501241 A7 _B7_ 五、發明說明（） 本發明係與晶片構裝有關，更詳而言之是指一種具有 保護效果之晶片構裝結構。 按，一般晶片構裝之結構，大體包含有一座體、一晶 片及一封蓋；該座體具有一容室，該容室形成有一連通外 5 部之開口，且該容室之底部佈設有多數呈預定數量及態樣 之線路；該晶片係固置於該容室之底部上，並藉由多數之 銲線電性連接於該等線路上；該封蓋係封合於該容室之開 口上，以避免該容室内之晶片受外部之污染或破壞者； 復按，一般在進行晶片構裝之場所，必定會先施以無 10 塵及殺菌之措施（即無塵室），以避免晶片受到異物之污染 或破壞；但，由於構裝之過程中，仍有許多必須藉助人力 方能完成之動作，因此無論如何嚴密的預防，仍免不了會 有些許細微之塵埃或懸浮微粒由人體所夾帶進入，也因而 在進行晶片之構裝後，仍有可能有上述之異物被封合於該 15 晶片構裝之容室内，進而對極精密的晶片運作造成影響或 導致損壞。 其次，上述構裝之座體，若採用現行一般強化塑膠材 質之印刷電路板製造時，在長期使用下，水氣將穿透電路 板進入於該容室中，進而影響晶片之正常運作或減低整體 20 構裝之使用壽命。 因此，在已採用最佳除塵及除濕除菌設施之晶片構裝 場所中，仍免不了有上述缺點產生之情況下，如何在構裝 結構之本身上尋求解決之道，便成為各家製造商及研究機 構所必須面對及突破之重要課題。 •3- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ----------------- (請先閱讀背_面之企意事項再填寫本頁) · -線· 經濟部智慧財產局員工消費合作社印製 501241 經濟部智慧財產局員工消費合作社印製 A7 _B7_五、發明說明（） 有鑑於上述之種種缺失，本案發明人乃經詳思細索， 並累積多年從事晶片構裝之製造及研究開發之經驗，終而 有本發明之產生。 亦即本發明之主要目的乃在提供一種具有保護效果之 5 晶片構裝結構，係可吸附晶片周圍之塵埃，以避免影響晶 片正常之運作者。 本發明之次要目的乃在提供一種具有保護效果之晶片 構裝結構，係可吸附晶片周圍之水份或濕氣，以避免影響 晶片正常之運作者。 10 緣此，為達上述之目的，本發明所提供一種具有保護 效果之晶片構裝結構，係包含有：一座體，該座體具有一 容室，該容室形成有一朝外之開口； 一晶片，係容置於該 座體之容室中，並與該座體呈電性連接；一保護組件，係 固置於該容室中，可用以吸附該容室内對晶片有害之塵埃 15 者；一基板，該基板可用以封閉該座體之開口，以避免位 於該容室内之晶片受外部之污染或破壞者。 為使審查委員能更詳細瞭解本發明之實際構造及特 性，茲舉以下較佳實施例並配合圖示說明如后，其中： 笫一圖係本發明笫一較佳實施例之剖視圖； 20 笫二圖係笫一圖所示實施例之使用狀態圖； 笫三圖係笫一圖所示實施例之局部放大圖； 笫四圖係本發明笫二較佳實施例之剖視圖； 笫五圖係本發明笫三較佳實施例之剖視圖； 笫六圖係本發明笫四較佳實施例之剖視圖； -4· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背'面之生意事項再填寫本頁) ;0 訂·· --線·501241 A7 _B7_ V. Description of the invention () The present invention relates to wafer structure, and more specifically refers to a wafer structure with a protective effect. According to the structure of a general wafer structure, it generally includes a body, a wafer, and a cover; the base has a receiving chamber, the receiving chamber is formed with an opening that communicates with the outer 5 parts, and the bottom of the receiving chamber is arranged There are a large number of circuits with a predetermined number and appearance; the chip is fixed on the bottom of the container, and is electrically connected to the circuits by a plurality of bonding wires; the cover is sealed in the container To prevent the wafer inside the container from being contaminated or damaged by the outside; re-press, generally in the place where the wafer is assembled, the measures must be implemented without dust and sterilization (ie, clean room), To prevent the wafer from being contaminated or damaged by foreign objects; however, since there are still many actions that must be performed by humans during the construction process, no matter how strict the prevention is, there will still be some slight dust or suspended particles. The human body is entrained into it. Therefore, after the wafer is assembled, it is still possible that the above-mentioned foreign matter is sealed in the 15-wafer-constructed chamber, which may affect or cause damage to the extremely precise wafer operation. Secondly, when the above-mentioned structured seat body is manufactured by using the current printed circuit board of general reinforced plastic material, under long-term use, water and gas will penetrate the circuit board and enter the chamber, thereby affecting the normal operation or reduction of the chip. The service life of the overall 20 construction. Therefore, in the wafer installation place that has adopted the best dust removal, dehumidification and sterilization facilities, it is inevitable that under the circumstances of the above disadvantages, how to find a solution on the structure structure itself has become a manufacturer and Important issues that research institutions must face and break through. • 3- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) ----------------- (Please read the company's intentions on the back (Fill in this page again.) · -Line · Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 501241 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ V. Description of the invention After careful consideration, and accumulated years of experience in manufacturing and research and development of wafer assembly, the invention finally came into being. That is, the main purpose of the present invention is to provide a 5 wafer structure with a protective effect, which can absorb the dust around the wafer to avoid affecting the normal operation of the wafer. A secondary object of the present invention is to provide a wafer structure with a protective effect, which can absorb moisture or moisture around the wafer to avoid affecting the normal operation of the wafer. 10 For this reason, in order to achieve the above-mentioned object, the present invention provides a wafer structure with a protective effect, including: a base body, the base body has a containing chamber, the containing chamber is formed with an outward opening; The chip is housed in the chamber of the base body and is electrically connected to the seat body; a protection component is fixed in the chamber and can be used to adsorb the dust harmful to the wafer in the chamber 15 A base plate, which can be used to close the opening of the base body to prevent the wafers located in the container from being contaminated or damaged by the outside. In order to enable the reviewing committee to understand the actual structure and characteristics of the present invention in more detail, the following preferred embodiments are illustrated in conjunction with the illustrations as follows, where: (a) a diagram is a cross-sectional view of a preferred embodiment of the present invention; (20) The second figure is a state diagram of the embodiment shown in the first figure; the third figure is a partial enlarged view of the embodiment shown in the first figure; the fourth figure is a sectional view of the second preferred embodiment of the present invention; the fifth figure is A cross-sectional view of the twenty-third preferred embodiment of the present invention; a six-view diagram is a cross-sectional view of the fourth preferred embodiment of the present invention; -4. This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please First read the business matters on the back side and then fill out this page); 0 order
五、發明說明（） 經濟部智慧財產局員工消費合作社印製 請參閱笫一至米二圖’係本發明所提供一種具有保護 效果之晶片構裝結構（10)，如笫一圖所示，其主要包含有 一座體(20)、一晶片（3〇)、一保護組件（40)及一基板（5〇); 該座體（20)，係可為塑膠、玻璃纖維、強化塑膠、陶 5 瓷…等材質所製成之電路板（Printed Circuit Board， PCB)，其具有一頂面（21)、一底面（22)、一容室（23)及一 連接裝置（27);該容室（23)具有一底部（24)、一位於該底部 (24)周緣之侧壁（25)以及一位於該頂面（21)而與外界相通之 開口（26)，該頂面（21)上則佈設有多數呈預定數量及態樣 10 之銲墊（圖未示），該連接裝置（27)係為若干自該頂面（21)銲 墊貫穿至該底面（22)上之貫孔（271); 該晶片（30)，係藉由一黏著物（31)，而固定於該容室 (23)之底部（24)上，且該晶片（30)之表面具有多數之銲蟄 (圖未示），並藉由多數之銲線（32)利用打線技術，而以謗 15 等銲線(32)之二端分別連接於該座體(20)及該晶片（30)之銲 墊上； 該保護組件（40)，係為若干表面塗佈有黏性材質之除 塵黏附層（41)，該等除塵黏附層（41)係分別黏著於該容室 (23)之底部(24)或側壁(25)或底部（24)及側壁(25)上； 20 該基板（50)係為一封蓋（51)，該封蓋（51)係可為不透明 之塑膠、金屬或透明之玻璃、塑膠等材質所製成之板狀 體，該封蓋（51)具有一頂面（53)及一底面（54);該底面（54) 係藉由一黏結物（52)而固接於該座體(20)之頂面（21)上’用 -5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀f.面之；^意事項再填寫本頁) Ί^τ· --線· 501241 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 以封閉住該答室（23)之開口（26)，以保護該晶片（3〇)可不受 外部之破壞或雜物之污染。 於此，係為本發明具有保護效果之晶片構裝結構各構 件構造及其組成方式，接著再將其組装特點及優點說明如 5 下： 如笫二圖所示，將該座體（2〇)之底面（22)連結於一外部 之電路板（60)上，並藉由一銲鍚（61)置入於該等貫孔（271) 中，使位於該座體(20)内之晶片（30)可藉由該銲鍚(61)之連 接而呈電性導通；且當該封蓋（51)封合於該容室（23)之開 10 口（26)上時’该容室（23)便成為一封閉之空間，使位於該 容室（23)中之有害物質（如塵埃或懸浮微粒），在飄移當中 會碰觸於該等除塵黏附層（41)上，而可將塵埃或懸浮微粒 黏著吸附於該等除塵黏附層（41)之黏性表面上（如第三圖所 示），使該容室（23)中之有害物質可被該等除塵黏附層（41) 15 所吸附，而不致影響該晶片（3〇)正常之運作。 另外，亦可將該等除塵黏附層（41)黏著固定於該封蓋 (51)之底面（54)上並與該容室（23)連通者。 由本發明各構件之組成’具有多項優點，在此說明如 下： 20 一·增加使用壽命：由於該保護組件具有可黏著吸附 塵埃或微粒之功效’將可使该晶片雙此異物影響或破壞之 情形大為減低，進而增加構裝之使用壽命。 -6- i紙張尺錢Θ帽國家標準（CNS)A4規格（210 X 297公釐) (請先閱讀背面之注意事項再填寫本*s) # _ -丨線· 經濟部智慧財產局員工消費合作社印製 501241 A7 _B7_ 五、發明說明（） 二·裝配簡易：由於該保護組件位在該容室中之位置 並不需作精確之限定，也不需藉用精密之機器或方法進行 裝配，使得裝配之簡易度大增。 三·成本低廉：由於該保護組件之構造簡單，使得在 5 製造及裝配上並不需額外增加過多之費用，便可換得如此 大之功效，可謂係物美價廉。 請參閱笫四圖，係本發明笫二較佳實施例所提供一種 具有保護效果之晶片構裝結構（1(V)，其主要包含有一座體 (20)、一晶片（30)、一保護組件（40)及一基板（50);與上述 1〇 實施例之主要差異在於： 該保護組件（40)更具有若干之除濕元件（42)，係位於該 容室（23)中而分別連結於該等除塵黏附層（41)上，而可用 以吸附該容室（23)中之水、濕氣等有害物質，以避免位在 該容室（23)中之晶片（30)遭受水、濕氣之影響而損壞者； 15 在本實施例中，該除濕元件（42)係為一乾燥劑包（43)，係 各自分別黏著於該除塵黏附層（41)之一端面上，且該乾燥 劑包（43)之面積係小於該除塵黏附層（41)之面積，使得該 除塵黏附層（41)與該乾燥劑包（43)黏著之端面上仍具有部 份可吸附塵埃或微粒之黏性表面； 20 其次，該保護組件（40)之除塵黏附層（41)，係可分別黏 著固定於該容室（23)之底部（24)、側壁（25)或與該容室（23) 相通之封蓋（51)底面（54)上。 請參閱笫五圖，係本發明笫三較佳實施例所提供之一 具有除塵效果之晶片構裝結構（ΗΓ)，其主要包含有一座體 -7_ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------------—訂---------IAWI (請先閱讀t.面之注意事項再填寫本頁) 501241 A7 B7 五、發明說明（） (20)、一晶片（30)、一保護組件（40)及一基板（50);其與上 述實施例之主要差異在於： 該基板（50)係為一外界之電路板（55)，該電路板（55)具 有一頂面（56)及一底面（57);該底面（57)上佈設有若干呈預 5定數量及態樣之線路（圖未示），係直接藉由一銲鍚（錄 膏）(571)而黏結於該座體（20)之頂面（21)上進而封合住該開 口（26)，使該座體(20)之容室（23)形成一封閉之空間，且該 電路板（55)上所佈設之線路可藉由銲線（32)與銲錫（571)而 與該晶片（30)呈電性導通；於此便可省去在該座體（20)上 1〇 設置連接裝置（如笫一圖所示之（27))以達簡化整體構裝之 結構。 請參閱笫六圖，係本發明笫四較佳實施例所提供一種 具有保護效果之晶片構裝結構（1(T)，其主要包含有一座 體（20)、一晶片（30)、一保護組件（40)及一基板（50);與上 15 述實施例之主要差異在於： 該基板（50)係為一封蓋（5Γ)，該封蓋（51，）具有一通孔 (511)，該通孔（511)係對應該晶片（30)之位置，且該通孔 (511)中至少封設固定有一鏡片（512)者。 經濟部智慧財產局員工消費合作社印製 综上所述，本發明於同類產品中實具其進步實用性， 20 且使用上之方便，又，本發明於申請前並無相同物品見於 刊物或公開使用，是以，本發明實已具備發明專利要件， 為保障發明人之苦思，爰依法提出申請。 _8_ 本紙張尺度顧+ @ 0家標準（CNS)A4規格（210 ; 297公髮了 501241 A7 B7_ 五、發明說明（） 簡單圖示說明： 笫一圖係本發明笫一較佳實施例之剖視圖。 笫二圖係笫一圖所示實施例之使用狀態圖。 笫三圖係笫一圖所示實施例之局部放大圖。 5 笫四圖係本發明笫二較佳實施例之剖視圖。 笫五圖係本發明笫三較佳實施例之剖視圖。 笫六圖係本發明笫四較佳實施例之剖視圖。 圖號說明： 10 「笫一較佳實施例」 具有保護效果之晶片構裝結構（1 〇) (請先閱讀背面之注意事項再填寫本頁) - 座體(20) 頂面（21) 底面（22) 容室（23) 底部（24) 側壁（25) 開口（26) 連接裝置（27) 貫孔（271) 晶片（30) 黏著物（31) 銲線(32) 保護組件（40) 除塵黏附層（41) 基板(50) 封蓋（51) 黏結物（52) 頂面（53) 底面（54) 電路板(60) 訂： -線· 銲鍚（61) 經濟部智慧財產局員工消費合作社印製 20 「笫二較佳實施例」 具有保護效果之晶片構裝結構（10’） 座體(20) 容室(23) 底部（24) 側壁（25) -9- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 501241 A7 _B7_ 五、發明說明（） 晶片（30) 除濕元件（42) 底面（54) 開口（26) 底面（57) 保護組件（40) 除塵黏附層（41) (請先閲讀背面之注意事項再填寫本頁) 乾燥劑包（43) 基板（50) 封蓋（51) 5 「笫三較佳實施例」 具有保護效果之晶片構裝結構（1〇Μ) 座體（20) 頂面（21) 晶片（30) 10 保護組件（40) 基板（50) 電路板（55) 頂面（56) 銲鍚（571) 15 「笫四較佳實施例」 具有保護效果之晶片構裝結構（10"’） 座體（20) 晶片（30) 保護組件（40)及 基板（50) 封蓋（5Γ) 通孔（511) 鏡片（512) 經濟部智慧財產局員工消費合作钍印製 10- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）V. Description of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, please refer to Figure 1-2 to Figure ii. This is a wafer structure (10) with protective effect provided by the present invention, as shown in Figure 1-1. It mainly includes a body (20), a wafer (30), a protective component (40), and a base plate (50); the base (20) can be plastic, fiberglass, reinforced plastic, ceramic 5 A printed circuit board (PCB) made of porcelain, etc., which has a top surface (21), a bottom surface (22), a receptacle (23), and a connection device (27); the receptacle (23) It has a bottom (24), a side wall (25) located on the periphery of the bottom (24), and an opening (26) located on the top surface (21) and communicating with the outside, on the top surface (21) Then, a large number of welding pads (not shown) with a predetermined number and appearance 10 are arranged, and the connecting device (27) is a plurality of through holes (from the top surface (21) welding pads to the bottom surface (22)) 271); the wafer (30) is fixed on the bottom (24) of the container (23) by an adhesive (31), and the surface of the wafer (30) has There are a large number of bonding pads (not shown), and the majority of bonding wires (32) utilize wire bonding technology, and the two ends of the bonding wire (32) are connected to the base (20) and the chip respectively. (30) on the welding pad; the protective component (40) is a number of dust-removing adhesion layers (41) coated with adhesive material on the surface, and the dust-removing adhesion layers (41) are respectively adhered to the chamber (23) Bottom (24) or side wall (25) or bottom (24) and side wall (25); 20 The substrate (50) is a cover (51), and the cover (51) may be opaque plastic, The plate (51) has a top surface (53) and a bottom surface (54) made of metal or transparent glass, plastic and other materials; the bottom surface (54) is made of an adhesive (52) ) And fixed on the top surface (21) of the base body (20) 'Use -5- This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) (Please read f. (Please fill in this page for ^ Italian matters) Ί ^ τ · --line · 501241 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention () To close the opening of the answering room (23) (26) To protect the chip 3〇) can damage or contamination from the outside of the glove. Here, this is the structure and composition of each component of the wafer mounting structure with protective effect of the present invention, and then its assembly features and advantages are described as follows: As shown in the second figure, the base (2 〇) The bottom surface (22) is connected to an external circuit board (60), and is placed in the through holes (271) by a soldering pad (61), so that it is located in the seat (20). The chip (30) can be electrically connected through the connection of the welding pad (61); and when the cover (51) is sealed on the opening 10 (26) of the container (23), the capacitor The chamber (23) becomes a closed space, so that harmful substances (such as dust or suspended particles) located in the containing chamber (23) will touch the dust-removing adhesion layer (41) during drifting, and may Dust or suspended particles are adhered and adhered to the sticky surface of the dust-removing adhesive layer (41) (as shown in the third figure), so that harmful substances in the container chamber (23) can be covered by the dust-removing adhesive layer (41). ) 15 without affecting the normal operation of the chip (30). In addition, the dust-removing adhesive layer (41) may be adhered and fixed on the bottom surface (54) of the cover (51) and communicated with the receptacle (23). The composition of the components of the present invention has a number of advantages, which are described here: 20 I. Increasing the service life: Because the protective component has the function of adhering and adsorbing dust or particles, the situation where the wafer can be affected or destroyed by this foreign body It is greatly reduced, thereby increasing the service life of the structure. -6- i paper rule money Θ cap national standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling in this * s) # _-丨 Line · Intellectual Property Bureau, Ministry of Economic Affairs, Employee Consumption Printed by the cooperative 501241 A7 _B7_ V. Description of the invention (2) Simple assembly: Because the position of the protective component in the container does not need to be precisely defined, nor does it need to be assembled by precision machinery or methods. Makes assembly easier. 3. Low cost: Because of the simple structure of the protection component, there is no need to increase extra costs in manufacturing and assembly, so that it can be exchanged for such a large effect, which can be said to be inexpensive. Please refer to FIG. 24, which is a wafer structure (1 (V) with protective effect) provided by the second preferred embodiment of the present invention, which mainly includes a body (20), a wafer (30), and a protection. Module (40) and a base plate (50); the main difference from the above-mentioned 10 embodiment is that the protection module (40) further has a number of dehumidifying elements (42), which are respectively connected in the container chamber (23) On the dust-removing adhesion layer (41), it can be used to adsorb harmful substances such as water and moisture in the container (23) to prevent the wafer (30) located in the container (23) from being exposed to water, Those who are damaged by the influence of moisture; 15 In this embodiment, the dehumidifying element (42) is a desiccant bag (43), which is respectively adhered to one end surface of the dust-removing adhesive layer (41), and the The area of the desiccant bag (43) is smaller than the area of the dust-removing adhesive layer (41), so that the end surface where the dust-removing adhesive layer (41) and the desiccant bag (43) are adhered still has a part that can absorb dust or particles. Adhesive surface; 20 Secondly, the dust-removing adhesive layer (41) of the protective component (40) can be adhered and fixed separately On the bottom (24), the side wall (25) of the container chamber (23), or the bottom surface (54) of the cover (51) communicating with the container chamber (23). Please refer to Figure 5, which is the third comparison of the present invention. A wafer mounting structure (ΗΓ) with dust removal effect provided by the preferred embodiment, which mainly includes a body-7_ This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---- --------------— Order --------- IAWI (Please read the notes on t. Before filling out this page) 501241 A7 B7 V. Description of the invention () (20), a wafer (30), a protective component (40), and a substrate (50); the main difference from the above embodiment is that the substrate (50) is an external circuit board (55), the The circuit board (55) has a top surface (56) and a bottom surface (57); the bottom surface (57) is provided with a number of circuits (not shown) in a predetermined number and shape, which are directly connected by a solder钖 (recording paste) (571) and bonded to the top surface (21) of the base body (20) to seal the opening (26), so that the chamber (23) of the base body (20) forms a closed Space, and the wiring on the circuit board (55) can be borrowed The wire (32) and the solder (571) are electrically connected to the chip (30); thus, it is possible to omit 10 connecting devices (as shown in the first figure) on the base (20). (27)) to simplify the overall structure. Please refer to Figure 26, which is a wafer structure (1 (T) with protective effect) provided by the fourth preferred embodiment of the present invention. The main body (20), a wafer (30), a protective component (40), and a substrate (50); the main difference from the embodiment described above is that: the substrate (50) is a cover (5Γ), the The cover (51,) has a through hole (511) corresponding to the position of the wafer (30), and at least one lens (512) is fixed in the through hole (511). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics In summary, the present invention has its practicality of advancement in similar products, and it is convenient to use. Moreover, the present invention did not have the same articles in publications or publications before application. The use is that the invention already has the elements of an invention patent. In order to protect the inventor's hard work, an application is made according to law. _8_ This paper scales Gu + @ 0 home standard (CNS) A4 specifications (210; 297 issued 501241 A7 B7_ V. Description of the invention () Brief illustration: (a) The figure is a cross-sectional view of a preferred embodiment of the present invention The second figure is a state diagram of the embodiment shown in the first figure. The third figure is a partial enlarged view of the embodiment shown in the first figure. 5 The fourth figure is a sectional view of the second preferred embodiment of the present invention. 笫The fifth figure is a cross-sectional view of the twenty-third preferred embodiment of the present invention. The sixth figure is a cross-sectional view of the twenty-fourth preferred embodiment of the present invention. Description of the drawing number: 10 "first preferred embodiment" A wafer structure with a protective effect (1 〇) (Please read the precautions on the back before filling out this page)-Seat (20) Top (21) Bottom (22) Container (23) Bottom (24) Side wall (25) Opening (26) Connection Device (27) Through-hole (271) Wafer (30) Adhesive (31) Welding wire (32) Protective component (40) Dust removal adhesive layer (41) Substrate (50) Cover (51) Adhesive (52) Top surface (53) Bottom surface (54) Circuit board (60) Order:-Wire · Solder (61) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 20 "Twenty-two preferred embodiments" Protective effect wafer structure (10 ') Base body (20) Receptor room (23) Bottom (24) Side wall (25) -9- This paper size applies to Chinese national standards ( CNS) A4 specification (210 X 297 mm) 501241 A7 _B7_ V. Description of the invention () Wafer (30) Dehumidification element (42) Bottom surface (54) Opening (26) Bottom surface (57) Protective component (40) Dust removal adhesive layer ( 41) (Please read the precautions on the back before filling out this page) Desiccant pack (43) Substrate (50) Cover (51) 5 "Third preferred embodiment" Protective wafer structure (1〇 Μ) Base (20) Top surface (21) Wafer (30) 10 Protective component (40) Substrate (50) Circuit board (55) Top surface (56) Solder pad (571) 15 "Four best embodiments" Protective effect wafer structure (10 " ') Base body (20) Wafer (30) Protection component (40) and base plate (50) Cover (5Γ) Through hole (511) Lens (512) Ministry of Economic Affairs Intellectual property Printed by the Bureau's Consumer Cooperation 10- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)