TW508283B - Method and device for assembling Ti alloy enclosure component for notebook computer - Google Patents

Method and device for assembling Ti alloy enclosure component for notebook computer Download PDF

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Publication number
TW508283B
TW508283B TW90120982A TW90120982A TW508283B TW 508283 B TW508283 B TW 508283B TW 90120982 A TW90120982 A TW 90120982A TW 90120982 A TW90120982 A TW 90120982A TW 508283 B TW508283 B TW 508283B
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Taiwan
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thin shell
seat
hole
welding
argon
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TW90120982A
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Chinese (zh)
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Han-Bin Lian
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Han-Bin Lian
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Abstract

The present invention relates to a method and a device for assembling a Ti alloy enclosure component for a notebook computer, which mainly uses a shape-copying mold and an argon welding technique to weld a combination seat and an enclosure body into an integral body. The main objective of the present invention is to provide a method and a device for assembling a Ti alloy enclosure component for a notebook computer, which simplifies the formation procedure of a Ti alloy enclosure and reduces the technical complexity in producing an enclosure. A second objective of the present invention is to provide a method and a device for assembling a Ti alloy enclosure component of a notebook computer, which can use an automatic control technique to achieve an automated operation to increase the production speed of a Ti alloy enclosure. Another objective of the present invention is to provide a method and a device for assembling a Ti alloy enclosure component of a notebook computer, which increase the production rate and quality stability of the Ti alloy enclosure to reduce the production cost.

Description

508283 五、發明說明α) [發明領域] 本發明係有關於一種鈦金屬薄殼元件之結合方法及過 程中輔助使用之裝置,特別有關一種筆記型電腦用鈦合金 薄殼元件組合方法及裝置。 [先前技術] 、目前市 消費性的產 者,尤其可 撞等附加價 框架、隔板 早期業者便 卡榫、定位 到輕量化條 以承受在使 之殼體有先 生裂損,或 解之材質不 A、筆記型 之技術。 近年來 殼體逐漸以 料,如鎮合 科技電子產 面上的 品,多 隨身攜 值,為 等結構 大量的 銷、螺 件的同 用過程 天上結 因受熱 符環保 電腦等 由於輕 輕金屬 金、#呂 品特別 電子產品 以輕薄短 帶的產品 使產品達 元件便以 使用塑膠 孔座等結 時,卻很 中隨機被 構強度不 而發生變 訴求,若 精密產品 金屬材料 材質取代 合金、鈦 是筆記型 ,如家用 小、功能 更講究體 到上述之 輕量化為 射出方式 合結構之 難兼顧到 動的碰撞 佳的遺懷 形的現象 作為可攜 之殼體結 電器、 強大等 積小、 機能* 其;設計 製造一 殼體, 整體結 壓力, ,受外 ,且塑 型電子 構材料 電躅 訴求 重量 產品 目標 體成 然而 構強 因為 力撞 膠乃 產品 、手 吸引 輕、 的殼 ;因 型, ,在 度是 塑膠 擊即 百年 如P 然非 機等 消費 耐碰 體、 此, 具有 考慮 否可 材質 易產 不分 D 完善 技術的逐漸成熟,電子產品的 塑膠材質作為薄殼元件之材 合金等材質已大量的使用在高 電腦上,而又以鈦合金材質為508283 V. Description of the invention α) [Field of the invention] The present invention relates to a method and a device for assisting the use of titanium thin shell components, and particularly to a method and a device for assembling titanium alloy thin shell components for notebook computers. [Previous technology], the current consumer producers in the market, especially collided with additional price frames, early distributors of partitions will be tenoned, positioned to lightweight strips to withstand the cracks in the shell, or the material of solution Not A. Note-based technology. In recent years, the housing has gradually been made of materials. For example, the products produced by Zhenhe Technology Electronics Co., Ltd. carry many values with them. The process of using a large number of pins and screws with the same structure in the heavens is caused by heating and environmental protection. # 吕 品 Special electronic products When using thin and short products to make products reach components, plastic sockets are used, but the structure is very random and the demand does not change. If precision products are made of metal materials instead of alloys and titanium, Note type, such as small household, more functional, the above-mentioned light weight is the injection mode and the structure is difficult to take into account the dynamic impact of the good-for-nothing phenomenon as a portable case, electrical appliances, powerful, small size, function * Its; the design and manufacture of a shell, the overall junction pressure, and external and plastic electronic construction materials require weight of the product target body formation, but the structure is strong because the impact of the rubber is the product, the hand attracts light, shell; due to the type , The degree is a plastic hit, that is, a hundred years of consumer resistance such as P, but not a machine. Therefore, it is necessary to consider whether the material is easy to produce regardless of D. Perfect technology is gradually mature. The plastic material of electronic products is used as the material of thin shell components. Materials such as alloys have been widely used in high computers, and titanium alloy materials are used as

508283 五、發明說明(2) 大宗,該以欽金屬材料製造的殼體’具有結構強度高、尺 寸更薄、又可防止電磁干擾的優點,而且符合環保回收之 訴求,但目前已揭示之技術係採用壓鑄、觸變成型或锻造 成型的技術製造薄殼體,但上述技術之製程需以壓力、熔 煉,等成形技術,難施用於硬度較高及易氧化的之欽合金 薄殼元伴上,特別是薄殼元件的結合結構更無法使用上述 成形技術直接建構在薄殼體上,且上述技術成品率及尺寸 限制仍有技術瓶頸待克服。508283 V. Description of the invention (2) Bulk, the casing made of Chin metal material has the advantages of high structural strength, thinner size, and can prevent electromagnetic interference, and meets the requirements of environmental protection recycling, but the technology has been revealed so far The thin shell is made by die-casting, thixoforming or forging technology, but the process of the above technology requires pressure, melting, and other forming techniques. It is difficult to apply it to the thinner shell of the Chin alloy with higher hardness and easy oxidation. In particular, the combined structure of thin shell elements can not be directly constructed on the thin shell using the above-mentioned forming technology, and the above-mentioned technical yield and size limitations still have technical bottlenecks to be overcome.

又,習知如中華民國第1 2 6 7 7 4號專利「具有結 合元件之金屬薄殼件之製造方法」,其係利用金屬板材經 過塑性成型技術製成薄殼元件,然後配合結構用膠,將結 合元件接合於已塗佈結構用膠之接合座上,使其具結合功 能之殼體,惟',該技術在塗膠之前必須經過洗淨程序,或 在表面做特殊處理,才可確保結構用膠的結合度,再者, 雖然結構用膠之k拉性較強,但抗剪力卻很弱,即使藉設 計技巧來克服,其效果仍有限,且徒增設計的難度及製作 成本。 基於上述所提各習知技術有成品率低、製作大尺寸元 件不易及結合元件與薄殼元件結合強度低等缺失,本發明In addition, it is known that the patent of the Republic of China No. 1 2 6 7 7 "Method for manufacturing metal thin shell parts with bonding elements", which is made of thin shell elements by using plastic sheet metal through plastic molding technology, and then used with structural glue , The bonding element is bonded to the bonding base of the structured structural adhesive, so that it has a bonding function of the shell, but ', the technology must be washed before the glue, or special treatment on the surface, To ensure the bonding degree of structural adhesives. Furthermore, although the structural adhesives have strong k-stretching properties, the shear resistance is weak. Even if they are overcome by design techniques, the effect is still limited, and the design difficulty and production are increased. cost. Based on the conventional technologies mentioned above, the present invention has the disadvantages of low yield, difficulty in making large-sized components, and low bonding strength between the bonding component and the thin shell component.

人乃積極潛心研發試做較佳之薄殼體加工技術,終乃得本 發明。 [發明特點] 本創作之主要目的,係要提供一種筆記型電腦用鈦合People have actively devoted themselves to the research and development of better thin-shell processing technology, and have finally achieved the present invention. [Inventive Features] The main purpose of this creation is to provide a titanium alloy for notebook computers.

508283 五、發明說明(3) 金薄殼元件組合方法及裝置,簡化鈦合金薄殼件的成型程 序,降低製造薄殼體之技術難度。 本創作之次要目地係要提供一種筆記型電腦用鈦合金 薄殼元件組合方法及裝置,可應用自動控制技術達成自動 化作業,提高鈦合金薄殼體的生產速度。 本創作之另一目地係要提供一種筆記型電腦用鈦合金 薄殼元件組合方法及裝置,提高鈦合金薄殼工件的成品率 及品質穩定度,以降低生產成本。 為使貴審查委員對本發明創設之真諦及應用之技術能 更瞭解,兹以較佳實施例並配合圖示闡明如后。 要係藉 殼體( 示之筆 份: 第2圖 薄殼體 造型闫 上方設 及位置 置相對 露於殼 係、一種筆記型電腦 用鈦合金薄殼元件組合方法 ),利用氬銲技術將結合座 一體之方法與裝置,其成品 鈦合金薄殼體者。 示,其中靠模(1 )係一部 穩定靠合之置具,該靠模 )之造型設計而另作改變, 之孔座(1 1 ),孔座(1 3 )預先設計之結合座(4 座(1 1 )之深度恰為結合 ,内徑恰等於結合座(4 ) [發明說明] 本發明 及裝置,主 (4 )與薄 如第1圖所 裝置部 請參考 份外型可與 (1 )主要 靠模(1 ) 1 )的數量 )數量及位 座(4 )暴 一靠模(1 3 )溶銲成 記型電腦用 、第3圖所 (3 )相互 薄殼體(3 有數孔預留 依薄殼體( 設置,該孔 面上之高度508283 V. Description of the invention (3) Combination method and device of gold thin shell components, simplifying the forming process of titanium alloy thin shell parts, and reducing the technical difficulty of manufacturing thin shells. The secondary purpose of this creation is to provide a combination method and device of titanium alloy thin shell components for notebook computers, which can use automatic control technology to achieve automatic operations and increase the production speed of titanium alloy thin shells. Another purpose of this creation is to provide a method and a device for assembling titanium alloy thin shell components for notebook computers to improve the yield and quality stability of titanium alloy thin shell workpieces, so as to reduce production costs. In order to make your reviewers better understand the true meaning of the invention and the applied technology, the preferred embodiments are illustrated in the following with the illustrations. It is necessary to borrow the shell (the shown pen: Figure 2 thin shell shape and upper position and position relatively exposed to the shell system, a titanium alloy thin shell component combination method for notebook computers), using argon welding technology to combine The integrated method and device of the seat, and the finished titanium alloy thin shell. As shown in the figure, the formwork (1) is a stable and close fitting, and the shape design of the formwork is changed. The hole seat (1 1) and the hole seat (1 3) are pre-designed combination seats ( The depth of the 4 seat (1 1) is just combined, and the inner diameter is exactly equal to the combined seat (4) [Explanation of the invention] The present invention and the device, the main (4) and the thin as shown in Figure 1. Please refer to the appearance (1) The number of main molds (1) 1) the number) and the number of seats (4) The first mold (1 3) is welded into a computer for storage, and the thin shell (3) shown in Figure 3 (3) There are several holes reserved according to the thin shell (set, the height of the hole surface

第6頁 508283 與 體 圍 ( 薄 於 為 要 穿 事 時 4 氬 發明說明(4) 外圍,此外,孔座(1 1 )周 12),於孔座(11)與氣 靠模(1 )水平面略有落差之 (2 )以螵絲從靠模(1 )下 之氣孔(1 2 )罩住,該罩體 21),連接從氬氣筒導出之 殼體(3 )係先以鈦合金板材 其上同時形成數個穿孔(3 1 具結合結構(如外螺紋柱,内 構體外另突設一銲柱(4 1 ) 孔(3 1)並突出一適當之突 先經加X大量製造備用。 實施方法、: A ·首先將具有結合結構 1)之孔座(11)内並完成 部份突立於靠模(1 )水平面 ,銲柱(41)與穿孔(31 a圖所示)。 B ·續開始從氬氣管(2 2 ) 氣經過氣孔(1 2 )、導氣槽 與薄殼體(3 )之間充滿氬氣 銲之技術(如第4 b圖所示) 圍進行電弧熱嫁,直到銲柱( 圍設至少 孔(1 2 導氣槽( 方分別將 (2 )中 氬氣管( ,經沖壓 );另, 螺紋孔) ,該銲柱 出量,該 一個穿通的氣孔 )之間銑與一道 13),數個罩 孔座(1 1 )周 心突設一接管 2 2 )。上述之 技術直接成型, 結合座(4 )係 之構件,於其主 (4 1 )可穿過 結合座(4 )可 氬 周 合為一體 之結合座(4)置入靠模 定位,此時僅銲柱(4 1 ,於蓋上薄殼體(3 ) )保持適當之間隙(如第 提供適丨當流量之氬氣, j (13),使結合座(4 形成無氧的狀態,然後以 ,對銲柱(4 1 ) 分及 4 1 )與薄殼體(3 )熔Page 6 508283 and the body circumference (thinner than the time to wear things 4 argon invention description (4) periphery, in addition, the hole seat (1 1) circumference 12), the hole seat (11) and the air cushion (1) horizontal plane A slight drop (2) is covered with a wire from the air hole (1 2) under the master (1), and the cover body 21) is connected to the shell (3) derived from the argon cylinder. Several perforations (3 1 with a combination structure (such as externally threaded posts, internal structure, and a welding post (4 1) hole (3 1) are protruded outside the internal structure and protruded an appropriate protrusion, and a large number of X are used to make a spare. Implementation method, A: First, the hole seat (11) with the combined structure 1) is completed and partially projected on the level of the master (1), the welding column (41) and the perforation (shown in Figure 31a). B · Continue to start the technique of arc welding from the argon gas tube (2 2) through the pores (1 2), between the gas guide groove and the thin shell (3). Welding column (enclose at least a hole (1 2 air-conducting troughs (squares will be argon gas pipes (2), punched; respectively, threaded holes)), the output of the welding column, the one through the gas Between) and a milling 13), a plurality of the boss cover (11) is provided a projecting peripheral heart takeover 22). The above-mentioned technology is directly formed. The components of the combination seat (4) can pass through the combination seat (4) through the combination seat (4). The combination seat (4) can be placed into the mold for positioning. Only the welding column (4 1, cover the thin shell (3)) with a proper gap (as provided by the appropriate flow of argon, j (13), make the binding seat (4 into an oxygen-free state, and then Therefore, the butt welding column (4 1) and 4 1) are fused with the thin shell (3).

第7頁 508283 五、發明說明(5) C .待冷卻之後,以砂帶機從銲合部份之表面處理平 順,即完成一具結合結構之鈦合金薄殼元件(如第4 c圖 所示)。 依本發明實施,吾人以基本的沖壓加工技術即可成型 得到完成率5 0%以上的薄殼半成品,大幅降低鈦金屬薄殼 件的加工技術難度,及縮短整個製程的時間,甚至可以製 作更薄、結合難度更高的薄件,且,製程中配合靠模以氬 銲之技術可確切的將兩分離構件結合為一體者,提高產品 穩定性及成品率;此外,佐以自動化控制的技術,更可將 進料、銲接的動作改以機械自動操作,Λ幅降低成本。 綜上所述,本發明之筆記型電腦用鈦合金薄殼元件組 合方法及裝置,其可大幅降低薄殼元件的組合技術難度, 減短製程時間,,製作尺寸更薄的薄殼元件,確保結合結構 的穩固性,經本發明實施的成品率極高,可直接進行後續 的表面處理,實溱降低生產咸本,實為一不可多得的智慧 創作。 雖然本發明已以前述較佳之實施例揭示,然其奠非用 以限定本發明,任何熟悉此技藝者,在不脫離本發明之精 神和範圍内,當可加以潤飾與修改,因此本發明之保護範 園當視後附之申請專利範圍所界定者為準。Page 7 508283 V. Description of the invention (5) C. After cooling, smooth the surface of the welded part with a sander to complete a titanium alloy thin shell element with a combined structure (as shown in Figure 4c). Show). According to the implementation of the present invention, we can use the basic stamping processing technology to form a thin shell semi-finished product with a completion rate of more than 50%, which greatly reduces the processing technical difficulty of titanium metal thin shell parts, and shortens the entire process time, and can even produce more Thin, more difficult to combine thin pieces, and the technology of argon welding with the master during the manufacturing process can accurately combine the two separated components into one, improving product stability and yield; in addition, it is supplemented by technology of automatic control In addition, the feeding and welding operations can be changed to mechanical automatic operation, which reduces the cost. In summary, the titanium alloy thin shell component assembly method and device for a notebook computer of the present invention can greatly reduce the technical difficulty of assembling thin shell components, shorten the process time, and produce thinner thin shell components to ensure Combined with the stability of the structure, the yield rate after the implementation of the present invention is extremely high, and subsequent surface treatment can be directly performed to reduce the production cost, which is a rare wisdom creation. Although the present invention has been disclosed with the foregoing preferred embodiments, its invention is not intended to limit the present invention. Anyone skilled in the art can be retouched and modified without departing from the spirit and scope of the present invention. The protection of Fan Yuan shall be determined by the scope of the attached patent application.

第8頁 508283 圖式簡單說明 第1圖係本發明之筆記型電腦用鈦合金薄殼體立體圖 第2圖係本創作之實施裝置示意圖。 第3圖係本創作之局部視圖。 第4 a — 4 c圖係本創作之實施流程示意圖。 [圖號說明] ‘ 1 ·靠模 1 1 .孔座 1 2 ·氣孔 1 3 .導氣槽 2 .罩體 2 1 ·接管 2 2 .氬氣管 3 .薄殼體 3 1 ·穿孔 ‘ 4 .結合座 4 1 ·銲柱 5 .氬銲銲搶 6 .砂帶機 %Page 8 508283 Brief Description of Drawings Figure 1 is a perspective view of a titanium alloy thin shell for a notebook computer of the present invention. Figure 2 is a schematic diagram of the implementation device of this creation. Figure 3 is a partial view of this creation. Figures 4a-4c are schematic diagrams of the implementation process of this creation. [Illustration of drawing number] '1 · Retainer 1 1 .Pocket seat 1 2 · Air hole 1 3 .Air guide groove 2 .Cover body 2 1 · Tube 2 2 .Argon gas pipe 3 .Thin shell 3 1 · Perforated' 4. Combined seat 4 1 · Welding column 5. Argon welding welding grab 6. Belt machine%

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Claims (1)

508283 六、申請專利範圍 1 · 一種筆記型電腦用鈦合金薄殼元件結合裝置,用以提 高構件結合強度及降低施工難度,主要包含: 一靠模,該靠模係一部份外型可與薄殼體相互穩定靠合之 置具,靠模上方設有數孔預留之孔座,該孔座的數量及位 置依薄殼體預先設計之結合座數量及位置相對設置,孔座 之深度恰為結合座暴露於殼面上之高度,孔座周圍設至少 一個穿通的氣孔,於孔座與氣孔之間銑出一道與靠模水平 面略有落差之導氣槽;數個罩體以螺絲從靠模下方分別將 孔座周圍之氣孔罩住,該罩體中心突設一接管,連接從氬 氣筒導出之氬氣管。 2 .如申請專利範圍第1項所述一種筆記型電腦用鈦合金 薄殼元件結合裝置,該靠模主要造型可因薄殼體之造型設 計而另作改變。 3 .如申請專利範圍第1項所述之裝豈,其中該薄殼體係 先以鈦合金板材,經沖壓技術直接成型,於其上同時形成 數個與孔座位置相對之穿孔。 4 ·如申請專利範圍第1項所述之裝置,其中結合座係為 具結合結構(如外螺紋柱,内螺紋孔)之構件,於其主要 構體外另突設一銲柱。 5 . —種筆記型電腦用鈦合金薄殼元件結合方法,用以提 高構件結合強度及降低施工難度,其中包含下列步驟: A ·將具有結合結構之結合座置入靠模之孔座内並完 成定位,此時僅銲柱部份突立於靠模水平面,於蓋上薄殼 體時,銲柱與穿孔保持適當之間隙;508283 VI. Scope of patent application 1 · A titanium alloy thin shell element bonding device for notebook computers, used to improve the bonding strength of components and reduce the difficulty of construction, mainly including: a mold, a part of the shape of the mold can be connected with The thin shells are stable and close to each other, and there are several hole seats reserved above the mold. The number and position of the hole seats are relatively set according to the number and position of the pre-designed combined seats of the thin shell. The depth of the hole seat is just In order to combine the height of the seat exposed on the shell surface, at least one through-hole is set around the hole seat, and an air guide groove with a slight drop from the horizontal plane of the mold is milled between the hole seat and the air hole; several covers are screwed from The air holes around the hole seat are respectively covered by the lower part of the mold. The center of the cover body is provided with a connecting pipe to connect the argon gas pipe led out from the argon cylinder. 2. According to the titanium alloy thin shell component bonding device for notebook computer described in item 1 of the scope of patent application, the main shape of the master can be changed due to the thin shell shape design. 3. The device as described in item 1 of the scope of the patent application, wherein the thin shell is firstly formed by a titanium alloy plate by stamping technology, and a plurality of perforations opposite to the position of the hole seat are simultaneously formed on the thin shell. 4 · The device according to item 1 of the scope of the patent application, wherein the joint seat is a component with a joint structure (such as an externally threaded post and internally threaded hole), and a welding post is protruded outside the main structure. 5. A method for bonding titanium alloy thin shell components for notebook computers, which is used to improve the bonding strength of components and reduce the difficulty of construction, which includes the following steps: A · Place the combination seat with the combination structure into the hole seat of the master and Positioning is completed. At this time, only the part of the welding column protrudes from the horizontal plane of the mold. When the thin shell is covered, the welding column and the perforation maintain an appropriate gap; 第10頁 508283 年 I广. 六、申請專利範圍 ΤΠ B .續開始從氬氣管提供適當、流量之氬氣,氬氣經過 氣孔、導氣槽,使結合座與薄殼體之間充'滿氬氣形成無氧 \ 的狀態,然後以氬銲之技術,對銲柱部份及周圍進行電弧 熱熔,直到銲柱與薄殼體熔合為一體; C .待冷卻之後,以砂帶機從銲合部份之表面處理平 順,即完成一具結合結構之鈦合金薄殼元件。Page 10, 508283, 2006. VI. Patent application scope TII B. Continued to provide appropriate and flow argon from the argon tube. Argon passes through the air holes and air guide grooves to fill the space between the combination seat and the thin shell. The argon gas is formed in an oxygen-free state, and then the arc welding process is performed on the welding rod part and the surrounding area by using argon welding technology until the welding rod and the thin shell are fused together. C. After cooling, use a belt machine to remove The surface treatment of the welding part is smooth, and a titanium alloy thin shell component with a combined structure is completed. 第11頁Page 11
TW90120982A 2001-08-23 2001-08-23 Method and device for assembling Ti alloy enclosure component for notebook computer TW508283B (en)

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