TW517397B - Image sensor package having sealed cavity over active area - Google Patents

Abstract

An image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support. The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.

Description

517397 V. Description of the invention (1) Generally speaking, the image sensor of the present invention includes a barrier or distortion which can prevent the active area image sensor. Pollution and scratch-sensors are the way to reduce economics. Update in the active area of this window. On the top of the device's image sensor, when these are singularized, the image is contained in one of the windows of the device. In other words, the example device is based on a single cut, which reduces the damage of the injured image and the higher image. Fortunately, the image sensor is printed with a closed image and is familiar with image sensing. It can be used to detect, for example, a silicon crystal from a silicon wafer to focus on the image, but the sensor is damaged or destroyed. In the sensor combination, the transmission penetrating sensor is used for the image sensing of the loading board motherboard seal. The technology related to the electrical detector is manufactured by the dust of the electrical appliance. On the circle. Like sensing, there is active destruction of silicon chips, and the system is packaged with sub-components. The details of the pollution in the magnetic light shooting area are more detailed, and the inclination of the production area of the device to each other is unimportantly important. To create an image sense To avoid it, it is 〇 but the window and shot into the image sense and the radiation responds. After the device is mounted on a printed circuit board, the casing surrounds the image. This casing provides a surrounding area for the image and supports the image sensor at the same time. As the technology progresses towards smaller and lighter electronic devices, the size of the image sensor assembly used must be small and separated. Ran. These are. Its junction reduces the yield of the package. More detailed knowledge. A response. Electromagnetic radiation is required. Most of the image wafers are singular, and there are, in the chipping effect image, the image sensor group is located to support a sensor.

517397 V. Description of invention (2) becomes more important. Disadvantageously, the above-mentioned conventional image sensor must have a housing to support its window, and hermetically seal the image sensor. Moreover, the size of this case is relatively large, extending upward from the printed circuit board to a considerable distance, for example, 〇 丨 〇〇inch (2.54 cm) to 0. 120 inches (3.05 cm) or above. As a result, the size of the image sensor assembly is relatively large. . Another important feature of the image sensor is the temperature at which condensation forms in the housing of the image sensor assembly, that is, the dew point of the image sensor assembly. In detail, in order to ensure satisfactory function of the image sensor combination over a wide temperature range, it is essential to have a low dew point. -According to the current month, the package of the image sensor includes an image sensor. The image sensor has a non-critical area with a soil surface formed on it. The active area covering 5 is supported by a window, which takes 0% to support the non-critical area. = Private window support and image, and the active area is located inside the hole. Each male sealed hole area is located inside the hole. That is, the active hole is Γο y, ^ Ν, and the breach hole hole is sealed to protect the trout. + £, it is free from foreign, insects, and deer. Active and wet milk, dust, and pollution. ^ Π In the prior art, Windows 俜 utilizes, is supported on the top of the image sensor and: the system is supported by a shell. The image sensor according to the present invention is equipped with expensive ceramics, which eliminates the need for a casing in the prior art

Page 6 Therefore, the shadow 517397

The image sensor package in the prior art has a significantly lower cost than the image sensor package. Moreover, the image feels a distance. Comparing with the package, the distance can be relatively large. Because of the thin ground, the small electrons are required. Because the window is a measuring device, the window and 'sometimes called z height is higher than that of the prior art to form a relatively thin, advanced technology, and from the printed image the shadow image according to the present invention The sensor package can be mounted, so that with the window support portion, the 'can be formed relatively small between directly attached to the upper surface of the image sensor. Its combination of image sensor, the image sensing 〇

The image sensor assembly, whose shell volume circuit mother board extends upward to a considerable distance, the image sensor package can be formed relatively well to be suitable for light, thin, short, thin and light image sensor assembly needs Or, because the Z height is relatively small, the volume of the hole is also small. By minimizing the hole, the moisture trapped in the hole is minimized. At this point, in turn, moisture condensation is basically avoided on the inner surface of the window, or on the active area of the image sensor. As a result, the image sensor package according to the present invention has a very low or non-existent dew point. On the contrary, the image sensor combination in the prior art has an obvious $ point, that is, it is used to cover the image sensor and support the formation of the condensate in the casing. temperature. Since the shell is relatively bulky and has a relatively large volume of air inside, moisture tends to be trapped in the shell and condense on the inner surface of the window, or the

Page 7 517397 V. Description of the invention (4) On the active area of the image sensor. To avoid this condensation, it is necessary to avoid exposing the image sensor assembly to extreme low temperatures. Disadvantageously, this limits the temperature range at which the image sensor combination can perform its function satisfactorily. Alternatively, the image sensor combination may be manufactured in a low-humidity environment to prevent moisture from being trapped inside the housing, and the housing is hermetically sealed to keep the moisture outside. This additional complexity has increased the cost of the image sensor assembly. Furthermore, if the hermetic seal fails, the image sensor will be damaged or destroyed. The low-temperature or high-temperature image sensor package also uses a window on the upper surface area. As much as possible, it includes reusing the ..., a μ package has a very non-existent dew point, and the image sensor The package can operate satisfactorily in a film wider than the film according to the invention compared to the film in the prior art. A method for making most image sensing. The method includes applying a non-critical area ' pads, and the non-critical area. By using the beads, a detector system is integratedly connected in one embodiment, and the method is standardized. Active zone protection of image sensor. More specifically, within the visual range, and, more specifically, the device combination is at a low temperature condition, according to the present invention, Yu hereby discloses one in one array to reduce the cost of beads in image sensing The upper surface of the device includes an active area and a plurality of f located on the active area and the pads are mounted on the image sensor. In this embodiment, the image sense is equal to the image sensor. According to the analysis of the majority of image sensors, yes = Yes, in the simplification, the self (together with the window support)

$ 8 pages 517397 V. Description of the invention (5) The window protects the active area from contamination and during simplification, such as scratches due to silicon debris. The window also protects the active area in the image reduction test package. As a result, the damage and destruction technology of the image sensor is reduced. Good M, and the packaging cost is two points compared with the previous one: the above number of sensor packages, which can realize the image of the array. Another advantage lies in ☆, manufacturing-the whole by reducing labor: and Japanese grapefruit, ¥, the use of materials is more efficient. The cost of borrowing the package t is extremely unexpected, and it is related to the details of the single-image sensing: its characteristics are more obvious from the following together with the attached drawings. view. Figure 2 is a partial cut-out side of the image sensor package according to the present invention, and the second figure c is a third figure according to the present invention; it is a cross-sectional view taken along line U'n in 1. In the fourth figure a, the first four enlarged sections of the sealed region 'area 111 are enlarged. In the embodiment, the fourth figure C is various real pictures according to the present invention. Sectional view of a single plate in the formation of a window in the evening number 1-Sectional view of the plate of Figure 4 in a later manufacturing stage 517397

/ \ In the first production, the sixth image, the first image, the lead frame, and the first wire are welded in a similar figure: a cross-sectional view of a structure of the image sensor package according to the present invention. Magic Zhu: The first, according to various embodiments of the present invention, is a cross-sectional view constructed in a more subsequent manufacturing stage. 妁 Z is a sensor assembly according to one embodiment of the present invention. Cross-section view. The j-pack is a cross-sectional view of a jacket-like sensor assembly according to another alternative embodiment of the present invention.

A cross-sectional view of a shirt-like sensor assembly according to yet another alternative embodiment of the present invention. = In the following description, the same or similar components are marked with the same or reference number. According to the present invention, an image sensor Feng Pei 00 (the first picture and the first picture A), hereinafter referred to as the package 100, includes an image sensor 102, which has an upper surface 102U, which An active area 104, 104 and a plurality of pads 106 are formed on the upper surface. The non-critical area ncr on the upper surface 1021] is located between the active area 104 and the pad 066. A window 11 covers the active area 'and is supported on the non-critical area NCR by a window support portion 08. The window 11 0 ′ and the window support portion 108 and the image sensor 102 define a sealed hole 118, and the active area 104 is located in the hole 118. In more detail, the active area 104 is located in the hole 118, and the hole is sealed to protect the active area 104 from external wetness.

Page 10 517397 V. Description of the invention (7)

Gas, dust, and pollution. Recall that in the prior art, the window system was supported by an outer raft above the image sensor. Usually, such a shell in a prior art is formed of relatively expensive ceramics. According to the invention, it is advantageous that its package 100 eliminates the need for a housing in the prior art. Therefore, the package 100 is significantly cheaper to manufacture than the image sensing assembly in the prior art. ° Furthermore, since the window 1 10 is directly attached to the image sensor 102, the window 110, and the upper surface 102u using the window support portion 08, sometimes called the Z height, it can be The formation is relatively small. As a result, the package 10/0 can be made relatively thin compared to the image sensor combination in the prior art. On the contrary, the image sensor combination in the prior art has a relatively large casing volume and extends upward from the printed circuit motherboard to a considerable distance. Since the package 100 can be formed relatively thin, the package 100 can be well-suited for light, thin, short, and small electronic devices, and there is a need for a thin and light image sensor combination. Furthermore, since the distance ZH is relatively small, the volume of the holes 1 18 is also relatively small. By minimizing the holes 1 1 8, the amount of moisture trapped in the holes 1 1 8 is also minimized. At this point, the condensation of moisture on the inner surface 1101 of the window 110 or the active area 104 of the image sensor 102 is substantially avoided. As a result, package 100 then has a very low, or non-existent, dew point. In contrast, the image sensor combination in the prior art has a clear

) i7397 V. Description of the invention (8) The apparent dew point, that is, a temperature at which condensation is formed inside the casing used to cover the image sensor. Because the volume of the casing is relatively large, and a relatively large volume of air is enclosed therein, the gas tends to be trapped in the casing and condense on the inner surface of the window, or the active of the image sensor Area. To avoid this condensation, it is necessary to avoid exposing the image sensor assembly to extreme low temperatures. Disadvantageously, this limits the range of temperatures at which the image sensor combination can perform its function satisfactorily. Alternatively, the image sensor combination may be manufactured in a low-humidity environment to prevent moisture from being trapped inside the housing, and the housing is hermetically sealed to keep the moisture outside. This additional complexity has increased the cost of the image sensor combination. Furthermore, if the hermetic seal fails, the image sensor will be damaged or destroyed. Since the package 100 has a very low or non-existing dew point, the package 100 can be in a wide temperature range, and, more specifically, the image sensor combination in the advanced technology of the car is low It operates satisfactorily under temperature conditions. According to the present invention, Yu hereby discloses a method for manufacturing a majority of the packaged 100: 6 TV "soap 1" to reduce costs. The method includes the application of a bead (the key is r / six figure) to a non-, product domain NCR1 of 102 U on the image sensor 102 surface. The upper surface 102U includes an active area 104A and a key area -1 is located between the active area 10 "and RnfiA ^. A window 110C (seventh figure A) is made of beads and contained in Image sensor 102a, beads 606A form a window support

517397 V. Description of Invention (9) " ------ Department 108C. In one embodiment, the image sensor 102A is one of a plurality of image sensors 102 integratedly connected to f. According to this implementation, the method further includes transforming the majority of the image sensors. The important "" when the soap is changed, the image sensor 1004 is protected by the window 110 (along with the window support portion 108). Eight P-dry one scratches. Window 1 10 is also packaged in subsequent wire bonding and / or packaging. As a result, the image sensor 丨 0 2's loss and yield is improved, and the sealing cost is compared to: window H0 protects the active area 104, (It is free from pollution, and :) During the transformation, for example, due to the debris of stone eve ...-follow-up processing of single 100, for example, to protect the active area 104 from injury or damage during formation. Therefore, the prior art is reduced. , Or, by forming a majority of the package 100 points at the same time. One of the advantages is that, in the same voice, Xia Xianyou Yougan rather than the individual processing and force σ: Handle and process most packages1. . , 軚 low. Another advantage is that the production of 10,000 knives is more efficient in the collection of materials. Borrow: of :: 100 hours, Caiping. In other words, the first figure is a side view according to the present invention. The second picture A is a sealed package according to the month of the present invention. , Cut The first same picture: ^ 1 line package 10 ° ○, the first picture and the second picture A, the sensor 102, which is sometimes referred to as a sensing device X. Package an image ~ Image sensor 1 〇 2 contains a

Page 13 517397 V. Description of the invention (10) Active areas 104, which are sometimes called image arrays. The active area 104 is located on one upper surface of the image sensor 102, for example, the first surface, 102 U, is above. In general, as known to those skilled in the art, the active area 104 can respond to radiation, such as electromagnetic radiation. For example, the active zone 104 can respond to infrared, ultraviolet, and / or visible light. For illustration, the image sensor 102 can be a CMOS image sensing device 'a charge-coupled device (CCD), a piezoelectric ceramic on CMOS, or an erasable programmable read-only memory device (EPROM) Although in other embodiments, other image sensors are used. The image sensor 102 further includes a plurality of pads 106, which are located on the upper surface 102U of the image sensor 102. The pads 106 are formed on the periphery of the upper surface 102U adjacent to the side surface 102 of the image sensor 102. The pad 10 is connected to the internal circuit of the image sensor 102. The active area 104 is inside the pad 106. A non-critical area n c R on the upper surface 1 2 U of the shirt image sensor 102 is located between the active area 104 and the pad 106. The non-critical area NCR system is formed into a square, for example, a square, surrounds the periphery of the active area 04, and is surrounded by the welding pad 106. A window support portion 108 is formed on the non-critical area NCR. In more detail, 'window support 丨 〇8 is attached to a non-critical area ... ^ for it to support,' and, in this embodiment, it is in contact with it, but does not extend super, active / zone 1 〇4 or pad 丨 〇6. In one embodiment, the window support 108 is transparent to the related radiation system, for example, it is φ & $! Π # 甘 θ _ ,, + 芏 动 区 1 with the image sensor 10 2 0 4 is transparent to its responsive radiation, such as

Page 14 W397 V. Description of the invention —----— Known to those skilled in the art. However, the window support portion 108 is not necessarily transparent, and in another embodiment, the window support portion 108 is opaque to the relevant radiation system. In this embodiment, the window support part 08 is an epoxy resin bead, for example, a bead formed of a B-stage epoxy resin, which is cured, that is, cured and gelled. Or make it sticky. In a special embodiment, the 'window support part is Masterbond 150, which is manufactured by Master Stick Company, 154 Hobart Street, Harkensack, 0760 1, New Jersey, USA, or Hysol 4451, as 9 1 746, California, USA, manufactured by Dixter Company, 1 515 Julian Road, East Party, Inster City. The window support portion 108 is in contact with and supports a window 11 〇 above the non-critical area NCR of the surface 〇2υ above the image sensor 102. The window 110 includes an inner surface, for example, a first surface, 11 mm, and an opposite outer surface, for example, a second surface, n oE. The inner surface 1101 is fixed to the window support 108, while the outer surface 110: is exposed to the surrounding environment. The window 1 10 further includes a side surface 1 10 s, which extends between the outer surface I 10E and the inner surface 1 101. In this embodiment, the window support portion 108 is in contact with the peripheral region PR of the inner surface 丨 丨!, But is not in contact with the side surface 110S. The peripheral region PR of the inner surface II 0 I is directly adjacent to the side surface 110 s and surrounds the central region CR of the inner surface 1101. The window 11 〇, more specifically, the central area CR of the inner surface 1101 of the window i J 〇 covers the active area. The window 1 10 is parallel to the upper surface 1 U 2 of the image sensor 102. More detailed

517397 V. Description of the invention (12) In other words, a plane defined by the inner surface 1101 (or outer surface 110E) is parallel to a plane defined by the upper surface 10 2 U of the image sensor 102. The window support portion 108 forms a seal between the peripheral region P R ′ of the inner surface 1101 of the window 110 and the non-critical region n c r of the upper surface 1 0 21 [of the image sensor 102. Thus, the window 1 10, the window supporting portion 108, and the image sensor 102 define a sealed hole 118. In more detail, the active area 104 is located in the hole 118, which is sealed to protect the active area 104 from external moisture, dust and pollution. Generally, the e 'hole 118 contains a medium 120' which is transparent to the relevant radiation, for example, the active area 104 of the image sensor 102 is transparent to the radiation that is responsive thereto. For example, if the relevant radiation is visible light, the medium 120 must have a low refractive index so that the medium does not reduce sensor cells in the active area 104, such as sensors equipped with color or microlenses Cell, efficiency. Furthermore, the media must not be physically defective, as it may cause spot defects in the received spatial light pattern. In one embodiment, the medium 120 is air. As those skilled in the relevant arts will understand, the window 丨 丨 is transparent to the relevant radiation, for example, the active area 104 of the image sensor 102 is transparent to the radiation that is responsive to it. In a special embodiment, the window ^ 〇 is a borosilicate glass. In general, the light transmittance of the window 110 and the medium 120 is a minimum necessary to allow the radiation required for the normal operation of the image sensor 102 to see through the window 110 and the medium 120. In use, the radiation system is pointed at the package 100 ^ familiar with related technologies

517397 V. Inventor (13) knows in detail that this radiation penetrates the window 丨 丨 0 and the medium 1 2 0, and enters the active area 104, which responds to the radiation. However, in another alternative embodiment, the active area 104 of the image sensor 102 can emit radiation such as electromagnetic radiation. For example, the image sensor 2 could be a light emitting diode (LED) microdisplay. According to this embodiment, the radiation emitted from the active area 104 passes through the medium 120 and the window 1 10 and is emitted from the package 〇〇〇. For the sake of simplicity, in the discussion above and below, the active area 〇〇 4 is set as a receiver of radiation. However, according to this disclosure, those skilled in the relevant art should recognize that, in general, the active area 104 is a receiver of radiation, a transmitter of radiation, or a transceiver, that is, a transmitter of radiation As well as the receiver. . Since the window 11 〇 is directly attached to the image sensor 0 2 using the window support 1 08, a distance z jj, which is sometimes referred to as z 冋, from 11 〇 and the upper surface 〇 2 u, can be formed Is relatively small. For illustration, the distance is in the range of about 0.003 to 0.08 inches (0.08 to 025 mm). The package 100 can be formed thinner than the image sensing in the prior art. For illustration, the package 100 can easily reach a thickness of 0 39 inches (1.0 mm) or less. h Ϊ ί, the image sensor combination in the prior art, the casing volume nf extends from the printed circuit motherboard up to a considerable distance or ΐ. From thermal 100 inches (2.54 mm) to 0.120 inches (3.05 mm) Good for use in f-pack 100 can be formed relatively thin 'package 100 can be thin, short, small electronic devices, which are rare for thin The needs of the two-shirt-like sensor combination.

517397 V. Description of the invention (14) Since the distance ZH is relatively small, the volume of the holes 1 and 8 is also phase J]. By minimizing the volume of the holes 11 8, the gas trapped in the holes 11 § can also be minimized. This approach further eliminates the possibility of moisture condensing on the inner surface of the window 110, or the possibility of active 104 of the image sensor. As a result, the package has a very low dew point that does not exist. In contrast, the image sensor combination in the prior art has a significant dew point, that is, a temperature at which the image sensor is covered by the image sensor and a condensate is formed in the casing of the window. Because the shell system is relatively large, and a relatively large volume of air moisture will tend to trap inside the shell and condense on the side of the window 'or the active area of the image sensor . To avoid this condensation, the image sensor must be prevented from being combined at extremely low temperatures. Disadvantageously, this approach limits the range of temperatures at which the image can be satisfactorily performed. Alternatively, 'the image sensor assembly can be manufactured in a low humidity environment, trapping moisture inside the casing, and using the hermetic seal of the casing' to keep the humidity outside. This additional complexity has increased the cost of the shirt-like sensor combination. Furthermore, if the hermetic seal is lost, the image sensor may be damaged or destroyed. Because the package 100 has a very low, or non-existent, Loze package 100 can be in a wide temperature range, and the more detailed η is compared to the image sensor combination in the prior art as Operates satisfactorily at low temperatures. f. The wet condensation area of the ground, or a gas that supports its body, and the internal exposure of the sensor to prevent the ground from densifying the effect.

V. Description of the Invention The first picture B is a cross-sectional view taken along line 11A of the second picture according to another embodiment of the present invention, taken along line A. The package 100A in the second figure β is the essence ". The package is 10, and only the obvious differences will be discussed below. The first block has a figure B. In this embodiment, the window support portion ι〇8Α is small. It is a square area with windows that extend through its central part. In the reading system, 108 upper surfaces of the portion 108, such as the 'first surface, and the inner surface n of 110, are attached to the window 108A by using an epoxy resin adhesive or tape to form a peripheral region PR. The window 110 and the window support part are covered with an inverted cup-shaped cover. Material of 110 material: In the form, the window support 108 is made of the same material as the window with ## 相同, borosilicate glass. By using the same = and? π ηέή $ + For example, the different stresses caused by thermal expansion between the tunnel bearing portion 108A can be minimized or eliminated. A lower surface of the window support portion 108A, for example, a second surface, uses an adhesive Adhesive layer 242 is attached to the non-critical area of 102U on the upper surface of the image sensor. 02. For illustration, the adhesive layer 242 is 536 or QMI 550, which is 921 26, California, USA, San Diego, Will Manufactured by Kuanteng Materials Co., 9 9 3 8 Passa Street. The second picture C is a cross-sectional view taken along line 11-11 of the first picture according to another embodiment of the present invention. The second picture C The package 丨 〇〇β is substantially similar to the package 100 in the second figure A, only the significant differences are discussed below.

$ 19 pages 517397

^ = First picture C, the window support portion 108B is a square, γ For example, the square of the square is too susceptible, the example section 108B and the window j ^ 〇 # 'In this embodiment, the window support is formed, The body's 'that is' system is composed of single-objects ^, without linking the individual objects of the night number in a frame. Also, l is as follows:

ιν ^ ^ ... As detailed in Figure c, the window supports the adjacent n8R

And Windows 1 1 〇 pass free shopping-敫 p ^ ^ -IMU8B into. The whole piece, for example, the lower surface of the window support portion 1G8B shaped by borosilicate glass, for example, the first surface, is attached to the image sensor 1 with an adhesive layer 242A. Non-critical area NCR above 2 02U. The root is that, for the sake of simplicity, the package 100 of the second figure A is illustrated in the third figure, the eighth figure, the ninth figure, and the tenth figure, and is discussed below. However, according to this disclosure, it should be understood that the package 100A of the second figure B or the package 100B of the second figure c can be equivalent to replace the package 100 of the second figure a. The third figure is an enlarged cross-sectional view of the area 100 of the package 100 in the second figure A. Referring now to the third figure, window 11o includes a locking feature 300 along the circumference of window ^ 0. In general, the locking feature 300 mechanically locks the window 110 to the package body, for example, as for plastic or liquid encapsulant, as detailed below with reference to the eighth, ninth, and tenth drawings Discussion 0 The locking feature 300 is formed along the side li (FIG. 2 and A) of the window 110. In this embodiment, the locking feature 300 is in the shape of a pedestal, sometimes called a step, and extends around the periphery of the window 110. More detailed

517397 V. Description of the invention (17) ^ The locking feature 300 includes a square ring-shaped pedestal 302, for example, a third surface extending to surround the outside of the outer surface 1 10OE. The gantry 3002 is located in a plane parallel to a plane defined by the outer surface 110E and a plane defined by the inner surface 110I. The step side surface 304 extends between the outer surface iiOE and the stage 302, and the step side surface 306 extends between the stage 302 and the inner surface 1101. In this embodiment, the 'step side 3 0, 3 0 6 is perpendicular to the outer surface 1 10 e, the inner surface Π0I, and the plane defined by the stand 302. It is important to define a pocket 308 for the 'bench 302 and the step side 304. As discussed in more detail below with reference to the eighth, ninth, and tenth drawings, the package extends into and fills the pocket 308, thereby mechanically securing the window 110. Although in the third figure, the locking feature 300 is illustrated as a gantry shape, according to this disclosure, those skilled in the relevant art will appreciate that other locking features may also be used. Furthermore, in one embodiment, the window 110 does not include a locking feature. In this embodiment, the window 110 includes a locking feature 30 (), which is manufactured from a single plate at the same time as most of the windows 110. The fourth figure is a cross-sectional view of a single window plate in the formation of a plurality of windows 11 () including a first window 110A and a second window 110B. At first, a window plate 400a, such as a lower surface of a piece of butterfly glass glass plate, for example, a first surface 002 is attached to a support portion 402, such as for The adhesive f for wafer dicing is well known to those skilled in the related art. On the surface of the window plate 400A, for example, 篦 ircl, t series ~ surface, 400U, there are a series of% formed by using, for example, a wide saw blade ▽ y 彳 < 戌 and wide cuts, for example

517397 V. Description of the invention (18) If the square is 7 grooves, it includes the first shallow and wide incision 404. The important point is that the shallow and wide incision 404 only scratches the window plate 400A, and does not extend through the entire view + window plate 400A. For the purpose of illustration, the shallow and wide incision 400 is (0.5 inches (0.38 mm) wide and extends halfway through the window plate 400A. The other shallow and wide The incisions are similar to shallow and wide incisions of 404 ° ^ four pictures B series, in most windows 丨 丨 〇 and the window support portion 108A, including the first window 110A and the window support portion 10 ^, and the second window 110B And a cross-sectional view of a single plate in the formation of the window support portion 108A2. Initially, through the use of drilling, punching, laser perforation, or other techniques, through the solid support plate 4 24, for example, the first borosilicate Acid glass plate, forming multiple openings 422, including a first opening 422A and a second opening. The upper surface of the window support plate 424, for example, the first surface, 424u, is attached for two examples! The lower surface of the window plate 4Oβ of the oxalate glass plate is deleted. In other embodiments, other techniques are used, such as using ^^ to attach the upper surface 424U to the lower surface. The surface is 400L, in this case, it will be placed on the top, such as epoxy resin adhesive in the B_ stage, sieved or scattered: ΐίΓ. or lower surface above 4 °° L and ripened. -Generally, the upper surface of the second plate 424 "" is transverse to each other, the orifice 422A and

The first one is directly attached to the 400L lower surface of the window plate 400L of the first one & domain C. The lower surface of the window support plate 424 is 42 mm attached to the support portion 402. "Yi Yiyi watches in the window plate 4_- one upper surface 4 Gang, there are a series of shallow and wide incisions, for example, square The groove includes a first- shallow and wide incision 404. The shallow and wide incision 400 is formed as an area c directly facing a lower surface 400L of the lower surface of the window plate 400B, where the self-supporting plate 424 is directly in contact with the lower surface 4b of the window plate 4 〇〇1 contact. In other words, the shallow and wide incision 404 is formed transversely and interposed between the orifice 422A and the orifice 422B, and does not directly face the orifice 422. In one embodiment, the shallow and wide incision 400 only scratches the window plate 400B, and does not extend through the entire window plate 400B. For illustrative purposes, the shallow and wide cut 404 is 0.015 inches (0.38 mm) wide and extends halfway through the window plate. However, in another ten years;;:, the shallow and wide incision 404 extends through the window plate 400B, and is scored to the upper surface 424U of the window support plate 424. Other shallow and wide incisions are similar to shallow and wide incisions. The fourth figure C is a window plate in the formation of the first window 110A and the window supporting portion 108B1, and the second window 110B and the window supporting portion 108B2 in most of the windows 11 and the window supporting portion 08B. Sectional view of 400C. Initially, a majority of holes 440 are formed in a window surface of 400 ° C, for example, a first borosilicate glass plate, using a method such as drilling, grinding, laser perforation, or other techniques. , Including the first hole 440A and the second hole 4 4 0 B. After the holes 440 A, 440 B are formed, the lower surface 400L of the window plate 400B is attached to the support portion 402. On one of the upper surfaces of the window plate 400 C, 400 U, there are a series of shallow and wide cuts formed by, for example, a wide saw blade, such as a square groove,

Page 23 517397 V. Description of the invention (20) 'Contains the first shallow and wide incision 404. The shallow and wide incision 404 is formed transversely between the hole 440A and the hole 440B, that is, it is not formed to directly face the hole 440. The important point is that the shallow and wide incision 404 only scratches the view / window panel 400C, and does not extend through the entire window panel 400C. For illustrative purposes, the shallow and wide incision 404 is 0. 015 inches (0.38 mm) wide and extends halfway through or below the 400C window plate. Other shallow and wide incisions are similar to shallow and wide incisions. The fifth figure is a sectional view of the window plate 400A of the fourth figure A in a later manufacturing stage. After forming a series of shallow and wide cuts, including shallow & wide cuts 404, use, for example, a narrow saw to form a series of deep and narrow cuts, such as a square groove, containing a deep and narrow Cut

Si / As shown in / fifth, the deep and narrow notch 502 extends through the window plate. 2Γ: The window 11A is unified from the window U ° B. The windows " 0A, 110B are held by the support portion 402. For illustration, the deep and narrow 〇2 is 0.008 inches (0.20 mm) wide. Other deep and narrow incisions are similarly formed in other corresponding shallow and wide incisions to the center. Therefore, they will not be discussed further here, so as not to be advantageous, formed in the window plate 400A =: the gist of the invention. For narrow incisions, rough cutting is better to facilitate locking; = incisions and deep three pictures). Because the thick chain cut = locked fine ^ incision and deep and narrow incision are made by high speed / better, the shallow and wide converse, for the sake of beauty, safety, and its good ;: formed. The window used by the image sensor combination is formed by shadow cutting in precision technology. In other words, the angled, jagged = heart, that is, the smooth cut ^ or broken window, both

Page 24 517397 V. Description of the invention (21): Connection: It is a process for the combination of image sensors in the prior art. It is recognized that i is a fine-cut window, which is caused by cutting at a lower speed than I. The manufacturing cost of the window 110 according to the present invention is -1 staring technology, and the manufacturing cost of the window of the image sensor combination. The deep and narrow incision 502 body of the window plate 400A in the fourth picture is as detailed as described. According to the present disclosure, those skilled in the relevant arts will be able to do this; The narrow notch 502 is also formed in the plate 420 of the fourth figure 6 * ± 1. The view of the four figures is from the plate 408C, so the window 1 10 and the view = supporting portion 108A, and the window supporting portion 1 are individually 〇8βsingularity. More specifically, the incision 5 02 extends through the window plate 400B / window support plate 1 and 4 (picture 4) or the window plate 4 0 0 c (fourth picture c), so the individual will see: 0 and the window The support part 108A and the window support part 088 are provided with a single dagger. These deep and narrow incisions 502 are shown in the fourth figure B, and the fourth figure C is indicated by a dashed line. The sixth diagram is a cross-sectional view of a structure 600 in the manufacture of most image sensor packages 0 (first diagram, second diagram A) according to the present invention. The structure 60 0 includes an image sensor substrate 60, such as a wafer-shaped shirt-like image sensor substrate 60 2, which includes most of the image sensors, and is integrated and integrated. The image sensor 02 includes an upper surface formed on the image sensor substrate 602, for example, the first surface, an active area 104 above the 602u. The image sensor 102 further includes a bonding pad 106 on the surface 602U of the image sensor substrate 602. Pad 6 is connected to the internal circuit of image sensor 102. In addition, the image sensor 丨 〇 2 includes a non-smooth on the upper surface 6 〇 2 ^ of the image sensor substrate 6 〇 2 located between the bonding pad 106 and the active area 104.

IHI I side 517397

V. Description of the invention (22) Critical area NCR. For illustration, a first image sensor 102A of the majority image sensor 102 includes a first active area 104A of the majority active area 104. The image sensor 102a also includes a first pad 106A of the plurality of pads 106 and a first non-critical region NCR1 of the majority of non-critical regions NCR. The other image sensors 102 include the active area 104, the pads 106, and the non-critical area NCR in a similar manner.

Image sensing 102 is integrated and integrated together to form an array, such as a 2x2, 3x3, or nxm array. Each image sensor 102 is a singularized street located between adjacent image sensors 102. Road 6 04. For example, one of the plurality of singularized streets 604—singularized street 604A depicts a first image sensor 102A and a second image sensor 1 from the majority image sensor 102. 〇2B. The other image sensors 102 are similarly drawn from the adjacent image sensors 102 by the corresponding singular street 604. As shown in the sixth figure, the bead 60 6 is applied to the non-critical area NCR so that the bead 606 is positioned above the non-critical area NCR. The beads 60 6 are applied around the entire periphery of the active area 104.

For illustration, a first bead 606A of the plurality of beads 606 is applied 'and is located above the non-critical region NCR1. The beads 60 6A are applied around the entire periphery of the active area 104A and surround the active area 104A. In one embodiment, the beads 606A are applied by using a needle to spread a suitable bonding material, such as viscose, as understood by those skilled in the relevant art. However, according to this disclosure, those skilled in the related art can also recognize that

Page 26 517397 V. Description of the invention (23) Other techniques can also be used to apply beads 60 6 A to the non-critical area ncr 1. For example, beads 6 0 A can be formed by sieving an epoxy resin adhesive or applying a piece of double-sided adhesive tape. Other beads 6 06 can be formed one at a time in a similar manner, or they can be formed simultaneously. The seventh figure A is a cross-sectional view of a structure 600 in a more subsequent manufacturing stage according to an embodiment of the present invention. Referring now to the sixth figure and the seventh figure A together, the window 11 0 is pressed into the corresponding beads 6 06 to form a corresponding window support portion 108. For example, a pick-and-place machine removes the window 丨 J 〇 from the supporting portion 402 (fifth picture) and presses the window 11 () into the corresponding bead 6 006 to form a corresponding window supporting portion.丨 〇8. For explanation, a first window 1 丨 C of the plurality of windows 11 〇 is pressed into beads 60 6A to form a window support portion 1 οκ, and more generally, a window 11 0 C is mounted on the image sensor.器 1 〇2 A. When the window 11 oc is pressed into the bead 6 06A, the bead 606A is squeezed downward by the window lioc, for example, in a first direction toward the non-critical area NCR 1. The volume of the beads 6 0 A is sufficient to stably and reliably mount the window 1 10 c on the image sensor 10 2 A. Moreover, the volume of the beads 606 A is sufficient to create a proper gap between the window 11 oc and the active area 104A. However, the volume of the beads is not enough to cause the window support portion 108 C to extend beyond any one of the pads 106 or the active area 104A. Advantageously, by pressing the window 11c into the bead 606A in the manner described above, the window 110C is substantially parallel to the upper surface 102U of the image sensor 102A. Furthermore, the distance between the window liOC and the image sensor 102A is precisely controlled within a strict tolerance. "

517397 V. Description of the invention (24) In the prior art, the window is placed on a stand of the casing after the casing is manufactured. Since there is a significant tolerance difference associated with the placement of a window, from one combination to another, the distance between the window and the image sensor varies significantly. However, to ensure optimal operation of the image sensor, it is important that the distance between the window and the image sensor is accurate. Since the tolerance of this distance has been reduced in the package, the performance of the package is better than that of the prior art. Although the arrangement of the window 11 0C in the beads 60 6A has been described above, it should be understood that other windows 11 0 are placed in other corresponding beads 60 6 in a similar manner to form other corresponding window supports. Department 108, ^ times ^, or concurrently. After the window 丨 丨 〇 has been placed on the corresponding beads 6, the window support portion 108 is cured. For example, the window support 108 may be cured by ultraviolet rays or heat. In addition, the window support portion 108 may be gelatinized or made sticky rather than mature. In general, the: 108 is cured, for example, by curing and gelling or by making it equal to sex. As described below with reference to the eighth, ninth, and tenth drawings, the window 110 uses the window support m to combine the Γ02. 'Λ Compared with if the window 11G is completely leaning on the support of the window support "108, the window support / structural integrity and the viscosity of the window 11 〇 / to form a lower knot image The sensor substrate 602 is along the front, the mouth, and the second figure). ® Use any of a number of previous singularization technologies to make the early-chemical cutting or mechanical sawing through the image sensor substrate 6 〇 2. For example, using lasers

517397 V. Description of the invention (25) '" One ---- the important is the active area of the image sensor 丨 04 in the singularization ♦ use the window 1 1 0 (and the window support 1 08-and) for protection . More specifically, the window 110 protects the active area 104 from being singularized. For example, it is caused by the contamination and scratches of silicon chips. The window 11 is also in the subsequent stage of the package ι〇〇, for example, in the subsequent wire bonding and / or packaging and / or forming the second bad area 104. As a result, damage to the image sensor 102 can be avoided. Because of &, compared with the prior art, the cost of improving the yield is lower. Furthermore, by forming a plurality of packages 100 at the same time, several advantages can be realized. One advantage is that a large number of packages 100 are processed and processed simultaneously, rather than individually processing and processing each package 100, which has a low density of force. Another advantage is that the use of materials is more efficient when manufacturing a package 100 of an entire array. By reducing labor and using less material, the cost associated with each single package 100 is minimized. However, as those skilled in the relevant arts will recognize, according to the present disclosure, if the relative father = 1. . They can also be manufactured one by one. For example, 'after the film attachment and / or wire bonding of the image sensor 10;' the window 110 may be attached using the window support 108. The seventh diagram B is a diagram of the 6 0 0 in a more subsequent manufacturing stage and the seventh diagram B according to the present invention, and the corresponding beads 6 6 which have been attached and pressed in are mounted on the image sensor at 108 A.器 1〇2. A sectional view of the structure of another alternative embodiment. Now referring to the window no of the sixth window support 108A, the window 1 1 0 and the window support

For illustration, a pick-and-place machine supports window 110 and window support

517397 V. Description of the invention (26) The part 108A is removed from the support part 402 in the fourth figure B, and the window support part 108a is pressed into the corresponding beads 6 06. For example, a first window 11 0D of the plurality of windows 11 0 has a first window support portion 108 0 A 3 attached to it. The window support portion 108A 3 is pressed into the beads 606A to load the window 110D and the window support portion 108A3 on the image sensor 102A. When the window support portion 108A3 is pressed into the bead 606A, the bead 606A is pressed down by the window support portion 108A3 and faces the non-critical area. Beads 606A form a viscose 242. Although the arrangement of the window 110D and the window support portion 108A3 in the bead 606A has been described above, it should be understood that other windows 丨 丨 and the window support portion 108A are similarly placed on other corresponding beads 6 In 〇6, other corresponding window support portions 108a are formed, one at a time, or concurrently. After the window 110 has been placed on the corresponding bead 606, the bead 606, that is, the adhesive 2 4 2 is cured.

In the embodiment described above and illustrated in FIG. 7B, the window 11 0 and the window support 1 0 A in the fourth β are mounted on the image sensor 1 02 to manufacture the second image B Package 1 00a. However, in another alternative embodiment, the window 1 10 of the fourth figure C and the window support portion 08B are mounted on the image sensor 10 2 ′, and the package 1 of the second figure c is manufactured in a similar manner. β. In an alternative embodiment, the beads 6 0 6 are not directly applied to the upper surface 6 0 2 U of the image sensor substrate 6 0 2 as shown in the sixth figure, but are directly applied to the window 11 0 (seventh figure A), or, alternatively, it is applied to the window support 108A (seventh figure B). According to this embodiment, in order to apply the beads 606 to the non-critical area NCR ′ in the window (the seventh figure or the window 11〇 / window)

Page 30 517397 V. Description of the invention (27) During the loading of the support portion 108A (seventh figure B), the beads 606 are pressed into the non-critical area NCR. In one embodiment, after the singularization of the image sensor substrate 602, the package 100 (second image A) is further packaged. Advantageously, since the active area 10 of the image sensor 102 is protected by the window 110, the package 100 can utilize any conventional packaging technology, such as standard molding and / or liquid sealing technology. For further packaging. For example, putting Feng Sang 100 in a combination of a flip-chip image sensor such as that illustrated in Figure 8

Such as the lead frame image sensor combination illustrated in Figure 9, or a wire-bonded image sensor combination illustrated in Figure 10. The eighth figure is a cross-sectional view of a flip-chip image sensor assembly 800 according to an embodiment of the present invention. Referring to the eighth figure, the combination 800 includes a substrate 802 for illustration. The substrate 802 may be a printed circuit board, ceramic, glue τ ′ or other materials as will be understood by those skilled in the relevant art.

The substrate 80 2 includes a conductive surface 80 4 formed on a lower surface of the substrate 802, for example, the first surface, a majority of 802L. The pads 106 are electrically connected to the corresponding conductive traces by using the corresponding conductive bumps 806. The conductive trace 804 is electrically connected to the corresponding conductive dielectric layer 808, which extends from the lower surface 802L of the substrate 802 to one above the lower surface 802l. The surface is, for example, the second surface, 802U. The dielectric layer 808 is electrically connected to a corresponding conductive trace 810 on the upper surface 802U of the substrate 802. A conductive pad 812 corresponding to the conductive trace 8m. A relatively Λ continuous ball 814 ′ solder ball is formed on the solder pad 812. The interconnection ball 814 is used to electrically connect the combination 800 to a larger substrate (not shown), such as a printed circuit board.

Page 31 517397 V. Description of the invention (28) " --- Motherboard. For illustration, a first pad 106A of the plurality of pads 106 is electrically connected by a first bump of the plurality of bumps 806, and is on the first trace of the majority 8G4— The trace is just eight. The trace 804 is electrically connected to a first interlayer 8_ of the plurality of interlayers 808. The dielectric layer 8m is electrically connected to a first trace 810A of the plurality of traces 810. A first bonding pad 81 of the majority of pads 812 is formed above the trace 81a and a first interconnection ball 814A of the plurality of interconnection balls 814 is formed over the bonding pads 81 2A. As described above, using the bump 806A, the trace 804a, the interlayer = 8A, the trace 810A, and the pad 812A, the pad 6A and the interconnect ball "" =-a conductive path has been formed. The other pads m, bumps, traces 804, interlayers 808, traces 81, pads 812, and interconnect balls 814 are two types: they are electrically connected to each other in a similar way. Deviate from the gist of the invention. -Although, a special conducting circuit between the interconnecting ball 814A and the bonding pad 106 has been described above. According to this disclosure, those skilled in the relevant art will recognize that other conductive paths may be formed. For example, when the substrate 802 is a multi-layer substrate, there is no need to directly pass through the interlayer 808. Most of the conductive traces on each of the two substrates 802 are interconnected to form a plurality of conductive dielectric layers. Electrical interconnections between traces 804 and 810. As yet another example, the interlayer 808 extends along the side surface 802 of the substrate 802 and the traces 804 and 810 extend to the side surface 802s. As yet another alternative, interconnect balls 814 are distributed in an array format to form a ball grid j-array (BGA) type package. Alternatively, the interconnect balls 814 are not formed to form ~ metal rail gate array (LGA) type packages, or-leadless crystals

517397

Chip Carrier (LCC) type package. Other conductive path changes should be apparent to those skilled in the relevant art. The base plate 802 includes a central aperture 816. The window 1 () is located within the center = port 816, or adjacent to the center port 816. In detail, the outer surface 1 1 0E of the window Π 0 is exposed through the opening 8 丨 6. In use, the radiation is directed at the combination 8000. This radiation penetrates the window 11 and passes through the medium 120 to reach the active area 104. As known to those skilled in the art, 104 will respond to this radiation. The motion & combination 800 includes a package 818. The package 818 is a kind of material such as, and electrically protects various conductive structures of the combination 8000, for example, to avoid short circuit, and environmental protection, for example, to prevent it from being '1 = outside, the package 818 is for the combination 80 0 provides mechanical strength, and the failure of the: L: nf bump 806 and the peeling of the substrate 802 of the associated image sensor 102 is minimized. In this embodiment, the package 818 covers the upper surface ι〇2υ and the side surface 102S of the second plate, the solder pad 106, the lower surface 802L, and the base η: the central orifice 816, and the trace 8.4. ,please. 6 and window support = fixed. In more detail, the package 818 includes a D bag 308 that fills the window with a wide area and a small space of 20 mm. Therefore, the medium and spoon type locks are fixed. In one embodiment, the package 818 of the government 820 is integrated, that is, the package 818 is maintained in view. Here, k is implemented. The rules are exposed from 110 outside surface 110E, also 517397. V. Description of the invention (30) That is, 'package 818 does not contact or cover the outer surface u0E. The package body 818 is formed of any of a number of conventional packaging materials. For example, the package body 818 may be formed of a plastic packaging material, or alternatively, a liquid packaging material. The ninth figure is a cross-sectional view of a lead frame image sensor combination 900 (hereafter referred to as combination 900) according to another alternative embodiment of the present invention. Referring now to the ninth figure, the image sensor 102 A lower surface, ° for example ·. The second surface, 102L, is a wafer attachment attached to the lead frame 904

Washer 902. For example, the lower surface 10 is attached to the contact pad 90 2 with an adhesive 906. The T lead frame 904 further includes a plurality of leads 908. The pad 10 is electrically connected to the lead 908 by a corresponding bonding wire 910. For example, a first bonding pad 106A of the plurality of bonding pads 106 is electrically connected to a first lead 908A of the plurality of leads 908 using a first bonding wire 9 1 0A of the plurality of bonding wires 910. . The other pads 106 are electrically connected to other corresponding leads 908 in a similar manner by using other corresponding bonding wires 91, and will not be discussed further. The combination 90 0 further includes a package 912. The package body 912 is an electrically insulating material, and electrically protects various conductive structures combined with 900, for example, to avoid short circuit, and environmental protection, for example, to prevent the bean from getting wet.封装 The package 912 covers the upper surface 1021 of the image sensor 102 and the side 102S, the bonding pad 106, the bonding wire 910, the wafer attachment pad 902, the lead 908 within the end 9081, and the window Bearing section 丨 〇8. Furthermore, the package body 912,

517397

: ^ See the self-supporting portion 108 ′ to mechanically lock the window 110.: Second, the package 912 contains an external locking feature 914 dagger pocket 308 ..., and the window ". Mechanical locking plus: --- ^-touch or cover the outer surface 110E. Each

The package body 91 2 is made of any of a number of conventional packaging materials. For example, the package body 912 may be formed of a plastic packaging material, or / 'instead, a liquid packaging material.

The tenth figure is a cross-sectional view of a wire bonding image sensor assembly 1000 (hereafter referred to as a combination 1000) according to yet another alternative embodiment of the present invention. According to the tenth figure, the combination 1000 includes a substrate 1002. For illustration, the substrate 100 may be a piece of printed circuit board, pottery, or tape, although other materials are used in other embodiments. The lower surface of the image sensor 〇 02 is 102 L ′, for example, attached to one of the upper surfaces of the substrate 002 with an adhesive 10 30, for example, the first surface 1002 U. The substrate 1002 includes a plurality of conductive traces 1004 formed on the upper surface of the substrate 1002. The bonding pads 106 are electrically connected to the corresponding traces 104 by using the corresponding bonding wires 1006. The trace 1 0 4 is electrically connected to the corresponding conductive dielectric layer 1 08, which extends from the upper surface 1002U of the substrate 1 2 0 to a lower surface opposite to the upper surface 1002U, for example, the second Surface, 100L. The interlayer 1 008 is electrically connected to the corresponding conductive trace 1010 on the lower surface 1002L of the substrate 1 002. A corresponding conductive pad 1012 is formed on the trace 1010. Formed on gasket 1012

Page 35 517397 V. Description of the invention (32) There are corresponding conductive interconnect balls 1014 such as solder balls. The interconnect ball 1014 is used to electrically connect the assembly 1000 to a larger substrate (not shown), such as a printed circuit motherboard. For illustration, a first pad 1064 of the plurality of bonding pads 106 is electrically connected to a trace 1 004 of the majority by a first bonding wire 1006 of the plurality of bonding wires 10 06. One of the first traces is 〇〇 ^. Trace 100 "is a first dielectric layer 1008 that is electrically connected to the majority of the interlayer 1008. The dielectric layer 1008A is a first electrically connected to the majority of the trace 101o. The trace is 1010 people. A first pad 1012A of the plurality of pads 1012 is formed on the trace 10a.

Above. A first interconnection ball 1014A of the plurality of interconnection balls 1014 is formed on the pad 101 2A. As described above, one of the bonding wire 1006A, the trace 1004, the interlayer 0088A, the trace 1010A, and the pad i12a, the bonding pad 106A and the interconnection ball 101 is used. Conductive paths have been formed. The other pads 106, bond wires 006, traces 1 004, interposer 1 008, traces 1010, pads 1012, and interconnect balls 1014 are similar. The methods are electrically connected to each other, so I will not discuss them further, so as not to deviate from the gist of the present invention. Although the two special conductive paths between the interconnecting ball 1014A and the bonding pad 106A have been described above, according to this disclosure, those skilled in the relevant art will You can also form other conductive paths. For example, when the substrate 1 002 is a multi-layer laminated substrate, most conductive traces on each layer in the interlayer 1 008 board 1 002 are not directly penetrated. Most conductive interlayers are used to interconnect to form electrical interconnections between traces 1004 and 1010.

As another example, the interlayer 10 08 is along the side 1002S of the substrate 1 002.

Page 36 517397 V. Description of the invention (33) extends, while traces 1 004 and 1010 extend to the side 1002s. As yet another—alternative example, interconnect balls 1 0 1 4 are distributed in an array format to form a ball grid array (BGA) type package. Alternatively, an interconnect ball "" is not formed to form a metal rail surface grid array (LGA) type package, or a ^ (LCC) type package. Other conductive path changes should be apparent to those skilled in the relevant art. 2 in 1 000 even contains a package body 1018. The package body 1018 is a kind of ^, 耵 square, and. 1. Various conductive structures of ϋ00 are used for electrical protection, for example, to avoid short circuit, and environmental protection, for example, to prevent them from being damaged, the package body 1018 covers the image sensor 102. 1004, the bonding pad 106, the top surface 1002U of the substrate 1002, the trace 1018'1, and the window support 108. Furthermore, the package is fixed ::? !! The support portion 108 mechanically locks the window 110, and in addition to 1012, the package 1018 includes an external locking feature. The mechanical window locks the pocket 110 of the window 110. Therefore, the window is ". 2 疋 疋 ’， 而 固 $。 In one embodiment, the package 1018 is integrated into a single body. In this case, the package body 1018 keeps the outer surface 11o of the window 1110 exposed, and the package body 1018 does not contact or cover the outer surface 11〇E. 2 J body 1018 is made of any of a number of conventional packaging materials. Alternatively, the package body 108 may be formed of a plastic encapsulant, or alternatively, a liquid encapsulant. For M times, the eighth figure, the ninth figure and the tenth figure are used to illustrate the image sensor group.

Page 37 517397 V. Description of the invention (34) It is equipped with a package according to the present invention. Those skilled in the relevant art will recognize that according to the present disclosure, other image sensor combinations with packages 100 can also be manufactured. For example, a solder mask can be applied to the upper surface 80211 and / or the lower surface 8021 of the substrate 802 (eighth image), and / or the upper surface 8012 and / or lower surface of the substrate 1002 (ninth image). Surface iOO2L. The foregoing drawings and description have provided examples of the invention. However, the scope of the present invention is by no means limited to these special cases. Whether or not it is indicated in this patent specification, many variations, such as differences in 'structure, dimensions, and materials, are possible. The scope of the present invention is at least as broad as the scope of patent application below. 517397 Brief description of the drawings 100, 100B: Image sensor packages 102, 102A: Image sensors 102S, 110S, 802S: Side 102U, 40 0U · Upper surface I 04, 1 04A: Active areas 106, 106A, 812 812A: Pads 108, 108A, 108A1, 108A2, 108B, 108B1, 108B2, 10 8C: Window support

108L, 400L, 424U, 602U, 802L, 1002U: first surface 108U, 400U, 802U, 100 2L: second surface 110, 110A, 110B, 110C: window II 0 E: outer surface 1 1 0 I: inner surface 118 , 440, 440A, 440B: Hole 1 2 0: Media 242, 242A: Adhesive layer 3 0 0: Locking feature 3 0 2: Square ring-shaped stand

3 0 4, 3 0 6 Step side 308: Pockets 400A, 400B, 400C: Window panel 4 0 0 LLower surface 4 0 2: Supporting part 404: Shallow wide cut

Page 39 517397 Brief description of the drawings 420: Single-plate 422, 422A 422B ·· Hole 424 • · Window support plate 502: Deep and narrow cut V 600: Structure 602: Base plate of image sensor

604, 604A: singular streets 606, 606A: beads 8 0 0: flip chip image sensor combination 8 0 2, 1 0 0 2: substrates 804, 804A, 810, 810A, 1004, 1004A, 1010, 1010A : Traces 806, 806A: Bumps 808, 808A, 1 0 08, 1 008A: Interlayer 814, 814A, 1014, 1014A: Interconnect ball 8 1 6: Central orifice 818, 912, 1018: Package 8 2 0, 9 1 4, 1 0 1 2: External lock feature

9 0 0: Lead frame image sensor combination 902 · Wafer attachment tab 9 04: Lead frame 9 0 6, 1 0 3 0: Adhesive 908, 908A: Lead 9 0 8 I: End

Page 517397 Brief description of the drawings 910, 910A, 1 06, 1 0 6A: Welding wire 1 0 0 0: Wire welding image sensor combination 1012, 1012A: Gasket CR: Central area NCR, NCR1: Non Critical area PR: Peripheral area 11 ^ page 41

Claims (1)

^ / 397 ^ ^^-1? #, 9Q1Q836R 二 二 申 ^ ΐ--face, and opposite to the _th surface-the environment is fixed to the window support, and the 4 :: face, the first -iq brother.罘 —The surface is exposed to the periphery: · The specialty: the structure of item 9, in which the window "encloses the surface: from the surface of the side brother and the appearance: it also includes the extension and the surface of the window support is from the surface of the direct brother Between the side 5 1 surface-a peripheral area connected to the side of the window, such as the 12th in the scope of patent application 丨 0-such as a ^ side area and the non-critical area ^^ / support • A seal between the third and the third of the women's patent application. ^ Epoxy resin beads. The member, "Dance, where the window support system is one of the window support system and the second window support system. Diagnose the structure of the scope of patent application No. 丨 2 "non-critical area contact. 4 · Such as the scope of patent application No. 1: a square block, which extends through: = = in the middle; see ..., -5. The structure of item 4 of the patent scope, the second hole: the support part forms an inverted cup-shaped cover., Q window and the window u • If the structure of the scope of patent application item 14 is applied, 苴 V 斤 is formed by the main body , The window support is made of this material: deemed as the scope of the patent The structure of item 4 is Nong 2. Salt glass. /, The material is borosilicate, where the window and the window support part of the window are 11.8. For example, the structure support part of the scope of patent application is the first Integrated into one. 1 9. The structure of the first scope of the patent application, page 43 2002 * ° 6. 03. 〇〇7 517397 _ case number 90108366_ year month day __ VI. Use a glue The layer is attached to the non-critical area. 20. The structure of item 1 of the patent application scope further includes an image sensor substrate including a majority of the image sensors, and the majority of the image sensors includes the image. Sensor 1. 2-An image sensor package structure comprising: a window support plate having a first opening and a second opening formed through the window support plate; and a window plate supporting the window support A first surface of the panel is in direct contact with a first region of a first surface of the window panel that is transversely interposed between the first aperture and the second aperture. Two surfaces containing the first The first groove is directly opposite to the area. 2 2. The structure according to item 21 of the patent application scope, wherein the first groove is square. 2 3. The structure according to item 21 of the patent application scope, wherein the first groove The groove is engraved on the window plate. 2 4. The structure according to item 23 of the scope of patent application, wherein the first groove is extended to halfway through the window plate. 2 5. According to the scope of patent application The structure of item 21, wherein the first groove is extended to penetrate the window plate. 2 6. The structure of item 25 of the patent application scope, wherein the first groove is scribed on the window support plate 2. The structure according to item 21 of the scope of patent application, which further includes a second groove in the first groove, and a width of the second groove is smaller than a width of the first groove. . Page 44 2002.06.03.008 517397 Modification of groove system. Groove system extension 28. The structure of item 27 of Rushen / Jun / if, wherein the first part is formed in a central part of the first groove. 29. The structure according to item 27 of the scope of patent application, wherein the extension extends through the window plate of the car and penetrates the window supporting plate. 30. The structure of item 29 in the Chinese Patent Model ^, wherein the window includes a small window supporting portion to: ... ^ The window plate in Zhuangzhong includes a first small second supporting portion, and the first The second groove and the second window are singularized, and the first window support portion is added from the first window support portion 31. If the patent application scope is 21V ^ the second window is single- Into. It is the first-handle, structure of gallate glass, wherein the window supports the second sheet of glass. # 片 '， And the window sheet is deleted from the salt glass salt 3 2 · —Special i image 144 dream recognition 4-a two-structure, including: 乂 第-孔 孔 和-个 第 :: the window sheet- Each of the first surfaces has a surface-first groove, an L-hole ', and a second and the second hole of the window plate. The -th trench is located across the first hole with 3 3 · As in the scope of the patent application, the second t structure within a trench, including the second one of the first trench Wide and one of the widths of the second trench is less than 3: in V, specifically: upper circumference; the structure of the item, wherein the second trench is formed in the one of the first trench 3 5 Yuandi, α 乂 extends through the window plate. Item, wherein the second trench is extended Page 45 2002.06.03.009 517397 Case 5 Tiger 901〇83fift Amendment VI. Patent application scope _____ 36. If the structure of the patent application scope item 35, 苴, one integrated with a first window 〃, δ Hai The window plate includes one integrated with a second window: a view f support portion, and two grooves to separate the first window support portion from the second and second window support portions, and the first window portion is provided from the second window portion. Simplification. A support section, and the first method, including: applying a bead to a first image sensor, a first non-critical area J of the first surface, the non-critical area is: Master Yu: =: area and several welding and moving & and the pad; use spear J to use this bead to make a window shape 38. For example, the square H sensor of the 37th scope of the patent application. A peripheral method for the active area, wherein the bead line surrounds the bead line-a species of which the bead line utilizes the name ten where the loading includes the wording where the bead has a = · such Method 4 of the scope of patent application ° 37 \ If the method of the scope of patent application 39 is applied, apply the adhesive. 41. Press the beads as described in the patent application. Netai 42. If the volume of the scope of patent application is applied, it is sufficient for the: windowman / :, in which there should be 4 gaps. See a gap between the solid part and the active area. 4 · If the patent application is for a window support, the method of this method, wherein the beads form a ^ to include curing the window support. Page 46 20〇2. 06. 03. 〇] 〇517397 _Case No. 90108366 _ Amendment _ Sixth, the scope of patent application 4 4. If the method of the 43rd scope of the patent application, the window support is Curing, gelling, or making it sticky. 4 5. The method according to item 43 of the scope of patent application, wherein the window, the window supporting portion and the image sensor define a sealed hole, and the active area is located within the hole. 46. The method of claim 37, wherein the image sensor is one of a plurality of image sensors integratedly connected together, and the method further includes singularizing the plurality of image sensors. 4 7. The method of claim 37, wherein the applying a bead to a non-critical area of a first surface of an image sensor comprises: applying the bead to the window; And pressing the beads into the non-critical area. 4 8. The method of claim 37, wherein a window support is attached to the window, and the loading includes pressing the window support into the beads. 49. The method of claim 48, which further comprises solidifying the beads. 50. The method according to item 48 of the patent application, wherein the window and the window supporting portion are integrated into one. 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