523851 A7 B7 五、發明說明（) 發明範疇： 本發明與半導體測試設備有關，特別是有關於一種晶圓測試線 上之噴墨模組。 發明背景： 在測試晶圓的時候，會測出有的晶片是好的，有的則是壞的。 其中，壞的晶片就要用墨水（ink)打在上面做記號。用來做記號的設 備一般配置在具有兩個方向的測試機台上。如第5圖所示，傳統的 記號設備係設置在第一方向，也就是所謂的線外記號位 置（offline inking position)500上做記號。至於第二方向，則如第4圖所示，是 所謂的線上記號位置（inline inking p〇sition)400。 以往我們用上述傳統設備做記號的時候，是在機台的線外記號 位置500(第5圖）上進行的（也就是晶圓測完之後再打記號）。這種傳 統設備的缺點之一，在於其墨水容器是添加式的，常造成機台上面 的污染，如第5圖所示。此外，應注意的是，墨水不能擱置超過二 十四小時；倘若超過二十四小時，容器内的墨水會起變化。這樣的 墨水打到晶片上，再經烘烤之後，會有裂掉的現象。這些龜裂的墨 水記號，在用水刀切出晶片的時候，會被水力衝擊成碎屑，而擴散 到原本應該是好的晶片上。 請參閱第1圖，其所繪示為傳統噴墨設備的立體示意圖。傳統 2 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝--------訂.-------· 經濟部智慧財產局員工消費合作社印製 523851 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 設備的缺點之一，在於其為固定式的，很難進行位置調整。尤其在 進行組合式晶圓（Combo chip ;不同型號的晶片做在同一個晶圓上） 的。 清參閱第6圖’其所繪示為由兩種型號之晶片组成的晶圓示意 圖。由於有第一種型號的晶片612、614,使其有第一種中心點（center point)610 ;也由於有第二種型號的晶片622、624，所以有第二種中 心點620 〇 上述中心點只是計算上虛擬的中心點，真正實際上晶片的中心 點仍需要軟體進行調整，以使墨水得以打在晶片真正的中心點上； 因此在測試晶圓的時候，會需要用軟體進行中心點的偏移調整。然 而’對於組合式的晶圓而言，就必須進行不止一次的偏移調整，因 為待測晶圓上面有不止一種晶片的緣故。此外，請參閱第5圖，用 這種傳統設備在打記號的時候，晶圓是座落在帶子5〇2底下，不容 易觀察是否有落在真正中心點上。 請繼續參閱第5圖，在用傳統設備做記號的時候，晶圓504會 藉由承載座從帶子502的右側逐漸移往帶子502的左側，而傳統設 備只能透過帶子502上的小孔，利用銀線在晶圓5〇4上打記號，其 中正在被打記號的晶片大部份是被帶子502遮住的。應注意的是， 在為晶圓504約前四至五排之壞的晶片所打的記號是否有落在中心 點，由於被帶子5〇2遮住的緣故，必須要到打第五至六排以後才會 知道位置打偏，實在為時已晚。 ----------—裝--------訂-------- (請先閱讀背面之注意事項再填寫本頁) 3523851 A7 B7 V. Description of the invention () The scope of the invention: The invention relates to semiconductor testing equipment, and in particular to an inkjet module on a wafer test line. Background of the invention: When testing wafers, some wafers are good and some are bad. Among them, bad wafers are marked with ink. The equipment used for marking is generally arranged on a test machine with two directions. As shown in FIG. 5, the conventional marking device is set in the first direction, that is, the so-called offline inking position 500 for marking. As for the second direction, as shown in FIG. 4, it is a so-called inline position 400. In the past, when we used the above traditional equipment for marking, it was performed on the machine's off-line marking position 500 (Figure 5) (that is, marking after the wafer was measured). One of the disadvantages of this traditional device is that its ink container is additive, which often causes contamination on the machine, as shown in Figure 5. In addition, it should be noted that the ink cannot be left for more than 24 hours; if it is more than 24 hours, the ink in the container will change. Such ink will crack on the wafer after baking. When these cracked ink marks are cut out of the wafer with a water knife, they will be impacted into chips by the hydraulic force and spread to the wafer that should be good. Please refer to FIG. 1, which is a perspective view of a conventional inkjet device. Traditional 2 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page). -------- Order .----- -· Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 523851 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () One of the disadvantages of the device is that it is fixed and difficult to adjust the position . Especially in the combination wafer (Combo chip; different types of wafers are made on the same wafer). Refer to FIG. 6 'for a schematic diagram of a wafer composed of two types of wafers. Since there are the first type of wafers 612 and 614, they have the first center point (610); and because of the second type of wafers 622 and 624, they have the second center point 620. The above center The point is only a virtual center point for calculation. In fact, the center point of the chip still needs to be adjusted by the software so that the ink can hit the true center point of the chip. Therefore, when testing the wafer, the center point of the software will be required. Offset adjustment. However, for a combined wafer, the offset adjustment must be performed more than once, because there are more than one wafer on the wafer under test. In addition, please refer to Fig. 5. When marking with this conventional device, the wafer is located under the tape 502, and it is not easy to observe whether it has landed on the true center point. Please continue to refer to FIG. 5. When the conventional equipment is used for marking, the wafer 504 will gradually move from the right side of the tape 502 to the left side of the tape 502 through the carrier, and the traditional equipment can only pass through the small hole on the tape 502. The silver wire is used to mark the wafer 504. Most of the wafers being marked are covered by the tape 502. It should be noted that whether the marks marked for the first four to five rows of wafers 504 have fallen on the center point, because they are covered by the tape 502, it is necessary to hit the fifth to sixth rows. I will know later that the position is off. It is too late. ------------ install -------- order -------- (Please read the notes on the back before filling this page) 3
523851523851
五、發明說明（ 〇 第5圖所示，傳統設備所打出的墨水痕跡容易對機二 造成嚴重污染506,難以清除。硬是要清除這些痕跡的話 ： 台的烤漆一起去掉，並不理想。 曰 月參閱第2圖’其所♦福另_種習知的噴墨設備立體示意圖。 這種傳統的設備是採用管式的墨水容器（用完就整管拔掉），其可克 服/亏染的題’但仍無法克服在測組合式晶圓時所產生的不便。這 是因為採用管式墨水容器的傳統設備在進行上述中心點偏移調整 時需要調動多個螺絲，其中包括必須使用一字起子調整兩個用於 前後方向的螺絲；使用十字起子調整一個用於上下方向的螺絲，·以 及使用内六角扳手調整其他方向，因此顯得相當地麻煩。 (請先閱讀背面之注意事項再填寫本頁) ••裝 經濟部智慧財產局員工消費合作社印製 發明目的及簡單說明： 本發明的目的之一，在於解決墨水的使用問題，以節省材料使 用成本。 本發明的另一目的，在於解決墨水對機台造成污染的問題。 本發明的又一目的，在於即時調整墨水打在晶片上的位置。 本發明的再一目的，在於減少調整墨水所需使用的工具。 本發明的另一目的，在於解決測試組合式晶圓所遭遇的中心點 4 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公爱） ί ί n n 一 · n n n 会 523851 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 偏移調整問題^ 為達成上述或其他目的，本發明提供一種測試線上之喷墨模組， 係為需要用墨水做3己號之晶圓的晶片所設計，這種線上喷墨機械組 件包括銀線’可供墨水打在需要做記號的晶片上；卡式墨水匣，提 供墨水；電動彈簧，用以使銀線上下移動，以達到做記號的目的； 第一機件，可供架設電動彈簧和卡式墨水匣，其中第一機件更配有 上下控制旋紐，用以控制銀線和晶圓的距離；第二機件，藉由壓花 式仰角控制螺絲和第一機件連接，其中仰角控制螺絲可用於調整銀 線打在晶片時的仰角；以及機座，透過壓花式左右控制旋鈕和壓花 式前後控制旋鈕連接第二機件，其中壓花式左右控制旋鈕可控制銀 線左右的位移量，而壓花式前後控制旋鈕可控制銀線前後的移動量。 根據本發明較佳實施例，本發明尚可在測試線上設置一透明的 壓克力板，其具有一缺口，可供操作人員即時知道晶片之記號是否 有打偏，不會像習知那樣要到打第五至六排以後才會知道位置打偏。 除此之外，本發明免用工具即能進行墨水位置調整。此外，採 用壓花式的控制旋紐有利於增加旋紐與手指間的摩擦力，避免手汗 等因素造成旋轉不易。更且，由於本發明是在測試線上直接進行記 號製作的，因此不會像習知那樣對機台造成嚴重污染，難以清除。 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公g ) (請先閱讀背面之注意 _事項再 -裝 填寫本頁) ----訂-------- 523851 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（) 圖式簡單說明： 第1圖繪示一種傳統噴墨設備的立體示意圖； 第2圖繪示另一種習知的喷墨設備立體示意圖； 第3圖繪示根據本發明較佳實施例，一種測試線上之喷墨模組 的立體示意圖； 第4圖繪示根據本發明較佳實施例，位在線上記號位置（inline inking position)上之壓克力板立體示意圖； 第5圖繪示傳統的記號設備係座落在測試機台的線外記號位置 (offline inking position)上；以及 第6圖繪示為由兩種型號之晶片組成的晶圓示意圖。 圖式標記說明： 302 :銀線 304 :卡式墨水匣 306 :電動彈簧 308 :第一機件 310 :第二機件 6 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----------裝--------訂------ it (請先閱讀背面之注意事項再填寫本頁) 523851 A7 B7 五、發明說明（） 312 :機座 314 :左右控制旋鈕 316 :前後控制旋鈕 318 :上下控制旋鈕 320 :仰角控制旋鈕 400 :線上記號位置（inline inking position) 402 :壓克力板 404 :缺口 500 :線外記號位置（offline inking position) 504 :晶圓 506 :污染 610 :第一種中心點 612、614 :第一種型號晶片 620 :第二種中心點 622、624 :第二種型號晶片 發明詳細說明： 請參閱第3圖，其所繪示為本發明較佳實施例，一種測試線上 之噴墨模組的立體示意圖。本發明係為需要用墨水做記號之晶圓的 晶片所設計，而這個晶圓可以是上述之組合式晶圓。 請繼續參閱第3圖’本發明喷墨模組可包括一銀線3〇2 ,用以供 墨水打在需要做記號的晶片上。此外，本發明尚包括一卡式墨水昆 7 紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） "--------- (請先閱讀背面之注意 事項再 填寫本頁) 經濟部智慧財產局員工消費合作社印製 523851 A7 B7 五、發明說明（） 304，可提供所需的墨水。所謂的卡式墨水匣3〇4，就是當墨水打完 的時候，就將之拋棄，不需要進行添加，如此的設計在墨水控制上 會較優於傳統設備。更且，本發明還包括一電動彈簧3〇6，用以使 上述銀線302上下移動，以達到做記號的目的。這個電動彈簧3〇6 的操作模式，可以疋當供電的時候，彈簧306會向下施壓，使銀線 302接觸到晶片；而在不供電的時候，彈簧3〇6會鬆回，使銀線3〇2 離開晶片。 請繼續參閱第3圖，本發明更可包括一第一機件3〇8，用以架設 上述電動彈簧306和卡式墨水匣3〇4，其中第一機件3〇8更配有上 下控制旋麵318，用以控制銀線302和晶圓的距離。此外，本發明 尚包括一第二機件310，可藉由壓花式仰角控制螺絲32〇和上述第 一機件308連接，其中仰角控制螺絲32〇可用於調整銀線3〇2打在 晶片時的仰角。一般而言，我們希望記號是以垂直於晶片的方式打 上去的’如此不但能使墨水匣304内的墨水得以被充分運用，減少 殘留，而且其所打出來的記號也較圓。通常這種仰度控制旋鈕32〇 只要調整一次就不需要再做調整。 尚且，本發明更具有一機座312,可透過壓花式左右控制旋鈕314 和壓花式前後控制旋鈕316和第二機件310連接，其中壓花式左右 控制旋鈕314可控制銀線302左右的位移量，而壓花式前後控制旋 鈕316可控制銀線302前後的移動量。 上述左右控制旋鈕314和前後控制旋鈕316是較為常使用的旋 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝--------訂------- 經濟部智慧財產局員工消費合作社印製 523851 κι 經濟部智慧財產局員工消費合作社印，製 _ —_______五、發明說明（） 钮’其中左右控制旋la 314的旋轉角度可以是左右各約30度（0 土 30°)。至於前後控制旋鈕316，其前後位移量（機座不動，第二機件 前後移動）可達約4000 mil(〜10 cm ; 1冚㈤=40 mil)。由於一個晶片 的長度或寬度大約是200-300 mil，因此4000 mil的位移量對晶片中 心點偏移調整來說是相當足夠的。 請參閱第4圖，本發明還可在測試線上設計透明的抗靜電壓克 力板402 ’設置在第一機件308和待測晶圓之間，以避免晶圓在運 作過程中產生靜電而被破壞。此外，在這塊壓克力板402上可設有 一缺口 404，供以供銀線302對晶片打記號。 本發明可以具有下列優點： 1·本發明是一種免用工具式的設備。其中，所有的控制旋鈕都 是以壓花式製作。所謂壓花式就是指在原本平滑的旋鈕上交叉切割 出螺紋，以增加旋鈕與手指間的摩擦力，避免手汗等因素造成旋轉 不易β 2·本發明設備是一種線上（inline)設備，也就是晶圓在測試運作 的當場就利用本設備對壞的晶片做記號，且可直接看到晶片的位置， 以找到其中心點，不需要操作人員另外學習軟體以計算中心點之誤 差。 3·本發明是在測試線上直接進行記號製作的，因此不會像習知 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱) 一 "-- (請先閱讀背面之注意事項再填寫本頁) —裝 —訂--- Φ 523851 A7 _____ B7___ 五、發明說明（） 那樣對機台造成嚴重污染，難以清除。 4·此外，上述位在線上的壓克力板缺口，可使操作人員即時知 道供晶片之記號是否有打偏，不會像習知那樣要到打第五至六排以 後才會知道位置打偏。 5.應用本發明係在線上記號位置進行記號操作（也就是在線上邊 測邊打記號），可提高效率。 本發明以較佳實施例說明如上，僅用於藉以幫助了解本發明之 實施，非用以限定本發明之精神，熟悉此領域技藝者於領悟本發明 之精神後，在不脫離本發明之精神範圍内，當可作些許更動潤飾及 等同之變化替換，其專利保護範圍當視後附之申請專利範圍及其等 同領域而定。 (請先閱讀背面之注意事項再填寫本頁) ▼------I---^ ·111111 ' 經濟部智慧財產局員工消費合作社印製 Λ 97 12 X 10 2 /V 格 規 4 A 5) N (C 準 標 家 國 國 中 用 適 度 尺 張 紙 本 10V. Description of the invention (〇 As shown in Figure 5, the ink marks produced by the traditional equipment are likely to cause serious pollution to machine 506, which is difficult to remove. If you want to remove these marks: Remove the baking paint of the table together, which is not ideal. Refer to Figure 2 for its three-dimensional schematic diagram of a conventional inkjet device. This traditional device uses a tube-type ink container (the entire tube is pulled out after use), which can overcome / defective Question 'But it still cannot overcome the inconvenience caused when testing combined wafers. This is because the traditional equipment using a tube ink container needs to move multiple screws during the above-mentioned center point offset adjustment, including the need to use a single word The screwdriver adjusts two screws for the forward and backward directions; using a cross screwdriver to adjust one screw for the upward and downward directions, and the use of an allen wrench to adjust other directions, so it seems quite troublesome. (Please read the precautions on the back before filling out this Page) •• Print the invention purpose and brief description of the employees ’cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs: One of the purposes of this invention is to solve the problem of ink Use the problem to save the cost of materials. Another object of the present invention is to solve the problem of ink pollution to the machine. Another object of the present invention is to adjust the position of the ink on the wafer in real time. The purpose is to reduce the tools required for adjusting the ink. Another object of the present invention is to solve the central point encountered in testing the combined wafer. 4 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 × 297). Love) ί nn nn nnn meeting 523851 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Offset adjustment issues ^ In order to achieve the above or other objectives, the present invention provides an inkjet mold on a test line The group is designed for the wafers that need to use ink to make 3 # wafers. This kind of online inkjet mechanical components include silver wires' for ink to be marked on the wafers that need to be marked; cassette ink cartridges to provide ink; The electric spring is used to move the silver wire up and down to achieve the purpose of marking. The first mechanism can be used to set up the electric spring and the cartridge cartridge. The mechanism is also equipped with up and down control knobs to control the distance between the silver wire and the wafer; the second mechanism is connected to the first mechanism by an embossed elevation angle control screw, of which the elevation angle control screw can be used to adjust the silver wire The elevation angle when hitting the wafer; and the base, the second mechanism is connected through the embossed left and right control knobs and the embossed front and rear control knobs. The embossed left and right control knobs can control the left and right displacement of the silver wire, and the embossing According to the preferred embodiment of the present invention, a transparent acrylic plate can be provided on the test line, which has a gap for the operator to immediately know the chip Whether the mark is misaligned, the position misalignment will not be known until after hitting the fifth to sixth rows, as is customary. In addition, the invention can adjust the ink position without using tools. In addition, embossing is used The control knob is conducive to increasing the friction between the knob and the fingers and avoiding the difficulty of rotation caused by factors such as hand sweat. Moreover, since the present invention directly makes the marks on the test line, it will not cause serious pollution to the machine as is conventional, and it is difficult to remove. 5 This paper size applies to China National Standard (CNS) A4 (210 X 297 g) (Please read the precautions on the back before filling in this page) ---- Order -------- 523851 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Brief description of the diagram: Figure 1 shows a three-dimensional schematic diagram of a traditional inkjet device; Figure 2 shows another conventional inkjet device 3D schematic diagram; FIG. 3 illustrates a 3D schematic diagram of an inkjet module on a test line according to a preferred embodiment of the present invention; FIG. 4 illustrates an inline inking position according to a preferred embodiment of the present invention 3) A schematic diagram of the acrylic board on the top; Figure 5 shows the traditional marking equipment is located in the offline inking position of the test machine; and Figure 6 shows the two models A schematic diagram of a wafer composed of wafers. Description of graphical symbols: 302: silver wire 304: cassette ink cartridge 306: electric spring 308: first machine part 310: second machine part 6 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ) ----------- Installation -------- Order ------ it (Please read the precautions on the back before filling this page) 523851 A7 B7 V. Description of the invention ( ) 312: Base 314: Left and right control knobs 316: Front and rear control knobs 318: Up and down control knobs 320: Elevation control knobs 400: Inline inking position 402: Acrylic plate 404: Notch 500: Out of line marker position (Offline inking position) 504: Wafer 506: Pollution 610: First type of center point 612, 614: First type of wafer 620: Second type of center point 622, 624: Second type of wafer Invention details: Please refer to FIG. 3 is a schematic perspective view of an inkjet module on a test line according to a preferred embodiment of the present invention. The present invention is designed for a wafer that needs to be marked with ink, and this wafer may be a combined wafer as described above. Please continue to refer to FIG. 3 'The inkjet module of the present invention may include a silver wire 302 for ink to be marked on a chip to be marked. In addition, the present invention also includes a cartridge ink Kun 7 paper size applicable to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) " --------- (Please read the precautions on the back before (Fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 523851 A7 B7 V. Description of Invention () 304, can provide the required ink. The so-called cassette ink cartridge 304 is to discard the ink when it is finished, and it does not need to be added. Such a design will be better than traditional equipment in terms of ink control. Moreover, the present invention also includes an electric spring 306 for moving the silver wire 302 up and down to achieve the purpose of marking. The operation mode of this electric spring 306 can be that when the power is supplied, the spring 306 will press down to make the silver wire 302 contact the chip; and when the power is not supplied, the spring 306 will loosen, making the silver Line 302 leaves the wafer. Please continue to refer to FIG. 3. The present invention may further include a first mechanism 3 08 for setting up the above-mentioned electric spring 306 and the cassette ink cartridge 3. The first mechanism 3 08 is further equipped with up and down control. The rotation surface 318 is used to control the distance between the silver wire 302 and the wafer. In addition, the present invention also includes a second mechanism 310, which can be connected to the above-mentioned first mechanism 308 by an embossed elevation angle control screw 32 °, wherein the elevation angle control screw 32 ° can be used to adjust the silver wire 30 to hit the chip The elevation angle of the hour. Generally speaking, we hope that the marks are printed in a manner perpendicular to the wafer, so that not only the ink in the ink cartridge 304 can be fully used and the residues can be reduced, but the marks produced by the ink cartridge 304 are also round. Usually this kind of elevation control knob 32 does not need to be adjusted once it is adjusted once. Moreover, the present invention further has a base 312, which can be connected to the second mechanism 310 through an embossed left and right control knob 314 and an embossed front and rear control knob 316, wherein the embossed left and right control knob 314 can control the silver wire 302 or so The embossed front and rear control knob 316 can control the amount of movement of the silver wire 302 back and forth. The above left and right control knobs 314 and front and rear control knobs 316 are the most commonly used knobs. This paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling this page). -------- Order ------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 523851 κ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy _ —_______ V. Description of Invention () Button 'Where the left and right control rotation la 314 can be rotated about 30 degrees (0 to 30 °). As for the front and rear control knob 316, the amount of back and forth displacement (the base is not moved, and the second part moves back and forth) can reach about 4000 mil (~ 10 cm; 1 冚 ㈤ = 40 mil). Since the length or width of a wafer is about 200-300 mil, a displacement of 4000 mil is quite sufficient for the wafer center point offset adjustment. Please refer to FIG. 4. The present invention can also design a transparent anti-static acrylic plate 402 ′ on the test line and set it between the first machine part 308 and the wafer to be tested, so as to avoid static electricity generated by the wafer during operation. destroyed. In addition, a cutout 404 may be provided on the acrylic plate 402 for the silver wire 302 to mark the wafer. The invention can have the following advantages: 1. The invention is a tool-free device. Among them, all the control knobs are made by embossing. The so-called embossing method refers to cutting the threads on the originally smooth knob to increase the friction between the knob and the fingers, and to prevent rotation caused by hand sweat and other factors. Β 2 · The device of the present invention is an inline device, also That is, the wafer uses the equipment to mark the bad wafer on the spot of the test operation, and can directly see the position of the wafer to find its center point. The operator does not need to learn additional software to calculate the center point error. 3. The present invention makes the mark directly on the test line, so it is not like the conventional 9 paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love)-"(Please read the back first Please pay attention to this page before filling in this page) — Binding — Binding --- Φ 523851 A7 _____ B7___ V. Description of the invention () That will cause serious pollution to the machine and it will be difficult to remove. 4. In addition, the above-mentioned acrylic plate gap on the line allows the operator to know immediately whether the mark for the wafer is misaligned, and will not know the position until after the fifth to sixth rows, as is customary. Partial. 5. The application of the present invention is to perform the marking operation on the marking position on the line (that is, to mark while measuring on the line), which can improve the efficiency. The present invention is described above with the preferred embodiments, and is only used to help understand the implementation of the present invention. It is not intended to limit the spirit of the present invention. Those skilled in this field will not depart from the spirit of the present invention after understanding the spirit of the present invention. Within the scope, when it is possible to make some minor modifications and equivalent changes, the scope of patent protection shall depend on the scope of the attached patent application and its equivalent fields. (Please read the precautions on the back before filling this page) ▼ ------ I --- ^ · 111111 '' Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ 97 12 X 10 2 / V Grid Regulation 4 A 5) N (C quasi-standards)