TW475061B - Infrared imagine of ultrasonically excited subsurface defects in materials - Google Patents
Infrared imagine of ultrasonically excited subsurface defects in materials Download PDFInfo
- Publication number
- TW475061B TW475061B TW089118931A TW89118931A TW475061B TW 475061 B TW475061 B TW 475061B TW 089118931 A TW089118931 A TW 089118931A TW 89118931 A TW89118931 A TW 89118931A TW 475061 B TW475061 B TW 475061B
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- TW
- Taiwan
- Prior art keywords
- pulse
- ultrasonic
- camera
- scope
- patent application
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Links
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/228—Details, e.g. general constructional or apparatus details related to high temperature conditions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2412—Probes using the magnetostrictive properties of the material to be examined, e.g. electromagnetic acoustic transducers [EMAT]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2462—Probes with waveguides, e.g. SAW devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
- G01N29/346—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with amplitude characteristics, e.g. modulated signal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
- G01N29/348—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with frequency characteristics, e.g. single frequency signals, chirp signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/449—Statistical methods not provided for in G01N29/4409, e.g. averaging, smoothing and interpolation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/024—Mixtures
- G01N2291/02483—Other human or animal parts, e.g. bones
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02881—Temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/101—Number of transducers one transducer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/263—Surfaces
- G01N2291/2638—Complex surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2694—Wings or other aircraft parts
Landscapes
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Probability & Statistics with Applications (AREA)
- Electromagnetism (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/397,585 US6236049B1 (en) | 1999-09-16 | 1999-09-16 | Infrared imaging of ultrasonically excited subsurface defects in materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW475061B true TW475061B (en) | 2002-02-01 |
Family
ID=23571799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089118931A TW475061B (en) | 1999-09-16 | 2000-09-27 | Infrared imagine of ultrasonically excited subsurface defects in materials |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6236049B1 (fr) |
| EP (1) | EP1214588B1 (fr) |
| JP (1) | JP4490017B2 (fr) |
| AU (1) | AU7492000A (fr) |
| CA (1) | CA2384848C (fr) |
| DE (1) | DE60045845D1 (fr) |
| TW (1) | TW475061B (fr) |
| WO (1) | WO2001020319A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8224062B2 (en) | 2006-08-14 | 2012-07-17 | Yamaha Corporation | Method and apparatus for inspection of wafer and semiconductor device |
| CN107024506A (zh) * | 2017-03-09 | 2017-08-08 | 深圳市朗驰欣创科技股份有限公司 | 一种致热缺陷检测方法及系统 |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7083327B1 (en) * | 1999-04-06 | 2006-08-01 | Thermal Wave Imaging, Inc. | Method and apparatus for detecting kissing unbond defects |
| US6437334B1 (en) * | 1999-09-16 | 2002-08-20 | Wayne State University | System and method for detecting cracks in a tooth by ultrasonically exciting and thermally imaging the tooth |
| US6593574B2 (en) * | 1999-09-16 | 2003-07-15 | Wayne State University | Hand-held sound source gun for infrared imaging of sub-surface defects in materials |
| CA2382675C (fr) * | 1999-09-16 | 2009-01-06 | Wayne State University | Dispositif ir sonore miniaturise sans contact d'inspection non destructive a distance |
| GB0001181D0 (en) * | 2000-01-20 | 2000-03-08 | British Aerospace | Material analysis |
| US6614577B1 (en) | 2000-08-23 | 2003-09-02 | Ppg Industries Ohio, Inc. | Method and apparatus for controlling an electrochromic device |
| GB0022612D0 (en) * | 2000-09-15 | 2000-11-01 | Univ Warwick | Non-destructive testing apparatus |
| KR20020095373A (ko) * | 2001-06-14 | 2002-12-26 | 현대자동차주식회사 | 볼트 체결 검사 장치 및 그 방법 |
| US6698288B2 (en) * | 2001-12-06 | 2004-03-02 | General Electric Company | Method and system for assembling and nondestructive testing of assemblies with composite components |
| US6662088B1 (en) | 2002-06-28 | 2003-12-09 | General Electric Company | Methods and systems for inspecting aircraft fuselage frames |
| US20040026622A1 (en) | 2002-08-06 | 2004-02-12 | Dimarzio Don | System and method for imaging of coated substrates |
| US7122801B2 (en) * | 2002-08-28 | 2006-10-17 | Wayne State University | System and method for generating chaotic sound for sonic infrared imaging of defects in materials |
| EP1582867B1 (fr) * | 2002-08-28 | 2012-05-23 | Siemens Energy, Inc. | Dispositif et procédé pour excitation sonore moyennant une multitude de fréquence en imagerie infrarouge |
| US6998616B2 (en) * | 2002-08-28 | 2006-02-14 | Wayne State University | System and method for acoustic chaos and sonic infrared imaging |
| US6684681B1 (en) | 2002-09-06 | 2004-02-03 | Siemens Westinghouse Power Corporation | Mechanical ultrasonic and high frequency sonic device |
| US7060971B2 (en) * | 2002-09-13 | 2006-06-13 | Siemens Westinghouser Power Corporation | Reference standard systems for thermosonic flaw detection |
| US7064331B2 (en) * | 2002-09-13 | 2006-06-20 | Siemens Power Generation, Inc. | Method for calibrating and enhancing flaw detection of an acoustic thermography system |
| US6877894B2 (en) | 2002-09-24 | 2005-04-12 | Siemens Westinghouse Power Corporation | Self-aligning apparatus for acoustic thermography |
| US6838670B2 (en) * | 2002-11-12 | 2005-01-04 | Siemens Westinghouse Power Corporation | Methods and system for ultrasonic thermographic non-destructive examination for enhanced defect determination |
| US7075084B2 (en) * | 2002-12-20 | 2006-07-11 | The Boeing Company | Ultrasonic thermography inspection method and apparatus |
| US7064330B2 (en) * | 2003-04-30 | 2006-06-20 | United Technologies Corporation | Infrared defect detection via broad-band acoustics |
| US6874932B2 (en) * | 2003-06-30 | 2005-04-05 | General Electric Company | Methods for determining the depth of defects |
| US7084402B2 (en) * | 2003-11-25 | 2006-08-01 | The Boeing Company | Liquid coupled defect detection systems and methods |
| US7462809B2 (en) | 2004-10-22 | 2008-12-09 | Northrop Grumman Corporation | Spectral filter system for infrared imaging of substrates through coatings |
| US7164146B2 (en) | 2004-10-22 | 2007-01-16 | Northrop Grumman Corporation | System for detecting structural defects and features utilizing blackbody self-illumination |
| DE102006023144A1 (de) * | 2006-05-16 | 2007-11-22 | ibea Ingenieurbüro für Elektronik und Automation GmbH | Verfahren zum Beurteilen von Körpern |
| US7716987B2 (en) | 2006-07-31 | 2010-05-18 | University Of Dayton | Non-contact thermo-elastic property measurement and imaging system for quantitative nondestructive evaluation of materials |
| US20090000382A1 (en) * | 2006-07-31 | 2009-01-01 | University Of Dayton | Non-contact acousto-thermal method and apparatus for detecting incipient damage in materials |
| US7549339B2 (en) * | 2006-09-05 | 2009-06-23 | United Technologies Corporation | Inverse thermal acoustic imaging part inspection |
| US7855368B2 (en) * | 2008-07-23 | 2010-12-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Air-coupled acoustic thermography for in-situ evaluation |
| US20100275949A1 (en) * | 2008-09-22 | 2010-11-04 | Ruhge Forrest R | Ultrasonic coating removal method |
| JP2010197377A (ja) * | 2009-01-27 | 2010-09-09 | Jfe Steel Corp | 赤外線亀裂検出装置および検出方法 |
| US8322221B1 (en) * | 2009-03-26 | 2012-12-04 | The United States Of America As Represented By The Secretary Of The Air Force | Non-contact high resolution near field acoustic imaging system |
| DE102009021233A1 (de) * | 2009-05-14 | 2010-11-18 | Siemens Aktiengesellschaft | Erfassung von Wärmebildern eines Objekts |
| US8577120B1 (en) | 2009-11-05 | 2013-11-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Methods and systems for characterization of an anomaly using infrared flash thermography |
| US9066028B1 (en) | 2010-01-08 | 2015-06-23 | The United States Of America As Represented By The Administator Of The National Aeronautics And Space Administration | Methods and systems for measurement and estimation of normalized contrast in infrared thermography |
| US9146205B2 (en) * | 2011-05-10 | 2015-09-29 | Areva Inc. | Vibrothermographic weld inspections |
| US9410853B2 (en) * | 2012-06-21 | 2016-08-09 | Siemens Energy, Inc. | Guided wave thermography methods and systems for inspecting a structure |
| JP6153240B2 (ja) * | 2013-01-21 | 2017-06-28 | 片倉 景義 | 非接触音響検査装置 |
| KR101519594B1 (ko) | 2013-09-24 | 2015-05-14 | 한국표준과학연구원 | 초음파 적외선 최적 방열 검출 캘리브레이션 시험편 유닛, 그 시험편 유닛을 이용한 교정방법, 그 시험편 유닛을 이용한 열화상 비파괴 검사 시스템 및 검출방법 |
| JP6372818B2 (ja) * | 2014-06-13 | 2018-08-15 | 公立大学法人 滋賀県立大学 | 超音波を用いた赤外線欠陥検出システム |
| US9360418B2 (en) * | 2014-07-17 | 2016-06-07 | The Boeing Company | Nondestructive inspection using hypersound |
| JP2016191552A (ja) * | 2015-03-30 | 2016-11-10 | 三菱重工業株式会社 | 非破壊検査装置及び非破壊検査方法 |
| JP6972299B2 (ja) * | 2017-08-01 | 2021-11-24 | シーメンス エナジー インコーポレイテッド | 改良型ガイド波サーモグラフィ検査システムおよびそれを使用する方法 |
| US10834336B2 (en) | 2018-01-29 | 2020-11-10 | Ge Aviation Systems Llc | Thermal imaging of aircraft |
| BR102018012268B1 (pt) * | 2018-06-15 | 2021-09-14 | Universidade Federal De Santa Catarina -Ufsc | Sistema para inspeção de um reparo ou junta de material composto aplicado a uma estrutura |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3934452A (en) | 1974-12-02 | 1976-01-27 | Allied Chemical Corporation | Method of determining dynamic strains in composite structures |
| GB1601890A (en) | 1978-05-31 | 1981-11-04 | Sira Institute | Apparatus and method for indicating stress in an object |
| US4232554A (en) | 1978-11-30 | 1980-11-11 | Grumman Aerospace Corporation | Thermal emission flaw detection method |
| US4463608A (en) * | 1979-05-07 | 1984-08-07 | Yokogawa Hokushin Electric Corp. | Ultrasound imaging system |
| JPS5794627A (en) | 1980-12-05 | 1982-06-12 | Komatsu Ltd | Stress distribution measuring instrument |
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| US4710030A (en) * | 1985-05-17 | 1987-12-01 | Bw Brown University Research Foundation | Optical generator and detector of stress pulses |
| US4878116A (en) | 1988-06-02 | 1989-10-31 | Wayne State University | Vector lock-in imaging system |
| US4828400A (en) | 1988-06-08 | 1989-05-09 | Deere & Company | Stress analyzer with automatic overload response |
| US4950897A (en) * | 1989-01-04 | 1990-08-21 | University Of Toronto Innovations Foundation | Thermal wave sub-surface defect imaging and tomography apparatus |
| US4950990A (en) | 1989-07-21 | 1990-08-21 | Iowa State University Research Foundation, Inc. | Method and apparatus for photoinductive imaging |
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| WO1994001766A1 (fr) * | 1992-07-14 | 1994-01-20 | Sierra Matrix, Inc. | Dispositif de controle mains-libres par ultrasons |
| US5495763A (en) | 1993-06-10 | 1996-03-05 | Rhodes; George W. | Method for resonant measurement |
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| US5837896A (en) | 1995-08-23 | 1998-11-17 | Quasar International | Detection of defects using resonant ultrasound spectroscopy at predicted high order modes |
| US5748318A (en) * | 1996-01-23 | 1998-05-05 | Brown University Research Foundation | Optical stress generator and detector |
| US5763786A (en) * | 1996-09-18 | 1998-06-09 | The Babcock & Wilcox Company | Automated mill roll inspection system |
-
1999
- 1999-09-16 US US09/397,585 patent/US6236049B1/en not_active Expired - Lifetime
-
2000
- 2000-09-15 JP JP2001523854A patent/JP4490017B2/ja not_active Expired - Fee Related
- 2000-09-15 CA CA002384848A patent/CA2384848C/fr not_active Expired - Fee Related
- 2000-09-15 EP EP00963516A patent/EP1214588B1/fr not_active Expired - Lifetime
- 2000-09-15 WO PCT/US2000/025373 patent/WO2001020319A1/fr active Application Filing
- 2000-09-15 DE DE60045845T patent/DE60045845D1/de not_active Expired - Lifetime
- 2000-09-15 AU AU74920/00A patent/AU7492000A/en not_active Abandoned
- 2000-09-27 TW TW089118931A patent/TW475061B/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8224062B2 (en) | 2006-08-14 | 2012-07-17 | Yamaha Corporation | Method and apparatus for inspection of wafer and semiconductor device |
| CN107024506A (zh) * | 2017-03-09 | 2017-08-08 | 深圳市朗驰欣创科技股份有限公司 | 一种致热缺陷检测方法及系统 |
| CN107024506B (zh) * | 2017-03-09 | 2020-06-26 | 深圳市朗驰欣创科技股份有限公司 | 一种致热缺陷检测方法及系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2384848C (fr) | 2009-04-14 |
| JP2003509691A (ja) | 2003-03-11 |
| US6236049B1 (en) | 2001-05-22 |
| WO2001020319A9 (fr) | 2002-09-26 |
| EP1214588B1 (fr) | 2011-04-13 |
| AU7492000A (en) | 2001-04-17 |
| DE60045845D1 (de) | 2011-05-26 |
| EP1214588A1 (fr) | 2002-06-19 |
| CA2384848A1 (fr) | 2001-03-22 |
| JP4490017B2 (ja) | 2010-06-23 |
| WO2001020319A1 (fr) | 2001-03-22 |
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