TW502247B - Touch panel to form the conductive film by using plating - Google Patents

Touch panel to form the conductive film by using plating Download PDF

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Publication number
TW502247B
TW502247B TW089123212A TW89123212A TW502247B TW 502247 B TW502247 B TW 502247B TW 089123212 A TW089123212 A TW 089123212A TW 89123212 A TW89123212 A TW 89123212A TW 502247 B TW502247 B TW 502247B
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Taiwan
Prior art keywords
plating
mask
touch panel
patent application
touch
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TW089123212A
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Chinese (zh)
Inventor
Deuk-Soo Pyun
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Hantouch Com
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Position Input By Displaying (AREA)

Abstract

The present invention relates to a touch panel to form the conductive film by using plating. Applying the plating technology to manufacture the conductive film of the peripheral circuit can raise and optimize the utilization of the substrate material and the reliability of the product. The conductive film of the peripheral circuit is formed by plating for the wiring material of the peripheral circuit on the transparent substrate.

Description

502247 經濟部智慧財產局員工消費合作社印制衣 A7 B7 五、發明說明(ί ) 【發明所屬的技術領域】 本發明係有關於觸控面板,在電腦、PDA等的資訊通 信機器和機器使用者間的對話手段之一種方式的觸控面板 製作技術中,使用以鍍敷方式形成導體膜。 【習知技術】 所謂觸控面板,係指使用者看顯示在該機器的顯示器 上之資訊,若直接用手指或筆接觸選擇附著在畫面上的透 明觸控面板的所欲部位的話,則在畫面上能馬上顯示所欲 資訊的資訊通信用電子輸入輸出手段。觸控面板係由電氣 性連接在對應應用機器的周邊電路薄膜圖案及連接電纜等 ,來構成許多的透明電極圖案及這種透明電極。其中,本 發明係有關於周邊電路薄膜圖案形成技術,習知係使用網 版印刷技術。但,若採用這種方式,因存在圖案微細化限 度及印刷基板間的接著劣化問題,故當然要提高量產時的 生產性及信賴性,並要求適合最近急遽發展的應用機器的 微細圖案之小型觸控面板的新技術。 【發明欲解決的課題】 本發明係用來解決上述的問題點,在製造周邊電路的 導體膜時,應用鍍敷技術,能實現微細圖案,藉此能提高 基板材料使用率的極大化及製品信賴性,其目的係達成生 產具有競爭力的製品。 【解決課題的手段】 爲了達成上述目的,本發明在製作觸控面板時,使用 以鍍敷方式形成導體膜來作爲透明基板上的周邊電路配線 3 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) --------------------訂---------^ (請先閱讀背面之注意事項再填寫本頁) 502247502247 Printed clothing A7 B7 of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (() [Technical field to which the invention belongs] The present invention relates to a touch panel, an information communication device in a computer, a PDA, etc. In a touch panel manufacturing technique that is one of the means of dialogue, a conductive film is formed by plating. [Know-how] The so-called touch panel refers to the information displayed on the display of the machine by the user. If a user directly touches a finger or a pen to select a desired part of the transparent touch panel attached to the screen, Electronic input and output means for information and communication that can immediately display desired information on the screen. The touch panel is composed of a plurality of transparent electrode patterns and such transparent electrodes which are electrically connected to a peripheral circuit film pattern of a corresponding application device and a connection cable. Among them, the present invention relates to a technique for forming a peripheral circuit thin film pattern, and the conventional system uses a screen printing technique. However, if this method is adopted, there are problems of pattern miniaturization and adhesion deterioration between printed circuit boards. Therefore, it is of course necessary to improve productivity and reliability during mass production, and it is required to be suitable for the fine patterns of application equipment that has been rapidly developed recently. New technology for small touch panels. [Problems to be Solved by the Invention] The present invention is intended to solve the above-mentioned problems. When manufacturing a conductive film of a peripheral circuit, a plating technology can be applied to realize a fine pattern, thereby increasing the use of substrate materials and maximizing the product Reliability, the purpose is to achieve the production of competitive products. [Means for solving the problem] In order to achieve the above-mentioned object, the present invention uses a conductive film formed by plating to form peripheral circuit wiring on a transparent substrate when manufacturing a touch panel. 3 This paper is in accordance with China National Standard (CNS) A4. (210 X 297 public love) -------------------- Order --------- ^ (Please read the notes on the back before filling this page ) 502247

五、發明說明(γ) 經濟部智慧財產局員工消費合作社印制衣 材料。 [發明之實施形態】 根據所附的圖面,將本發明詳細說明如下。 圖2係有關本發明的觸控面板之1種的數位形態觸控 面板的構成圖,在觸控格子2中,只要用手指接觸所欲的 矩陣交叉(matrix cross)部位,透明基板1所形成的該透明電 極2的帶(strip)就會被電氣性短路,該電氣信號通過該周邊 電路圖案3及連接電纜4,傳達給該應甩機器,藉此進行 所欲功能。本發明的觸控面板1係附著在本身具有發光功 能的顯示器上’故使用者經由觸控面板來確認顯示器上的 圖像,藉此能易於識別所欲的觸控部位。即,使用者經由 面板,識別所見的圖像,選擇性地接觸所欲的觸控格子, 藉此能選擇性地進行所欲功能。 如圖2所示,觸控面板的面積分爲觸控格子部位 (active area)和用以周邊電路配線的部位,周邊電路的配線 面積越小,觸控格子部位越增大,因此,容易增加觸控格 子數,來達到更多功能化應用機器的要求。又,當格子數 固定時’相對地’有效面積率(active area/total area)變高, 也能期待因節省材料費而節省量產費用。爲了減少所提供 的觸控格子數的周邊電路面積,雖必須縮小周邊電路配線 寬和配線間隔來進行圖案化,但現在,採用現有的印刷工 程(參照圖3),在一定水準的大小(dimenslon)以下,因線寬 的不均勻性、印刷材料和透明基板等的印刷下支持面間的 接著強度不良’不易縮減具有信賴性的配線寬/間隔。 4 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) —--------裝--------訂---------^ AW. (請先閱讀背面之注意事項再填寫本頁) 502247 經濟部智慧財產局員工消費合作社印制π A7 B7 五、發明說明(^ ) 如本發明所述,只要使用以鍍敷方式來形成導體膜’ 因係採用曝光及顯影工程的圖案化’故與印刷方式比較起 來’相對地具有優異的圖案均句度/精度’又’鑛敷 (plating)方式係在透明基板或其他被鍍敷材料的表面,利用 化學的方法來進行蒸鍍,故具有優異的黏著性。 就鍍敷方式而言,都能使用電解及無電解鍍敷技術’ 在鍍敷前,就以表面活性化目的所進行的鍍敷前處理方式 而言,都能適用化學性及物理性的方式。化學性的方式係 用金屬酸、中性或鹼性溶劑,將應鍍敷的表面進行溼式 (wet)處理,物理性的方式係使用濺鍍(sputtering)、電子束 (electron beam)及熱汽化(thermal evaporation)之物理性的金 屬薄膜蒸鍍和化學蒸鍍沉積法(chemical vapor deposition)、 原子層沈積(atomic layer deposition)方式之化學性的薄膜蒸 鍍,藉此處理需要鍍敷的表面,在被鍍敷部位,形成種子 層(seed layer)來誘發鍍敷。 圖4a及圖4b係在製作觸控面板時,表示適用鍍敷技 術兩種情形的周邊電路配線工程圖,工程順序如下。首先 ,如圖4a所示,將全面蒸鍍IT0或Sn〇2等的透明導體膜 之透明基板進行上述鍍敷前處理後,除了所欲的鍍敷部位 外,將剩下的部位進行網版印刷,形成遮罩1。通常,所 欲鍍敷部位係周邊電路的配線所定位的部位,沿著矩形透 明基板的周邊下去,係一定寬(約AL、AW)的矩形帶狀的 部位。就鍍敷所需要的金屬溶劑而言,能適用能鍍敷的酸 、中性、鹼等所有的鍍敷用金屬溶劑。鍍敷後,除去鍍敷 5 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----------s --------訂---------線 ml (請先閱讀背面之注意事項再填寫本頁) 502247 經濟部智慧財產局員工消費合作社印制衣 A7 B7 五、發明說明(f ) 防止遮罩1,形成用來周邊電路配線及觸控格子圖案化的 遮罩2,但因這係曝光方式圖案化,故只要使用光阻,具 有這種圖案遮罩的鍍敷薄膜或透明電極部位不會被蝕刻而 殘留下來。在鍍敷薄膜及透明電極薄膜蝕刻工程中,首先 ,將鍍敷薄膜進行鈾刻,接下來,不僅能適用將透明薄膜 進行蝕刻的順序工程,或靠選擇蝕刻用化學溶劑,也能適 用將兩薄膜同時進行蝕刻的工程。完成金屬蝕刻工程後, 只要除去遮罩2,就能得到包括所欲周邊電路部位的觸控 格子圖案。圖4b所示的工程係除了圖4a的工程之外,爲 了鍍敷前處理工程,多包括一個遮罩工程(遮罩1)的情形。 這係因爲因情況而定,上述鍍敷前處理時,爲了保護圖案 化後的透明電極薄膜的關係(例如,藉由鍍敷前處理所使用 的化學溶劑等,圖案鈾刻前觸控格子部位2內的透明電極 受到物理性/化學性的損傷的情形)。又,鍍敷時,在遮罩1 上,爲了防止鍍敷,形成與遮罩1的圖案相同的遮罩2後 ,再進行鍍敷,然後,用來鍍敷薄膜及透明電極圖案化的 曝光遮罩形成工程及飩刻工程、最終遮罩除去工程係和圖 4a的工程相同。 根據實施例,將本發明具體地說明如下,本發明不限 於此。 實施例V. Description of the invention (γ) The printed materials of the consumer cooperatives of the employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. [Embodiment of the invention] The present invention will be described in detail below based on the attached drawings. FIG. 2 is a structural diagram of a digital form touch panel related to the touch panel of the present invention. In the touch grid 2, as long as a desired matrix cross portion is touched with a finger, the transparent substrate 1 is formed. The strip of the transparent electrode 2 is electrically short-circuited, and the electrical signal is transmitted to the device to be dumped through the peripheral circuit pattern 3 and the connection cable 4 to perform a desired function. The touch panel 1 of the present invention is attached to a display having a light-emitting function itself, so the user confirms an image on the display via the touch panel, thereby easily identifying a desired touched part. That is, the user recognizes the image seen through the panel and selectively touches the desired touch grid, thereby selectively performing the desired function. As shown in FIG. 2, the area of the touch panel is divided into a touch grid area (active area) and a location for peripheral circuit wiring. The smaller the wiring area of the peripheral circuit, the larger the touch grid area, so it is easy to increase Touch the grid number to meet the requirements of more functional applications. Further, when the number of lattices is fixed, the "relatively" active area / total area becomes high, and it is also expected to save material production costs and save mass production costs. In order to reduce the peripheral circuit area provided by the number of touch grids, although the peripheral circuit wiring width and wiring interval must be reduced for patterning, the current printing process (refer to FIG. 3) is used at a certain level (dimenslon ) Below, it is difficult to reduce the reliable wiring width / space due to unevenness in line width, poor bonding strength between printed support surfaces such as printed materials and transparent substrates. 4 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) —-------- installation -------- order --------- ^ AW (Please read the precautions on the back before filling out this page) 502247 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs π A7 B7 V. Description of the Invention (^) As described in the present invention, as long as the conductor is formed by plating Since the film is patterned using exposure and development processes, compared to printing methods, it has relatively good pattern uniformity / accuracy, and the plating method is applied to transparent substrates or other plated materials. The surface is chemically vapor-deposited, so it has excellent adhesion. As for the plating method, both electrolytic and non-electrolytic plating techniques can be used. 'Both the chemical and physical methods can be applied to the pre-plating treatment methods for surface activation before plating. . The chemical method is to wet the surface to be plated with a metal acid, a neutral or alkaline solvent, and the physical method is to use sputtering, electron beam, and heat. Physical metal thin film vapor deposition (chemical vapor deposition), chemical vapor deposition, atomic layer deposition (chemical vapor deposition) chemical thin film deposition, thereby processing the surface to be plated A seed layer is formed at the site to be plated to induce plating. Fig. 4a and Fig. 4b show the peripheral circuit wiring engineering drawings when the touch panel is applied in two cases when the plating technology is applied. The engineering sequence is as follows. First, as shown in FIG. 4a, after the transparent substrate on which a transparent conductor film such as IT0 or Sn02 has been completely vapor-deposited is subjected to the aforementioned pre-plating treatment, in addition to the desired plating portions, the remaining portions are screen-printed Print to form mask 1. Generally, the desired plating site is the site where the wiring of the peripheral circuit is located. It goes down along the periphery of the rectangular transparent substrate and is a rectangular strip-shaped site with a certain width (about AL, AW). As the metal solvent required for plating, all metal solvents for plating, such as acid, neutral, and alkali that can be plated, can be applied. After plating, remove the plating 5 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ---------- s -------- Order --- ------ Line ml (Please read the precautions on the back before filling this page) 502247 Printed clothing A7 B7 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (f) Preventing the mask 1 from forming Peripheral circuit wiring and touch grid patterned mask 2, but because of this exposure method patterning, as long as photoresist is used, the plating film or transparent electrode part with this pattern mask will not be etched and left behind . In the etching process of the plating film and the transparent electrode film, first, the plating film is etched with uranium. Next, it can be applied not only to the sequential process of etching the transparent film, or by selecting a chemical solvent for etching, but also applying the two The film is simultaneously etched. After the metal etching process is completed, as long as the mask 2 is removed, a touch grid pattern including a desired peripheral circuit portion can be obtained. In addition to the process shown in Figure 4a, the engineering system shown in Figure 4b includes a mask process (Mask 1) for the pre-plating process. This is because, depending on the situation, in order to protect the relationship between the patterned transparent electrode film during the pre-plating process (for example, by using a chemical solvent used in the pre-plating process, the pattern is touched on the grid area before the uranium is etched. When the transparent electrode in 2 is physically / chemically damaged). In addition, during plating, a mask 2 having the same pattern as that of the mask 1 is formed on the mask 1 to prevent the plating, and then plating is performed, and then used to expose the pattern of the plating film and the transparent electrode. The mask formation process, the engraving process, and the final mask removal process are the same as the process of FIG. 4a. The present invention will be specifically described below based on examples, and the present invention is not limited thereto. Examples

Indium Tin 〇xide(IT〇)Glass 係使用面阻抗 200〜300Ω/ □,厚度1.1mm的Si〇2進行鍍膜處理。首先’用中性洗劑 進行洗淨後,將耐鹼剝離型鍍敷進行網版印刷°圖案在觸 6 --------------------訂---------線· (請先閱讀背面之注意事項再填寫本頁> 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 502247 五 經濟部智慧財產局員工消費合作社印製 A7 B7 發明說明(f) 控面板中,除了透明部分外,將所有的部分進行印刷。舄 了無電解鍍敷,使用由氯化鈀〇.5g、氯化錫25g、鹽酸 300ml、水600ml等所組成的觸媒,在60°C進行2〜5分鏟 的浸泡處理後,進行水洗,在耐鍍敷上,爲了防止鎳金屬 被鍍敷,印刷了像耐鍍敷那種圖案的耐鹼剝離型。然後, 在ITO上,爲了蒸鍍10〜20//m的鎳,用由硫酸鎳33g/l、 次亞磷酸蘇打20g/l、有機酸18g/l、琥珀酸蘇打16g/l所 組成的無電解鎳鍍敷溶液,實施無電解鍍敷。將耐鍍敷用 浸泡在40°C的氫氧化鈉3%溶液中加以除去。爲了鎳周邊 電路配線及ITO圖案化,塗布光阻後,爲了形成蝕刻遮罩 圖案,實施曝光。用碳酸鈉1%溶液進行顯影後,用42波 美(Baume)氯化鐵、鹽酸及水的混合溶液(1 ·· 1 ·· 1)進行蝕刻 。最後,用氫氧化鈉3%溶液來剝離光阻圖案遮罩,完成周 邊電路配線及ITO圖案。ΠΌ膜基板也用相同的工程來完 成。 在上述實施例中,能使用一般性的酸性鍍敷液來取代 無電解鎳鍍敷溶液,耐鍍敷用的浸泡處理時,爲了更穩定 的作業,也能用混合乙二醇和有機鹼溶劑的溶液進行處理 來取代氫氧化鈉3%溶液。 【發明的效果】 如以上的說明,本發明係有關於採用金屬鍍敷技術的 觸控面板的製作工程,具體說來,係有關於在製作觸控面 板時,就透明基板上的周邊電路配線材料,使用以鍍敷方 式來形成導體膜的觸控面板。當製作數位方式的觸控面板 7 度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----------i s --------訂---------線 請先閱讀背面之注音?事項再填寫本頁} 502247 A7 B7 五、發明說明(L) (請先閱讀背面之注意事項再填寫本頁) 時,爲了設定觸控部位,將構成觸控面板的透明電極進行 帶狀圖案化(strip patterning)而加以使用,但最近,根據必 須附著觸控面板之資訊機器的發展趨勢,在小型觸控面板 中,因要求更多觸控部位的設定,故觸控格子圖案的微細 化當然必須藉此來進行周邊電路圖案的微細化。因此,若 採用現在所使用的網版印刷方式的話,這種圖案微細化有 其限度,但只要應用鍍敷方式,在小型的面板中,因能增 大觸控格子數和得到最大有效面積率,故不僅增大觸空格 子數,而且能提高製品的信賴性及生產性,今後,適合應 用在新一代PDA、移動通信等的資訊通信機器,能製造具 有競爭力的觸控面板。 【圖式之簡單說明】 【圖1】本發明的觸控面板之平面圖。 【圖2】本發明的數位方式觸控面板之構成圖。 【圖3】表示採用網版印刷方式的現有觸控面板製作 工程中的電極形成過程之工程圖。 【圖4a】在本發明中,表示適用鍍敷技術的觸控面板 電極的形成方法之一實施例的工程圖。 經濟部智慧財產局員工消費合作社印制衣 【圖4b】在本發明中,表示適用鍍敷技術的觸控面板 電極的形成方法外的實施例之工程圖。 【符號說明】 1 觸控面板/透明基板 2 觸控格子部位/透明電極帶 3 周邊電路圖案 8 &張尺度適用中國國家標準(CNS)A4規格(21G X 297公爱) 502247 A7 _B7五、發明說明(γ ) 4 機器連接電纜 L 觸控面板的長度 W 觸控面板的寬度 L- AL 觸控格子部位 W- ΔΨ 觸控格子部位 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 9 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)Indium Tin 〇xide (IT〇) Glass is coated with Si〇2 with a surface impedance of 200 ~ 300Ω / □ and a thickness of 1.1mm. First 'After cleaning with a neutral detergent, the alkali-resistant peel-off type plating is screen-printed. The pattern is in contact 6 -------------------- Order- -------- Line · (Please read the precautions on the back before filling in this page> This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 502247 Intellectual Property Bureau of the Ministry of Economy Printed by employees' consumer cooperatives A7 B7 Description of invention (f) In the control panel, all parts are printed except for the transparent parts. Electroless plating is used, and 0.5 g of palladium chloride, 25 g of tin chloride, and hydrochloric acid are used. The catalyst consisting of 300ml and water 600ml is immersed in a shovel for 2 to 5 minutes at 60 ° C, and then washed with water. On the plating resistance, in order to prevent the nickel metal from being plated, it is printed like plating resistance. Alkali peeling type with various patterns. Then, on the ITO, in order to vapor-deposit 10 to 20 // m of nickel, 33 g / l of nickel sulfate, 20 g / l of hypophosphite soda, 18 g / l of organic acid, and succinic acid were used. An electroless nickel plating solution composed of 16 g / l of soda is used for electroless plating. The plating resistance is immersed in a 3% solution of sodium hydroxide at 40 ° C and removed. Circuit wiring and ITO are patterned. After photoresist is applied, exposure is performed in order to form an etching mask pattern. After development with a 1% solution of sodium carbonate, a mixed solution of 42 Baume iron chloride, hydrochloric acid, and water ( 1 ·· 1 ·· 1) Etching. Finally, use a 3% solution of sodium hydroxide to peel off the photoresist pattern mask to complete the peripheral circuit wiring and ITO pattern. ΠΌ film substrate is also completed by the same process. In the above implementation In the example, a general acidic plating solution can be used instead of the electroless nickel plating solution. In the case of plating-resistant immersion treatment, a solution mixed with ethylene glycol and an organic alkali solvent can be used for more stable operation. To replace the 3% solution of sodium hydroxide. [Effects of the invention] As explained above, the present invention relates to the manufacturing process of a touch panel using metal plating technology, and more specifically, it relates to the process of making a touch panel. For the peripheral circuit wiring material on the transparent substrate, a touch panel with a conductive film formed by plating is used. When a digital touch panel is manufactured at 7 degrees, the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) ---------- is -------- Order --------- Please read the phonetic on the back? Matters before filling out this page} 502247 A7 B7 V. Description of the Invention (L) (Please read the precautions on the back before filling in this page). In order to set the touch position, the transparent electrodes that make up the touch panel are strip patterned and used. However, recently, according to the development trend of information equipment that must be attached to a touch panel, in a small touch panel, because more settings of touch parts are required, the refinement of the touch grid pattern must of course be used to carry out peripheral circuits. Refinement of patterns. Therefore, if the current screen printing method is used, there is a limit to this pattern miniaturization. However, as long as the plating method is applied, the number of touch grids can be increased and the maximum effective area ratio can be obtained in a small panel. Therefore, it not only increases the number of touch spaces, but also improves the reliability and productivity of products. In the future, it will be suitable for information communication equipment such as new-generation PDAs and mobile communications, and it can manufacture competitive touch panels. [Brief description of the drawings] [FIG. 1] A plan view of a touch panel of the present invention. FIG. 2 is a structural diagram of a digital-type touch panel of the present invention. [Fig. 3] An engineering drawing showing an electrode formation process in a conventional touch panel manufacturing process using screen printing. [Fig. 4a] In the present invention, a process drawing showing an embodiment of a method for forming a touch panel electrode to which a plating technique is applied. [Figure 4b] In the present invention, an engineering drawing showing an embodiment other than a method of forming a touch panel electrode to which plating technology is applied. [Symbol description] 1 Touch panel / transparent substrate 2 Touch grid area / transparent electrode strip 3 Peripheral circuit pattern 8 & Zhang scales are applicable to China National Standard (CNS) A4 specifications (21G X 297 public love) 502247 A7 _B7 Description of invention (γ) 4 Machine connection cable L Length of touch panel W Width of touch panel L- AL Touch grid part W- ΔΨ Touch grid part (please read the precautions on the back before filling this page) Ministry of Economy Printed by the Intellectual Property Bureau's Consumer Cooperatives 9 This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

經濟部智慧財產局員工消費合作社印製 502247 頜 、 _S_ 六、申請專利範圍 1、 一種觸控面板,其特徵在於:在製作觸控面板時, 使用以鍍敷方式形成導體膜來作爲透明基板上的周邊電路 配線材料。 2、 如申請專利範圍第1項之觸控面板,其中,使用電 解或無電解鍍敷方式來作爲鍍敷方式,就鍍敷前處理方法 而言,使用化學性的方式或物理蒸鍍沉積法(physical vapor deposition)或化學蒸鍍沉積法(chemical vapor deposition),化 學性的方式係使用可用在鍍敷前處理的所有酸、中性及鹼 金屬溶劑。 3、 如申請專利範圍第2項之觸控面板,其中,前述鍍 敷劑前處理包括在透明基板上,全面蒸鍍透明電極後,再 實施上述鍍敷前處理,在形成鍍敷防止遮罩(圖4a的遮罩 1)後進行鍍敷的方式;及爲了防止鍍敷前處理所造成的觸 控格子部位(2)內的透明電極之損傷,在蒸鍍損傷防止用遮 罩(圖4b的遮罩1)後,進行鍍敷前處理,待形成鍍敷防止 遮罩(圖4b的遮罩2)後進行鍍敷的方式。 4、 如申請專利範圍第3項之觸控面板,其中,在完成 鍍敷後、除去鍍敷防止遮罩後、及將透明導體及鍍敷導體 膜進行圖案化所能使用的方法塗布光阻後,使用曝光工程 (photolithography),形成觸控格子及周邊電路配線圖案遮罩 (圖4a的遮罩2及圖4b的遮罩3)。 5、 如申請專利範圍第4項之觸控面板,其中,在形成 觸控格子及周邊電路配線圖案遮罩後,使用可用的化學溶 劑,依序或同時進行透明導體膜及鍍敷導體的蝕刻,並在 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) I - -丨線· 502247 A8 B8 C8 D8 、申請專利範圍 蝕刻後,用能使用的方式除去圖案遮罩。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 2 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 502247 Jaw, _S_ VI. Patent application scope 1. A touch panel, characterized in that when manufacturing a touch panel, a conductive film is formed by plating as a transparent substrate Peripheral circuit wiring materials. 2. For the touch panel of the first patent application scope, in which electrolytic or non-electrolytic plating is used as the plating method, as for the pre-plating treatment method, a chemical method or a physical vapor deposition method is used. (physical vapor deposition) or chemical vapor deposition (chemical vapor deposition), the chemical method is to use all acid, neutral and alkali metal solvents that can be used in pre-plating treatment. 3. For the touch panel according to the second item of the patent application, wherein the aforementioned pretreatment of the plating agent includes a transparent substrate, and after the transparent electrode is fully vapor-deposited, the aforementioned pretreatment of the plating is performed to form a plating prevention mask. (Mask 1 of FIG. 4a) A method of plating afterwards; and in order to prevent damage to the transparent electrode in the touch grid part (2) caused by pre-plating treatment, a mask for vapor deposition damage prevention (FIG. 4b) After the mask 1), a pre-plating treatment is performed, and a plating prevention method is performed after a plating prevention mask (the mask 2 in FIG. 4b) is formed. 4. For the touch panel of item 3 in the scope of patent application, wherein the photoresist can be coated by a method that can be used after plating, after removing the plating prevention mask, and patterning the transparent conductor and the plated conductor film. Then, photolithography is used to form a touch grid and a peripheral circuit wiring pattern mask (mask 2 in FIG. 4a and mask 3 in FIG. 4b). 5. For the touch panel of the fourth item in the scope of patent application, after forming the touch grid and the peripheral circuit wiring pattern mask, use available chemical solvents to sequentially or simultaneously etch the transparent conductor film and plated conductor. , And this paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) I--丨 · 502247 A8 B8 C8 D8, patent application scope After etching, the pattern mask is removed in a usable manner. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 2 The paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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