TW501174B - Photoresist baking device - Google Patents

Photoresist baking device Download PDF

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Publication number
TW501174B
TW501174B TW90121705A TW90121705A TW501174B TW 501174 B TW501174 B TW 501174B TW 90121705 A TW90121705 A TW 90121705A TW 90121705 A TW90121705 A TW 90121705A TW 501174 B TW501174 B TW 501174B
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Taiwan
Prior art keywords
photoresist
drying device
patent application
item
scope
Prior art date
Application number
TW90121705A
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Chinese (zh)
Inventor
Kuen-Jian Chen
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Au Optronics Corp
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Priority to TW90121705A priority Critical patent/TW501174B/en
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Publication of TW501174B publication Critical patent/TW501174B/en

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Abstract

This invention provides a photoresist baking device, which mainly consists of a reaction tank, a heating unit and at least a partition plate. The partition has or is connected to at least a warming unit to increase temperature of the partition plate and the photoresist coated substrate is heated between the heating unit and the partition plate. Therefore, the solvent vapor generated from the photoresist coated substrate during heating can remain decomposed or gaseous state, when contacting the warm-up partition plate, without condensing on the partition plate. This can ensure that there is no particle contaminant source formed on the partition plate because the vapor generated during heating can be completely removed from the reaction chamber through the ventilation hole of the partition plate.

Description

501174 A7 B7 五、發明說明(I ) 【本發明之領域】 本發明係關於一種光阻烘乾裝置,尤指一種可使塗佈 光阻之基板於烘乾時產生之氣體,不致形成粒子污染源之 光阻烘乾裝置。 【本發明之背景】 一般之半導體製程或平面顯示基板之製程中,多會利 用黃光蝕刻製程以製造電路或電子元件單位之圖樣。而黃 光蝕刻製程包含塗布光阻,烘乾,曝光(使用光罩)以及 顯影等步驟。 而傳統習知之光阻烘乾裝置,如第1圖所示,係將塗 佈光阻之基板放置於加熱板與阻隔板間,待加熱板加熱 後,可使基板上原有之溶劑蒸發成為氣體狀態或分解,藉 以將光阻内多餘之溶劑排出,之後再利用抽風設備將溶劑 氣體排除,且該氣體係經由阻隔板上的排氣孔排除。 經濟部智.€財產局-^-工消費合作社印製 然而,傳統之光阻烘乾裝置無法有效率地將氣體完全 排除,因為部分氣體會先接觸到阻隔板板面後,才透過排 氣孔排除。但是溶劑分子接觸阻隔板時,常常凝結於阻隔 板表面;其主要是因為阻隔板溫度常低於加熱板溫度或低 於溶劑氣化之溫度,無法使氣體仍然維持分解或氣體狀 態;故有少數氣體在排出反應槽之前,碰觸到溫度較低之 阻隔板後,則會凝結於阻隔板表面上’無法隨抽風設備自 排氣孔排除。這些分子凝固於阻隔板之内面’經反應槽長 時間之使用,往往形成凝結沈積於阻隔板表面上。久而久 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公) 501174 經濟部智慧財產局M工消費合作社印製 A7 _B7 ___五、發明說明(乙) 之,阻隔板板面將因這些凝結沈積之結果而形成一些不受 歡迎之粒子,更因此而成為基板之污染源,粒子容易掉落 於被處理之基板表面,使光阻製造過程的不良率提高。 發明人爰因於此,本於積極發明之精神,亟思一種可 以解決上述問題之「光阻烘乾裝置」,幾經研究實驗終至 完成此項之發明。 【本發明之概述】 本發明之主要目的係在提供一種光阻烘乾裝置,俾能 確保塗佈光阻之基板於加熱時所產生之溶劑氣體於排除至 反應槽外之過程中,不致凝結沈積於阻隔板上而形成基板 之粒子污染源。 為達成上述之目的,本發明主要包括一反應槽、一加 熱單元、以及至少一阻隔板,其特徵在於該阻隔板具有或 連接有至少一增溫單元以增高該阻隔板之溫度,且該塗佈 光阻之基板係於該加熱單元及該阻隔板間加熱。因此,該 塗佈光阻之基板於加熱時所產生之溶劑氣體’接觸到該增 溫後之阻隔板時,仍可維持分解或氣體之狀態,不致凝結 沈積於該阻隔板上。故幾乎所有加熱時產生之氣體可完全 經由該阻隔板之排氣孔自反應室中排除,確可使該阻隔板 上不致因凝結沈積而形成粒子污染源。 由於本發前構造新穎,能提供產業上利用,且確有 增進功效,故依法申請發明專利。 先 Μ 讀 背 S 之 注 意 事 項 裝 訂 線 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 刈 1174 A7501174 A7 B7 V. Description of the invention (I) [Field of the invention] The present invention relates to a photoresist drying device, in particular to a gas that can be generated during drying of a substrate coated with photoresist, so as not to form a source of particle pollution. Photoresist drying device. [Background of the present invention] In a general semiconductor manufacturing process or a flat display substrate manufacturing process, a yellow light etching process is often used to manufacture a circuit or electronic component unit pattern. The yellow etching process includes the steps of coating photoresist, drying, exposing (using a photomask), and developing. The conventional photoresist drying device, as shown in Figure 1, places the photoresist-coated substrate between the heating plate and the barrier plate. After the heating plate is heated, the original solvent on the substrate can be evaporated into a gas. State or decomposition, so as to discharge the excess solvent in the photoresist, and then exhaust the solvent gas using a ventilation device, and the gas system is eliminated through the exhaust hole on the barrier plate. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs-^-Industrial and Consumer Cooperatives. However, the traditional photoresist drying device cannot completely eliminate the gas efficiently, because some of the gas will first contact the barrier plate surface before passing through the exhaust. Hole exclusion. However, when the solvent molecules contact the barrier film, they often condense on the surface of the barrier film. It is mainly because the temperature of the barrier film is often lower than the temperature of the heating plate or the temperature at which the solvent vaporizes, and the gas cannot be maintained in a decomposed or gas state. Before the gas is discharged from the reaction tank, after it touches the lower temperature barrier plate, it will condense on the surface of the barrier plate 'cannot be removed from the exhaust hole with the exhaust equipment. These molecules are solidified on the inner surface of the barrier plate, and after a long period of use in the reaction tank, they often form condensation and deposit on the surface of the barrier plate. Over time, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 males) 501174 Printed by the M Industrial Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7 ___ V. Description of the invention (B) As a result of these condensed deposits, some undesirable particles are formed, and thus become a source of contamination of the substrate. The particles easily fall on the surface of the substrate being processed, which increases the defect rate of the photoresist manufacturing process. Because of this, the inventor, in the spirit of active invention, urgently thought of a "photoresist drying device" that could solve the above problems. After several research experiments, this invention was completed. [Overview of the present invention] The main purpose of the present invention is to provide a photoresist drying device, which can ensure that the solvent gas generated when the photoresist-coated substrate is heated is not condensed during the process of being excluded from the reaction tank. A source of particle contamination deposited on a barrier to form a substrate. In order to achieve the above object, the present invention mainly includes a reaction tank, a heating unit, and at least one barrier plate, which is characterized in that the barrier plate has or is connected with at least one temperature increasing unit to increase the temperature of the barrier plate, and the coating The substrate with photoresist is heated between the heating unit and the barrier plate. Therefore, when the photoresist-coated substrate is heated, the solvent gas' generated during contact with the temperature-increased barrier film can still maintain the decomposition or gas state without causing condensation to deposit on the barrier film. Therefore, almost all the gas generated during heating can be completely eliminated from the reaction chamber through the exhaust holes of the barrier plate, which can prevent the pollution source from being formed on the barrier plate due to condensation and deposition. Because the structure before the issue is novel, it can provide industrial use, and it does improve the efficacy, so it applies for an invention patent in accordance with the law. Read the note of S first and note the binding line. The paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 刈 1174 A7

五、發明說明(4) 乾裝置反應室之方法無限制,較佳為以滾輪或機械手臂將 基板輸送至該加熱單元。 為能讓貴審查委員能更瞭解本發明之技術内容,特 舉一較佳具體實施例說明如下。 請參照第2圖本發明實施例之示意圖,係一種適用於 加工塗佈光阻之基板4之光阻烘乾裝置,其中該塗佈光阻 之基板4為晶圓或平面顯示面板。該光阻烘乾裝置主要包 括有·一反應槽1 ’其内具有一由周壁圍繞之反應室, 光阻烘乾過程係於該反應槽丨内進行;該反應槽中並具有 一加熱單元2(於本實施例中為一加熱板),以加熱該塗 佈光阻之基板4 ;以及至少一與該反應室丨丨周壁連結之阻 隔板3 ’且該阻隔板3具有複數個排氣孔3丨以排除該反應 室11之氣體。其中該阻隔板3之内部具有或連接有至少一 增溫單元33,以增高該阻隔板3之溫度,且該塗佈光阻之 基板4係位於該加熱單元2 (於本實施例中為一加熱板)及 該阻隔板3間加熱。 經濟部智慧財產局I-工消費合作社印製 上述之增溫單元3 3於本實施例中係為使用一加熱線 i ’當然其亦可為一燃氣燃燒室,亦可使用熱交換器等任 何可提高溫度之裝置,且該增溫單元33係保持於分解或氣 化該光阻之溶劑之溫度範圍内,俾使該塗佈光阻之基板4 於加熱時所產生之溶劑氣體,經由抽氣單元32運作,自排 氣孔3排除適程中接觸到該具增溫單元33之阻隔板3時, 仍可維持氣體或分解之狀態,不致凝結沈積於該阻隔板3 上’故所有加熱時產生之氣體,可完全經由連結該阻隔板 本紙樹中關家標準(CNS)A4規格⑽x297 501174 A7 五、發明說明(f ) 3之排氣孔31之抽氣單元32自反應室11中排除,確可使談 阻隔板3上不致形成凝結沈積之粒子污染源,污染加工 (烘乾)中之基板。 本發明之光阻烘乾裝置,因為於阻隔板内部或外部增 加了一增溫單元,以於基板進入反應室中作業時,保持溫 度於溶劑或其他污染源分子氣化或分解之溫度(但不破壞 光阻特性之溫度),使溶劑或其他污染源分子不會凝結沈 積於該阻隔板之表面,而得以順利抽走溶劑或其他污染源 分子’提高廢氣之抽氣率並降低污染基板之溶劑或其他污 染源分子掉落於基板之機率,大大提高基板生產之良率, 具新穎性及進步性。 綜上所陳,本發明無論就目的、手段及功效,在在均 顯示其迥異於習知技術之特徵,為「光阻烘乾裝置」之一 大火破’懇請鈞局明察,早日賜准專利,俾嘉惠社會, 貫感德便。惟應注意的是,上述諸多實施例僅係為了便於 說明而舉例而已,本發明所主張之權利範圍自應以申請專 利範圍所述為準,而非僅限於上述實施例。 閱 η 背 面 項 頁 裝 涵尺度適用中 ^297 )V. Description of the invention (4) There is no limitation on the method of the reaction chamber of the dry device, and it is preferable to convey the substrate to the heating unit by a roller or a robot arm. In order to make your reviewing committee better understand the technical content of the present invention, a preferred embodiment is described below. Please refer to FIG. 2 for a schematic diagram of an embodiment of the present invention, which is a photoresist drying device suitable for processing a photoresist-coated substrate 4, wherein the photoresist-coated substrate 4 is a wafer or a flat display panel. The photoresist drying device mainly includes a reaction tank 1 'which has a reaction chamber surrounded by a peripheral wall. The photoresist drying process is performed in the reaction tank; the reaction tank has a heating unit 2 (A heating plate in this embodiment) to heat the photoresist-coated substrate 4; and at least one barrier plate 3 'connected to the peripheral wall of the reaction chamber, and the barrier plate 3 has a plurality of exhaust holes 3 to remove the gas from the reaction chamber 11. The barrier plate 3 has or is connected to at least one temperature increasing unit 33 inside to increase the temperature of the barrier plate 3, and the photoresist-coated substrate 4 is located in the heating unit 2 (in this embodiment, it is a Heating plate) and the barrier plate 3 are heated. The above-mentioned warming unit 3 3 is printed by the I-Industrial and Consumer Cooperative of the Ministry of Economic Affairs. In this embodiment, a heating wire i is used. Of course, it can also be a gas combustion chamber, and a heat exchanger can also be used. Any device that can increase the temperature, and the temperature increasing unit 33 is maintained within the temperature range of the solvent that decomposes or vaporizes the photoresist, so that the solvent gas generated when the photoresist-coated substrate 4 is heated, passes through The air extraction unit 32 operates, and when the barrier plate 3 with the temperature increasing unit 33 is contacted during the exhaustion from the exhaust hole 3, the gas or decomposed state can still be maintained, so that no condensation is deposited on the barrier plate 3, so all The gas generated during heating can be completely passed from the reaction chamber 11 through the exhaust unit 31 of the exhaust hole 31 of the invention description (f) 3 through the House Standard (CNS) A4 specification of the paper tree connected to the barrier plate (x297 501174 A7). Exclusion can surely prevent the particle pollution source on the barrier plate 3 from forming condensed deposits, and contaminate the substrate during processing (drying). In the photoresist drying device of the present invention, a temperature increasing unit is added inside or outside the barrier plate to maintain the temperature at the temperature at which the solvent or other pollution source molecules vaporize or decompose when the substrate enters the reaction chamber for operation (but not The temperature that destroys the photoresistance characteristics), so that the solvent or other pollution source molecules will not condense and deposit on the surface of the barrier plate, and the solvent or other pollution source molecules can be pumped off smoothly. The probability of pollution source molecules falling on the substrate greatly improves the yield of substrate production, which is novel and progressive. In summary, the present invention, regardless of its purpose, means and efficacy, shows its characteristics that are quite different from the conventional technology. It is a fire of one of the "photoresist drying devices". , Jia Jiahui society, consistent sense of virtue. It should be noted that the above-mentioned embodiments are merely examples for the convenience of description, and the scope of the rights claimed in the present invention should be based on the scope of the patent application, rather than being limited to the above-mentioned embodiments. (See the back of the η item page.

Claims (1)

中請專利範圍 一種光阻烘乾裝置,係配合加工塗佈光阻之基板,包 含: 一反應槽,該反應槽具有一由周壁圍繞之反應室; 一加熱單元,以加熱該塗佈光阻之基板; 至少一阻隔板,該阻隔板係與該反應室之周壁連結, 且具有複數個排氣孔以排除該反應室之氣體; 其中該阻隔板具有或連接有至少一增溫單元以增高該 阻隔板之溫度,且該塗佈光阻之基板係於該加熱單元 及該阻隔板間加熱。 如申請專利範圍第1項所述之光阻烘乾裝置,其中該 增溫單元為一加熱線圈。 如申請專利範圍第1項所述之光阻烘乾裝置,其中該 增溫單元為一燃氣燃燒室。 如申請專利範圍第1項所述之光阻烘乾裝置,其中該 增溫單元係保持阻隔板於分解或氣化該光阻之溶劑之 溫度範圍。 如申請專利範圍第1項所述之光阻烘乾裝置,其中該 加熱早7〇為"-加熱板。 如申請專利範圍第1項所述之光阻烘乾裝置,其中該 增溫單元係位於該阻隔板之内部。 如申請專利範圍第1項所述之光阻烘乾裝置,其更包 含一抽氣單元連接該阻隔板之排氣孔,以排出該反應 室之氣體。 501174 A8 B8 C8 D8 六、申請專利範圍 8. 如申請專利範圍第1項所述之光阻烘乾裝置,其中該 基板為晶圓或平面顯示面板。 (請先閱讀背面之注意事項再0 本頁) 裝 -丨線· 經濟部智慧財產局I-工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 2971公釐)The patent claims a photoresist drying device for processing and coating a photoresist substrate, including: a reaction tank having a reaction chamber surrounded by a peripheral wall; a heating unit to heat the coating photoresist A base plate; at least one barrier plate, which is connected to the peripheral wall of the reaction chamber, and has a plurality of exhaust holes to exclude the gas of the reaction chamber; wherein the barrier plate has or is connected with at least one temperature increasing unit to increase the temperature The temperature of the barrier film, and the photoresist-coated substrate is heated between the heating unit and the barrier film. The photoresist drying device according to item 1 of the patent application scope, wherein the temperature increasing unit is a heating coil. The photoresist drying device according to item 1 of the patent application scope, wherein the temperature increasing unit is a gas combustion chamber. The photoresist drying device according to item 1 of the scope of the patent application, wherein the temperature increasing unit maintains the barrier plate at a temperature range in which the photoresist is decomposed or vaporized. The photoresist drying device as described in item 1 of the scope of the patent application, wherein the heating is as early as 70% " -heating plate. The photoresist drying device according to item 1 of the patent application scope, wherein the temperature increasing unit is located inside the barrier plate. The photoresist drying device described in item 1 of the scope of the patent application, further includes an exhaust unit connected to the exhaust hole of the barrier plate to exhaust the gas from the reaction chamber. 501174 A8 B8 C8 D8 6. Scope of patent application 8. The photoresist drying device described in item 1 of the scope of patent application, wherein the substrate is a wafer or a flat display panel. (Please read the precautions on the back first, then this page.) Assembling-丨 Line · Printed by I-Industrial Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210 X 2971 mm)
TW90121705A 2001-08-31 2001-08-31 Photoresist baking device TW501174B (en)

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