TW475778U - Tool of semiconductor device - Google Patents

Tool of semiconductor device

Info

Publication number
TW475778U
TW475778U TW90200643U TW90200643U TW475778U TW 475778 U TW475778 U TW 475778U TW 90200643 U TW90200643 U TW 90200643U TW 90200643 U TW90200643 U TW 90200643U TW 475778 U TW475778 U TW 475778U
Authority
TW
Taiwan
Prior art keywords
tool
semiconductor device
semiconductor
Prior art date
Application number
TW90200643U
Other languages
Chinese (zh)
Inventor
Mu-Sheng Liao
Wei-Feng Lin
Chen-Wen Tsai
Ching-Jung Huang
Yi-Chang Hsieh
Original Assignee
Silicon Integrated Sys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Integrated Sys Corp filed Critical Silicon Integrated Sys Corp
Priority to TW90200643U priority Critical patent/TW475778U/en
Publication of TW475778U publication Critical patent/TW475778U/en

Links

TW90200643U 2001-01-12 2001-01-12 Tool of semiconductor device TW475778U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90200643U TW475778U (en) 2001-01-12 2001-01-12 Tool of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90200643U TW475778U (en) 2001-01-12 2001-01-12 Tool of semiconductor device

Publications (1)

Publication Number Publication Date
TW475778U true TW475778U (en) 2002-02-01

Family

ID=21680500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90200643U TW475778U (en) 2001-01-12 2001-01-12 Tool of semiconductor device

Country Status (1)

Country Link
TW (1) TW475778U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641070B (en) * 2018-01-09 2018-11-11 力成科技股份有限公司 Needle device for chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641070B (en) * 2018-01-09 2018-11-11 力成科技股份有限公司 Needle device for chip

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees