503525 五、發明説明（1 、 發 明 背景 1 . 發 明領域 本 發明係 有 關 於 — 改 良 的切割鋸機其係用於晶片切 割 或 晶圓切 割 〇 更 特 別 地 ，本發明係有關於一新穎的 基 板 鋸機其 係 具 有 許 多 的 旋轉切割刀具以相對移動的 兩 相 反的方 向 來 切 斷 或 切 割基板。 2. 習 知技術 描 述 晶 片鋸機 和 切 割 鋸 機 早 已是眾所皆知。具有特殊的 切 割 刀具的 晶 片 鋸 機 早 已 被使用來使來自一半導體晶 m (被固定在- “能飼 3塑膠薄膜上的黏著層之上）的 半 ϊ播 導 體晶片 被 切 割 或 分 離 。該晶片鋸機較佳地是被程 式 化 以在晶 片 的 橫 列 和 縱 列之間切割出街道（street) 直 至 穿透該 晶 m 且 進 入 該 黏著層的深度，因此，從其 它 晶 片中完 整 地 切 割 出 -~- 晶片。大部份的習知技術的 鋸 機 是被設 計 在 一 m ..ΤΊΡ1 個 晶 _上來切割出一單一街道或 切 斷 然後舉 起 該 切 割 刀 具 且回歸至相同的邊然後開始 下 一 次的切 斷 〇 先 進的封 裝 (A d v an ce P； ackaging(AP))裝置包含有一 晶 片 和一載 體 ο 該 已 切 割 的晶片被固定於一載體之上 ， 例 如一基 板 或 印 刷 電 路 (PC板）其係具有導電的引 腳 (1丨 eads)且 / 或 導 電 的 球 且/或銷。A P技術包含有 錫 球 格子陣 列 封 裝 (BGA) ;Micro BGA(pBGA);覆晶 (Flip-Chip)裝 晶 片 尺 寸 (Chip Scale)封裝，等等。所 有 的 該裝置 較 佳 地 被 固 定 於該具有其它先進的封裝晶\ -3-503525 V. Description of the invention (1. Background of the invention 1. Field of the invention The present invention relates to-an improved dicing saw for wafer cutting or wafer cutting. More particularly, the present invention relates to a novel substrate saw The machine has many rotary cutting tools to cut or cut the substrate in two opposite directions of relative movement. 2. Conventional Technology Description Wafer saws and dicing saws are already well known. Wafer saws have long been used to cut or separate semi-seed conductor wafers from a semiconductor wafer (fixed on-"capable of an adhesive layer on a plastic film). The wafer saw is preferably It is programmed to cut the street between the rows and columns of the wafer to the depth that penetrates the crystal m and enters the adhesive layer, and therefore, the wafer is completely cut out of the other wafers. Part of the conventional sawing machine is designed at a m..T P1 crystals come up to cut a single street or cut and then lift the cutting tool and return to the same side and then start the next cut. Advanced packaging (A dv an ce P; ackaging (AP)) device contains There is a wafer and a carrier. The cut wafer is fixed on a carrier, for example, a substrate or a printed circuit (PC board) which has conductive pins (1eads) and / or conductive balls and / or Pin. AP technology includes solder ball grid array package (BGA); Micro BGA (pBGA); Flip-Chip chip scale (Chip Scale) package, etc. All the devices are preferably fixed to The other advanced package crystal \ -3-
五、發明説明（2 ) 片裝置的基板上而互需要從其它晶片中切割以成爲單一 晶片。 通常，該A P裝置從相互間中藉由寬的街道（其係 不能藉由寬的切割刀具而被切斷且移除）而分離出來 。此需要兩次切割切斷以移除材料然後形成可分離該 裝置的街道。該兩次切割街道也會造成晶圓部份和街 道碎片消失或藉由移動切割刀具且進入該晶片鋸機的 碎片部份而變得凸出，例如在晶片鋸機中所發現的彈 性的風箱（bellows)。另一個問題是該晶片鋸機必須 被關掉以移除所累積的碎片。因此，習知技術的泥漿 排放系統並不是被設計來通過基板碎片而且用於切割 基板的晶片切割系統的轉換會需要定期的關掉和、凊潔 。當只有晶圓泥漿時，則剝除的基板的大碎片無法藉 由液體工具而儘可能的被沖除。 一些AP裝置是分別地被封裝於一從其它裝置分離 出來的基板上，然而，一些製造廠商使用一封裝樹脂 的均勻層例如環氧樹脂（當進入到熟成狀態時，該環 氧樹脂會縮小）來封裝所有的AP裝置於該基板上。 該封裝過程會造成基板帶子的彎曲或扭曲且當使一裝 置從其它裝置分開出來時’則會呈現出該切割鋸機的 問題。 習知技術的晶片鋸機已經具有晶圓處理機（wafer handler) 〇當該晶圏處理機是被耦合至該鋸機的一邊 時，則它會輸入一要被切斷的晶圓然後在一晶圓被切 -4- 503525 五、發明説明（3 ) 斷之後移除一晶圓。此處理機有時候也被叫做入和出 處理機（in-and out handlers)。該入和出處理機的缺 點爲在卸下和再裝載晶圓期間會無法完成有生產力的 切割。當晶片鋸機被使用以切割已封裝的AP裝置時 ，則用於卸下和裝載帶子或基板（其具有埋藏在裏面 的許多AP裝置）基板的時間會有相同的無法完成有 生產力的切割。 要建議的是習知技術的晶片鋸機要被改良如此以致 於該輸入處理機能供應一要被切斷的晶圓於切割的一 邊而且該輸出處理機能接收一已被切斷的一晶圓。因 爲上述情形會需要兩個處理機（其係佔有雙倍的地板 空間以及重新設計在鋸機本身中的運輸系統），所以 根本沒有此種鋸機存在。 習知晶片鋸機已具有兩個或更多的切割刀具其係固 定於一單一主軸以同時地切斷出許多路徑於一晶圓或 基板中。此可使切斷一完整晶圓的時間減少。然而， 不可能使用此系統（其中需要有非常高的精密度或是 在裝置之間的街道需要兩次切斷以移除街道材料）。 此外，只有當要切斷的晶片是完美的正方形時且該切 割刀具是與該街道相同寬度時，則可使用在一主軸上 的多刀具。 希望能提供一新的設計的切割鋸機其可實現且解決 在切割鋸機的修改或轉變中所發現的上述問題以實施 AP裝置的切割。也希望能提供一切割鋸機其係可被 ** 503525 五、發明説明（4 ) 修改或轉變以做用一晶片鋸機而能保有增加產量的所 有改良。 本發明的說明 本發明的主要目的是要提供一新的切割鋸機/晶片 鋸機其可增加裝置的產量而不需要增加切割刀具的速 度。 本發明的另一個主要目的是要提供一新的運輸系統 於一切割鋸機/晶片鋸機中其係可在切割期間執行裝 載和卸下。 本發明的主要目的是要提供一高效率的具有許多切 割刀具的切割鋸機，其中至少有兩個切割刀具是相反 的旋轉以允g午以兩個相封移動的相對方向來切割基板0 本發明的主要目的是要提供藉由切斷的一第一方向 上的該第一切割刀具而能部份地切斷且穿透厚的歪曲 的基板然後藉由在一第二方向上切割的一不同的切割 刀具的來完成該切割的方法。 本發明的主要目的是要提供一基板碎片或零件移除 系統其係實際上可消除用於淸潔和移除基板碎片的關 機時間。 本發明的主要目的是要提供一新穎的運輸支持器和 定位系統以用於一雙向切割系統其會呈出且會定位要 被切斷之基板至一旋轉切割刀具而只要最小的運輸時 間損失。 本發明的主要目的是要提供一新穎的雙向切割系統/ -6- 503525 五、發明説明（5 ) 其 可 允 会午 以 兩 個 相 對 移 動 的 方 向 而 切 割 基 板 而 且 實 際 上 可 消 除 在 一 第 一 切 割 之 ..... 刖 童 yrr 轨 安 置 該 切 割 刀 具 的 時 間 損 失 〇 本 發 明 的 主 要 巨 的 是 cfctj 女 提 供 — 切 割 鋸 機 苴 Z、 係 用 於 切 割 基 板 或 使 基 板 成 爲 個 別 的 裝 置 〇 本 發 明 的 主 要 巨 的 是 要 提 供 -- 切 割 黏 機 其 係 具 有 高 於 習 知 技 術 切 割 鋸 機 的 裝 置 產 量 〇 本 發 明 的 主 女 百 的 是 要 提 供 一 新 匕s 穎 的 切 割 鋸 機 苴 係 具 有 兩 個 分 離 的 且 有 區 別 的 切 割 刀 亘 〆、 以 用 於 在 相 對 移 動 的 不 同 方 向 上 切 割 基 板 〇 本 發 明 的 主 要 巨 的 是 要 提 供 -- &r. 新 的 運 輸 系 統 其 係 具 有 兩 個 分 離 的 且 有 區 別 的 基 板 載 體 苴 〆、 移 動 是 獨 一〈了 地 被 控 制 以 在 —^ 相 對 地 固 定 的 切 割 刀 具 之 下 於 兩 方 向 上 移 動 〇 本 發 明 的 主 Vf 1 ; 巨 的 是 要 提 供 — 新 穎 的 單 道 切 割 鋸 子 其 係 具 有 兩 個 分 離 的 且 有 區 別 的 基 板 載 體 5 該 基 板 載 mm 體 可 在 — 對 交 替 地 切 斷 切 割 刀 具 下 交 替 |ZZ| 地 往 復 運 動 〇 根 據 本 發 明 的 這 些 和 其 它 目 的 提 供 —^ 對 反 旋 轉 切 割 刀 具 其 係 被 固 定 以 在 -. 垂 直 方 向 上 移 動 來 ..........齡|II."* 父 替 地 嚙 合 於 要 被 切 割 的 — 第 基 板 〇 一 包 括 有 一 對 基 板 載 體 的 運 輸 系 統 會 在 —^ 對 切 割 刀 片 下 使 第 —. 基 板 往 復 運 動 > 而 且 交 替 的 切 割 刀 具 被 嚙 合 以 切 斷 該 基 板 〇 當 第 一 基 板 正 被 切 斷 時 ， 則 第 或 其 它 基 板 載 體 Is 相 繼 地 卸 下 —* 已 切 斷 的 基 板 > 裝 載 -* 新 的 未 切 斷 的 基 板 然 後 移 動- 7·5. Description of the invention (2) The substrate of the wafer device needs to be cut from other wafers to become a single wafer. Generally, the AP device is separated from each other by a wide street (which cannot be cut and removed by a wide cutting tool). This requires two cuts to remove material and then form a street that can separate the device. The two cuts of the street also cause the wafer portion and street debris to disappear or become protruding by moving the cutting tool and entering the fragment portion of the wafer saw, such as the elastic wind found in wafer saws. Boxes (bellows). Another problem is that the wafer saw must be turned off to remove accumulated debris. Therefore, the conventional mud discharge system is not designed to pass through the substrate fragments and the conversion of the wafer cutting system for cutting the substrate will need to be turned off and cleaned regularly. When there is only wafer slurry, large fragments of the peeled substrate cannot be washed out as much as possible by the liquid tool. Some AP devices are separately packaged on a substrate separated from other devices, however, some manufacturers use a uniform layer of packaging resin such as epoxy (the epoxy will shrink when it enters the mature state) To package all AP devices on the substrate. This packaging process causes bending or twisting of the substrate tape and when a device is separated from other devices, 'it presents the problem of the dicing saw. The conventional wafer sawing machine already has a wafer handler. When the wafer processing machine is coupled to one side of the sawing machine, it will input a wafer to be cut and then Wafer is cut -4- 503525 5. Description of the invention (3) Remove a wafer after breaking. This handler is sometimes called in-and out handlers. The disadvantage of this in and out processor is that it cannot perform productive dicing during wafer unloading and reloading. When a wafer saw is used to cut a packaged AP device, the time for unloading and loading a tape or substrate (which has many AP devices buried in it) to the substrate will have the same unproductive cutting. It is suggested that the conventional wafer saw be modified so that the input processor can supply a wafer to be cut on the side of the cut and the output processor can receive a wafer that has been cut. Since the above situation would require two handlers (which would double the floor space and redesign the transport system in the saw itself), no such saw would exist at all. Conventional wafer sawing machines already have two or more cutting tools that are fixed to a single spindle to simultaneously cut many paths into a wafer or substrate. This can reduce the time to cut a complete wafer. However, it is not possible to use this system (where either very high precision is required or the street between devices needs to be cut twice to remove street material). In addition, only when the wafer to be cut is a perfect square and the cutting tool is the same width as the street, multiple tools on one spindle can be used. It is desirable to provide a newly designed cutting saw that can implement and solve the above-mentioned problems found in the modification or transformation of the cutting saw to implement cutting of the AP device. It is also hoped that a dicing saw machine can be provided which can be modified or transformed by ** 503525 5. Invention Description (4) to use a wafer saw machine while maintaining all improvements that increase production. DESCRIPTION OF THE INVENTION The main object of the present invention is to provide a new dicing saw / wafer saw which can increase the output of the device without increasing the speed of the cutting tool. Another main object of the present invention is to provide a new transportation system in a dicing saw / wafer saw which can perform loading and unloading during cutting. The main object of the present invention is to provide a high-efficiency cutting saw with a plurality of cutting knives, wherein at least two cutting knives are rotated in opposite directions to allow the substrate to be cut in two opposite directions in which the two are moved in a relative direction. The main object of the invention is to provide a substrate that can be partially cut and penetrated through a thick distorted substrate by the first cutting tool in a first direction of cutting, and then cut by a second direction Different cutting tools to complete the cutting method. The main object of the present invention is to provide a substrate chip or part removal system which can substantially eliminate the downtime for cleaning and removing the substrate chip. The main object of the present invention is to provide a novel transport support and positioning system for a two-way cutting system which will present and position a substrate to be cut to a rotary cutting tool with minimal loss of transport time. The main object of the present invention is to provide a novel two-way cutting system / -6-503525. 5. Description of the invention (5) It can cut the substrate in two relative movement directions at noon and can actually eliminate a first Cutting ..... The time lost in placing the cutting tool on the child yrr rail. The main thing of the present invention is the cfctj female — cutting saw 苴 Z, which is used to cut the substrate or make the substrate an individual device. The main thing of the invention is to provide-the cutting stick machine has a higher output than the cutting saw machine of the conventional technology. The master and daughter of the invention are to provide a new dagger. The cutting saw machine has Two separate and distinct cutting knives for cutting substrates in different directions of relative movement. The main thing of the present invention is to provide-& r. The new transport system has two separate and differentiated substrate carriers. The movement is unique. The ground is controlled to move in two directions under a relatively fixed cutting tool. The main Vf 1; The big thing is to provide — a novel single-pass cutting saw with two separate and distinguished substrate carriers 5 The substrate carrier mm body can be alternated under a pair of alternate cutting cutters | ZZ | Ground reciprocating motions are provided according to these and other objects of the present invention— ^ A pair of counter-rotating cutting tools which are fixed to move in a vertical direction .... …… AGE | II. &Quot; * Alternately engaged with the-substrate to be cut-a transport system including a pair of substrate carriers will make the-substrate reciprocating under-^ pair of cutting blades, and alternate cutting tools are engaged to Breaking the substrate billion when the first substrate is being cut off, the first or it its substrate carrier Is phase following the removed independently - * cut-off of the substrate > loading - * the new uncut off the substrate and then move - 7.1
503525 五、發明説明（6 ) 該 未 切 斷 的 基 板 至 —. 視 覺 系 統 (vision system)以決定 相 對 於 該 第 二 載 體 的 該 基 板 的 位置然後定位該第二載 體 及 其 基 扳 於 — 準 備 要 被 切 斷 (藉由該對正在切割該 第 —^ 基 板 的 切 割 刀 具 )的位置中。當該第一已切斷的 基 板 被 移 動 至 —^ 卸 下 位 置 時 > 則該新的未切斷的基板 被 移 動 至 — 切 割 位 |g 中 而 只 有 切斷時間的最小損失。 圖 式 簡 單 說 明 第 1 圖 是 — 習 知 技 術 往 復 晶 圓切割鋸機和I/O晶圓 處 理 機 (其已被轉變爲- -切割鋸機）的實體圖； /r/y 2 圖 是 本 發 明 的 雙 向 切 割 鋸機和I/O基板處理機 (其可被轉變爲- -晶圓切割鋸機）的實體圖； 第 3 圖 是 本 發 明 的 另 — 個 實 例的實體圖，其中雙向 切 割 鋸 機 是 被 親 合 至 用 於 連 續 的量產輸出性能的一輸 入 基 板 處 理 機 和 —^ 輸 出 基 板 處 理機； 第 4 圖 是 —^ 基 板 的 平 面 圖 其 係用來例舉要被切割的 —* 些 不 同 尺 寸 的 半 導 體 裝 置 第 5 Η 是 — 已 切 割 的 BGA裝置的立體圖的放大剖 面 (SI 圖 ϊ 該 裝 置 是 從 基 板 而 被 分離出來； 第 6 _ 是 本 發 明 切 割 難 機 的 等量的圖，其係顯示出 該 支 持 室 ϊ 其 上 有 蓋 子 第 7 圖 是 —^ 等 量 圖 j 其 顯 示 出一對較佳的實例基板 運 輸 線 性 致 動 器 其 係 在 一 對 反 轉動切割機刀具下而操 作 t 第 8 固 圖 是 單 道 鋸 子 的 等 -8- 量 圖，其顯示出反轉動的> 503525 五、發明説明（7 ) 切斷鋸機刀具和用於切割刀具的γ-軸定位驅動，以 及一支持構台（support gantry)其係用於搖動框 (rocking frame)或頭（用來支持該切割刀具）； 第9圖是第8圖的切割鋸機的正面立體圖，其係顯 示出用於定位在一 Z輪中的切割刀具的視覺系統和 該搖動驅動馬達； 第1〇_是用於定位在一 Z軸中的切割刀具的該搖 動頭驅動馬達及其連合系統的等量圖； 第11画是被固定於一搖動頭支持器（其係藉由第 1 0圖中所顯示的鎖定驅動馬達）上的反旋轉切割刀具 (counter-rotating saw blades)及其主軸驅動馬達的等 量圖； 第12園是該基板載體支持系統之一的放大等量圖 ，其顯示出一用於粗略地和細微地定位一基板於兩直 角的切斷位置中的一較佳實例支持系統； 第13圖是該前載體的於一短軸負載位置中而該後 載體在該一長軸的切斷位置中的圖式平面圖； 第1 4 _是該前載體其係被旋轉以允許通過 (pas sage)藉由在該長軸切斷位置中的後載體的圖式 平面圖。 第15圖是被位定於該視覺系統之下的該前載體而 該後載體是仍然在該長軸的切斷位置中。 第16圖是仍被定位在該視覺系統下的且已旋轉90 度的前載體的圖式平面圖，其中該後載體已旋轉如此 -9- 503525 五、發明説明（8 ) 以致於該切割鋸機在該短軸切斷位置上正在切割； 第1 7圏是被定位於該視覺系統中之後的該前載體 的圖式平面圖，其中該鋸機在該長軸切斷位置上正在 切斷而該後載體是被定位於最右邊的位置中以卸下一 已切割基板且以後續地裝載一新的要被切割的基板； 第18圖是在正X方向上移動的該前載體的圖式立 體圖’其中該前載體藉由最右邊的切割刀具（其係以 一反時鐘方向而移動）而被切斷。 第19圖是在完成該正X方向切斷之後的第18_ 的切割鋸機的圖式立體圖，其中該兩個切割刀具已被 抬高至一中立的非切斷位置中；以及 第20圖是在第1 g和1 9圆的該切割鋸機的槪要立 體圆，其中該切割鋸機藉由正在該負X方向上移動 的該載體以嚙合於最左邊的切割刀具（其係以順時鐘 方向而旋轉）而開始負X方向上的切斷。 較佳實例的描述 參考第1圖，其係顯示出一習知技術的晶圓鋸機1 的實體圏，該晶圓鋸子係被耦合至一輸入和輸出處理 機2其係具有一裝載/卸下站3以用來裝載和卸下藉 由單一主軸鋸機4在切斷站5上而被切斷的晶圓。 參考第2圖，其係顯示出本發明雙向鋸機的較佳實 例的画，該雙向据機顯不出切割据機6其係被親合至 一習知技術型式的處理機2其係適用於基板且具有裝 載/卸下站3。鋸機6包括有一切斷站5，一視覺站 -10- 503525 五、發明説明（9 ) 7，以及一雙主軸鋸機8。 參考第3圖，其係顯示出本發明雙向切割鋸機6的 另一個實例，該鋸機6是被親合至一具有一卸下站 10的輸出處理機11。該画顯示出一輸入處理機9其 係被耦合至包括有一視覺站7和一切斷站5的切割鋸 機6 〇 參考第4圖，其係顯示出一基板的圖式平面圖’該 圖顯示出許多不同型式的半導體裝置（其係要被切割） 而且顯示出方形裝置13其係藉由Η的寬街道S和大 的長方形裝置14而被分開’該Η的寬街道S和大的 長方形裝置14係藉由 以兩方向上的寬街道而被分 開以及兩種其它型式的長方形裝置15和16也是藉由 V的垂直街道而被分開。可了解的是基板/帶子12 不是典型的而是被使用來例舉不同的型式和裝置的尺 寸，其現有的問題可藉由新式的切割鋸機（其可沿著 Η的街道S而製造出兩切斷以便切割出裝置13至16) 而被解決。 參考第5圖，其係顯示出一已切割的BGA裝置13 的立體剖面放大圖，該裝置13包括有被固定在一基 底18上的一晶片或半導體17而且顯示出導電球19 其係藉由孔（未顯示）而被連接至基底18上的電路。 同時，也顯示出導電線21其係被用來連接外引腳位 22和在晶片上17的腳位23之間，這些腳位連接至 在基底18上的電路24。封裝材料25完全地覆蓋住 •11· 503525 五、發明説明（1G ) 晶片17和它的電氣連接以完成一 BGA裝置。 現在參考第6圖，其係顯示出本發明的切割鋸機基 底26的等量圖，同時也顯示出用於該基底（其係包括 有側邊蓋子29)的支撑櫃（support cabinet)，一電腦或 門控制器D1，電源供應器和增幅器通道門（amplifier access door) D2，一可被拉出的抽屜31其係裝設有 孔或排出孔3 2 (其被提供於出籃子或篩子）。較佳地 ，基底26是非常精密的高密度的鑄造而且裝設有溝 槽27以接收且正確地定位運輸工具而且具有一水槽 或盆28其係用來使硏磨劑和粒子的基板部份或碎片 流入拉出抽屜31如此以致於該切割鋸機並不需要被 關閉（該關閉的目的爲淸洗在鋸機下的通道）而是僅藉 倒出籃子或抽屜31中之東西就可準備被使用。 現在參考第7圖，其係顯示出一對基板運輸工具 33和34的等量圖，每一個運輸工具包括有一對載體 支持器37和38，及一對線性促動器35和36(其係藉 由馬達39和40而被驅動）。可了解的是所顯示的線 性促動器採用球螺絲和驅動馬達但可爲線性馬達以定 位載體支持器37和38。該圖顯示出四個固定和對準 裝置41其可在溝槽27中滑動如第6圖所示且其設置 有用於微調整和對準的裝置如此以致於線性促動器 3 5和3 6能被正確地定位以相對應於該旋轉的切割鋸. 機刀具且能相互平行。 現在參考第8圖，其係顯示出用於該鋸機和該支持 -12- 503525 五、發明説明（11 ) 構台（其係用於可支撑該雙主軸鋸機的工作頭 (working head)的反轉動切割刀具的切割鋸機8的等 量_。線性促動器3 5，3 6也顯示出它們的載體支持 器3 7各3 8其係被固定於固定和對準裝置4 1上，該裝 置41會進入於用於鋸子8的基底或支持器26的溝槽 27。要注意的是在載體支持器37和38的上面的基板 載體42和43是適合於接收長方形基板帶子且裝設有 一真空源V (其係在基板（未顯示）下延伸，同時也要 注意的是基板載體42和43是可被正確地位定的從所 顯不的一位置至一直角的位置（從其算來共有90度） 如此以致於該等基板載體在運輸系統的操作期間內可 相互穿越。該新式的系統包含有一包括一視覺系統攝 機44的視覺系統，該視覺系統系統44是被固定於包 括有一 Y軸馬達46的一 Y-軸線性促動器45上。該 Y-軸促動器是可移動地而被固定在一固定托架48上 其係被固定在基底或支持器26上。要了解的是攝影 機44可正確地被位定於一基板上的X和γ中，該基 板藉由基板載體42或43中任何一個直角的位置而被 運送，當在最左邊視覺站在該視覺攝影機系統位置如 在42所示。 現在參考第8和第9圖，其係顯示出藉由基底或支 持器26透過一固定板或裝置4.9(其係支持一 Y構台 5 0)而被支撑的切割鋸機8。Y構台50是透過一用於 在Y軸移動的間隔器52而被耦合於上方的固定框53 -13- 503525 五、發明説明（12 ) ‘ 。上方的固定框5 3支持著較低的搖動框5 6和其搖動 軸5 5(其係藉由搖動驅動馬達54而被固定至於移動 的較低的搖動框56)。搖動框56支持著主軸59和60 以及它們的驅動馬達（其係被固定在搖動框56上且載 負了反轉動的切割刀具57和58)。 參考第10圖’其係顯示出用於在一 Z軸中定位該 切割刀具的搖動框驅動馬達及連結系統的等量圖。同 時，參考第Π圖，其係顯示出被固定於較低的搖動 框56上的反轉動切割刀具57和58以及它們的主軸 驅動59和60(其係被固定在較低的搖動框56上（該 搖動框是藉由搖動驅動馬達54而被定位）的等量圖。 所顯示的上方固定框53是被安裝至間隔轉接器52以 藉由Y軸驅動馬達51而可在Y軸方向上移動。一支 持架6 1 S是被固定在固定框5 3的側面上以支持彈性 的E-鍊條61如第8圖所示。所顯示的搖動驅動馬達 54是被固定在一軸承物支架62上且被耦合至槓桿驅 動塊63以可線性的移動。驅動塊63是透過一樞軸對 一樞軸塊64以驅動一槓桿總成65而被固定。槓桿 65是被固定至搖動驅動軸55(其係可延伸並穿透上方 的固定框53且固定地被安裝至搖動框56)。因此， 可了解的是當搖動驅動馬達54被促動時，則它可樞 軸（pivot)槓桿65，使軸55旋轉（軸55是被安裝在該 下方的搖動框）且搖動該搖動框以及移動該切割鋸子 刀具57和58於Z軸上。此外，也設置有一煞車66 -14- $、發明説明（u) 其係被耦合至在軸55上的一煞車盤且可被促動以固 定切割刀具5 7於一 Z軸上一旦它們適當地被定位以 用來切割或切斷一基板。 第1 1圖顯示出用於主軸系統59和60的主軸驅動 馬達67且同時也顯示出夾持支架68其係用來夾住在 下方的搖動框56中的主軸驅動系統59和60。 已說明第9，10以及11圖，其係顯示出用於搖動 該搖動驅動軸5 5的搖動框5 6及其系統，可了解的是 ，較佳地，該搖動驅動馬達是一步進馬達（stepping motor)其能旋轉地被定位至一高度的正確性以傳給一 高度的旋轉正確性至搖動軸5 5其可輪流地傳給Z移 動的一高度至切割切斷刀具5 7和5 8。 參考第12圖，其係顯示出一基板載體支持器37的 放大的等量圖，該支持器顯示出一較佳的實例系統其 係用於粗略地和細微地定位一基板於兩直角的切割位 置中（相互之間爲90度）。載體支持器37是藉由一軸 承塊69而被移動，該軸承塊具有一開口 71以接收一 球螺絲（ball sere w(未顯示））。該軸承塊是被固定在一 支持該系統（其被識別爲一載體支持器37)的固定支 架上。載體支持器37包括有一旋轉促動器73以粗略 地定位該基板載體42於兩個較佳的直角的位置之一 中。一耦合器74是被固定在促動器73和一被驅動的 盤75(其具有一被固定於其上的槓桿臂7 6)之間。槓 桿臂76在X軸方向上軸由一細微的定位的theta馬 _ -15- 503525 五、發明説明（14) 達7 7(其被固定在一支架78上）而被驅動。可了解的 是耦合器74並不是直接被耦合至該盤75而是透過一 機構（其可允許轉動促進器73來定位插銷83於兩個 旋轉位置之一中）被耦合。被固定於盤75上的是軸承 外殼79其是要提供一 Z移動至該基板載體當該基板 載體需要被定位於一 Z軸上以避免基板載體42和43 的碰撞，當它們運送大的晶圓時。在本發明的較佳實 例中，基板載體支持器3 7採用一轉接盤8 1和墊片 8 2 (該墊片是被設計以與在一特殊的基板（其係要被切 割）上的裝置嚙合）如此以致於該真空系統是被應用於 每一個基板開口 84其可應用真空於墊片開口 85(其 會與在該基板上的裝置在位置中重疊於基板上）如此 以致於當裝置被切割時，該真空可持續地夾持該裝置 ，即使它從其它裝置中分離出來。然而，該真空系統 並不夾持該基板的邊緣（該基板係鬆弛地被切開從外 部的周圍或在裝置（其會掉落至在基底26的水槽28 中）之間的街道）。 參考第13圖*其顯示出在一裝載位置中的前載體 43和在一長軸切斷位置上的後載體42的圖式平面圖 。可以觀察到的是圖中塊7形成了視覺站且塊5形成 了切斷站’以及塊3形成了裝載和卸下站。當在切斷 位置中的基板12正被切斷時，則在裝載和卸下站3 中的基板12是正被卸下且裝載有一新的基板12以用 於後續的切斷。 -16· 503525 五、發明説明（15 ) 參考第14圖，其顯示出前載體43的圖式平面圖， 該前載體43被旋轉至一長軸位置以允許在該長軸切 斷位置中的後載體42的通過。 參考第1 5圖，其顯示出一被定位於視覺系統44之 下的前載體43的圖式平面圖，而後載體42仍然在切 斷站5中的長軸切斷位置。 現在參考第1 6圖，其顯示出一被定位於視覺系統 44之下的前載體43的圖式平面圖，而後載體42是 被定位於在切斷站5中的短軸切斷位置。 現在參考第1 7圖，其顯示出在藉由視覺系統44而 被定位之後且被移入在長軸切割位置中的切斷站的前 載體43的圖式平面圖，而後載體42是被定位在最右 邊的位置以卸下一已切割的基板1 2和裝載一新的要 被切割的新基板1 2。 現在參考第18圖，其顯示出前載體43的圖式立體 圖，該前載體43移動於正X軸上且藉由切割刀具（ 其係以一反時鐘方向而移動）而被切斷。 現在參考第19圖，其顯示出在完成正-X方向切斷 之後的第18圖的切割鋸機8的圖式立體圖，而且兩 切割刀具57和58被提高至一中立的或非切斷的位置中。 現在參考第20圖，其顯示出第18和第19圖的切 割鋸機8的圖式立體圖，在開始該負X方向切割且 移動基板載體43於負X方向之後，以便嚙合於最左 的切割刀具（其係以一順時鐘方向而旋轉）。 -17- 503525 五、發明説明（16) 現在參考表1 ’其是被設^ #來顯不出習知技術和本 發明之間的不同’而且本發明能節省相當多的時間而 不需要使用一裝載和一卸下站此兩者。 表 I 1·裝載 2.位定在該載體上的該基板 3 .移動相對於該視覺系統的基板 4.視覺對準該基板 5 .再次定位該基板以用於第一次切斷 6. 降低該基板外的刀具 7. 以切斷速度移動該基板並穿透該切割刀具 8 .抬起該切割刀具 9.以高速來縮回該基板 1 〇.再次定位該切割刀具的Y軸 H.把該基板旋轉90度且重覆切斷程序 12.移動該基板至一裝載/卸下站 1 3 .卸下該切割帶 要注意的是，編號6至10的切斷次序會重覆許多 次直到該基板在一方向上完全的被切割。在旋轉90 度之後，然後藉由使用6至1〇所顯示的步驟不同的 許多時間來重覆相同的切割次序。一旦該基板完成地 被切斷或切割時，則它被移動至該卸下站，其中該切 割帶是被移除而且一尙未切割帶是被放置在該載體上。 本發明中的步驟1至5與步驟6至11中的操作同 -18- 503525 五、發明説明( 17 ) 時 地 被 施 行 〇 此 外， 本 發 明的較佳實例是在雨方向上 切 斷 > 因 此 在 步驟 9 中 所顯示的步驟（其中該切割 刀 具 是 可 被 縮 回 )可完 :全地被消除而且該切斷作業是 比 更 使 用 相 同 的 線性 移 動 的基板和相同的旋轉刀片速 快 了 至 少 1 5% 〇 已 描 述 了 -- 較 佳的 實 例 雙主軸切割（其係使用反轉 向 切 割 刀 具 )以使得- -往復來回的基板2能在水平移 動 的 兩 方 向 上 在 切割 刀 具 (其係被固定在Z軸上）下而 被 切 斷 但 要 了 解的 是 該 搖動框（其係支撑該雙主軸） 可 藉 由 兩 個 獨 立 的Ζ 致 動 器而被取代，每一致動器 會 支 持 — 主 軸 而 且在 Ζ 方 向上有是獨立地可程式化 的 〇 類 似 地 ， 當 在 一不 同 的 基板上實施該切斷作業時， 則 在 切 割 系 統 中 的該 切 割 刀具可藉由一雷射切割系統 (其合倂有新式的運輸系統以卸下和裝載要被切割的 晶 圓 )而® “戈。 現今， 該雙主軸切割刀具以更快且更 冷 於 任 何 習 知 的 商業 上 可 利用的雷射來切斷。眾所皆 知 的 是 雷 射 切 割 是較 熱 於 且慢於切割刀片而且被認爲 與 在 此 所 描 述 的 較佳 實 例 相比起來是令人不滿足的修 改 〇 本 發 明 的 優 點 的例 子 是 在切斷兩個相同的基板時， 個 使 用 最 好 的 習知 技 術 系統而另一個使用本發明。 該 取 好 的 習 知 技 術發 明 切 割需要1 8 3秒以切割兩片基 板 而 本 發 明 可 在 133 秒 內 做同樣的或更多的切斷作業- -19-503525 V. Description of the invention (6) The uncut substrate to —. A vision system to determine the position of the substrate relative to the second carrier and then position the second carrier and its base on — ready to Is cut (by the pair of cutting tools that are cutting the first substrate). When the first cut substrate is moved to the-^ unloading position > then the new uncut substrate is moved to the -cut position | g with only a minimum loss of cut time. Brief Description of the Drawings Figure 1 is a physical diagram of the conventional technology reciprocating wafer dicing saw and I / O wafer processing machine (which has been transformed into a dicing saw); / r / y 2 Physical diagram of the invented two-way dicing saw and I / O substrate processing machine (which can be converted into a wafer dicing saw); FIG. 3 is a physical view of another example of the present invention, in which the two-way dicing saw The machine is an input substrate processing machine and a ^ output substrate processing machine that are compatible for continuous mass production output performance; Figure 4 is a plan view of a ^ substrate which is used to exemplify what is to be cut-* some The fifth dimension of semiconductor devices of different sizes is — an enlarged section of a perspective view of a cut BGA device (SI figure 是 The device is separated from the substrate; the sixth dimension _ is an equivalent view of the difficult cutting machine of the present invention, which The support room is shown. There is a lid on it. Figure 7 is-^ Isometric Figure j, which shows a pair of better examples. The linear actuator for substrate transportation is operated under a pair of counter-rotating cutting tools. The eighth solid figure is an iso-8-dimensional drawing of a single-pass saw, which shows the counter-rotation. 503525 5. Description of the invention ( 7) A cutting saw tool and a γ-axis positioning drive for the cutting tool, and a support gantry for a rocking frame or head (to support the cutting tool); FIG. 8 is a front perspective view of the cutting saw of FIG. 8, which shows a vision system for positioning a cutting tool in a Z-wheel and the rocking drive motor; FIG. 10_ is for positioning in a Z-axis Isometric view of the moving head drive motor of the cutting tool and its coupling system; Figure 11 is the reaction of the moving head holder (which is driven by the lock drive motor shown in Figure 10). Isometric view of counter-rotating saw blades and their spindle drive motors; Section 12 is an enlarged isometric view of one of the substrate carrier support systems, showing a rough and fine positioning A preferred example support system of the substrate in two right-angled cutting positions; Figure 13 is a diagrammatic plan view of the front carrier in a short-axis load position and the rear carrier in the long-axis cut position No. 14_ is a schematic plan view of the front carrier which is rotated to allow passage through the rear carrier in the long axis cutting position. Fig. 15 is the front carrier positioned under the vision system and the rear carrier is still in the cut position of the long axis. Figure 16 is a diagrammatic plan view of a front carrier that is still positioned under the vision system and has been rotated 90 degrees, wherein the rear carrier has been rotated so-9-503525 V. Description of the invention (8) so that the cutting saw Cutting at the short-axis cutting position; The 17th figure is a schematic plan view of the front carrier after being positioned in the vision system, where the saw is cutting at the long-axis cutting position and the The rear carrier is positioned in the rightmost position to unload a cut substrate and subsequently load a new substrate to be cut; Figure 18 is a schematic perspective view of the front carrier moving in the positive X direction 'Where the front carrier is cut by the right-most cutting tool, which moves in a counterclockwise direction. FIG. 19 is a schematic perspective view of the 18_ cutting saw after the positive X-direction cutting is completed, in which the two cutting tools have been raised to a neutral non-cutting position; and FIG. 20 is The three-dimensional circle of the cutting saw machine at the 1g and 19th circles, wherein the cutting saw machine engages the leftmost cutting tool (which is clockwise by the clock) by moving the carrier in the negative X direction. Direction while rotating) and start cutting in the negative X direction. The description of the preferred embodiment is made with reference to FIG. 1, which shows the physical structure of a conventional wafer saw 1 which is coupled to an input and output processor 2 which has a load / unload The lower station 3 is used to load and unload wafers that have been cut by the single spindle saw 4 on the cutting station 5. Referring to FIG. 2, it is a drawing showing a preferred example of the two-way saw of the present invention. The two-way data machine does not show a cutting machine 6. It is a processing machine 2 which is compatible with a conventional technology. It is applicable. On the substrate and has a loading / unloading station 3. The sawing machine 6 includes a cutting station 5, a vision station -10- 503525 V. Description of the Invention (9) 7, and a dual-spindle sawing machine 8. Referring to Fig. 3, there is shown another example of the bidirectional sawing machine 6 of the present invention, which is coupled to an output processor 11 having a unloading station 10. The drawing shows an input processor 9 which is coupled to a cutting saw 6 including a vision station 7 and a cutting station 5. Referring to FIG. 4, it shows a schematic plan view of a substrate. Many different types of semiconductor devices (which are to be cut) and square devices 13 are shown which are separated by a wide street S and a large rectangular device 14 'the wide street S and a large rectangular device 14 They are separated by wide streets in both directions and two other types of rectangular devices 15 and 16 are also separated by V vertical streets. It can be understood that the substrate / tape 12 is not typical but is used to exemplify different types and device sizes. The existing problems can be solved by new cutting saws (which can be made along the street S Two cuts are made in order to cut out the devices 13 to 16). Referring to FIG. 5, it shows an enlarged three-dimensional cross-sectional view of a cut BGA device 13 including a wafer or semiconductor 17 fixed on a substrate 18 and showing conductive balls 19 by A hole (not shown) is connected to the circuit on the substrate 18. At the same time, it is also shown that the conductive wire 21 is used to connect the external pin 22 and the pin 23 on the chip 17 which are connected to the circuit 24 on the substrate 18. Encapsulation material 25 completely covers • 11.503525 5. Description of the invention (1G) The chip 17 and its electrical connection complete a BGA device. Reference is now made to FIG. 6, which shows an isometric view of the cutting saw base 26 of the present invention, and also shows a support cabinet for the base (which includes a side cover 29). Computer or door controller D1, power supply and amplifier access door D2, a drawer 31 which can be fitted with holes or discharge holes 3 2 (it is provided in a basket or sieve ). Preferably, the substrate 26 is a very precise, high-density cast and is equipped with grooves 27 to receive and correctly position the transportation means and has a sink or basin 28 which is the portion of the substrate for the honing agent and particles Or debris flows into the drawer 31 so that the cutting saw does not need to be closed (the purpose of the closing is to wash the aisle under the saw), but it can be prepared simply by pouring out the contents of the basket or drawer 31 used. Reference is now made to FIG. 7, which shows an isometric view of a pair of substrate carriers 33 and 34, each carrier including a pair of carrier holders 37 and 38, and a pair of linear actuators 35 and 36 (which are Driven by motors 39 and 40). It will be appreciated that the linear actuators shown use ball screws and drive motors but could be linear motors to position the carrier holders 37 and 38. The figure shows four fixing and alignment devices 41 which can be slid in the grooves 27 as shown in FIG. 6 and which are provided with means for fine adjustment and alignment so that the linear actuators 3 5 and 3 6 Can be correctly positioned to correspond to the rotating cutting saw. Machine tools can be parallel to each other. Reference is now made to Fig. 8, which shows the use of the saw machine and the support -12-503525. V. INTRODUCTION TO (11) A gantry (which is used to support a working head of the dual-spindle saw machine) Equivalent _ of the sawing machine 8 counter-rotating the cutting tool. The linear actuators 3, 3, 6 also show their carrier holders 3 7 each 3 8 which are fixed to the fixing and alignment device 41, The device 41 will enter the base 27 for the saw 8 or the groove 27 of the holder 26. It should be noted that the substrate carriers 42 and 43 above the carrier holders 37 and 38 are suitable for receiving rectangular substrate tapes and are installed There is a vacuum source V (which extends under the substrate (not shown). It should also be noted that the substrate carriers 42 and 43 can be correctly positioned from a position that is not visible to a position at a right angle (from which (90 degrees in total) so that the substrate carriers can pass through each other during the operation of the transport system. The new system includes a vision system including a vision system camera 44, which is fixed to A Y-axis with a Y-axis motor 46 Actuator 45. The Y-axis actuator is movably fixed to a fixed bracket 48 which is fixed to a base or holder 26. It is understood that the camera 44 can be positioned correctly In X and γ on a substrate, the substrate is transported by a right-angled position in either of the substrate carriers 42 or 43, when the vision camera system is positioned on the far left as shown in 42. Now refer to Figures 8 and 9 show the cutting saw 8 supported by the base or holder 26 through a fixed plate or device 4.9 (which supports a Y-frame 50). The Y-frame 50 is used for one purpose. The spacer 52 which is moved on the Y axis is coupled to the upper fixed frame 53 -13-503525. 5. Description of the invention (12) '. The upper fixed frame 5 3 supports the lower shaking frame 56 and its shaking axis. 5 5 (which is fixed to the lower swing frame 56 by swinging the drive motor 54). The swing frame 56 supports the main shafts 59 and 60 and their drive motors (which are fixed to the swing frame 56 and Loaded with counter-rotating cutting tools 57 and 58). Refer to Figure 10 'which shows the An isometric view of the swing frame drive motor and linking system for positioning the cutting tool in the Z axis. At the same time, referring to Figure Π, it shows the counter-rotating cutting tools 57 and 58 fixed to the lower swing frame 56 And isometric views of their spindle drives 59 and 60 (which are fixed to the lower swing frame 56 which is positioned by swinging the drive motor 54). The upper fixed frame 53 shown is Mounted to the spacer adapter 52 to be movable in the Y-axis direction by the Y-axis drive motor 51. A support frame 6 1 S is fixed to the side of the fixed frame 5 3 to support the elastic E-chain 61 such as Figure 8 shows. The swing driving motor 54 shown is fixed on a bearing support 62 and is coupled to a lever driving block 63 to be linearly movable. The driving block 63 is fixed through a pivot to a pivot block 64 to drive a lever assembly 65. The lever 65 is fixed to the swing driving shaft 55 (which is extended and penetrates the upper fixing frame 53 and is fixedly mounted to the swing frame 56). Therefore, it can be understood that when the swing driving motor 54 is actuated, it can pivot the lever 65 to rotate the shaft 55 (the shaft 55 is a swing frame installed below) and shake the swing frame and The cutting saw blades 57 and 58 are moved on the Z axis. In addition, a brake 66 -14- $ is also provided. (U) It is coupled to a brake disc on the shaft 55 and can be actuated to hold the cutting tool 5 7 on a Z axis once they are properly It is positioned to cut or cut a substrate. FIG. 11 shows the spindle drive motors 67 for the spindle systems 59 and 60 and also shows the clamp bracket 68 which is used to clamp the spindle drive systems 59 and 60 in the swing frame 56 below. The figures 9, 10, and 11 have been described, which show the shaking frame 56 and its system for shaking the shaking drive shaft 55, and it can be understood that, preferably, the shaking drive motor is a stepping motor ( stepping motor) which can be rotated to be positioned to a high degree of accuracy to impart a high degree of rotational correctness to the swing axis 5 5 which can in turn be passed to a Z-moving height to the cutting and cutting tools 5 7 and 5 8 . Referring to FIG. 12, which shows an enlarged isometric view of a substrate carrier holder 37 which shows a preferred example system which is used to roughly and finely position a substrate at two right-angle cuts. In position (90 degrees to each other). The carrier holder 37 is moved by a bearing block 69 having an opening 71 to receive a ball screw (not shown). The bearing block is fixed on a fixed support supporting the system, which is identified as a carrier holder 37. The carrier holder 37 includes a rotary actuator 73 to roughly position the substrate carrier 42 in one of two preferred right-angled positions. A coupler 74 is fixed between the actuator 73 and a driven disc 75 (which has a lever arm 76 fixed to it). The lever arm 76 is driven by a slightly positioned theta horse in the X-axis direction. _-15-503525 V. Description of the invention (14) It is driven up to 7 7 (which is fixed on a bracket 78). It will be appreciated that the coupler 74 is not directly coupled to the disc 75 but is coupled by a mechanism that allows the rotation of the facilitator 73 to position the pin 83 in one of the two rotational positions. Fixed on the plate 75 is a bearing housing 79 which is to provide a Z-movement to the substrate carrier when the substrate carrier needs to be positioned on a Z-axis to avoid the collision of the substrate carriers 42 and 43 when they transport large crystals Round time. In the preferred embodiment of the present invention, the substrate carrier holder 37 uses an adapter plate 8 1 and a spacer 8 2 (the spacer is designed to interact with a special substrate (which is to be cut)). Device engagement) so that the vacuum system is applied to each substrate opening 84 which can apply a vacuum to the pad opening 85 (which would overlap the device on the substrate in position on the substrate) so that it acts as a device When cut, the vacuum continues to hold the device, even if it is detached from other devices. However, the vacuum system does not grip the edge of the substrate (the substrate is loosely cut from the outside or the street between the devices (which would fall into the sink 28 of the substrate 26)). Reference is made to Figure 13 * which shows a schematic plan view of the front carrier 43 in a loading position and the rear carrier 42 in a long axis cutting position. It can be observed that block 7 forms a vision station and block 5 forms a cutting station 'and block 3 forms a loading and unloading station in the figure. When the substrate 12 in the cutting position is being cut, the substrate 12 in the loading and unloading station 3 is being unloaded and a new substrate 12 is loaded for subsequent cutting. -16503503525 V. Description of the invention (15) Reference is made to FIG. 14 which shows a schematic plan view of the front carrier 43 which is rotated to a long axis position to allow the rear carrier in the long axis cutting position. Pass of 42. Referring to FIG. 15, which shows a schematic plan view of a front carrier 43 positioned below the vision system 44, the rear carrier 42 is still in the long-axis cutting position in the cutting station 5. Reference is now made to Fig. 16 which shows a diagrammatic plan view of a front carrier 43 positioned below the vision system 44 and a rear carrier 42 positioned at the short-axis cutting position in the cutting station 5. Reference is now made to FIG. 17, which shows a schematic plan view of the front carrier 43 after being positioned by the vision system 44 and moved into the cutting station in the long-axis cutting position, and the rear carrier 42 is positioned at the most The right position is to remove a cut substrate 12 and load a new substrate 12 to be cut. Referring now to FIG. 18, there is shown a schematic perspective view of the front carrier 43 which is moved on the positive X axis and is cut by a cutting tool (which is moved in a counterclockwise direction). Reference is now made to Fig. 19, which shows a schematic perspective view of the cutting saw 8 of Fig. 18 after the positive-X cutting is completed, and the two cutting tools 57 and 58 are raised to a neutral or non-cutting Position. Referring now to FIG. 20, which shows a schematic perspective view of the cutting saw 8 of FIGS. 18 and 19, after starting the negative X-direction cutting and moving the substrate carrier 43 in the negative X-direction to engage the leftmost cutting Tool (which rotates in a clockwise direction). -17- 503525 5. Description of the invention (16) Now refer to Table 1 'It is set ^ # to show the difference between the conventional technology and the invention' and the invention can save considerable time without using One loading and one unloading station. Table I 1. Load 2. The substrate positioned on the carrier 3. Move the substrate relative to the vision system 4. Vision align the substrate 5. Position the substrate again for the first cut 6. Lower Tool outside the substrate 7. Move the substrate at the cutting speed and penetrate the cutting tool 8. Lift the cutting tool 9. Retract the substrate at high speed 10. Position the Y-axis H of the cutting tool again. The substrate rotates 90 degrees and repeats the cutting procedure 12. Move the substrate to a loading / unloading station 1 3. Unload the cutting tape. Note that the cutting sequence numbered 6 to 10 will be repeated many times until The substrate is completely cut in one direction. After rotating 90 degrees, the same cutting sequence is then repeated by using the steps shown in 6 to 10 for many different times. Once the substrate is completely cut or cut, it is moved to the unloading station where the dicing tape is removed and a stack of uncut tape is placed on the carrier. The operations in steps 1 to 5 and steps 6 to 11 in the present invention are the same as in -18-503525 5. The description of the invention (17) is implemented from time to time. In addition, the preferred example of the present invention is to cut in the direction of rain > So the step shown in step 9 (where the cutting tool is retractable) can be completed: the whole ground is eliminated and the cutting operation is faster than using the same linearly moving substrate and the same rotating blade At least 15% has been described-the preferred example is dual-spindle cutting (which uses a reverse-direction cutting tool) so that --- the back-and-forth substrate 2 can be moved in both directions of the horizontal movement of the cutting tool (its system It is fixed under the Z axis) and is cut off, but it is understood that the shaking frame (which supports the dual main shaft) can be replaced by two independent Z actuators, each actuator will support— The main axis is also independently programmable in the Z direction. Similarly, when the cutting operation is performed on a different substrate Then, the cutting tool in the cutting system can be processed by a laser cutting system (which incorporates a new transport system to unload and load the wafer to be cut). Now, the dual-spindle cutting The cutter is cut faster and cooler than any conventional commercially available laser. It is well known that laser cutting is hotter and slower than the cutting blade and is considered to be similar to what is described herein The preferred example is an unsatisfactory modification in comparison. An example of the advantages of the present invention is that when cutting two identical substrates, one uses the best known technology system and the other uses the present invention. The conventional technology of the invention requires 1 3 3 seconds to cut two substrates while the present invention can do the same or more cutting operations in 133 seconds-19-
503525 五、發明説明（18 ) 。此可產生一大約從37%〜50%更快的切斷時間。 習知技術的晶圃切割在切割期間要使用數公升昂貴 的去離子水來冷卻沖洗且淸潔一晶園。由於本發明會 減少切斷時間，所以也會減少所需要的去離子水的數 量° 在一較佳實例的切割鋸機中，也有可能藉由開始每 一次切斷於每一方向藉由垂直地移動該切割刀具以嚙 合該基板且同時地開始水平的移動。缺少一個更好的 描述名稱，該開始切斷是被稱爲一衝出切斷（plunge cut)。在一切割之末端的類似方法，當該切割刀具穿 透該底部邊緣時，則該切割刀具可立刻被往前上移動 至一中立的位置（其係在一衝出切斷的反向的移動中） 。一旦該刀具離開該正被切斷的基板時，則該Y軸 構台會馬上定位該搖動框（或頭底座（head mount))以 準備下一個衝出切斷和開始一基板的切割。 參考符號說明 1 · · · · •晶片鋸機 2 · · · * ·處理機 3 · · · . ·裝載/卸下站/塊 4 · · · · ·主軸鋸機 . 5 · · · ••切斷站/塊 6 * · · · ·鋸機 7 · · · · •塊 7 · · · · ·視覺站 -20- 503525 五、發明説明（19) 8 * * * * * 鋸機 9 * « * * * 輸入處理機 10· · · · •卸下站 1 1 * · * * •輸出處理機 1 2 * * · · •基板/帶子 1 3 * · * · •裝置 14 · · * · •裝置 1 5 * · * * •裝置 16 * · * * •裝置 17 * ——* •晶片/半導體 18· · * · •基底 19· · * · •導電球 2 1 * · · · •導電線 22 ·——· •外引膠位 23 · · · · •腳位 24·*** •電路 25· —— · •封裝材料 26 * * * * •基底 27 · * * * •溝槽 28· · · · •水槽/盆 29 * ·—— •側邊蓋子 3 1 * * · * •抽屜 3 2 * * · · •孔/排出孔 33 · · · · •運輸工具 -21- 503525 五、發明説明（2〇 ) 3 4 * * · * •運輸工具 · 3 5 * * · * -促動器 3 6 * · · · •促動器 37 · · · * •支持器 38 · · · · •支持器 39 · · · · •馬達 4〇· · · * •馬達 41 · · · · •裝置 42 · · · · •載體/後載體 43 · · · * •載體/前載體 44**** •視覺系統/攝影機 45**** •促動器 46*·** •馬達 48**·* •固定托架 49 · · * · •板子/裝置 50 · · · · •構台 51· » · · •驅動馬達 52**** •間隔器/間隔轉接器 53 ·——· •固定框 54···* •驅動馬達/驅動軸 55 · * * · •軸 56· · · · •搖動框 57***· •刀具 58 * * · · •刀具 — -22- 503525 五、發明説明（21 ) 5 9· · · · •主軸/主軸系統/主軸驅動系統 60 * · · · •主軸/主軸系統/主軸驅動系統 61 · · · · · E-鍊條 6 1 S · · · · ·支持架 62 · · · · ·支架 6 3 · · · · ·驅動塊 64 · . · · ·樞軸塊 6 5 · · . . ·槓桿總成/槓桿 66 · · · · ·煞車 6 8· · · · •夾持支架 69 * . · · •軸承塊 71———— ·開口 72 · · · · ·固定支架 73 · · · · ·促動器 74 · · · · ·耦合器 75 · · —— ·盤 7 6 * * * * •臂 7 7 · · · · ·馬達 78 · · · · ·支架 7 9 * · * · ·外殻 8 1—— · · ·盤 82 * · · · •墊片 83 · · · · •銷 84———— ·開口 -23- 503525 五、發明説明（22 ) 8 5· * • · •墊片開口 D 1 . • · •門控制器 D2 ·. •——門 S· •.街道 V . . . • •真空源 -24-503525 5. Description of the invention (18). This can result in a faster cut-off time from about 37% to 50%. Conventional crystal garden cutting uses several liters of expensive deionized water to cool down and clean a crystal garden during cutting. Since the present invention reduces the cutting time, it also reduces the amount of deionized water required. In a cutting saw machine of a preferred embodiment, it is also possible to The cutting tool is moved to engage the substrate and simultaneously begin horizontal movement. Without a better descriptive name, this initial cut is called a plunge cut. A similar method at the end of a cut, when the cutting tool penetrates the bottom edge, the cutting tool can be immediately moved forward to a neutral position (which is a reverse movement of a punching cut) Middle). Once the cutter leaves the substrate being cut, the Y-axis platform will immediately position the shaking frame (or head mount) to prepare for the next punch cut and start cutting of a substrate. Explanation of reference symbols 1 · · · · • Wafer saw 2 · · · * · Processor 3 · · ·. · Loading / unloading station / block 4 · · · · · Spindle saw. 5 · · · • • Cut Break station / block 6 * · · · · Sawing machine 7 · · · · · Block 7 · · · · · Vision station -20-503525 V. Description of the invention (19) 8 * * * * * Sawing machine 9 * «* * * Input processor 10 · · · · • Remove station 1 1 * · * * • Output processor 1 2 * * · · • Substrate / tape 1 3 * · * · • Device 14 · · * · • Device 1 5 * · * * • Device 16 * · * * • Device 17 * —— * • Wafer / Semiconductor 18 · · * · • Substrate 19 · · * · • Conductive ball 2 1 * · · · • Conductive wire 22 · — — · • Outer glue position 23 · · · · · Pin 24 · *** • Circuit 25 · —— · • Packaging material 26 * * * * • Base 27 · * * * • Groove 28 · · · · • Sink / basin 29 * · —— • Side cover 3 1 * * · * • Drawer 3 2 * * · · • Holes / drain holes 33 · · · · • Transportation tools-21- 503525 5. Description of the invention (2 〇) 3 4 * * · * • Shipping Tools · 3 5 * * · *-Actuator 3 6 * · · · • Actuator 37 · · · * · Holder 38 · · · · · Holder 39 · · · · • Motor 4〇 · · · * • Motor 41 · · · · · Device 42 · · · · · Carrier / rear carrier 43 · · · * · Carrier / front carrier 44 **** • Vision system / camera 45 **** • Actuator 46 * · ** • Motor 48 ** · * • Mounting bracket 49 · · * · • Board / device 50 · · · · • Frame 51 · »· · • Drive motor 52 **** • Spacer / spacer Connector 53 · —— · • Fixed frame 54 ··· * • Drive motor / drive shaft 55 · * * · • Shaft 56 · · · · • Shake frame 57 *** · • Tool 58 * * · · • Tool — -22- 503525 5. Description of the invention (21) 5 9 · · · · • Spindle / spindle system / spindle drive system 60 * · · · • Spindle / spindle system / spindle drive system 61 · · · · · E-chain 6 1 S · · · · · Support frame 62 · · · · · Bracket 6 3 · · · · · Drive block 64 · · · · · Pivot block 6 5 · · · · · Lever assembly / Lever 66 · · · · · Sha Car 6 8 · · · · • Clamping bracket 69 *. · · • Bearing block 71 ———— · Opening 72 · · · · · Fixed bracket 73 · · · · · Actuator 74 · · · · · Coupling Device 75 · · —— · Plate 7 6 * * * * • Arm 7 7 · · · · · Motor 78 · · · · · Stand 7 9 * · * · Case 8 1—— · · · Plate 82 * · · · • Gasket 83 · · · · · Pin 84 ———— · Opening -23- 503525 V. Description of the Invention (22) 8 5 · * • • • Gasket opening D 1. • • • Door controller D2 ·. • —— Door S · •. Street V... • • Vacuum source-24-