經濟部智慧財產局員工消費合作社印製 519866 A7 _ _ B7 五、發明説明（1) 【發明之技術領域】 本發明，是關於冷卻電子機器所使用之散熱器，尤其 是將金屬製底板與散熱翼片部予以接合成一體之具翼片之 散熱器。 【先行技術】 爲了要將年年大幅增加之電子機器的半導體晶片所發 之熱予以散熱，一般所熟悉的是使散熱器緊密接著在半導 體晶片上，使半導體晶片的熱移轉到散熱器之散熱方法。 以往的散熱器，爲了緊密接著地接合在半導體晶片，因此 以具有金屬製之平板狀底板，在與位於底板之半導體晶片 所在面的相反側之面上，乃具備設置有複數片金屬製薄板 之翼片構造。 在如此構造之散熱器，來自半導體晶片所產生的熱， 藉由與半導體晶片緊密接著配置之底板，而傳導至底板之 整體，如此地擴散至底板之熱，再藉由被安裝在底板上之 散熱翼片，散熱到大氣中或是某特定空間。以往所使用之 散熱器，是以壓出成型方式提供鋁製之一體成型的散熱器 。然而，被壓出成型之鋁製一體成型品之散熱器，對於將 散熱翼片間之間距縮小，在成型技術上乃相當困難，由於 散熱翼片間之間距的細密化有其限度，因此，當散熱翼片 之數目被限定在無法滿足需求數量之狀態時，便具有無法 充分獲得散熱效果之問題。 爲了解決上述問題，以取得更優異之散熱效果，被提 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） I 批衣 訂 矣 (請先閲讀背面之注意事項再填寫本頁) -4 - 519866 經濟部智慧財產局員工消費合作社印製 A7 B7_五、發明説明（会 案有以非一體成型品，將底板、以及與底板分開之散熱翼 片部分別製作，將如此所製作之散熱翼片部’藉由軟焊接 合、或是以機械方法接合在底板之另一面。但藉由軟焊接 合之方法，由於製造成本高，因此以機械方法來將散熱翼 片部接合在底板之另一面上，較爲有利。 如第4圖所示，半導體晶片3 0與底板2 2之大小， 與底板2 2相較，半導體晶片3 0遠小於底板2 2。因此 如此，必須使用熱傳導性佳之銅、鋁等材料來作爲底板， 將來自較小之半導體晶片的熱量傳導至大的底板整體。尤 其是銅，由於熱傳導性優異，可作爲散熱器之底板材料乃 廣爲人知。然而，銅的重量（密度）較大，而且必須直接 緊密接合於半導體晶片，因此對於銅製之底板荷重，還必 須要具備有用以減輕對半導體晶片損傷之耐強度構造（例 如，對電路基板使用之零件安裝具等）。 再者，電子機器，隨著輕量化及小型化，不僅能夠使 用重量較大之銅製底板之情況變少，且難以確保使用空間 ，因此對銅製底板之使用日益困難。但另一方面，隨著半 導體晶片等之集積程度越來越高，以及處理能力的提升， 由半導體晶片之發熱量乃愈形增多，爲了要使半導體晶片 等安定地正常動作，就需要有更佳良好的散熱效果。 如上所述，雖然銅製底板其熱傳導性優異，但卻因重 量大而難以使用。因此，在現狀上，當使用絕來作爲底板 之材料時，就必須滿足對散熱器之散熱效果更高之要求。 對於將散熱翼片部以藉由機械方式接合於底板之另一 本紙張尺度通用中國國家標準（CNS ) A4規格（210X297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝· 訂 線· -5- 519866 A7 B7 五、發明説明（9 (請先閲讀背面之注意事項再填寫本頁) 面所製作之散熱器，在散熱中之定常狀態下，底板內的溫 度分布，是以安裝有半導體晶片之底板中央部爲最高溫’ 溫度隨著離開半導體晶片而降低。因此，被接合在底板另 一面，以對熱可傳導連接的複數片散熱翼片而言，也是呈 位於安裝有半導體晶片之底板中央部的散熱翼片的溫度爲 最高，愈離開底板中央部之端部的散熱翼片的溫度就愈低 之狀態。 再者，在散熱翼片之高度方向以存在著溫度分布，以 熱傳導接合底板之熱翼片基部的溫度最高，隨著離基部愈 遠，散熱翼片的溫度則愈低。此乃由於散熱翼片內之熱的 移動，是藉由固體進行熱傳導。 經濟部智慧財產局員工消費合作社印製 然而，從散熱效率之觀點而言，是期望散熱器各部分 的溫度差要儘可能地少。但從過去至今，如上所述，隨著 半導體晶片發熱量增大之同時，以及半導體晶片的小型化 ，結果使得發熱密度具有急速增大之傾向，因此提升散熱 器之性能（亦即，提高散熱翼片的細密度化，以使底板呈 熱管（heat pipe )化）成爲當務之急之狀況下，特別是對 於上述散熱器減少各部分之溫度差，強烈要求提高散熱效 率。 如上所述，以壓出成型之以鋁一體成型之散熱器，因 在成型技術上有困難，散熱翼片間距的細密化有其極限， 所以散熱翼片之數量乃被限定，而具有無法充分獲得散熱 效果之問題點。再者，盡管銅製底板其具有優異熱傳導性 ，但因重量大，而具有難以使用之問題。因此，對於將散 本紙張尺度逍用中國國家標準（CNS ) A4規格（210X297公釐） -6- 經濟部智慧財產局員工消費合作社印製 519866 A7 B7 五、發明説明（4) 熱翼片部以機械方式接合在鋁製底板之另一面所製作之散 熱器而言，是被強烈期望要更加提升散熱器之散熱效率。 然而’對於將散熱翼片部以機械方式接合在銘製底板 之另一面所製作之散熱器而言，在底板、或在散熱翼片之 各部分上依然存在有溫度差，而有散熱效率上之問題。 【發明之要旨】 本發明之具翼片之散熱器，是將由至少2種不同熱傳 導性質之金屬材料所製作之散熱翼片予以組合之散熱翼片 群’以及將上述散熱翼片群以高密度接合之金屬製底板材 所構成之具翼片之散熱器。 【發明之實施形態及實施例】 對於本發明之具翼片之散熱器之形態，參照圖面詳細 說明如下。 本發明者，在反覆累積可解決上述先行問題點之先進 硏究下。結果，發現到以使用不同熱傳導性的2種金屬來 製作散熱翼片，藉由在靠近半導體等發熱元件處，配置以 熱傳導性高之金屬所製作之散熱翼片，而在其他部分則配 置以相對熱傳導性較低之金屬所製作之散熱翼片，來減少 底板的溫度差，對於配置在靠近半導體等發熱元件之散熱 翼片本身，藉由使用熱傳導性高之金屬，而能夠減少溫度 差。 亦即，作爲底板者，是使用鋁製之底板，藉由對於配 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） I 批衣 訂 線 (請先閲讀背面之注意事項再填寫本頁) 519866 經濟部智慧財產局員工消費合作社印製 A7 _ B7_____五、發明説明（9 置在靠近半導體等發熱元件之散熱翼片是使用銅材料，再 者，對於配置在其他部分處之散熱翼片則使用鋁材料，而 能夠於底板及散熱翼片，縮小溫度差距’而提高熱效率。 本發明之一目的，是在於提供一種可克服以往之問題 點，將以高密度所配置的多數片散熱翼片部’藉由接合於 鋁製底板之另一面所製作之散熱效率優異之散熱器，尤其 是使底板以及散熱翼片之各部分縮小溫度差’且量輕之散 熱器。再者，本發明之目的，是在提供一種設計自由度高 、加工性優良、低成本之散熱器。 本發明之具翼片之散熱器之一實施形態，是藉由將至 少2種不同熱傳導性質之金屬材料所製作之散熱翼片予以 組合之散熱翼片群，以及將上述散熱翼片群以高密度接合 之金屬製底板材所構成之具翼片之散熱器。 在本發明之具翼片之散熱器，是使上述金屬製底板及 上述散熱翼片以減少溫度差之方式，來配置形成上述散熱 翼片群的各個散熱翼片。 在本發明之具翼片之散熱器，於上述散熱翼片群之中 ，至少在靠近發熱元件部位所配置之散熱翼片是由銅材料 所成之散熱翼片。 在本發明之具翼片之散熱器之另一實施形態，是由： 在一面是貼合於發熱元件之金屬製底板材，以及插入在上 述金屬製底板材之另一面所設的複數個溝部之複數片薄板 狀金屬製翼片所構成，之具翼片之散熱器。該複數片薄板 狀金屬製翼片，是使上述溝部與溝部之間之上述金屬底板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29?公釐） ~ -8 - (請先閲讀背面之注意事項再填寫本頁) 裝· 、訂 -線_ 519866 A7 經濟部智慧財產局員工消費合作社印製 B7五、發明説明（Θ 材的一部分，藉由沖壓而被加壓變形，由兩側所壓塡而與 上述金屬製底板材一體形成之至少由2種材料所構成的複 數片薄板狀金屬製翼片。 在本發明之具翼片之散熱器中，上述金屬製翼片是由 2種類的金屬板材料所成，位於靠近上述發熱元件之安裝 部位置之上述金屬製翼片，是比位於其他部分之金屬製翼 片，由較高之熱傳導率之材料所成。 在本發明之具翼片之散熱器中，上述2種類的金屬板 材料，是由銅及鋁材所成，位於靠近上述發熱元件之安裝 部位置之上述金屬製翼片是由銅材所成，而位於其他部分 之金屬製翼片是由鋁材料所成。 - 在本發明之具翼片之散熱器中，上述金屬製底板材是 由鋁材所成。 在本發明之具翼片之散熱器中，由上述銅材所成之散 熱翼片，對於散熱翼片整體之比率是在2 5〜7 5%的範 圍內。 第1圖，是顯示本發明之具翼片之散熱器之一實施形 態。如第1圖所示，本發明之散熱器1，是由鋁材所成之 底板材2以及散熱翼片所構成。該散熱翼片，是分別插入 於設置在由鋁材所成之底板材上的多數溝部，藉由沖壓使 上述溝部與溝部之間之底板材部分被加壓變形，從兩側壓 塡而與底板材以機械方式一體形成者。又該散熱翼片部’ 是由配置在底板材中央部之銅製散熱翼片4，以及配置在 銅製散熱翼片兩側之鋁製散熱翼片3所構成。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) •裝· _ 訂 線- -9 - 經濟部智慧財產局員工消費合作社印製 519866 A7 B7____ 五、發明説明（7) 第2圖，是顯示本發明之具翼片之散熱器之另一實施 形態。與第1圖所示相同樣地’從第2圖可淸楚顯示’本 發明之散熱器1 ’是由鋁材所成之底板材2以及散熱翼片 所構成。該散熱翼片’是分別插入於設置在由纟S材所成之 底板材上的多數溝部，藉由沖壓使上述溝部與溝部之間之 底板材部分被加壓變形’從兩側壓夾而與底板材以機械方 式一體形成者。又該散熱翼片部’是由配置在底板材中央 部之銅製散熱翼片4，以及配置在銅製散熱翼片兩側之鋁 製散熱翼片3所構成。在第1圖所示之形態與在第2圖所 示之形態，有不同的銅製翼片數量’在第2圖所示之形態 中，銅製翼片之數量較多。 在上述之形態中，底板材與散熱翼片之接合雖是藉由 機械方式進行接合，但亦能以其他諸如錫焊、銀焊、熔接 等方式接合。 第3圖，是顯示在散熱翼片當中，銅製散熱翼片之比 率（也就是在散熱翼片整體中，銅製散熱翼片所佔之比率 )與熱阻抗之間的關係圖表。第3圖之縱軸爲熱阻抗，橫 軸爲銅製散熱翼片之比率（copper fin ratio) ( % )。由 第3圖可明白，銅製散熱翼片之比率爲零時，熱阻抗最大 。銅製散熱翼片之比率爲1 0 0 %時，熱阻抗最小。亦即 ，熱阻抗，是在銅製散熱翼片比率從零到銅製散熱翼片比 率爲1 0 0 %之間，隨著銅製散熱翼片比率的增加而下降 〇 此外，（圖示省略）在銅製散熱翼片比率從零到銅製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 一 — i I I I I I n I I I I I n 訂 I I ϋ ϋ I (請先閲讀背面之注意事項再填寫本頁) -10- 經濟部智慧財產局員工消費合作社印製 519866 A 7 B7 五、發明説明（9 散熱翼片比率爲1 〇 〇 %之間’隨著銅製散熱翼片比率的 增加，重量亦增加，所隨之製造成本亦增加。在銅製散熱 翼片比率未達2 5%時，熱阻抗變大，使得散熱器之熱效 率下降。另一方面，若銅製散熱翼片比率超過7 5%時， 由於熱阻抗顯著降低、重量增加、成本增大，使得熱阻抗 降低在效果上相對變小。 因此，銅製散熱翼片之比率’以在2 5%〜7 5%之 範圍內爲理想。 如上所述，於本發明之散熱器中，在靠近半導體晶片 等之安裝部之散熱翼片，以較其他部分之散熱翼片爲熱傳 導率較高之材質，亦即，靠近半導體晶片等之安裝部之散 熱翼片以銅製，其他部分之散熱翼片以鋁製爲理想。 用於本發明之散熱器，作爲底板材之鋁材可使用 A 1〇5 0、A 6 0 6 3、A 5 0 5 5 ，特別是以純鋁（ A 1 〇 5 0 )爲理想。 作爲本發明之銅製散熱翼片所使用之銅材，可使用 Cl〇2〇、C1 100 ，其中特別是以C1020爲理 想。又，鋁製之散熱翼片，以與鋁製底板材爲相同材料爲 理想。 實施例 以下，藉由實施例更詳加說明本發明。 如第1圖所示，製作長8 0mm、寬6 5mm、厚5 mm之鋁製底板材。在鋁製底板材之另一面形成有用以插 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） I-------1¾衣------1T------0 (請先閲讀背面之注意事項再填寫本頁) -11 - 519866 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（d 入散熱翼片的多數溝部，於各溝部各別插入厚0 · 6 m m 、高3 Omm之銅製散熱翼片與鋁製散熱翼片，散熱翼片 之間距爲2 m m，藉由沖壓將溝部與溝部之間之底板材部 分加壓變形、塡壓而機械性接合。散熱翼片，合計是由 3 0片散熱翼片所成，其中在基底構件之中央部配置有 1 6片銅製散熱翼片，於其兩側分別配置7片鋁製散熱翼 片。 在設有與如此所製作之散熱器基底構件之散熱翼片之 面爲相反側之面的中央部，配置2 0 m m方型半導體晶片 來調查其散熱狀況。 爲了比較，與第1圖所示相同樣地，製作了長8 0 mm、寬6 5mm、厚5mm之銘製底板材。在錦製底板 材之另一面形成有用以插入散熱翼片的多數溝部，於各溝 部各別插入厚〇.6mm、高30mm之鋁製散熱翼片， 散熱翼片之間距爲2 m m，藉由沖壓將溝部與溝部之間之 底板材部分加壓變形、塡壓而機械性接合。散熱翼片，合 計是由3 0片鋁製散熱翼片所成， 在設有與如此所製作之散熱器基底構件之散熱翼片之 面爲相反側之面的中央部，配置2 0 m m方型半導體晶片 來調查其散熱狀況。 結果，對於在本發明之鋁製基底構件中央部配置1 6 片銅製散熱翼片，而在其兩側配置7片鋁製散熱翼片之散 熱器，與將3 0片鋁製散熱翼片配置在比較用之鋁製基底 構件中央部之散熱器相比較之下，冷卻空氣溫度與晶片表 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ -12- I I I ϋ n 訂 I I I 線 (請先閲讀背面之注意事項再填寫本頁) 519866 經濟部智慧財產局員工消費合作社印製 A7 B7___ 五、發明説明（1)0 面溫度間之熱阻抗降低了 0 . 0 3 °C / W。 由上述可明瞭，依據本發明，可得到重量減輕、製造 成本降低、同時熱效率優異之散熱器。 在上述之實施例中，是顯示將散熱翼片以等間隔地配 置在散熱翼片間距爲2 m m之底板材上之例示，但也可以 變化散熱翼片之間隔，來縮小底板材及散熱翼片中之溫度 差。 如上述般地，依據本發明，能夠提供藉由將至少2種 不同熱傳導性質之金屬材料所製作之散熱翼片予以組合之 散熱翼片群，以高密度接合於金屬製底板而製作出散熱效 率優異之散熱器，尤其是在底板及散熱翼片各部分之溫度 差異小，且輕量之散熱器。 並且，藉由適切地選擇底板材及散熱翼片群之金屬材 料，能夠提供設計自由度高、加工性優良之低成本散熱器 【圖面之簡單說明】 第1圖是本發明之具翼片之散熱器之一實施形態。 弟2圖是本發明之具翼片之散熱器的另一實施形態。 第3圖是散熱翼片中，銅製散熱翼片之比率與熱阻抗 之間的關係。 弟4圖是藏7[^接合於半導體晶片等之散熱器圖示。 主要元件符號對照表 本紙張尺度適用中國國家標準（CNS )八4胁（21〇Χ297公釐） ' -13- 裝 訂 線 (請先閲讀背面之注意事項再填寫本頁) 519866 A7 B7 五、發明説明（1>1 1 散熱器 2 底板材 3 鋁製散熱翼片 4 銅製散熱翼片 2 2 底板 3 0 半導體晶片 (請先閲讀背面之注意事項再填寫本頁) •裝· 訂 線_ 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -14-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 519866 A7 _ _ B7 V. Description of the Invention (1) [Technical Field of the Invention] The present invention relates to a heat sink used for cooling electronic equipment, especially a metal base plate and a heat sink. The fin part is connected with a finned heat sink. [Advanced Technology] In order to dissipate the heat generated by the semiconductor wafers of electronic devices that have increased significantly every year, it is generally familiar to place the heat sink closely on the semiconductor wafer and transfer the heat of the semiconductor wafer to the heat sink. Cooling method. Conventional heat sinks have a flat plate-shaped base plate made of metal to be closely adhered to a semiconductor wafer. On the side opposite to the surface of the semiconductor wafer on the base plate, a plurality of metal thin plates are provided. Airfoil structure. In the heat sink thus structured, the heat generated from the semiconductor wafer is conducted to the whole of the bottom plate through the bottom plate arranged closely to the semiconductor wafer, and the heat spread to the bottom plate is thus diffused, and then the heat generated by the bottom plate is mounted on the bottom plate. The cooling fins dissipate heat into the atmosphere or a specific space. The radiator used in the past is an aluminum-made radiator that is formed by extrusion molding. However, it is quite difficult to reduce the distance between the radiating fins of the heat sink of the aluminum integrated molded product that is extruded and molded. Since the distance between the radiating fins is limited, there is a limit. When the number of cooling fins is limited to a state that cannot meet the required number, there is a problem that the cooling effect cannot be fully obtained. In order to solve the above problems and achieve better heat dissipation effect, the paper size of the paper is applicable to Chinese National Standard (CNS) A4 (210 X297 mm). I batch order (please read the precautions on the back before filling this page) ) -4-519866 Printed by A7 B7_, Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. V. Description of the invention The produced fin part is bonded to the other side of the base plate by soft welding or mechanical method. However, because of the high manufacturing cost by the soft welding method, the radiating fin portion is mechanically bonded. On the other side of the bottom plate, it is more advantageous. As shown in Figure 4, the size of the semiconductor wafer 30 and the bottom plate 22 is larger than that of the bottom plate 22, and the semiconductor wafer 30 is much smaller than the bottom plate 22. Therefore, it is necessary to Materials such as copper and aluminum with good thermal conductivity are used as the substrate, and heat from smaller semiconductor wafers is transmitted to the entire large substrate. Especially copper, because of its excellent thermal conductivity, can be used as The base material of the heater is widely known. However, the weight (density) of copper is large and it must be directly tightly bonded to the semiconductor wafer. Therefore, for the load of the copper base plate, it must also have resistance to reduce damage to the semiconductor wafer. Strength structure (for example, parts mounting tools used for circuit boards). Furthermore, with the reduction in weight and size of electronic equipment, not only can a heavy copper base plate be used, but it is difficult to secure a space. Therefore, it is increasingly difficult to use copper substrates. But on the other hand, with the increasing accumulation of semiconductor wafers and the increase in processing capacity, the amount of heat generated by semiconductor wafers has increased. In order to make semiconductor wafers, etc. Stable and normal operation requires better and better heat dissipation. As mentioned above, although the copper baseplate has excellent thermal conductivity, it is difficult to use due to its heavy weight. Therefore, in the current situation, when using the substrate as the material of the baseplate In this case, it is necessary to meet the requirements for a higher heat dissipation effect of the heat sink. Another paper size mechanically bonded to the bottom plate is common Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)-Binding · Thread · 519 866 A7 B7 V. Description of the invention (9 (Please read the precautions on the back before filling in this page) The heat distribution in the base plate under the steady state of heat dissipation on the surface of the heat sink is based on the base plate on which the semiconductor wafer is installed The center part is the highest temperature. The temperature decreases as it leaves the semiconductor wafer. Therefore, it is bonded to the other side of the base plate so that the plurality of heat-dissipating fins that are thermally conductively connected are located at the center portion of the base plate on which the semiconductor wafer is mounted. The temperature of the cooling fins is the highest, and the temperature of the cooling fins that are farther away from the end of the central portion of the bottom plate is lower. Furthermore, there is a temperature distribution in the height direction of the radiating fins, and the temperature of the base of the thermal fins joining the bottom plate by heat conduction is the highest. As the distance from the base is farther, the temperature of the radiating fins becomes lower. This is due to the movement of heat within the heat sink fins, which conducts heat through solids. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs However, from the viewpoint of heat dissipation efficiency, it is expected that the temperature difference between the various parts of the radiator should be as small as possible. However, from the past, as mentioned above, as the amount of heat generated by semiconductor wafers increases and the size of semiconductor wafers becomes smaller, as a result, the heating density tends to increase rapidly, so the performance of the heat sink is improved (that is, heat dissipation is improved). In order to reduce the thickness of the fins so that the bottom plate becomes a heat pipe, it is urgent to reduce the temperature difference between the various parts of the heat sink, especially to improve the heat dissipation efficiency. As mentioned above, the heat sink made of aluminum integrally formed by extrusion molding has difficulties in molding technology, and there is a limit to the reduction of the pitch of the cooling fins. Therefore, the number of the cooling fins is limited, and it is not sufficient. The problem of obtaining cooling effect. Moreover, although the copper base plate has excellent thermal conductivity, it has a problem of being difficult to use due to its heavy weight. Therefore, for the use of loose paper sizes in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm) -6- printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 519866 A7 B7 V. Description of the invention (4) Hot-wing film department For a heat sink made by mechanically bonding to the other side of an aluminum base plate, it is strongly expected to further improve the heat dissipation efficiency of the heat sink. However, for a heat sink made by mechanically joining the heat sink fin portion to the other side of the engraved base plate, there is still a temperature difference on the base plate or each part of the heat sink fin, and there is heat dissipation efficiency. Problem. [Summary of the invention] The finned radiator of the present invention is a group of radiating fins combining radiating fins made of at least two metal materials with different thermal conductivity properties, and the above-mentioned radiating fins group has a high density. Finned heat sink made of bonded metal base plates. [Inventive Embodiments and Examples] The form of the finned radiator of the present invention will be described in detail with reference to the drawings. The present inventors have made advanced researches on iterative accumulation that can solve the foregoing problems. As a result, it was found that two types of metals with different thermal conductivity were used to make the heat sink fins. The heat sinks made of a metal with high heat conductivity were arranged near heat-generating components such as semiconductors, while other parts were arranged with The heat dissipation fins made of metal with relatively low thermal conductivity can reduce the temperature difference of the base plate. For the heat dissipation fins arranged near heating elements such as semiconductors, the temperature difference can be reduced by using a metal with high thermal conductivity. That is, as the bottom plate, the aluminum base plate is used. By applying the Chinese National Standard (CNS) A4 specification (210 X297 mm) for the paper size, I batch of clothing threads (please read the precautions on the back before filling This page) 519866 Printed by A7 _ B7_____ of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (9 The heat sink fins located near the heating elements such as semiconductors are made of copper. The heat dissipation fins are made of aluminum, which can reduce the temperature difference between the base plate and the heat dissipation fins and improve the thermal efficiency. One object of the present invention is to provide a high-density structure that can overcome the problems of the past. The heat-dissipating fin portion is a heat sink having excellent heat dissipation efficiency by being bonded to the other side of the aluminum base plate, especially a heat sink that reduces the temperature difference between the base plate and the heat-dissipating fin portion. The object of the present invention is to provide a heat sink with high design freedom, excellent processability and low cost. The form is a wing group consisting of a combination of radiating fins made of at least two metal materials with different thermal conductivity properties, and a wing composed of a metal bottom plate that joins the above radiating fin groups with high density. The heat sink with fins. In the heat sink with fins of the present invention, each of the heat dissipation fins forming the heat dissipation fin group is arranged by using the metal base plate and the heat dissipation fins to reduce the temperature difference. The finned radiator of the invention, among the above-mentioned finned groups, at least the fins arranged near the heating element are fins made of copper material. The finned heat dissipation in the present invention Another embodiment of the device is composed of: a metal base plate attached to a heating element on one side, and a plurality of thin plate-shaped metal wings inserted into a plurality of grooves provided on the other side of the metal base plate. A heat sink with fins. The plurality of thin-plate-shaped metal fins make the above-mentioned metal base plate between the groove part and the groove part. CNS) A4 specification (210X29? Mm) ~ -8-(Please read the precautions on the back before filling in this page) Assembling, ordering-line _ 519866 A7 Printed by B7 of the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives Explanation (A part of the Θ material is pressurized and deformed by punching. It is formed by pressing at both sides and integrated with the above-mentioned metal base plate. A plurality of thin-plate-shaped metal wings made of at least two materials. In the finned radiator of the present invention, the metal fin is made of two types of metal plate materials, and the metal fin is located closer to the mounting portion of the heating element than the metal located in other parts. The fins are made of materials with high thermal conductivity. In the finned heat sink of the present invention, the above two types of metal plate materials are made of copper and aluminum, and are located near the heating element. The aforementioned metal fins at the mounting portion are made of copper, while the metal fins at the other portions are made of aluminum. -In the finned radiator of the present invention, the metal base plate is made of aluminum. In the heat sink with fins of the present invention, the ratio of the heat radiating fins made of the above-mentioned copper material to the entire heat radiating fins is in the range of 25 to 75%. Fig. 1 shows an embodiment of a finned heat sink according to the present invention. As shown in Fig. 1, the heat sink 1 of the present invention is composed of a base plate 2 made of aluminum and a heat dissipation fin. The radiating fins are respectively inserted into a plurality of groove portions provided on a bottom plate made of aluminum material, and the bottom plate portion between the groove portion and the groove portion is pressurized and deformed by pressing, and is pressed from both sides to contact The bottom plate is mechanically integrated. The radiating fin portion 'is composed of a copper radiating fin 4 arranged at the center of the bottom plate and aluminum radiating fins 3 arranged on both sides of the copper radiating fin. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) • Packing · _ Thread--9-Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 519866 A7 B7____ 5. Explanation of the invention (7) Figure 2 shows another embodiment of the radiator with fins of the present invention. As shown in Fig. 1, "the heat sink 1" according to the present invention is clearly shown in Fig. 2 and is composed of a bottom plate 2 made of aluminum and a heat sink fin. The radiating fins are inserted into a plurality of groove portions provided on the bottom plate made of 纟 S material, and the bottom plate portion between the groove portion and the groove portion is pressurized and deformed by pressing. Mechanically integrated with the bottom plate. The radiating fin portion 'is composed of a copper radiating fin 4 arranged at the center of the bottom plate, and aluminum radiating fins 3 arranged on both sides of the copper radiating fin. There are different numbers of copper fins in the form shown in Fig. 1 and the form shown in Fig. 2. In the form shown in Fig. 2, the number of copper fins is large. In the above-mentioned form, although the joining of the bottom plate and the radiating fins is performed mechanically, they can also be joined by other methods such as soldering, silver welding, or welding. Figure 3 is a graph showing the relationship between the ratio of copper cooling fins (that is, the ratio of copper cooling fins to the total cooling fins) and the thermal resistance among the cooling fins. The vertical axis of Figure 3 is the thermal impedance, and the horizontal axis is the copper fin ratio (%) of the copper-made heat sink. It can be seen from Fig. 3 that when the ratio of the copper cooling fins is zero, the thermal resistance is the largest. When the ratio of copper cooling fins is 100%, the thermal resistance is the smallest. That is, the thermal resistance is between zero and 100% of the copper cooling fins, and decreases with the increase of the copper cooling fin ratio. (The illustration is omitted) The cooling fin ratio is from zero to copper. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). I — i IIIII n IIIII n Order II ϋ ϋ I (Please read the precautions on the back before filling this page) -10- Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives 519866 A 7 B7 V. Description of the invention (9 The ratio of cooling fins is between 100% 'As the ratio of copper cooling fins increases, the weight also increases. As a result, manufacturing costs also increase. When the ratio of copper cooling fins is less than 2 5%, the thermal resistance becomes larger, which reduces the thermal efficiency of the heat sink. On the other hand, if the ratio of copper cooling fins exceeds 7 5%, The significant reduction in impedance, weight increase, and cost increase make the thermal impedance reduction relatively small in effect. Therefore, the ratio of the copper heat sink fin is preferably in the range of 2 5% to 7 5%. As mentioned above, In the heat sink of the present invention, the radiating fins near the mounting portion of the semiconductor wafer and the like are made of a material having higher thermal conductivity than the radiating fins of the other portions, that is, the radiating fins near the mounting portion of the semiconductor wafer and the like. It is made of copper, and the other parts of the cooling fins are preferably made of aluminum. For the heat sink of the present invention, the aluminum material used as the bottom plate can be A 1 0 0 0, A 6 0 6 3, A 5 0 5 5, especially Ideally, it is pure aluminum (A 1050). As the copper material used for the copper heat-dissipating fins of the present invention, Cl020 and C1 100 can be used, and C1020 is particularly preferable. In addition, aluminum The heat sink fin is preferably made of the same material as the aluminum base plate. Examples The following describes the present invention in more detail by way of examples. As shown in FIG. 1, a length of 80 mm, a width of 65 mm, and a thickness of 5 mm are produced. Aluminum base plate. It is formed on the other side of the aluminum base plate to be inserted into this paper. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) I ------- 1¾ clothing ----- -1T ------ 0 (Please read the notes on the back before filling this page) -11-519866 Ministry of Economic Affairs Printed by A7 B7 of the Consumer Cooperative of the Property Bureau V. Description of the invention (d) Most grooves of the cooling fins are inserted into copper grooves and aluminum fins with a thickness of 0.6 mm and a height of 3 Omm. The distance between the cooling fins is 2 mm, and the bottom plate part between the groove part and the groove part is pressurized and deformed and pressed mechanically by pressing. The cooling fins are made up of 30 cooling fins in total, of which Sixteen copper cooling fins are arranged at the center of the base member, and seven aluminum cooling fins are arranged on both sides of the base member. A 20-m square semiconductor wafer was placed in the central portion of the surface on the side opposite to the surface of the heat-dissipating fin of the heat-radiating base member produced in this manner, and the heat-dissipating condition was investigated. For comparison, in the same manner as that shown in Fig. 1, a bottom plate with a length of 80 mm, a width of 65 mm, and a thickness of 5 mm was produced. On the other side of the brocade bottom plate, a plurality of grooves for inserting heat sinking fins are formed, and aluminum heat sinking fins having a thickness of 0.6 mm and a height of 30 mm are inserted into each groove part. The distance between the heat sinking fins is 2 mm. Pressing mechanically joins the bottom plate portion between the groove portion and the groove portion by pressing and pressing. The heat radiating fins are made up of 30 aluminum heat radiating fins in total, and a 20 mm square is arranged at the center of the surface on the side opposite to the surface of the heat radiating fins of the heat sink base member thus produced. Type semiconductor wafer to investigate its heat dissipation. As a result, a heat sink having 16 copper fins disposed at the central portion of the aluminum base member of the present invention, and 7 pieces of aluminum radiating fins disposed on both sides thereof, and 30 aluminum radiating fins disposed In comparison with the radiator of the central part of the aluminum base member for comparison, the cooling air temperature and the paper surface of the wafer are applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ -12- III ϋ n Order III (Please read the precautions on the back before filling this page) 519866 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7___ V. Description of the invention (1) The thermal resistance between the surface temperature has been reduced by 0. 0 3 ° C / W. As is clear from the above, according to the present invention, a heat sink with reduced weight, reduced manufacturing cost, and excellent thermal efficiency can be obtained. In the above-mentioned embodiment, an example is shown in which the heat-dissipating fins are arranged at equal intervals on the base plate with a space of 2 mm between the heat-dissipating fins, but the interval of the heat-dissipating fins can be changed to reduce the base plate and the heat-dissipating wings The temperature difference in the film. As described above, according to the present invention, it is possible to provide a heat dissipation fin group by combining heat dissipation fins made of at least two kinds of metal materials with different thermal conductivity properties, and bonding to a metal base plate at a high density to produce heat dissipation efficiency. Excellent heat sink, especially the light-weight heat sink with small temperature difference between the bottom plate and the fins. In addition, by properly selecting the bottom plate and the metal material of the cooling fin group, a low-cost heat sink with high design freedom and excellent processability can be provided. [Simplified description of the drawing] FIG. 1 is a fin with the fin of the present invention An embodiment of the radiator. Figure 2 is another embodiment of the finned radiator of the present invention. Figure 3 shows the relationship between the ratio of copper cooling fins and the thermal resistance among the cooling fins. Figure 4 is an illustration of a heat sink that is mounted on a semiconductor wafer. Main component symbol comparison table The paper size is applicable to the Chinese National Standard (CNS) Ya 4 Taki (21〇 × 297 mm) Description (1 &1; 1 1 radiator 2 bottom plate 3 aluminum cooling fin 4 copper cooling fin 2 2 bottom plate 3 0 semiconductor chip (please read the precautions on the back before filling this page) The paper size printed by the Intellectual Property Bureau employee consumer cooperative is applicable to Chinese National Standard (CNS) A4 (210X297 mm) -14-