TW483297B - Composition and method for manufacturing integral resistors in printed circuit boards - Google Patents

Abstract

An electrically resistive foil comprising a resistive composite material including a conductive material and a non-conductive material alone or incorporated into a two layer foil material that includes a conductive metal layer and a layer of the resistive composite material. This invention also includes circuit boards comprising an insulative substrate and an integral resistor comprising the resistive composite material of this invention as well as methods for manufacturing printed circuit boards including integral resistors.

Description

483297 A7 B7 V. Description of the invention (Background of the invention: Please request the priority of the provisional application order 60 / 094,746 filed on 7777, July 1998. (1) The invention, | g | This t is about a kind of Resistor reincarnation; Lagan ± conductor-materials, which include conductive materials and non-cores: The present invention also relates to a multilayer box including a conductive box layer and a conductive compound layer deposited on the conductive layer. In addition, the present invention relates to n Printed circuit board 'which includes-an insulating substrate and-a kind of encapsulating material and a non-conductive material; " ^ A ,, MR ^ private resistance, in which the resistance k 5 material layer is laminated on the insulating base The teaching of this technology is to reduce the size and cost of electronic products and improve their reliability. For the replacement of discrete electronic components by dental components, integrated circuit components are part of the printed circuit board manufacturing process. The use of a copper box to generate limbs: the copper 羯 is plated with a material with a resistance greater than that of the copper 羯. The problem with the prior art resistance layer is that it is thin because of the manufacturing material. Because the resistance layer is thin, it is easy to cause Throughout the process: Scratches Damage caused by cracks and other physical hazards caused by f-curves. For example, the formation of pure nickel < the resistive layer must be about 0.00174 microns thick to achieve a resistivity of 々-shaped sheet of 50 ohms. Such a resistive film layer Easily damaged The use of nickel-phosphorus alloys to generate higher sheet resistance is described in ^ Guomu, Zhuan 3 ″ 808,576, and its patent specification is incorporated into the context in the manner mentioned, although under a particular sheet resistance ·; Nickel material will provide a thick resistive layer, but it is still manufactured as a thin resistive layer. When it is based on the product, nickel I-4-G scale is applicable; Mejia Xian (CNSM4 Specifications (21〇Τ ^ 7 ¥ Ι V. Description of the invention (2) = Production loss in production =: 々. Commercially available nickel-Taidu + Xin Amamuwan shape within a limited range of 1 ohm. Large number 欧姆Thousands: Limitation. The resistivity of the material is not enough to eliminate the second material. "Jiji limits the application of this technology. In addition, the manufacturing of this knowledge must be based on the resistive layer material. This is due in part to the cause. Glossy surface for adhesion. Therefore, it can be dispersed in higher resistance applications. Integral body resistance. I ,, and if you need to change the electrical and thermal insulation in the box of the present invention-the project, you can easily disc circuit two "only when it is incorporated into the layered body passive resistance." The base material, -combined, and processed to produce a separate one in January-the purpose is to propose a printed circuit board foil. Print with a known body resistance. Another item of the present invention is a compound developed by 人 Λ to produce integrated circuits:落: The composition and the use of the metal flute group body resistance to the resistance material = ρ brush% road version · ^ method 'where the product resistance. ^ Material song and ㈣ change and degradation caused by yet another purpose φ, Shi & η with high yield and improved === and the method of using the composition. Dagger and body resistance < Printed circuit version invention includes a resistance-resistance compound material, which includes conductive material and non-conducting paper scale (Homogenea -5- 297 mm) 483297 No. 88113100 Patent Application A7 Correction page of the Chinese manual (December 1990) & Members are kindly requested to indicate whether there is a revised version mentioned in the year / -month 1 ν £ νΓ ^, Η4, /-^; ίι > Γ ^ 'ιί: .., five, Description of the Invention (4 丨 %% supplementary electrical materials. The present invention also includes a multilayer foil including a conductive metal layer and a resistive composite material. On the other hand, the present invention includes a multilayer foil including a shiny surface and A copper metal layer with a matte surface, and a resistive co-deposited composite material layer combined with the surface of the copper metal layer, wherein the resistive co-deposited composite material layer includes about 0.01 to about 99.9 area% of conductive metal (other than copper), and about 0.01 Up to about 99.9 area% of non-conductive material particles selected from alumina, boron nitride, and mixtures thereof. Another aspect of the invention is a bulk resistor including (a) a first surface and a second surface. insulation Material layer; (b) an integrated resistor on the first surface of the insulating substrate, wherein the integrated resistor further comprises a co-deposited material (including a conductive material and a non-conductive material), and wherein the integrated resistor has a first And second terminal; (c) a first conductive metal layer combined with the first end of the integrated resistor, and a second conductive metal layer combined with the second end of the integrated resistor. The steps of a method for manufacturing a laminate using a foil made of the resistive composite material of the present invention are described, the laminate including an integrated resistor that can be used to make a printed circuit board. Figure 9 is a cross-sectional view of an integrated resistor, the integrated resistor The resistor includes a co-deposited resistive composite material layer 12, including a conductive metal with a large number of non-conductive particles 36.: -6-This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm). 483297 A7 B7 Revised Page of Chinese Specification for Patent Application No. 88113100 (December 1990) V. Description of Invention (

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Brief description of the symbols of the graphic elements 10 12 14 16 18 20 22 24 30 32 34 36 represents a conductive metal layer; represents a composite material layer; represents an insulating substrate; represents a photosensitive resist layer; represents an optical tool; Represents a suitable light source; Represents the exposed part after irradiation; Represents a middle etching photoresist pattern; Represents a second anti-resistant material layer; Represents a part of a conductive metal layer; Represents a bulk resistor; and Represents a number of Non-conductive particles. Specific example description This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 483297 V. Description of the invention (4 The present invention relates to a printed conductive material that includes at least the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Resistive composite material core :: conductive materials and at least ― species: like, including: having shiny sides and about: a modified ^ and combined with / conductive surface of the conductive metal layer < conductive metal layer , Printed circuit boards, and other electrical materials; the present invention also relates to integrated resistors made from the composite materials of the present invention. Including at least one month, an improved resistor has been developed that can be used to manufacture printed electronic substrates. : Material: ': Conductive material including a bulk resistor and a non-conductive material. When made :: Combined: Section includes a variety of bulk resistors printed t & to manufacture one or use. 卩 刷% Road version (when the resistor is connected, the composite material is used; a kind of plating solution can be used to know the electrodeposition side of the resistance composite material. The plating solution includes a small amount of conductive metal ions, which will be used during plating. The conductive material layer and / or the conductive metal layer and the conductive metal forming the conductive gold invention material layer may be any metal capable of conducting current, metal-like metals, alloys, or combinations thereof. It is suitable as the resistance co-deposited material of the present invention. Examples of conductive metals in the metal alloy or alloy include one or more of the following: antimony (Sb), arsenic (As), bismuth (Bi), cobalt (Ce), tungsten (w), magnesium (Mn), lead (Pb), chromium (Cr), zinc (Zn), palladium (pd), phosphorus (P), sulfur (s), carbon (c), starting (Ta), Ming (A1), iron (Fe), thorium (Ti), network, name (pt), tin (Sn), wire (state), silver (Au), and copper (Cu). The conductive metal and alloy may also be selected from one or more of the above-mentioned conductive materials. Or it is a multi-layered layer of multiple conductive metals or alloys.

"I-1 installed fjing first read the phonetic on the back? Fill in this Ic nn · order · --- nnn · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 483297 A7 Ministry of Economic Affairs Printed by the Intellectual Property Bureau's Consumer Cooperatives 5. Invention Description (5 2) The non-conductive material in the resistance composite material is a non-conductive material that can be co-deposited with a resistive foil layer that can be combined with any combination of conductive metals. House: conductive The material is preferably a micro-particle material that can be uniformly dispersed in the overall resistance foil material. Such micro-particle materials include, but are not limited to, metal oxides, metal nitrides, ceramics, and other micro-particle non-conductive materials. More preferably The microparticle non-conductive material is selected from the group consisting of boron nitride and silicon carbide: dagger: oxidized oxide, short nitride, talc, polyethylene tetrafluoride (TFE),% oxygen resin powder and mixture thereof. It has a pH of 2 to 6, a temperature of ^ to ^, and includes, `` soil of about 250 g / L of nickel sulfamate and from about 0 g / L to about% 0 g / 2 or more Electrolytic dissolution of alumina or boron nitride particles The co-deposition layer is co-deposited. The average particle size of the oxide particles and the nitride particles is preferably from about 0.01 to about 20 micrometers, and most preferably less than about 10 micrometers. It can be used on the factory: The co-deposited composite material layer formed by the cathodic layer has the electrical resistance data of about ohm / ohm / square. This is usually equivalent to the amount of electrical material in the co-deposited layer, which ranges from about 0% to about 99.9 area%. ^ Effective cross-sectional area of the layer of private resistance composite material, which is the product of the thickness of the resistive material and the resistance-an important factor ^ = the area of the surface, refers to the conductive metal portion of the resistive material The cross-sections and cross-sections. Therefore, the 99.9% conductive material according to the present invention may have a cross-sectional area of about 0.01% to about 80: Λ. This corresponds to a metal thickness of about 1 Angstrom to about 3 U. "Using electrical = composite materials to manufacture printed circuit board components, there are several materials that can be made thick enough to withstand the manufacture and use of this material

Please read the notes on the back first and fill in the notes 1 Write this page I w II Order # -8- 5. Description of the invention (resistance layer occasionally damaged during the 6th party. First, for example, the composite material can be made J The manufacture of circuit board components with materials includes the resistance composite material of the present invention. The uniformity is more uniform. The following hypothetical examples are used to understand the advantages of using the complex material π々 sheet of the present invention. If each square is required; The resistance can be generated by the conductive material < shim resistance coefficient, the non-conductive material particles of 0.3 micron ', such as the average particle size of the thickness of the resistive material layer is equivalent to ^^ Therefore, these particles are plated into each The particles have a% resistance layer. If it is filled, it will be 2 μm and 2 μm pure nickel and tightly packed. In contrast, only 42% made of pure nickel: 1 μm of 1 μm. m. Therefore, the complex layer has a thickness of more than 500 times the thickness of the same resistive film: resistance; the thickness is pure nickel phase. The resistive layer is less likely to generate resistance due to physical damage; Includes Multilayer Resistor Boxes. This Hair & Economy The Intellectual Property Bureau employee consumer cooperative prints π conductive metal layers and a resistive composite material layer with '::: include-comprising at least two layers. This multilayer box can be used to manufacture: The integrated resistor can be used for the resistance distribution, time constant, filter network, etc. of the resistor. The positive, negative limit, and voltage of this multilayer foil conductive metal layer are basically composed of to. The conductive, private Metal or alloy The same conductive layer of the resistance material of the present invention is suitable for the production of a good layer and is selected as the composite material. The conductive but conductive metal is different from the Y and the metal. The -9-i paper scale is applicable to the national standard of the country ( CNS) A4 size (21〇χ 297 Male i

Different conductive metals can make the circuit board process more flexible, including, for example, after the two layers are laminated to the insulating substrate, the conductive metal can be selectively etched from the two layers without interfering with the ability of the co-deposited material layer. The preferred conductive metal layer is a kind of surface-treated tincture, which is described in U.S. Patent No. 5,679,203, and the description thereof is in the manner mentioned in Z ^ Γ. Meijia double-layer mooring system is made of a conductive composite material containing conductive materials (such as nickel) = micro, non-conductive materials (such as oxide oxide or boron nitride): by co-deposition, electrodeposition on the better steel film Made by surface treatment on smooth or matte sides. The resistance composite material preferably has a degree of thermal conductivity to improve the heat dissipation characteristics of the integrated resistance made from the composite material. The resistive composite material layer applied on the surface of the conductive metal layer: a smooth surface or a matte surface. However, this resistance = 浐: It is better to apply it to the smoother surface of the conductive junction. On the smooth side, a kind of composite material layer exhibits a more uniform surface cathodic effect than that of the composite material layer on the electrodeposited copper film: Xianze side. On the surface of the composite material layer, Micro uniformity. In addition, 'because of the smoothness and the shallowness of the profile', the time required to etch unwanted resistive areas from the laminate is important: the time of the salty button engraving also contributes to the formation of the february foot from the product of the present invention 1 Improved uniformity and density. The electric surface of the electric box is applied with a smooth surface to promote adhesion to promote the surface. This adhesion promoting layer can double the body of the resistor. ㈣Coating with chemical bonding materials (such as silicon sintering; 1) Coating in two periods to improve contact and inflow㈣ Θ Midfoot surface active substances, and those who are familiar with this art are already familiar with S Please read the intellectual property of the Ministry of Economy Notice printed by the bureau's consumer cooperatives

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A7 I " _ B / V. Description of the invention (8) Other technologies for making metal foils using k foils to promote adhesion. When two layers of foil are used on the right, the conductive metal is preferably copper. The thickness of the conductive metal layer depends on its end use. The thickness of the resistive co-deposited material layer depends on the resistance of the bulk resistor to be integrated, and it ranges from about 0.1 to about 12,000 ohms / square in the end use. The diagram relates to a method for manufacturing a printed circuit board including at least one integrated resistor using two layers including a layer of resistance co-deposited material. As shown in Fig. ^ 2, two layers including a composite material layer 12 and a conductive metal layer 10 are laminated to the insulating substrate 丨 4, so that the composite material layer 丨 2 is sandwiched between the insulating substrate 14 and conductive Between the metal layers 10. The insulating substrate 14 can be made of any material conventionally used in the art to make printed circuit boards, including but not limited to the reaction products of formaldehyde and urine meter or formaldehyde and melamine, epoxy resin, polyacetate resin, Reactive resins prepared by reacting with formic acid, polyoxysilanes, polyamides, diallyl phthalates, phenylsilane resins, and ceramics, such as alumina, oxidized wrinkles, nitrogen Silicone, its mixtures, etc. As shown in Fig. 3, a photosensitive resist material 16 is applied to the exposed surface of the conductive metal layer. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as shown in Figure 4-5. The optical tools 18 used to embody the surface of the desired pattern are placed on the photosensitive resist layer 6 and the combination is exposed. A suitable light source 20 is irradiated with or by the light source to generate a negative light image, which is then chemically developed. During the chemical development, the unexposed portion of the photoresist can be dissolved in the developer, and is therefore removed, and the insoluble exposed portion 2 of the photoresist material of the developer 4 is still fixed at 6 Guide-11-Specifications of this paper rule for wealth and wealth (CNS) A4 ---- 1 Yan i 9 2 3 8 A7 B7 V. Description of the invention (9) Electrical metal layer 10. FIG. 6 depicts an intermediate product including an insulating substrate layer 14, a composite material layer 12, a conductive metal layer 1G, and a photosensitive resist material layer, and the intermediate photoresist material layer has been developed. Etching diagram; 24. In FIG. 6B, the intermediate resist pattern is imaged and developed to retain the developed resistance: In the material 24, a serpentine having a patterned resistance shape is produced: using an appropriate acid etching solution such as vaporized copper, vaporized iron, and copper Therefore, the father of sulfur), remove the humiliation $ | 糸 糸 He went to t to develop a conductive metal and resistive metal layer protected by a photoresist material. The four etching steps of Zhao Zhaoye and Ye Yue produced the integral resistance completed by Shao Fen, as shown in Fig. 7, which includes the composite material layer 12 and the isotropic layer 10, among which One of the servants & Taoist people μ a _ has been removed by chemical etching to remove one of the composite material layer 1 2 and the lead layer to the metal layer 10, and the system is / e * resistance 28. Figure 7 of the integrated product formed by the beta system is shown in Figure 7B, and the intermediate layer is shown in Figure 7A. The second layer of the resist material 30 is applied to the unetched lead. After the exposed surface of the layer is exposed, it is developed to expose the conductive metal layer portion 32 corresponding to the integrated Leiyanghu strike. The intermediate product shown in FIG. 7B is a thin ^ ^ ^ ^ ^ ^ ^ ^ ♦, ♦ two etched etchant material layer 30 is selectively applied to the surface of the exposed conductive metal. The surface 10 is formed. Then set the photographic tool; apply the resist material to the layer 3 and layer 3, and then expose or irradiate. Then, the exposed resist material is displayed as a Hecunxian shirt to obtain a patterned photoresistor 32,? ::, the patterned photoresistor makes a part of the integrated circuit of the integrated resistor into a body circuit < The conductive metal parts are not protected. An unprotected area of the conductive metal layer 10 is etched with a gaseous or nicknamed engraving agent 彳 纟 # · X ρ a DS _…, exposing the integrated resistance 34, and the force is red. Deposition resistance -12 (Please read the precautions on the back and write this page first) Order · Printed private paper standard for employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies Chinese National Standard (CNS) A4l ^^ 297 mm 483297 A7 B7 5 、 Explanation of the invention (10g 8 places:,: there are-and ^ ^ resistance 3 4 conductive metal layer at each end, as shown in Figure 8 ... using any appropriate time solution from the product and the body resistance 34 of the conductive metal Fortunately, copper is electrically conductive in the layer part !: Specific: R Shizhong 'etched solution is selected from persulfuric acid: other commercially available ammonia-containing etchant.-Lice emulsion and Figure 8 describe a completed circuit A stacked body resistor includes a composite material M, on which a layer of composite material in the form of a stacked body resistor ^ is placed, and a conductive metal layer 10 is placed thereon, wherein the conductive metal layer has been etched from the resistive layer 34 of human soil. "" Integrated resistance Figure 9 is a resistive co-deposition including non-conductive particles 36 of an insulating substrate layer Dielectric Conductivity: Cross-sectional view with a large number of bulk resistors. And the product of percent conductivity metal layer, 0, or, can be manufactured by the following including the bulk resistor of the present invention: prepared-a laminate, which includes an insulating substrate layer AND-Electrics: Furen materials :, coated, developed and removed from the resistive co-deposited layer without considering the shape of the trajectory, so the developed photoresistive material is known as "resistance <; (3 ) Remove the photoresist material from the insulating base material; ⑷Remove the photoresist material from the residual composite material Materials and develop eight; and (6) an unprotected portion of a conductive gold resistance composite composite layer by, for example, electrolytic deposition. Fly, or an example This example describes the manufacture of the composite bridge 7 of the present invention and the use of the two-layer box Method for manufacturing printed circuit board including integrated resistors. ㈢ '衣 仏 -13- Description of the invention (11 materials p hairpin pot ^ ^ in this technology, and copper foil produced by pen solution deposition, need not be described here in detail .Using injury &, ^ your eyes And copper is electrodeposited on a rotating metal drum to produce copper. The treatment is, in the examples, using a treated phase made according to the method disclosed in US Pat. No. 5,679,230. Summarizing this, in the 23 ° patent, the white side of t V next to the barrel is the smooth ('丨 flash ancient π.) Side, and the other side has a relatively rough surface (",, = Ze side"). This can be processed The shiny side of the copper box causes the copper particles to be deposited / coarsely saccharified and thus promotes subsequent layer adhesion. In turn, according to the present invention, the resistance of jtL 'rb ΠΠ ΤΒ, Α, and metal The layer coating is changed to a copper layer with a good thickness. Alternatively, the copper particles may be layered / coated before the co-deposition step. In addition, the copper adhesion treatment can be omitted, and a resistance layer is directly generated on the side of the Porcelain, which in this case provides sufficient adhesion during lamination. Τ Non-conductive fine particles to be co-deposited on the surface of the metal cladding should have a diameter of less than about 2 嶋, be dispersible in the co-deposition bath, and be resistant to reactions with all subsequent chemicals (such as etchant solutions) " Jiaojiao is a kind of material that has high dielectric strength, high conductivity, high conductivity, good conductivity, easy drilling, or mechanical core particles, such as nitride. Due to cost, stability, porosity, and availability: 'emulsified aluminum is another preferred non-conductive material. Either can successfully produce a resistive layer. Τ 9 用 —The co-deposition layer is made with an electric bond bath. 7 The bath contains non-conductive, diluent, and suitable paper for depositing the conductive metal or metal alloy. Dimensions of paper towels (CNS) A4. Χ χ Please read the notice on the back and fill in this first page. Order # Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 14-

V. Description of the invention (12 ^ This item; Brother Zhong 'is derived from a total of 90 grams of aminosulfonic acid Ni per liter and the mother liter contains 30 grams of alumina bath with an average particle diameter of about 0.3 micrometers. The deposited layer processes the copper foil. The final sheet resistivity of the 1 deposited layer is a function of the volume percentage of non-conductive particles included and the overall thickness of the metal deposit. The area of non-conductive particles in the co-precipitated scallop layer The percentage range can be from about 1 to about 9. 9 weight I% ° Other electrical properties (such as power dissipation) are also a function of these parameters. Therefore, the wide range combination of thickness and co-deposition ratio will produce resistance products. <Wide range. In one extreme, there is essentially no metal or metal alloy layer with detectable particles in the sediment, which usually results in a low flake private resistance coefficient. In the other extreme, it has exactly It is enough to provide the required machinery. The deposit made of metal / metal alloy of raw shellfish is usually: supply = high sheet resistivity. It can be adjusted by electroplating which is known in the art = flow two degrees, plating time, flow Rate, the electrolysis These properties are controlled by the non-conductive solid%, bath temperature, pH 控制 and other plating variables. In this example, a co-deposition private barrier material was formed on a copper foil carrier by the following method. 90 grams of deionized water was added to the plating / valley solution. To this was added 3 q grams per liter of alumina having an average particle size of 0.3 μm and alumina powder. The mixture was stirred while stirring. Heat to the plating temperature not shown in Table 1. Use sulfamic acid to adjust the plating solution p Η 値. And copper V from the cathode immersed in 1% H2S04 (water-soluble, liquid) for 30 seconds, and then deionized water Wash thoroughly. This sample is placed in a nickel sulfamate that has been placed. Please read the precautions on the back first. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. ^ 7 ^ ·) Α4 position ⑽Χ 29? ^-

A7 A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

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TF B7, description of the invention (13 Electricity: two; in the electroplating room. By external screwing together, the solution is circulated throughout the room at min-pole, two; Γ rate. Attached recording layer is thin: = Γ, 6 ·. Moreover, in the case of electroplating under c, it is found that the resistance coefficient of the chip is 992 ohms per square. By manipulation—or multiple processing parameters, the solid content of the material, or changing the total deposition: It is said that Gao Leiyang hurts bismuth ~ 丄 only% I and the amount of ^ ^, change the sheet to "quot ::: by increasing the ratio per square inch ... seconds by adding the same by stirring, using surface-active substances and such as Revelation :: Guozhuan: No. 4,441,965 (the description of which is incorporated in the mentioned manner :: Dagger and other technical changes. You can also change the bath conditions and composition by measuring the resistance in the body until the resistance is reached So far, the desired sheet resistance has been obtained through experiments. By changing the processing parameters, the Neem solution I in the range of 2 to 6 has been used, the temperature range is 20 to 50 degrees Celsius, and the constant 30 grams per liter is oxidized. With a current density of 50 ASF, a sheet having 10 ohms per square to 11,700 ohms per square Co-deposited layer of resistivity. Generally, increasing the temperature of the plating solution will reduce the resistivity of the sheet of resistive layer. The effect is shown in the following table 1. In an alternative application method, non-conductive particles can be placed close to the cathode -16- Applicable to China National Standard (CNS) A4 specification (210 x? 97 male f) 483297 A7 V. Description of the invention (14) Physical proximity, such as electroplated nickel electroplating) and non-conductive granular shell (in this example: Under the slurry of amine sulfide, the solution is filled with ^ in the household ^ mouth emulsified). Then without interference and then: = =, the gap between the anode and the cathode. Co-deposited layer. A ... In order to form the plating method, the non-conductive particles can be placed in close proximity to the cathode by placing non-conductive particles in an electrolyte slurry used for electricity, copper and copper to form a resistance co-precipitation. Lamination, application, branching—in this example, concentrated mi Cu and 7 grams of free H, S〇XI poor #, and 48 grams of horse mother liters adhered to the exosecond solution at 50 per square foot Adhesion m under ampere is about 6G seconds. Then attach the particle core copper box in deionized water. Then use the same solution as before to place the resistive layer on the adhesion particles. μ “The general ridge can include, but is not limited to, plasma spraying, aerial deposition, and lighting, and other methods are well known for sputtering to manufacture the co-deposited layer. Then, adhesion promoters, oxidation preventive agents, and well-known manufacturing methods can be used. Apply either side of A 3 or 所, which is known to those who use copper. Also deal with the method, the box should be used to make the resistance element by the micro-etching method. In this method, the interconnection is used in a downward manner. Imaging and etching of conductive traces. Use _ species ^ an etchant that removes a conductive layer but does not substantially affect the lower resistance layer ^ two imaging and etching steps. In this case, two layers are coated on top of each other. Shao Fen's heat-cured epoxy resin, prepreg embryo "is sufficient to make this epoxy 杓 -17 'paper size applicable to Chinese National Standard (CNS) A41 ^ 21G χ 297 Kg) -_ (please first Read the notes on the reverse side and fill out this page) »: Pack and fill out the book order ------------- ^ Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 483297 A7 V. Description of Invention (15) The lower layer of heat and pressure of fat flow and maturation forms a laminate. The two layers include a guide Metal layer, which includes a side having a co-deposited layer of shiny. A resist material is applied on the outer surface in the desired pattern, and the laminate is etched in a photoresist. In this example, the acid etch: ::: copper or ferric chloride. Clean, rinse, and dry the resulting warp 1: Apply a second resist material to protect the desired conductive pattern. Then put this layered material in a paste containing: ammonium persulfate), remove the high lead from the above ugly / (in this example ^ L into β 4 Co / Youhe resistors. Go to stay The resist material is then rinsed and dried. The% I-110,000 method uses mechanical, electrical, or chemical mechanism methods that require the necessary components to form the resistance element. Iron must be ordered although it has been targeted for specific comparisons. The specific embodiments illustrate and describe this: very :: obviously familiar with the art of reading and understanding this book and drinking two life effects and corrections. The invention includes all such fall within the scope of the following application; 1 = within the scope of Equivalent Variations and Amendments. 申 4 Patent # Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs.

Claims (1)

The patent application No. 88113100 is a revised version of the application (January, February, 1990). The scope of the patent application is %%. The name is: 1. A resistance composite material, which is selected from the group consisting of two gl !, scales, sulfur, carbon, Heart, iron,: group consisting of 'tin'nickel' silver, copper, and their blends = conductive material, and uniformly dispersed in the conductive material :: ,,, oxidized oxide, oxygen cut, oxidized oxide, A group of non-conductive fine particle materials composed of a nitrided surface, two ice ethyl tetrafluoroethylene and their blends. The non-conducting 2. The resistive composite material according to item 1 of the patent application The electrical material includes alumina. The conductive composite material according to item 1 of the patent application scope includes copper. Wherein the conductive 4. The resistance composite material according to item 1 of the scope of patent application is not copper. 5. The resistance composite material according to item 1 of the patent application scope, which has a resistance from about 1 to about 10,000 ohms / square. The seed layer / 1 'comprises a conductive metal layer and a resistive composite material according to item 1 of the patent application. 7. The multilayer according to item 6 of the application, wherein the conductive metal layer and the conductive material are different materials. 8. The multilayer Luo according to claim 6 of the application, wherein the conductive material comprises copper. 9 · According to the number of patents in China, not copper. 10. According to the multi-layered application of the scope of patent application No. 6, wherein the conductive material is the paper size phase + ss household material (CNS) A4 specification --- --- 483297 A8 B8 C8 D8 VI. The scope of patent application t year, the Ί J v:, i contains nickel. 11. A multilayer foil comprising a copper metal layer having a shiny surface and a resistive composite material layer combined with the shiny surface of the copper metal layer, wherein the resistive composite material layer comprises about 0.01 to about 99.9% by area of copper Conductive metal, and bauxite particles of about 0.01 to about 99.9 area%. 12. A circuit board including a bulk resistor, comprising: (a) an insulating substrate layer having a first surface and a second surface; and (b) a bulk resistor located on the first surface of the insulating substrate, The integrated resistor further includes a resistive composite material, which includes a conductive material and a non-conductive material, wherein the integrated resistor has a first end and a second end; and (c) is combined with the first end of the integrated resistor A first conductive metal layer and a second conductive metal layer combined with the second end of the integrated resistor. 13. The circuit board according to item 12 of the scope of the patent application, wherein the non-conductive material of the resistive composite material layer is a non-conductive fine particle material selected from the group consisting of metal oxides, metal nitrides, ceramics, and mixtures thereof. Line 14. The circuit board according to item 13 of the scope of patent application, wherein the non-conductive fine particle material is selected from the group consisting of boron nitride, silicon carbide, aluminum oxide, silicon oxide, platinum oxide, aluminum nitride, talc, and polyethylene. Ethylene fluoride (P-butyl FE), epoxy resin powder and mixtures. 15. The circuit board according to item 12 of the scope of patent application, wherein the conductive material is a metal, a metalloid, an alloy, or a combination thereof. 16. —A method for manufacturing a printed circuit board including integrated resistors, which includes the following steps: -2- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)峰 观 浐 (:): 罘 —photosensitive resist material is applied to-laminate This substrate 'conducting metal layer with exposed upper surface' where the photoresistant material is applied to the conductive = The surface is exposed outside the layer; at least a portion of the photosensitive resist material is exposed by the skin to provide; the irradiated portion of the sexual anti-resistance material and the unirradiated portion of the photosensitive resist material; Layer and resistive material layer, except for a portion of the photosensitive resist (C), removing a portion of the conductive metal layer of the integrated resistive material; (d) removing the conductive gold exposed in step (C) to form a partially formed Integrated resistance; (e) removing the integrated resistance formed from the distant part; (f) applying two photosensitive a resist materials on the first resistance to the formed product (g) the second photosensitive Sexual anti-surname agent material and irradiated The unmasked portion of the photoresistant material forms a bulk resistor; and ㈨ removes the photoresist material covering the bulk resistor, and removes the conductive metal layer combined with the bulk resistor to expose the lower lump Thai resistance material layer to form the integrated resistor. Print package 17. The method according to item 16 of the patent application, wherein the resistive material is a co-deposited material including a conductive material and a non-conductive material, wherein the conductive metal layer and the conductive material are different materials. -3-The standard of this paper is gg standard (¾) A4 size (210X297 mm) / 、 Applicable patent scope 18 · Method according to item 17 of the patent scope of application material $ is selected from metal oxides and metal nitrogen Non-conductive fine particle materials of chemical compounds, ceramics and mixtures thereof. 19. ^ The method according to item 18 of the scope of patent application, wherein the non-conductive particulate material is selected from the group consisting of hafnium nitride, hard carbide, oxide, and oxide: platinum oxide, nitride button, and talc Ethylene (FE), epoxy resin powder and mixtures thereof. The method of applying for the scope of the patent item "item" wherein the multilayer book includes a copper metal layer with a flash shell surface and a matte surface, and a resistive and fine-screen coexisting layer combined with the copper metal layer flash shell surface, &amp; a private resistance co-deposited layer Wherein, the resistance co-deposits conductive metals other than copper with a width of about 0.01 to about 99.9 area%, and: 0.1 to about 99.9 area% of particles selected from alumina, boron nitride, and mixtures thereof and non-conductive materials. The resistive composite material of the scope of the patent application ^, wherein the conductive material comprises nickel. 22. = The resistive composite material of the scope of the patent application! The amount of the non-conductive 2 material in the resistive composite material is from about 0.001 Within the range of about 99 9 area%. Β · = Resistant Composite Materials Section of Item 1 of the Patent Claims, where the conductive. The amount of material in the resistance composite material is from about 00 to about 9 9 9 area Within the range of Α 疋. Please refer to the multi-layer box metal layer of the patent range 6 including copper. '25 · According to the multi-layer drop of the patent application range of the sixth, wherein the conductive metal layer -4- binding sheet size suitable financial @ s 家Standard (⑽ : 297 mm) 483297 8 8 8 8 AB c D 6. The scope of patent application Γ; ^ -Ί ρ year '丨;' ίν.Ί '!; Contains copper and the conductive material does not contain copper. 26. According to the patent application The multi-layer foil of the scope item 6, wherein the conductive metal layer comprises copper and the conductive material comprises nickel. 27. The multi-layer foil according to the scope of application patent item 6, wherein the resistive composite material has from about 1 to about 10,000 ohms / square 28. The multilayer foil according to item 6 of the patent application, wherein the non-conductive material comprises alumina. 29. The multilayer foil according to item 6 of the patent application, wherein the conductive metal layer comprises copper and the conductive material comprises Nickel, and the non-conductive material contains alumina. -5- This paper size applies to China National Standard (CNS) A4 (210X 297 mm)