TW522668B - Self-aligned integrated photoelectric transceiver - Google Patents

Abstract

The present invention provides an integrated photoelectric component and a self-aligned integrated photoelectric transceiver which is produced by using a flip chip technology and a self-alignment of mechanical manner. The main components of the self-aligned integrated photoelectric transceiver comprise: an L-shaped circuit board, a silicon substrate, a plurality of chips connected to the silicon substrate, a micro-lens array, an optical fiber, and a container housing the above components, in which the above components are assembled into an integral alignment construction. Said plurality of chips can include a laser diode, a laser diode driver, a photo detector, and a signal amplifier. The mechanical alignment method of the micro-lens array and the silicon substrate comprises using a groove formed on the surface of the two, and inserting an isolation ball into the two corresponding grooves to form a gap, thereby forming a self-alignment function.

Description

522668

V. Description of the Invention (1) [Field of the Invention] The present invention relates to an automatic alignment type integrated photoelectric transceiver, and particularly to an integrated optical element and providing automatic "use of flip chip technology"; capable of automatic alignment type integration Optical Transceiver. [Background of the Invention] In recent years, the photoelectric technology applied to computers has developed rapidly, such as communication, optical storage devices (such as optical discs), etc. In addition, ^ technology is also used in many consumer markets Ancient & σ ^ Jiu Dian technical system, computer light tablet machine, and bean #How to store it as a 豕 庭 奴 木 糸 system, multimedia film; material ,; precision =, use the information in the optical disc brain system, two light Shape of 乂 w ϋ Α / "Save general electrical components. "Receiving and receiving" is an important component of the optical communication system. The optical transceiver Tian Guangguang, Lei Kuo, and the measuring radiation diode transmission fiber also include the body's twelve aurora detection for feedback stability. The pressure body will send the light to the other device. The signal sent by the micro-transmissive device will not cause the photoelectric device to shrink with the temperature, and the element G symbol will be emitted from the client system. It will receive the signal and convert the mirror array and output. After passing through, it can be used in the reverse, and the system of light alignment conditions in the system of time and accuracy is configured to reduce the power of the power supply. The light emitted from the surface of an optical mirror is changed by lightning and the electrical transmission and reception are matched. The information of the mini-optical unit is that the Liyinxun system produces two transmissive transducers that can be divided into geometric devices. The conversion receiver is used to reflect and change to the polar wind. The nine-signal light-transmitting one. Light collected and processed; it is also a small amount of light emitted by electronic signals

522668 V. Description of the invention (2) The alignment between the source, the micro lens and the light detector is also very heavy. * The academic signal is completely converted into an electronic signal. Second, the light can be distorted. Avoid the cause during the front line communication [Objective and summary of the invention] The purpose of this description is to provide an automatic alignment type transmitter to improve some shortcomings of the traditional photoelectric transceiver. Another objective of the present invention is to provide two types of automatic paired photoelectric transceivers. The douxiaoren # +-& eye-to-bundle type integration Γ t /, positive α pre-formed components- The holistic ridge-shaped light beam is 1: 3! Another purpose is to provide a kind of automatic alignment type: the second one is the electric receiver, and it is made to be positive using flip chip technology. The detector can be passively aligned. ',', Lens and light Another object of the present invention is to provide a self-storing photoelectric transceiver, which integrates light in a container, and an integrated module is formed into an integrated module. In the circuit, another object of the present invention is to provide an i-optical transceiver, a silicon substrate (si η, quasi-type integrated wire bonding (Wlreb0nd) (full-line soldering)) using a plurality of chips to make its production technology ) To connect the circuit board and the invention, there is an object to provide an automatic power transmission and reception state, in which a plurality of chips use the automatic solder bump% to electrically connect to the silicon substrate. Another object of the invention is to provide a self-aligning type of first-generation transceiver, which uses mechanical devices such as a silicon substrate and a micro-induction-type integrated groove.厶 υ〇δ -—_ _ — V. Description of the invention (3) Capability. The present invention discloses an automatic alignment of a quasi-function. Six :: The first electrical element and the use of flip-chip technology to provide a better embodiment, ―Type B " iE ' In the present invention, the vertical part of the vertical board is composed of a vertical part and a horizontal part with a bottom surface having a plurality of two surfaces—a silicon substrate, and the vertical part of the horizontal part of the circuit board is electrically conductive. Circuit; a Shi Xi substrate, bonded to its chip, which contains a lightning surface, the silicon surface sub-device has a plurality of parallel to the aforementioned silicon-membrane Γ material limb and light detector; a micro-lens array, fiber connector output wheel: m-emitting diodes; -optical fiber, via optical chips, microlens arrays; crying: uncovering the substrate, multiple quasi-architectures. The right connection is combined to form a pair of the present invention to unveil an integrated optical fiber transceiver, Zhongchang: Shier 2 :: An automatic alignment type integrated surface above -Γ, Dagger 3…, state, installed on the circuit board horizontal plate f Ϊ1,: Γ, wire bonding circuit to connect Shixi substrate Disk circuit

Invert a 1c chip. Its plurality of integrated circuits = i said chip further includes a plurality of solder bumps to provide 10 chips and silicon-based C ;: i f, a plurality of wafers can also use its solder bumps; quasi 7 = board. The self-aligning integrated optical transceiver further includes four or more concave samples formed on the surface of the silicon substrate and the bottom surface of the microlens array. After the substrate and the microlens array are assembled, the grooves of the two form a mirror-pair. In the evening, the four or more isolation balls are placed between the silicon substrate and the symmetrical groove of the microarray, so that the silicon substrate is automatically aligned with the microlens array. 'Brother this self-aligning integrated optical transceiver, the circuit board is made of insulation 522668 V. Description of the invention (4) Material, a plurality of integrated electrics including laser diode, light detection: (Ι (; ) Said chip can be four kinds of IC crystal [its large device, more packages are included on several chips ^ field emission-the electrical connection between the polar body driver and the signal amplifier board. Automatic: number: wire bonding to provide silicon-based silicon The integrated optical transceiver of the substrate and the microlens array also includes two or two isolation rods maintained between the board and the microlens array, so that the bottom surface of Shi Xijifen is formed; the space of the number = the horizontal leg of the plate. □ The cold electricity circuit is a solder bump or a conductive connection. A :: !! type "type photoelectric transceiver, where the container has a small hole in the center and a small hole in the bottom plate. The guide rod is a π, g ♦ Firstly, the state-of-the-art tactics are adopted to make a pair of guide rods pass through the ift ^ ^ ^, and the small hole in the vertical part of the k d %% road board, and the other end is a fiber bundle by mounting on the container. The small hole in the center of the silicon-silicon board and the pillar of the two f. When the optical fiber is in the container, the system is; The lens and the microlens array are assembled for the purpose of the present invention. A per-pole system generates a pulsed laser. It is understood that the FI-spoon, structural features and functions thereof are further J. Noon. From the mating diagram is not detailed Explained as [the detailed description of the examples] The present invention discloses a loyalty and mechanical alignment > μ trophy first 70 pieces and uses automatic alignment flip-chip technology and an automatic pure method of drought control method = :; Dynamic alignment type: close. Electric :: =: type electric and -container group of several wafers, -micro lens array, -optical fiber L-shaped circuit board consists of a straight line and a horizontal part, vertical unit

V. Description of the invention (5) d: S-plane bonding :: The bottom surface of the horizontal part of the substrate is a wire. The laser-pole-: is equipped with a heat sink i. The silicon substrate is composed of a plurality of external panels including straight portions. More advantageous two: into a sub-group, Yu · circuit board pituitary, 射 _ h ^ A more advantageous method is to include the laser diode H = drive device, M chip structure 1 on the light detector on a silicon substrate Top surface. The isolation ball is mechanically aligned and aligned with the laser diode, and the lens array is parallel to the Shixi substrate and outputs the input optical signal. The key set consists of the integrated self-aligning photoelectric photoelectric H1G * _L type circuit of the invention of the 3rd invention. The figure of the self-aligning integrated body circuit chip (1C crystal moon). A silicon substrate 30, a plurality of integrator 1C chips 42, a single IC chip 40 and a photodetector 22, and an L-shaped circuit board 20 above the water knife 24 can be assembled with a heat sinking solder bump to make it The two sides with the outside are 4 and the bottom surface 26 has a wire arrangement 28. If there is a trace of metal (not marked): vertical J is changed in the [type circuit board 20. The inside also includes wire bonding 34 to form an electrical connection. The circuit board 32 can be connected to the silicon substrate 30. After hitting picture 2 Λ too / (as shown in picture 3). V in the container, mainly? A self-aligning, self-aligning, integrated photoelectric transceiver assembly mirror array 50 is shown in the figure 60. As shown in FIG. 2, the pillars 62 including the micro-through holes 64 are placed at the center respectively. Each has -medium Λ and -fiber optic connectors, further explanation of this content. V. Description of the invention (6); 2 °; 2 ;; two plates straight 6 r capacity ^ side side plate

The rod 36 passes, and the other end of the guide rod 36 is drawn in the center hole 64 of the lead V 62. It is known that the knife is connected to the pillar in the container 60. FIG. 3 shows the automatic alignment type integration of the present invention. Type B: as shown in Fig. 3 ', a plurality of 1C chips 4. , '2 includes the use of 46 ^ ^ ^ ^ 30 # ^ ^ 1〇 ^ 4〇f ^ LI and :: bu =; B "Besides, it is a ZC chip for the signal amplifier of the private state Λ. Therefore, the chip uses The solder bump 44 (as shown in FIG. 2) is connected to the Shixi substrate 30, and the Shixi base two counter 30 is connected to the L-shaped circuit board 2 by using wire bonding 34. The slices 40, 42, 52, and 54 are only As a reference for the legend, any of the: 1; 1C chip can be used for the integrated light of the automatic alignment type of the present invention. The fourth figure is the alignment of the automatic alignment type of the present invention ==, micro lens array 5 °, laser Diode I .: Two fibers?! # 隹 Set drawing. The optical fiber connector 70 introduces optical fiber 74 inside, light and cut 7 4 collected by the laser 1 + Μ plane ^ pole limb 1C said film 40 The 1C wafer 40, which is projected onto the mirror surface area 56 of the microlens mirror, is composed of wire bonding 46, the top μ-4 lens area 5 8 and the center laser cavity 76. The cavity 76 is composed of two layers of oxide layer 78 sandwiching a gain layer 80, and the laser beam 8 emitted by the laser diode 82 is 522668 of the laser diode. 5. Description of the invention (7) 1C wafer 40. Section 5 This is an auto-aligned integrated type of the invention | § 60 and an enlarged cross-sectional view of the internal component configuration, including the optical fiber connector 70, a pair of guide rods 36, a microcontainer and its pair of isolation bars 48, 1C The array 40 of the chip 40 and the silicon substrate 30 are connected to the configuration via the guide rod 36 and the circuit board hole 38. The container 1C chip 40 and the stone substrate 30 are soldered to the circuit board 20 The inert gas cavity formed between the substrate 30 and the wall of the container 6Q. The gas (such as nitrogen) is shown in Figure 6. Figure 6 shows the container 60 and its internal components in the automatic alignment type full-crowded, inert electrical transceiver of the present invention. Configuration cross-section details: Model 1 light elevation, a model that simulates the situation where laser light 82 passes through the laser diode ^ micro lens mirror 98 and nitrogen atmosphere 88. Yusheng II is the same:: It is through the laser II Welding provided by the IC chip 40 of the polar body: convex = bonding pads (not shown) on the surface of the substrate 30 to generate alignment capability. Λ Another level of automatic alignment capability is using the mechanical mechanism of the present invention, such as 7 the optical fiber connector 70, micro lens array 50, The layout of the Teikoku 1C chip 40 and the silicon substrate 30. There are at least four concave birch-microlens arrays 50 and the surface of the silicon substrate 30 on the micro lens array "face 92 and the silicon substrate 30 top surface 9 4 The grooves 90 are mirror images of each other. After the assembly, four or more isolation balls with a predetermined diameter are formed. An object distance is formed between the grooves 90 on the surface of the micromirror array 50 and the silicon substrate 30 to provide both. The function of automatic alignment is as shown in FIG. 8, which is an enlarged cross-sectional view of the mechanical alignment mechanism between the microlens array and the silicon substrate of the automatic alignment type full-size photoelectric transceiver of the present invention. Please note that in Figure 7, the laser diode and the silicon substrate are used.

Page 10 522668 V. Convex Stone Device Description (8) The block achieves the function of automatic alignment and facilitates the electrical connection of the bonding pad 96 of the substrate. The Ling junction 46 laser diode and the present invention provide a new automatic, which uses flip chip technology and mechanical two integrated photoelectric transceiver architecture has been described in detail! Figures 8 through 8 achieve the function of automatic alignment. The above are only used by the author to limit the implementation of the present invention? Only the preferred embodiments, and the same changes and modifications are made: Second, the patent application for f invention is covered by the scope of the invention patent. 522668 Brief description of the diagram. The first diagram is the configuration diagram of the key components of the automatic alignment type integrated photoelectric transceiver according to the present invention. &Amp;-, σ The second diagram is the automatic alignment type integrated photoelectric receiver according to the present invention. Sectional view of the main components of the driver in the container; X buckle, and garment Figure 3 is the layout diagram of the multiple wafers, Shi Xi substrate and circuit board of the self-aligning integrated photoelectric transceiver of the present invention; Fig. 4 is an arrangement diagram of the IC connector of the fiber optic connector, micro-lens array, and laser diode of the self-aligned integrated photoelectric transceiver according to the present invention; Fig. 5 and the silicon substrate An enlarged cross-sectional view of a quasi-type integrated optical device and its internal component configuration; Figure 6 of the narrative content is an enlarged cross-sectional view of the automatic alignment type integrated device and its internal component configuration. It is a layout diagram of a fiber optic connector, a micro lens array ^, a chip, and a silicon substrate; and Ic of a field-emitting diode Fig. 8 is an automatic alignment type mechanical alignment between the integrated lens array and the silicon substrate according to the present invention. Device Explanation of formula symbols] Enlarge and cut two pictures. 10 Photoelectric transceiver 20 L-shaped circuit board 22 Heat sink 24 L-shaped circuit board horizontal part 26 L-shaped circuit board horizontal part bottom 28 Wire configuration page 12 522668 Simple illustration 30 $ 夕Substrate 32 vertical circuit board 34 wire bonding 36 guide rod 38 circuit board hole 40 IC chip 42 IC chip 44 solder bump 46 wire bonding 48 spacer 50 micro lens array 52 IC chip 54 IC chip 56 top mirror area. 58 bottom mirror Zone 60 Container 62 Pillar 64 Center Small L 66 Container Top Plate 68 Container Bottom Plate 70 Fiber Optic Connector 72 Side Plates on Both Sides of the Container 74 Fiber 76 Laser Cavity

Page 13 522668

Page 14

Claims (1)

522668 6. Application scope i • -A type of self-aligning integrated photoelectric transceiver, the package of which is an L-shaped circuit board consisting of a vertical section and a vertical section, the vertical section has an external plane " 77 shape has a The bottom of the plurality of conductive lines is provided with a ^ far horizontal portion of the M plate (S1, 1), which is a straight part of the surface of the aforementioned circuit topology, and the surface of the Shixi substrate has up to ^ pieces; Songjie's integrated circuit (IC) is a micro-lens array, which is parallel to the polar body; T sub-aligns the laser 21 fiber on the silicon substrate and passes a fiber connector to output or input the number one; And a container of Youxun, combining the silicon substrate, the plurality of jc chips, the array, and the optical fiber connector to form an alignment structure: lens 2 ·:: Aligned integrated light + narrative state, which is more sentenced above the top of the surface of the earth, for the sake of silicon: clothes are placed on the L-shaped structure of the L-shaped circuit board of the horizontal circuit board. And support The 3, such as the application of 5 patents, 1 Tg, +, transceiver, An integrated photovoltaic panel with an automatic alignment type and an L-shaped circuit board included in the mid-range, and the reverse-connected side Shi Xiji 4 · Shenqing Patent No. 1 and Transceiver, among which a plurality of ic 'moving pairs The quasi-integrated integrated optoelectronics are provided for the plurality of IC chips. The chip further includes solder bumps for improving the electrical connection between the chip and the silicon substrate. Page 15 522668 /, patent application scope-a 5 · as described in the scope of the patent application, the whole alignment of the whole human type light +: wherein the plurality of IC chips using solder bumps from: to "6 The self-aligning transceiver as described in item 丨 of the patent application scope, which further includes:. The grooves of the first electric lens are respectively formed on the surface of the Shixi substrate and the bottom surface of the micro-column column, The grooves of the silicon substrate and the microlens array are mirror-symmetrical to each other; and after the dressing, four or more isolation spheres of the two are placed on the silicon substrate and the 哕 彳% rust & array symmetrical concave rod. The gate is standing, so it ’s ‘aa’ and ’. The lens array is aligned between yttrium. The silicon substrate is automatically aligned with the micro lens array. U t Please refer to item i of the patent scope. Contains Ray's body driver, signal amplifier. Transceiver, and in the middle: the automatic alignment type integrated optoelectronic substrate described in the item described above achieves electrical connection. The chip is bonded by wire bonding with the stone Xi 9 · If the patented rib = transceiver, the silicon substrate \ ^ The self-aligning integrated photoelectric rod described above, in the silicon base: and; 2 = there are at least two isolation spaces between the arrays. A reserved space is kept between the spear edge lens arrays. 10 · For example, a patent application for a $ transceiver, where the c's self-aligning integrated optoelectronics has a plurality of solder balls. The conductive line on the bottom surface of the horizontal part of the board is 522668 6. Scope of patent application Π · The automatic alignment type integrated photoelectric transceiver as described in item 1 of the scope of patent application, wherein the container is composed of an upper plate and a bottom plate, and the upper plate and the bottom plate are respectively embedded A pillar with a small hole in the center is installed, and a pair of guide rods are passed through the small holes when the photoelectric transceiver is assembled. 1 2 · The self-aligning integrated optical transceiver as described in item 1 of the scope of patent application, wherein the vertical part of the circuit board is near the top and bottom of the vertical part, and each has two guide rods for passing Kid L. 1 3 · The self-aligning integrated optical transceiver as described in item 12 of the patent application scope, which further includes a pair of guide rods, one end of which passes through a small hole in the vertical portion of the circuit board, and the other end passes through the aforementioned Embedded in the central small hole of the pillar of the upper plate and the bottom plate of the container. 1 4 · The self-aligning integrated optical-electrical transceiver described in item (2) of the patent application scope, wherein the optical fiber is an optical fiber bundle. 1 5 · The optoelectronic transceiver with integrated optoelectronic elements as described in item 1 of the scope of the patent application, wherein the Shixi substrate, the plurality of IC chips, and the microlens array are used when they are in a remote container. For each other. Page 17