494717 德-$久 匕:‘娜押…曰 A7 概」 五、發明説明（，） (請先閲讀背面之注意事項再填寫本頁) 本發明俗關於一種可擴充之模組式周邊設備，可用來 控制及/或監視技術性程序。此周邊設備是由基本模組 構成，至少有一電源電壓可傳送至基本模組，至少有一 擴充模組可串聯在此基本模組上。於是，基本模組以及 至少一可串聯之擴充模組都可與作用器及/或感測器相 連接以便控制及/或監視技術程序。 上述技藝之周邊設備在先前技藝中通常已為人所知。 西門斯（Siemens)公司例如已提供模組式周邊設備ET200U 。在傳統之自動化設備的結構中，感測器及作用器偽直 接與中央之自動化設備相連接。這在廣泛分支式設備中 導致具有高的導線費用之巨量導線以及在變化上及擴充 上較小之彈性。 分散式周邊設備因此在程序和中央自動化設備之間形 成一種有效之介面。程序信號（與感測器和作用器之交 互作用）之處理和轉換直接在空間中屬於此程序或部份 程序的位置前進行。介於周邊設備和中央自動化設備之 間的連接因此通常都經由陣列匯流排而完成且因此經由 各別之連接件而完成。 經濟部中央標準局員工消費合作社印製 此外，在先前技藝中，具有高级保護方式（I P 6 6 / I P 6 7 ) 之單件式周邊設備已為人所知，例如，由西門斯公司所 銷售之周邊設備ET200C,其主要特性是用在較惡劣之工 業環境中。 在高级保護方式中，同時&是模組式可擴充之周邊設 備則尚未為人所知。此外，在先前技術中至今尚未有模組 式可擴充之周邊設備為人所知，其中介於各模組之間所 494717 A7 B7 五、發明説明（2 經濟部中央標準局員工消費合作社印製 的監 前組部擴 I 部串 之據 上組上備 ϊβ 。利下 類或 之部上和Μ下相 聯依 組模組設 件專如 之 \ 。項上組件 組互 串之 模之模邊 ” Μ 接請明 簾及的 1 組模組),模m)可件 一應一周待^ 連申説 電 制充第模充部le充0Γ種組 每對另之等 _ 的之單 或 控擴圍本擴下fi擴(f此部 ：相到構T,TU 間片簡 頭 便可範基由組Γ0或式 ··下 示在受結畠 ^ 之相式 插 以式利由組模(P，形 示組 顯定會種 件及圖 如 備組專組模本型件其 顯模 備固不此卩，|^組式 。 如 鬆 例 設模請模充基外組依 備與 設只作在 j 部圖中 需 邊是申本擴，之部可 設其 邊自操。(^*^下據明 不 周備據基，成聯下件 邊藉。周各之擋刻 組依説 間 種設依：成構串組組 周是成此件件阻時^； 模節之 · 期 一邊偽成構件可模部 此這達，元元之一 於細例 4 充 供周的達件組有充下 ，c 而中定定件任 介或施 -擴 提種目式組部具擴組 中的接構固固組在畠開點實 在 是此一方部下都和模 構撑連結一此部件 鬆優述 接 c 的，此述下組件件充 結支之之少且下組M全它下 連件目序之下組模組組擴 之動開利至，組部¾完其在 性元之程備以模充部部一 利自鬆有以上模上㈣必之述 電觸明性設而本擴下下另 有可可一偽件或組 不明描 導接發術邊份基及組組和 一是的另件組件模PJ或發而 之外本技固部及件模模’件 c 在構式在組部組 ，)^件本圍 需額 視 言件組充本組聯 結形 部下部中的組 範 ----------批衣------1T------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 經濟部中央標準局員工消費合作社印製 494717 A7 B7 五、發明説明（3 ) 第1圖在組合狀態之可擴充模組式周邊設備。 第2圖以部份剖面圖表示之可擴充模組式周邊設備。 ^ 第3圖互相串聯之模組下部組件的俯視圖。 第4圖沿著切割線I V經由周邊設備之切面圖。 第5圖沿著切割線V經由周邊設備之切面圖。 依據第1圖，基本模組B Μ由基本模組下部組件B MU和 基太模組上部組件Β Μ 0所構成。相對地，擴充模組Ε Μ由 擴充模組下部組件ΕΜΙΙ和擴充模組上部組件ΕΜΟ所構成。 基本模組下部組件BMU和擴充模組下部組件EMU具有一 種可串聯之外型，使基本模組下部組件BMU和擴充模組 下部組件EMU,或擴充模組下部組件EMU和另一擴充模組 下部組件EMU可依其形式而串聯。在此實施例中，有一 種階梯外型可供使用。 第2圖顯示以部份剖面圖表示之周邊設備PG,其中模 組下部組件BMU, EMU已經互相串聯。模組下部組件BMU, ΕΜϋ之串聯可在通道上準確地進行，這是因為模組下部 組件BMU, EMU可藉共同作用之形式連接口 1而不是藉圖 示之形式連接元件（例如，燕尾槽及燕尾槽口 1)來引導 。藉模組下部BMU, EMU之依據形式的連接，則模組式周 邊設備PG之可串聯的結構形成自動支撑。 此種在通道上準確的引導是需要的，於是密封糸統之 元件可準確地互相抓握。為了達到高级保護方式，密封 条統在此實施例中偽以彈簧-導槽-組合之方式構成。模 組上部組件BMO, EMO抓握在模組下部組件BMU, BMU之導 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） I •裝 訂 (請先閲讀背面之注意事項再填寫本頁) 494717 A7 B7 五、發明説明（4 ) 經濟部中央標準局員工消費合作社印製 槽N中，，，塾圈上有細孔而以密封方式嵌入模組下部組件 BMU, EMU之導槽N中。不但各別之模組BM, EM而且可擴 充之固邊設備PG於是都需符合DIN IEC 529中保護方式 I P 6 5 之準則（c r i t e r i a )。 模組下部組件BMU, EMU通常是固定在一覆蓋面上，模 組下部組件B M U , E M U因此有一値鑽孔2，固定元件（例如 螺絲）可導入鑽孔2中。模組下部組件BMU，EMU可利用此 固定元件而各自固定在覆蓋面上。 亙相串聯之模組下部組件BMU, EMU藉螺絲旋緊或藉同 樣功用之固定元件而互相固定。模組下部組件BMU，EMU 具有用於此目的之鑽孔3, 3’。螺絲可導入鑽孔3,3’中。 在一未顯示之實施形式中，互相串聯之模組下部組件BMU。 EMU的固定方式偽藉導入楔形之插銷元件而達成。 由第2圖又待別可得知，模組上部組件BMO, EMO不需 鬆開模組下部組件BMU, ΕΜϋ卽可由各自之下部組件BMU, EMU取下，因此在等待情況或在改變設備組態時時可很 容易地替換。這樣可産生之情況是：在一有利之結構中 ，每一模組上部組件BMO, EMO各自以至少一固定元件而 只固定在對應之模組下部組件BMU, EMU上，固定元件之 操作不會受到其它模組上部組件BMO, EMO或模組下部組 件EMU, EMU之阻擋。模組上部組件EMO, EMO因此具有鑽 孔4'固定元件（例如，螺絲）可通過此鑽孔4’，固定元 件抓握在模組下部組件ΒΜϋ, EM11中對應之鑽孔4中，使 模組上部組件BMO, ΕΜΟ可固定在模組下部組件BMU, EMU 一 6 一 ---------ί i 裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準（CNS )八4規格（210X 297公釐） 經濟部中央標準局員工消費合作社印製 494717 A7 B7 五、發明説明（5 ) 上，、 在第1圖或第2圖實施例中，基本模組BM具有三個終 端捅頭AS1, AS2，AS3。二個此種終端插頭AS2, AS3共同 安裝在插頭板SP上。至少有一電源電壓通常是經由終端 插頭A S 1而供應至周邊設備P G。陣列匯流排導線例如經由 終端捅頭AS2, AS3而藉周邊裝置來形成回路，因此有利 之方式是：終端插頭AS2, AS3安裝在插頭板SP上，則當 進入及出去之陣列匯流排導線連接在終端插頭AS2, AS3 中時，則在鬆開由終端插頭AS2, AS3及插頭板SP所構成 之插頭單元此一過程中即不需中斷此陣列匯流排導線。 介於其它可能之周邊設備P G之間的通信號連接因此可以 繼鑛存在。 模組式周邊設備PG之各別模組BM, EM的模組下部組件 BMU, EMU具有許多接觸芫件1^,這些接觸元件LE可進一 步引導信號電壓或電源電壓。接觸元件LE基本上偽以U 形之接觸元件L E構成且配置在串聯外型（P r 〇 f i 1 e )之側 面上之模組下部組件中。 U形接觸元件LE的一腳位於模組BM, EM内部所設立之 模組上部組件BMO , EMO上，使ϋ形接觸元件LE中許多這 種腳形成一種内部接觸件IML(在本實施例中是一種内部 測量接觸條IML)。U形接觸元件LE之另一腳在模組ΒΜ, ΕΜ外部所設立之模組上部組件BMO, ΕΜΟ上，使II形接觸 元件LE中許多這種腳形成一種外部接觸件EML(在本實施 例中是一種外部測量接觸條E M L )。 - 7 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） ----------裝------訂------ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 494717 A7 B7 五、發明説明（6 ) 在串聯擴充模組E Μ於基本模組B Μ時，基本模組B Μ之外 部測暈接觸條E M L抓握在擴充模組Ε Μ中，使基本模組Β Μ 之外部測鼍接觸條E M L位於串聯擴充模組Ε Μ之内部測量 接觸條I M L的對而。為了將另一擴充模組Ε Μ串聯於一擴 充樽組Ε Μ上，上述之情況可對應地適用。此外，它們可 特別由第2圖中之圖式清楚地看出。 不會受另一串聯擴充模組Ε Μ所覆蓋之此種外部測量接 觸條Ε M L會受到一種特殊之末端件E S所覆蓋。接觸式保 護以同一方式藉末端件ES而達成，就像對抗式保護技術 所需之密封一樣，此外，在基本上亦可保持擴充模組Ε Μ 為相同結構，使恃殊之擴充模組EM作為終端模組是不需 要的。 感測器及/或作用器可連接在一値電路上，此一電路 通常與模組上部組件Β Μ Ο , Ε Μ 0共同安裝或以連接方式安 裝，蕻此一電路可在接觸元件LE之至少一部份，各模組 下部組件Β Μ 1] , Ε Μ I)之間産生所望之導電性連接。 第3圖顯示在互相串聯之模組下部組件Β Μ Ο , Ε Μ 0上之 俯視圖。吾人可分別辨認内部測量接觸條I M L和外部測 景接觸條R M U測量接觸條I M L , Ε M L之接觸元件L Ε的一 部份作為進一步引導至少一電源電壓，接觸元件L Ε之另 一部份刖可進一步引導信號電壓。 依據第4 _，可恃別明白信號電壓之進一步引導。陣 列Κ流排導線可藉第4圖中未顯示之终端插頭A S 2， Λ S 3 iTu雜接汴（SI邊設備P G上。信號電壓藉此陣列匯流排導線 -8 ~ (請先閱讀背面、5·注意事項再填寫本頁) 裝· 線 經濟部中央標準局員工消費合作社印製 494717 A7 B7 五、發明説明（7 ) 而供應至固邊設備PG之基本模組BM中。信號電壓藉基本 樺紺B Μ中配置之電路板L P可到達基本模組B Μ之内部測量 接觸條丨M L的接觸元件L Ε中。經由電路板L Ρ上之導電軌 於是可在終端插頭A S 2 , A S 3之未顯示的接點和内部測量 接觸條I M L之接觸元件L E之間産生導電性之連接。 内部測量接觸條I M L之此種可進一步引導信號電壓的 接觸元件LE在以下偽以參考符號LES表示。 經由此種基本上為U形之接觸元件L E S ,則信號電壓 可育接位於外部測量接觸條E M L上，因此在空間上已經 位於串聯擴充模組ΕΜ之範圍中。信號電壓進一步由基本 模組ΒΜ之外部測量接觸條EML引導至擴充模組ΕΜ之内部 測量接觸條I M L傜經由電路板L Ρ之導電軌或另一適當之 連接元件而完成。在此實施例中，有一電路板LP配置在 擴充模組上部組件Ε Μ 0中。在將感測器L Ρ設定於擴充模組 下部組件EMU時，在擴充模組上部組件ΕΜΟ中之電路板LP 之接觸元件以及U形接觸元件LES之間會産生一種導電 性連接。在此實施例中，有一匯流排-AS 1C存在於電路 板LP中。藉此匯流排- ASIC可保證各擴充模組EM可整個 在匯流排上所發生之資料通信中。此外，匯流排-AS 1C 亦可接收經由匯流排傳送之信號電壓的修正值。進入匯 流排- ASIC之信號電壓當然會以先前所述之方式經由對 _之接觸元件LES而進一步傳導至其它可能之擴充模組EM 。若不使用匯流排-A S I C則進一步傳導信號電壓之接觸 元件經由電路板LP的一種1: 1-連接亦是可能的。 - 9 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ----------裝------訂------^ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 494717 A7 __B7 _ 五、發明説明（8 ) 負載電壓之進一步傳導特別可由第5圖得知。至少有 一電源電壓偽經由第5圖中未顯示之終端插頭AS1而傳 導牵固邊設備PG之基本模組BM。在基本模組BM内部藉導 霄件之律接元件VE可將電源電壓由終端插頭AS1未顯示 之接觸元件進一步傳導至基本模組BM之内部測量接觸條 I M L的接觸元件L E中。此一接觸元件L E (其專門用於電源 電壓之進一步傳導）在以下係以參考符號LEP表示。 相對於信號電壓而言，電源電壓由外部測量接觸條E M L 進一步傳導至内部測量接觸條I M L ,其間是經由適當之 配置在模組下部組件BMU, EMU的導電性連接元件VE，而 不經由模組上部組件BMO , EMO中所配置之電路。這樣所 具有之優點是：當實際上需要負載電壓時，在每一情況 中此負載電壓不必經由配置在模組上部組件BMO, EMO中 之電路來傳導，而是只施加於該處。 因此，有利之方式是：在配置於模組上部組件BMO , EMO 中之電路上只有電源電壓之選擇值可以測得，使得在電 路區域中只能使用此種在實際上亦需要之電源電壓。 這特別在模組上部組件BMO, EMO之區域中的散熱是有 利的，但對電磁輻射所可能産生之干擾而言這亦是有利 的。若在一配置於模組上部組件BMO , EMO中之電路中需 要一已確定之電源電壓時，則需形成相對應之接觸元件 ,使電源電壓可直接在電路板L P上測得。以此種方式， 則實際上只有此一電源電壓會傳導至在該處實際上亦需 要之電路中。所有其它電源電壓在上述形式1: 1之情況 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ---------—裝------訂------"線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 494717 A7 B7 五、發明説明（9 ) 中藉各自之連接元件V E而經由相關模組Β Μ， E Μ來形成連 貫之回路（1 ο ο Ρ )。 藉擴充模組Ε Μ之串聯，由此可産生一種自動形成之匯 流排，其中此匯流排可含有信號電壓及電源電壓。經由 電源電壓之測量及信號電壓之評估，則藉配置在模組上 部組件ΒΜΟ， ΕΚΟ中之電路可控制及/或監視技術性程序 。由於各自之電路是配置在模組上部組件ΒΜΟ, ΕΜΟ中， 各電路在等待情況中可容易地調換。在模組上部組件ΒΜΟ ,ΕΜΟ中之電路在電性上可經由適當之插頭連接件（特別 是計時器接觸件）而與各自之模組下部組件EMU，BMU或 與Ε Μ ϋ , Β Μ ϋ中之接觸元件L E相連接。U形接觸元件L E之 腳可依所需情況而具有分支，例如需多次測量各自之電 壓時需要分支。 所有之顯示元件和終端元件是配置在前側面上，亦即 在模組上部側面ΒΜΟ, ΕΜΟ上，使這些元件可容易地接近 以便連接技術性程序之感測器或作用器。 周邊設備PG之安裝位置是任意的，因此可依據需要對 準插入件或依據所需之使用方式來對準。藉著傳導信號 電壓或電源電壓之連接件在各自之模組外殼内仍保持完 整時，則對不期望之向外或向内的電磁輻射可逹成明顯 的保護作用。在非金屬性或只有一部份是金屬性模組外 殼之情況中，若模組外殼之保護作用不足，則一屏蔽件 可另外設置在模組外殼之内側面或外側面上。 在一特殊之末顯示之實施形式中，如上所述，模組下 部組件B M U , Ε M U及/或模組上部組件Β Μ Ο , Ε Μ 0亦可具有 -11- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） ---------, *裝------訂------Μ (請先閲讀背面之注意事項再填寫本頁) 494717 A7 B7 五、發明説明（、。） 待殊之形式相關元件以取代串聯之外型，藉此種元件亦 可使模組Β Μ， E Μ逹成一種與形式相關之串聯。此種形式 相關元件例如可為一種抓握在相鄰模組Β Μ， Ε Μ之對應凹 口中之樞軸（Pivot)。若此樞軸本身具有凹口，則可將 銷釘形或楔形固定元件旋入於樞軸之凹口中而使串聯狀 態中之模組Β Μ , Ε Μ鎖定於相鄰模組Β Μ , Ε Μ上，在此一特 殊之未顯示的實施形式中，銷釘形或楔形固定元件被導 入模組上部組件ΒΜΟ, ΕΜ0中相對應之凹口中，其中此固 定元件至少抵達串聯相鄰模組ΒΜ, ΕΜ之樞軸的凹口中， 因此其可依據形式而被鎖定。 參考符號表 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 P G 周 邊 設 備 MB 基 本 模 組 BM0 基 本 模 組 上 部 組 件 BMU 基 本 模 組 下 部 組 件 EM 擴 充 模 組 EMO 擴 充 模 組 上 部 組 件 EMU 擴 充 模 組 下 部 組 件 ES 末 端 件 AS 1 , AS 2 , AS 3 終端插頭 SP 插 頭 板 LE 接 觸 元 件 EM L 外 部 測 量 接 觸 條 I M L 内 部 測 量 接 觸 條 -12- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 494717 A7 B7 五、發明説明（ LP 電路板 V E 在基本模組，擴充模組内部之導電性連接元件 1 形式連接口 2 固定模組下部組件於覆蓋面之鑽孔 3，3 ’ 互相固定模組下部組件之鑽孔 4，4 ’ 固定模組上部組件於模組下部組件之纘孔 N 密封条統之導槽 請 先 閱 讀 背 面 i 事-項▲ 填τ I裝 頁 經濟部中央標準局員工消費合作社印製494717 German- $ Jiu Jiu: 'Naab ... saying A7 outline "V. Description of the invention (,) (Please read the notes on the back before filling this page) The present invention is about an expandable modular peripheral device that can be used To control and / or monitor technical procedures. This peripheral device is composed of a basic module. At least one power supply voltage can be transmitted to the basic module, and at least one expansion module can be connected in series to the basic module. Thus, both the basic module and at least one serially expandable module can be connected to the actuators and / or sensors to control and / or monitor the technical process. The peripheral equipment of the above technique is generally known in the prior art. Siemens has provided, for example, the modular peripheral ET200U. In the structure of traditional automation equipment, the sensors and actuators are pseudo-directly connected to the central automation equipment. This results in a large amount of wires with high wire costs and less flexibility in change and expansion in a wide range of branching equipment. Decentralized peripherals therefore form an effective interface between the program and the central automation device. The processing and conversion of program signals (interaction with sensors and actuators) is performed directly in front of the location of the program or part of the program in space. The connection between the peripheral equipment and the central automation equipment is therefore usually done via an array bus and therefore via individual connections. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. In addition, in the prior art, one-piece peripherals with advanced protection methods (IP 6 6 / IP 6 7) have been known, for example, sold by Simmons. Peripheral equipment ET200C, its main characteristics are used in harsh industrial environments. In the advanced protection method, & is a modular and expandable peripheral device is not known. In addition, in the prior art, there has not been any module-type expandable peripheral equipment known to date. Among them, there are 494717 A7 B7 between the modules. V. Invention Description (2 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs According to the extension of the pre-supervision department, the string of the first group is based on the β of the upper group. It is the same as the module of the lower group or the upper group and the lower group of the associated group module.边 "Ｍ asked Ming curtain and 1 set of modules), mold m) can be waited for one week ^ Lian Shen said that the electrical system charging module module charge unit 0 charge each of the other groups of single or Controlled expansion, expansion, expansion, and expansion (f this part: phase to structure T, the short block of the TU can be based on the group Γ0 or the formula.... (P, the shape display group will show the seed pieces and the figure such as the special group mold model. The display model is not fixed. If the model is loose, please fill the base with the external group. Suppose that it is only used in the figure of part j. The part can be extended by the application. The part can set its own operation. Intersect According to: the formation of a group of strings is the time when this piece is obstructed ^; The section of the model is a pseudo-component can be modeled here, one of the yuan is detailed in Example 4 Next, c and the fixed part of the introduction or application-expansion and seeding type of the set of the expansion of the fixed group is at the break point is that this one is connected with the mold support. This component is loose. After c, the following components are small and the balance is small, and the next group M has all the components in the next order. The expansion of the group module group is profitable, and the group department completes its process of preparation. The mold filling part is easy to use. It has the above-mentioned electrical tactile characteristics. The cocoa is a fake or a group of unknown descriptions of hair extensions and groups. The other component module PJ or the outside of the technical department and the mold module 'piece c is in the configuration in the group department group,) ^ This area requires the amount of video components to fill the lower part of the connection-shaped part of this group. Group Fan ---------- Approval of clothes ------ 1T ------ ^ (Please read the precautions on the back before filling out this page) This paper size applies to Chinese national standards (CNS ) A4 size (210X 297mm) Central Ministry of Economic Affairs Printed by the Standards Bureau Consumer Cooperatives 494717 A7 B7 V. Description of the Invention (3) Figure 1 shows the expandable modular peripheral device in the combined state. Figure 2 shows the expandable modular peripheral device in a partial cross-sectional view. ^ Figure 3 is a top view of the lower modules of the modules connected in series. Figure 4 is a cross-sectional view of the peripheral equipment along the cutting line IV. Figure 5 is a cross-sectional view of the peripheral equipment along the cutting line V. According to Figure 1, basic Module B Μ consists of the lower module B MU of the basic module and the upper module B MU 0 of the base module. In contrast, the expansion module EM is composed of an expansion module lower component EMI1 and an expansion module upper component EMI. The lower module BMU of the basic module and the lower module EMU of the expansion module have a series external appearance, so that the lower module of the basic module BMU and the lower module of the expansion module EMU, or the lower module of the expansion module EMU and another lower module The components EMU can be connected in series according to their form. In this embodiment, a stepped shape is available. Figure 2 shows the peripheral equipment PG shown in a partial cross-sectional view, in which the lower components of the module BMU and EMU have been connected in series with each other. The lower module BMU, ΕΜϋ can be connected in series on the channel accurately. This is because the lower module BMU, EMU can be connected to the port 1 by means of a common action instead of the components shown in the figure (for example, a dovetail slot). And dovetail notch 1) to guide. Based on the connection of the BMU and EMU of the lower part of the module, the tandem structure of the modular peripheral equipment PG forms an automatic support. This kind of accurate guidance on the channel is needed so that the components of the sealing system can be accurately grasped by each other. In order to achieve an advanced protection method, the sealing strip is in this embodiment pseudo-constructed in a spring-guide groove-combination manner. The upper module of the module BMO, EMO is gripped on the lower module of the module BMU, BMU. The paper size applies to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) I • Binding (please read the precautions on the back before filling in this Page) 494717 A7 B7 V. Description of the invention (4) In the slot N printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, there are fine holes in the ring and it is sealed into the lower module BMU and EMU guide slot N. in. Not only the individual modules BM, EM but also the expandable edge-fixing equipment PG must comply with the protection method I P 6 5 (c r i t e r i a) in DIN IEC 529. The lower components of the module BMU, EMU are usually fixed on a covering surface. Therefore, the lower components of the module B M U, E M U have a drilled hole 2, and the fixing elements (such as screws) can be introduced into the drilled hole 2. The lower components of the module BMU and EMU can be fixed on the covering surface by using this fixing element.下部 The lower components of the series connected modules BMU and EMU are fixed to each other by tightening the screws or fixing components with the same function. The lower module BMU, EMU has drill holes 3, 3 'for this purpose. The screws can be introduced into the holes 3,3 '. In an embodiment not shown, the lower module BMU of the modules connected in series. The fixing method of the EMU is achieved by introducing a wedge-shaped latch element. It can be seen from Figure 2 that the module upper components BMO and EMO do not need to loosen the module lower components BMU, Εϋ 卽 can be removed by the respective lower components BMU, EMU, so waiting for the situation or changing the equipment group Status can be easily replaced. This can produce a situation: In an advantageous structure, each module upper component BMO, EMO is fixed to the corresponding module lower components BMU, EMU with at least one fixed component, respectively. The operation of the fixed components will not Blocked by other module upper components BMO, EMO or module lower components EMU, EMU. The upper part of the module EMO, EMO therefore has a drilled 4 'fixing element (for example, a screw) through which can be drilled 4', the fixing element is held in the corresponding drilled hole 4 in the lower module of the module BMϋ, EM11, so that the mold The upper module BMO, ΕΜ can be fixed to the lower module BMU, EMU one 6 one --------- ί i installed-(Please read the precautions on the back before filling this page) Applicable to China National Standards (CNS) 8-4 specifications (210X 297 mm) Printed by the Employees' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 494717 A7 B7 5. On the description of the invention (5), in the embodiment of Figure 1 or Figure 2 The basic module BM has three terminal heads AS1, AS2, AS3. Two such terminal plugs AS2, AS3 are mounted on the plug board SP together. At least one power supply voltage is usually supplied to the peripheral equipment P G via the terminal plug A S 1. Array bus wires are looped by peripheral devices, such as via terminal heads AS2, AS3. Therefore, it is advantageous that the terminal plugs AS2, AS3 are installed on the plug board SP. When the array bus wires entering and leaving are connected to When the terminal plugs AS2 and AS3 are in use, it is not necessary to interrupt the array bus wires during the process of loosening the plug unit composed of the terminal plugs AS2, AS3 and the plug plate SP. The signal connection between other possible peripheral devices PG can therefore continue to exist. The lower modules BMU and EMU of the respective modules BM and EM of the modular peripheral equipment PG have many contact elements 1 ^, and these contact elements LE can further guide the signal voltage or power supply voltage. The contact element LE is basically constituted by a U-shaped contact element L E and is arranged in a module lower assembly on the side surface of the series appearance (P r 0 f i 1 e). One leg of the U-shaped contact element LE is located on the module upper components BMO, EMO established inside the modules BM, EM, so that many of these legs in the U-shaped contact element LE form an internal contact IML (in this embodiment Is an internal measurement contact strip (IML). The other leg of the U-shaped contact element LE is on the module upper components BMO, EM0 established outside the module BM, EM, so that many of these legs in the II-shaped contact element LE form an external contact EML (in this embodiment Is an external measuring contact strip (EML). -7-This paper size applies to China National Standard (CNS) Α4 specification (210X297 mm) ---------- install ------ order ------ (Please read the Please fill in this page again) Printed by the Central Consumers Bureau of the Ministry of Economic Affairs Consumer Cooperatives 494717 A7 B7 V. Description of the invention (6) When the serial expansion module E Μ is connected to the basic module B Μ, the external test of the basic module B Μ The halo contact strip EML is held in the expansion module EM, so that the external measurement contact strip EML of the basic module BM is located inside the serial expansion module EM and measures the contact strip IML. In order to connect another expansion module EM in series to an expansion bottle group EM, the above situation can be correspondingly applied. In addition, they can be clearly seen from the diagram in FIG. 2 in particular. Such external measurement contact strips EM L, which are not covered by another serial expansion module EM, are covered by a special end piece ES. The contact protection is achieved by the end piece ES in the same way, just like the seal required by the adversarial protection technology. In addition, the expansion module EM can basically be kept in the same structure, making the special expansion module EM Not needed as a terminal module. The sensor and / or the actuator can be connected to a circuit. This circuit is usually installed with the module upper components B Μ 0, Ε Μ 0 or installed in a connection manner. This circuit can be installed on the contact element LE. At least a part of the lower components of each module B M 1], E M I) creates the desired conductive connection. Figure 3 shows a top view of the lower components B Μ 0, Ε 0 of the modules connected in series. I can identify the internal measurement contact strip IML and the external scene contact strip RMU measurement contact strip IML, a part of the contact element L Ε of ML as a further guide for at least a power supply voltage, and another part of the contact element L Ε 刖The signal voltage can be further guided. According to the fourth _, you can not understand the further guidance of the signal voltage. Array K bus conductors can be connected by terminal plugs AS 2 and Λ S 3 iTu (not shown in Figure 4) on the SI side device PG. The signal voltage is used by this array bus conductor -8 ~ (Please read the back, 5 · Precautions, please fill in this page again.) · Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economics, printed by 494717 A7 B7. 5. Description of the invention (7) and supplied to the basic module BM of the fixed edge equipment PG. The circuit board LP configured in the BAM can reach the contact element L E of the internal measurement contact bar ML of the basic module B M. Through the conductive track on the circuit board L P, it can then be used in the terminal plugs AS 2, AS 3 A conductive connection is established between the unshown contacts and the contact element LE of the internal measurement contact strip IML. The contact element LE of the internal measurement contact strip IML which can further guide the signal voltage is indicated by the reference symbol LES below. Via such a U-shaped contact element LES, the signal voltage can be fertilely located on the external measurement contact strip EML, so it is already in the space of the series expansion module EM in space. The signal voltage is further provided by The external measurement contact strip EML of the basic module BM is guided to the internal measurement contact strip IML of the expansion module EM through a conductive track of the circuit board L P or another suitable connection element. In this embodiment, there is a circuit board The LP is arranged in the upper module EM 0 of the expansion module. When the sensor LP is set to the lower module EMU of the expansion module, the contact elements and U-shaped contact elements of the circuit board LP in the upper module EM 0 of the expansion module There will be a conductive connection between the LESs. In this embodiment, a bus-AS 1C exists in the circuit board LP. By this, the bus-ASIC can ensure that each expansion module EM can occur on the bus as a whole In the data communication. In addition, the bus-AS 1C can also receive the correction value of the signal voltage transmitted through the bus. The signal voltage entering the bus-ASIC will of course pass through the contact element LES of the _ Further conduction to other possible expansion modules EM. If the bus-ASIC is not used, it is also possible to make a 1: 1-connection of the contact element for further signal voltage via the circuit board LP.-9 -This paper size is applicable to Chinese National Standard (CNS) A4 (210X297mm) ---------- install ------ order ------ ^ (Please read the note on the back first Please fill in this page again) Printed by the Employees' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 494717 A7 __B7 _ V. Description of the invention (8) The further conduction of the load voltage can be known in particular from Figure 5. At least one power supply voltage passes through Figure 5 The terminal plug AS1, not shown, conducts the basic module BM of the holding edge device PG. By borrowing the law-connecting element VE of the basic module BM, the power supply voltage can be further transmitted from the contact element not shown in the terminal plug AS1 to the contact element LE of the internal measurement contact strip I M L of the basic module BM. This contact element L E (which is specifically used for further conduction of the power supply voltage) is indicated below by the reference symbol LEP. Relative to the signal voltage, the power supply voltage is further transmitted from the external measurement contact bar EML to the internal measurement contact bar IML, during which the conductive connection element VE of the module lower component BMU, EMU is appropriately configured, without passing through the module Circuits configured in the upper components BMO, EMO. This has the advantage that when a load voltage is actually required, in each case the load voltage does not have to be conducted through the circuits arranged in the upper components of the module BMO, EMO, but is only applied there. Therefore, an advantageous method is: only the selected value of the power supply voltage can be measured on the circuits arranged in the module upper components BMO and EMO, so that only such power supply voltages that are actually required can be used in the circuit area. This is especially beneficial for the heat dissipation in the area of the upper components of the module BMO, EMO, but it is also beneficial for the interference that may be generated by electromagnetic radiation. If a determined power supply voltage is required in a circuit configured in the upper components of the module BMO, EMO, a corresponding contact element must be formed so that the power supply voltage can be directly measured on the circuit board L P. In this way, only this supply voltage will actually be conducted to the circuit that is actually needed there as well. All other power supply voltages in the above form 1: 1 This paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) ----------- install ------ order- ---- " (Please read the precautions on the back before filling out this page) Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 494717 A7 B7 V. The description of the invention (9) is borrowed from the respective connection element VE through the relevant Modules BM and EM to form a continuous loop (1 ο ο Ρ). By connecting the expansion modules EM in series, an automatically formed bus can be generated, where the bus can contain signal voltage and power supply voltage. Through the measurement of the power supply voltage and the evaluation of the signal voltage, the technical procedures can be controlled and / or monitored by the circuit configured in the upper component of the module BΜΟ, ΕΚΟ. Since the respective circuits are arranged in the upper components of the module, BMO and EM0, each circuit can be easily exchanged during a waiting situation. The circuits in the upper module components BM0 and EM0 can be electrically connected with the respective lower module components EMU, BMU or with Ε Μ ϋ, Β Μ ϋ through appropriate plug connectors (especially timer contacts). The contact element LE is connected. The legs of the U-shaped contact element LE can have branches as required, for example, branches need to be measured when the respective voltages need to be measured multiple times. All display elements and terminal elements are arranged on the front side, that is, on the upper side of the module, BMO, EM0, so that these elements can be easily accessed to connect sensors or actuators of technical procedures. The installation position of the peripheral equipment PG is arbitrary, so the insert can be aligned as required or aligned according to the required use mode. When the connectors that conduct signal voltage or power supply voltage remain intact in their respective module housings, they can provide significant protection against unwanted outward or inward electromagnetic radiation. In the case of non-metallic or only a part of a metallic module case, if the protection effect of the module case is insufficient, a shield can be additionally provided on the inner side or the outer side of the module case. In a special implementation form shown above, as mentioned above, the lower module components BMU, Ε MU and / or the upper module components B Μ Ο, Ε Μ 0 may also have -11- This paper size applies to Chinese national standards (CNS) Α4 Specification (210 × 297 mm) ---------, * Installation ------ Order ------ M (Please read the precautions on the back before filling this page) 494717 A7 B7 V. Description of the invention (, ...) The form-related components to be replaced instead of the series-type, which can also make the modules BM and E Μ form a series-related series. The related element in this form may be, for example, a pivot pin grasped in a corresponding recess of the adjacent module BM, EM. If the pivot itself has a notch, a pin-shaped or wedge-shaped fixing element can be screwed into the notch of the pivot to lock the modules BM, ΕM in the tandem state to adjacent modules BM, ΕM Above, in this particular not-shown implementation form, a pin-shaped or wedge-shaped fixing element is introduced into the corresponding recess in the upper module of the module BM0, EM0, wherein the fixing element reaches at least the tandem adjacent module BM, ΕM In the recess of the pivot so that it can be locked depending on the form. Reference symbol table (please read the precautions on the back before filling this page) Printed by PG Peripheral Equipment MB Basic Module BM0 Basic Module Upper Module BMU Basic Module Lower Component EM Expansion Module EMO Expansion module upper module EMU Expansion module lower module ES end piece AS 1, AS 2, AS 3 terminal plug SP plug board LE contact element EM L external measurement contact strip IML internal measurement contact strip -12- This paper size applies to China Standard (CNS) A4 specification (210X 297 mm) 494717 A7 B7 V. Description of the invention (LP circuit board VE in the basic module, the conductive connection element inside the expansion module 1 Form connection port 2 Fix the lower component of the module on the covering surface Drilling holes 3, 3 'Fixing the lower components of the module to each other 4, 4' Fixing the upper holes of the module to the countersinks of the lower components of the module N Sealing strip guide grooves Please read the i-item on the back-item ▲ Fill in τ I Pager Staffing of Central Bureau of Standards, Ministry of Economic Affairs Printed cooperatives