523821 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（1 ) 發明背景 發明領域 本發明有關使用超音波之淸潔設備，尤係可有效淸潔 輸送半導體之輸送帶之淸潔設備，結合此淸潔設備之 c v D設備，及利用c V D設備進行淸潔程序之半導體裝 置之製造方法。 相關技術說明 就製造半導體裝置之程序，尤係使用如c V D設備之 半導體製造設備之薄膜形成程序，必須使用輸送帶輸送晶 圓朝向CVD設備之薄膜形成區，製造時晶圓上有半導體 裝置。 輸送晶圓時，異物可能附於輸送帶上，進而傳到晶圓 上，故須有措施有效除去此異物。 日本公開專利申請案1 〇 — 2 8 4 5 7 1號此技術有 關一半導體製造設備，在一循環輸送帶上輸送半導體晶圓 製預定處理區，其中超音波機構及磁性機構位於輸送帶循 環徑之中間。超音波機構利用超音波作用在液體中除去輸 送帶上之異物，磁性機構藉磁力收集懸浮在液體中或漂浮 在液體表面上之解脫異物。 上述技術雖可有效除去磁性金屬異物，但不能除去其 他異物。理由之一爲即使以磁性機構除去液體中懸浮或液 體表面漂浮之其他異物，仍會附著於輸送帶上。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -4- • l·----------裝-------^訂---------線. (請先閱讀背面之注意事項再填寫本頁) 523821 A7 B7 _ 五、發明說明（2 ) (請先閱讀背面之注意事項再填寫本頁) 若半導體製造設備欲形成薄膜於晶圓上，在過程中亦 以副產品沈積於輸送帶之薄膜可能成爲其他種異物，一般 係以超音波淸潔設備用水將此副產品洗淨。 但此超音波淸潔設備因爲固定之淸潔粉末、較低淸潔 技能及淸潔液循環不良，致沈積膜再黏附。即習知超音波 淸潔設備中，晶圓係載於其上具未淸除沈積膜之輸送帶上 ，故根據沈積膜之異物輕易附著於晶圓。當輸送帶上沈積 之薄膜增加或輸送帶使用過久，因淸潔液循環不良，有時 易生腐蝕，因此所製造之半導體產品可靠度不佳。 發明槪述 本發明第一目的提供一淸潔設備，其中將超音波振盪 機構與淸潔液供應機構組合，自動對應淸潔結果而控制。 本發明之淸潔設備可有效除去輸送帶或其他欲淸潔構件上 附著之異物，解決除去後再附著之問題，提高半導體產品 品質。 本發明第二目的提供具淸潔設備之C V D設備。 經濟部智慧財產局員工消費合作社印制衣 本發明第三目的提供以此淸潔技術製造半導體裝置之 方法。 就第一目的，本發明之淸潔設備包含一容器體，其內 可製淸潔液及欲淸潔之構件；一超音波振盪機構對容器體 所裝欲淸潔之構件振動；供應機構可供應淸潔液至容器體 ;排出機構可排出容器體中之淸潔液，污物偵測機構可偵 測輸送帶之污物程度；及控制機構可控制淸潔液之供應量 -5- 本紙張尺度適用中國國家標準（CNS〉A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 523821 A7 _____B7 五、發明說明（3 ) ’並根據污物偵測機構所得偵測結果控制供應機構之淸潔 液供應量。 如此結構以污物偵測機構偵測淸潔液污物度及控制機 構’可自動控制超音波振盪機構及淸潔液供應機構適合淸 潔結果。故可根據容器體淸潔液污物度，決定最佳淸潔條 件’如超音波振盪機構之振盪及淸潔液供應量。如此可有 效除去輸送帶或其他構件附著之異物，解決除去後再附著 問題，提局半導體產品品質。 結構例中，超音波振盪機構具許多振盪單元，故控制 機構一次可控制振邊單元數。 其中，多數振盪單元可排列於欲淸潔構件整個幅度， 以有效淸潔。利用調整振盪單元數或功率，完成淸潔效率 之提高。 一尤佳例中，設定淸潔液之排出機構當容器體之高液' 超過一定水準時排出淸潔液。 如此成功防止淸潔液浪費，大幅省下成本。 另一佳例中，欲淸潔之構件爲具循環徑之輸送帶，輸 送帶之路徑通過容器體中淸潔液。 如此允許輸送帶於循環徑通過淸潔液，可於淸潔設備 操作時穩定淸潔，大幅提高淸潔設備管理效率。 另一例中，輸送帶可輸送半導體製造設備中之半導體 晶圓。 如此可有效淸潔輸送帶整個表面，並可精確除去經輸 送帶附於半導體晶圓之異物。 -----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -6 - 523821 A7 B7 五、發明說明（4 ) (請先閱讀背面之注意事項再填寫本頁) 就第二目的，本發明之CVD設備包含一輸送帶，一 薄膜形成區，第一輸送帶淸潔區及第二輸送帶淸潔區；第 二輸送帶淸潔區另包含一容器體’其內可裝淸潔液及欲淸 潔構件；超音波振盪機構可振動容器體所裝欲淸潔構件； 供應機構可供應淸潔液至容器體；排出機構可排出容器體 中淸潔液，污物偵測機構可偵測淸潔液污物度；及控制機 構可控制超音波振盪機構之振盪單元數，並根據污物偵測 機構之偵測結果控制供應機構之淸潔液供應量。 如此以污物偵測機構偵測淸潔液污物度及控制機構， 可自動控制超音波振盪機構並配合淸潔結果控制第二淸潔 區之淸潔液供應機構。亦可根據容器體之淸潔液污物度， 決定最佳淸潔條件，如超音波振盪機構之振盪單元數及淸 潔液供應量。故可有效除去輸送帶附著異物，解決除去後 再附著問題，提商半導體成品品質。 較佳例中，超音波振盪機構具多數振盪單元，故控制 機構可控制一次操作之振盪單元數。 經濟部智慧財產局員工消費合作社印製 其中，多數振盪單元可排列於欲淸潔構件整個幅度， 以有效淸潔。利用調整振盪單元數或功率，完成淸潔效率 之提高。 一尤佳例中，設定淸潔液之排出機構當容器體之高液 超過一定水準時排出淸潔液。 如此成功防止淸潔液浪費，大幅省下成本。 另一佳例中，欲淸潔之構件爲具循環徑之輸送帶，輸 送帶之路徑通過容器體中淸潔液。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） :7 - ^-- 經濟部智慧財產局員工消費合作社印製 523821 A7 B7_ 五、發明說明（5 ) 如此允許輸送帶於循環徑通過淸潔液，可於淸潔設備 操作時穩定淸潔，大幅提高淸潔設備管理效率。 另一例中，輸送帶可輸送半導體製造設備中之半導體 晶圓。 如此可有效淸潔輸送帶整個表面，並可精確除去經輸 送帶附於半導體晶圓之異物。 結構另一例中，C V D設備爲大氣壓力C V D設備。 如此允許精巧之C V D設備，因設備可置於大氣環境 ，不需特別措施。 就本發明第三目的，製造半導體裝置之方法包含：一 步驟形成薄膜於輸送帶之半導體裝置上；一步驟將輸送帶 裝於容器體中；一步驟提供超音波振盪至容器體中所裝之 輸送帶；一步驟提供淸潔液至容器體一步驟排出容器體之 淸潔液；一步驟偵測淸潔液之污物度；及一步驟控制超音 波振盪機構之振盪單元數，並根據污物度控制淸潔液供應 量。 如此以步驟偵測淸潔液污物度可自動控制振供輸送帶 振動之步驟及配合淸潔液污物度供應淸潔液之步驟。亦可 根據容器體中淸潔液污物度，決定最佳淸潔條件，如超音 波振盪機構之振盪單元數及淸潔液供應量。如此可有效除 去輸送帶上附著異物，解決除去後再附著問題，乃提高半 導體成品品質。 一例之輸送帶振盪可由多數振盪單元執行’調整一次 操作之振盪單元數，而完成其控制。 j---------丨-裝·-------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -8 - 經濟部智慧財產局員工消費合作社印製 523821 A7 B7 五、發明說明（6 ) 其中，多數振盪單元可排列於欲淸潔構件整個幅度， 以有效淸潔，利用調整振盪單元數或功率，完成淸潔效率 之提高。 一尤佳例中，設定淸潔液之排出步驟當容器體之高液 超過一定水準時排出淸潔液。 如此成功防止淸潔液浪費，大幅省下成本。 另一佳例中，欲淸潔之構件爲具循環徑之輸送帶，輸 送帶之路徑通過容器體中淸潔液。 如此允許輸送帶於循環徑通過淸潔液，可於淸潔設備 操作時穩定淸潔，大幅提高淸潔設備管理效率。 圖式簡要說明 圖1爲本發明一例結合淸潔設備之半導體製造設備示 意圖； ’ 圖2爲本發明一例結合淸潔設備之半導體製造設備側 視圖， 圖3爲本發明一例之淸潔設備側視圖；及 圖4爲本發明一例之淸潔設備控制系統流程圖。 元件對照表 1 輸送帶 2 半導體晶圓 3 滑輪 4 滑輪 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -9 - ί 裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 523821 A7 _B7 五、發明說明（7 ) 經濟部智慧財產局員工消費合作社印製 5 箭頭 6 氣體噴頭 7 薄膜形成區 1 9 加熱器塊 1 〇 氫氟酸控制單元 1 1 容器體 1 2 氫氟酸供應設備 1 3 調節器 1 4 閥 1 5 槽 1 6 調節閥 1 7 加熱器 2 〇 淸潔設備 2 1 容器體 2 2 超音波振盪單元 2 3 供應機構 2 4 供應機構 2 5 排出機構 2 6 污物感應器 2 7 控制器 3 〇 滾子 2 3 1 電磁閥 2 3 4 電磁閥 ---------—裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） _ 1〇 _ 523821 Α7 Β7 五、發明說明（8 ) 較佳實施例說明 參考附圖說明本發明較佳實施例。 圖1平面圖顯示一大氣壓力CVD設備，圖2爲設備 之側視圖。圖3側視圖顯示本發明淸潔設備構造，圖4爲 設備控制系統之流程。 參考圖1，CVD設備具輸送帶1可輸送半導體晶圓 2 ’輸送帶形成迴路之循環徑，以滑輪3，4輔助於箭頭 方向進行。設備有氣體噴頭6，可噴出氣體形成薄膜於半 導體晶圓2上。排列多數氣體噴頭6構成薄膜形成區7， 並備有加熱區1 9。 薄膜形成區7中形成薄膜於輸送帶1之個別半導體晶 圓2。除目的薄膜形成在半導體晶圓2上，相關薄膜亦形 成在輸送帶上，成爲異物。爲將其除去，放置HF (氫氟 酸）控制單元（氫氟酸淸潔設備）1 0。 ‘ HF控制單元10包含盒形容器體11包圍行走輸送 帶1之中間；一 H F供應設備1 2可供應氣化H F與N 2氣 體至容器體；二者一起構成氣泡系統。H F供應設備1 2 可引入Ν 2經過調節器1 3至閥1 4至一槽1 5而令H F生 氣泡，並供應氣化H F至容器體1 1。控制單元1 0有一 調節閥1 6在H F供應管線上。 以H F控制單元1 0預先淸潔之輸送帶1被加熱器 1 7加熱，除去殘餘H F，再以本發明淸潔設備2 0完全 淸潔。 圖3顯示淸潔設備2 0 一例。淸潔設備2 0包含一容 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公爱） (請先閱讀背面之注意事項再填寫本頁) I,裝--------訂---------線"^一^" 經濟部智慧財產局員工消費合作社印製 523821 A7 B7___ 五、發明說明（9 ) (請先閱讀背面之注意事項再填寫本頁) 器體2 1，其內可裝淸潔液及輸送帶1 ; 一超音波振盪單 元2 2可提供振動於容器體2 1所裝輸送帶1 ;供應機構 2 3，2 4可供應淸潔液S至容器體2 1 ;排出機構2 5 可排出容器體2 1之淸潔液S ;污物感應器2 6可偵測淸 潔液S污物度；及一控制器2 7可根據污物感應器所得偵 測結果，控制超音波振盪單元2 2數及供應機構2 3， 2 4之淸潔液S供應量。 容器體2 1有一開口頂板，並以純水裝於內作爲淸潔 液超音波振盪單元2 2有多數個，控制器2 7可控制一次 操作超音波振盪單元2 2數。如此，多數超音波振盪單元 2 2排列在淸潔液S中輸送帶1整個幅度，可有效淸潔。 如此亦便利調整超音波振盪單元2 2數或功率。 可排出淸潔液S之排出機構2 5包含一排流管，當淸 潔液S達一定量（高度）時可排出淸潔液S，防止淸潔液 S浪費。 經濟部智慧財產局員工消費合作社印製 沿一循環徑走行之輸送帶1通過容器體2 1中淸潔液 S。在容器體2 1中，輸送帶1徑過並沈入淸潔液S，係 用一靜載重滾子3 0。如此允許輸送帶1於循環徑上經過 淸潔液S，在設備運轉時可穩定淸潔’明顯提高設備管理 效率。 就個別供應淸潔液S之供應機構2 3 ’ 2 4包含饋送 管，供應機構2 3接至容器體2 1上部而供應機構2 4至 下部。如此可促進淸潔液S在容器體2 1中攪拌，有利直 接經排放管排出淸潔液S表面漂浮之異物。供應機構2 3 -12 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 523821 A7 __ B7 五、發明說明（1〇) ’ 2 4分別聯接電磁閥2 3 1，2 4 1 ;以控制器2 7控 制其開口之開閉。 污物感應器2 6包含一光感應器，可轉換淸潔液污物 度爲電訊號輸出，係利用對應污物度之透光強度偵測。 如圖4，控制器可送開閉訊號或開口控制訊號至電磁 閥2 3 1，2 4 1根據污物感應器之偵測結果以控制水量 ，並一致送出訊號至超音波振盪單元，以控制振盪數及其 輸出。控制器2 7具有控制程式，在淸潔輸送帶1時達到 最佳條件。可由實驗輕易收集完成控制程式所需資料。 本發明實施例成功處爲： (1 )根據容器體2 1內污物度取得最佳淸潔條件， 如輸送帶之振盪數及水量，以免薄膜附著及損及容器體 2 1，有利設備維修； (2 )抑制水浪費，節省運轉成本； > (3 )正確調整振盪數以控制污物度或待命模式； (4 )有效淸潔輸送帶1整個幅度； (5 )即使操作設備時可穩定淸潔，明顯提高設備管 理效率；及 (6 )系統結構精巧。 以上例有關運送半導體晶圓之輸送帶淸潔用之淸潔設 備，但本發明可應用於任何其他半導體製造設備或須淸潔 輸送帶之類似設備。本發明亦可應用至半導體晶圓以外之 輸送，如製造L CD，有機E L顯示器等所用石英或玻璃 之絕緣晶圓。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13- -------------------^------------- (請先閱讀背面之注意事項再填寫本頁) 523821 A7 B7 五、發明說明（11) 由上可見，本發明提供之淸潔設備中組合輸送帶振盪 機構及淸潔液供應機構，可對應淸潔結果自動控制，有效 除去輸送帶或其他構件上附著之異物，解決除去後再附著 問題，提高半導體成品之品質。 -LT-----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） -U-523821 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the Invention (1) Background of the Invention Field of the Invention The present invention relates to cleaning equipment that uses ultrasonic waves, especially cleaning equipment that can effectively clean semiconductor conveyors , A method for manufacturing a cv D device combining this cleaning device and a semiconductor device using the c VD device to perform a cleaning process. Relevant technical description Regarding the procedure for manufacturing semiconductor devices, especially the thin film forming procedures for semiconductor manufacturing equipment such as cVD equipment, a conveyor belt must be used to transport the wafers towards the thin film formation area of the CVD equipment. There are semiconductor devices on the wafer during manufacturing. When transferring wafers, foreign matter may be attached to the conveyor belt and then transferred to the wafer. Therefore, measures must be taken to effectively remove this foreign matter. Japanese published patent application No. 1—2—8 4 5 7 1 This technology relates to a semiconductor manufacturing equipment that transports a semiconductor wafer to a predetermined processing area on a circular conveyor belt, in which the ultrasonic mechanism and the magnetic mechanism are located on the conveyor belt circulation path. In the middle. The ultrasonic mechanism uses ultrasonic waves to remove foreign objects on the conveyor belt in the liquid, and the magnetic mechanism collects the foreign objects suspended in the liquid or floats on the surface of the liquid by magnetic force. Although the above technique can effectively remove magnetic metal foreign materials, it cannot remove other foreign materials. One reason is that even if other foreign matter suspended in the liquid or floating on the surface of the liquid is removed by the magnetic mechanism, it still adheres to the conveyor belt. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -4- • l · ---------- install ------- ^ order ----- ---- Line. (Please read the precautions on the back before filling this page) 523821 A7 B7 _ V. Description of the invention (2) (Please read the precautions on the back before filling this page) If the semiconductor manufacturing equipment wants to form a thin film On the wafer, the film that is also deposited as a by-product on the conveyor belt during the process may become other kinds of foreign matter. Generally, the by-product is washed with water using an ultrasonic cleaning equipment. However, due to the fixed cleaning powder, low cleaning skills and poor circulation of cleaning liquid, the ultrasonic cleaning equipment caused the deposited film to adhere again. That is, in the conventional ultrasonic cleaning equipment, the wafer is loaded on a conveyor belt on which the deposited film has not been removed, so foreign matter on the deposited film easily attaches to the wafer. When the film deposited on the conveyor belt is increased or the conveyor belt is used for a long time, due to poor circulation of the cleaning solution, it is sometimes prone to corrosion, so the reliability of the manufactured semiconductor products is not good. SUMMARY OF THE INVENTION A first object of the present invention is to provide a cleaning device in which an ultrasonic oscillation mechanism and a cleaning liquid supply mechanism are combined to automatically control the cleaning results in response to the cleaning results. The cleaning equipment of the present invention can effectively remove the foreign matter attached to the conveyor belt or other cleaning components, solve the problem of adhesion after removal, and improve the quality of semiconductor products. A second object of the present invention is to provide a C V D device with a cleaning device. The third object of the present invention is to provide a method for manufacturing a semiconductor device using this clean technology. With regard to the first object, the cleaning equipment of the present invention includes a container body in which cleaning liquid and components to be cleaned can be prepared; an ultrasonic vibration mechanism vibrates the components to be cleaned in the container body; and the supply mechanism can Supply cleaning solution to the container body; the discharge mechanism can discharge the cleaning solution in the container body, the dirt detection mechanism can detect the degree of dirt on the conveyor belt; and the control mechanism can control the supply of cleaning solution Paper size applies Chinese national standard (CNS> A4 specification (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 523821 A7 _____B7 V. Description of the invention (3) 'and according to the detection results obtained by the dirt detection agency Control the supply amount of cleaning liquid by the supply mechanism. With such a structure, the dirt detection mechanism detects the cleaning liquid's pollution degree and the control mechanism can automatically control the ultrasonic oscillation mechanism and the cleaning liquid supply mechanism to suit the cleaning result. According to the degree of contamination of the cleaning liquid in the container body, determine the best cleaning conditions, such as the vibration of the ultrasonic oscillation mechanism and the supply of cleaning liquid. This can effectively remove the foreign matter attached to the conveyor belt or other components and solve the problem. Then attach the problem to improve the quality of the semiconductor product. In the structural example, the ultrasonic oscillation mechanism has many oscillation units, so the control mechanism can control the number of edge oscillation units at a time. Among them, most of the oscillation units can be arranged in the entire width of the component to be cleaned. Effective cleaning can be achieved. By adjusting the number of oscillation units or power, the cleaning efficiency can be improved. In a particularly good example, the cleaning liquid discharge mechanism is set to discharge the cleaning liquid when the high liquid in the container exceeds a certain level. Successfully prevent the waste of cleaning fluid, greatly saving costs. In another good example, the component to be cleaned is a conveyor belt with a circulation path, and the path of the conveyor belt passes through the cleaning fluid in the container body. This allows the conveyor belt to be on the circulation path. The cleaning liquid can stabilize the cleaning during the operation of the cleaning equipment and greatly improve the management efficiency of the cleaning equipment. In another example, the conveyor belt can transport the semiconductor wafers in the semiconductor manufacturing equipment. This can effectively clean the entire surface of the conveyor belt. , And can accurately remove the foreign matter attached to the semiconductor wafer through the conveyor. ----------- installation -------- order --------- line (please first Read the note on the back Please fill in this page again) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) -6-523821 A7 B7 V. Description of invention (4) (Please read the notes on the back before filling this page For the second purpose, the CVD apparatus of the present invention includes a conveyor belt, a thin film forming area, a first conveyor belt cleaning area and a second conveyor belt cleaning area; the second conveyor belt cleaning area further includes a container body ' The cleaning liquid and cleaning components can be installed therein; the ultrasonic vibration mechanism can vibrate the cleaning components installed in the container body; the supply mechanism can supply cleaning liquid to the container body; and the discharging mechanism can discharge the cleaning liquid in the container body, The dirt detection mechanism can detect the dirt degree of the cleaning liquid; and the control mechanism can control the number of oscillation units of the ultrasonic oscillation mechanism, and control the supply amount of the cleaning liquid by the supply mechanism according to the detection result of the dirt detection mechanism. In this way, the dirt detection mechanism and the control mechanism of the cleaning liquid can automatically control the ultrasonic oscillation mechanism and cooperate with the cleaning result to control the cleaning liquid supply mechanism of the second cleaning area. It is also possible to determine the optimal cleaning conditions based on the contamination level of the cleaning liquid in the container body, such as the number of oscillation units of the ultrasonic oscillation mechanism and the supply of cleaning liquid. Therefore, it is possible to effectively remove the foreign matter attached to the conveyor belt, solve the problem of adhesion after removal, and improve the quality of semiconductor finished products. In a preferred example, the ultrasonic oscillation mechanism has a plurality of oscillation units, so the control mechanism can control the number of oscillation units for one operation. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Among them, most of the oscillating units can be arranged in the entire width of the cleaning unit for effective cleaning. By adjusting the number or power of oscillation units, the cleaning efficiency is improved. In a particularly preferable example, the cleaning liquid discharge mechanism is set to discharge the cleaning liquid when the high liquid in the container body exceeds a certain level. This has successfully prevented the waste of cleaning solution, which has greatly saved costs. In another good example, the component to be cleaned is a conveyor belt with a circulation path, and the path of the conveyor belt passes through the cleaning liquid in the container body. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm): 7-^-printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 523821 A7 B7_ V. Description of the invention (5) This allows the conveyor belt to The circulation path passes through the cleaning liquid, which can stabilize the cleaning during the operation of the cleaning equipment, and greatly improve the management efficiency of the cleaning equipment. In another example, a conveyor belt can transport semiconductor wafers in a semiconductor manufacturing facility. This can effectively clean the entire surface of the conveyor belt and accurately remove foreign objects attached to the semiconductor wafer through the conveyor belt. In another example of the structure, the C V D device is an atmospheric pressure C V D device. This allows the delicate C V D equipment, because the equipment can be placed in the atmospheric environment, no special measures are required. According to a third object of the present invention, a method for manufacturing a semiconductor device includes: a step of forming a thin film on a semiconductor device of a conveyor belt; a step of installing the conveyor belt in a container body; and a step of providing ultrasonic vibration to the container body. Conveyor belt; one step provides cleaning solution to the container body; one step discharges the cleaning solution from the container body; one step detects the degree of soiling of the cleaning solution; and one step controls the number of oscillation units of the ultrasonic oscillation mechanism, and Physical control of the supply of cleaning solution. In this way, the step of detecting the contamination level of the cleaning liquid can automatically control the vibration of the supply conveyor belt and the step of supplying the cleaning liquid in accordance with the cleaning liquid contamination level. It is also possible to determine the optimal cleaning conditions based on the contamination level of the cleaning liquid in the container body, such as the number of oscillation units of the ultrasonic oscillation mechanism and the supply of cleaning liquid. This can effectively remove foreign matter on the conveyor belt, solve the problem of adhesion after removal, and improve the quality of the finished semiconductor product. One example of the conveyor belt oscillation can be performed by a plurality of oscillation units to adjust the number of oscillation units in one operation to complete its control. j --------- 丨 -Packing ------- Order --------- Line (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 Specification (210 X 297 mm) -8-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 523821 A7 B7 V. Description of the Invention (6) Among them, most of the oscillation units can be arranged in the entire structure to be cleaned The amplitude is used for effective cleaning, and the number of oscillation units or power is adjusted to improve the cleaning efficiency. In a particularly preferred embodiment, the cleaning liquid discharging step is set to discharge the cleaning liquid when the high liquid in the container body exceeds a certain level. This has successfully prevented the waste of cleaning solution, which has greatly saved costs. In another good example, the component to be cleaned is a conveyor belt with a circulation path, and the path of the conveyor belt passes through the cleaning liquid in the container body. This allows the conveyor belt to pass through the cleaning liquid in the circulation path, which can stabilize the cleaning during the operation of the cleaning equipment and greatly improve the management efficiency of the cleaning equipment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an example of a semiconductor manufacturing device incorporating a cleaning device according to the present invention; FIG. 2 is a side view of an example of a semiconductor manufacturing device incorporating a cleaning device according to the present invention; And FIG. 4 is a flow chart of an example of a cleaning equipment control system of the present invention. Component comparison table 1 Conveyor belt 2 Semiconductor wafer 3 Pulley 4 Pulley This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) -9-ί -------- Order --- ------ line (please read the notes on the back before filling this page) 523821 A7 _B7 V. Description of Invention (7) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5 Arrow 6 Gas nozzle 7 Thin film forming area 1 9 Heater block 1 〇 Hydrofluoric acid control unit 1 1 Container body 1 2 Hydrofluoric acid supply equipment 1 3 Regulator 1 4 Valve 1 5 Tank 1 6 Control valve 1 7 Heater 2 〇 Clean equipment 2 1 Container body 2 2 Ultrasonic oscillating unit 2 3 Supply mechanism 2 4 Supply mechanism 2 5 Ejection mechanism 2 6 Dirt sensor 2 7 Controller 3 〇 Roller 2 3 1 Solenoid valve 2 3 4 Solenoid valve --------- —Packing -------- Order --------- line (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210 x 297 (Mm) _ 1〇_ 523821 A7 B7 V. Description of the invention (8) Description of the preferred embodiment The preferred embodiment of the present invention will be described with reference to the drawingsFig. 1 is a plan view showing an atmospheric pressure CVD apparatus, and Fig. 2 is a side view of the apparatus. Fig. 3 is a side view showing the structure of the cleaning equipment of the present invention, and Fig. 4 is a flow chart of the equipment control system. Referring to FIG. 1, the CVD equipment conveyor belt 1 can transport semiconductor wafers 2 ', and the circulation path of the conveyor belt forming circuit is performed with pulleys 3, 4 assisted in the direction of the arrow. The equipment has a gas spray head 6 which can spray gas to form a thin film on the semiconductor wafer 2. A plurality of gas shower heads 6 are arranged to form a thin film formation region 7 and a heating region 19 is provided. In the film formation region 7, individual semiconductor wafers 2 each having a thin film formed on a conveyor belt 1 are formed. The target film is formed on the semiconductor wafer 2, and the relevant film is also formed on the conveyor belt, which becomes a foreign object. To remove it, place an HF (hydrofluoric acid) control unit (hydrofluoric acid cleaning equipment) 10. ‘The HF control unit 10 includes a box-shaped container body 11 surrounding the middle of the walking conveyor belt 1; an H F supply device 12 can supply gasified H F and N 2 gases to the container body; both together constitute a bubble system. The H F supply device 12 can introduce N 2 through the regulator 13 to the valve 14 to a tank 15 to cause H F to bubble and supply gasified H F to the container body 11. The control unit 10 has a regulating valve 16 on the H F supply line. The conveyor belt 1 cleaned in advance by the H F control unit 10 is heated by a heater 17 to remove residual H F, and then cleaned completely by the cleaning device 20 of the present invention. Fig. 3 shows an example of the 淸 cleaning equipment 2 0.淸 Cleaning equipment 2 0 contains a paper size applicable to the Chinese National Standard (CNS) A4 specifications (210 χ 297 public love) (Please read the precautions on the back before filling this page) I, installed ------- -Order --------- line " ^ 一 ^ " Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 523821 A7 B7___ V. Description of Invention (9) (Please read the precautions on the back before filling in this Page) Device body 21, which can be filled with cleaning liquid and conveyor belt 1; an ultrasonic vibration unit 2 2 can provide vibration to the container body 2 1 Conveyor belt 1; supply mechanism 2 3, 2 4 can supply 淸The cleaning liquid S to the container body 2 1; the discharging mechanism 25 can discharge the cleaning liquid S of the container body 2; the dirt sensor 26 can detect the pollution degree of the cleaning liquid S; and a controller 2 7 can The detection result obtained by the dirt sensor controls the number of ultrasonic oscillating units 22 and the supply amount of the cleaning liquid S of the supply mechanisms 2 3 and 24. The container body 21 has an open top plate, and is filled with pure water as a clean liquid ultrasonic oscillating unit 22. The controller 27 can control the ultrasonic oscillating unit 2 2 once. In this way, most of the ultrasonic oscillating units 22 are arranged in the cleaning liquid S over the entire width of the conveyor belt 1 and can be effectively cleaned. It is also convenient to adjust the number or power of the ultrasonic oscillating unit 22. The discharge mechanism 25 capable of discharging the cleaning solution S includes a drain pipe, and when the cleaning solution S reaches a certain amount (height), the cleaning solution S can be discharged to prevent the cleaning solution S from being wasted. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The conveyor belt 1 running along a circulation path passes through the container body 2 and the cleaning liquid S is in it. In the container body 21, the conveyor belt 1 passes through and sinks into the cleaning solution S, and a static load roller 30 is used. In this way, the conveyor belt 1 is allowed to pass the cleaning solution S on the circulation path, and the cleaning can be stabilized when the equipment is running ', which significantly improves the efficiency of equipment management. The supply mechanism 2 3 ′ 2 4 for individually supplying the cleaning solution S includes a feed tube, and the supply mechanism 23 is connected to the upper portion of the container body 21 and the supply mechanism 24 to the lower portion. This can promote the stirring of the cleaning solution S in the container body 21, and it is advantageous to directly discharge the foreign matters floating on the surface of the cleaning solution S through the discharge pipe. Supply organization 2 3 -12-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 523821 A7 __ B7 V. Description of the invention (1〇) '2 4 Connect the solenoid valves 2 3 1, 2 4 1 respectively; the controller 2 7 controls the opening and closing of the openings. The dirt sensor 26 includes a light sensor, which can convert the pollution degree of the cleaning liquid into an electrical signal output, and uses the light transmission intensity detection corresponding to the dirt degree. As shown in Figure 4, the controller can send the open / close signal or the opening control signal to the solenoid valve 2 3 1, 2 4 1 to control the amount of water according to the detection result of the dirt sensor, and send a signal to the ultrasonic oscillation unit to control the oscillation. Number and its output. The controller 2 7 has a control program to achieve the best conditions when cleaning the conveyor belt 1. The data needed to complete the control program can be easily collected by experiments. The embodiments of the present invention succeed in: (1) Obtaining the best cleaning conditions based on the degree of dirt in the container body 21, such as the number of oscillations and the amount of water in the conveyor belt, so as to avoid film attachment and damage to the container body 21, which is beneficial to equipment maintenance ; (2) inhibit water waste and save running costs; > (3) correctly adjust the number of oscillations to control the degree of dirt or standby mode; (4) effectively clean the entire width of the conveyor belt 1; (5) even when operating the equipment It is stable and clean, which obviously improves the efficiency of equipment management; and (6) the system is compact. The above example relates to cleaning equipment for cleaning semiconductor conveyor belts, but the present invention can be applied to any other semiconductor manufacturing equipment or similar equipment that requires cleaning conveyors. The present invention can also be applied to transportation other than semiconductor wafers, such as quartz or glass insulating wafers used in the manufacture of L CDs, organic EL displays, and the like. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -13- ------------------- ^ -------- ----- (Please read the precautions on the back before filling this page) 523821 A7 B7 V. Description of the invention (11) As can be seen from the above, the combined conveyor belt oscillation mechanism and cleaning liquid supply in the cleaning equipment provided by the present invention The mechanism can automatically control the cleaning result, effectively remove the foreign matter attached to the conveyor belt or other components, solve the problem of adhesion after removal, and improve the quality of the semiconductor finished product. -LT ----------- install -------- order --------- line (please read the precautions on the back before filling this page) Ministry of Economy Intellectual Property The paper size printed by the Bureau ’s Consumer Cooperatives applies the Chinese National Standard (CNS) A4 (210 x 297 mm) -U-