507486 A7 五、發明說明（1 ) 【創作領域】 本發明是有關於一種電子元件，特別是指一種具板狀 接腳之片式電子元件之製造方法。 【習知技藝說明】 按，片式之電子元件，如突波吸收器、γ電容、負溫 度係數熱敏電阻（NTC)或正溫度係數熱敏電阻（ptc)等， 其傳統之製造方法，如第一圖所示，係將一圓片狀之電子 元件本體1兩側分別印刷上電極面2，再以焊錫將左、右接 腳3分別焊接於電極面2上，最後再於表面塗佈一絕緣膜4， 如此即獲得一片式電子元件之成品。 訂 惟，上述封裝方法所製成之片式電子元件仍存在有下 列缺點： 線 一、製程繁瑣，不易一貫化大量作業：由於每一片式 電子元件之左、右接腳3係分別單獨成形，故為求大量作 業，需預先以膠帶（圖未示）將大批接腳3黏固定位後，再 行依序插置本體1及焊接，事後再去除該污損之膠帶，故相 對地製程需藉助人工且較為繁瑣，亦無法以自動化設備大 量生產，另外，於接腳3上插置本體丨時亦容易發生落片或 偏移現象，造成困擾。 二、該接腳3與本體1之焊接效果不佳··由於該接腳） 係屬一種橫切面為圓形之金屬導線所形成，故其接腳3與電 極面2接觸時，往往僅是接腳3切面與電極面2之接觸，而容 易發生空焊或假焊，即使將該接腳3經由加工壓製成扁平 狀，如本案發明人先前所1請之公告第326961號『電子元 本纸張尺度適用中國國家標準（CNSM4 ϋ (21Q X 297公董 — 第〆％ 507486 A7507486 A7 V. Description of the Invention (1) [Creation Field] The present invention relates to an electronic component, and particularly to a method for manufacturing a chip-type electronic component with plate-shaped pins. [Know-how Description] Press, chip electronic components, such as surge absorbers, gamma capacitors, negative temperature coefficient thermistors (NTC) or positive temperature coefficient thermistors (ptc), etc., their traditional manufacturing methods, As shown in the first figure, a wafer-shaped electronic component body 1 is printed with an electrode surface 2 on both sides, and then left and right pins 3 are soldered to the electrode surface 2 with solder, and finally coated on the surface. An insulating film 4 is obtained, so that the finished product of the one-piece electronic component is obtained. However, the chip electronic components manufactured by the above-mentioned packaging method still have the following disadvantages: Line one. The process is cumbersome, and it is not easy to consistently perform a large number of operations. Because the left and right pins 3 of each chip electronic component are separately formed separately, Therefore, in order to obtain a large amount of work, a large number of pins 3 need to be glued and fixed in advance with tape (not shown), and then the body 1 and welding are sequentially inserted, and the contaminated tape is removed afterwards, so the relative manufacturing process requires It is also laborious and tedious, and it cannot be mass-produced by automated equipment. In addition, when the main body 丨 is inserted on the pin 3, a falling sheet or an offset phenomenon is likely to occur, which causes trouble. 2. The welding effect between the pin 3 and the body 1 is not good ... As the pin) is formed by a metal wire with a circular cross-section, so when the pin 3 is in contact with the electrode surface 2, it is often only The contact between the cut surface of the pin 3 and the electrode surface 2 is prone to air welding or false welding, even if the pin 3 is pressed into a flat shape through processing. Paper size applies to Chinese National Standards (CNSM4 ϋ (21Q X 297 Public Director — 〆 %% 507486 A7
五、發明說明（3 ) 甘 由 二 (請先閱讀背面之注意事項再填寫本頁) w亥左、右接腳上段皆分別形成有一焊接部，而其下 丰又則形成有一插設部，又該左、右接腳於中段處分別沖製 成一彎折部，使左、右接腳上段間形成有一間隙。四、進 仃本體插置步驟：將該等本體分別插置入每一對左、右接 腳上&間所形成之間隙中，恰可使焊接部靠合於電極面 五進行焊合接腳步驟：將本體與左、右接腳之焊接 ^ 同β入錫爐，完成焊合。六、進行塗裝絕緣膜步驟： 將該本體完全浸潰於液態之絕緣材料中並經烘烤固化，即 可使本體包覆於絕緣膜内。七、進行分離電子元件步驟： 利用切割方式將接腳與孔排分離，如此即可獲得一成品。 【圖式之簡單說明】 本發明之其他特徵及優點，在以下配合參考圖式之較 佳實施例的詳細說明中，將可清楚的明白，在圖式中： 第一圖係習用電子元件之組合剖面圖； 第二圖係本發明一較佳實施例於金屬板上沖製接腳之 平面圖； 經濟部智慧財產局員工消費合作，吐印製 第三圖係本發明上述較佳實施例經由沖切後所獲得之 接腳之立體圖； 第四圖係本發明上述較佳實施例之本體插置於接腳間 之立體圖； 第五圖係本發明上述較佳實施例之本體塗佈有絕緣膜 之立體圖； 第六圖係本發明上述較佳實施例之成品立體圖； 第七圖係本發明上述較佳實施例之流程圖； &紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） — 第〆頁 五、發明說明（4 第圖係本發明上述較佳實施例之接腳與電路板之 合狀態示意圖；及 第九圖係本發明另一較佳實施例金屬板沖切成三個接 腳之平面圖。 【較佳實施例之詳細說明】 本發明之具板狀接腳之片式電子元件之製造方法的_ 較佳實施例，配合參閱第二至七圖，該方法包含以下步驟·· 一、準備數裸電子元件本體10:其中該本體10係為一 種片式之電子元件’例如突波吸收器、熱敏電阻、γ電容、 負溫度係數熱敏電阻（NTC )、正溫度係數熱敏電阻 (ptc)、渡波器等，且於本實施例中，該本體1〇為圓片 一、於本體10兩側分別印刷一電極面丨i ••該電極面i i 係以銀為材料，利用印刷方式印製於本體10兩侧而形成二 導電端面，又該電極面Π之形狀可為圓形、方形或其他多 邊形’在本實施例中，該電極面i丨是為圓形。 三、進行沖製接腳20、30步驟··於一金屬板1〇〇上加以 沖壓裁切，使該金屬板丨00同時沖壓裁切出數對縱向之左、 右接腳20、30及一松向之孔排4〇，其中，該等接腳2〇、3〇 底端皆共同與該孔排40相連結，該孔排4〇上設有連續之定 位孔41，而可供定位及自動輸送用，又每一對接腳2〇、 上ί又白刀別形成有一焊接部21、31，該焊接部21、31皆係 沖製成面積約略相同之板體，而概呈相對應之半圓形，且 其所沖製而成之組合面積係對應該電極面丨丨之圓形面積 507486 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（5 又該焊接部21、31表面更縱向沖製有數焊錫溝22、32，而 其相對應側係呈多數個凹凸相間之抵持面23、33，s分& 腳20、30下段則分別形成有一插設端24、34，俾可供插設 於電路板上，又該接腳20、30於中段處分別沖製成一 彎折部25、35，使接腳20、30上段間形成有一間隙，且該 接腳20、30中段於彎折部25、35下方更分別沖製有_肩部 26、36，使該接腳20、30於該肩部26、36上方形成有一較 大寬度，而於該肩部26、36下方形成有一較小寬度，而其 中段間並形成有一相互連接之架橋5〇 ,以固定該左、右接 腳 20、30。 四、 進行本體10插置步驟：將該等本體1〇分別插置入 每一對接腳20、30上段間所形成之間隙中，並受彎折部25、 35限位而恰可使接腳2〇、3〇之焊接部21、31靠合於本體1〇 之電極面11上，由於該等接腳2〇、3〇可分別藉由孔排4〇而 於輸送帶上進行輸送、定位及加工，而可方便自動化之進 行，故插置本體10於每一對接腳20、30上時，亦可藉由自 動化機械設備來完成。 五、 進行焊合接腳2〇、30步驟：將本體1〇與接腳2〇、 30之焊接部21、31—同浸入錫爐，讓焊錫能完全流入該等 焊錫溝22、32，而使本體1〇與接腳2〇、3〇間具有極佳之焊 合效果。 六、 進行塗裝絕緣膜60步驟：將該本體10完全浸潰於 液態之絕緣材料中並經烘烤固化，即可使本體丨〇包覆於絕 緣膜60内，而接腳20、30則外露於絕緣膜60外。 表纸張週用中國國家標準（CNS)A4規格（21Q χ 297公髮-） 第7頁 --------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 507486 五、發明說明（6 ) 七、進行分離電子元件步驟：利用切割方式將該接聊 2〇、3〇與孔排40分離’並同時切除該架橋5〇 ,如此即可 獲得一成品。 經由以上的說明，可再將本發明的優點歸納如下： 一、 由於本發明之所有接腳2〇、3〇皆可藉由孔排4〇做 為連結、定位及輸送等用途，故可方便於自動生產化上之 流程，使其在製造加工時，可類似於半導體之製程，以一 貫化自動作業，大量製造，降低成本。 二、 由於本發明之接腳20、30係以金屬板片沖壓裁切 製成，故在沖切時即可依需要同時製作出適當外形之接 腳，並達到一定之功效，例如：具有大面積之焊接部2 i、 31可增加焊接時的效果，提高其承受電流；具有z形之彎 折部25、35則可供本體10插置及具有使本體1〇限位之功 能；配合參閱第八圖所示，接腳2〇、3〇中段所形成之肩部 26、36，則可使接腳2〇、3 0插入一電路板200之焊接孔201 時，達到定位之功用，使接腳2〇、30與電路板2〇〇間可達到 確實焊固之效果。 經濟部智慧財產局員工消費合作社印製 值得一提的是，本發明除了可藉由沖壓裁切方式形成 左、右接腳外，亦可依需要沖切成三接腳，如第九圖所示， 即於金屬板上沖壓出左、中、右等三接腳7〇、80、90，而 於兩相鄰接腳70、80、90間可置入不同之裸電子元件本體， 再依上述相同之步驟，即可獲得一複合式之電子元件。 歸納上述，本發明之具板狀接腳之片式電子元件之製 造方法，不僅製造步驟簡單、製造一貫化，除具有降低成 本紙張尺度Ϊ用中國國家標準（CNS)A4規格（21〇 x 297公釐） — 第8頁 A7 A7V. Description of the invention (3) Gan Youer (please read the notes on the back before filling in this page) w The upper part of the left and right pins are respectively formed with a welding part, and the lower part of the foot is formed with an insertion part. The left and right legs are punched into a bent part at the middle section, so that a gap is formed between the upper sections of the left and right legs. Steps for inserting the main body: Insert the main bodies into the gap formed between each pair of left and right pins & just make the welding part close to the electrode surface for welding. Steps: Weld the body with the left and right pins ^ into the tin furnace with β to complete the welding. 6. Performing the coating of the insulation film: The body is completely immersed in the liquid insulation material and cured by baking, so that the body can be wrapped in the insulation film. Seventh, the steps of separating the electronic components: The cutting method is used to separate the pins from the hole rows, so that a finished product can be obtained. [Brief description of the drawings] Other features and advantages of the present invention will be clearly understood in the following detailed description of the preferred embodiments with reference to the drawings. In the drawings: The first drawing is a conventional electronic component Combined sectional view; the second figure is a plan view of a preferred embodiment of the present invention punching pins on a metal plate; the consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs, the third figure is printed by the above-mentioned preferred embodiment of the present invention A perspective view of the pins obtained after punching; a fourth view is a perspective view of the body of the above-mentioned preferred embodiment of the present invention inserted between the pins; a fifth view is the body of the above-mentioned preferred embodiment of the present invention coated with insulation A perspective view of the film; a sixth view is a perspective view of the finished product of the above-mentioned preferred embodiment of the present invention; a seventh view is a flowchart of the above-mentioned preferred embodiment of the present invention; & the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) — page 五 5. Description of the invention (4 The diagram is a schematic view of the combined state of the pins and the circuit board of the above-mentioned preferred embodiment of the present invention; and the ninth diagram is another preferred embodiment of the present invention. A plan view of punching into three pins. [Detailed description of the preferred embodiment] A preferred embodiment of the method for manufacturing a chip-type electronic component with plate-shaped pins according to the present invention. The method includes the following steps: 1. Prepare a bare electronic component body 10: wherein the body 10 is a chip-type electronic component such as a surge absorber, a thermistor, a gamma capacitor, and a negative temperature coefficient thermistor ( NTC), positive temperature coefficient thermistor (ptc), ferrule, etc., and in this embodiment, the body 10 is a wafer 1, and an electrode surface is printed on each side of the body 10i i • the electrode surface ii uses silver as the material, and is printed on both sides of the body 10 by printing to form two conductive end faces, and the shape of the electrode surface Π may be a circle, a square, or other polygons. In this embodiment, the electrode surface i丨 It is a circle. 3. Steps 20 and 30 of punching the pins .... Punch and cut on a metal plate 100 to make the metal plate 00 simultaneously punch and cut out several pairs of vertical left and right. Pins 20 and 30 and a loose row of rows 40, of which, the The bottom ends of the pins 20 and 30 are connected to the hole row 40 in common. The hole row 40 is provided with continuous positioning holes 41 for positioning and automatic conveying. Each pair of pins 20, The upper part is formed with a welding part 21 and 31. The welding parts 21 and 31 are punched into a plate body having an approximately the same area, and they are approximately corresponding semi-circular shapes. The combined area is the circular area corresponding to the electrode surface. It is printed by A7 printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A5. Invention description (5) The surface of the welding sections 21 and 31 is punched with several solder grooves 22 and 32. The corresponding side is a plurality of concave and convex resistance surfaces 23, 33, s points & feet 20, 30 lower sections are respectively formed with an insertion end 24, 34, which can be inserted on the circuit board, and The pins 20 and 30 are punched into a bent portion 25 and 35 respectively at the middle section, so that a gap is formed between the upper sections of the pins 20 and 30, and the middle sections of the pins 20 and 30 are further below the bent sections 25 and 35. _Shoulders 26 and 36 are punched respectively, so that the pins 20 and 30 have a larger width above the shoulders 26 and 36, and The lower portions 26 and 36 is formed with a smaller width, between the middle and which is formed with a connecting bridge 5〇 of each other to secure the left and right pins 20 and 30. Fourth, the main body 10 inserting steps: insert the main bodies 10 into the gap formed between each pair of pins 20, 30 respectively, and limited by the bends 25, 35 to make the pins The welding portions 21 and 31 of 20 and 30 abut on the electrode surface 11 of the main body 10. Since these pins 20 and 30 can be conveyed and positioned on the conveyor belt through the hole row 40, respectively. And processing can be easily automated, so when inserting the body 10 on each of the mating pins 20, 30, it can also be completed by automated mechanical equipment. Fifth, the steps of soldering the pins 20 and 30: immerse the body 10 and the soldering portions 21 and 31 of the pins 20 and 30 together with the solder furnace so that the solder can completely flow into the solder grooves 22 and 32, and The body 10 and the pins 20 and 30 have excellent welding effect. 6. The step of coating the insulating film 60: the body 10 is completely immersed in the liquid insulating material and cured by baking, so that the body can be covered in the insulating film 60, and the pins 20 and 30 are It is exposed outside the insulating film 60. Table paper weekly uses the Chinese National Standard (CNS) A4 specification (21Q χ 297 issued-) Page 7 ------------------------ Order- ------- Line (Please read the precautions on the back before filling out this page) 507486 V. Description of the invention (6) VII. Steps for separating electronic components: Use cutting method to connect the chat 20, 30 and The row of holes 40 is separated and the bridge 50 is cut off at the same time, so that a finished product can be obtained. Through the above description, the advantages of the present invention can be summarized as follows: 1. Since all pins 20 and 30 of the present invention can be used for connection, positioning and transportation through the row of rows 40, it is convenient The process of automatic production enables it to be similar to the manufacturing process of semiconductors during the manufacturing process, so that it can automatically operate in a consistent manner, mass production, and reduce costs. 2. Since the pins 20 and 30 of the present invention are made by punching and cutting of metal plates, the pins with appropriate shapes can be produced at the same time when punching, and achieve certain effects, such as: The area of the welding parts 2 i and 31 can increase the effect during welding and increase its current carrying capacity. The zigzag-shaped bending parts 25 and 35 can be used for the body 10 to be inserted and have the function of limiting the body 10 position. As shown in the eighth figure, the shoulders 26 and 36 formed in the middle of the pins 20 and 30 can enable the pins 20 and 30 to be positioned when they are inserted into the soldering holes 201 of a circuit board 200 so that Pins 20, 30 and circuit board 200 can be reliably soldered. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs It is worth mentioning that in addition to forming the left and right pins by punching and cutting, the present invention can also be cut into three pins as required, as shown in the ninth figure As shown in the figure, the left, middle, and right three pins 70, 80, and 90 are punched out on a metal plate, and different bare electronic component bodies can be placed between two adjacent pins 70, 80, and 90. The same steps as above can obtain a composite electronic component. To sum up, the method for manufacturing a chip-type electronic component with plate-shaped pins according to the present invention is not only simple in manufacturing steps and consistent in manufacturing, but also has a cost-reducing paper size and uses the Chinese National Standard (CNS) A4 specification (21〇x 297) Mm) — page 8 A7 A7
五、發明說明（7 ) 本之功效外，更可減少製造上之不良率， 卜良手，增加電子元件之 壽命，提高電+元件之特性，故確實能達到發明之目的。 惟以上所述者，僅為本發明之二較佳實施例而已，當 不忐以此限定本發明實施之範圍，即大凡依本發明申請專 利範圍及創作說明書内容所作之簡單的等效變化與修飾， 皆仍屬本發明專利涵蓋之範圍内。 -------------裝--------訂- (請先閱讀背面之注意事項再填寫本頁)V. Description of the invention (7) In addition to the effectiveness of the book, it can reduce the manufacturing defect rate, improve the life of electronic components, and improve the characteristics of electrical + components, so it can indeed achieve the purpose of the invention. However, the above is only the second preferred embodiment of the present invention. It is not limited to the scope of implementation of the present invention, that is, the simple equivalent changes made according to the scope of the patent application and the content of the creative specification of the present invention. Modifications are still within the scope of the patent of the present invention. ------------- Install -------- Order- (Please read the precautions on the back before filling this page)
丨線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 第9頁- 507486 A7 B7 五、發明說明（8 ) 【元件標號對照】 習知圖示中之元件標號： 經濟部智慧財產局員工消費合作社印製 1…本體 2…電極面 3…接腳 4…絕緣膜 本發明圖式中之元件標號： 200…電路板 201···焊接孔 100…金屬板 10…本體 11···電極面 20…接腳 21…焊接部 22…焊錫溝 2 3…抵持面 24…插設端 25…彎折部 2 6…肩部 30…接腳 31…焊接部 32···焊錫溝 3 3…抵持面 34…插設端 35…彎折部 3 6…肩部 4 0 · · ·孑 L 41···定位孑L 50…架橋 60…絕緣膜 70…接腳 80…接腳 90…接腳 (請先閱讀背面之注意事項再填寫本頁) · -丨線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — 第10頁丨 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) Page 9-507486 A7 B7 V. Description of the invention (8) [Comparison of component numbers] The component numbers in the conventional illustration: printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 ... the body 2 ... the electrode surface 3 ... the pin 4 ... the insulation film The component numbers in the drawings of the present invention: 200 ... circuit board 201 ... · Welding hole 100 ... Metal plate 10 ... Body 11 ··· Electrode surface 20 ... Pin 21 ... Welding portion 22 ... Solder groove 2 3 ... Abutment surface 24 ... Interposition end 25 ... Bend portion 2 6 ... Shoulder portion 30 ... pin 31 ... soldering portion 32 ... soldering groove 3 3 ... abutment surface 34 ... insertion end 35 ... bending portion 3 6 ... shoulder portion 4 0 · · · 孑 L 41 ··· positioning 孑 L 50… Bridge 60 ... Insulation film 70 ... Pin 80 ... Pin 90 ... Pin (Please read the precautions on the back before filling this page) ·-丨 Line-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — page 10