TW500979B - Photoresist compositions with cyclic olefin polymers and additives, patterned photoresist structure, and the method of forming the same - Google Patents

Photoresist compositions with cyclic olefin polymers and additives, patterned photoresist structure, and the method of forming the same Download PDF

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TW500979B
TW500979B TW089104172A TW89104172A TW500979B TW 500979 B TW500979 B TW 500979B TW 089104172 A TW089104172 A TW 089104172A TW 89104172 A TW89104172 A TW 89104172A TW 500979 B TW500979 B TW 500979B
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TW089104172A
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Pushkara Rao Varanasi
Joseph F Maniscalco
Margaret C Lawson
Ann Marie Mewherter
Mahmoud M Khojasteh
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Ibm
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists

Abstract

Acid-catalyzed positive photoresist compositions which are imageable with 193nm radiation and are developable to form photoresist structures of high resolution and high etch resistance are enabled by the use of a combination of cyclic olefin polymer, photosensitive acid generator and of a saturated steroid component, a hydrophobic non-steroidal alicyclic component, a hydrophobic non-steroidal multi-a licyclic component containing plural acid labile linking groups, or a bulky hydrophobic additive which is substantially transparent to 193 nm radiation. The cyclic olefin polymers contain (i) cyclic olefin units having polar functional moieties, and (ii) cyclic olefin units having acid labile moieties that inhibit solubility in aqueous alkaline solutions.

Description

^00979 五、發明說明(i) 發明背景 在微電子工举^ 磁阻頭)之工業中其古他包括建造顯微結構(如微機械、 微電子工業中㈣:直希望降低結構部份的尺寸。在此 定晶片尺寸更多:電:低微電子元件之尺寸和/或提供特 和=ϊ丄:::J力是受光石印技術確實解析較小部份 度的能力部^=。透鏡的|質是使獲冑更精細之解析 長所限制。因::於製造石印圖案之光線(或輻射)的波 序的趨勢。最、义去一直有將較短光波長用於光石印程 米)移至248毫仿半f趨勢已從所謂的卜線輻射( 350毫微 毛儆水輻射。 ‘ 為了夫炎P 2 求。不幸地,二降低,產生使用193毫微米輻射的需 物一般不適入用I毫微米光石印程序的主要光阻組合 當光阻组::,波長。 長下使其具有影後f具有理想的透鏡特徵以在所需輻射波 合的化學和機^ 析旎力時,光阻組合物也必須具有適 層:光像後)必須足以防止圖==下_ 完成。®幸彳卜^ it #可藉些屋化學蝕刻或離子蝕刻形態 成圖案化先阻層抵抗圖案轉移餘刻程序(如光阻層的 面基材層上„其可從圖案化光阻將影像轉移至下 應答(即選擇性h a,路出圖案的正面光阻必須能適當溶解 水性驗顯/Λ1份)以產生所需光阻結構。使用 普遍使用ίSii印術所提供的廣泛經驗對於在此種^ 00979 V. Description of the invention (i) Background of the invention In the microelectronics industry ^ magnetoresistive head industry, other ancient industries include the construction of microstructures (such as micromechanics, microelectronics industry): I hope to reduce the structural part of the Size. Here we set the wafer size more: electrical: the size of the microelectronic components and / or provide special sum = ϊ 丄 ::: J force is the ability of the light receiving lithography technology to really resolve smaller parts ^ =. | Quality is limited by the finer resolution of the gain. Because: The tendency of the wave order of the light (or radiation) in the manufacture of lithographic patterns. Most recently, there has been a use of shorter light wavelengths for light lithographic meters.) The trend of moving to 248 nanoimitations has shifted from the so-called Bu-line radiation (350 nano-capillary water radiation. 'For husband inflammation P 2 requirements. Unfortunately, the two lowered, generating demand using 193 nm radiation is generally not suitable The main photoresist combination of the 1nm photolithography program is used when the photoresist group is ::, wavelength. When it is made long, it has the ideal lens characteristics after the shadow f to achieve the chemical and mechanical analysis of the desired radiation combination. , The photoresist composition must also have a suitable layer: after the light image ) Must be sufficient to prevent the graph == under_ from completing. ® 幸 彳 卜 ^ it #It can be patterned by chemical etching or ion etching to form a patterned first resist layer to resist the pattern transfer remaining process (such as the photoresist layer on the surface substrate layer. It can be imaged from the patterned photoresist Transfer to the lower response (that is, selective ha, the front photoresist of the exit pattern must be able to dissolve the aqueous test / Λ1 part appropriately) to produce the desired photoresist structure. Using the extensive experience provided by the universal use of Sii printing, here Species

第7頁 500979 五、發明說明(2) #刻抵抗力)的能力是一種重要的光阻特徵。 士當一些光阻組合物已被設計成配合193毫微米輻射使 Ϊ 2 7 ί —個或多個上述部份中缺乏成效,®此這些組 .物-般無法表現出較短波長成像之真實解析度的優勢、、。 =二:光:且組合物具有較佳顯像能力和蝕刻抵抗力時, 顯: 波長之輕射(如193毫微米紫外輻射)使其 發明概述 -$: ί 1共具有尚解析石印成效能Λ,特別是利用193 力、顯像能力和钱刻抵抗力以提供具極高:: :之=轉移,因為其解析度只受成像輻射的波長所限 4 4明光阻組合物的特徵一般在於(a)環烯類聚合物 飽和類固醇成份、含有多個酸不安定連接基之疏水 固醇多脂環成份("HNMp”)或疏水性非類固醇脂環成 t的存在,或其特徵在於包含酸_不安定官能度和酸性極 :S能度組合物之環烯類聚合物的存在,其最好另外以巨 水性添加物的存在為特徵,其中該添加物在193毫微 米輻射下實質上是透明的^ 本發明也提供利用本發明光阻組合物創造光阻結構之光 =印方法和利用該光阻結構以轉移圖案至下層的方法。本 *石印方法的特徵最好在於利用丨9 3毫微米紫外輻射使圖 -、頌路。本發明方法最好不使用相偏移面具即可解析尺寸 ’、於約150毫微米,較佳為尺寸小於約115毫微米(利用Page 7 500979 V. Description of the invention (2) # The ability to engraved resistance is an important photoresistance feature. Some of the photoresist compositions have been designed to work with 193 nm radiation to make Ϊ 2 7 多个 one or more of the above parts ineffective. These groups of objects cannot generally show the trueness of shorter wavelength imaging. The advantages of resolution. = 2: Light: When the composition has better imaging ability and etching resistance, the light of the wavelength (such as 193 nm ultraviolet radiation) makes its invention summary-$: ί 1 has the performance of analytic lithography Λ, especially the use of 193 force, imaging ability and money resistance to provide extremely high ::: = transfer, because its resolution is limited only by the wavelength of the imaging radiation 4 4 The characteristics of bright photoresist compositions are generally (A) the presence of saturated steroid components of cycloolefin polymers, hydrophobic sterol polyalicyclic components (" HNMp ") or hydrophobic non-steroidal alicyclic rings containing t The presence of a cycloolefin polymer containing an acid-stabilizing functionality and an acid polar: S-energy composition, which is preferably additionally characterized by the presence of a super-aqueous additive, wherein the additive is substantially irradiated by 193 nm The above is transparent ^ The present invention also provides a photo-printing method using the photoresist composition of the present invention to create a photoresist structure and a method using the photoresist structure to transfer a pattern to the lower layer. The feature of this * lithography method is best to use 丨9 3 nm UV Radiation makes the map-and ode. The method of the present invention can resolve the size without using a phase shift mask. It is about 150 nm, preferably less than about 115 nm (using

五、發明說明¢3) 0.68數字型孔透鏡)部份。 在-特點上本::月包括—種光阻組合物,其包含:. (a) —種環烯類聚合物,其包含: υ 具有極性官能基部份的環稀單位,和 π) μ酸不*定部份之環婦單位,該酸不*定部份可 抑制在鹼性水溶液中之溶解度, (b) —種光活化成份,和 (:)J飽t;固醇成份、疏水性非類固醇脂環成份或含 (,,讀"^不女疋連接基之疏水性非類固醇多脂環成份 類ΐ 組最好是由環稀 ⑴所構成的。單位。最好二'們^上夕單位i)和 _ ’瑕好包含pKa $ 1 3之酸性極性部份。 ϊ:Ϊί 最:=t性的。較佳的飽和類固醇是經改 貝山的石Λ酸知4水性非類固醇脂環成份最好包含⑴ =數更南的脂環部份。HNMp最好至少包含兩個以或碳 f的脂環部#。瞻成份的酸離開最好造成具有多個酸性 =官能基和/或多個各具有至少一個酸性極性基夕:化酸合陸 物形成。 α 含在另一個特點上,本發明包含一種光阻組合物,其包 (a) —種環烯類聚合物 )U〇979 五、發明說明(4) ii)具有酸不安定部份的環埽單位,該酸不安定部份可 抑制在鹼性水溶液中之溶解度, (b) —種光活化成份,和 (c ) 一種巨大疏水性的添加物,該添加物在1 93毫微米紫 外輻射下實質上是透明的。 ⑽在此特點上,本發明環烯類聚合物包含約5至4〇莫耳%之 ,位1 )。本發明環烯類聚合物基本上最妤是由環烯類單 早位所組成的;較佳為他們基本上是由單位^和“) 成的。該巨大疏水性的添加物最好包含一個脂環部份。霉 在另一個特點上,本發明包含一 光阻結構的方法,該方法包括: 表埏圖案化 (a) —種具有本發明光阻組合物之表面 (b) 圖案般暴露光阻層 妁基材, 輜射下,以及 層於释射下,因此部份光阻層暴露在 (C)以一種難顯像劑溶液接觸該光 暴露的部份以創造圖案化光阻結構。 除且層所 在上法中步驟(hi齡m )所用的輻射線最好是193薹嫩ί 射。 疋氅微米紫外輻 本發明也包括利用 田 製造導電、半導電、明組合物之圖索化光阻 本發明的這些和 〖生或浥緣結構的方法。 …構 描ij ,、他特點將進一步詳細討綸於下。 本發明光阻組合物一 ' 合物包含n具有•性 草位,其中該5. Description of the invention ¢ 3) 0.68 digital aperture lens). In terms of features :: month includes: a photoresist composition, which includes: (a)-a cycloolefin polymer, which includes: υ ring dilute unit with a polar functional group portion, and π) μ The ring-shaped unit of the acidic indeterminate part, the acid indeterminate part can inhibit the solubility in alkaline aqueous solution, (b) — a kind of photoactive ingredient, and (:) J saturated t; sterol ingredient, hydrophobic Non-steroidal alicyclic ingredients or (,, read " ^ Non-Women's linker hydrophobic non-steroidal multi-alicyclic ingredients class ΐ group is preferably composed of cyclic dilute hydrazones. Units. Best two'men ^ The units on the eve of i) and _ 'blemishes contain the acidic polar portion of pKa $ 1 3. ϊ: Ϊί Most: = t sexual. The preferred saturated steroids are modified by Shishan acid of Beishan, and the water-based non-steroidal alicyclic component preferably contains ⑴ = a few more alicyclic parts. HNMp preferably contains at least two alicyclic moieties # or carbon f. The acid leaving of the ingredients is preferably caused to have a plurality of acidic = functional groups and / or a plurality of each having at least one acidic polar group: the formation of acidic compounds. α is contained in another feature. The present invention includes a photoresist composition comprising (a) a cycloolefin polymer) U〇979 5. Description of the invention (4) ii) a ring having an acid-labile portion A unit of thallium, the acid-labile part can inhibit the solubility in alkaline aqueous solution, (b) a photoactive component, and (c) a huge hydrophobic additive, the additive is irradiated at 1 93 nm The bottom is essentially transparent. ⑽ In this feature, the cycloolefin-based polymer of the present invention contains about 5 to 40 mol%, bit 1). The cycloolefin-based polymers of the present invention are basically composed of cycloolefin-based single sites; preferably, they are basically composed of units ^ and "). The huge hydrophobic additive preferably contains a The alicyclic part. In another feature, the present invention includes a method of photoresist structure, the method includes: Table 埏 patterning (a)-a surface with a photoresist composition of the present invention (b) pattern-like exposure The photoresist layer is a base material, a photoresist layer, and a layer under emission, so part of the photoresist layer is exposed to (C) a light-resistant developer solution contacting the light-exposed portion to create a patterned photoresist structure In addition, the radiation used in the step (hi age m) of the above method is preferably 193 nm. 疋 氅 micron ultraviolet radiation. The present invention also includes the use of fields to make conductive, semi-conductive, bright compositions. The photoresist method of the present invention and the method of generating or forming a marginal structure .... The structure ij is described in detail, and its characteristics will be discussed in further detail below. The photoresist composition of the present invention includes a n-position. , Where the

第10頁 500979 五、發明說明(5) 溶液令之溶解度,和“)具有酸不安 iid:位,其令該酸不安定部份可抑制在驗性水 %之環烯單位υ。該叙合物另外以存在一種巨大=生莫耳 力二:特徵’其中該添加物在193毫微米輻射下實質上i ,:;cb)---- 含有多個酸不安定連接/之Λ1Λ 醇脂環成份或 存在。兮璟嫌龆取人& 土1l水性非類固醇多脂環成份的 j n?烯類t合物最好包含i)具有酸性極性官能美邻Page 10, 500979 V. Explanation of the invention (5) The solubility of the solution and ") have acid-unstable iid: position, which makes the acid-unstable portion can be inhibited in the cycloolefin unit υ% of the test water. In addition, there is a kind of huge = Sheng Mo Er Li II: feature 'where the additive is substantially i under 193 nm radiation :; cb) ---- Λ1Λ alicyclic component containing multiple acid labile links / Or exist. Xi 璟 suspected of taking people & soil 1 l water-based non-steroidal polyalicyclic components jn? Ene t compounds preferably contain i) have acidic polar functional beauty

份的環烯單位,和i n且古缺π A A A f丨王S犯暴口P 中兮萨X — ),、有酸不女疋部份之環烯單位,立 令f酸不女疋部份可抑制在鹼性水溶液t之溶解声。八Part of the cycloolefin unit, and in the ancient and lacking π AAA f 丨 Wang S guilty of violence P in the mouth X X —), a cycloolefin unit with acid and no son-in-law part, order f acid not son-in-law part It can suppress the dissolving sound in alkaline aqueous solution t. Eight

=些本發明組合物特別可利用丨93毫 X 顯像能力和圖案轉移特徵提供高解析度之光石印圖良/的 本發月另外包括含有本發明光阻組 =創造光阻結構並利用此光阻結 :先:: 電和/或絕緣結構的方法。 /風等電、丰導 本發明光阻組合物一般包含: U) —種環烯類聚合物,其包含: 总1i具^極性官能基部份的環烯單位,置中嗲極ht卹A 係選自可幫助在鹼性太i潘φ夕为妨* 八甲省極性部份 性極性部份,和 各又的酸性部份和非酸_ 11)具有酸不安定部份的環烯 抑制在鹼性水溶液中之溶解度, ^酸不女疋部份可 第11頁 500979 五、發明說明(6) (b ) —種先活化成份,和 (c) 種飽和類固醇成份、疏水性非類固醇脂環成份.、含_ 有多個酸不安定連接基之疏水性非類固醇多脂環成份或一 種巨大疏水性的添加物,該添加物在丨9 3毫微米輻射下實 質上是透明的。 環烯單位i)可為任何具有酸性極性官能基之環烯類單體 單位,其中該酸性極性官能基促進鹼溶解度或具有非酸性 極性基之環烯類單體單位。環烯類單體實例包括下列以結 構(ί)所表示之單體,其中匕代表一種(酸)極性部份和^是 零或某正整數: (1)· Μ 環烯單位i )較隹係選自: a)= Some of the compositions of the present invention can be particularly utilized 丨 93 milliseconds of imaging capabilities and pattern transfer characteristics to provide high-resolution light lithography / this hair month also includes the photoresist group containing the present invention = create a photoresist structure and use this Photoresistance Junction: First: Method of Electrical and / or Insulating Structure. / Wind power and photoconductor The photoresist composition of the present invention generally includes: U) a kind of cycloolefin polymer, which comprises: a total of 1i cycloolefin units with a polar functional group moiety, centered 嗲 shirt A; It is selected from the group that can help in the alkaline phase. It is possible to prevent the polar part, the polar part, and the acidic part and the non-acid part in Hakkei. Solubility in alkaline aqueous solution, the acid and non-sex part can be found on page 500500979. V. Description of the invention (6) (b)-a kind of pre-activated ingredient, and (c) a kind of saturated steroid ingredient, hydrophobic non-steroidal lipid Ring components. Hydrophobic non-steroidal alicyclic components containing multiple acid-labile linking groups or a huge hydrophobic additive, the additive is substantially transparent under 9 nm radiation. The cycloolefin unit i) may be any cycloolefin-based monomer unit having an acidic polar functional group, wherein the acidic polar functional group promotes alkali solubility or a cycloolefin-based monomer unit having a non-acidic polar group. Examples of cycloolefin monomers include the following monomers represented by the structure (ί), where d represents a (acid) polar moiety and ^ is zero or a positive integer: (1) · M cycloolefin unit i) Is selected from: a)

(Π) 其中R!代表一種可幫助在鹼性水溶液中之溶解度的酸性極 性部份或非酸性極性部份。該酸性極性部份的pKa最好是(Π) where R! Represents an acidic polar part or a non-acidic polar part which can help the solubility in an alkaline aqueous solution. The pKa of the acidic polar part is preferably

第12頁 500979 五、發明說明(7) 約1 3或更低。較佳的酸性極性部份包括選自包含綾基、# 磺醯基、氟醇和其他酸性極性基之極性基。二, 刀疋竣基。非酸性極性部份最好具有队>13 y -個雜原子如氧、氮或硫。若有必要,可使用 t ?性官能基之環烯單位i)組合。最好至少—些或ς 二 單位i )具有酸性極性官能度。 有展烯 環烯單位ii)可為任何且古 〜 显栉,兮祕T〜 /、有酸不女疋部份的環烯類單艚 早位,該酸不安定部份可抑 邱頸早肢 環烯類單體實例包括下列J f鹼性水溶液中之溶解度。 μ代表一種保護酸-不i =構(ΠΙ)所表*之單體,其 疋一份和η是零或某正整數:Page 12 500979 V. Description of the invention (7) About 13 or less. Preferred acidic polar moieties include polar groups selected from the group consisting of fluorenyl, #sulfofluorenyl, fluoroalcohol, and other acidic polar groups. Second, the sword is finished. The non-acidic polar part preferably has a team > 13 y-heteroatoms such as oxygen, nitrogen or sulfur. If necessary, a combination of cycloolefin units i) with t-functional groups can be used. Preferably at least some or two units i) have an acidic polar functionality. Acene cycloene units ii) can be any and ancient ~ significant, T ~ /, cycloenes with acid-free female sex part of the early position, the acid-labile part can suppress Qiu neck early Examples of acrocyclene-based monomers include the following solubility in a basic aqueous solution of Jf. μ represents a monomer of the protective acid-not i = conformation (III), where 其 and η are zero or a positive integer:

Ra (HI). η 環烯單位i i)較佳係選Ra (HI). Η cycloolefin unit i i) is preferably selected

其中h代表一種保護酸〜不I & 定部份是選自包含三級烷其Γ火部份。較佳的保護酸-不安 基、甲基環戊基、甲基、二(/環院基)叛基醋(如第三-丁 |己基、甲基、金剛烷基)、酯 500979 五、發明說明(8) 〜—---------—^一^ 縮酮二:ί :基羧基醋是—種最佳的保護酸-不安定部 .^组右合最好Λ使用Λ有不同保護官能基之環稀單位 1官能度。 y t或所有裱烯單位〇具有酸性極性 =積=路結構和其他顯微結構的製造中所用的光石 :,:,本:明環稀類聚合物最好包含約5,莫 羧酸官能化單位所組成之處,本發明環烯類聚2物最好勺 含約5-30莫耳%,較佳係約1〇_25莫 耳。則婦單位U。在環締單位= = = 單位所組成之處,本發明環稀類聚合物較佳係包夂含目約月匕化 10-80莫耳%,最佳係約20 — 40莫耳%、 ' % ~滷聚σ物取好至少包含約2〇莫耳%之環 佳係約40-90莫耳%,若羧酸被用作酸性基,則最佳1 乂 80-90莫耳%,或若使用酸性官能化單位,則最的 6 0-8 0莫耳%。本發明環烯類聚合物除了單位丨 〇含其他單體單位。本發明環烯類聚合物最好包含可^> /〇或更祗此類其他單體單位,較佳係約2〇 _ 莫耳 發明環㈣聚合物基本上是由環烯單低/本 本發明光阻組合物另外以一種飽和類固醇 q 存在為特徵。該ss成份一般可使和/或可提高 77的 給糾?κ Μ 八N W 貝用水性 SS成;f劑;產生的應答中解析極細石印部份的能力。該 特飽和:固醇(C17)脂環骨架結構為 該飽和類固酵成份可包含一種具有多個餘和類 500979 、發明說明(9)Wherein h represents a protective acid ~ I & the fixed part is selected from the Γ fire part containing tertiary alkane. Better protected acid-unstable, methylcyclopentyl, methyl, di (/ cycloalkyl) acetic acid (such as tert-butyl | hexyl, methyl, adamantyl), ester 500979 V. Invention Explanation (8) ~ —---------— ^ a ^ ketal two: ί: carboxylic acid vinegar is the best protective acid-unstable part. ^ Group right combination is best Λ use Λ Cyclo-diluted units with different protective functionalities 1 functionality. yt or all mountene units 0 has acidic polarity = product = road structure and other microstructures used in the manufacture of light stone:,:, this: bright ring dilute polymers preferably contain about 5, mocarboxylic acid functional units Where it is composed, the cyclic olefin polymer 2 of the present invention preferably contains about 5-30 mole%, preferably about 10-25 mole. The women's unit U. Where the cyclic unit = = = unit is composed, the cyclic dilute polymer of the present invention preferably contains 10-80 mol%, and most preferably about 20-40 mol%. % ~ Halopoly sigma is preferably at least about 20-90 mol%, and Ringer is about 40-90 mol%. If carboxylic acid is used as an acidic group, it is preferably 1 乂 80-90 mol%, or If acid functionalized units are used, the most 60 to 80 mole%. The cycloolefin-based polymer of the present invention contains other monomer units in addition to units. The cycloolefin polymer of the present invention preferably contains other monomer units such as ^ > / 〇 or 祗, preferably about 20 mol. The cyclic cyclic polymer of the present invention is basically The inventive photoresist composition is additionally characterized by the presence of a saturated steroid q. The ss component can generally increase and / or increase the correction of 77? κ M Eight N W shellfish with aqueous SS; f agent; ability to resolve extremely fine lithographs in response. The special saturation: sterol (C17) alicyclic skeleton structure is: The saturated steric enzyme component may contain a kind of residues with multiple residues 500979, invention description (9)

中所產生的酸有反應之部份,因: 種之後可促進驗溶驗度的分子) 份,因 固醇或三-類固醇)。該ss成份最好 包含酸不安定部份(如對光石印程序 之部份,因此該部份經過裂解以提供 驗度的分子)之側基。較佳的SS成份 y包含額外側基如選自包含甲醯基、羥基或三氟乙醯基之 部份。若此酸不安定部份側基是存在的,其可被一個或多 個間隔基所分離’如下列結構S L - 1和S L - 2所示。一般而 言,以更具疏水性的SS成份為佳。若有必要,可使用SS成 份的組合物。 較佳的SS成份實例包栝膽酸酯類(如第三-丁基石膽酸 酯、第三-丁基去氧基膽酸酯、第三-丁基膽酸酯)、經酯 改質之石膽酸酯(如第三-丁基—3-三氟乙醯基石膽酸酯、 第三-丁基-3-乙醯基石膽酸酯、第三-丁基-3-特戊醯基石 膽酸酯)、經酯改質之膽酸酯(如第三-丁基-3, 7, 12-三甲 醯基膽酸酯、第三-丁基一參—(3, 7,12 -三氟乙醯基)膽酸 酯)和被隔開之石膽酸酯如下列結構SL-1和SL-2。The acid produced in the reaction part, because: after the species can promote the solubility test molecules, sterols or tri-steroids). The SS component preferably contains pendant groups of acid-labile parts (such as the part of the photolithography process, so the part is lysed to provide the molecule for verification). The preferred SS component y contains additional pendant groups such as those selected from the group consisting of formamyl, hydroxyl, or trifluoroacetamidine. If this acid-labile moiety is present, it can be separated by one or more spacers' as shown in the following structures SL-1 and SL-2. Generally speaking, the more hydrophobic SS component is preferred. If necessary, a composition containing SS ingredients may be used. Examples of preferred SS ingredients include cholic acid esters (such as tertiary-butyllithocholic acid ester, tertiary-butyl deoxycholate, tertiary-butyl cholate), ester modified Lithocholic acid esters (such as tert-butyl-3-trifluoroethylfluorenyllithocholic acid, tertiary-butyl-3-ethynylphosphocholic acid ester, tertiary-butyl-3-tetramethylenefluorite) Cholic acid esters), ester modified cholic acid esters (such as tertiary-butyl-3, 7, 12-trimethylamidinocholate, tertiary-butyl ginseng— (3, 7,12-tris) Fluoroacetamyl) cholic acid ester) and separated lithocholic acid esters have the following structures SL-1 and SL-2.

500979500979

❿ ,、中tBu疋種三級丁基。一種最佳的SS成份是第丁其 -3-三氟乙醯基石缺土 疋乐一丁基 您石膽酸酯。 ^ /v " ^ 1旦合物另外以疏水性非類固醇脂環(丨丨HNA"、❿, and tBu 疋 tertiary butyl. One of the best SS ingredients is Dibuthi-3-trifluoroacetamidite-depleted urethane monobutyl your stone cholate. ^ / v " ^ 1 denier compound additionally with a hydrophobic non-steroidal alicyclic ring (丨 丨 HNA ",

,的存*為特後。該HNA成份一般可和/ 解HNA 〜 h 貝用水性鹼顯像劑產生反應的能力。該HNA忐 份以非類固醇脂戸沾磁,w 邊HNA成 縮合環結構4# 種不包含類固醇化合物之Cn "h \ 、)的存在為特徵。該脂環結構最好包含至 個碳原子。整二A 1 °…,最佳係約1 "ο 較佳係約1 4-50個碳原子。〜2包含至少約1 4個碳原子’ 包含超過一個脂環部份。/有必要,本發明ΗΝΑ添加劑可 處,他們最好以一個酸不ΐ組合物包含兩個環脂部份脂-脂環化合物實例表示於下H連接基分離之。—種此類多, The deposit * is special. The HNA component can generally reconcile / dissolve HNA ~ h with the ability to react with an aqueous alkali imaging agent. The HNA component is characterized by the presence of non-steroidal lipids, and the presence of 4 # condensed ring structures of HNA on the w side. Cn " h \), which does not contain steroids. The alicyclic structure preferably contains up to carbon atoms. The whole two A 1 ° ..., the best is about 1 " ο more preferably about 1 4-50 carbon atoms. ~ 2 contains at least about 14 carbon atoms' and contains more than one alicyclic moiety. / It is necessary that the ΗNA additives of the present invention are suitable. They are preferably separated from the lower H linking group by an example of an alicyclic compound comprising two alicyclic moieties. — So many

第16頁 500979Page 500 500979

五、發明說明(π)V. Description of the invention (π)

該ΗΝΑ最好包含一個或多個侧基酸不安定部份(即一個對 石印程序所產生的酸有反應的部份,因此該部份經由裂解 以提供之後作為促進鹼溶解度的分子)。較佳的酸不安定 部份是選自包含三級烷基(或環烷基)羧基酯(如第三一丁 基、甲基環戊基、甲基環己基、甲基金剛烷基)、酯縮綱 和酯乙縮醛。第三-丁基羧基酯是一種較佳的酸不安定侧 基。HNA成份也可依提高光阻組合物成效之方式包含 加分子體積和/或增加分子疏水性的側基。若有必要’該y 側邊酸不安定部份可以一個或多個間隔基與脂環基部份分 離。若有必要,可使用HNA成份組合物。 你 較佳的HNA成份實例包括金剛烷和較高碳數之熔凝脂壞 環系統的羧基酯。一種最佳HNA成份是金剛烷第三-丁基象 酸酯。The ΗΝΑ preferably contains one or more pendant acid labile moieties (ie, a moiety that reacts with the acid produced by the lithographic process, so this moiety is cleaved to provide molecules that promote alkali solubility). The preferred acid labile moiety is selected from the group consisting of tertiary alkyl (or cycloalkyl) carboxylates (such as tertiary butyl, methylcyclopentyl, methylcyclohexyl, methyladamantyl), Ester acetals and ester acetals. Tertiary-butyl carboxylate is a preferred acid labile pendant group. The HNA component may also include pendant groups that increase molecular volume and / or increase molecular hydrophobicity in a manner that enhances the effectiveness of the photoresist composition. If necessary, the y-side acid labile moiety may be separated from one or more spacer groups from the alicyclic moiety. If necessary, HNA ingredient compositions can be used. Examples of your preferred HNA composition include adamantane and carboxylate esters of higher carbon fused alicyclic systems. An optimal HNA ingredient is adamantane tert-butyl elephantate.

以下列結構說明一些HNA成份實例:The following structure illustrates some examples of HNA components:

第17頁Page 17

500979500979

第18頁 500979Page 18 500979

本發明光阻紐合物另外以含有多個酸不安定連 水性非類固醇多脂環成份("ΗΝΜΡ”)的存在為特徵。 成份一般可和/或提高解析極細石印部份對慣用水性鹼顯 像劑產生反應的能力。該ΗΝΜΡ成份是以至少兩種不同的非 類固醇脂環結構(即不包含類固醇化合物之k縮合環結構 特徵)的存在為特徵。該脂環結構最好各包含至少7個碳原 子() ’較佳係約1 〇 — 3 0個石炭原子,包括側基。整個ηnMp 成份最好包含約2 0 - 6 0個碳原子。 該ΗNMP廣泛地涵蓋具有至少兩個酸不安定連接基和至少 兩個脂環部份使一個酸不安定連接基存在於至少兩個脂環 部份之間。 該ΗΝΜΡ化合物包含多個酸不安定連接部份和多個脂環部 份。可以下式表示一種此化合物之結構: (X)The photoresist button compound of the present invention is further characterized by the presence of multiple acid-labile and water-soluble non-steroidal polyalicyclic components (" " NMP "). The components can generally and / or improve the resolution of the ultra-fine lithographed part to the aqueous alkali The developer's ability to react. The ΗNMP component is characterized by the presence of at least two different non-steroidal alicyclic structures (ie, k-condensed ring structure features that do not include steroid compounds). The alicyclic structures preferably each include at least 7 carbon atoms () 'are preferably about 10-30 carbon atoms, including pendant groups. The entire ηnMp component preferably contains about 20-60 carbon atoms. The ΗNMP broadly encompasses at least two acids The labile linker and at least two alicyclic moieties allow an acid labile linker to exist between the at least two alicyclic moieties. The ΗNMP compound comprises a plurality of acid labile linkers and a plurality of alicyclic moieties. The structure of this compound can be represented by the following formula: (X)

R XR X

第19頁 500979 五、發明說明(14) R和X間的鍵是酸不安定的,使至少一個Xc-R1衍生物可藉酸 裂解R-X鍵而形戒,其中X。是一個延伸自R’之酸性極性側-基。η是至少為2。若R包含一個脂環部份,然後至少一個 R ’包含一個脂環部份。若R不包含一個脂環部份,然後至 少兩個R’基各包含一個脂環部份。其中X是一個羧酸基, 該結構為: (νι) ΟPage 19 500979 V. Description of the invention (14) The bond between R and X is acid labile, so that at least one Xc-R1 derivative can be formed by cleaving the R-X bond with an acid, in which X. Is an acidic polar side-group extending from R '. η is at least two. If R contains an alicyclic moiety, then at least one R ' contains an alicyclic moiety. If R does not contain an alicyclic moiety, then at least two R 'groups each contain an alicyclic moiety. Wherein X is a carboxylic acid group, the structure is: (νι) Ο

R—-Ο——C ——R1 L J η 其中R-Ο鍵是酸不安定的。裂解後,Γ侧邊將保留一個羧 酸基。其中η是2和R’包含金剛烷部份,結構可能是R—-O——C—R1 L J η where the R—O bond is acid labile. After cleavage, a carboxylic acid group will remain on the flanking side. Where η is 2 and R ’contains an adamantane moiety, the structure may be

其中R最好是酸不安定酯基如兩個第三-丁基酯基鍵結在一 起(在下列結構X I a中,1指酸不安定連接點的位置)或一些 其他酸不安定連接基之組合。裂解的結果使多個含有R’部Among them, R is preferably an acid-labile ester group such as two third-butyl ester groups bonded together (in the following structure XI a, 1 refers to the position of the acid-labile linker) or some other acid-labile linker Of combination. As a result of cleavage, multiple

第20頁 500979 五、發明說明(15) 份之化合物具有側邊羧酸基Page 20 500979 V. Description of the invention (15) parts of the compounds have side carboxylic acid groups

(Xla)(Xla)

或者,HNMP化合物可具有結構Alternatively, the HNMP compound may have a structure

R X1 R· (XII) 其中R’和X’間的鍵是酸不安定的使R-(Xe)n,衍生物可籍酸 裂解R’ -X’鍵而形成,其中Xc是一個延伸自R的酸性極性側 基。η’是至少為2。至少一個ΪΤ具有一個脂環部份而且至 少一個R或剩餘的R ’部份包含一個脂環部份。在任一例 中,裂解後的最後結果將創造出兩個各具有一個脂環部份 之較小分子並製造多個延伸自R的極性官能基。 其中X是一個叛基,該結構是: 0R X1 R · (XII) where the bond between R 'and X' is acid-labile so that R- (Xe) n, a derivative can be formed by cleaving the R'-X 'bond with an acid, where Xc is an extension from R is an acidic polar pendant group. η 'is at least two. At least one QT has an alicyclic moiety and at least one R or the remaining R 'moiety contains an alicyclic moiety. In either case, the final result after cleavage will create two smaller molecules each with an alicyclic moiety and make multiple polar functionalities extending from R. Where X is a traitor, the structure is: 0

RR

C Ο (XIII) ηC Ο (XIII) η

第21頁 500979500979 Page 21

第22頁 500979500979 Page 22

在本發明所用的HNMP化合物中,該酸不安定連接基最好 與光石印程序中所產生的酸反應,因此,該部份經由梦解 可提供分子或實質上降低分子量,然後促進光阻經輻^昭 射部份的鹼溶解度。最妤酸不安定連接部份包含至少_個' 選自包含三級烷基(或環烷基)羧基酯(如第三〜丁基、甲芙 環戊基、甲基環己基、甲基金剛烷基)、酯縮_和^旨^ 醛之部份。HNMP成份也可依提高光阻組合物成效之方式包 含可增加分子體積和/或增加分子疏水性的側基。若_ % 要,可使用HNMP成份組合物。In the HNMP compound used in the present invention, the acid-labile linker preferably reacts with the acid generated in the light lithography process. Therefore, this part can provide molecules or substantially reduce the molecular weight through dream interpretation, and then promote photoresistance. Alkali solubility of the radioactive part. The most unstable linker moiety contains at least _'s selected from the group consisting of tertiary alkyl (or cycloalkyl) carboxylates (such as tertiary butyl, methylcyclopentyl, methylcyclohexyl, methyladamantine Alkyl), esters, and aldehydes. The HNMP component may also include pendant groups that increase molecular volume and / or increase molecular hydrophobicity in a manner that enhances the effectiveness of the photoresist composition. If _% is desired, HNMP ingredient composition can be used.

較佳的HNMP成份實例包括金剛烷和較高碳數之炫凝脂 環系統的雙-羧基酯。一種最佳HNMP成份是雙〜金剛燒^ ^ - 丁基羧酸酯。 除了環脂類聚合物之外,本發明光阻組合物包含_個對 光敏感的酸產生劑(PAG)。本發明不限於使用任何特定Examples of preferred HNMP ingredients include adamantane and bis-carboxy esters of salicyclic systems of higher carbon numbers. One of the best HNMP ingredients is bis-adamantine ^^-butyl carboxylate. In addition to the cycloaliphatic polymer, the photoresist composition of the present invention contains a light-sensitive acid generator (PAG). The invention is not limited to the use of any particular

第23頁 500979 五、發明說明(18)P.23 500979 V. Description of the invention (18)

或P A G組合物’即本發明之益處可利用技術上所熟知之各 種對光敏感的酸產生劑而獲得。較佳的PAG是這些含有低 (或最好不含)芳基部份之PAG ^使用含有芳基之pAG處, PAG在1 93毫微米的吸收特徵可能限制調配物内所含的pAG 量。Or the P A G composition ', the benefits of the present invention, can be obtained by using various light-sensitive acid generators well known in the art. The preferred PAGs are those PAGs containing low (or preferably no) aryl moieties. Where pAG containing aryl groups is used, the absorption characteristics of PAG at 193 nm may limit the amount of pAG contained in the formulation.

適合對光敏感的酸產生劑實例包括(但最好以烷基取代 一個或多個任何指定芳基部份)鎗鹽如三芳基毓六氟銻酸 酯、二芳基碘鎗六氟銻酸酯、六氟坤酸酯、三flate、全 氟烷%酸酯(如全氟甲烷磺酸酯、全氟丁烷、全氟己烷磺 酸酯、全氟辛烷磺酸酯等),經取代的芳基磺酸酯如連苯 f酚(如連苯三酚的苯均三酸酯或連苯三酚的參(磺酸 酯))、羥基亞胺的磺酸酯、N—全氟苯楓基氧基萘二甲醯胺 基、α^α’雙-楓基二偶氮基甲烷、萘醌二疊氮化物、 烧基二續酸酯和其他類似物。 本發明 透明的巨 BH添加劑 鹼顯像劑 部份的存 碳原子, 子。該BH 定側基, 經輻射照 選自包含 光阻組 大疏水 一般可 產生反 在為特 較佳係 添加.劑 其在酸 射部份 飽和類Examples of acid generators suitable for photosensitivity include (but preferably substituted one or more of any specified aryl moieties with alkyl groups) gun salts such as triaryl hexafluoroantimonate, diaryl iodohexafluoro antimonate Esters, hexafluoroquinates, trilates, perfluoroalkane% esters (such as perfluoromethanesulfonate, perfluorobutane, perfluorohexanesulfonate, perfluorooctanesulfonate, etc.), Substituted aryl sulfonates such as trisphenol f (such as pyromellitic esters of pyrogallol or ginseng (sulfonate)), sulfonates of hydroxyimine, N-perfluoro Benzyloxynaphthalenedimethylamine, α ^ α'bis-maplediazomethane, naphthoquinone diazide, alkyl dibasic acid ester, and others. The transparent giant BH additive of the present invention contains carbon atoms in the alkali developer part. The BH fixed side group is selected from the group consisting of a photoresist group and a large hydrophobic group through radiation. Generally, it is particularly preferable to be added. The agent is in the acid-emitting part and is saturated.

合物另外以在193毫微米輻射下實質上呈 性添加物("BH"添加劑)的存在為特徵。t 和/或提高解析極細石印部份對慣用水性 應的能力。該BH成份最好以至少一個脂考 徵。該Μ添加劑最好包含至少約14至6〇浪 至少14個碳原子,最佳係約14至60個碳3 最好包含一個或多個額外部份如酸_不安 的存在下經過裂解可提供一種可促進光扭 的=溶解度之、組成物。較佳糊添加劑力 固醇成份、非類固醇脂環化合物、至少母The compound is further characterized by the presence of substantially additive (" BH " additive) under 193 nm radiation. t and / or improve the ability to resolve the very fine lithographs' response to water usage. The BH component is preferably characterized by at least one lipid. The M additive preferably contains at least about 14 to 60 carbon atoms and at least 14 carbon atoms, most preferably about 14 to 60 carbon atoms. 3 Most preferably contains one or more additional moieties such as cleavage in the presence of acidic uneasiness to provide A composition that can promote light twist = solubility. Preferred paste additives: Steroids, non-steroidal alicyclic compounds, at least

第24頁 500979 五、發明說明(19) 一 '—^-— 個脂環部份間具有多個酸不安定連接基之非類固醇多脂環 化合物。較佳的BH添加劑包括石膽酸酯如第三—丁基-3—三 氟乙醯基石膽酸酯、第三—丁基金剛合金羧酸酯和雙—金剛 基-丁基羧酸酯。若有必要,可使用M添加劑脂組合物。 本發=光阻組合物在其塗佈於目標基材之前,一般將包 含一種溶劑。該溶劑可為任何習慣與經酸催化的光阻一起 使用的溶劑,另外其對光阻組合物的成效不具有任何過多 負面影響。較佳溶劑是丙二醇單甲基醚醋酸酯、環己酮 乙基乙酸溶纖劑。 本發明組合物可另外包含少量輔助成份如技術上已知的 染料/敏化劑、鹼添加劑等。較佳的鹼添加劑是可清除少 量酸而不會對光阻成效有過多影響之弱鹼。較佳的鹼添加 劑是(al iphat i c或脂環)三級烷基胺或第三烷基銨 物如第三-丁基銨氫氧化物(TBAH)。 本發明光阻組合物最好包含約〇. 5_2〇重量%(較佳 3-15重量%)之對光敏感的酸產生劑,以组合物 類 合物的總量為基準。在溶劑細,整個組合物最:$ 約50-90重量%溶劑。該組合物最好包含則重量%或更少之 該鹼添加劑,以對酸敏感的聚合物總重量為基準 η物最好包含至少約54量%之郎、ss、H__ 添加劑成伤’較佳為約1〇-25重量% ’最佳為約ι〇_2 %,以組合物中環烯類聚合物的總量為基準。 本發明不限於任何特定方法以合成太 聚合物。該料類聚合物最好是以加所用的環烯類 ^ I合形成的。適合Page 24 500979 V. Description of the invention (19) A non-steroidal polyalicyclic compound having multiple acid-labile linkers between alicyclic moieties. Preferred BH additives include lithocholic acid esters such as tertiary-butyl-3-trifluoroacetamidinocholate, tertiary-butadiene alloy carboxylic acid esters, and bis-adamantyl-butylcarboxylic acid esters. If necessary, M additive fat compositions can be used. This hair = The photoresist composition will generally contain a solvent before it is applied to the target substrate. The solvent can be any solvent that is customarily used with an acid-catalyzed photoresist, and in addition, it does not have any excessively negative effects on the effectiveness of the photoresist composition. Preferred solvents are propylene glycol monomethyl ether acetate and cyclohexanone ethyl acetate cellosolve. The composition of the present invention may further contain minor amounts of auxiliary ingredients such as dyes / sensitizers, alkali additives and the like known in the art. The preferred base additive is a weak base that removes a small amount of acid without having much effect on the photoresist effectiveness. Preferred base additives are (al iphat i c or alicyclic) tertiary alkylamines or tertiary alkylammonium compounds such as tertiary-butylammonium hydroxide (TBAH). The photoresist composition of the present invention preferably contains about 0.5-20% by weight (preferably 3-15% by weight) of a light-sensitive acid generator, based on the total amount of the composition of the composition. Fine in solvent, most of the entire composition: $ 50-90% by weight solvent. The composition preferably contains the alkali additive in weight percent or less. Based on the total weight of the acid-sensitive polymer, the compound preferably contains at least about 54% by weight of Lang, ss, and H_. It is about 10-25% by weight, and most preferably about OM_2%, based on the total amount of the cycloolefin-based polymer in the composition. The invention is not limited to any particular method for synthesizing too polymers. The material polymer is preferably formed by adding a cycloolefin compound used. Suitable for

第25頁 五、發明說明(20) 的技術實例揭示於發給B.F Gcmrit^· k、 5,468,8 1 9 ^5,705,503 " 考。 在此將此揭示内容併入以作為參— 5,0 0 0- 1 0 0,0 00,較佳係約 1〇,〇〇〇 — 5〇,㈣❹。 ss %:a為:用方去此合環烯類聚合物、PAG、βΗ、 發明環烯類聚合物。可用於光成、成伤所獲仵的本 具有明I員量之溶齊丨。' 序之光阻組合物一般 =明環浠類聚合物特別地可用於半導 體電路所用的光石印程序中。特別地,該組合物可= 毫二米訂輻射之光石印程序。若欲使用其他輻射:如 仇料㈣微米深υν、χ'射線或e_束),可藉添加適當 木枓或破化刎至該組合物中以調整本發明组合物。 :阻組合物在半導體光石印技術上的一般用途二 下0 、Page 25 5. The technical example of the description of the invention (20) is disclosed in B.F Gcmrit ^ · k, 5,468,8 1 9 ^ 5,705,503 " This disclosure is incorporated herein as a reference-5, 000-1 0, 0, 00, preferably about 10, 000-50, ㈣❹. ss%: a means: use this method to remove the cycloolefin polymer, PAG, βΗ, and invent the cycloolefin polymer. It can be used for photo-acquisition and wound-acquisition. 'The photoresist composition of the sequence is generally = bright ring type polymers are particularly useful in photolithography processes for semiconductor circuits. In particular, the composition can be a light lithographic process for millimeters of radiation. If other radiations are to be used: for example, micron deep, νν, χ ′ rays, or e-beams), the composition of the present invention can be adjusted by adding appropriate wood chips or crackers to the composition. : General use of the resist composition in semiconductor light lithography technology

、半導體光石印應用一般包括轉移一圖案至半導體基材上 的材料層上。半導體基材的材料層可為金屬導電層、陶 瓷絕f層:半導體層或視製造程序步驟和最終產物所設定 的目f材料而定之其他材料。在許多例子中,在塗佈光阻 層之前’先將抗反射塗層(ARC)塗佈在材料層上。該ARC層_ 為任何可與酸催化光阻互容的慣用ARC。 、—般’利用旋轉塗佈或其他技術將含溶劑的光阻組合物 塗佈在目標半導體基材上。之後,最好加熱該具有光阻塗Semiconductor light lithography applications generally involve transferring a pattern to a material layer on a semiconductor substrate. The material layer of the semiconductor substrate can be a metal conductive layer, a ceramic insulation layer: a semiconductor layer, or other materials depending on the target material set by the manufacturing process steps and the final product. In many instances, an anti-reflective coating (ARC) is applied to the material layer before the photoresist layer is applied. The ARC layer is any conventional ARC that is compatible with acid-catalyzed photoresist. In general, a solvent-containing photoresist composition is coated on a target semiconductor substrate by spin coating or other techniques. After that, it is best to heat the photoresist coating

第26頁 500979 五、發明說明(21) 層之基材(曝光前烘烤)以除去溶劑並改善該光阻層之内聚 力。該塗佈層之厚度最好儘可能薄,但其條件為該厚度最-好實質上是均勻的而且該光阻層足以承受接下來的加工 (一般是反應性離子蝕刻)以轉移石印圖案至下面基材的材 料層上。前-曝光烘烤步驟最好進行約1〇秒至15分鐘,較 佳係約15秒至1分鐘。該前—曝光烘烤溫度可視光阻的玻璃 轉化溫度而改變。該前-曝光烘烤最好是在低於\至少2 〇 C之溫度下完成。 除去溶劑後’然後將光阻層圖案般曝露於目標輻射下 (如1 9 3毫微米紫外輻射)。使用掃描粒子束如電子束之 處’藉該束掃過基材並選擇性地將該束應用於目標圖案上 以達到圖案般曝露。更普遍的,似波輻射形成如1 9 3毫微 米1外輻射之處’圖案般曝露是經由一個放在光阻層上的 面具進行的。對於193毫微米UV輻射,總照光能量最好是 約1〇〇毫焦耳/平方厘米或更少,較佳係約50毫焦耳/平方 厘米或更少(如15-30毫焦耳/平方厘米)。 在所需的圖案般曝露之後,一般烘烤該光阻層以進一步 元成酸催化反應並提南所曝露出圖案的對比後—曝光丈共 烤最好是在約1 0 0- 1 75 °C,較佳係約1 2 5-1 60 °c下進行。後 〜曝光烘烤最好進行約30秒至5分鐘。Page 26 500979 V. Description of the invention (21) layer substrate (baking before exposure) to remove the solvent and improve the cohesion of the photoresist layer. The thickness of the coating layer is preferably as thin as possible, but the condition is that the thickness is-most preferably substantially uniform and the photoresist layer is sufficient to withstand subsequent processing (generally reactive ion etching) to transfer the lithographic pattern to On the underlying material layer. The pre-exposure baking step is preferably performed for about 10 seconds to 15 minutes, and more preferably about 15 seconds to 1 minute. The pre-exposure bake temperature can be changed depending on the glass transition temperature of the photoresist. The pre-exposure bake is preferably performed at a temperature lower than at least 20 ° C. After removing the solvent ’, the photoresist layer is then pattern-wise exposed to the target radiation (eg, 193 nm ultraviolet radiation). Use a scanning particle beam such as an electron beam 'to sweep the substrate through the beam and selectively apply the beam to a target pattern to achieve pattern-like exposure. More generally, wave-like radiation is formed like a pattern of external radiation at 193 nanometers1. The exposure is performed through a mask placed on the photoresist layer. For 193 nm UV radiation, the total illumination energy is preferably about 100 mJ / cm2 or less, preferably about 50 mJ / cm2 or less (such as 15-30 mJ / cm2). . After the desired pattern is exposed, the photoresist layer is generally baked to further form an acid-catalyzed reaction and the contrast of the exposed pattern is raised—the exposure and co-baking are preferably at about 100-175 ° C, preferably at about 1 2 5-1 60 ° c. After ~ exposure baking is best performed for about 30 seconds to 5 minutes.

在後-曝光烘烤之後,藉光阻層與一鹼性溶液接觸可獲 得(顯像出)具有目標圖案之光阻結構,其中該鹼性溶液可 選擇性溶解曾曝露在輻射下之光阻部份。較佳的驗性溶液 (顯像劑)是四甲基銨氫氧化物水溶液。最好以慣用〇 26NAfter the post-exposure baking, a photoresist structure having a target pattern can be obtained (developed) by contacting the photoresist layer with an alkaline solution, wherein the alkaline solution can selectively dissolve the photoresist that has been exposed to radiation. Part. The preferred test solution (developing agent) is an aqueous solution of tetramethylammonium hydroxide. It is better to use the usual 26N

第27頁 ^uuy/9 五、發明說明(22) ~ ~~-- @ #〖生水溶液使本發明光阻組合物顯像。 也可利用0 · 1 4Ν或〇 · 2 1 Ν或其他鹼性水溶液使本發明光阻 1且合物顯像。一般,然後乾燥基材上所獲得的光阻結構以 除去任何殘留顯像劑溶劑。一般本發明光阻組合物的特徵 在於該產物光阻結構具有高儀刻抵抗力。在一些例子中, 利用技術上已知方法之後—砍烧化技術可進一步提高 該光阻結構的蝕刻抵抗力。本發明組合物可復現石印部 份。 然後來自光阻結構的圖案被轉移至下層基材的材料(如 陶变、金屬或半導體)上。代表性地,此轉移可藉反應性 =子蝕刻或一些其他蝕刻技術而達成。在反應性離子蝕刻 2境中,光阻的蝕刻抵抗力是特別重要的。因此本發明組 合物和所造成的光阻結構可用於創造積體電路元件的設計 中所=的圖案化材料層結構如金屬配線、接觸或通孔的口 2贫絕緣部份(如波紋溝槽或淺溝隔離)、電容器結構的溝 槽#。 用於製造這些(陶瓷、金屬或半導體)部份的程序一 化基材之材料層或部份、塗佈-光阻層於該 材枓層或。卩伤上、圖案般曝露該光阻於輻射下、藉诚 ϋίϊ!溶劑接觸顯像該圖案、蝕刻光阻層下方之二料層 的圖术二白處因此形成一個圖案化材料層或基材部份, 並自基材中除去任何殘留的光阻。在一些例子中, 光阻層下使用一個硬面具以幫助轉移該圖案至下面 料層或部份。此程序的例子揭示於美國專利4,π 5,〇丨7 ;Page 27 ^ uuy / 9 V. Explanation of the invention (22) ~~~-@ # 〖生生 水 的 Development of the photoresist composition of the present invention. The photoresist 1 and the compound of the present invention can also be developed using 0. 1 4N or 0.21 N or other alkaline aqueous solution. Generally, the photoresist structure obtained on the substrate is then dried to remove any residual developer solvent. The photoresist composition of the present invention is generally characterized in that the photoresist structure of the product has high resistance to etching. In some examples, the etch resistance of the photoresist structure can be further improved by using a method known in the art-a sintering technique. The composition of the present invention can reproduce the lithograph portion. The pattern from the photoresist structure is then transferred to the underlying substrate material (such as ceramic, metal or semiconductor). Typically, this transfer can be achieved by reactive etching or some other etching technique. In the reactive ion etching environment, the photoresist's etch resistance is particularly important. Therefore, the composition of the present invention and the resulting photoresist structure can be used to create a patterned material layer structure such as a metal wiring, a contact or a hole of a through hole in a design of an integrated circuit element. Or shallow trench isolation), trench # of capacitor structure. The procedure used to make these (ceramic, metal or semiconductor) parts is to change the material layer or part of the substrate, coating-photoresist layer on the material layer or. The photoresist is exposed to radiation, pattern-likely exposed to radiation, and sincerely! Solvent contact to develop the pattern, etch the two layers of the photoresist layer below the photoresist layer, and form a patterned material layer or substrate. And remove any remaining photoresist from the substrate. In some examples, a hard mask is used under the photoresist layer to help transfer the pattern to the underlying layer or portion. An example of this program is disclosed in US Patent 4, π 5, 〇 丨 7;

第28頁 500979 五、發明說明(23) 5,362,663 429,710 ;5,562,801 ;5,618,751 ; 5 二744, 376 ,; 5, 801,〇94 和5, 821,46 9 ,在此將此專利 不的内容併入以作為參考。其他圖案轉移程序實例是 於Plenum出版社在1 988年所發行之ffayne Mow"半導體 石印術、原理、實施和材料Η的第丨2和丨3章中,在此將其 所揭不的内谷併入以作為參考。應了解本發明不被任何 定石印技術或元件結構所限制。 實例1 (對照)P.28 500979 V. Description of the invention (23) 5,362,663 429,710; 5,562,801; 5,618,751; 5 744, 376 ;; 5, 801, 〇94 and 5, 821, 46 9, the content of this patent is hereby incorporated by Reference. Other examples of pattern transfer procedures are in chapters 2 and 3 of the ffayne Mow " semiconductor lithography, principle, implementation, and materials " issued by Plenum Press in 1988. Incorporated for reference. It should be understood that the present invention is not limited by any fixed lithographic technique or component structure. Example 1 (control)

為了石印實驗的目的,藉混合下面所列以份重所表示之 材料製備一種含有原冰片烯共聚物之光阻調配物,其中該 原冰片烯共聚物包含85%原冰片烯第三_ 丁基酯 和15%原冰片烯-羧酸(作為侧基)(NB-CA)。 37 4 0. 16 0. 008 丙二醇單甲基醚醋酸醋 ΝΒ-ΐ-BE 和NB-CA 的共聚物(85/15) 二-第三-丁基苯基碘鎗全氟辛烷磺酸酯 四丁基銨氳氧化物 該光阻調配物被旋轉塗佈(3 〇秒)在塗覆於矽膠片之抗反 射材料Ur,,Shipley公司)上。在真空加熱板上於丨3〇艺 下洪烤6 0秒軟化該光阻層以產生約〇 . 4微米厚的薄膜。然 後讓該膠片曝露於193毫微米輻射中(〇· 6NA ArF,ISI步進 照像機)。露出的圖案是一種線和不同尺寸之間隔的排 列’其中間隔的尺寸可減至〇. 1微米。讓經照光的膠片在For the purpose of lithographic experiments, a photoresist formulation containing an original norbornene copolymer was prepared by mixing the materials listed below in parts by weight, wherein the original norbornene copolymer contained 85% orthobornene tertiary-butyl Esters and 15% orbornene-carboxylic acid (as a side group) (NB-CA). 37 4 0. 16 0. 008 Copolymer of propylene glycol monomethyl ether acetate NB-ΐ-BE and NB-CA (85/15) Di-tertiary-butylphenyl iodogun perfluorooctane sulfonate Tetrabutylammonium phosphonium oxide The photoresist formulation was spin-coated (30 seconds) on an anti-reflective material (Ur, Shipley, Inc.) coated on a silicon film. The photoresist layer was soft-baked for 60 seconds on a vacuum hot plate at 30 ° C to soften to produce a thin film of about 0.4 microns. The film was then exposed to 193 nm radiation (0.6 NA ArF, ISI stepper camera). The exposed pattern is an array of lines and spaces of different sizes, wherein the size of the spaces can be reduced to 0.1 micron. Let illuminated film

第29頁 500979 五、發明說明(24) 真空加熱板上於1 5 0 °C下進行後-曝光烘烤9 0秒。然後利 用0 · 2 6 3 N四甲基銨氫氧化物顯像劑使露出圖案的光阻(攪__ 煉)顯像。然後以掃插電子顯微術(SEM )測定該圖案。該 S E Μ圖案截面指出因彼此重疊的線使其無法解析出低於2 〇 〇 微米L / S (線-間隔對)。即使大於2 0 0毫微米的線-間隔對也 無法完全被解析出來,因為各線間過多的殘渣/殘留物。 實例2 此實例說明含有飽和類固醇添加劑之本發明組合物的益 處。光阻調配物可藉混合下面所列以份重所表示之材料製 得 丙二醇單甲基醚醋酸g| 38 具有t-BE和CA基的聚(原冰片烯) (t-BE/CA: 85/15) 4 二-第三-丁基苯基碘鑰全氟辛烷磺酸酯 0.16 第三-丁基-3-三氟乙醯基石膽酸_ 0 4 四丁基銨氫氧化物 〇. 008 該光阻調配物被旋棘塗儒在;Μ ΓΑγΧ® , 得室仰在矽膠片所塗覆的抗反射材料 、αγα奴,bhipley公司)上、圖衆叙Μ η 知奢你μ加知η ^ 1 國梁般照光(1 9 3毫微米)並以 如實例1般相同方式使其顯像。然护 乂Page 29 500979 V. Description of the invention (24) Post-exposure baking at 150 ° C on vacuum heating plate for 90 seconds. Then use 0 · 2 6 3 N tetramethylammonium hydroxide developer to develop the photoresist (stirring) of the exposed pattern. The pattern was then determined by scanning electron microscopy (SEM). The cross section of the S EM pattern indicates that it cannot resolve below 200 μm L / S (line-spaced pair) due to overlapping lines. Even line-spaced pairs larger than 200 nm cannot be fully resolved because of excessive residue / residues between the lines. Example 2 This example illustrates the benefits of a composition of the invention containing a saturated steroid additive. Photoresist formulations can be prepared by mixing the materials listed below in parts by weight in propylene glycol monomethyl ether acetate g | 38 Poly (orthobornene) with t-BE and CA groups (t-BE / CA: 85 / 15) 4 bis-tertiary-butylphenyl iodonium perfluorooctane sulfonate 0.16 tertiary-butyl-3-trifluoroethylfluorenyllithocholic acid-0.4 tetrabutylammonium hydroxide. 008 The photoresist formulation is applied by spinner; Μ ΓΑγχ®, the chamber is placed on the anti-reflection material coated by silicon film, αγα slave (bhipley company), Tuzhong M η know luxury you μ know η ^ 1 was illuminated as a national beam (193 nm) and developed in the same manner as in Example 1. Ran Hu

(SEM)測定所得圖荦。14〇毫黴半^以知描電子顯微術 清楚輪廡赫办入紐^ u 卡和以上的線-間隔對可以 m楚輪廓被4全解析出。此調配4从 25-35毫焦耳/平方厘米範圍内。物所需的照光能量是在„(SEM) measured the obtained figure 荦. The 14 micromolds of the microscopic electron microscopy clearly knows that the 庑 u card and the line-space pairs above can be completely resolved by 4 m. This blend 4 ranges from 25-35 mJ / cm2. The energy needed for lighting is

500979 五、發明說明(25) 實例3 金剛烷-1-羧酸第三-丁基酯之合成500979 V. Description of the invention (25) Example 3 Synthesis of adamantane-1-carboxylic acid third-butyl ester

在室溫下,於一種含有25.34克(0· 34 2莫耳)第三-丁基 醇於600亳升二氣甲烷所形成的懸浮液中加入38〇7克 (0· 3815莫耳)三乙基胺。在室溫下攪拌所得懸浮液直到其 變成澄清溶液。在(TC下,將74. 75克( 0.3762莫耳)金剛& -1 -羰基氯化物加入上述溶液中。完成添加後,在室溫下 攪拌該反應混合物1 2小時,接著在迴流條件下加熱2小 時。過濾該反應混合物以除去反應期間所形成的三乙基胺 氣化氫。以水(X 5 0 0毫升)清洗該遽液數次,以無水酸硫酸 鈉乾燥之並在低壓下濃縮之。經由管柱色層分析法(石夕 膠;己烷/二氯甲烷:9 : 1)純化殘留物可獲得48. 4克 (〜60%)之白色固體,經NMR光譜法鑑定指其為金剛烷-1-羧 酸第三-丁基酯。 實例4 此實例說明含有金剛烷-1 -羧酸第三-丁基酯之本發明組 合物的益處。光阻調配物可藉混合下面所列以份重所表示 之材料製得。To a suspension of 25.34 g (0.332 mol) of tertiary-butyl alcohol in 600 liters of methane at room temperature was added 3807 g (0.315 mol) of tris-butyl alcohol. Ethylamine. The resulting suspension was stirred at room temperature until it became a clear solution. At (TC, 74.75 g (0.3762 mol) of King Kong & -1 -carbonyl chloride was added to the above solution. After the addition was completed, the reaction mixture was stirred at room temperature for 12 hours, then under reflux conditions Heated for 2 hours. The reaction mixture was filtered to remove triethylamine gaseous hydrogen formed during the reaction. The mash was washed several times with water (500 ml), dried over anhydrous sodium sulfate, and under reduced pressure. Concentrated. Purified residue by column chromatography (Shi Xijiao; hexane / dichloromethane: 9: 1) to obtain 48.4 g (~ 60%) of a white solid, identified by NMR spectroscopy This is the third-butyl ester of adamantane-1-carboxylic acid. Example 4 This example illustrates the benefits of the composition of the present invention containing the third-butyl ester of adamantane-1-carboxylic acid. The photoresist formulation can be mixed Made from the materials listed below in parts.

第31頁 500979 五、發明說明(26) 丙二醇單甲基醚醋酸酯 具有ΐ-BE和CA基的聚(原冰片烯) 4 (t-BE/CA: 85/15) ‘ 二-第三-丁基苯基碘鏺全氟辛烷續酸職 〇 16P.31 500979 V. Description of the invention (26) Propylene glycol monomethyl ether acetate poly (orthobornene) having fluorene-BE and CA groups 4 (t-BE / CA: 85/15) 'Second-third- Butylphenyl iodonium perfluorooctane acid

金剛烷-1-羧酸第三_ 丁基酯(實例4 四丁基銨氫氧化物 〇* 〇〇8Amantadine-1-carboxylic acid tertiary-butyl ester (Example 4 Tetrabutylammonium hydroxide 〇 * 〇〇8

該光阻調配物被旋轉塗佈在矽膠片上的抗反射材料(ΑΓχ⑧ ’Shipley公司)上、圖案般照光(193毫微米)並以如實例i 般相同方式使其顯像。然後以掃描電子顯微術(SEM)測定 所得圖案。1 4 0毫微米和以上的線-間隔對可以清楚輪廓被 完全解析出。此調配物所需的照光能量是在2〇_3〇毫焦耳/ 平方厘米範圍内。 實例5 2,5 -雙(金剛烷-1-羧基氧基)—2, 5-二甲基己烷之合成 在室溫下,於一種含有5〇克(0·342莫耳)2,6—二甲基一 2, 5-己烷二酵於6 〇〇毫升二氣曱烷所形成的懸浮液中加入 76.14克(〇·762莫耳)三乙基胺。在室溫下攪拌所得懸浮液 直到其變成澄清溶液。在(TC下,將149· 5克(0· 7524莫耳) 金剛烧-1 -羰基氣化物加入上述溶液中。完成添加後,在 至溫下搜拌該反應混合物1 2小時,接著在迴流條件下加熱 2小時。過濾該反應混合物以除去反應期間所形成的三乙 基胺氣化氫。以水(X 5 〇 〇毫升)清洗該濾液數次,以無水酸 硫酸鈉乾燥之,然後在低壓下濃縮之。經由管柱色層分析 法(矽膠;己烷/二氣甲烷:9 : 1 )純化殘留物可獲得1 2 8克This photoresist formulation was spin-coated on an anti-reflective material (Alphax'Shipley Company) on a silicon film, pattern-like light (193 nm), and developed in the same manner as in Example i. The resulting pattern was then measured by scanning electron microscopy (SEM). Line-space pairs of 140 nm and above can be clearly resolved with clear contours. The light energy required for this formulation is in the range of 20-30 millijoules per square centimeter. Example 5 Synthesis of 2,5 -bis (adamantane-1-carboxyoxy) -2,5-dimethylhexane At room temperature, a compound containing 50 g (0.342 mol) of 2,6 -A suspension of dimethyl-2,5-hexanedionate in 600 ml of dioxane was added with 76.14 g (0.762 mol) of triethylamine. The resulting suspension was stirred at room temperature until it became a clear solution. At TC, 149.5 g (0.7524 mol) of rimana-1-carbonyl gaseous substance was added to the above solution. After the addition was completed, the reaction mixture was stirred at room temperature for 12 hours, and then refluxed. It was heated under conditions for 2 hours. The reaction mixture was filtered to remove triethylamine gaseous hydrogen formed during the reaction. The filtrate was washed several times with water (500 ml), dried over anhydrous sodium sulfate, and then Concentrated at low pressure. Purification of the residue by column chromatography (silica gel; hexane / digas methane: 9: 1) yields 1 2 8 g

第32頁 500979 五、發明說明(27) (〜8〇%)之白色固體,經NMR光譜法鑑定指其為2,5 -雙(金剛 燒〜綾基氧基)-2,5 -二甲基己烷。 實例6 此實例說明含有2, 5-雙(金剛垸叛基氧基)-2, 5-二甲 基己烷之本發明組合物的益處。光阻調配物可藉混合下面 所列以份重所表示之材料製得 丙二醇單甲基醚醋酸酯 38 具有t-BE和CA基的聚(原冰片烯) 4 (t-BE/CA: 85/15) 一 -第三-丁基苯基礙鐵全氟辛炫罐酸酯 0.16 2,5〜雙(金剛烷-1-羧基氧基)一2,5-二甲基己烷 〇.4 (實例5) 四丁基銨氫氧化物 0.008 該光阻調配物被旋轉塗佈在矽膠片上的抗反射材料(ΑΓχ® ’ Shipley公司)上、圖案般照光(丨93毫微米)並以如實例1 般相同方式使其顯像。然後以掃描電子顯微術(SEM)測定 所=圖案。i 3〇毫微米和以上的線-間隔對可以清楚輪廓被 完全解析出。此調配物所需的照光能量是在2〇-3〇毫焦耳/ 平方厘米範圍内。 實例6 (對照) 為了石印實驗的目的,藉混合下面所列以份重所表示之 材料衣備一種含有原冰片烯共聚物之光阻調配物,其中該P.32 500979 V. Description of the invention (27) (~ 80%) A white solid identified by NMR spectroscopy means that it is 2,5-bis (adamantyl ~ fluorenyloxy) -2,5-dimethyl Hexane. Example 6 This example illustrates the benefits of a composition of the present invention containing 2,5-bis (adamantyloxy) -2,5-dimethylhexane. Photoresist formulations can be prepared by mixing the materials listed below in parts by weight to produce propylene glycol monomethyl ether acetate 38 poly (orthobornene) with t-BE and CA groups 4 (t-BE / CA: 85 / 15) Mono-tertiary-butylphenyl iron hindering perfluorooctanoate 0.16 2,5 ~ bis (adamantane-1-carboxyoxy) -2,5-dimethylhexane 0.4 (Example 5) Tetrabutylammonium hydroxide 0.008 The photoresist formulation was spin-coated on an anti-reflection material (AΓχ® 'Shipley Company) on a silicon film, pattern-like light (93 nm), and an example was used. 1 in the same way. The scanning pattern was then determined by scanning electron microscopy (SEM). Line-space pairs of i 30nm and above can be clearly resolved with clear contours. The light energy required for this formulation is in the range of 20-30 mJ / cm2. Example 6 (Control) For the purpose of lithographic experiments, a photoresist formulation containing an original norbornene copolymer was prepared by mixing the materials indicated in parts listed below in weight, where the

第33頁 500979 五、發明說明(28) 原冰片浠共聚物包含85%原冰片烯第三-丁基酯(關一 t-gg) 和1 5%原冰片烯-羧酸(作為侧基)。 丙二醇單甲基醚醋酸酯 37 NB-1-BE 和NB-CA 的共聚物(85/15) 4 二-第二-丁基本基破鎗全氟辛垸磺酸酯 〇.1β 四丁基銨氫氧化物 0008 該光阻調配物被旋轉塗佈(30秒)在塗覆於矽膠片上之抗 反射材料(Ar)^ ’ Shipley公司)上。在真空加熱板上於13〇 °C下烘烤60秒以軟化該光阻層而產生約〇· 4微米厚的薄 膜。然後讓該膠片曝露於193毫微米輻射中(〇.6NA ArF, I SI步進照像機)。露出的圖案是一種線和不同尺寸之間隔 的排列,其中間隔的尺寸可減至〇 · 1微米。讓經照光的膠 片在真空加熱板上於1 5 0 °C下進行後-曝光烘烤9 q秒。然後 利用0· 263N四甲基銨氫氧化物顯像劑使露出圖案的光阻 (攪煉)顯像。然後以掃描電子顯微術(SEM)測定該圖案。 該SEM圖案截面指出因彼此重疊的線使其無法解析出低於 200微米L/S(線-間隔對)。即使大於200毫微米的線_間隔 對也無法完全被解析出來,因為各線間過多的殘渣/殘留 物。 實例7 在一個12公升四頸圓底燒瓶中加入5 00克(1.328莫耳)石 膽酸和4公升乾THF,其中該圓底燒瓶裝有一個頭授摔器、P.33 500979 V. Description of the invention (28) The original norbornene copolymer contains 85% orthobornene tertiary-butyl ester (Kwanichi t-gg) and 1 5% orthobornene-carboxylic acid (as a side group) . Propylene Glycol Monomethyl Ether Acetate 37 Copolymer of NB-1-BE and NB-CA (85/15) 4 Di-Second-Butylbenzyl Perfluorooctanesulfonate 0.1% Tetrabutylammonium Hydroxide 0008 The photoresist formulation was spin-coated (30 seconds) on an anti-reflective material (Ar) (Shipley Corporation) coated on a silicon film. Baking on a vacuum hot plate at 13 ° C. for 60 seconds to soften the photoresist layer to produce a thin film of about 0.4 microns. The film was then exposed to 193 nm radiation (0.6 NA ArF, I SI step camera). The exposed pattern is an arrangement of lines and spaces of different sizes, where the size of the spaces can be reduced to 0.1 micron. The illuminated film was post-exposed and baked on a vacuum hot plate at 150 ° C for 9 q seconds. Then, the photoresist (stirring) of the exposed pattern was developed using a 0. 263N tetramethylammonium hydroxide developer. The pattern was then measured by scanning electron microscopy (SEM). The cross section of the SEM pattern indicates that it is impossible to resolve below 200 micrometers L / S (line-space pair) due to the overlapping lines. Even line-space pairs larger than 200 nm cannot be fully resolved because of excessive residue / residues between the lines. Example 7 A 12-liter four-necked round bottom flask was charged with 500 g (1.328 mol) of cholestyronic acid and 4 liters of dry THF, wherein the round-bottomed flask was equipped with a head shaker,

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Dvvy/y 五、發明說明(29) 熱電偶溫度監測器和1公升裝有氮氣入口之 :。J” 1 920毫升(13.6莫耳)三氟醋酸軒裝二漏斗 冰中冷卻該燒瓶並將三氣^酐加人保持 ί上 /的稀水流中。將該混合物加熱至室溫並 陥仪攪拌,之後在旋轉蒸發器中除去溶劑和 酸酐。將濃且黏稠中間物移至另外重新裝有;^里m 公升燒瓶中。將740克(1〇莫耳)第三—丁基( 釋之以防止固化)裝入添加漏斗中。- ^量F稀 *々獨才T。丹度於冰 瓶並將第三-丁基醇加入保持在低於1〇它之 豨 囡ΓΓ 達到室溫。然後加人近2〇〇克 固體NaHC03並另外繼續授掉2小時。然後在旋 除去溶劑和過量的第三_ 丁基醇。並將混合•在乂 醚中主以3x800毫升飽和NaHC〇3,接著以2χΐ〇〇〇|升^ :心清洗之。#隨著攪拌,以心叫乾燥溶劑約^小時,過 濾之並旋轉蒸發器中將其蒸掉。 _ 慢地沖提該濃且黏稠的殘留物,由一個大官枉缓 矽朦於? #占| 物其中該管柱内含有80 0克 ' 元。在旋轉蒸發器中蒸發所人|, 並且在真空和40。(:下於嫌f畜續:;贫所〇併的產物成伤 重以獲得620克(88%)目=::::去剩餘溶劑至-固定 戊院中可成功地結日:㈡:;;'色的白色糖浆。從 實例8 由冗郷負W獲仵一低熔點白蠟。 此實例說明本發明組合物 下面所列以份重所表示之材阻調配物可藉"合Dvvy / y V. Description of the invention (29) Thermocouple temperature monitor and 1 liter of nitrogen inlet:. J ”1 920 ml (13.6 mol) trifluoroacetic acid in a second funnel. Cool the flask in ice and add trishydride to a dilute stream of water. Heat the mixture to room temperature and stir with a funnel. After that, the solvent and acid anhydride were removed in a rotary evaporator. The thick and viscous intermediate was transferred to another refilling tank; the liter was a liter flask. 740 g (10 mol) of the third-butyl (explained as (To prevent solidification) into the addition funnel.-^ Amount F dilute * 々 独 才 T. Dandu in an ice bottle and the third -butyl alcohol was added to keep the temperature below 10% to reach room temperature. Then Add nearly 200 g of solid NaHC03 and continue to bleed for another 2 hours. Then remove the solvent and excess tertiary butyl alcohol in the spin. And mix • Mainly 3x800 ml of saturated NaHC03 in ether, then Take 2χΐ〇〇〇〇 liter ^: heart wash it. # With stirring, dry the solvent by heart for about ^ hours, filter it and evaporate it in a rotary evaporator. _ Slowly extract the thick and viscous residue Matter, by a big official to slow silicon haze? # 占 | 物。 The column contains 80 0g 'yuan. In a rotary evaporator发 所 人 |, and under vacuum and 40. (: next to the suspected animal continued :; the product of the depleted and unincorporated into a wound to obtain 620 g (88%) mesh = :::: to the remaining solvent to-fixed In the Chinese Academy of Sciences, the date can be successfully settled: ;: ;; 'colored white syrup. A low melting point white wax was obtained from Example 8 from the negative load. This example illustrates the composition of the present invention expressed in parts by weight. Materials can be borrowed " combined

第35頁 500979 五、發明說明(30) 丙二醇單甲基醚醋酸酯 38 具有ΐ-ΒΕ和CA基的聚(原冰片烯) 4 (t-BE/CA: 85/15) 二-第三-丁基苯基碘鎗全氟辛烷磺酸酯 0.16 第二-丁基_ 3 -二氣乙酿基石膽酸酯(實例2 ) 0.4 四丁基銨氫氧化物 0. 008P.35 500979 V. Description of the invention (30) Propylene glycol monomethyl ether acetate 38 Poly (orthobornene) having fluorene-ΒΕ and CA groups 4 (t-BE / CA: 85/15) Second-third- Butylphenyl iodine gun perfluorooctane sulfonate 0.16 second-butyl-3-digas ethyl alcohol lithocholic acid ester (Example 2) 0.4 tetrabutylammonium hydroxide 0.008

該光阻調配物被旋轉塗佈在矽膠片所塗覆的抗反射材料 (Ari®,Shipley公司)上、圖案般照光(193毫微米)並以如 實例6般相同方式使其顯像。然後以掃描電子顯微術(SEM) 測定所得圖案。140毫微米和以上的線—間隔對可以清楚輪 廓被完全解析出。此調配物所需的照光能量是在25-35毫 焦耳/平方厘米範圍内。 實例9The photoresist formulation was spin-coated on an anti-reflective material (Ari®, Shipley, Inc.) coated with a silicon film, pattern-like light (193 nm), and developed in the same manner as in Example 6. The resulting pattern was then measured by scanning electron microscopy (SEM). Line-space pairs of 140 nm and above clearly show that the contours are fully resolved. The light energy required for this formulation is in the range of 25-35 mJ / cm2. Example 9

在室溫下,於一種含有25· 34克(〇· 342莫耳)第三—丁基 醇於600毫升二氣甲烧所形成的懸浮液中加入38.Q7克 (〇· 3815莫耳)三乙基胺◎在室溫下攪拌所得懸浮液直到其 變成澄清溶液。在0 °C下,將74. 75克(0· 3762莫耳)金剛烧 一 1-羰基氣化物加入上述溶液中。完成添加後,在室溫下 攪拌該反應混合物1 2小時,接著在迴流條件下加熱2小 時。過濾該反應混合物以除去反應期間所形成的三乙基胺 氯化氫。以水(X 5 0 0毫升)清洗該濾液數次,以無水酸硫酸 鈉乾燥之並在低壓下濃縮之。經由管柱色層分析法(矽To a suspension of 25.34 g (.342 mol) of tertiary-butyl alcohol in 600 ml of dichloromethane was added 38.Q7 g (0.315 mol) at room temperature. Triethylamine ◎ The resulting suspension was stirred at room temperature until it became a clear solution. At 0 ° C, 74.75 grams (0.3762 moles) of diamond-fired 1-carbonyl gas was added to the above solution. After the addition was completed, the reaction mixture was stirred at room temperature for 12 hours, and then heated under reflux for 2 hours. The reaction mixture was filtered to remove triethylamine hydrogen chloride formed during the reaction. The filtrate was washed several times with water (500 ml), dried over anhydrous sodium sulfate and concentrated under reduced pressure. Via column chromatography (silicon

第36頁 500979 五、發明說明(31) 膠’己统/二氣甲燒:9 :1)純化殘留物可獲得48.4克 (〜60%)之白色爵體,經光譜法鑑定指其為金剛烷—丨-羧# 酸第三-丁基酯。 實例1 0 為了石印貫驗的目的,藉混合下面所列以份重所表示之 材料製備一種含有原冰片烯共聚物之光阻調配物,其中該 原冰片烯共聚物包含85%原冰片烯第三—丁基酯be) 和15%原冰片烯-羧酸(作為侧基)(NB-CA)。 丙二醇單甲基醚醋酸酯 3 7 NB-1-BE 和 NB-CA 的共聚物(85/15) 4 二-第三-丁基苯基碘鑷全氟辛烷磺酸酯 ^ i 0. 008P.36 500979 V. Description of the invention (31) Gum 'Hotong / Digasaki: 9: 1) Purified residue can obtain 48.4 g (~ 60%) of white beetle. Spectral identification indicates that it is diamond. Alkane- 丨 -carboxy # acid third-butyl ester. Example 10 For the purpose of lithographic inspection, a photoresist formulation containing an original norbornene copolymer was prepared by mixing the materials listed below in parts by weight, wherein the original norbornene copolymer contained 85% of the original norbornene copolymer. Tri-butyl ester be) and 15% orbornene-carboxylic acid (as a side group) (NB-CA). Propylene glycol monomethyl ether acetate 3 7 Copolymer of NB-1-BE and NB-CA (85/15) 4 Di-tertiary-butylphenyliodine tweezers perfluorooctane sulfonate ^ i 0.08

該SEM圖案截面指出因彼此重疊的線使其 四丁基銨氫氧化物 · 口出圖案的光阻 Λ)測定該圖案。 無法解析出低於 500979 五、發明說明(32) 2 0 0微未L / S (線-間隔對)。 對也無法完全被解析出來 物0 即使大於2 0 0毫微米的線_間隔 因為各線間過多的殘渣/殘留 實例11 光阻調配物可藉混合 此實例說明本發明組合物的益處。 下面所列以份重所表示之材料製得。 38 4 0. 16 0.4 0. 008The cross section of the SEM pattern indicates the photoresist of the tetrabutylammonium hydroxide due to the lines overlapping each other. The pattern was measured. Cannot parse out below 500979 V. Description of the invention (32) 2 0 0 Wei L / S (line-space pair). Pairs cannot be fully resolved. Object 0 Even lines larger than 200 nm. Line spacing because of excessive residue / residue between lines. Example 11 Photoresist formulations can be mixed. This example illustrates the benefits of the composition of the present invention. Made from the materials listed below in parts. 38 4 0. 16 0.4 0. 008

丙二醇單甲基醚醋酸酯 具有ΐ - BE和CA基的聚(原冰片嫌) (t-BE/CA: 85/15) 二-第三_丁基苯基碘鎗全氟辛烷磺酸酯 金剛烷-1 -羧酸第三-丁基酯(實例3) 四丁基銨氩氧化物 阻調配物被旋轉塗佈在矽膠片所塗覆的抗反射材料 (ArP,Ship ley公司)上、圖案般照光(193毫微米)並以如 實例10般相同方式使其顯像。然後以掃描電子顯微術 (SEM)測定所得圖案。14〇毫微米和以上的線-間隔對可以Propylene glycol monomethyl ether acetate Poly (original borneol) with fluorene-BE and CA groups (t-BE / CA: 85/15) Di-tertiary-butylphenyl iodogun perfluorooctane sulfonate Adamantane-1 -carboxylic acid third-butyl ester (Example 3) The tetrabutylammonium argon oxide barrier formulation was spin-coated on an anti-reflective material (ArP, Shipley Co.) Light was patterned (193 nm) and developed in the same manner as in Example 10. The resulting pattern was then measured by scanning electron microscopy (SEM). Line-spaced pairs of 14 nm and above can

清楚輪廓被完全解析出。此調配物所需的照光能量是在 20-30毫焦耳/平方厘米範圍内。 實例1 2 在室溫下,於一種含有50克(〇· 342莫耳)2, 6-二甲基-2, 5-己烷二醇於600毫升二氣甲烷所形成的懸浮液中加入 7β·14克(0.762莫耳)三乙基胺。在室溫下攪拌所得懸浮液The clear outline is fully resolved. The light energy required for this formulation is in the range of 20-30 mJ / cm2. Example 1 2 At room temperature, 7β was added to a suspension containing 50 g (.342 mol) of 2, 6-dimethyl-2,5-hexanediol in 600 ml of digasmethane. 14 grams (0.762 moles) of triethylamine. Stir the resulting suspension at room temperature

第38頁 ^uuy/9 五、發⑶) ~ "— 直到其變成澄清溶液。在〇 t:下,將149· 5克(0· 7524莫耳) ,剛烷-1 -羰基氯化物加入上述溶液中。完成添加後,在 至溫下攪拌該反應混合物1 2小時,接著在迴流條件下加熱 2小時。過濾該反應混合物以除去反應期間所形成的三乙 基胺氣化氫。以水(x500毫升)清洗該濾液數次,以無水酸 硫酸鈉乾燥之,然後在低壓下濃縮之。經由管柱色層分析 去(矽膠;己烧/二氯甲烷:9 : 1 )純化殘留物可獲得j 2 8克 (〜8 0%)之白色固體,經NMR光譜法鑑定指其為2,5-雙(金剛 燒一1、羧基氧基)-2,5-二甲基己烷。 實例1 3 (對照) 為了石印實驗的目的,藉混合下面所列以份重所表示之 材料製備一種含有原冰片烯共聚物之光阻調配物,其中該 原冰片烯共聚物包含g5%原冰片烯第三—丁基酯(龍一卜抑) 和1 5%原冰片烯—羧酸(作為侧基)。 37 4 0. 16 0. 008 丙二醇單甲基醚醋酸酯 NB-1-BE 和 NB-CA 的共聚物(85/15) 二-第三-丁基苯基碘鎗全氟辛烷磺酸酯 四丁基銨氫氧化物 該光阻調配被旋轉塗佈(3 〇秒)在塗覆於矽膠片上之抗 反射材料(Arf ,Shipley公司)上。在真空加熱板上於13〇 C下烘烤60秒以軟化該光阻層而產生約〇· 4微米厚的薄 膜然後讓該膠片曝露於193毫微米輻射中(〇m ArF,Page 38 ^ uuy / 9 V. Issue ⑶) ~ " — until it becomes a clear solution. At 0 t: 149.5 g (0.7524 mol) of adamane-1 -carbonyl chloride was added to the above solution. After the addition was completed, the reaction mixture was stirred at room temperature for 12 hours, and then heated under reflux for 2 hours. The reaction mixture was filtered to remove triethylamine gaseous hydrogen formed during the reaction. The filtrate was washed several times with water (x500 ml), dried over anhydrous sodium sulfate, and then concentrated under reduced pressure. Purify the residue by column chromatography (silica gel; hexane / dichloromethane: 9: 1) to obtain j 2 8 g (~ 80%) of a white solid, which is identified by NMR spectroscopy as 2, 5-Bis (Diamond Diamond-1, Carboxyloxy) -2,5-dimethylhexane. Example 13 (Comparison) For the purpose of lithographic experiments, a photoresist formulation containing an original norbornene copolymer was prepared by mixing the materials expressed in parts listed below in parts by weight, wherein the original norbornene copolymer contained g5% of original norbornene Tertiary-butyl ester (Long Yibu Yi) and 15% orthobornene-carboxylic acid (as a side group). 37 4 0. 16 0. 008 Copolymer of propylene glycol monomethyl ether acetate NB-1-BE and NB-CA (85/15) Di-tertiary-butylphenyl iodogun perfluorooctane sulfonate Tetrabutylammonium hydroxide The photoresist formulation was spin-coated (30 seconds) on an anti-reflective material (Arf, Shipley) coated on a silicon film. Baking on a vacuum hot plate at 13 ° C. for 60 seconds to soften the photoresist layer to produce a thin film of about 0.4 micron thickness and then exposing the film to 193 nm radiation (0 m ArF,

第39頁 500979 五、發明說明(34) ^_ ISI步進照像機)。露出的圖案是一種線和不同 的排列,其中間隔的尺寸可減至0. 1微米。讓經昭'中、之間f 片在真空加熱板上於150t下進行後—曝光烘烤90、和光的膠 利用0.263N四甲基銨氫氧化物顯像劑使露出圖素=、。然後 (攪煉)顯像。然後以掃描電子顯微術(SEM)測定談、光阻 該SEM圖案截面指出因彼此重疊的線使其無法解案。、 200微米L/S(線-間隔對)。即使大於2〇〇毫微米的 對也無法完全被解析出來,因為各線間過多的殘逢 物。 實例1 4 此實例說明本發日月組合物的益處。光阻調配物可萨混合 下面所列以份重所表示之材料製得 曰 38 4 0. 16 0· 4 0. 008 丙二醇單甲基醚醋酸酯 具有t-BE和CA基的聚(原冰片烯) (t-BE/CA: 85/15) 二-第三-丁基苯基碘鏺全氟辛烷磋酸酯 2, 5-雙(金剛烷-1-羧基氧基)—2,卜二甲基己烷 (實例5 ) 四丁基銨氫氧化物 該光阻調配物被旋轉塗佈在矽膠片所塗覆的抗反射材料 (ArX ,Shipley公司)上、圖案般照光〇 93毫微米)並以如 實例13般相同方式使其顯像。然後以掃描電子顯微術Page 39 500979 V. Description of the invention (34) ^ _ ISI stepper camera). The exposed pattern is a line and a different arrangement in which the size of the spaces can be reduced to 0.1 micron. After the "Zhao" and "f" flakes were performed on a vacuum hot plate at 150t—exposure bake 90, Wako glue was exposed with a 0.263N tetramethylammonium hydroxide developer to expose pixels = ,. Then (refined) development. Then, scanning electron microscopy (SEM) was used to measure the photoresistance. The cross-section of the SEM pattern indicated that lines could not be resolved due to overlapping lines. , 200 microns L / S (line-spaced pair). Even pairs larger than 200 nm cannot be fully resolved because there are too many artifacts between the lines. Example 1 4 This example illustrates the benefits of this sun and moon composition. Photoresist formulation can be blended with the materials listed below in parts by weight to obtain 38 4 0. 16 0 · 4 0. 008 Propylene glycol monomethyl ether acetate Poly (original borneol) with t-BE and CA groups Ethylene) (t-BE / CA: 85/15) Di-tert-butylphenyliodonium perfluorooctane oxalate 2,5-bis (adamantane-1-carboxyoxy) -2, Bu Dimethyl hexane (Example 5) Tetrabutylammonium hydroxide The photoresist formulation was spin-coated on an anti-reflective material (ArX, Shipley, Inc.) coated with silicon film, and patterned to illuminate 093 nm. ) And developed it in the same manner as in Example 13. Scanning electron microscopy

第40胃 500979 五、發明說明(35) (SEM)測定所得圖案。1 30毫微米和以上的線-間隔對可以 清楚輪廓被完全解析出。此調配物所需的照光能量是在 20-30毫焦耳/平方厘米範圍内。 50097940th stomach 500979 V. Description of the invention (35) (SEM) Measurement of the obtained pattern. 1 Line-space pairs of 30 nm and above can be clearly resolved with clear contours. The light energy required for this formulation is in the range of 20-30 mJ / cm2. 500979

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Claims (1)

500979500979 >年告月本 修正本 案號 89104Π2 六、申請專利範圍 1 · 一種光阻組合物,其包含(a)環烯類聚合物、(b )對光 敏感的酸產生劑,和(c )飽和類固醇成份、疏水性非類固 醇脂環成份或含有多個酸不安定連接基之疏水性非類固醇 多脂環成份,其中該組合物包含0· 5-20重量% (b)及5-25重 i%(c),以環烯類聚合物(a)的總量為基準,其中該環烯 類聚合物包含: i ) 10-80莫耳%具有極性官能基的環烯單位,和 ii) 20-90莫耳%具有酸不安定部份之環烯單位,該 酸不安定部份可抑制在鹼性水溶液中的溶解度。 2. 根據申請專利範圍第1項之組合物,其中該環烯類聚 合物基本上是由環烯單位i )和環浠單位i i )所組成的。 3. 根據申請專利範圍第1項之組合物,其中該極性官能 基部份是選自包含pKa約1 3或更低的酸性極性官能基部份 和pKa大於1 3之非酸性極性官能基部份或其組合物。 4. 根據申請專利範圍第3項之組合物,其中該環烯單位 i)包含一個酸性極性官能基部份,該部份具有一個選自包 含羧基、氨續醯基、氟醇和其他酸性極性基之酸性極性 基。 5. 根據申請專利範圍第4項之組合物,其中該酸性極性 基是一個羧基。 6. 根據申請專利範圍第1項之組合物,其中該環烯單位 i i )包含一個酸-不安定保護基,該保護基具有一個選自包 含三級烷基羧基酯、三級環烷基羧基酯、酯縮酮和酯乙縮 酸之部份。> Annual Report This Amendment No. 89104Π2 VI. Patent Application Scope 1. A photoresist composition comprising (a) a cycloolefin polymer, (b) a light-sensitive acid generator, and (c) saturation Steroid component, hydrophobic non-steroidal alicyclic component or hydrophobic non-steroidal polyalicyclic component containing multiple acid-labile linkers, wherein the composition contains 0.5-20% by weight (b) and 5-25% by weight i % (c), based on the total amount of cycloolefin-based polymer (a), wherein the cycloolefin-based polymer contains: i) 10-80 mole% of cycloolefin units having polar functional groups, and ii) 20 -90 mole% of a cycloolefin unit having an acid-labile portion, which can inhibit the solubility in an alkaline aqueous solution. 2. The composition according to item 1 of the scope of patent application, wherein the cycloolefin polymer is basically composed of a cycloolefin unit i) and a cyclofluorene unit ii). 3. The composition according to item 1 of the scope of patent application, wherein the polar functional group portion is selected from the group consisting of an acidic polar functional group portion having a pKa of about 13 or less and a non-acidic polar functional group portion having a pKa of greater than 13 Servings or combinations thereof. 4. The composition according to item 3 of the scope of patent application, wherein the cyclic olefin unit i) comprises an acidic polar functional group moiety which has a member selected from the group consisting of a carboxyl group, an aminofluorenyl group, a fluoroalcohol and other acidic polar groups. The acidic polar group. 5. The composition according to item 4 of the patent application, wherein the acidic polar group is a carboxyl group. 6. The composition according to item 1 of the scope of patent application, wherein the cycloolefin unit ii) comprises an acid-labile protecting group having a member selected from the group consisting of a tertiary alkyl carboxylate, a tertiary cycloalkyl carboxyl group Ester, ester ketal and ester acetic acid. O:\62\62934.ptc 第43頁 500979 案號 89104172 年j月曰_修正 六、申請專利範圍 f其中該飽和類固 ,該骨架具有至少 *其中該飽和類固 其係選自包含羥 ,其中該飽和類固 7. 根據申請專利範圍第1項之組合物 醇包含至少一種飽和C17類固醇脂環骨架 一個側邊酸不安定保護基。 8. 根據申請專利範圍第7項之組合物 醇化合物另外包含一個額外側邊部份, 基、甲醯基、乙醯基和氟乙醯基。 9. 根據申請專利範圍第1項之組合物 醇成份包含一個類固醇化合物,其係選自包含贍酸酯類、 經酯改質之石膽酸酯、經酯改質之膽酸酯和被間隔之石膽 酸酉逢。 10. 根據申請專利範圍第9項之組合物,其中該飽和類 固醇成份是選自包含第三-丁基石膽酸酯、第三-丁基去氧 基膽酸酯、第三-丁基膽酸酯、第三-丁基-3 -三氟乙醯基 石膽酸酯、第三-丁基-3-乙醯基石膽酸酯、第三-丁基-3-特戊醯基石膽酸酯、第三-丁基-3, 7, 12 -三甲醯基膽酸 酯、第三-丁基-皇-(3,7,12-三氟乙醯基)膽酸酯和被隔開 之石膽酸酯結構:O: \ 62 \ 62934.ptc Page 43 500979 Case No. 89104172 _ Amendment VI. Patent application scope f Where the saturated solid, the skeleton has at least * where the saturated solid is selected from the group containing hydroxyl, Wherein the saturated steroid 7. The composition alcohol according to item 1 of the scope of patent application contains at least one saturated C17 steroid alicyclic skeleton with one acid-labile protecting group on one side. 8. The composition according to item 7 of the patent application. The alcohol compound further contains an additional side moiety, a methyl group, a methyl group, an ethyl group and a fluoroethyl group. 9. The alcohol component of the composition according to item 1 of the patent application scope comprises a steroid compound selected from the group consisting of phosphonates, ester-modified lithocholic acid esters, ester-modified cholic acid esters, and spacers. The stone cholic acid meets each other. 10. The composition according to item 9 of the scope of patent application, wherein the saturated steroid component is selected from the group consisting of tertiary-butyllithium cholate, tertiary-butyldeoxycholate, tertiary-butylcholic acid Esters, tertiary-butyl-3 -trifluoroacetamidinocholate, tertiary-butyl-3-ethynylcholate, tertiary-butyl-3-pentylfluorenylcholate, Tertiary-butyl-3, 7, 12-trimethylfluorenylcholate, tertiary-butyl-huang- (3,7,12-trifluoroethylfluorenyl) cholate, and separated stone gallbladder Ester structure: mm O:\62\62934.ptc 第44頁 500979 修正 案號89104172 吁丨年3月:f曰 六、申請專利範圍O: \ 62 \ 62934.ptc Page 44 500979 Amendment No. 89104172 Appeal March: f F. Scope of Patent Application O-fBu 其中tBu是一種三級丁基。 11. 根據申請專利範圍第1 0項之組合物,其中該飽和類 固醇成份是第三-丁基-3-三氟乙醯基石膽酸酯。 ί I Ϊ O:\62\62934.ptc 第45頁 500979 修正 _案號 89104172 六、申請專利範圍 12. 根據申請專利範圍第1項之組合物,其中該疏水性 非類固醇脂環成份至少包含一個非類固醇C6或碳數較高的 脂環部份。 13. 根據申請專利範圍第1項之組合物,其中該疏水性 非類固醇脂環化合物具有至少一個側邊酸不安定保護基。 14. 根據申請專利範圍第1 2項之組合物,其中該疏水性 非類固醇脂環成份包含一個酸不安定保護基,其係選自包 含三級烷基羧基酯、三級環烷基羧基、酯縮酮和酯乙縮 醛。 15. 根據申請專利範圍第1 4項之組合物,其中該疏水性 非類固醇脂環成份包含至少一個非類固醇C1Q -C3Q脂環部 份。 16. 根據申請專利範圍第1 4項之組合物,其中該疏水性 非類固醇脂環成份包含一個三級烷基羧基酯。 17. 根據申請專利範圍第1項之組合物,其中該疏水性 非類固醇多脂環成份包含至少兩個非類固醇或碳數較高 的脂環部份。 18. 根據申請專利範圍第1 7項之組合物,其中該疏水性 非類固醇多脂環成份包含兩個酸不安定連接部份。 19. 根據申請專利範圍第1 8項之組合物,其中該疏水性 非類固醇脂環成份包含酸不安定連接部份,其係選自包含 三級烷基羧基酯、三級環烷基羧基、酯縮酮和酯乙縮醛。 20. 根據申請專利範圍第1 7項之組合物,其中該疏水性 非類固醇脂環成份包含至少兩個非類固醇C1Q-C3Q脂環部O-fBu where tBu is a tertiary butyl. 11. The composition according to item 10 of the scope of patent application, wherein the saturated steroid component is tertiary-butyl-3-trifluoroacetamidinocholate. ί I Ϊ O: \ 62 \ 62934.ptc Page 45 500979 Amendment_Case No. 89104172 VI. Patent Application Range 12. The composition according to item 1 of the patent application range, wherein the hydrophobic non-steroidal alicyclic component contains at least one Non-steroid C6 or higher alicyclic parts. 13. The composition according to item 1 of the patent application scope, wherein the hydrophobic non-steroidal alicyclic compound has at least one side acid labile protecting group. 14. The composition according to item 12 of the scope of patent application, wherein the hydrophobic non-steroidal alicyclic component comprises an acid labile protective group selected from the group consisting of tertiary alkyl carboxylate, tertiary cycloalkyl carboxyl, Ester ketals and ester acetals. 15. The composition according to item 14 of the scope of patent application, wherein the hydrophobic non-steroidal alicyclic component comprises at least one non-steroidal C1Q-C3Q alicyclic component. 16. A composition according to item 14 of the patent application, wherein the hydrophobic non-steroidal alicyclic component comprises a tertiary alkyl carboxylate. 17. The composition according to item 1 of the patent application scope, wherein the hydrophobic non-steroidal polyalicyclic component comprises at least two non-steroidal or alicyclic moieties having a higher carbon number. 18. The composition according to item 17 of the application, wherein the hydrophobic non-steroidal polyalicyclic component comprises two acid-labile linking moieties. 19. The composition according to item 18 of the scope of patent application, wherein the hydrophobic non-steroidal alicyclic component comprises an acid-labile linking moiety selected from the group consisting of a tertiary alkyl carboxylate, a tertiary cycloalkyl carboxyl, Ester ketals and ester acetals. 20. The composition according to item 17 of the scope of patent application, wherein the hydrophobic non-steroidal alicyclic component comprises at least two non-steroidal C1Q-C3Q alicyclic portions O:\62\62934.ptc 第46頁 500979 案號 89104172 修正 六、申請專利範圍 份。 21. 根據 不安定連接 酯〇 2 2. 根據 包含5-25重 申請專利範圍第1 8項之組合物,其中該兩個酸 部份是兩個彼此鍵結在一起的三級烧基魏基 申請專利範圍第1項之組合物,其中該組合物 量%之該疏水性非類固醇脂環成份,以該環烯 類聚合物的重量為基準。 在基材上形成圖案化光阻結構之方法,該方法 23 包括 成一 光敏 固醇 醇多 感的 光阻 露出 24 合輪 份可 .一種 (A) 光阻層 感的酸 脂環成 脂環成 (B) 酸產生 (C) 層經曝 該基材 . 根據 包含: i) i i ) 抑制在 塗佈一 ’該光 產生劑 份或含 份, 將該基 光阻組合勒於該基材上以在該基材上形 阻組合物包含(a )環烯類聚合物、(b )對 ,和(c )飽和類固醇成份、疏水性非類 有多個酸不安定連接基之疏水性非類固 材如圖案般曝露於輻射下,因此對光敏 劑在該光阻層經該輻射曝照的區域產生酸,和 以一種鹼性顯像劑水溶液接觸該基材,因此該 光的區域選擇性地被該顯像劑溶液所溶解以顯 上該圖案化光阻結構。 申請專利範圍第2 3項之方法,其中該環烯類聚 具有極性官能基部份的環烯單位,和 具有酸不安定部份之環烯單位,該酸不安定部 鹼性水溶液中的溶解度。O: \ 62 \ 62934.ptc Page 46 500979 Case No. 89104172 Amendment 6. Scope of patent application. 21. Linking esters according to instability 02. 2. According to a composition comprising 5 to 25-requested patents in the scope of item 18, wherein the two acid moieties are two tertiary alkyl radicals which are bonded to each other. The composition of claim 1 in the patent application range, wherein the hydrophobic non-steroidal alicyclic component in the composition% is based on the weight of the cycloolefin polymer. A method for forming a patterned photoresist structure on a substrate, the method 23 includes forming a photosensitive sterol multi-sensitive photoresist to expose 24 parts. A kind of (A) photo-resistive acid alicyclic ring becomes an alicyclic ring. (B) The acid-generating (C) layer is exposed to the substrate. According to the following: i) ii) inhibiting the coating of the photo-generating agent or the component, the base photoresist combination is placed on the substrate to The steric hindrance composition on the substrate comprises (a) a cycloolefin polymer, (b) pairs, and (c) a saturated steroid component, and a hydrophobic non-hydrophobic non-steroid having multiple acid-labile linkers. The material is exposed to radiation as a pattern, so that the photosensitizer generates an acid in the area where the photoresist layer is exposed to the radiation, and contacts the substrate with an aqueous alkaline developer solution, so the area of light is selectively Dissolved by the developer solution to develop the patterned photoresist structure. The method of claim 23, wherein the cycloolefin is a cycloolefin unit having a polar functional group portion, and the cycloolefin unit having an acid-labile portion, and the acid-labile portion is soluble in an alkaline aqueous solution. O:\62\62934.ptc 第47頁 500979 案號 89104Π2 六、申請專利範圍 2 5. 根據申 所用的該輻射 2 6.根據申 驟(B)和(C)之 27. —種在 θ 修正 係選自 形成一 對光敏 類固酵 固醇多 感的酸 光阻層 露出 該光阻 28. 合物包 份可抑 包含半 (A) 提 (B) 塗 光阻層 感的酸 脂環成 脂環成 (C) 將 產生劑 (D) 以 經曝光 個圖案 (E ) 4k 結構圖 根據申 含: 1 ) 具 i i )具 制在驗 請專利範圍第 是1M ^ i弟23項之方法 ί糞利/米紫外輻射。 Β 魏圍第23項之方法 間被烘烤。 〶之方法 基材上形成觀 導體、陶ϊ f案化材料結構之方法,該材料 供一個且二 金屬,該方法包括: : 具有該材料層之A枯, 佈一光阻敏人1 滑之暴材 ,該光阻組iff該基材上以在該材料層上 產生劑,和f L含(a)環烯類聚合物、(b) 份或含有多個c 和類固醇成份、疏水性非 份, k不安定連接基之疏水性非類 該基材如圖牵& # 在該光阻層經輻射下,因此對光敏 -種驗性顯像;水生酸,;也被該顯像劑溶液所溶解以顯 穿該光阻結構圖案的空 案轉移至該材料Η:白處冰入该材料層將 請專利範圍第27項之方法,其中 長甲这%烯類聚有極性官能基部份的環烯單位,和 有酸不安定部份之環烯單位,該酸 性水溶液中的溶解度。 不文疋部 其中步騾(B)中 其中該基材在步O: \ 62 \ 62934.ptc P.47 500979 Case No. 89104Π2 6. Scope of patent application 2 5. According to the radiation used in the application 2 6. According to 27 (B) and (C) of the application.-Kind of correction in θ It is selected from the group consisting of a pair of photosensitive steroid sterol-sensitive acid photoresist layers to expose the photoresist 28. The compound inclusions can suppress the acid alicyclic ring containing half (A) and (B) photoresist layer coating Alicyclic (C) The generator (D) is exposed to a pattern (E) 4k structure drawing according to the application: 1) ii) Manufactured in the method of examination patent scope is 1M ^ 23 method Feces / meter UV radiation. Β Weiwei method 23 is baked. Method of forming a method of forming a conductor structure on a substrate, and forming a material structure on the substrate. The material is provided for one and two metals. The method includes: A with the material layer, a photoresist, and a slippery one. Storm material, the photoresist group iff on the substrate to generate an agent on the material layer, and f L contains (a) cycloolefin-based polymer, (b) parts or contains multiple c and steroid components, hydrophobic non- Part, the hydrophobicity of the k labile linker is not similar to the substrate as shown in Figure &# under the radiation of the photoresist layer, so the photosensitivity-type visual inspection; aquatic acid ,; also by the developer The solution dissolved by the solution to show the photoresist structure pattern is transferred to the material. 处: Ice into the material layer in the white part will ask for the method in the scope of patent No. 27, in which the% ethylene of long methyl group has a polar functional group. Solubility in this acidic aqueous solution, and cycloolefin units with acid labile parts. The unwritten part where step (B) where the substrate is in step 500979 、 _案號89104172 Θ丨年j月必曰 修正__ 六、申請專利範圍 29. 根據申請專利範圍第2 7項之方法,其中該材料是金 屬。 3 0. 根據申請專利範圍第2 7項之方法,其中該蝕刻包括 反應性離子儀刻。 31. 根據申請專利範圍第2 7項之方法,其中在該材料層 和該光阻層之間提供至少一中間物層,而且步驟(E)包含 蝕穿該中間層。 32. 根據申請專利範圍第2 7項之方法,其中該輻射的波 長為約1 9 3毫微米。 3 3. 根據申請專利範圍第2 7項之方法,其中該基材在步 驟(C )和(D )之間被烘烤。 3 4 · —種光阻組合物,其包含(a )環烯類聚合物、(b)對 光敏感的酸產生劑,和(c)在1 9 3毫微米輻射下實質上是透 明的巨大疏水性添加劑,其中該組合物包含0 . 5 - 2 0重量 (b)及5-25重量(c),以環烯類聚合物(a)的總量為基準, 其中該環烯類聚合物包含: i ) 5-4 0莫耳%具有酸性極性官能基部份之環烯單 位,該酸性極性官能基部份可促進在鹼性水溶液中的溶解 度,和 i i ) 具有酸不安定部份之環烯單位,該酸不安定部 份可抑制在驗性水溶液中的溶解度。 3 5. 根據申請專利範圍第3 4項之組合物,其中該環烯類 聚合物基本上是由環烯單位i )和環烯單位i i )所組成的。 36. 根據申請專利範圍第34項之組合物,其中該環烯單500979, _Case No. 89104172, _ _ must be said in the month of January __ Sixth, the scope of patent application 29. The method according to item 27 of the scope of patent application, where the material is metal. 30. The method according to item 27 of the patent application scope, wherein the etching includes reactive ion instrumentation. 31. The method according to item 27 of the scope of patent application, wherein at least one intermediate layer is provided between the material layer and the photoresist layer, and step (E) includes etching through the intermediate layer. 32. The method according to item 27 of the scope of patent application, wherein the wavelength of the radiation is about 193 nm. 3 3. The method according to item 27 of the scope of patent application, wherein the substrate is baked between steps (C) and (D). 3 4 · A photoresist composition comprising (a) a cycloolefin polymer, (b) a light-sensitive acid generator, and (c) a substantially transparent giant under radiation of 193 nm A hydrophobic additive, wherein the composition comprises 0.5 to 20 weight (b) and 5 to 25 weight (c), based on the total amount of the cycloolefin polymer (a), wherein the cycloolefin polymer Containing: i) 5 to 40 mole% of a cycloolefin unit having an acidic polar functional moiety, the acidic polar functional moiety can promote solubility in an alkaline aqueous solution, and ii) an acidic unstable moiety Cycloalkene units, this acid-labile portion can inhibit solubility in aqueous solutions. 35. The composition according to item 34 of the scope of the patent application, wherein the cycloolefin polymer is basically composed of a cycloolefin unit i) and a cycloolefin unit ii). 36. The composition according to item 34 of the claims, wherein the cycloolefin O:\62\62934.ptc 第49頁 500979 修正 _案號 89104172 六、申請專利範圍 位i )包含一個酸性極性官能基部份,該部份具有一個選自 包含羧基、氨磺醯基、氟醇和其他酸性極性基之酸性基。 37. 根據申請專利範圍第3 6項之組合物,其中該酸性極 性基是一個羧基。 38. 根據申請專利範圍第34項之組合物,其中該環烯單 位i i )包含一個酸-不安定保護基,該保護基具有一個選自 包含三級烷基羧基酯、三級環烷基羧基酯、酯縮酮和酯乙 縮醛之部份。O: \ 62 \ 62934.ptc Page 49 500979 Amendment_ Case No. 89104172 VI. Patent application scope bit i) Contains an acidic polar functional group moiety, which has a member selected from the group consisting of carboxyl, sulfamoyl, and fluorine An acidic group of alcohols and other acidic polar groups. 37. The composition according to item 36 of the application, wherein the acidic polar group is a carboxyl group. 38. The composition according to item 34 of the scope of patent application, wherein the cycloolefin unit ii) comprises an acid-labile protecting group having a member selected from the group consisting of a tertiary alkyl carboxylate, a tertiary cycloalkyl carboxyl group Part of esters, ketals and acetals. O:\62\62934.ptc 第50頁O: \ 62 \ 62934.ptc Page 50
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