490345 五、發明說明α) 純銅及其合 的被應用於工業 合技術方面的需 是最常被使用的 通常會遭遇到一 以銲接方式接合 而一般銲接的接 的硬銲製程中， 性及防止氧化， 銲後的清除是一 接合面含氣孔， 一種新穎的電阻 中 〇 所謂電阻銲 高電阻在施以大 料後形成銲點。 以高度自動化生 業中，大量高度 板之點銲熔接。 材料而言，由於 面附近，因而無 料。 由於純銅本 Conductivity， 金由於兼具高 界中。在應用 求。在此一領 方式之一。但 首先 低， 可達 助銲 些困擾。 的強度為 合效率則 必須使用 但是在許 大問題。 故無法達 接合製程 多接 另一 到氣 ，將 接是利用二片 電流銲接時產 由於電阻銲接 產，故廣為工 自動化的電阻 然而，對於部 電阻熱不易生 法以傳統之電 身具有非常高 0· 596 106/Ω 導電率及導熱性質，故廣泛 銅及其合金時，將會出現接 域中，硬銲（B r a z i n g )技術 是在使用硬銲方式接合時， 是硬銲之接合強度，通常較 其接合效率約為50%-80%， 到9 0 %以上。其次是在傳統 劑（F 1 u X )以增進材料的可銲 合件的應用之中，助銲劑於 方面，硬銲接合工件經常於 密性需求。而本發明則提出 可以應用於銅及其合金之 金屬材料間，於接觸部份的 生高熱，並進而熔化金屬材 之設備簡單、維修簡易且可 業界所採用，例如在汽車工 點銲製程，被應用於車用鋼 份具有低電阻、高熱導性的 成且熱ΐ不易累積於板材界 阻銲接製程應用於此類材 的電傳導率（Electrical /cm)，遠高於一般常見的金490345 V. Description of the invention α) Pure copper and its combination are applied to industrial technology. It is the most commonly used. It usually encounters a brazing process where the joint is welded and welded in general. Oxidation and removal after welding is a joint with pores. A new type of resistance. The so-called resistance welding high resistance forms a solder joint after applying a large amount of material. In the highly automated industry, spot welding of a large number of height plates is performed. As far as the material is concerned, it is not expected because it is near the surface. Due to the conductivity of pure copper, gold also has a high level. In the application. One way to do this. But first of all low, it can reach some troubles. The strength of the combined efficiency must be used but there are many problems. Therefore, it is not possible to reach another connection process in the joining process. The connection is produced by resistance welding when two pieces of current are used. Therefore, the resistance is widely used in industrial automation. High 0 · 596 106 / Ω Electrical conductivity and thermal conductivity properties, so when copper and its alloys are widely used, the junction area will appear. Brazing technology is the strength of brazing when using brazing. It is usually about 50% -80% higher than its joining efficiency, and more than 90%. Secondly, in the application of traditional flux (F 1 u X) to improve the weldable parts of the material, in terms of flux, hard-welded workpieces often require tightness. The present invention proposes that it can be applied between the metal materials of copper and its alloys, and the equipment that generates high heat at the contact part and further melts the metal materials is simple, easy to maintain, and can be used in the industry, such as in the automotive spot welding process, It is used in automotive steels with low resistance and high thermal conductivity, and the thermal conductivity is not easy to accumulate in the sheet boundary resistance welding process. The electrical conductivity (Electrical / cm) of this material is much higher than that of common gold.
第5頁 490345 五、發明說明（2) 屬材料如：鐵（ 0.0 9 9 3 1 0 6 /Ω /⑶）、鎳（〇143 1〇6/Ω /Cm)、鈦（0.0234 ^06/Ω /cm)、鋁（〇377 1〇6/Ω /cm)， 如此將造成電阻熱量無法在材料接合部位 池。故在傳統電阻銲接製程中，纟無法銲接銅及其：：。 為了增加銅及其合金在進行電阻接合製 本發明中選用錄金屬（或其合金）層被覆於銅的表面。由於 鎳與銅具有冶金上的完全互溶性’因此可 理、機械性質有最少的影響。故選用鎳金屬】盆 理想之中間層材料。研究中使用傳統點銲機進 ： 厚度0 _ 5mm銅片之表面分別使用電鍍的方 、，’’、將 度為1、5、10、20、50“ m的鎳，再進行&且=士了 =厚 鎳金屬中間層之存在，使得電阻發熱所生成之能口量於 合二片鍍鎳銅Μ，並形成良好的接點。而： 下無中間層之純銅片1完全無法施以 Ζ匕： 為上述接合部份橫剖面之金相組織的觀 ：写 合界…外，圖中亦標示= 對於電阻接合的助益，於雷阻接人# ，、屬中間層 覆層己形成良好的接點：二；；ΐ中r銅片表面錄披 目租扱剧成中發現，試件 指為銅基材，而非接點部位。自此可以得知: 強度應足敷使用。 此接點之 研究中亦發現，利用無電鍍方式在純 度的鎳合金（Ν 1 - 7 w t % Ρ )，也可以得到相同 銅片鐵上 的效果， 4" m厚 如第二Page 5 490345 V. Description of the invention (2) Metal materials such as: iron (0.0 9 9 3 1 0 6 / Ω / ⑶), nickel (〇143 1〇6 / Ω / Cm), titanium (0.0234 ^ 06 / Ω / cm), aluminum (〇377 1〇6 / Ω / cm), so that resistance heat can not be pooled in the material joint. Therefore, in the traditional resistance welding process, 纟 cannot weld copper and its ::. In order to increase the resistance bonding of copper and its alloy, the metal (or its alloy) layer is selected to cover the surface of copper in the present invention. Since nickel and copper are completely miscible with metallurgy ', it has the least impact on the reasonable and mechanical properties. Therefore, nickel metal] basin is the ideal intermediate layer material. The traditional spot welding machine was used in the research: The surface of the copper sheet with a thickness of 0 _ 5mm was plated with square, '', nickel with a degree of 1, 5, 10, 20, 50 "m, and then & and = Taxi = the presence of a thick nickel metal intermediate layer, which makes the energy generated by resistance heating equal to two pieces of nickel-plated copper M and forms a good contact. And: pure copper sheet 1 without an intermediate layer cannot be applied at all ZZ: It is the view of the metallographic structure of the cross section of the above joints: the writing boundary ... In addition, it is also marked in the figure = for the benefit of resistance joints, Yulei resistance access person #, which is an intermediate layer coating has been formed Good joints: 2; It was found in the recording of the copper sheet on Langzhong that the test piece refers to the copper base material, not the contact part. It can be known from this point that the strength should be sufficient. It was also found in the research of this contact that the same effect on the same copper sheet iron can be obtained by using electroless plating on a pure nickel alloy (N 1-7 wt% P). 4 "
490345 五、發明說明（3) 圖所示。故此處之鎳金屬應包含純鎳及各式鎳合金（合金 成份中依重量百分率計算，鎳元素具有最大比率者）。本 圖示中的兩片銅片中僅在其中一片單邊鍍鎳。另外，在實 驗結果中亦顯示，當鎳彼覆層的厚度小於1/z m時，其輔助 電阻接合的效果非常有限，故鍍鎳層的厚度應大於1" m。 自上述的貫驗結果中可以得知’具有南導電性的銅 (及其合金）在進行電阻接合時，可以利用其接合界面間之 鎳金屬（或鎳合金）中間夾層，以增加接合界面之電阻。在 實際的應用中，鎳金屬中間夾層可以使用鎳及其合金之薄 片（Foil)或各種常用之鎳金屬彼覆製程，包括：電鍍、無 電鍍（化學鍍）、浸鍍、蒸鍍、喷覆、塗覆、物理氣相沉積 法等製程，均可用來披覆鎳金屬於銅金屬表面。而應用電 阻接合製程包括：電阻點銲（Resistance Spot Welding)、電阻縫銲（Resistance Seam Welding)、撞擊 銲接（Percussion Welding)、浮凸銲接（Projection Welding)·.·等。 上述之具體實施例是用來詳細說明本發明之目的、 特徵及功效，對於熟悉該項技藝人士而言，根據上述說明 對該具體實施例作部分變更或修改，均不脫離本發明之精 神範疇。以任何更動與潤飾在不脫離本創作之基本精神 下，均應屬於本創作之適用範圍。490345 V. Description of the invention (3) Figure. Therefore, the nickel metal here should include pure nickel and various types of nickel alloys (calculated by weight percentage of the alloy composition, the nickel element has the largest ratio). Only one of the two copper pieces shown in this illustration is nickel-plated on one side. In addition, the experimental results also show that when the thickness of the nickel coating is less than 1 / z m, the effect of auxiliary resistance bonding is very limited, so the thickness of the nickel plating layer should be greater than 1 " m. From the above-mentioned test results, it can be known that when copper (and its alloy) having south conductivity is used for resistance bonding, a nickel metal (or nickel alloy) interlayer between the bonding interfaces can be used to increase the bonding interface. resistance. In practical applications, the nickel metal interlayer can use nickel and its alloy foil (Foil) or various commonly used nickel metal coating processes, including: electroplating, electroless plating (electroless plating), immersion plating, vapor deposition, spray coating , Coating, physical vapor deposition, and other processes can be used to coat nickel metal on the surface of copper metal. The application of resistance joining process includes: Resistance Spot Welding, Resistance Seam Welding, Impact Welding, Projection Welding, etc. The specific embodiments described above are used to describe the purpose, features and effects of the present invention in detail. For those skilled in the art, according to the above description, some changes or modifications to the specific embodiments will not depart from the spirit of the present invention. . Any modification and retouching should be within the scope of this creation without departing from the basic spirit of this creation.
490345 圖式簡單說明 第一圖為實驗中於電阻接合後，試片部份橫剖面之金相鉬 辦觀察結果：（a )銅片表面電鍍5// m的鎳，（b )銅片表面電 鍍3 0 // m的鎳，（c)銅片表面雷鍍50/z m的鎳。 第二圖為利用無電鍍方式在純銅片鍍上m厚度的鎞合盒 (N i - 7 w t % P )於電阻接合後，試片橫剖面之金相組織觀察結490345 Brief description of the diagram The first picture is the observation result of the metallographic molybdenum office in the cross section of the test piece after the resistance bonding in the experiment: (a) the surface of the copper plate is plated with 5 // m nickel, and (b) the surface of the copper plate Electroplated 3 0 // m nickel, (c) 50 / zm nickel plated on the surface of the copper sheet. The second picture shows the metallographic structure of the cross section of the test piece after resistive bonding by electroless plating on a pure copper sheet with a thickness of m (N i-7 w t% P).
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