TW511413B - Method for recycling printed circuit board panel by applying stepped binding structure - Google Patents

Abstract

The present invention is a method for recycling printed circuit board (PCB) panel by applying stepped adhesive bonding structure. The method includes the following procedures: (a) using a die module to clamp and secure a first surface of a first PCB panel; (b) applying program control on a NC machine to automatically mill defective pieces away from the first PCB panel and mill a suitable stepped structure on each connecting plate while keeping the remaining acceptable pieces on the first PCB panel; (c) using the die module again to clamp and secure a second surface of a second PCB panel before applying program control on the NC machine to automatically mill acceptable pieces away and mill a suitable stepped structure on each connecting plate; (d) painting a layer of adhesion agent on each suitable step of the first PCB panel before fitting the acceptable pieces obtained in step (c) on the vacant spaces of the first PCB panel so as to replace the defective pieces and form a new PCB panel; (e) binding the connecting plates with each other through the suitable steps before applying precision positioning of the die module and pressing the new PCB panel to allow the PCB panel to have a flush surface; (f) placing the new PCB panel obtained in step (e) into an oven to allow the layer of adhesion agent to be post-cured and firmly bound to form the new PCB panel.

Description

511413 V. Description of the invention (1)-The present invention relates to a method for recovering a printed circuit board by using a step-shaped bonding structure, and particularly relates to a printed circuit board (PCB Panel), which removes a defective circuit board (piece). Then, a good unit sub-circuit board from another printed circuit board is adhered to the original sub-circuit board with the defective unit removed to form a new printed circuit board.

At present, various printed circuit board (PCB) arrangements are often made on a printed circuit board (panel), and a plurality of sub-circuit boards (pieces) are manufactured in accordance with the needs of various sizes and processes, and the arrangement is also different. The difference. According to customer requirements or quality control regulations, the defective rate of each printed circuit board ^ sub-circuit board has different limits, such as a printed circuit board may allow a unit sub-circuit board to be defective, or may be allowed on the printed circuit board The three unit sub-circuit boards are defective, that is, the defective rate can still be accepted as a usable printed circuit board at the value set by the customer. For subsequent production, such as printed solder paste, manual plug-in (Manual or SMD ( (Surface Mounting) plug-ins, etc. The printed circuit board whose replacement rate is more than the specified value is a discarded printed circuit board; however, for the circuit board manufacturer, the number of discarded printed circuits still has Many units of sub-circuit boards are good sub-circuit boards that can still be used. Unfortunately, discarding them also increases the cost relatively. Therefore, we have begun to develop methods to eliminate bad updates and recyclable printed circuit boards. Erliang αα Unit sub-circuit board, and will use the defective single circuit on the printed circuit board, remove 'refill the unit good product sub-circuit board to replace it. Jinshu' head already has a lot of related professional Cases uncovered out ', for example, "Republic of China Patent Publication invention of 42842 at No. 3

P.5 511413 V. Description of the invention (2) Recovery and reconstruction of defective printed circuit boards "," Manufacturing Methods of Circuit Boards "of the Republic of China Invention Patent Bulletin No. 443081, U.S. Patent No. 549307 6 structure for repairing semiconductor substrates ". However, the method of "recycling and rebuilding" described in the above patent is a common concept technology in the 7-page domain of various industries, that is, removing the bad and old parts, and then replacing the good and new parts with the original ones. Machinery and equipment, such as the waste metal specialized industry developed from the import of waste metal from Japan in the past, was partially damaged or no longer in use because of imported waste metal 1 = including a large amount of used hardware in Japan at that time = play = board or telephone Circuit boards, waste hardware manufacturers, especially when dealing with waste, first look at the middle of the circuit board one by one), and at that time, the Taiwan chapter had prepared Lei Zheng also = species (the most important of integrated circuit board parts, c is often Out of stock, or ^ C electricity, buy the good $ 检视 from the waste circuit board directly, because it is implanted in a new circuit board with the exact same design (including ^ c technology and moved it) to replace the The connection of the I r and A pins of the if is also 4 m A Μ. If it is damaged, it will be assembled into a new electric tax or electric machine for sale. Therefore, the "large% of the toy industrial zone was waste hardware. (Professional area) Telephone is the second: Kaohsiung Dafajian Product completion methods: Lee: Recycling further increase this relatively simple structure body, not as a printed circuit board of the current I c is provided by the junction shorter, and smaller and more diverse functions to strengthen. Recognize the juice and lightness, therefore, the aforementioned bulletin number 4 2 8 4 2 3 "Recycling and Rebuilding Method of Road Boards" and Bulletin No .: f Manufacturing method of defective printed circuit boards "two invention patents = 3 〇 No. 8 丄, “Performance must be coordinated with each other on page 6 511413 V. Description of the invention (3) ___ When the precise joining technology, that is, the implementation of joining technology in each connection •, otherwise it cannot be achieved. However, the aforementioned printed circuit boards with less defective invention patents such as Announcement No. 4 2 8 4 2 ^ Utilization of Recovery and Reconstruction Method, etc., have the following disadvantages during implementation: Bonding methods and techniques (compared to ::: The "fitting squares are removed from the printed circuit board to form a gap" on the road f and the "fitting squares are taken out of the printed circuit board. The good printed circuit is cut into" -grooves and-tabs ". It is used to cut and brush the circuit board because of the connection piece space #ff "at the connection point, and partly printed with -protruding piece". Therefore, it is not suitable; it is cut into "-groove board design." I is used for printed circuits of various circuit boards 2, "And again, a plurality of joints are fitted with each other, The structure of the "open piece" is cut with a cutter, and the slot is formed with an opening width smaller than the bottom width, but it is knotted. ^ Is smaller than the top width, so the convex piece and the slot can be closely connected. " ,, ... will produce a tight or loose fit relationship, and if it is brushed: it is not easy to fit a connection point (circuit board and printed ΚίΐΠdegree) ', and if it is loose fit, then the process is compiled. It is not easy to align and position, which directly affects the subsequent 3 3: two :: and-the convex piece "fit and combine, whether it is closely matched with the knot 'shape two = system' · the gap between the groove and the convex piece is difficult to glue Make α & 乂 stable, if glue is applied from the surface of the circuit board,

If it affects the subsequent printing, the good printing condition of the good product may not be accepted in the subsequent S process, so that the subsequent process is to provide a suitable removal and recycling method. On the chip, the method includes the first system of the printed circuit board. Under the control of milling, the first printed circuit is milled on the connecting pieces to fit and fix the second printed circuit board, and the program is controlled to automatically mill the connecting pieces to be milled into appropriate steps. The adhesion effect is particularly difficult. "The fruit is not good, the thickness is thick and the tin is poor. Also, if the adhesion effect is not mrface M_ting) the surface pressure of the plug-in will cause the new board to break away from the printed circuit board or shift. Doing more with less: In view of this, the main purpose of the present invention is to connect the various sub-circuits of the printed circuit board + good unit sub-circuits to the printed circuit board. (A) The mold plane is used to clamp and fix the first plane; (b) With the NC processing machine, the defective sub-circuit boards in the process are stepped; (c) The second plane is clamped by the mold module again, and some good products are added by the NC. (D) apply a layer of coating agent to each of the appropriate stepped shapes of the first printed circuit board, and combine the good sub-circuit boards taken out in step (c) with the first printed circuit board, Instead of removing the defective daughter board, a new printed circuit board is formed; (e) each of them is adhered to each other through the appropriate stepped connecting pieces, and the new printed circuit board is then used by the mold module Compressed type and precision plate

511413 5. Description of the invention (5) Make the new printed circuit board flush; and (f) Put the new printed circuit board of step (e) in an oven to make the layer of adhesive The new brush circuit board is solidified by heat, and the new brush circuit board is formed by bonding. In order to make the above and other objects, features, and advantages of the present invention more clearly known, the following describes the preferred embodiments of the present invention in detail with the following details: < Illustration > The present invention is shown. The second drawing is a drawing showing a circuit board of the present invention. The third drawing is a set of circuit boards of the present invention. The fourth drawing is a part showing the invention. The fifth drawing is a drawing showing the present invention. The first printing and the sixth drawing are schematic diagrams of the printed circuit board of the present invention, and the seventh drawing is a schematic diagram of the present invention. View of the printed circuit board of the first preferred embodiment An exploded view of the mold module holding the printed body of the first preferred embodiment. First: a schematic illustration of the mold module clamping printing of the preferred embodiment. Large picture of removing defective sub-circuit board of the first preferred embodiment. The first preferred embodiment is a three-dimensional schematic diagram of bonding a good product circuit board to a circuit board. The second preferred embodiment is a schematic diagram of a mold module holding multiple pieces. Second preferred embodiment of the first printed circuit board stand

Page 9 511413 V. Description of the invention (6) The eighth diagram is a schematic diagram showing the second preferred embodiment of the present invention. The ninth diagram is the second preferred embodiment of the present invention. The tenth drawing of a three-dimensional schematic diagram of a printed circuit board is a flowchart of a method for using a step-shaped adhesive board according to the present invention. 0 < Illustration of drawing number > 1 0 Edge board 1 2 a 1 2 e Positioning of the printed circuit board Hole 1 4 a 1 4 d Positioning hole 1 6 a 1 6 d Position _ 丨 丨 丨 _ Positioning hole 1 8 Connecting piece 2 0 Point row slot 2 2 X 2 4 5 6 6 2 Good product sub circuit board 2 6 、 2 8, 5 8 Bad sub-circuit board 2 9 Mold board 3 0 Mold module 3 2 ax 3 2 b Bead 3 4 a X 3 4 b X 3 4 CX 3 4 d Press plate 3 6 Bolt hole 4 0 Bolt 4 2 Gasket 4 4 oval hole

Page 10 M1413 V. Description of the invention (7) 4 6 5 0 a, 5 5 2 a, 5 5 4 6 0 1 0 0 1 0 Ob The first 'recession hole 0 b pressure plate positioning hole 2 b mold plate positioning The hole positioning pin adhesive refers to the first printed circuit board and the second printed circuit board. Referring to FIG.-FIG., It is a view showing a printed circuit board according to a first preferred embodiment of the present invention. This first printed circuit board i 〇 a, board 10, good product sub-circuit boards 22, 24, and% :, 28. Among them, the first-quality sub-circuit boards 2 2, 2 4 and the bad sub-circuit boards 2 6 and 2 8 are good sub-circuit boards that have been tested and tested. Of course, other bad sub-circuit boards may also be included. The occurrence of the probability is that the good sub-circuit boards 2 2, 2 4 and the bad sub-circuit boards g 6 and 2 8 are different. The edge connection board 1 has multiple printed circuit board positioning holes 2a ~ 12e, and these unit sub-circuit boards 22 to 28 also have the same positioning holes, such as the first positioning holes i 4 a to 丄 4 d and the second positioning holes 16 a to 16 d. Quickly locate the first printed circuit board 1 0 0 a ° However, the sub-circuit boards 2 2 to 2 8 are connected to each other by a plurality of connecting pieces 18 and are commonly connected to the edge connecting plate 1 0. These connecting pieces ^ The number of 8 is different from the type according to the design of each printed circuit board. "Specially," the connecting portions of these connecting pieces 18 have multiple points, respectively.

511413

Row slot 2 〇, these are separately designed by the same mold module design, a number of pressure plate pieces 4 2, retreat the positioning pins brush the circuit board set 1 4 a ~ 1 hole) bit plate 3 4 a The size and position are not limited. However, the method is as follows: 0 a is sleeved on the pin 5 4, and a, 3 4 b is provided with a module 30, a bolt 40, and b. It is used to facilitate the cleaning of the good cripple circuit. Refer to the second figure. Hold the printed electrical mold module 3 3 4 a, 3 and make holes 4 6, 5 4 and so on. The position holes 1 2 a 4 d (the first set and the configuration of 3 4 b) For example, these are shown in the same figure as the mold. The mold of the present invention is shown in FIG. Two, respectively used. In particular, the lock on the die plate or direct milling plate 2 2 ~ 2, which is a three-dimensional drawing of the road board 0 'including two 4 b, multiple oval holes in the bolt' these fixed ~ 1 2 e (locating hole), in this mold, it is also in the same shape as the die concession hole 4 6 with the plate 29. With the module 30, first, fix the 30 fixed bead 3 2 multiple bolts 4 the plate positioning hole The mold of 9 9 breaks these connections 8 ° The first exploded schematic diagram of the present invention is a group of bead 3 2 holes 3 6, screws 4 4, and bit pins 5 4 are located on the side plate 1 6 a ~ 1 group 30, with a mold Group 3 G, and positioning lock 5 with elliptical holes, which recovers multiple sizes a, 3 2 b 0, gaskets 4 5 0 a, g plate positioning holes g piece 1 8 printed on this first print, and is preferably implemented For example, according to this issue a, 3 2 b check 40, pads of multiple sizes do not correspond to the print 1 0), 6 (the second surely its multiple pressed die plate 2 4 4 shape 4 fit, so brush Electricity Circuit board 1 0 Different positioning and pressure plate 3 4 2 Screws 2 a, 5 2 fixed on the mold 0 b

511413

It is a schematic diagram showing the combination of the first preferred embodiment of the present invention. At this time, the bed (not shown in the figure) or 30. The processing machine includes: N c figure is not shown), that is, the defective sub-circuit board 2 6, 26, 28 and The edge connection plate 10 is appropriately stepped. Please also refer to the subroutine for removing bad sub-circuits in the preferred embodiment as shown in the C-C cross section, where the vacancy is an appropriate step. For example, the mold module loses the printed circuit board mold module 3 〇 It is also fixed to the processing machine Originally located on the processing machine This mold module, CNC and other automatic processing center machines (except the first printed circuit board 1 0 〇a 2 8, ie, cutting each connecting piece 1 2 between 2 4, 2 6; and showing four pictures' which is the enlarged view of the part behind the first board of the present invention in green. In addition, as for each connecting piece 1 8 On, milled

After that, the printed circuit board to be discarded after testing (that is, the second printed circuit board i00b of the present invention) is also provided with a good quality sub-circuit board, which is unfortunately discarded and the cost is increased. Therefore, by using the mold module 3 of the present invention to hold the second printed circuit board i 00b, it is necessary to reverse the second printing because the good sub-circuit board thereon is to be removed and a suitable step shape is milled on the connecting piece. The circuit board 100b, which is the back side (the second side referred to in the present invention, can also refer to Figure 7 at the same time), mills off the connecting pieces 18 between the defective sub-circuit board and the good sub-circuit board, and directly takes out the good sub-board Circuit board. It should be emphasized that the appropriate stepped shapes of the first printed circuit board 100a and the second printed circuit board 丄 oob of the present invention on each of the connecting pieces 18 are formed using Nc automatic sharpening and sharpening. Leave an appropriate margin for subsequent coordination. Reference is made to the fifth figure at the time of Ming, which is a schematic perspective view showing a first preferred embodiment of the present invention bonding a good daughter circuit board to a first printed circuit board. its

Page 13 511413 5. In the description of the invention (ίο), as shown in the section D-D, when bonding, apply a layer of adhesion on each appropriate stepped surface of the first printed circuit board 1 0 0 a in advance. Agent 60, and then the good sub-circuit board removed from the second printed circuit board 100b is bonded to the appropriately stepped connecting piece 18 of the bad sub-circuit board that has been milled. Compress the new printed circuit board into a mold by using the mold module 30, so that the new printed circuit board is flush and accurately positioned, and then precure the new printed circuit board—after an appropriate time, Into the oven ', the adhesive 60 is postcure by heat, and the new printed circuit board is bonded and fixed. In addition, the method for recycling printed circuit boards of the present invention is to complete the work of bonding good quality sub-circuit boards in the mold module 30, including the processes of clamping, fixing, milling, bonding, and thermosetting, which can be seen in the present invention. Convenience.

Please add a module in this post to add another group of 30 to brush the circuit and add a second better group of 30 to include ... N

The second preferred reference is the first of the misunderstandings and the first of the misunderstandings, " 丨 _ 丨 丨 &" On the above, the board can be smooth and the embodiment is fixed to C, the sixth embodiment of C, which is a comparison of the printed circuit board. In the preferred embodiment, the printed circuit board 1 mills the first 0b at the same time, and it is no longer effective. Please also refer to the first printed electric bed (automatic processing machine NC, etc., which shows the combination of the present invention, which is 0 0b. The printed circuit is broken in stages. Two better practical intentions. This real mold module is also shown on the plate 100a, milling, and its system will show a schematic diagram. When), this (the figure does not show the embodiment of the mold Different from 30, this mold and the second stamp increase the aging of the first mold mold processing machine package of the present invention), that is, open

511413 surface) This first uncut edge 5 6 is cut into a shape that can be positioned by a knife. Ten reference circuit board Ryoko Electric This second printed circuit board 6 Second printed second stamp, directly, use NC degrees The meaning is to refer to the first circuit board paste before the appropriate stage, and then mill 10 0b 0 b (but unfortunately, 0 b is back 0 0 b. Good quality sub-circuit board 6 2 Don't mill into step-shaped circuit board. The unit circuit board 5 8 of the brush circuit board 1 0 0 1 0 0 a is shown in the order of 8 and 10, and the CNC sharp bed that is manufactured by the present invention is to be milled quickly. The second preferred embodiment of the present invention. When the first printed circuit board 1 is removed, and the printed circuit board 1 is tested for unqualified second printing, the cost of the printed circuit board (which is held on this board) 2 Apply the layer of adhesive on the top surface of the second solid a. V. Description of the invention (11) Machine milling removes the plate 5 8 (picture), that is, the method of cutting 1 8 and milling the plate, bed), automatic i appropriate Ladder please print the second 0 0 a no 0 0 b 〇 at the same time and discard the first good product of electricity, flip this Take the other side of this 0). It should be emphasized that 18, it is appropriate to leave a suitable piece of film on 18, please also attach good products to each printed circuit board at the same time, this bad product, 5 8 It is like a ladder with 5. The automatic program control tool is convenient for sharpening each point and is eight figures, which is a three-dimensional schematic diagram of the circuit board 5 8 after the printed circuit board 1 0 2), because the circuit board 1 0 is brushed and the circuit board 1 is removed. And take out this good product sub-electric automatic milling machine, then this good product is milled into an appropriate nine diagram, which is connected to the first printed circuit board ladder surface, the bad sub-circuits are tested to obtain each connection piece to receive the printed circuit (or NC The milling piece 1 8 has been improved by one or more. It is therefore called the second mold module 3 in the invention. The figure of each connection piece is not shown in the figure, and a schematic diagram of a preferred embodiment of each connection is shown. When the product circuit board 60, Again

P.15 511413 V. Description of the invention (12) Good quality sub-circuit board 6 Step-shaped connection piece Circuit board compression-type compact positioning, and after this time, send it to the oven to complete the new, but this hair There are 8 important points mentioned here and by bonding, the sub-circuit boards are bonded to each other. For the form of 18, please refer to the tenth structure. Recycling and clamping C. Sub-circuits are the second, step three, step five. Apply a sub-circuit to the printed circuit to fix the first machine to the process board; the steps are milled to the appropriate surface, and the milling is formed to form the appropriate and step four: the printed layer adhesive board is pressed against the township. The board and the stepped shape are directly removed. In the same mold module 18, it is not limited to 8, and the cost is reduced. Shown according to the process map. The first, the first, and the first printed circuit board are made into a flat plane by using a mold module. Each of the sub-circuit boards 5 6 is appropriately used. The new printed circuit board is formed into a flat plane. Precure of precision circuit boards — when appropriate, agent 60 is solidified by heat (post cure), especially eight sub-circuit boards are shown in the figure. The present invention can be milled into an appropriate step shape, and each appropriate step shape Good quality effect. For this reason, non-link 2 fits on Liang 18. Facilitate the use of this new new printed circuit board to make sticky potato printed circuit boards. However, these connecting pieces 1 are pressed and heat-connected to achieve multiple figures. The method of drawing the board is to print the printed circuit board and control the milling and removing three: in the step shape; the step and the sub-circuit circuit board are presented; steps Six: The first printed circuit of the present invention uses step one: a flat plane; a step of printing a printed circuit board to brush the circuit board to clamp the second product circuit board of the good product circuit; Group two: connecting the printed circuit boards between the printed circuit boards by the bad ones of the connecting plates (however, cutting work); on the chips, the good products of step five are respectively; step seven:

Page 16

511413 V. Description of the invention (13) Put it into the oven, solidify (ρ 〇 s t c u r e) to form, and complete this new printed circuit board. Although the present invention has been disclosed as above with two preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and decorations without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

Page 17

Claims (1)

511413 VI. Application Patent Scope 1. A method for recovering printed circuit boards by using stepped Wechat ^^ yttrium structure, the printed circuit boards each have a _plane, _: plane ... edge connection board, Plural good early morning 夂, and a plurality of connections: board bad sub-circuit board ▲ The purlin is in the middle of the sub-circuits; te series 相互 are connected to each other by the ί slice and fixedly connected to the side connection board The method for recovering a printed circuit board by using a step-like bonding structure includes: ⑷ = mold module clamps and fixes the first printed circuit board of the first ⑻ = 'programming-milling the first printed circuit The board steps are respectively sharpened on the connecting pieces (CH uses a mold module to hold and fix the processing machine of the second printed circuit board, and automatically program the 2L sub-circuit board by program control. These connection pieces are milled into the appropriate step (d) = each of the first-printed circuit board the appropriate step-like coating = the good sub-circuit boards removed from step (c)? 忒, 忒 the first printed circuit board, Instead of removing the bad daughter board ' A new printed circuit board; (e) t do not adhere to each other through the appropriate stepped connecting pieces, and then use the mold module to press the new printed circuit board into a compact and precise shape, and then make the new The printed circuit board is flush; and, f) the new printed circuit board of step (e) is placed in an oven, and the remote adhesive is heated and solidified to bond and fix the new printed circuit, page 18, 511413 6. Scope of patent application. 2. The method for recovering printed circuit boards by using a step-like bonding structure as described in item 1 of Shen Qing's patent scope, wherein the processing machine includes a CNC automatic processing center machine. 3. The method for recovering a printed circuit board using a step-like bonding structure as described in item 1 of the scope of the patent application, wherein when milling each of the step-shaped connecting pieces, an appropriate margin is reserved. The appropriate margin includes the margin after applying the layer of adhesive, so that the mold module is pressed into a composite type, so that the bonded good-quality sub-circuit board can be flush with the bad sub-circuit board that was originally discarded. 4 methods for recovering printed circuit boards by using a step-like bonding structure, the printed circuit boards each having a first plane, a second plane, one side connection board, a plurality of good sub-circuit boards, and a plurality of bad sub-circuit boards This and a plurality of connection pieces, wherein the sub-circuit boards are connected to each other by the connection pieces, and are fixedly connected to the edge connection plate. The method for recovering the printed circuit board by using a step-shaped adhesive structure includes: (a) using a mold module to clamp and fix the first (b, face, and the second plane of the second printed circuit board); the NC processing machine is used to program-control the milling In addition to the first printed circuit board, the defective sub-circuit boards, and the connections between the good sub-circuit boards and the defective sub-circuit boards of the second printed circuit board are removed, and are respectively located in the The connection pieces are milled into an appropriate step shape to remove the bad sub-circuit boards on the first printed circuit board, and form vacancies. The good products are taken out from the second printed circuit board. 511413 ——_— · Patent application scope Road board; (d) Adhering to the first coating agent and forming a new one (e) After the molds are respectively used, (f) The step board is further implemented. 5. If applying for printed electrical processing 6. If applying for printing electrical connection for coating, so that Ryoko Electric will print the step through the adapter module to make the new step (e adhesive patent road board) Slots of the patented fan board, when the layer of the road board is applied. Each of the appropriate step-like (c) circuit boards is replaced by the good products, replacing the defective ones that have been removed; circuit boards ; When the stepped connecting pieces press the new printed circuit board to form a flush printed circuit board with each other;) the new printed circuit board is put into heat and solidified, and the Xinwei item 4 is bonded and fixed The step-adhesive method described above, wherein the processing machine includes the step-adhesive method described in item 4 above, wherein when milling each one, a proper margin is reserved. The margin is such that the mold product circuit board can be flush with the original coating of a layer of adhesive circuit board, the circuit board, the shape bonding is precise and precise, and the printed circuit connection structure in an oven is automatically recovered by CNC. Structure back The step-wise margin should include the module compaction, and should be discarded. Page 20