TW501789U - Wafer lifting pin stand - Google Patents

Wafer lifting pin stand

Info

Publication number
TW501789U
TW501789U TW90210042U TW90210042U TW501789U TW 501789 U TW501789 U TW 501789U TW 90210042 U TW90210042 U TW 90210042U TW 90210042 U TW90210042 U TW 90210042U TW 501789 U TW501789 U TW 501789U
Authority
TW
Taiwan
Prior art keywords
lifting pin
wafer lifting
pin stand
stand
wafer
Prior art date
Application number
TW90210042U
Other languages
Chinese (zh)
Inventor
Tian-De Yang
Duen-Jr Shr
Original Assignee
King Mechatronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Mechatronics Co Ltd filed Critical King Mechatronics Co Ltd
Priority to TW90210042U priority Critical patent/TW501789U/en
Publication of TW501789U publication Critical patent/TW501789U/en

Links

TW90210042U 2001-06-15 2001-06-15 Wafer lifting pin stand TW501789U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90210042U TW501789U (en) 2001-06-15 2001-06-15 Wafer lifting pin stand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90210042U TW501789U (en) 2001-06-15 2001-06-15 Wafer lifting pin stand

Publications (1)

Publication Number Publication Date
TW501789U true TW501789U (en) 2002-09-01

Family

ID=21684607

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90210042U TW501789U (en) 2001-06-15 2001-06-15 Wafer lifting pin stand

Country Status (1)

Country Link
TW (1) TW501789U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641070B (en) * 2018-01-09 2018-11-11 力成科技股份有限公司 Needle device for chip
CN110299303A (en) * 2018-03-23 2019-10-01 旺矽科技股份有限公司 Chip picks assembly and chip moving method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641070B (en) * 2018-01-09 2018-11-11 力成科技股份有限公司 Needle device for chip
CN110299303A (en) * 2018-03-23 2019-10-01 旺矽科技股份有限公司 Chip picks assembly and chip moving method

Similar Documents

Publication Publication Date Title
IL154264A0 (en) Wafer prober
EP1368269A4 (en) Lifting device
EP1401759A4 (en) Lifting apparatus
TW501789U (en) Wafer lifting pin stand
GB0200699D0 (en) Lifting apparatus
GB0116302D0 (en) Lifting device
GB2380602B (en) Wafer alignment device
GB0117825D0 (en) Hoisting device
GB0225056D0 (en) Lifting frames
GB2377688B (en) Lifting mechanism
TW500123U (en) Improved jack
GB2392432B (en) Lifting apparatus
GB2379652B (en) Lifting apparatus
GB0101813D0 (en) Lifting aid
GB2373285B (en) Lifting device
GB0118967D0 (en) Lifting device
GB0113014D0 (en) Lifting Device
GB2392433B (en) Lifting apparatus
GB0116435D0 (en) Lifting means
TW528053U (en) Fast jack
GB0112553D0 (en) Static quick lift jack
GB0104474D0 (en) Lifting apparatus
GB0117444D0 (en) Lifting apparatus
GB0100576D0 (en) Drawing pin device
GB0126389D0 (en) Wafer

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees