TW495135U - Multiple heat radiating module - Google Patents

Multiple heat radiating module

Info

Publication number
TW495135U
TW495135U TW090208104U TW90208104U TW495135U TW 495135 U TW495135 U TW 495135U TW 090208104 U TW090208104 U TW 090208104U TW 90208104 U TW90208104 U TW 90208104U TW 495135 U TW495135 U TW 495135U
Authority
TW
Taiwan
Prior art keywords
heat radiating
multiple heat
radiating module
module
radiating
Prior art date
Application number
TW090208104U
Other languages
English (en)
Inventor
Wen-Shi Huang
Guo-Jeng Lin
Tzu-Liang Lin
Tzung-Yu Lei
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW090208104U priority Critical patent/TW495135U/zh
Priority to JP2001350328A priority patent/JP3680018B2/ja
Priority to US10/143,303 priority patent/US6648065B2/en
Priority to DE20207467U priority patent/DE20207467U1/de
Publication of TW495135U publication Critical patent/TW495135U/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/007—Axial-flow pumps multistage fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
TW090208104U 2001-05-18 2001-05-18 Multiple heat radiating module TW495135U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW090208104U TW495135U (en) 2001-05-18 2001-05-18 Multiple heat radiating module
JP2001350328A JP3680018B2 (ja) 2001-05-18 2001-11-15 多重散熱モジュール
US10/143,303 US6648065B2 (en) 2001-05-18 2002-05-09 Heat-dissipating module
DE20207467U DE20207467U1 (de) 2001-05-18 2002-05-13 Wärmeableitsystem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090208104U TW495135U (en) 2001-05-18 2001-05-18 Multiple heat radiating module

Publications (1)

Publication Number Publication Date
TW495135U true TW495135U (en) 2002-07-11

Family

ID=21683845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090208104U TW495135U (en) 2001-05-18 2001-05-18 Multiple heat radiating module

Country Status (4)

Country Link
US (1) US6648065B2 (zh)
JP (1) JP3680018B2 (zh)
DE (1) DE20207467U1 (zh)
TW (1) TW495135U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101965117A (zh) * 2009-07-22 2011-02-02 鸿富锦精密工业（深圳）有限公司 散热装置
CN102200137A (zh) * 2003-03-20 2011-09-28 亨泰尔公司 空气调节系统中的风扇阵列风扇部分、将空气供给到建筑物的方法
CN106762771A (zh) * 2017-02-09 2017-05-31 联想(北京)有限公司 风扇控制系统、散热系统以及风扇控制方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW568299U (en) * 2003-04-01 2003-12-21 Delta Electronics Inc Heat dissipation module
TW566073B (en) * 2003-04-11 2003-12-11 Delta Electronics Inc Heat-dissipating device and a housing thereof
DE10335329A1 (de) * 2003-08-01 2005-03-03 Asia Vital Components Co., Ltd. Wärmeabführungssystem für elektronisches Bauelement
US20050068729A1 (en) * 2003-09-25 2005-03-31 Lin Jen Cheng Dual-fan heat dissipator
US20050163615A1 (en) * 2004-01-23 2005-07-28 Chheda Sachin N. Redundant fan system in a turbo cooler assembly
US20050167083A1 (en) * 2004-01-29 2005-08-04 Belady Christian L. Heat sink including redundant fan sinks
US20050219821A1 (en) * 2004-03-30 2005-10-06 Power Cooler Enterprise Co., Ltd. Fan and heat sink arrangement
US7120019B2 (en) * 2004-08-18 2006-10-10 International Business Machines Corporation Coaxial air ducts and fans for cooling and electronic component
US7866959B2 (en) * 2005-01-24 2011-01-11 Hewlett-Packard Development Company, L.P. Fan clutch for an electronics cooling fan
US7324339B2 (en) * 2005-12-21 2008-01-29 International Business Machines Corporation Dual impeller push-pull axial fan heat sink
US20070239688A1 (en) * 2006-04-11 2007-10-11 Clark David K System and method for altering search result sequence based on user preferences
JP3904595B1 (ja) * 2006-11-08 2007-04-11 山洋電気株式会社 二重反転式軸流送風機
CN101452328A (zh) * 2007-12-03 2009-06-10 鸿富锦精密工业（深圳）有限公司 电脑散热装置
TW201120319A (en) * 2009-12-02 2011-06-16 Hon Hai Prec Ind Co Ltd Fan module and heat disspation device incorporating the same
CN102086876A (zh) * 2009-12-03 2011-06-08 鸿富锦精密工业（深圳）有限公司 风扇模组及使用该风扇模组的散热装置
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
TWI531304B (zh) * 2012-02-20 2016-04-21 鴻準精密工業股份有限公司 散熱模組
KR101625828B1 (ko) * 2014-12-08 2016-05-31 주식회사 토네이도시스템즈 스월러팬을 구비한 배기장치 모듈

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297617A (en) * 1992-12-22 1994-03-29 Edward Herbert Fan assembly with heat sink
US5745041A (en) * 1995-07-11 1998-04-28 Dell U.S.A., L.P. System for dissipating heat from a power supply
US6526333B1 (en) * 1997-05-13 2003-02-25 Micron Technology, Inc. Computer fan speed control system method
US6219242B1 (en) * 1999-10-21 2001-04-17 Raul Martinez Apparatus for cooling a heat producing member
US6396688B1 (en) * 2000-03-29 2002-05-28 Dell Products L.P. Series fan speed control system
US6343014B1 (en) * 2000-08-11 2002-01-29 Ming-Chuan Yu CPU cooling arrangement
TW532738U (en) * 2001-03-27 2003-05-11 Foxconn Prec Components Co Ltd Heat sink assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102200137A (zh) * 2003-03-20 2011-09-28 亨泰尔公司 空气调节系统中的风扇阵列风扇部分、将空气供给到建筑物的方法
CN101965117A (zh) * 2009-07-22 2011-02-02 鸿富锦精密工业（深圳）有限公司 散热装置
CN101965117B (zh) * 2009-07-22 2015-03-18 赛恩倍吉科技顾问（深圳）有限公司 散热装置
CN106762771A (zh) * 2017-02-09 2017-05-31 联想(北京)有限公司 风扇控制系统、散热系统以及风扇控制方法
CN106762771B (zh) * 2017-02-09 2019-01-15 联想(北京)有限公司 风扇控制系统、散热系统以及风扇控制方法

Also Published As

Publication number Publication date
US6648065B2 (en) 2003-11-18
JP2002353678A (ja) 2002-12-06
US20020170703A1 (en) 2002-11-21
JP3680018B2 (ja) 2005-08-10
DE20207467U1 (de) 2002-10-17

Similar Documents

Publication Publication Date Title
GB2375818B (en) Heat exchanger
TW516812U (en) Heat dissipating module
TW495135U (en) Multiple heat radiating module
EP1383169A4 (en) heat sink member
EP1370818A4 (en) Heat Exchanger
GB2373571B (en) Heat exchanger
TW588932U (en) Heat sink module
GB2375817B (en) Heat exchanger
EP1359384A4 (en) HEAT EXCHANGER
EP1365204A4 (en) Heat Exchanger
EP1420222A4 (en) HEAT EXCHANGER
GB0208701D0 (en) Heat radiator
TW592340U (en) Heat dissipating module
GB0128830D0 (en) Low-temperature radiator
GB0114361D0 (en) Heat exchanger
TW495013U (en) Heat exchanger
TW526960U (en) Heat sink module
TW527076U (en) Improved heat sink module
TW535938U (en) Heat dissipating module
TW498995U (en) Heat dissipation module
TW555059U (en) Heat exchange module
TW516806U (en) Heat exchange module
TW586648U (en) Heat dissipation module
HU0101051D0 (en) Spiral-plate heat exchanger
TW491510U (en) Heat sink module