TW515061B - Electroplating nickel/gold process and structure for electric contact pad of chip package substrate - Google Patents
Electroplating nickel/gold process and structure for electric contact pad of chip package substrate Download PDFInfo
- Publication number
- TW515061B TW515061B TW90127968A TW90127968A TW515061B TW 515061 B TW515061 B TW 515061B TW 90127968 A TW90127968 A TW 90127968A TW 90127968 A TW90127968 A TW 90127968A TW 515061 B TW515061 B TW 515061B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact pad
- layer
- electrical contact
- substrate
- gold
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract description 24
- 239000000758 substrate Substances 0.000 title abstract description 20
- 229910052737 gold Inorganic materials 0.000 title abstract description 12
- 239000010931 gold Substances 0.000 title abstract description 12
- 229910052759 nickel Inorganic materials 0.000 title abstract description 12
- 238000000034 method Methods 0.000 title abstract description 9
- 238000009713 electroplating Methods 0.000 title abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Description
A Be D M5U01 第90127968號，％年4月7日更正頁 丨六、申請專利範圍 ⑷於基板上形成_第二光阻、 於第一光阻層開孔區之導電膜4一先阻層覆住殘露 該基板至少-電性制墊進行f 性接觸墊表面鍍上鎳/金層； 使所这電 (f)移除第二、-光阻層及其所覆蓋之導電膜。 5 ·如申請專利範圍第4項所述之 墊之電鑛鋅/全f程，b μ 基板電性接觸 =士其中在步驟⑴之後’更可包括一步驟 )*在邊基板表面上覆上一防焊層，該防焊層露出前述完 成電鍍鎳/金屬之電性接觸墊。 :觸申ΓΓ圍第4或第5項所述之—種晶片封裝基板電性 塾之電鍍鎳/金製程’其中所述電性接觸墊係為基板之 打線墊（Bonding Pad)。 7. 如申請專利範或第5項所述之—種晶片封裝基板電性 接觸墊之電制/金製程，其中所述電性接觸墊係為基板之 錫球墊(Solder Ball Pad)。 8. 如申請專利範圍第4或第5項所述之—種晶片封裝基板電性 接觸塾之電鑛錄/金製程，其中所述導電膜可為錫（sn)、 銅（〇0、鉻（⑺、！巴⑽、鎳⑽、錫/錯（Sn/pb) 等材質或其合金所組成。 9. 如申請專利第4或第5項所述之—種“封裝基板電性 接觸墊之電鍍鎳/金製程，其中所述物理沈積方式形成一導 電膜，係以濺鑛（Sputtering)方式形成。 12 本紙張尺度適用中國國家標準（CNS) A4規格（210x297公釐） (請先閱讀背面之注意事項再填寫本頁各攔) 裝 t4線！
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW90127968A TW515061B (en) | 2001-11-12 | 2001-11-12 | Electroplating nickel/gold process and structure for electric contact pad of chip package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW90127968A TW515061B (en) | 2001-11-12 | 2001-11-12 | Electroplating nickel/gold process and structure for electric contact pad of chip package substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW515061B true TW515061B (en) | 2002-12-21 |
Family
ID=27786862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW90127968A TW515061B (en) | 2001-11-12 | 2001-11-12 | Electroplating nickel/gold process and structure for electric contact pad of chip package substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW515061B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7125745B2 (en) | 2003-04-28 | 2006-10-24 | Advanced Semiconductor Engineering, Inc. | Multi-chip package substrate for flip-chip and wire bonding |
| US7627946B2 (en) | 2006-03-20 | 2009-12-08 | Phoenix Precision Technology Corporation | Method for fabricating a metal protection layer on electrically connecting pad of circuit board |
-
2001
- 2001-11-12 TW TW90127968A patent/TW515061B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7125745B2 (en) | 2003-04-28 | 2006-10-24 | Advanced Semiconductor Engineering, Inc. | Multi-chip package substrate for flip-chip and wire bonding |
| US7627946B2 (en) | 2006-03-20 | 2009-12-08 | Phoenix Precision Technology Corporation | Method for fabricating a metal protection layer on electrically connecting pad of circuit board |
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| GD4A | Issue of patent certificate for granted invention patent | ||
| MC4A | Revocation of granted patent |