522503 C7 D7 五、創作説明（^ ) 【發明領域】 (請.元閔讀背云之;'±意事項4填寫本頁) 表發明是有關於一種將散熱片定量塗佈接著劑與定 位？5貼之方法及裝Ϊ，特別是指一種可迅速精_的拜散熱 . 片黏貼於晶片上，至可一次將接著劑定量的塗扫於多嗟散 5 煞片上之方法及裝置3 [習知技藝說明】 參閲苐一、二圖，習知一種將散熱片1塗佈接著剌2 及_貼之方法，主要是在每次動作時，一次將一個散熱片 1取出，在其拿備與一電路板3晶片31相接觸的一黏貼 10 5丨0上時，以手二塗採一層接著劑2，然後再取出一片 電珞板3，將該散熱片1具有接著劑2之該黏貼面10，對 莩該電路板3之晶片3 I施力黏貼，最後稍微調整該散熱 片1所黏貼的角度與位置後，即完成此道工程。 此種將散熱片1塗钸接著劑2及黏貼在電路板3晶 15 片3 1上的方法，最大的缺點在於接著過程速度缓慢、以 反接著劑2的塗佈量多寡不定難以控制，且黏貼在該電路 :¾ 3晶片31上的相對位置及角度每片不一，因為是以作 業人員的手工塗佈及黏貼，所以在作案過程中會有許多不 每定的因素影響生產製程，如作業人員間熟練度的差異、 20 4業人員本身的精神狀態及作業環境或作業設備等等，很 容易發生如接著劑2太多，導致在黏貼時接著劑2溢流到 該電珞板3板面上，污染及破壞該電珞板3之美觀，或接 著劃2双少導致其與晶片31的黏著力不足，或黏著時散 热片1產生角度歪钭、位置移位等等問題，這些生產時所 第4頁 尽紙洚尺度逍司口 g國家標準（CNS) A4規格（2Ϊ0Χ297公釐） 522503 C7 D7 五、創作説明 發生的瑕疵，都有可能導致該電路板3在品管檢驗時，被 整批退貨。 【發明概要】 因此，本發明之目的即在提供一種將散熱片定量塗 5 佈接著劑與定位黏貼之方法，該方法可同時塗佈定量的接 著劑於複數個散熱片上，且可準確的將散熱片黏貼在一晶 片上。 本發明之另一目的是在於提供一種將散熱片定量塗 铞接著劑與定位黏貼之裝置，藉a該裝置而可於散熱片上 10 塗佈定量的接著劑，並將其準確的黏貼於一晶片上。 於是，本發明將散熱片定量塗铞接著劑與定位黏貼 之方法及裝置，係先將複數個散熱片以其一黏貼面朝上， 分別平鋪排列於一第一定位治具的複數個容置空間中，每 一容置空間的大小係洽足以容納一個散熱片，之後再取一 15 具有特定厚度的塗佈模板平置在該第一定位治具的頂平面 上，使該塗佈模板上所開設的每一穿孔對準位於一散熱片 黏貼面的上方，將接著劑適量的置放在該塗佈模板的頂面 上，均勻地將該接著劑抹過整片塗佈模板的頂面，使該接 著劑填滿該塗佈模板的全部穿孔，接著取下該塗佈模板， .20 使該等散熱片的黏貼面上附著有相等於該塗佈模板厚度的 定量接著劑。 下一步驟為，將一電路板可脫離地裝置入一第二定 位治具的一插置空間中，該第二定位治具於一側具有一插 置口，該插置口係與插置空間互相連通，於該插置空間的 第 本紙a尺度適用中3國家標準（CNS) A4規格（210X297公釐） ------------------------裝-------------------1T------------------線 (請先閲讀背面之注意事項再填寫本頁) 522503 C7 D7 五、創作説明（3 ) (^先閲讀背云之;±:£事項4填寫本頁) 一頂壁上形成有一形狀與該敖熱片相配合的祛口，該缺口 令会該插置口往内凹設所形成的，而該電珞垮上之晶片則 洽對應位於該缺口的方：再曰該第一定乜治具的容置空 間士取出一散熱Μ ，以其黏貼δ對車該第二定位治具頂壁 5 5':'筑口，ΓΓ7 .七卜这"f义怒.r"i :¾仏5亥％上> 〒/又3 .片二’ 54放激片 則會因該缺口的扠及刳其_貼的角度，及因該電路板固 定+置在該第二定位3具内的位置限制該散熱片黏貼的相 對乜置，而使得每片教熱片在黏貼時，都可精確的黏貼定 位於晶片上。 I 0 【圖式之簡單說明] 本發明之其他特致及優點，在以下配合參考圖式之 較佳實施例的詳細說明中，將可清楚的明白，在圖式中： 第一圖是習知一種在散熱片黏貼面上直接塗谇接著 劑的立體示意圖； 15 苐二圖是習知一種将散熱片黏貼在電路f反益片衣四 的操作示意圖； 第三圖是本發明較佳實施例將散熱片置放在第一定 立治具内的立體示意圖； 第四圖是本發明較佳實施例中塗佈模板的立體示意 20 圖： 第五圖是本發明較佳實施例以一刮刀於平面板體上 刮抹，使接著劑填滿每一穿孔的剖面示意圖； 第六圖是·本發明較佳實施例之步驟配合自動化機具 加以進行之立體示意圖； .第6頁 本紙绶尺度適用國家標準（CNS) A4規格（210X297公釐） 522503 C7 D7 4 頁 五、創作説明 第七圖是本發明較佳實施例第二定位治具之立體分 解示意圖，圖中該電路板係置於該底盤上； 第八圖是本發明較佳實施例第二定位治具之立體組 合示意圖，圖中該電路板係隨著該底盤而插置於該插置空 5 間内； 第九圖是本發明較佳實施例之該数熱片黏貼於該晶 片上之側視圖^圖中該散熱片係尚不^三β 3¾片知刀，及 φ 第十圖是本發明較佳實施例之該散熱片向下施力黏 貼在該晶片上之側視圖。 10 【較佳實施例之詳細說明】 參閱第三、四、五、六圖所示，本發明將散熱片1 定量塗佈接著劑2與定位黏貼於電路板3晶片31上之方 法的一較佳實施例是包含有下述步驟： 步驟（1 )是將複數個散熱片1以其一黏貼面1 〇朝 15 上，並分別平鋪排列在一第一定位治具4的複數個容置空 間44中。該第一定位治具4係呈一短形板狀，具有一頂 平面43，而該等容置空間44係於該頂平面43上向下凹 陷形成的，且每個容置空間44的尺寸大小均與散熱片1 之形狀、厚度相對應而可供容置散熱片1，於本實施例中 20 該等散熱片1於置入容置空間44後，其黏貼面10會與該 頂平面43齊平，且位於同一排的相鄰容置空間44間設有 取置槽42，該取置槽42的設置是用以方便將散熱片1置 入及取出容置空間44。 步驟（2 )是取一塗佈模板5覆蓋於該第一定位治具 第 本紙杀尺度適用中國國家標準（CNS) Α4規格（210X297公釐） ------------------------裝-------------------、可------------------線 (請先閲讀背面之注意事項再填窝本頁) 522503 C7 D7 五、創作説明（_ ) 4上，益使該塗估模板5上所開設的複數個穿孔52對應 位於該等散熱片1黏貼云1 〇之上方。該塗钸模板5具有 一矩形外捏5 5及一迠設於該外框5 5 5之一平S板體5 1， 該五δ板禮5 1為一不鎬銅板，該等穿孔52係穿設於該平 ： 无板體51上，且貫穿正面板韹51兩δ，該早面板體51 i厚度是經過彳牙定計具的7而為何妥經3特定計异将於:沒 以說明，另平面板體.51之尺寸恰好與第一定位治具4 9同，因此當塗佈摸板5覆蓋於該第一定位治具4上時， 該矩形外框5 5則恰好裎住於第一定位治具4外圍，提供 iu 定位的功周，同時該平S板體5 1之一底面54平貼於該第 一定位治具4之頂平面43上，而該平δ扳體5 1上所形成 的複數彳固穿孔52分別對這於容置在該第一定位治具4之 容置空間44内的散熱片1，旦該等穿孔52與該等散熱片 1黏貼面1 0之形狀相配合，但該等穿iL 52之面積略小於 15 該黏貼面1 0靣積，一般來說此類塗佈模板5是以不鏽鋼 板製造。 請再參閱第五圖所示，步驟（3 )是先將該接著劑2 擠壓於平面板體5 1之一側，再甴該倒蔣接著劑2均勻地 塗钸於該散熱片1黏貼面10上，本較佳實施洌中所使用 2 0 的方弍是先將接著劑2置於平面板體51之頂面53，再以 一刮刀6將該接著劑2均勻地到過該了員面5 3，使該接著 劑2填滿該平面板韹5 1上之全部穿孔52，本實施例II是 α到刀6來到抹，而事實上可以任何適當的方式來加以塗 琢均可3該接考劑2是元集_地置放-三該平面板體5 1的 第8頁 太.¾¾尺度適用中國S家標準（CNS) A4規格（2Ί0Χ297公釐） (請先閒讀背耷之注意事項耳4寫衣頁) 、vm 522503 C7 D7 五、創作説明（6 ) 頂面53上，當刮刀6將該接著劑2均勻的刮過整月平面 板體51的頂面53時，會使得該接著劑2流入並填滿該平 面板體51上的每一穿孔52，多餘的接著劑2則被刮刀6 刮除，如此一來，該等散熱片1之黏貼面1 0上便附著一 5 層相等於該平面板體51厚度的接著劑2，而使接著劑2 均勻塗佈於每一穿孔52中的方式並不限於以刮刀6到抹， 亦可以其他工具抹過平面板體5 1之頂S 53，同樣可使接 I 著劑2均勻的塗佈於每一穿孔52中。白於該平面扳體5 1 的底靣54平貼於該第一定位治具4的頂手面43上，所以 10 該平面板體5 1上的各個穿孔52便形或一底部封閉的槽 狀，當該刮刀6刮過該平面板體5 1的頂面53上，且被施 加一橫向力推動呈現膠狀的接著劑2前進時，該接著劑2 即會自動的流入並填滿該平面板體5 1的穿孔52内，填滿 該穿孔52後多餘的接著劑2則繼續被該刮刀6推向下一 15 個穿孔52，最後該平面板體51上所有的穿孔52均會填 滿相等於該平面板體5 1厚度及該穿孔52面積的定量接著 _ 劑2。 步驟（4 )是以垂直遠離該第一定位治具4頂平面43 的方向，向上取出該塗佈模板5，亦可以自動化的機具8 20 夾住該塗佈模板5之外框55，往上的蔣該塗佈模板5脫 離該第一定位治具4，如第六圖所示。將原本填滿於各該 穿孔5 2内的接著劑2銳離該塗佈模板5，並留置於該散 熱片1的黏貼面1 0上，且盡量避免使附著於該等散熱片 1黏接面1 0上的接著劑2，因於取出時受到該平面板體5 1 頁 (請先閱讀背面之注意事項再填寫本頁) 第 本紙乐尺度適用中國國家標準（CNS) A4規格（210X297公釐） 522503 C7 D7 五、創作説明（7 ) 的这觸，而產生移位的情;兄。 (請先3讀背云之：r〗意事項玉：4窝本頁) 甴前述該等步驟^，可以得知前迄步霉是能S自鸯 化流程扣以進行的，將該等散熱片1——的置入答置2間 4 4中，這個動作是可輕易的以通當的機器〔圖未示）加以完 5 咸的，而以一機具8夾住該塗佈模板5外框55，il得置 放有複數個散熱片1之第一定位治具4置於該機具S下 方，並利罔一些定位塊s 1來使該第一定位治具4能m確 的與該塗讳模板5配合，該機具8夾著塗讳模板5往下移 動，卵可使塗佈模板5位於第一定位治具4上方，並如前 10 述步辑（2)使每一穿孔52對準每一散熱片1，然後令機具 8於皁面板體5 1的頂面5 3上添加接著劑2，再控制刮刀 ό刮過該平面板韹5 1的頂面53，使接著劑2佈滿每一穿 孔52，再令機具8將該塗佈模板5向上脫離第一定位治 具4，即可以全自動的方式完成該等步霖了。 15 接著請參閱第六圖所示，步驟（5)是將一電路板3 可脫離地置入一第二定位治具7之一插置空間75内，該 第二定位治具7略呈一矩形體，其一例邊具有一插置口 74，甴該插置口 74向内凹設形成有一插置空間75，該插 置空間75略呈一矩形，旦沿著插置口 74兩側向插置空間 2 0 5円分別廷伸有一導槽/ c，，而該插置空間7 5之頂璧71 Η該插置α 74往相對側G：陷形成一缺α，於本實施例 令这班口 7 2具有大、小个，:5j的尺〒’ ？父大的部汾疋連5文 於該插置α 74而較小的部份則是與較大的部份互相連 設，且與散熱片1的大小相等，而於缺口 72較小部份的 第10頁 衣紙法尺度適用中33家標準（CNS) Α4規格（210X297公釐） 522503 C7 D7 五、創作説明 兩長側邊另設有相對應的開槽77，其作同容後說明。 本實施例另設有一底盤78，該底盤78係可甴該插置 口 74進、出該插置空間75，該底盤了8係罔以承載該電 路板3，於該底盤78插入插置口 74的一端設有兩磁鐵 5 78 1，而於插置空間75對應之處亦設有兩磁鐵73，另外， 該底盤78的兩側邊分別設有複數個滾輪783，該等滾輪783 是與該插置空間75的兩導槽76相配合。 請再配合第七圖所示，將該電路板3置放於底盤78 上，將該底盤78甴該插置口 74推入該插置空間75円， 10 藉甴底盤78兩側的滾輪783於插置空間75内兩導槽76 滑移，使該電路板3插置於插置空間75内時不會因人為 的些許疏失而產生任何的偏移，於該電珞板3插入插置空 間75内時，其上所設的晶片3 1恰對應位於尺寸較小之缺 口 72的位置。 15 參閱第八圖，步驟（6 )是甴該第一定位治具4之容 置空間44中取出一散熱片1，藉由該容置空間44側邊所 設置的取置槽42，而可方便將散熱片1取出容置空間44， 以該散熱片1之黏貼面1 0對準該缺口 72，而藉黏貼面1 0 上的接著劑2黏貼固定於該電路板3之晶片31上，當該 20 附著有接著劑2的散熱片1對準並穿過該缺口 72，而黏 貼在該電路板3的晶片31上時，因該每一片電路板3均 定位容置在該第二定位治具7的插置空間75中，且又因 該缺口 72即對應該電路板3上之晶片3 1位置所開設，所 以當該散熱片1在對應黏貼於該電路板3之晶片31上時’ 第11頁 本紙張尺度適用中g國家標準（CNS) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) -裝丨 、v'u :線丨 522503 C7 D7 五、創作説明（9 ) 每一片散熱片1所黏貼的電路板3相對位置均固定。又該 缺口 72之令狀為與該散熱片1之$狀相配合，故當該敎 熟片1於黏貼完成後，因該缺口了2形趺的限制，而变待 須穿過該接口 7 2的散熱片1所能黏努的角度也受限，自 5 然當其黏貼在每一片電路板3晶片31上的角度都能维持 固定。 參閱第九圖及第十圖，在本發明方法中，因考慮到 當附著有該接著割2的散熱片1，黏貼在該電路板3之晶 片3 1上時，該接著劑2所塗钸的量不可太少，以免黏著 10 力不足，且該接著劑2所塗钸量亦不可太多，避免施力黏 貼時該接著劑2溢流到晶片3 1外，污染該電路板3之外 觀。所以步驟（2)中所採周的塗佈板5之平面板體51 厚度便隨著該散熱片1所需黏著力的不同，而有所變更， 又因所選擇的平面板體51厚度不同，進而影響該平面板 15 體51上所開設的穿孔52的面積，以維持該接著劑2所塗 係的量。就大多數常見的散熱片1黏貼時所需之接著劑2 塗钸量而言，約需厚0.1 5mm (如第九圖），意即該平面 板體5 1之厚度需0 · 1 5 m m，而該接著劑2所塗佈的面，每 邊的邊長均須略小於該散熱片1每邊邊長〇. 1 mm，故該穿 2 0 孔52所閧設的每邊長均需+於該散熱片1每邊長約 0.1 m m，以提岳最適量的接著劑2，立在，将該散熱片1抱 力黏貼於該電珞板3的晶片31上時·該接著劑2足夠溢 出該散熱.片1的黏站面1 〇，但又^至於流到晶片3 1的電 路板3上（如苐九圖所示）。 第12頁 本紙丢尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ------------------f:·------------魏 (請先閲讀背面之注意寧項再4寫本頁) 522503 D7 10 五、創作説明 惟以上所述者，僅為本發明之較佳實施例而已，當 不能以此限定本發明實施之範圍；故大凡依本發明f請專 利範圍及發明說明書π容所作之簡單的等效變化與修飾， 营應仍屬本發明專利涵蓋之範圍内。 第13頁 本紙彔尺度適用中國ϋ家標準（CNS) Α4規格（210X297公釐） :裝 訂 ·線 (請先閲讀背面之注意事項再填窝本頁) 522503 C7 D7 五、創作説明（^ )【元件標號對照] 1 散熱片 丄0 為.¾ δ η 接著劑 ο 電路板 31 晶片 4 第一定位治具 5 42 取置槽 :貝千面 44 容置空間 5 塗讳模板 5 1 平面彳反體 52 穿孔 53 頂面 54 惠面 5 5 外框 6 到刀 10 7 第二定位治具 7 1 丁頁璧 72 缺口 73 运鐵 74 孑#置α 75 插置空間 76 導槽 7 7 間槽 78 底兹 78 1 笤鐵 15 783 乂丁 Η+ί 8 機具 第14頁 (請先閱讀背面之注意事項再場寫vr貝)522503 C7 D7 V. Creation Instructions (^) [Invention Field] (Please. Yuan Min reads back to the cloud; '± Matter 4: Fill in this page) The invention of the table relates to a kind of quantitative coating of adhesives and positioning of heat sinks? The method and device of 5 paste, especially refers to a method that can quickly and accurately dissipate heat. The sheet is pasted on the wafer, and the method and device can be used to quantitatively apply the adhesive to the multiple brakes. Description of knowing skills] Refer to Figures 1 and 2 to learn a method of coating the heat sink 1 followed by 2 and _ paste. The main method is to take out one heat sink 1 at a time and prepare it for each operation. When an adhesive 10 5 丨 0 in contact with a chip 31 of a circuit board 3 is applied, a layer of adhesive 2 is applied with two hands, and then a piece of electrical board 3 is taken out, and the heat sink 1 has the adhesive of adhesive 2. On the surface 10, the wafer 3I of the circuit board 3 is adhered by force, and finally, the angle and position of the heat sink 1 are adjusted slightly to complete the project. The biggest disadvantage of this method of coating the heat sink 1 with the adhesive 2 and attaching it to the 15 crystals 31 of the circuit board 3 is that the speed of the bonding process is slow, and the amount of the coating of the adhesive 2 is difficult to control, and The relative positions and angles of the circuit: ¾ 3 wafer 31 are different. Because it is manually coated and pasted by the operator, there will be many uncertain factors affecting the production process during the crime, such as Differences in proficiency among operators, the mental state of the workers themselves, the operating environment or the operating equipment, etc., can easily occur if the adhesive 2 is too much, which causes the adhesive 2 to overflow to the electric panel 3 during adhesion. On the surface of the board, contamination and damage of the beauty of the electric board 3, or subsequent double draws, cause insufficient adhesive force with the chip 31, or problems such as skewed angles and position shifts of the heat sink 1 during adhesion, etc. The fourth page of the production site is full of paper. Standards (CNS) A4 (2Ϊ0 × 297 mm) 522503 C7 D7 V. Defects in the creation instructions may cause the circuit board 3 to be inspected during quality control. , Returned in batches . [Summary of the Invention] Therefore, an object of the present invention is to provide a method for quantitatively coating a heat sink with 5 cloth adhesives and positioning and pasting. The method can simultaneously apply a fixed amount of adhesive to a plurality of heat sinks, and accurately apply the heat sink. The heat sink is adhered to a chip. Another object of the present invention is to provide a device for quantitatively applying an adhesive to a heat sink and positioning and pasting. By using the device, a fixed amount of adhesive can be applied to the heat sink 10 and accurately adhered to a wafer. on. Therefore, in the method and device for quantitatively applying the heat sink and the adhesive and positioning and adhering, the method firstly arranges a plurality of heat sinks with one of the sticking sides facing up, and arranges them in a plurality on a first positioning jig. In the installation space, the size of each accommodating space is sufficient to accommodate a heat sink, and then a 15 coating template having a specific thickness is placed on the top plane of the first positioning jig, and the coating template is made flat. Each perforation opened above is aligned above a heat sink affixed surface, and an appropriate amount of adhesive is placed on the top surface of the coating template, and the adhesive is evenly applied across the top of the entire coating template. Surface, so that the adhesive fills all the perforations of the coating template, then remove the coating template, .20 so that a fixed amount of adhesive equal to the thickness of the coating template is adhered to the adhesive surfaces of the fins. The next step is to detachably mount a circuit board into an insertion space of a second positioning jig, the second positioning jig has an insertion port on one side, and the insertion port is connected with the insertion The spaces are connected to each other, and the 3rd paper a of the inserted space is applicable to the China 3 National Standards (CNS) A4 specifications (210X297 mm) --------------------- --- installed ------------------- 1T ------------------ line (Please read the note on the back first Please fill in this page again for matters) 522503 C7 D7 V. Creation Instructions (3) (^ Read Back of Yun Yun; ±: £ Fill 4 for this page) A top wall is formed with a cutout that matches the hot piece. The notch is formed by the insertion opening being recessed inward, and the chip on the chip is in correspondence with the side located in the notch: then the space holder of the first fixing fixture takes out one The heat dissipation M is adhered to the top wall 5 of the second positioning jig 5 5 ':' Zhukou, ΓΓ7. Qibu this " f 义 anger.r " i: ¾ 仏 5 ハ ％ 上 > 〒 / 3. The second piece of the '54 stimulating film will be due to the notch fork and the angle of the _ paste, and because the circuit board is fixed + placed in the second fixed The position within the three positions limits the relative placement of the heat sink, so that each heat teaching sheet can be accurately positioned on the chip when it is pasted. I 0 [Simplified description of the drawings] Other features and advantages of the present invention will be clearly understood in the following detailed description of the preferred embodiment with reference to the drawings. In the drawings: The first picture is a study A three-dimensional schematic diagram of directly applying an adhesive on the heat sink affixed surface is shown in FIG. 15. The second diagram is a conventional operation schematic diagram of a heat sink affixed to a circuit f anti-film sheet. The third diagram is a preferred implementation of the present invention. Example is a perspective view of a heat sink placed in a first standing fixture; Figure 4 is a perspective view of a coating template in a preferred embodiment of the present invention. Figure 20 is a perspective view of a preferred embodiment of the present invention. The scraper scrapes on the flat plate body, so that the adhesive fills each of the perforations. The sixth diagram is a three-dimensional schematic diagram of the steps of the preferred embodiment of the present invention in cooperation with an automated machine. Page 6 Applicable national standard (CNS) A4 specification (210X297 mm) 522503 C7 D7 Page 5 5. Creation description The seventh diagram is a three-dimensional exploded schematic diagram of the second positioning jig of the preferred embodiment of the present invention. The circuit board is placed on the The bottom Top; FIG. 8 is a schematic diagram of a three-dimensional assembly of a second positioning jig according to a preferred embodiment of the present invention, and the circuit board is inserted into the insertion space with the chassis; FIG. 9 is the present invention Side view of the heat sink affixed to the wafer in the preferred embodiment ^ The heat sink in the figure is not yet three β 3¾ sheets, and φ The tenth figure is the heat sink in the preferred embodiment of the present invention Side view of applying force to the wafer by applying downward force. 10 [Detailed description of the preferred embodiment] Referring to the third, fourth, fifth, and sixth figures, the present invention compares the method of quantitatively coating the heat sink 1 with the adhesive 2 and positioning and adhering the circuit board 3 to the wafer 31. The preferred embodiment includes the following steps: Step (1) is to place a plurality of heat sinks 1 with an adhesive surface 10 facing 15 and arrange the plurality of accommodating pieces of a first positioning fixture 4 in a tiled manner. Space 44. The first positioning jig 4 has a short plate shape, and has a top plane 43. The accommodation spaces 44 are formed by being recessed downward on the top plane 43, and each accommodation space 44 has a size. The size is corresponding to the shape and thickness of the heat sink 1 and can be used to accommodate the heat sink 1. In this embodiment, after the heat sinks 1 are placed in the accommodation space 44, the adhesive surface 10 will be aligned with the top plane. 43 is flush, and an access slot 42 is provided between adjacent accommodation spaces 44 in the same row. The access slot 42 is provided to facilitate the insertion and removal of the heat sink 1 into and out of the accommodation space 44. Step (2) is to take a coating template 5 to cover the paper size of the first positioning jig, and apply the Chinese National Standard (CNS) A4 specification (210X297 mm) ------------- ----------- install ------------------- 、 may ----------------- -Line (please read the precautions on the back before filling in this page) 522503 C7 D7 V. Creative Instructions (_) 4 The number of perforations 52 on the painted template 5 is located on the heat sink correspondingly 1 Paste above the cloud 10. The coated template 5 has a rectangular outer pin 5 5 and a flat S plate body 5 1 provided in the outer frame 5 5 5. The five δ plate gift 51 is a non-pick copper plate, and the perforations 52 are worn. Set on the flat: No plate body 51, and pass through the front panel 韹 51 two δ, the thickness of the early panel body 51 i is 7 through the tooth decay gauge, and why is it through 3 specific calculation will be: not explained The size of the other flat plate body .51 is exactly the same as that of the first positioning jig 4 9. Therefore, when the coating mold 5 covers the first positioning jig 4, the rectangular frame 5 5 is just caught on The periphery of the first positioning jig 4 provides the work cycle for iu positioning, and at the same time, the bottom surface 54 of one of the flat S plates 51 is flatly attached to the top plane 43 of the first positioning jig 4 and the flat delta plate 5 The plurality of solid-fixed perforations 52 formed on 1 respectively face the heat sink 1 accommodated in the accommodation space 44 of the first positioning jig 4 once the perforations 52 and the heat sink 1 adhere to the surface 1 0. The shapes match, but the area of the penetrating iL 52 is slightly less than 15 and the adhesive surface is 10 靣. Generally speaking, this type of coating template 5 is made of stainless steel plate. Please refer to the fifth figure again. In step (3), first press the adhesive 2 on one side of the flat plate body 51, and then apply the inverted adhesive 2 evenly to the heat sink 1 and stick it. On the surface 10, the square of 20 used in the preferred embodiment is to first place the adhesive 2 on the top surface 53 of the flat plate body 51, and then use a scraper 6 to uniformly pass the adhesive 2 there. The face 5 3 allows the adhesive 2 to fill all the perforations 52 on the flat plate 韹 51. In this embodiment II, α is applied to the knife 6, and in fact, it can be painted in any suitable manner. Can 3 The test agent 2 is a meta-set_ground placement-San the flat plate 5 1 of the 8th page too. ¾¾ The standard is applicable to the Chinese Standard S (CNS) A4 (2Ί0 × 297 mm) (please read first) Note on the back: ear 4 write clothes page), vm 522503 C7 D7 5. Creation instructions (6) on the top surface 53, when the scraper 6 evenly scrapes the adhesive 2 across the top surface 53 of the full moon flat plate body 51 At this time, the adhesive 2 will flow into and fill each of the perforations 52 on the flat plate body 51, and the excess adhesive 2 will be scraped off by the scraper 6. In this way, the adhesive surfaces 1 of the heat sinks 1 0 on 5 layers of adhesive 2 with the same thickness as the plane plate body 51 are attached, and the method of uniformly applying the adhesive 2 to each of the perforations 52 is not limited to the application with a scraper 6 to the surface, and other planes can also be used to wipe the plane plate. The top S 53 of the body 51 can also uniformly coat the adhesive 2 in each of the perforations 52. The bottom ridge 54 that is whiter than the flat trigger body 5 1 is flatly attached to the top hand surface 43 of the first positioning jig 4, so 10 each of the perforations 52 on the flat plate body 5 1 is shaped like a groove or a bottom closed groove. Shape, when the scraper 6 scrapes on the top surface 53 of the flat plate body 51, and a lateral force is applied to push the adhesive 2 in the form of a gel, the adhesive 2 will automatically flow in and fill the adhesive In the perforation 52 of the flat panel body 51, the excess adhesive 2 after filling the perforation 52 is continued to be pushed down by the scraper 6 to the next 15 perforations 52. Finally, all the perforations 52 on the flat panel body 51 will be filled. The weight equal to the thickness of the flat plate body 51 and the area of the perforation 52 is equal to the agent 2. Step (4): Take out the coating template 5 in a direction vertically away from the top plane 43 of the first positioning jig 4; an automated tool 8 20 can also be used to clamp the outer frame 55 of the coating template 5 and go up The coated template 5 is separated from the first positioning jig 4 as shown in the sixth figure. The adhesive 2 originally filled in each of the perforations 5 2 is sharply separated from the coating template 5 and left on the adhesive surface 10 of the heat sink 1, and the adhesion to the heat sinks 1 is avoided as much as possible. Adhesive 2 on face 10, because of receiving the flat board 5 1 page when removed (please read the precautions on the back before filling this page) The paper scale is applicable to Chinese National Standard (CNS) A4 specification (210X297) (Centi) 522503 C7 D7 V. This touch of the creation note (7) creates a shifting affection; brother. (Please read 3 of the back of the cloud: r〗} Jade: 4 nests on this page) 甴 These steps ^, you can know that the previous step can be deducted by the S self-hydration process, and dissipate the heat Slide 1——Place in 2 rooms 4 4 This operation can be easily completed by a common machine (not shown) 5 and a machine 8 is used to clamp the outside of the coating template 5 In block 55, a first positioning jig 4 having a plurality of heat sinks 1 is placed under the tool S, and some positioning blocks s 1 are used to enable the first positioning jig 4 to accurately match the positioning jig 4. Cooperating with the masking template 5, the machine 8 moves the masking template 5 downwards, and the egg can make the coating template 5 be located above the first positioning jig 4, and make each perforation 52 as described in the first 10 steps (2) Align each heat sink 1, and then make the implement 8 add adhesive 2 on the top surface 5 3 of the soap panel body 5 1, and then control the scraper to scrape the top surface 53 of the flat plate 5 1 to make the adhesive 2 Each of the perforations 52 is covered, and then the machine tool 8 lifts the coating template 5 upward from the first positioning jig 4 to complete such steps in a fully automatic manner. 15 Next, please refer to the sixth figure. Step (5) is to detachably place a circuit board 3 into an insertion space 75 of a second positioning jig 7. The second positioning jig 7 is slightly A rectangular body has, for example, an insertion opening 74 on one side. The insertion opening 74 is recessed inward to form an insertion space 75. The insertion space 75 is slightly rectangular. The insertion space 2 0 5 伸 extends a guide groove / c, and the top of the insertion space 7 5 璧 71 Η The insertion α 74 faces the opposite side G: a depression α is formed by the depression. In this embodiment, This class mouth 7 2 has a large and a small, 5 'ruler'? The father's part of the Fen Fanglian 5 texts were inserted in the α 74 and the smaller part was interconnected with the larger part and equal to the size of the heat sink 1, and the smaller part in the gap 72 Page 10 of the 33 standards (CNS) A4 specifications (210X297 mm) 522503 C7 D7 applicable to the paper and paper method V. Creation instructions There are corresponding slots 77 on the two long sides, which will be described later. . In this embodiment, a chassis 78 is provided. The chassis 78 can be inserted into and out of the insertion space 75 through the insertion port 74. The chassis has 8 series to carry the circuit board 3. The insertion hole is inserted into the chassis 78. Two magnets 5 78 1 are provided at one end of the 74, and two magnets 73 are provided at the corresponding positions of the insertion space 75. In addition, the two sides of the chassis 78 are respectively provided with a plurality of rollers 783. The two guide grooves 76 of the insertion space 75 cooperate with each other. Please cooperate with the seventh figure to place the circuit board 3 on the chassis 78, push the chassis 78, the insertion port 74 into the insertion space 75, and 10 by the rollers 783 on both sides of the chassis 78 The two guide grooves 76 slide in the insertion space 75, so that the circuit board 3 will not be shifted due to some human error when inserted into the insertion space 75. Insert the insertion into the electrical board 3. When the space 75 is inside, the wafer 31 arranged thereon corresponds to the position of the notch 72 with a smaller size. 15 Referring to the eighth figure, step (6) is to take out a heat sink 1 from the accommodation space 44 of the first positioning jig 4 and use an access slot 42 provided on the side of the accommodation space 44 to It is convenient to take the heat sink 1 out of the accommodating space 44 and align the adhesive surface 10 of the heat sink 1 with the notch 72, and fix and fix it on the chip 31 of the circuit board 3 by the adhesive 2 on the adhesive surface 10. When the heat sink 1 attached with the adhesive 2 is aligned and passed through the gap 72 and adhered to the wafer 31 of the circuit board 3, each of the circuit boards 3 is positioned and accommodated in the second positioning. In the insertion space 75 of the jig 7, and because the gap 72 corresponds to the position of the wafer 31 on the circuit board 3, when the heat sink 1 is corresponding to the wafer 31 adhered to the circuit board 3 '' P.11 This paper's dimensions apply to China National Standards (CNS) A4 specifications (210X297 mm) (please read the precautions on the back before filling this page)-Installation 丨, v'u: Line 丨 522503 C7 D7 V. Creation note (9) The relative position of the circuit board 3 to which each heat sink 1 is attached is fixed. Moreover, the order of the notch 72 is matched with the shape of the heat sink 1. Therefore, when the cooked sheet 1 is pasted, the notch has the restriction of the two-shaped form, and it must be passed through the interface 7 The angle at which the heat sink 1 of 2 can be attached is also limited. Since the angle at which it is adhered to the chip 31 of each circuit board 3 can be maintained fixed. Referring to FIG. 9 and FIG. 10, in the method of the present invention, it is considered that the adhesive 2 is applied when the heat sink 1 attached to the cutting 2 is adhered to the wafer 31 of the circuit board 3. The amount of the adhesive should not be too small, so as to avoid insufficient adhesion, and the amount of the adhesive 2 should not be too much, to prevent the adhesive 2 from overflowing to the outside of the wafer 31 when the adhesive is applied, and contaminating the appearance of the circuit board 3. . Therefore, the thickness of the flat plate body 51 of the coating plate 5 collected in step (2) varies with the different adhesive force required by the heat sink 1, and the thickness of the selected flat plate body 51 is different. , And further affect the area of the perforations 52 formed on the body 51 of the flat plate 15 to maintain the amount of the adhesive 2 applied. As for the coating amount of the adhesive 2 required for most common heat sinks 1, the thickness is about 0.1 5mm (as shown in the ninth figure), which means that the thickness of the flat plate 5 1 needs to be 0 · 1 5 mm. The length of each side of the surface coated by the adhesive 2 must be slightly smaller than the length of each side of the heat sink 1 by 0.1 mm. Therefore, the length of each side of the 20 through-hole 52 needs to be coaxed. + When the heat sink 1 is approximately 0.1 mm in length on each side, in order to raise the optimum amount of the adhesive 2, stand on the side of the heat sink 1 and adhere to the wafer 31 of the electric panel 3 · The adhesive 2 It is enough to overflow the heat sink. The sticky station surface 1 of the sheet 1 is flowing to the circuit board 3 of the chip 31 (as shown in Fig. 9). Page 12 The standard for paper loss is applicable to China National Standard (CNS) A4 (210X 297 mm) ------------------ f: · -------- ---- Wei (please read the note on the back, and then write this page) 522503 D7 10 V. Creation Note The above is only the preferred embodiment of the present invention. The scope of the invention; therefore, any simple equivalent changes and modifications made in accordance with the scope of the invention and the scope of the invention, should still fall within the scope of the invention patent. Page 13 The dimensions of this paper are in accordance with Chinese Standard (CNS) A4 (210X297 mm): binding and thread (please read the precautions on the back before filling this page) 522503 C7 D7 V. Creation Instructions (^) 【 Component number comparison] 1 Heat sink 丄 0 is .¾ δ η Adhesive ο Circuit board 31 Wafer 4 First positioning jig 5 42 Placement slot: Beiqian surface 44 Receiving space 5 Masking template 5 1 Planar body 52 Perforation 53 Top surface 54 Hui surface 5 5 Frame 6 to the knife 10 7 Second positioning jig 7 1 Ding page 璧 72 Notch 73 Transportation iron 74 孑 # 置 α 75 Insert space 76 Guide slot 7 7 slot 78 bottom Here 78 1 笤 铁 15 783 乂 丁 Η + ί 8 Machine Page 14 (Please read the precautions on the back before writing vr shell)
本紙3：尺度適月中3國家標準（CNS) A4規格（210X297公釐）Paper 3: National Standard (CNS) A4 Specification (210X297 mm)