥1 8 0的開/關狀態，因而可自由控制 晶盒中氣體的進氣與排氣狀態。 請參考第5圖，本發明之另一較佳實施例之進氣閥1 70 以及排氣闊1 8 0例如可為氣動閥。若進氣閥} 7 〇以及排氣 閥1 80為氣動閥’則本發明之裝置更包括進氣電磁閥24〇 以及排氣電磁閥250，其中此進氣電磁閥24〇與此排氣電 磁閥250係分別藉由第一 CDA管線260與第二CDA管線 270連接至進氣閥170以及排氣閥18〇，且CDA提供穿置 300分別藉由CDA管線280與CDA管線290連接至進氣電 磁闊240與排氣電磁閥250。此外’若進氣閥17〇以及排 氣閥180為氣動闊’則本發明之裝置更包括控制電路23〇, 經由訊號線210以及訊號線220分別電性連接至進氣電磁 閥240以及排氣電磁閥250。此控制雷” …电路2 3 0進一步電性 連接至習知之SMIF控制系統80。因此， 相關人員可直接 L T (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 由SMIF控制系統80直接控制進氣閥1 7 〜以及排氣閥18( 的開/關狀態，因而可自由控制晶盒中氣顺^ 礼妓的進氣與排氣狀 態。 綜合上述，本發明之一優點為提供〜 種將氣體自動充 11 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 527681 A7 _B7^ 五、發明説明（） 入裝載埠上的晶盒中之裝置，可用以保護晶盒中的晶圓免 於遭受腐蝕性氣體分子之危害。 本發明之另一優點為提供一種將氣體自動充入裝載槔 上的晶盒中之裝置，可用以提高晶圓之品質。 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)The farm house printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is suitable for filling the milk from gas supply, such as nitrogen or pure gas, into the crystal box on the loading port of a standard mechanical interface system, side by side. The gas is evacuated to protect the wafers in the wafer box from corrosive substances. Please refer to FIG. 3 and FIG. 4 respectively. The preferred embodiment of the present invention-a preferred embodiment of the invention for automatically filling gas into a crystal box on a cock: a set-up: an exploded view and a combination view, including the conventional ones Components such as crystal case, microenvironment, and SMIF control system. The device of the present invention includes a crystal box base 145, an air inlet connector 11o, an exhaust connector 12o, a loading port door 150, an air inlet 170, an exhaust valve i 8 0, and a control circuit 2 3 0. . In addition, components such as the crystal case housing, the loading port platform 20, the mini-environment 30, and the smif control system 80 are conventional elements that must be matched with the operation of the device of the present invention. Furthermore, before the device of the present invention cooperates with conventional components, it must be assembled as shown in FIG. 4. The connection relationship between the device of the present invention and the conventional components will be described below. The case of the box is a conventional component, which together with the crystal box base 145 forms a box. The cassette also includes a wafer cassette, and wafers can be placed in the cassette (the wafer cassette and wafer are not shown in Figures 3 and 4, but the crystals in Figures 1 and 2 can be referred to Wafer 40 and wafer 70). The crystal box base 145 was originally a conventional component, but after being improved, it is also one of the components in the device of the present invention. The inlet connector 110 and the exhaust connector 20 pass through the base of the crystal box, and are used as channels for gas to enter and exit the crystal box. The types of the air inlet joint Π 0 and the air exhaust joint 1 2 0 are, for example, quick joints that can achieve good air tightness. According to this paper size, the Chinese National Standard (CNS) A4 specification (210x297 mm) is used. — — — — K ' l — — · — — — — I — — — — — llll — (Please read the notes on the back before filling this page) 527681 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A 7 B7 V. Description of Invention () The technician can quickly insert the air inlet connector 1 1 0 and the air outlet connector 1 20 from above the loading port door 150 respectively at the same time and quickly insert the air inlet hole 1 3 0 and the exhaust hole 1 through the loading port door 150. The air intake and exhaust functions with good airtightness are performed in 40%. When the intake and exhaust ends, the intake joint 110 and exhaust joint 120 can quickly pull the crystal box away from the intake hole 130 and the exhaust hole 140. The intake line 1 5 5 and the exhaust line 1 65 are placed in the micro-environment 30. One end of the intake line 1 5 5 and one end of the exhaust line 1 6 5 are respectively below the loading door 1 50. Connected to the air intake hole 130 and the exhaust hole 140. The other end of the intake line 155 and the other end of the exhaust line 165 are connected to one end of the intake valve 170 and one end of the exhaust valve 180, respectively. The other end of the air inlet valve 1 70 and the other end of the air outlet valve 180 are further connected to the gas supply device 90 and the evacuation device 100 located outside the microenvironment 30 through other lines, respectively. The arrow 190 indicates a gas from the above-mentioned gas supply device 90, and the gas may be, for example, nitrogen or inert gas. The arrow 200 indicates the gas from the crystal case shell 10, which is about to be evacuated to the vacuum device 100. The gas includes corrosive gas molecules that can cause damage to the surface of the wafer. The intake valve 170 and the exhaust valve 180 of a preferred embodiment of the present invention may be solenoid valves, for example. If the inlet valve 1 70 and the exhaust valve 1 80 are solenoid valves, the device of the present invention further includes a control circuit 2 3 0, which is in accordance with the Chinese National Standard (CNS) A4 specification (210X297) via the signal line 2 1 0 on this paper scale. (Mm) ---- ---- • 丨 Install ......... Order ......... (Please read the notes on the back before filling this page) 527681 A7 B7 5. Description of the invention () and the signal line 220 are electrically connected to the intake valve} 70 and the exhaust valve 180 respectively. The control circuit 230 is further electrically connected to the conventional SMIF control system 80. Therefore, the relevant personnel can directly control the opening / closing states of the intake valve 170 and the exhaust valve 180 by the SMIF control system 80, and thus can freely control the intake and exhaust states of the gas in the crystal box. Referring to FIG. 5, the intake valve 1 70 and the exhaust valve 1 80 according to another preferred embodiment of the present invention may be pneumatic valves, for example. If the intake valve} 7 〇 and the exhaust valve 1 80 are pneumatic valves, the device of the present invention further includes an intake solenoid valve 24 〇 and an exhaust solenoid valve 250, wherein the intake solenoid valve 24 〇 and the exhaust solenoid valve The valve 250 is connected to the intake valve 170 and the exhaust valve 18 through the first CDA line 260 and the second CDA line 270, respectively, and the CDA providing through 300 is connected to the intake air through the CDA line 280 and the CDA line 290, respectively. Electromagnetic wide 240 and exhaust solenoid valve 250. In addition, if the intake valve 17o and the exhaust valve 180 are pneumatic, the device of the present invention further includes a control circuit 23o, which is electrically connected to the intake solenoid valve 240 and the exhaust gas via a signal line 210 and a signal line 220, respectively. Solenoid valve 250. This control mine "… circuit 2 3 0 is further electrically connected to the conventional SMIF control system 80. Therefore, relevant personnel can directly LT (please read the precautions on the back before filling this page) The SMIF control system 80 directly controls the opening / closing states of the intake valves 17 to 18 and the exhaust valves 18 (), so that the gas inlet and exhaust states of the ceremonial can be controlled freely. Based on the above, this One of the advantages of the invention is to provide ~ a kind of automatic gas filling 11 paper size applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) 527681 A7 _B7 ^ V. Description of the invention () Device in the crystal box on the loading port It can be used to protect the wafers in the crystal box from being damaged by corrosive gas molecules. Another advantage of the present invention is to provide a device for automatically filling gas into the crystal box on the wafer, which can be used to improve the wafer Quality. As understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent application for the present invention; Equivalent changes or modifications made under the spirit of the spirit should be included in the scope of patent application below. (Please read the precautions on the back before filling out this page.) The paper printed by the employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs applies to this paper. China National Standard (CNS) A4 specification (210X297 mm)