TW506092B - Packaging method of organic EL device - Google Patents

Packaging method of organic EL device Download PDF

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Publication number
TW506092B
TW506092B TW90105255A TW90105255A TW506092B TW 506092 B TW506092 B TW 506092B TW 90105255 A TW90105255 A TW 90105255A TW 90105255 A TW90105255 A TW 90105255A TW 506092 B TW506092 B TW 506092B
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Taiwan
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organic
packaging
scope
plastic
patent application
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TW90105255A
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Chinese (zh)
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Ruei-Ming Ni
Shiue-Wen Chen
Jing-Pei Huang
Guang-Rung Chen
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Windell Corp
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Abstract

To have a longer lifetime for organic EL (electroluminescence) device, a better packaging method must be used to completely isolate the organic material layer and electrode layer material of the organic EL device from the external environment. Thin plastic plates is flexible to be applied in flexible device, a blocking layer having waterproof, anti-oxidation capability is formed by using this thin plastic plate, and an adhesion layer is formed by printing. A package can with a cave region is formed after pressing by mold having pattern formation function, so as to package the organic EL device such that the internal devices are prevented from contacting with the external environment, which can effectively increase the operating lifetime of the organic EL device.

Description

【發明領域】 為確保^件內關了種於有機發光二極體(OLED)元件中, 裝罐方式封吃^不党外界環境影響,所發展出來的一種封 中,為達二,:而且在該有機發光二極體(0LED)元件 密合 2該有機EL薄膜層的基板與封裝罐能完全 向所開發出來的結合技術。 【發明背景】 有 皆形成 EL元件 層,其 有機EL 洞輸送 子輸送 入有機 電洞的 理。 機EL元件 於透明基 之基本結 中該陰極 材料層靠 層,以及 層,使得 發光材料 再結合而 為一種板上, 構包括 與該陽 近該陽 靠近該 该IW極層,並 發光, 具有層狀結構的元件, 如玻璃或塑膠材質之基板。該 ·· 一陰極、一陽極與一有機EL 極間插入該有機EL材料層,藉 注入層 注入層 能有效 進行電 之發光 一般其薄暝[Field of the Invention] In order to ensure that the organic light-emitting diode (OLED) elements are enclosed inside the container, the canning method is used to seal the external environment, and a seal developed to achieve two: The organic light emitting diode (0LED) element is closely bonded to the substrate and the packaging can of the organic EL thin film layer, which can completely develop the bonding technology developed. [Background of the Invention] There is a principle that an EL element layer is formed, and an organic EL hole transporter is transported into an organic hole. In the basic junction of the organic EL element, the cathode material layer rests on the layer and the layer, so that the light-emitting material is recombined into a plate, and the structure includes the anode near the anode and the anode near the IW electrode layer, and emits light. Layered components, such as glass or plastic substrates. The organic EL material layer is inserted between a cathode, an anode, and an organic EL electrode. The injection layer can effectively perform electric light emission by the injection layer. Generally, it is thin.

極之一 陰極之 與陰極 於該有 此現象 侧上形成一電洞 一側上形成電子 上之電洞與電子 機發光材料層中 即為有機EL元件One of the cathode and the cathode has this phenomenon. An electric hole is formed on the side. An electric hole is formed on the side and an electron is formed in the light emitting material layer of the organic EL element.

有機E L元件因有可自發光的特性,所以也具有高解析 性,且具有優良的耐衝擊性,依據這些特殊性質,目前有 機EL元件正被研究開發中,以形成可作為表現圖形顯示之Organic EL devices have self-luminous properties, so they also have high resolution and excellent impact resistance. Based on these special properties, organic EL devices are currently being researched and developed to form displays that can be used as graphic displays.

第4頁 五、發明說明(2) 用的晝素(P i X e 1 )形式,期样 .^ θ ^ ^ J待可作為下一代顯示器之用。 有找E L兀件另具有高視唐你;。 声盥、、主入兩4 1女L 又低彳呆作電壓特點,且存在發光亮 .^ ^ ^ j汪關係,另可藉由變更有機體可發 光之螢先材枓,獲得在可满止_ 靶圍内的各種發光顏色。 於有 係採用一 材料時, 化將大大 的發光層 層,對於 機物結晶 謂「黑點 EL元件内 完善的封 命。為了 格的要求 氣等及其 機E L元 具低工 該陰極 降低元 ’以及 水、氧 化’產 」出現 部必g 裝情況 增加有 ’使其 它外在 件中,為 作函數的 會有容易 件的效率 有機材料 及其它環 生有機材 。因此, 盡可能降 下,傳統 機E L元件 有機EL元 環境的影 了有利於電 材料,然而 被氧化的困 。另外有機 所形成的電 境因素極為 料層與陰極 為了抑制黑 低水氣成分 有機EL元件 之哥命,對 件中陰極與 響。 子注入 當使用擾,而 螢光材 子電洞 敏感, 間分離 點出現 之含量 僅有極 其封裝 有機層 的緣故 低工作 陰極材 料固體 注入層 非常容 的現象 及成長 ,故若 短的發 方式應 隔絕水 ,陰極 函數的 料的氧 所形成 與輸送 易使_ ,即所 ,有機 在沒有 光壽 有更嚴 氣、氧 金屬, 重量較 之封裝 需要將 須花費 然 重 罐 & a:般使用於封裝製程中封裝罐之材併比么 而金屬材質之封桊錯、 材貝白為一 且具有較容易:罐在製造上需要較高之成本, 、名早乂谷易破氧化的缺點。此 個一個金屬# Μ /、平整性較差,又封裝過程中 们金屬椅質封裝罐分別裝填於冶具上,不但Page 4 V. Description of the invention (2) The form of day element (P i X e 1) used, the period sample. ^ Θ ^ ^ J will be used as the next generation display. There are other EL components to look for you. The sound and sound of the main body and the female body are low and the voltage is low, and the light is bright. ^ ^ ^ The relationship between Wang and Wang can also be changed by changing the fluorescent material that the organism can emit. _ Various luminous colors in the target area. When a material is used, the light-emitting layer will be greatly changed. For the crystal of the machine, it is called "the perfect seal in the black point EL element. In order to meet the requirements of the grid, the EL element has a low working level and the cathode reduces the element. "And water, oxidation" production "appearing part must be installed to increase the situation" so that in other external parts, as a function of the efficiency of organic materials and other environmentally-friendly organic materials. Therefore, as far as possible, the traditional organic EL element organic EL element environment affects the electrical materials, but is difficult to be oxidized. In addition, the environmental factors formed by organic materials are extremely important for the material layer and the cathode. In order to suppress the fate of organic EL elements with low water vapor content, the cathode and the cathode in the device are responsive. When the sub-injection is used, the fluorescent material sub-holes are sensitive, and the content of the separation point is only extremely encapsulated with the organic layer. The low working cathode material solid injection layer is very capacitive and grows, so if the short hair method should be Isolation of water, the formation and transportation of oxygen in the cathode function materials are easy to use. That is, organic materials have more stringent gas and oxygen metal in the absence of Guangshou, and the weight will be more expensive than packaging. In the packaging process, the material of the packaging can is not the same as that of the metal material. The material can be easily sealed: the production of the can requires a higher cost, and the shortcomings of the pit can be easily broken and oxidized. This one metal # Μ /, the flatness is poor, and the metal chair cans are filled on the smelting tools during the packaging process, not only

與基板間黏合虛 * τ, Μ ,丨钉於金屬材質 506092 五、發明說明(3) 長的時間,且黏合劑 ^ 兩者間黏著性也較差 另一種封裝罐材質為 工成形及易碎裂等缺點;'在^驻破場材質封裝罐有不易加 也如金屬材質封裝罐—樣,+ ^ j程中,玻璃材質封裝罐 個分別裝填於冶具上。 而要化費較長的時間,一個一 因此在有機EL元件應 提供了有別於習知的封裝,存在多種限制,而本發明 元件之封裝方法以及封裝罐的習知技藝中有機EL 為本發明之有機讥元件封裝姓ς化^。如第一圖所示, 於一透明基板u上形成—m陽極層之有機α元件,為 成一有機薄膜層13,再於該 於^極層12上形 Μ,而完成該有舰元件,且』=上形成-陰極層 數的特性,再以一封裝罐丨5上形:_曰14具有一低工作函 有=元性氣體17中…封ίϊΐ1 預6先 防水14防氧氣等侵入的阻隔薄膜丨5 a。 八 【發明目的】 為能夠有效改善有機EL元件僅有極短發壽命 制,並對具有嚴格要求之封裝方法…更J二方【對 有機EL兀件封裝,故必須使用一種新的方式解決目前所遭 遇的難題。本發明有機EL元件之封裝方法,主要目的為避Adhesion to substrate * τ, Μ, nailed to metal material 506092 V. Description of the invention (3) Long time, and adhesive ^ The adhesiveness between the two is also poor. Another packaging can material is work-forming and fragile Disadvantages such as; 'In the ^ station breakdown material packaging cans are not easy to add, like metal packaging cans-like, + ^ j process, glass packaging cans were filled on the smelting tools. However, it takes a long time, so one by one, organic EL elements should be provided with packages different from the conventional ones, and there are various limitations. The organic EL element based on the method of packaging the elements of the present invention and the conventional technique of packaging cans. The invention of the organic 讥 component package surname ^. As shown in the first figure, an organic alpha element of the -m anode layer is formed on a transparent substrate u to form an organic thin film layer 13 and then an M is formed on the polar layer 12 to complete the naval element, and 』= Upper formation-the number of cathode layers, and then a packaging can 5 top shape: _ said 14 has a low working function = = elemental gas 17 ... seal ϊΐ 1 pre 6 waterproof 14 anti oxygen intrusion barrier Film 5a. [Objective of the Invention] In order to effectively improve the organic EL element only has a very short hair life system, and a packaging method with strict requirements ... more J two parties [package organic EL components, so a new way must be used to solve the current Difficulties encountered. The main purpose of the packaging method of the organic EL element of the present invention is to avoid

第6頁 506092 五、發明說明(4) 免有機EL元#| x ^ ^ ^牛*路在身又的大氣環境下,且能有效隔離外 :ϊΐ:響;*發明之次-目的,在於延長有舰元件之 封裝ϊ二本發明之另—目的,為提供一個較簡單的方法 衣有_元件’達到封裝高效率化。 封裝侍使用昜命長的有機EL元件,必須使用一較佳的 層材料與外JJ =有機E L元件中有機材料層及電極 件之射# I衣兄接觸的目的,本發明提供一種有機EL元 対衣方法,包括: 一形成 透明基板上 一形成 1薄板,且 薄板上形成 詞'裝薄板當 一封裝 上具黏合層 I ’並以埶 ί ' Λ 成一封裝體 絕。 有機EL元件 形成一複數 塑膠封裝薄 於該塑膠封 形成内含穴狀區 一複數個穴 作一封裝罐 體接合步驟 之一側與該 能或UV-Cur ,並達到封 步驟,係提供一透明基板,且於該 個有機EL元件; 板與黏合層步驟,係提供一塑膠封 裝薄板上形成一複數個黏合層; 域的封裝罐步驟,係於該塑膠封·裝 狀區域’且以該具穴狀區域的塑膠 ;以及 ,係將該封裝罐一侧,即塑膠薄板 透明基板上具有機EL元件之一側接 1 ng的方式乾燥硬化該黏合層以形 裝體内部之有機EL元件與外界完全 勻 其具活性之有機材料係在一透明 的基板上形成一均Page 6 506092 V. Description of the invention (4) Free organic EL element # | x ^ ^ ^ Niu * Road is in the atmospheric environment and can effectively isolate outside: ϊΐ: 响; * The second time of the invention-the purpose is to Extending the packaging of warship components. Another object of the present invention is to provide a simpler method to incorporate components to achieve higher packaging efficiency. The packaging server uses a long-lasting organic EL element, and a better layer material must be used to contact the outer layer of the organic material and the electrode in the organic EL element. The purpose of the invention is to provide an organic EL element. A method of coating includes: forming a transparent substrate on a thin plate, and forming the word 'mounting the thin plate as a package with an adhesive layer I' on the transparent substrate, and forming a package body with 埶 ί'Λ. The organic EL element forms a plurality of plastic packages that are thinner than the plastic package to form a cavity-containing area. A plurality of cavities are used as one side of a packaging can body joining step with the energy or UV-Cur, and the sealing step is provided, which provides a transparency. The substrate and the organic EL element; the step of plate and adhesive layer is to provide a plastic packaging sheet to form a plurality of adhesive layers; the step of encapsulating cans in the field is tied to the plastic sealing and packaging area 'and using the tool The plastic in the cavity area; and the one side of the packaging can, that is, one of the organic EL elements on the plastic sheet transparent substrate is connected to the side by 1 ng to dry and harden the adhesive layer to form the organic EL element inside the body and the outside. The active organic material is completely homogenized on a transparent substrate.

506092 五、發明說明(5) 薄膜’並在有機層上形成一 電極材料層n M W勺之電極材料薄膜層,且該 刷方式塗佈熱固性、埶勒 . 鍍上以印 防太、此,#-熟塑性或訂―Curing等黏合材料,呈 防氧氣專隔離效果之趟勝壤此 ’、 壓方式形m “ 4板,之後再以沖壓或滾 封裝罐與該有機EL元件:3二:声J :狀外形是為避免 元件。所得到之封裝: 層,觸而破壞 全隔絕 板―,使所形成的有機材料與外界環境完 【本發明實施例之詳細說明】 本發明揭露一種有機乩元件 第七圖所示,包括: 封裝方法,如弟二圖〜 透明驟,係提供一透明基板,且於該 二丞板上形成一禝數個有機el 封裝結構中之有機EL元件及其有應^如弟一圖所不,為 括:-透明基板21上形成形成一π ‘的結構’其中包 22上形成一電洞注入層23 〇 =層22,於陽極層 2 3 3、電子輸送層234、電子注入= f 232、發光層 =第三圖所示,為該透W板成、電二材,層二。 圖,其中該透明基板21上具件之不思 形成-複數個有機EL元件34 %:;3°,且該基板上 在封裳該有機EL元件過程506092 V. Description of the invention (5) Thin film and an electrode material thin film layer of an electrode material layer n MW spoon formed on the organic layer, and the brush method is coated with thermosetting, pinch. Plated to print anti-tai, this, # -Mature plastic or customized-Curing and other bonding materials, which have the effect of preventing oxygen from isolating. This is a "m" 4 plate, and then the organic EL element is stamped or rolled into a can: 32: sound J: The shape is to avoid the component. The resulting package: layer, touch and destroy the full insulation board-so that the formed organic material and the external environment are completed [Detailed description of the embodiment of the present invention] The present invention discloses an organic element The seventh figure includes: A packaging method, such as the second figure to the transparent step, is to provide a transparent substrate, and form a plurality of organic EL elements in the organic el package structure on the second plate and its application. ^ As shown in the figure, it includes the following:-A π 'structure' is formed on the transparent substrate 21, wherein a hole injection layer 23 is formed on the package 22 〇 = layer 22, and the anode layer 2 3 3, an electron transport layer 234, electron injection = f 232, light emitting layer = The figure shows the transparent W board, electrical materials, and layer 2. The figure, in which the transparent substrate 21 has a careless formation-a plurality of organic EL elements 34% :; 3 °, and the substrate is on The process of sealing the organic EL element

中,其有 裝過程中 一形 裝薄板, 第四圖所 薄板示意 防水、防 可撓性質 方式形成 具以沖壓 板4 5,具 侵入之能 於形成一 式,於該 黏合層的 固性或熱 的乾燥硬 低對溫度 料,在加 膠材為使 時也需注 免有機EL 機材料應被完全有效地被封入惰性氣體中,且封 所使用的封裝罐亦不可與内部有機EL元件接觸。 成塑膠封裝薄板與黏合層步驟,係提供一塑膠封 ^於該塑膠封裝薄板上形成一複數個黏合層;如 二 為本發明封裝結構中之所使用之一塑膠封事 ,二=於一塑膠封裝薄板451上,預先形成一具" 虱氣能力之一阻擋層45 2。因塑膠封裝薄板具^ $ H Z於可撓性元件,以網版印刷或凸版印刷 ^ ζ f後,經由具有製作圖形(patten)能力的模 ^滾壓形成封裝罐之形狀,使其中該 :能達到如金屬或玻璃材質封裝罐防水與以 久如第五圖所示,為本發明在塑膠封裝薄= ㈣m 網板印刷或凸版印刷方 多封瓜溥板45之阻擋層452上,形成一 圖形(Patten)46,黏合声 /成複數個 塑性膠材,利用教妒方科方面,採用熱 化.因Α右了 式使接的膠材能夠迅速 ?,有桟EL凡件所使用的有機材料, 的要求嚴格,所以使用Μ勒 /、§· 熱的溫度方面需特別注::、、】 =塑性塑膠材 謂Cun ng方式硬7有-種黏合層 意封裝中之元件溫度變化及訂处田旦使用UV光照射 元件劣化或封裝之膠材碎化。月"里的增加量’以 ju〇u^2 五、發明說明(7) " ' -----| r —形成内含穴狀區域的封裝罐步驟,係於該塑膠封裝-3板上形成一複數個穴狀區域,以該具穴狀區域的塑膠封 :薄板當作封裝罐,·如第六圖所示,為/穴狀區域示意圖,, ,,用該具黏合層46之塑膠封裝薄板45,以沖壓的式於 2 2 °層4 6與该塑膠封裝薄板4 5上形成一複數個穴狀區域 2作為一複數個封裝罐49之用,且其穴狀區域48中凹穴之 itzit約為5〇〜2〇〇以10,使其内部有機EL元件落於此穴狀區 " 内,防止内部有機乩元件與封裝罐49有接觸的機會。 —封裝體接合步驟,係將該封裝罐一侧,即塑膠薄板 f具黏合層之一侧與該透明基板上具有機EL元件之二側接^ 合狀=以熱能的方式乾燥硬化該黏合層形成 =肢並達到封裝體内部有機EL元件與外界完全隔絕。 如第=圖所示,為該塑膠封裝薄板表面區域之示意圖,其 中4八狀區域4 8的形狀及大小係配合第三圖所示該複數個 ~ 有fEL元件34。且經沖壓或滾壓後作為封裝罐用之該塑膠 封裝薄板^的對位記號7〇,對應配合第三圖元件基板21丄 的對位記號30,使黏合層46上的穴狀區域圖形48與基板21 準確接合以封裝該有機元件34。 =一圖所示為本發明之有機EL元件封裝結構,包括:_「 κτ _ ϋ透明基板11,且於該透明基板上具有一複數個有機 70 且為透明基板11上形成一 ΙΤΟ陽極層12,於陽極 層12上形成—有機薄膜層13,再於該有機薄膜層ι3形成一In the installation process, a thin plate is installed during the installation process. The thin plate shown in the fourth figure shows the waterproof and anti-flexible properties. It is formed with a stamping plate 45. It can penetrate into the solid or heat of the adhesive layer. The dry, hard, low-temperature materials need to be filled with organic EL materials, so that the materials should be completely and effectively sealed in an inert gas, and the packaging cans used for sealing must not be in contact with the internal organic EL elements. The step of forming a plastic packaging sheet and an adhesive layer is to provide a plastic seal ^ to form a plurality of adhesive layers on the plastic packaging sheet; if two is one of the plastic seals used in the packaging structure of the present invention, two = one plastic On the encapsulating sheet 451, a barrier layer 45 2 having a " lice capacity is formed in advance. Due to the plastic packaging sheet with ^ $ HZ on the flexible element, screen printing or letterpress printing ^ ζ f, the shape of the packaging can is formed by rolling with a mold capable of making a pattern ^, so that: It can reach the waterproofing of metal or glass packaging cans as shown in the fifth figure. According to the present invention, a pattern is formed on the barrier layer 452 of the plastic packaging thin film of ㈣m screen printing or letterpress printing on a plurality of melamine plates 45. Patten) 46, glued together / made into a number of plastic glues, using heating and jealousy, to use heating. Because of the right-handed type, the glue can be quickly connected. There are organic materials used in EL components. The requirements are strict, so special attention should be paid to the use of ML /, § · hot temperature :: ,,] = plastic plastic material is called Cun ng method hard 7 there are-a kind of adhesive layer to change the temperature of components in the package and order Once the UV light is used to irradiate the component or the packaging material is broken. The amount of increase in the month "Take ju〇u ^ 2 V. Description of the invention (7) " '----- | r — The step of forming the pot containing the cavity area is tied to the plastic package -3 A plurality of cavity-shaped areas are formed on the board, and the plastic seal with the cavity-shaped areas is used: the thin plate is used as the packaging can. As shown in the sixth figure, it is a schematic diagram of the cavity-shaped areas. The plastic packaging sheet 45 is formed by punching a plurality of cavity regions 2 on the 2 2 layer 4 6 and the plastic packaging sheet 45 as a plurality of packaging cans 49. The itzit of the cavity is about 50 to 200 to 10, so that the internal organic EL element falls within the cavity-shaped area "to prevent the internal organic tritium element from contacting the pot 49. —The step of bonding the package is to connect one side of the packaging can, that is, one side of the plastic sheet f with an adhesive layer, to the two sides of the transparent substrate with the organic EL element ^ Joint shape = dry and harden the adhesive layer by thermal energy Form = limb and reach the organic EL element inside the package body completely isolated from the outside world. As shown in the third figure, it is a schematic diagram of the surface area of the plastic package sheet, in which the shape and size of the 48-shaped area 48 are matched with the plurality of fEL elements 34 shown in the third figure. And after being stamped or rolled, the registration mark 70 of the plastic packaging sheet ^ used for the packaging can corresponds to the registration mark 30 of the component substrate 21 第三 of the third figure, so that the cavity area pattern 48 on the adhesive layer 46 is formed. The organic element 34 is accurately bonded to the substrate 21. = A picture shows the organic EL element packaging structure of the present invention, which includes: _ "κτ _ ϋ a transparent substrate 11 and a plurality of organic 70 on the transparent substrate and forming an ITO anode layer 12 on the transparent substrate 11 An organic thin film layer 13 is formed on the anode layer 12, and then an organic thin film layer 13 is formed on the organic thin film layer ι3.

第10頁 五、發明說明(8) 陰極層1 4,而 於該塑膠封裝 可預先形成一 膠封裝薄板i 5 1 8,且以該具 且该封裝罐一 該透明基板11 一封裝體,並 界完全隔絕。 完成該 薄板上 具防水 與該複 穴狀區 側,即 上具複 達到該 有機ELtg件;—塑膠封裝薄板15,且 具有;:複數個黏合層16,且該封裝蓋 與防氧氣侵入的阻隔薄膜15a;該塑 數個黏合層1 6具有一複數個穴狀區域 域18的塑膠封裝薄板當作一封裝罐; 塑膠封裝薄板上具黏合層16之一側與 數個有機EL元件之一侧接合,以形成 封裝體内部之複數個有機EL元件與外 因此, 揭露之技藝 新穎性 本發明『有機EL元件之封裝方法』,確能藉所 ,達到所預期之目的與功效,符合發明專利之 步性與產業利用性之要件。 明’僅為本發明之較佳實 之實施,大凡熟悉該項技 所作之變化或修飾,皆應 内0 ^ 隹以上所揭露之圖式及 ^例而已,非為用以限定本發 π之人士其所依本發明之精神 涵蓋在以下本案之申請專利範 506092 圖式簡單說明 【圖式簡單說明】 第一圖為本發明十字斷面有機EL元件的具體示意圖 第二圖為第一圖中十字斷面有機EL元件中有機層部份的層 狀主體示意圖 第三圖為已形成一複數個0LED元件之基板示意圖 第四圖為塑膠封裝薄板形成一具防水與防氧氣等侵入的阻 隔薄膜的示意圖 第五圖為塑膠封裝薄板形成黏合層圖樣(Pattern)之結構 示意圖 第六圖塑膠封裝薄板形成黏合層圖樣後,經沖壓或滚壓所 形成穴狀區域外形之示意圖 第七圖為已鍍上防水、防氧氣等隔絕層並計畫作為封裝罐 的塑膠薄板示意圖 【圖號說明】 透明基板 11Page 10 V. Description of the invention (8) The cathode layer 1 4 and a plastic packaging sheet i 5 1 8 can be formed in the plastic package in advance, and the device and the packaging can-the transparent substrate 11-a package body, and The world is completely isolated. The sheet is waterproofed and the compound cavity-shaped area side is completed, that is, the sheet reaches the organic ELtg piece; the plastic package sheet 15 has: a plurality of adhesive layers 16 and the packaging cover is blocked from oxygen intrusion Thin film 15a; the plastic several adhesive layers 16 having a plurality of cavity-shaped areas 18 of a plastic packaging sheet as a packaging can; the plastic packaging sheet having one side of the adhesive layer 16 and one side of several organic EL elements Bonding to form a plurality of organic EL elements inside and outside the package. Therefore, the disclosed novelty of the present invention "the method of packaging organic EL elements" can indeed be used to achieve the desired purpose and effect, which is in line with the invention patent. Elements of step and industrial utilization. "Ming" is only a better implementation of the present invention. Any changes or modifications familiar with this technology should be included in the drawings and examples disclosed above 0 ^ 隹, not intended to limit the issue of π The spirit of the invention according to the present invention is covered by the following patent application patent 506092. Brief description of the drawings [Simplified description of the drawings] The first diagram is a specific schematic diagram of the cross-section organic EL element of the present invention. The second diagram is the first diagram. Schematic diagram of the layered body of the organic layer part of the cross-section organic EL element. The third diagram is a schematic diagram of a substrate having a plurality of 0LED elements. The fourth diagram is a plastic package sheet forming a barrier film that is waterproof and oxygen-proof. The fifth diagram is a schematic diagram of the structure of the plastic packaging sheet to form an adhesive layer pattern. The sixth diagram is the shape of the cavity area formed by stamping or rolling after the plastic package sheet is formed to form an adhesive layer pattern. The seventh diagram is plated. Schematic diagram of a plastic sheet that is waterproof and oxygen-proof and is intended to be used as a packaging can. [Illustration of drawing number] Transparent substrate 11

第12頁 506092 3式簡單說明 陽極層 12 有機薄膜層 13 陰極層 14 封裝罐 15 阻擋層之阻隔薄膜 15a 黏合層 16 惰性氣體 17 透明基板 21 陽極層 22 電洞注入層 231 電洞輸送層 232 發光層 23 3 電子輸送層 234 電子注入層 235 電極材料層 24 元件基板上的對位記號 30 基板上複數個有機E L元件 34 塑膠封裝薄板 45 塑膠封裝薄板 451 阻擋層 452 黏合層的圖形(Patten) 46 穴狀區域 48 封裝罐 49 塑膠封裝薄板上的對位記號 70Page 12 506092 Type 3 simple description of anode layer 12 organic thin film layer 13 cathode layer 14 sealing can 15 barrier film 15a adhesive layer 16 inert gas 17 transparent substrate 21 anode layer 22 hole injection layer 231 hole transport layer 232 light emission Layer 23 3 Electron transport layer 234 Electron injection layer 235 Electrode material layer 24 Alignment mark on element substrate 30 Multiple organic EL elements on substrate 34 Plastic packaging sheet 45 Plastic packaging sheet 451 Barrier layer 452 Pattern of adhesive layer (Patten) 46 Cavity area 48 Encapsulation can 49 Registration mark on plastic encapsulation sheet 70

第13頁Page 13

Claims (1)

506092 _案號901Q5255_年月曰 修正_ 六、申請專利範圍 1. 一種有機電激發光顯示器(0 r g a n i c Electroluminescent Device)元件(簡稱有機 ΕL元件) 之封裝方法,包括: 一形成有機EL元件步驟,係提供一透明基板,且於該 透明基板上形成一複數個有機EL元件; 一形成塑膠封裝薄板與黏合層步驟,係提供一塑膠封 裝薄板,且於該塑膠封裝薄板上形成一複數個黏合層; 一形成内含穴狀區域的封裝罐步驟,係於該塑膠封裝 薄板上形成一複數個穴狀區域,且以該具穴狀區域的塑膠 封裝薄板當作一封裝罐;以及 一封裝體接合步驟,係將該封裝罐一側,即塑膠薄板 上具黏合層之一側與該透明基板上具有機EL元件之一側接 合,並以熱能或紫外線固化(U V - C u r i n g)的方式乾燥硬 化該黏合層以形成一封裝體,達到封裝體内部之有機EL元 件與外界完全隔絕。 2. 如申請專利範圍第1項所述之有機EL元件之封裝方法, 其中該塑膠封裝薄板表面可預先形成一具防水與防氧氣等 侵入的阻隔薄膜。 3. 如申請專利範圍第1項所述之有機EL元件之封裝方法, 其中該黏合層之材料可為一熱塑性、熱固性或紫外線固化 的環氧樹脂(Epoxy)或壓克力(Acrylic)等膠狀材質。506092 _Case No. 901Q5255_Amendment of the month and year_ VI. Patent application scope 1. A method for packaging an organic electroluminescent device (organic EL device), including: a step of forming an organic EL device, A transparent substrate is provided, and a plurality of organic EL elements are formed on the transparent substrate. A step of forming a plastic packaging sheet and an adhesive layer is to provide a plastic packaging sheet, and a plurality of adhesive layers are formed on the plastic packaging sheet. A step of forming a canister with a cavity-shaped region, forming a plurality of cavity-shaped regions on the plastic packaging sheet, and using the plastic packaging sheet with the cavity-shaped region as a packaging can; and a package body joint The step is to join one side of the packaging can, that is, one side of the plastic sheet with an adhesive layer, to one side of the transparent substrate with an organic EL element, and dry and harden by means of thermal energy or ultraviolet curing. The adhesive layer forms a package, and the organic EL element inside the package is completely isolated from the outside. 2. The packaging method of the organic EL element according to item 1 of the scope of the patent application, wherein the surface of the plastic packaging sheet can be pre-formed with a barrier film that is resistant to water and oxygen intrusion. 3. The packaging method of the organic EL element according to item 1 of the scope of the patent application, wherein the material of the adhesive layer may be a thermoplastic, thermosetting or UV-curable epoxy (Epoxy) or acrylic (Acrylic), etc.状 材料。 Shaped material. 506092 _案號90105255_年月曰 修正_ 六、申請專利範圍 4. 如申請專利範圍第1項所述之有機EL元件之封裝方法, 其中該黏合層係以一網版印刷或一凸版印刷的方式印刷形 成,且該網版印刷或凸版印刷在塑膠薄板上的區域形狀可 為一環狀,如周圍塗佈的方式,或也可於元件區域内整面 塗佈。 5. 如申請專利範圍第1項所述之有機EL元件之封裝方法, 其中該塑膠薄板上穴狀區域,係以沖壓或滚壓方式在塑膠 薄板上形成。 6. 如申請專利範圍第1項所述之有機EL元件之封裝方法, 其中該塑膠薄板上之黏合層個數、穴狀區域個數與該透明 基板上之有機EL元件個數相等,且其形成之位置相對應。 7. 如申請專利範圍第1項所述之有機EL元件之封裝方法, 其中於該塑膠薄板上形成該黏合層與該穴狀區域時,經對 位記號對準後,其黏合層與穴狀區域需準確對位於透明基 板上有機EL元件的位置。 8. 如申請專利範圍第5項所述之有機EL元件之封裝方法, 其中該滾壓的方式為一滾軸上先形成圖形(Pattern),再 以滾軸滾壓的方式形成該穴狀區域。 9 .如申請專利範圍第5項所述之有機EL元件之封裝方法,506092 _Case No. 90105255_Amendment of the month and year_ 6. Application for patent scope 4. The packaging method of organic EL element described in item 1 of the scope of patent application, wherein the adhesive layer is printed by a screen printing or a relief printing It can be formed by printing, and the shape of the area of the screen printing or letterpress printing on the plastic sheet can be a ring shape, such as the surrounding coating method, or it can also be coated on the entire surface of the element area. 5. The packaging method of the organic EL element according to item 1 of the scope of patent application, wherein the cavity-shaped area on the plastic sheet is formed on the plastic sheet by stamping or rolling. 6. The packaging method of the organic EL element according to item 1 of the scope of the patent application, wherein the number of the adhesive layers and the number of the cavity areas on the plastic sheet is equal to the number of the organic EL elements on the transparent substrate, and The formation position corresponds. 7. The packaging method of the organic EL element according to item 1 of the scope of the patent application, wherein when the adhesive layer and the cavity area are formed on the plastic sheet, after the alignment marks are aligned, the adhesive layer and the cavity shape are aligned. The area needs to be accurately positioned on the organic EL element on the transparent substrate. 8. The packaging method of the organic EL element according to item 5 of the scope of the patent application, wherein the rolling method is to first form a pattern on a roller, and then form the cavity region by rolling the roller. . 9. The packaging method of the organic EL element as described in item 5 of the scope of patent application, 506092 _案號90105255_年月曰 修正_ 六、申請專利範圍 其中該沖壓的方式為一平面模具,以平面沖壓的方式形成 該穴狀區域。 1 0. —種使用如申請專利範圍第1項所述方法形成之有機EL 元件的封裝結構,包括: 一透明基板,且於該透明基板上具有一複數個有機EL 元件;506092 _Case No. 90105255_ Years and months Amendment_ VI. Scope of patent application Where the punching method is a flat die, the cavity area is formed by flat punching. 1 0. A packaging structure using an organic EL element formed by the method described in item 1 of the scope of patent application, comprising: a transparent substrate having a plurality of organic EL elements on the transparent substrate; 一塑膠封裝薄板,且於該塑膠封裝薄板上具有一複數 個黏合層;該塑膠封裝薄板具有一複數個穴狀區域,且以 該具穴狀區域的塑膠封裝薄板當作一封裝罐;且 該封裝罐一側,即塑膠封裝薄板上具黏合層之一側與 該透明基板上具複數個有機EL元件之一側接合,以形成一 封裝體,並達到該封裝體内部之複數個有機EL元件與外界 完全隔絕。 1 1.如申請專利範圍第1 0項所述之有機EL元件的封裝結 構,其中該塑膠封裝薄板表面可預先形成一具防水與防氧 氣等侵入的阻隔薄膜。A plastic packaging sheet with a plurality of adhesive layers on the plastic packaging sheet; the plastic packaging sheet having a plurality of cavity-shaped areas, and the plastic packaging sheet with the cavity-shaped areas as a packaging can; and the One side of the packaging can, that is, one side of the plastic packaging sheet with an adhesive layer and one side of the transparent substrate with a plurality of organic EL elements are joined to form a package and reach the plurality of organic EL elements inside the package. Completely isolated from the outside world. 1 1. The packaging structure of the organic EL element as described in item 10 of the scope of the patent application, wherein the surface of the plastic packaging sheet can be pre-formed with a barrier film that is resistant to water and oxygen. 1 2 .如申請專利範圍第1 0項所述之有機EL元件的封裝結 構,其中該黏合層材料可為一熱塑性、熱固性或紫外線固 化的環氧樹脂或壓克力等膠狀材質。 1 3 .如申請專利範圍第1 0項所述之有機EL元件的封裝結12. The encapsulation structure of an organic EL device as described in item 10 of the scope of the patent application, wherein the material of the adhesive layer may be a thermoplastic, thermosetting or UV-curable epoxy resin or acrylic material such as acrylic. 1 3. Package junction of organic EL device as described in item 10 of the scope of patent application 第16頁 506092 _案號90105255_年月曰 修正_ 六、申請專利範圍 構,其中該黏合層係以一網版印刷或一凸版印刷的方式印 刷形成,且該網版印刷或凸版印刷在塑膠薄板上的區域形 狀可為一環狀,如周圍塗佈的方式,或也可於元件區域内 整面塗佈。 1 4.如申請專利範圍第1 0項所述之有機EL元件的封裝結 構,其中該塑膠薄板上穴狀區域,係以沖壓或滾壓方式在 塑膠薄板上形成。 1 5 .如申請專利範圍第1 0項所述之有機EL元件的封裝結 構,其中該塑膠薄板上之黏合層個數、穴狀區域個數與該 透明基板上之有機EL元件個數相等,且其形成之位置相對 應。 1 6 .如申請專利範圍第1 4項所述之有機EL元件的封裝結 構,其中該滾壓的方式為一滾轴上先形成圖形 (Pattern),再以滾轴沖壓的方式形成該穴狀區域。 1 7 .如申請專利範圍第1 4項所述之有機EL元件的封裝結 構,其中該沖壓的方式為一平面模具,以平面沖壓的方式 形成該穴狀區域。Page 16 506092 _Case No. 90105255_ Year Month Amendment _ 6. The scope of the patent application, wherein the adhesive layer is printed by a screen printing or a letterpress printing, and the screen printing or letterpress printing is on plastic The shape of the area on the sheet can be a ring shape, such as the way of surrounding coating, or it can also be coated on the entire surface of the element area. 14. The packaging structure of the organic EL element according to item 10 of the scope of patent application, wherein the cavity-shaped area on the plastic sheet is formed on the plastic sheet by stamping or rolling. 15. The packaging structure of the organic EL element as described in item 10 of the scope of patent application, wherein the number of the adhesive layers and the number of the cavity areas on the plastic sheet are equal to the number of the organic EL elements on the transparent substrate. And the position where it is formed corresponds. 16. The packaging structure of the organic EL element according to item 14 of the scope of patent application, wherein the rolling method is to first form a pattern on a roller, and then form the cavity by roller stamping. region. 17. The packaging structure of an organic EL element as described in item 14 of the scope of patent application, wherein the punching method is a flat die, and the cavity region is formed by flat punching.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8383455B2 (en) 2005-12-23 2013-02-26 E I Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
CN104183795A (en) * 2013-05-27 2014-12-03 纬创资通股份有限公司 organic photoelectric element packaging structure and packaging method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8383455B2 (en) 2005-12-23 2013-02-26 E I Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
CN104183795A (en) * 2013-05-27 2014-12-03 纬创资通股份有限公司 organic photoelectric element packaging structure and packaging method

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