TW473794B - Method and apparatus for separating nonmetallic substrate - Google Patents

Abstract

There is provided a method and apparatus for separating a nonmetallic substrate. The apparatus comprises: a base body; a transfer assembly established at the base body, for transferring the non-metallic substrate along a direction to be cut; a rapid heating unit established at the base body such that it is spaced apart by a selected distance from the non-metallic substrate, for rapid-heating a first region including a prescribed cut line on a surface of the nonmetallic substrate by irradiating a heating beam onto the first region; a rapid chilling unit placed on an irradiating path of the heating beam, for rapid-chilling a second region including the heated prescribed cut line on the surface of the non-metallic substrate by injecting a chilling source onto the second region; and a path converting unit for converting the irradiating path of the heating beam such that the heating beam output from the rapid heating unit reaches the surface of the non-metallic substrate without being blocked by the rapid chilling unit.

Description

-^ 473794 A7 B7 Ministry of Intellectual Property Bureau employees' consumption 5. Description of the invention (The present invention relates to a method and device that can cut non-metal substrates with high brittleness such as glass and silicon, especially to a method The method and device 'can be completely separated along the path by controlling the expansion of a micro-slit and the internal stress of the material, and can accurately control the cutting of the non-metal substrate. Recently' due to the thin film processing technology The development of the semiconductor industry has made semiconductor industries that are highly integrated and highly reliable. In semiconductor products, hundreds to thousands of semiconductor units will be integrated in _high with thin film processing technology. On a pure substrate, it is made of pure polycrystalline silicon and is called a wafer. These semiconductor products store data in the form of digital signals. Or they store the data in a very fast time. 'There is a use in the semiconductor industry to make a liquid crystal display (LCD)' It can convert analog image signals processed in the information processing unit It illustrates into digital images. In the manufacturing process of the LCD, several days to several hundreds of semiconductor units formed by thin film processing techniques on a transparent glass substrate, which is a line

Non-metallic substrate. This is why the LCD can be included in applications in the semiconductor industry. W has something in common between semiconductor products and LCDs. In other words, they are all made of semiconductor substrates made of glass and cut, so they have high purity and high brittleness, and they are very weak in impact resistance. These non-metallic substrates have the common advantage that in many semiconducting Zhao Jing -------- ^ --------- lines (please read the precautions on the back before filling this page) The paper size of the paper is suitable for the national standard (CNS) A4 of the country of wealth (0 × χ tear public hair) Λ73794 A7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

After the wafers or LCD cells are formed on the wafer or glass substrate, they can be easily cut into individual wafers or cells. The technology of slicing the non-metallic substrate will affect the production capacity and yield of the product. As shown in Figure 1, in order to increase the production capacity of this semiconductor product, hundreds of semiconductor wafers 2 will be made on a single wafer! on. After the semiconductor wafers are manufactured, a dicing process is performed. Then, each of the separated semiconductor wafers 2 will be packaged to make the semiconductor product. On the other hand, in the case of an LCD, as shown in FIG. 2, at least two or more LCD unit bodies 4 are simultaneously formed on a large-sized glass substrate, which is called a mother board 3. After at least two or more LCD unit bodies 4 are fabricated on a single mother board 3 at the same time, each LCD unit body 4 is separated by the mother board 3 by a cutting procedure. Sound will perform a combination process to complete the CD. This segmentation process will be more important than other processes. Because the singulation process is the final procedure of these products, and the cutting margin on the wafer is very small, when several to hundreds of semiconductor wafers 2 are made on the wafer 1, To separate them one by one, precise cutting is required. If the slicing process is not performed properly or is broken during cutting, the semiconductor product cannot be used. Although the cutting margin in LCDs is not as small as in semiconductor products, the division process needs to be performed more accurately. This is because the mother board 3 used for the L c D is not a crystalline structure but a glass structure, so it has a higher fragility than a wafer. At the time of division processing, it is 297 mm) 1IIIIII — — — — — — * — — 1111— · 11111111 (Please note on the back of lait before filling out this page) This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 173794

The micro slits generated at the edges will rapidly expand along the stress weakness. Therefore, in the past, cutting failure to cut to the wrong part often occurred. Failure to segment these non-metallic substrates means that their original characteristics and functions will be lost. In the conventional division method, a diamond knife is used, and most fine diamonds are planted on a circular plate rotating at high speed. The diamond knife will contact an imaginary "cut line," and form a "pre-cut line," 2a, 4a, etc., at a predetermined depth on the surface of the substrate to be cut. Alas, a physical impact will be applied to the substrates, and by the stress concentration on the pre-cut lines, the semiconductor wafers 2 are separated by the wafer i, or the LCD unit bodies 4 are separated by the mother board 3. However, in the conventional singulation method, since the wafer or the mother board 3 generates fine debris, an additional cleaning and drying process is additionally required. Also, when a diamond knife is used to perform the singulation process 4 of the wafer 1 or the mother board 3, an appropriate surface area is also required for the cutting operation, that is, a cutting margin is basically required. If the dicing process is not completed accurately, it will be difficult to increase the number of semiconductor wafers 2 formed on the wafer. This is the most important factor in its capacity. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In particular, in the LCD division process, when each LCD unit is cut by the mother board 3 with a diamond knife, the side cut by the diamond knife is more It is rough, so stress concentration will occur in multiple parts of the section. Gap and chipping will occur in the part where the stress is concentrated on the cut surface. Therefore, erroneous cutting often occurs in the image display portion, that is, an unnecessary portion. Furthermore, the glass substrate is separated via at least two procedures. That is, 6 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 473794 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (4 The pre-cut line must first be used with a diamond knife It is formed at a desired depth. Then, the LCD unit body 4 is separated by the mother board 3 by using the pre-cut line. Therefore, it takes a lot of time to perform the above process. In addition, as described above, if a diamond knife is used There will also be a problem that a large amount of glass particles will be generated, and these glass particles must be removed by washing and drying. In order to solve the above problems, some conventional laser cutting methods are disclosed in US No. 4,467,168. Patents "Methods of Cutting Glass with Lasers and Articles Made therefrom", US Patent No. 4,682,003 · 'Laser Beam Glass Cutting, and US Patent No. 5,622,540 "Method of Splitting a Glass Piece, etc." However, these methods are not suitable for processes that require high accuracy. Moreover, these methods have a common mechanism, that is, a pre-cut line must be formed before the substrate is processed by It is separated by the pre-cut line, which will reduce the productivity. One of the purposes of the present invention is to absorb the residual cooling water left on a non-metallic substrate by absorbing the dividing line used for rapid cooling of the heated dividing line. One purpose is to improve the cutting ability of a non-metal substrate by completely using a vacuum suction or an external force generated by thermal expansion. Another object of the present invention is to increase the heating temperature of the dividing line of a non-metal substrate as much as possible. The temperature difference between the temperature and the cooling temperature improves the cutting accuracy. Another object of the present invention is to improve the cutting speed of a non-metal substrate. Another object of the present invention is to minimize a non-metal substrate. ^ ---- 1 --- ^ -------- < Please read the precautions on the back before filling this page)

473794

The Intellectual Property Bureau of the Ministry of Economic Affairs, Employee Consumption Cooperative Printing 5 clothing. Another object of the present invention is to perform a complete cutting of a non-metallic substrate. Although it has cracks, it starts from the front side of the substrate, but does not extend to it. The back. To achieve the above objects and advantages, a device is provided for cutting a non-metal substrate. The device comprises: a base body; a transfer assembly is arranged in the base body, and the non-metal substrate can be transported along a cutting direction; a rapid heating unit η is in the base body, and a The predetermined distances are separated, and a heating beam can be irradiated to a first zone for rapid heating. The first zone includes a pre-cut line on the surface of the substrate; a rapid cooling unit is placed on the irradiation path of the heating beam. And a cooling source can be injected to rapidly cool it from a second zone, which includes a pre-cut line that has been heated on the surface of the substrate; and an optical path conversion unit can change the irradiation path of the heating beam, The heating beam output by the rapid heating unit can reach the surface of the non-metal substrate without being blocked by the rapid cooling unit. According to another aspect of the present invention, a method for cutting a non-metal substrate is provided. The method includes the following steps: conveying a conveying plate along a conveying direction on which the non-metallic substrate is fixed; preheating a first area including a pre-cut line on the surface of the substrate; using a heating beam to rapidly heat the A preheated first zone; and injecting a cooling source into a second zone including the pre-cut line to rapidly cool the rapidly heated first zone to cut the non-metal substrate. Brief Description of the Drawings The purpose and other advantages of the present invention will be more clearly understood from the detailed description of the following embodiments in conjunction with the drawings; wherein: FIG. 1 shows a method for manufacturing a semiconductor product, in which There is a paper format that conforms to the Chinese National Standard (CNS) A4 specification (210 x 297 mm) Αν Μ -------- ^ --------- (Please read the precautions on the back first Refill this page) 173794

V. Description of the invention (6) The semiconductor unit on the silicon wafer of the non-metal substrate is separated; FIG. 2 shows a method for manufacturing an LCD, in which an LCD unit body is formed on a glass substrate of the non-metal substrate. It is divided; FIG. 3 shows the cutting mechanism of the non-metal substrate of the present invention; FIG. 4 is a perspective view of a cutting unit for completing the cutting mechanism of the non-metal substrate of FIG. 3; Partial cross-sectional view of the crack generating unit taken on line IV-IV in FIG. 4; FIG. 6 is a schematic diagram of a processing lens capable of forming a laser beam and energy level in the crack generating unit of the present invention; The front view taken along the front of A in Figure 6 shows its energy level; Figure 8 is the side view taken along the arrow of B in Figure 6 showing its energy level; Figure 9 A is Schematic diagram of the structure and operation of a rapid cooling unit of the present invention; Figures 9B to 9D show the laser beam profile at a, b, and c positions in Figure 9A; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Fig. 10 is a sectional view taken along the CC line in Fig. 9A; Fig. 11 is A perspective view of the lens of the laser beam going path out of the converter; 12 Photo sectional view taken along line D-D of Η Fig of the mining; section 13A graph laser beam advancing path of the present invention the conversion lens perspective view of another embodiment of the implement; 473794 A7

V. Description of the invention (7) Figure 13B is a plan view of Figure 13A; Figure 13C is a cross-sectional view taken along the pre-cut line; Figure 13D is a cross-sectional view at position S in Figure 13A; Figure 14 is A perspective view of the auxiliary cutting unit provided on the transfer unit of the invention; FIG. 15 is an enlarged view of part E in FIG. 14; FIG. 16 is an enlarged view of part F in FIG. 14; Sectional view of the expansion tube taken along line I-I in FIG. 15 and line Π-Π in FIG. 16; FIG. 18 shows the state of expansion of the expansion tube; FIG. 19 shows the expansion tube Fig. 20 is a sectional view of another embodiment of the method for cutting a non-metal substrate according to the present invention; Fig. 21 is a sectional view of another embodiment of the method for cutting a non-metal substrate according to the present invention; And FIG. 22 is a cross-sectional view of still another embodiment of a method for cutting a non-metallic substrate according to the present invention. The present invention will now be fully explained with reference to the accompanying drawings showing preferred embodiments. FIG. 3 shows a mechanism of the present invention, that is, an LCD mother board 100, such as a glass substrate combined with two glass substrates, can be divided into LCD unit panels. In Fig. 3, reference numeral 110 denotes a mother glass plate, and reference numeral 120 denotes a mother glass plate. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 丨 τ —! _ (Please read the notes on the back before filling in this page) · !!! 1 Order ·! !! !! -Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 i73791__ * • A7 r —----- B7 V. Invention Description (8) -I (Please read the notes on the back before filling this page) Basis 1 '· "Pre-cut line" 150, various elements of a color filter substrate 130 are provided on one side of the upper mother glass plate 110. According to a "pre-cut line 19", various elements of a TFT substrate 140 are provided on the One side of the lower mother glass plate 12 {) is opposed to the element of the color filter substrate 130. A liquid crystal 160 is interposed between the color filter substrate 130 and the TFT substrate 140. A sealing line 175 is provided along one side of the two opposing substrates 130 and 140 to seal the two opposing substrates. Wherein, the position of the pre-cut line 150 is defined by a unit that can cut a non-metal substrate which will be described later. In order to completely separate the upper and lower mother glass plates 110 and 120 along the pre-cut line 150, the pre-cut line 150 is rapidly heated in a small surface area. In other words, the pre-cut line 150 is heated by a heating source 170, such as a laser beam, for a short period of time, so that its heating temperature is higher than a critical thermal stress temperature. This heated part (the first zone) will rapidly expand locally. -Line · Then, a cooling fluid 180 will be injected into this thermally expanded first zone. The portion (second zone) into which the cooling fluid 180 is injected will be quickly cooled, resulting in thermal contraction. The thermal stress caused by such thermal expansion and contraction will increase and become greater than the bonding force between glass molecules. Therefore, a crack will be generated along the pre-cut line 150. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics Please refer to FIG. 3 again. The laser beam 170 overlaps with one of the cooling fluid 180, part L, which is the part where cracks actually occur. The single-dotted line portion in front of the overlapping portion L is the portion where the crack has occurred. The portion behind the overlapping portion L (in the direction of X-axis advancement) is the portion where cracks will occur. When the cooling fluid 180 is injected into the overlapping portion L, if the pre-cut line 150 (that is, the dotted line portion) where the cracks are formed is preheated, the upper and lower mother glass plates 11 The paper size applies to the Chinese National Standard (CNS) A4 size (210 X 297 mm)

A7

V. Description of the invention (9) The cutting speed of 110 and 120 will be improved. The important point here is that the second zone is located in the first zone quickly heated by the pre-cut line 150. As described above, since the cooling fluid is injected into the rapidly heated portion, the local temperature difference is maximized. Therefore, sufficient heat stress will be generated in the rapidly heating and rapidly cooling portion, so that the portion can be completely cut off at one time. If the upper mother glass plate 110 has been cut by the aforementioned mechanism, the Lcd mother plate 100 will be turned by a turning unit (not shown). Alas, the aforementioned pre-cut line 190 of the lower mother glass plate 120 is cut in the same way, so that the LCD unit can be separated by the LCD mother plate. Of course, the cutting mechanism can also be used on a Shixi substrate (not shown) to make a semiconductor product. Fig. 4 shows an embodiment of an apparatus 500 that can cut a non-metallic substrate to complete one of the cutting mechanisms. Referring to Figure 4, the operation of cutting a CD master will be explained. The apparatus 500 for cutting a non-metal substrate according to the present invention includes a body 210 ′, a transfer assembly 240, and a crack generating assembly 300 is provided on top of the transfer assembly 240. It is supported by the base body 2 10 and a laser beam generating unit 400. The base body 210 includes a base plate 212 which is arranged in a rectangular parallelepiped shape, and parallel to the χ-γ plane of the coordinate system in FIG. Set, and at least one horizontal support frame 230 is oppositely connected to the middle part of these vertical pillars 22o, and this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297). 丨 丨 ——! _ (Please read the precautions on the back before filling out this page) -------- Order --------- line ^ ΙΓ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 12 473794 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (10 is parallel to the bottom plate 212. The transfer assembly 240 includes a pair of fixing rods 241, which are parallel to the Y axis and are arranged at a certain interval on the base 210 On the top surface of the supporting frame 230, a conveyor belt 242 is oppositely disposed on the inner surface of the fixing rods 241, and a plate 243 is disposed above the fixing rods 241, and can be linearly driven by the conveyor belt 240 reciprocatingly. The unit 245 is provided on the top surface of the support plate 243, and can be rotated in a 0 direction on the XY plane, and a receiving plate 246 is provided on the top surface of the rotation unit 245. The bottom surface of the support plate 243 is fixed to the The conveyor belt 242 can be driven along with the conveyor belt 242. The side of the support plate 243 parallel to the conveyor belt 242 corresponds to a short jaw 241a provided on the fixing rod 241. Due to the short length of the fixing rod 241 The structure of the gripper 241a enables the support plate 243 to be precisely reciprocated by the conveyor belt 242 without any On the top surface of the support plate 243 that can reciprocate without fluctuation, the rotation unit 245 is provided, which can be rotated by a motor (not shown) in the direction 0 of FIG. 4. A large surface area The receiving plate 246 is fixed on the top surface of the rotating unit 245. A vacuum holding unit (not shown) is preferably provided in the receiving plate 246, so that a workpiece such as a mother LCD panel 100 can be vacuum-pressed. A laser beam generating unit 400 includes a first laser beam generating unit 410, which can generate a laser beam to cut a workpiece, and a second laser beam generating unit 420, which can preheat the cutting to be performed. Part of the workpiece. The laser beam generating unit 400 further includes a third laser beam generating unit (not shown), which can generate a laser beam, and is regarded as an initial crack generating unit. The specifications of this paper are applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 13 I »------- I ^ · 11 --- II (Please read the precautions on the back before (Fill in this page) 473794 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 —-------------__ 5 SUMMARY OF THE INVENTION (11) The laser beam generated by the laser beam generating unit 400 can be used as a heating source to heat a workpiece. The laser beam will be correctly selected to match the properties of the non-metal substrate to be cut. At the same time, the laser beam should have an excellent efficiency and reliability for the substrate to be cut, and have a wavelength so that the energy absorption efficiency of the substrate can approach 1000/0. For example, it is best to Use a CO2 laser beam with a wavelength of 1.06 microns to cut a glass substrate, and use a YAG laser beam to form an initial crack 'and use a laser beam with a wavelength of 1.06 microns or less to cut Shi Xi Substrate. The laser beam generated by the laser beam generating unit 400 is supplied to one of the crack generating assemblies 300 shown in Figs. 4 and 5 through most optical systems (not shown). The optical system is composed of a lens group, and the optical path of the laser beam can be changed. The crack generating assembly 300 includes a guide block 310, a crack generating unit 320, a preheating unit 330, and a fixed plate 340. The crack generating unit 320 and the preheating unit 330 can move at the same time, and a driving unit (not shown) (Out) The fixed plate 340 and an initial crack generating unit 350 can be moved. The guide block 310 is a hexahedron and has a proper length and width. In the guide block 310, two groove-shaped openings 311 and 312 are parallel to each other and perpendicular to the conveying direction of the workpiece. Both ends of the guide block 310 are fixed by vertical pillars 220. At the end of the guide block 310, two laser introduction units 321 and 322 are provided, so that the laser beam generated by the laser beam generating unit 400 can be incident through the optical system. The laser beams outputted through the laser beam introduction units 322 and 321 are supplied to the crack generating unit 320 and the preheating unit 330 provided in the openings 3 11 and 3 12. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 14 up pack -------- Order --------- line mr (Please read the precautions on the back first (Fill in this page again) 473794 A7 B7 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and the invention description (12) The crack generating unit 320 and the preheating unit 330 are connected through the fixing plate 340, so as to avoid the guide block 3 10 Break away. The fixing plate 340 is slidably disposed on the top of the guide block 310. A driving unit (not shown) is provided at the guide block 310, so that the fixing plate 340 can reciprocate along the openings 311 and 312. Therefore, the crack generating unit 320 and the preheating unit 330 will be moved by the driving unit along the openings 3 11 and 3 12. In addition, in the two openings 3 11 and 312, the preheating unit 330 and the crack generating unit 320 are provided, so that a workpiece can be preheated and then cut. The structure and operation of the crack generation unit 320 and the preheating unit 330 will be described more fully as follows. Referring to FIG. 5, the preheating device 330 includes a laser beam direction conversion mirror 33. The second laser beam generating unit 420 shown in FIG. 4 is passed through the optical system and the guide block 340 is provided. The direction of the laser beam of the upper laser introduction unit 321 is changed toward a workpiece, for example, an LCD mother board 100 (hereinafter referred to as "mother board"); a housing 333 is sent by the laser beam direction conversion mirror 331 The incoming laser beam passes through it; and a lens unit 324 is disposed in the casing 333. By means of the lens unit 324, the laser beam 332 having a point shape is divided into at least two or more laser beams 332a which can be operated for preheating, and then irradiates the mother board 100. The lens unit 324 includes a lens 334a to divide the spot laser beam into two or more, and an up and down unit 334b can move the lens 334a up and down in the housing 333 to control the focus, and the lens The interval between the preheated laser beams 332a emitted by 334a. At this time, the control of the focal length of the preheating operation and the laser east 332a distance, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------ · i — — — — — — — ^ · —------ • line (please read the notes on the back before filling this page) 15 473794 A7

V. Description of the Invention (U) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is very relevant to the preheating temperature of the motherboard 100. • The increase or decrease in the preheating temperature of the motherboard is achieved by controlling the equidistance between the laser beams 332a. These preheated laser beams 332 & are obtained by controlling the distance between the motherboard and the lens 334a. In the case where the mother board 100 has been preheated by the preheating unit 330, the receiving plate 246 will continue to move, and the preheated mother board will reach the initial crack generation unit 350. The initial crack generation unit 350 can generate cracks at the beginning of the cutting of the motherboard 100, and shows the direction of the cracks to be generated. The initial crack generating unit 350 includes a diamond knife 351, which rotates at a high speed, and a diamond knife driving unit 353 can rotate or move the diamond knife 351 up and down. In another embodiment of the initial crack generating unit 350, The beam is irradiated on one of the starting points of the pre-tangent line to melt it slightly and form an initial crack. The mother board 100 that caused the initial crack will continue to be transferred by the transfer assembly 240, and reaches the crack generation unit 320. Referring to FIG. 5 again, the crack generation unit 320 includes a laser beam path conversion mirror 328, which can pass the laser introduction unit 322 provided in the guide block 310 shown in FIG. 4 as The direction of the laser beam incident on the motherboard 100 by the heating source changes; a housing 323 through which the laser beam sent from the laser beam path conversion mirror 328 passes; and a profile-changing lens 324 is provided in the casing 323. By changing the lens through the profile, the profile of the spot laser beam is changed to a desired shape. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 16 (Please read the notes on the back before filling out this page) I ϋ H «I ϋ ^ OJ · ϋ I n 1 n ϋ.. Line IT.

V. Description of the Invention (I4) ^ --- (Please read the notes on the back before filling in this page) In addition, the crack generated early element 320 contains an upper and lower unit 3,5, which can be moved up and down along the inner wall of the body 323 Move to control the profile y area of the profile change lens 324. A gate 326 is provided in the housing 323 to prevent the laser beam from passing, or reduce the profile area of the laser beam to increase or decrease the laser profile. The energy level of the beam; a rapid cooling unit 327 forms a cooling source; and a lens group can change the optical path of the laser beam so that the laser beam is guided to reach the motherboard 100. The profile-changing mirror 324 is a compound lens in which a cylindrical concave lens and a cylindrical convex lens are provided together. Please refer to Figs. 6 to 8 for a more complete description of the profile change lens 324. The profile changing lens 324 is formed in a rectangular hexahedron shape and has a required area tj. !

I

As shown in FIGS. 6 and 7, the top surface of the lens 324, that is, the position I where the laser beam is incident, is formed into a concave lens 324a shape, and the bottom surface thereof is formed into a convex lens 324b! Shape. Grandpa

"I If a spot laser beam with an L! Diameter is incident on the concave lens 324a] The printing office of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is shown in Figure 6, the spot laser beam will change into an ellipse The shape of the beam | beam 'has a length of the long axis of L2.] 嗣' The elliptical laser beam will change again so that the length of its short axis will pass through the convex lens 324b more and less. Therefore, the incident The spot laser will change into an elliptical laser beam, and the length of its long axis will be much longer than the short axis. In these embodiments, the laser changed by the profile change lens 324 Shoot 1 beam long axis with a length of about 2 ~ 8mm. 1 17 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 473794

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

The use of a modified rounded laser beam will increase the processing speed and fineness more than the use of a dot laser beam. In other words, it will be able to preheat the pre-tangent line 'with a single shot of 12 lengths and maintain a uniform laser energy distribution, as shown in Figure 7. Therefore, the heating efficiency of the motherboard is significantly increased compared to the case where the spot laser beam is irradiated on the motherboard 100. In addition, in an elliptical laser beam, the energy level of the laser beam is controlled by separating a part of the laser beam. Since the length of the laser beam can be controlled, the heating temperature of the motherboard can be controlled. In FIGS. 7 and 8, the I-axis system shows the energy distribution of the laser beam. Meanwhile, as shown in Fig. 5, the energy level of the laser beam can be mechanically controlled by a gate 326 provided in the housing 323. The shutter 326 is fixed to the inner wall of the casing 323 at a position lower than the profile changing lens 324. Generally, the energy level of the laser beam is controlled by the up and down action of the up and down unit 325, which moves the profile changing lens 324 up and down. Specifically, when the upper and lower units 325 move down the profile changing lens 324 b ′, the seedling beam will come in to increase the area of the laser beam. At this time, part of the laser beam will overlap the shutter 326, so the length L2 of the long axis of the focused elliptical laser beam will be shortened by the overlap length. As shown in FIG. 5, the rapid cooling unit 327 is disposed in the casing 323 and under the gate 326. Specifically, as shown in FIG. 9A, the rapid cooling unit 327 as a cooling source is close to the mother board 10 of a non-metal substrate to be cut. This is to avoid reducing the temperature difference of the motherboard 100 when it is heated and cooled. In other words, 'If the distance between the cooling unit 327 and the motherboard 100 increases, the paper size of the cooling fluid applies the Chinese National Standard (CNS) A4 specification (2] 〇X 297. ^ ----- 1 — ^ --- ------ (Please read the precautions on the back before filling out this page) 18 473794 A7 B7 V_ Printing of clothing by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, description of inventions (16) 329a Reaching the motherboard 100 The area will increase, and its cooling temperature will increase in inverse proportion to the increase in the contact area, which will reduce its temperature difference. When the cooling unit 327 is close to the motherboard 100 to solve this problem, the cooling unit 327 is set at the laser beam. In the forward path, the laser beam will be hindered. In other words, the laser beam will be blocked by the cooling unit 327, so the motherboard 100 located under the cooling unit 327 will not be irradiated by the laser beam. In order to solve the above problem, a laser beam path conversion lens 328c is provided on the cooling unit 327, and a laser focusing lens 328e is provided in the housing 323. Hereinafter, the laser beam light Diameter conversion lens 328c and laser beam focusing lens 328e are called It is a laser beam path conversion unit 328. In detail, the laser beam path conversion lens 328c preferably has a suitable shape, such as a triangular structure. The conversion lens 328c has seven sides as shown in FIG. 11 At the same time, the lens 328c is preferably made of a material that can completely reflect the laser beam generated by the profile-changing lens 324. Referring to FIG. 12, a irradiated laser beam reaches the two After the inclined surfaces 328a and 328b, they will be divided into two laser beams with different forward paths. In addition, the two separated laser beams will be reflected by the focusing lens 328e. As shown in FIG. On the surface of the cut mother board 100. Specifically, by controlling the angles of the focusing lens 328e and the optical path conversion lens 328c, the laser beam can be irradiated in a desired shape despite the presence of the cooling unit 327 — — — — — — — — — — — — 1 »· 1111111 ^ · 1111111 · < Please read the notes on the back before filling out this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297) Mm) 19

5. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 __B7___ Description of the Invention (17) More specifically, the shape of the laser beam irradiated by the focusing lens 328e is shown in Figures 9B to 9D. Figure 9B shows the profile of the laser beam separated by the optical path conversion lens 328c and the focusing lens 328e at a distance "a" from the motherboard 100. Figure 9C shows the separated laser beam at " The profile between “a” and “c”, FIG. 9D shows the profile of the separated laser beam at “c”, which has bypassed the cooling unit 327 and then joined together. As shown in Figs. 11 and 12, a receiving hole 328d has a certain space and is provided under the optical path conversion lens 328c. The receiving hole 328d can accommodate the cooling unit 329, which injects cooling water or cooling gas into a mother board in the laser irradiation area. The cooling unit 327 includes a cooling gas injection pipe 329b. A cooling water injection pipe 329c and a cooling water absorption pipe 329d are all connected in common to a cooling fluid supply unit (not shown). The cooling fluid supply unit supplies a low-temperature cooling gas, for example, a low-temperature inert gas, such as liquid helium, nitrogen, argon, and the like, and a cooling water. These fluids are injected through a cooling gas injection pipe 329b, a cooling water injection pipe 329c, and the like. When a cooling gas or cooling water is injected on the motherboard workpiece, only one of the cooling gas injection pipe 329b and the cooling water injection pipe 329c may be used. However, in order to obtain a high cooling capacity, it is preferable that both tubes are used. In order to use both, it is preferable that a cooling fluid supply pipe can have a double-layer structure, one of which is located in the other, so that the cooling gas can be injected into a small area together with the cooling water. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ------------------ ^ ------- 1 (Please read first (Notes on the back, please fill out this page) 20

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. To be able to do so, the cooling fluid supply will supply cooling gas and cooling water through their respective supply channels. Specifically, the cooling water is supplied to the cooling water injection pipe 329c provided in the innermost layer, and the cooling gas is supplied to the cooling gas injection pipe 329b surrounding the cooling water injection pipe 329c. With these structures, when the cooling gas is injected onto a workpiece such as the mother board 100, it surrounds the cooling water injection pipe 329c. If only a single cooling gas is used as the cooling fluid, the residue of the injected cooling gas will not cause contamination of the motherboard, but when cooling gas and cooling water are used as the cooling fluid, the injected cooling water will greatly pollute The motherboard 100 and a cutting device. Therefore, it is necessary to additionally provide a cooling water draining device in the cutting device. The use of this additional cooling water drain will cause a cooling area to be enlarged, causing cracks to exceed the cutting path. To solve this disadvantage, the cutting device of the present invention is provided with a cooling fluid absorption pipe 329d surrounding the outer surface of the cooling gas injection pipe 329b, as shown in FIG. The cooling fluid absorption pipe 329d is connected to a vacuum generating unit (not shown) so that the injected cooling water can be discharged to the cooling fluid absorption pipe 329d after cooling the workpiece. Figures 13A to 13D show a rapid cooling unit of a non-metal substrate cutting device according to another embodiment of the present invention. The laser beam moving along the pre-tangent line has a relatively fast forward speed. Therefore, it is difficult for the cooling fluid absorption pipe 329d having the structure shown in Figs. 11 and 12 to completely absorb the remaining cooling water in a short time. As shown in Figures 13A to 13D, in order to completely absorb the residual cooling water in a short period of time, a residual cooling water absorption unit 362 is provided in the cooling water. The paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) 21 I I --- i — — — — — — ^ · —--— II I (Please read the notes on the back before filling this page)

A7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (l9) Behind the injection pipe 329c, preferably about 50mm from the cooling water injection pipe 329c, or approximately pE behind the 170 edge of the laser beam. Between 0 and 200 mm 'is shown in Figure 13c. The residual cooling water absorbing unit 362 generates vacuum ' and can absorb the residual cooling water on a moving substrate to help the substrate completely separate. The vacuum generated by the absorption unit 362 will also generate a force in the z-direction 'which can absorb the residual cooling water and assist the substrate to be completely separated. In order to exert the maximum suction force, it is necessary to make the vacuum as close to the surface of the substrate as possible without touching the surface of the substrate. In order to keep the minimum distance and avoid contacting and blocking the vacuum, a set of elastic rollers 366 made of rubber will be provided at the outer edge of the vacuum suction hole of the absorption unit 362, as shown in FIG. 13D. The wheels 366 contact the substrate on both sides of the cutting line. When the absorption unit 362 is operated under vacuum to suck the residual cooling water into its holes, the set of wheels will be pressed against both sides of the cutting line of the substrate with a force in the direction of the Z axis. In other words, the vacuum will apply a force to the cutting line in the positive Z axis direction, and the wheel will apply a force in the negative Z axis direction, so a lever fulcrum will be formed to help complete separation. This is important for thick glass and laminated structures, because the applied force will form and coalesce behind the laser beam. This will help maintain the linearity of the cut. Since the local force is behind the cutting line, the linearity can be maintained. Figures 14 to 19 show an example of an auxiliary separation unit, which can help to completely separate a non-metallic material in a single operation when, for various reasons, sufficient cracks cannot be completely separated from a non-metallic substrate. Substrate. Please refer to Figures 14 and 15. The auxiliary separation unit contains: accommodating ditch (or -I ----- installation -------- order -------- (Please read first (Notes on the back then fill out this page)

473794 A7 B7 Five # Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and a description of the invention (20) Channels) 246a, 246d are provided on the receiving plate 246 in a grid shape corresponding to the pre-cut line; A groove tube 246b is accommodated, and a cooling fluid supply unit 246c is connected to the groove tube 246b. Specifically, as shown in FIGS. 14 to 16, the receiving grooves 246 a and 246 d extend in a grid shape along the X and Y axis directions of the coordinate system shown in FIG. 14, so they correspond to each other. Four edges 30a, 30b, 30c, 30d of one LCD unit body 30 on one of the motherboards 100. The first receiving groove 246a is formed by extending in the X-axis direction, and the second receiving groove 246d is formed by extending in the Y-axis direction. One end of the groove tube 246b is closed but the other end is opened, and is embedded in the first and second receiving grooves 246a and 246d, as shown in FIG. One of the openings of the slot tubes 246b is connected to the cooling fluid supply unit 246c, and cooling fluid can be independently supplied to each of the slot tubes 246b. When the fluid is supplied into the groove tube 246b, the groove tube 246b will expand and protrude from the surface of the receiving plate 246 to a certain height, as shown in FIG. When the grooved tube 246b expands and protrudes, its protruding portion will push against the corresponding pre-cut line of the mother board 100, and a tensile stress will be applied along the pre-cut line of the mother board 100. The fluid used is preferably a cooled fluid. Therefore, after using the auxiliary separation unit to concentrate the tensile stress on the pre-tangent line, when the rapid local heating and cooling is performed as described above, although the cracks generated by the rapid heating and local cooling are not enough to separate the mother Board, but the motherboard 100 can still be completely separated in one operation. Among them, the stress intensity to be applied is obtained through various tests and simulations. When a unit is to be separated by a mother board, one of the pre-cut lines of the mother board will first -------------— — — — — — — — β-— — — — — — (Please read the precautions on the back before filling out this page) This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) 23 473191 A7 B7 V. Description of the invention (21) (Please read the notes on the back first (Fill in this page and fill in this page again) It is separated by the method described above, and then the crack generating assembly 300 has a drive unit to move to the next pre-cut line. At this point, the fluid supplied to the aforementioned tubing will: be drained. The fluid is fed into the other tank tube again, and the other pre-cut line ^ is rapidly heated and cooled to separate the other pre-cut line. The foregoing steps are repeated, and the mother board 100 completely separates a unit body and the operation of the cooling fluid supply unit 246c is performed by an electromagnetic beam (not shown). Hereinafter, a method of separating the LCD unit body from the mother board will be explained in detail. A mother board 100 is calibrated and fixed on one of the receiving boards 246 of the transfer assembly 2240 described above. The motherboard 100 has an area including a plurality of unit bodies. a The driving unit in the crack generating assembly 300 will be operated so that the crack generating unit 320 and the preheating unit 330 are aligned at a predetermined position of the motherboard 100, for example, to be cut One line. Then, the transfer assembly 240 operates the conveyor belt 242 to transfer the motherboard 100 at a certain speed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs When the motherboard 100 reaches the bottom of the crack generating assembly 300, the preheated laser beam generating unit 420 generates a laser beam. The laser beam is input into a laser introduction unit 322 via an optical system. Then, the forward direction of the laser beam is transformed by the laser beam direction conversion mirror 33b toward the inside of the casing 333. Then, the laser beam is processed into at least one preheated laser beam passing through the lens unit 334 and then irradiated on the pretangent line. However, by using the upper and lower units 334b to regulate the distance between the surface of the motherboard 100 and the lens unit 334, the preheating laser beam will preheat the surface of the motherboard 100 to a predetermined temperature. When preheated, the motherboard 100 is being conveyed by the conveyor 240. When 24 paper sizes are in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 473794 A7 _______________ B7 V. Description of the invention (22) The mother board reached the initial crack At the unit 350, the unit 350 will generate an initial crack at the cutting start point of the pre-cut line of the motherboard 100. The initial crack is formed along the pre-cut line of the motherboard. Then, the mother board 100 will be further transported to reach the crack generating unit 320. When the motherboard 100 reaches the crack generating unit 320, a laser beam generated by the laser beam generating unit 410 is input into the laser beam introducing unit 322 via an optical system. Then, the laser beam is input into the profile changing lens 324 provided in the housing 323 through the direction conversion mirror 328. The input laser beam is processed into an ellipse, and its long axis is aligned along the pre-tangent line, and a part of the initial fracture of the pre-cut line is irradiated. The laser beam is input to an optical path conversion lens 328c provided in the irradiation path, and the lens 328c reflects the input laser beam and changes its advancing path toward the laser beam focusing lens 328e. Then, the laser beam is reflected again by the focusing lens 328e, so that its forward path directly faces the pre-tangent line, and finally focuses on the pre-tangent line. The focused laser beam will rapidly heat the pre-tangent line locally. Then, a mixed cooling fluid including a cooling gas and a cooling water, or a mixed material of the cooling gas and the cooling water, will be injected into the locally heated portion of the pre-cut line. Wherein, the mixed cooling fluid injection portion overlaps the local heating portion. Specifically, 'the mixed cooling flow system is injected into the locally heated portion, so a high thermal stress is generated on the mother board 100. Therefore, injecting a cooling fluid into the locally heated portion will more effectively apply thermal stress to the motherboard. The generated thermal stress will cause a crack to expand from the top surface of the mother board 100. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 25 ----------- -I ^ · I I ----- til —-II (Please read the notes on the back before filling this page) 473794 A7 ____ B7___ V. Description of the invention (23) to the bottom. Depending on the intensity of the thermal stress, the part corresponding to the pre-cut line will be partially or completely separated. After a pre-cut line is divided in the aforementioned manner, the remaining pre-cut lines on one side of the motherboard are also divided in the same manner. Then, the mother board 100 can be inverted by rotating the rotating unit 245 of the transfer assembly 240, so that the glass on the other side of the mother board can be separated in the same way. Therefore, an LCD unit body can be separated by the motherboard. Fig. 20 is a sectional view showing a separating method using an auxiliary separating unit according to another embodiment of the present invention. Referring to FIG. 20, instead of placing the grooved tube 246 on the receiving plate as in the previous embodiment, a thermal expansion member 2 5 6 made of a metal or other material having a high thermal expansion coefficient is provided in the groove. The thermal expansion member 2 56 can expand under the glass in a short time, and when the preheating and cutting laser beams are irradiated, the glass is slightly raised, which will help it completely separate. This increase in bulging will generate a shear stress along the direction perpendicular to the pre-cut line, as shown in Figure 19, which will help the formation and expansion of cracks. Since the expansion is local, it can maintain the force behind the irradiated area, so it is a bit similar to the previous disclosure, and it helps to maintain linearity. In the case of glass', a YAG (or other) laser can be introduced to pass through the glass and shine on the surface material. The thermal expansion member 256 may need to be coated with a black paint or other highly absorbing material to enhance radiant heat transfer. Due to the time constants involved, the YAG laser should be introduced into the material slightly earlier or later in the CO2 heating zone depending on the thermal conductivity and reaction time. Yet another auxiliary separation unit that can help complete the separation, is a paper size that applies the Chinese National Standard (CNS) A4 specification (2) 0 X 297 public love) (Please read the precautions on the back before filling this page) Installed 丨 丨 丨 丨 丨 Order 丨 丨 Line I. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 26 A7 B7 V.

Hr Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy Invention Description (24) A flexible material with certain flexibility is sandwiched between the workpiece and the receiving plate 246. The glass substrate must have a space to flex at the point of complete separation, and avoid applying a vacuum directly under the cut. Therefore, it is better to make the inflammation material have a softness of 70 A to 80 A, which may include a metal (such as an inscription) sheet on the top of the material and under the cutout to assist heat conduction. Another advantage of this method is that the clips can be easily replaced without having to replace the entire processing table each time the product is changed. In order to be able to grind and / or melt the newly formed glass edge immediately after being completely separated by the laser, YAG or other lasers may be used. This can be completed in a single operation, such as irradiation, cutting and trimming. In addition to saving time, its advantages are: 1) the glass has a higher local temperature and helps to absorb so it can reduce energy requirements, and 2) a better irradiation angle can provide a good point for the YAG laser beam point "Target". In addition, this method can add additional thermal energy to the rear "fracture zone", which will increase the force required for complete separation. The size of the YAG laser beam can be: 1) an elliptical beam can cover the two Side (for example, 300x200 microns), or 2) double elliptical beams (for example, ιιοχιιιμιη) who shine on the edges of both sides. In addition, the above-mentioned separating device and method can also be used for slicing. Cutting failure will occur at the starting and ending points of cutting. This is due to the existence of fine cracks at the starting and ending points of cutting. When high thermal stress is applied to the starting and ending points, these micro-slits It is possible to deviate the actual cutting line from the pre-cut line. Therefore, it is necessary to prevent excessive stress from being applied to the starting and ending points of cutting. Then, 'will explain that guides can be avoided at the starting and ending points of cutting-— — — — — — — — · 1111111 ^ · 1111111 (Please read the notes on the back before filling this page)

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 473794 _ A7 _____ B7 V. Description of the Invention (25) Different embodiments of cracks that cause cutting failure. FIG. 21 illustrates a method for controlling the transmission speed of the motherboard 100. Specifically, the speed of the conveyor belt 242 of the drive receiving plate 240 will increase at the cutting start point 1100, and will decrease after passing through the starting point 1100, and will increase again at the cutting end point 1200 to avoid The micro-seam at the starting point 1100 and the ending point 1200 caused cutting failure. Another embodiment that prevents micro slits from causing failure is to change the energy level of the laser beam. The focused area of the laser beam is reduced at the starting point 1 100 and the ending point 1200, and the original focusing area is restored between the starting point 1100 and the ending point 1200, which is obtained by the aforementioned crack generating unit 320. The upper and lower unit 325 is controlled by a shutter with adjustable laser beam length. In addition, another embodiment is to change both the energy level of the laser beam and the transfer speed of the motherboard 100 at the same time. Specifically, the transfer assembly 240 allows the mother board 100 to be transmitted faster, and the energy level of the laser beam is controlled in accordance with the transmission speed of the mother board 100. Fig. 22 shows still another embodiment using an auxiliary separation unit. Referring to FIG. 22, a mechanical impact system is applied to the back surface 120 of the motherboard using a vibrator 600, and a preheating laser beam is irradiated by the preheating unit 330 along a precut line. After the elliptical heating laser beam passes through the profile-changing lens and a cooling liquid is injected into the pre-heated and then heated pre-tangent line on the motherboard, the vibrator is used to apply a periodic vibration. The mechanical impact helps to completely separate the motherboard. In order to improve its separation speed and cutting accuracy, the mother board must be heated (please read the precautions on the back before filling this page). Installation -------- Order H- ·

A7

丨 Threat The temperature difference between the first degree printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and the second temperature at the time of being cooled should be as large as possible. In the second embodiment, during the aforementioned rapid heating and rapid cooling, the month J is first blown on the mother board with a pile of warm air, which will increase the first temperature more than the second temperature. In another embodiment, a forced cooling unit such as a pehier module 329e shown in FIG. 12 is configured to inject a rapid cooling unit 70 into the rapid heating portion of the workpiece. The temperature of the cooling fluid is forcibly reduced. Better results can be obtained by using the two aforementioned embodiments together. As described above, the present invention can effectively absorb the cooling residue on the non-metal substrate after the cutting is completed. The present invention can completely separate a non-metal substrate by using vacuum or external force to improve the cutting ability. The invention also improves the cutting accuracy by increasing the temperature difference between the heating temperature and the cooling temperature on the cutting line of a non-metallic substrate. The invention can also improve the cutting speed of a non-metal substrate. The invention can also minimize the cutting allowance for cutting non-metal substrates. Although the present invention has been described in detail, it should be understood that there are many variations that can be implemented 'without exceeding the spirit and scope of the invention as defined by the scope of the patent application. This paper size applies to the Chinese national standard (CNS> A4 specification (210 X 297 mm) 29 — — — — — — — — — — — — — — — — 1111111 · (Please read the precautions on the back first (Fill in this page again) 473794 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (27) Component number comparison 1 ... Wafer 243 ... Support plate 2 ... Semiconductor wafer 245 ... Rotating units 2a, 4a, 150, 190 ... Pre-cut line 246 ... Receiving plate 3 ... Mother plate 246a, d ... Accommodation groove 4, 30 " LCD unit body 246b ... Slot tube 100 " LCD mother plate 246c ... Cooling fluid supply unit 110 ... Upper mother glass plate 256 ... thermal expansion member 120 ... lower mother glass plate 300 ... crack generating assembly 130 ... color filter substrate 310 ... guide block 140--TFT substrate 311, 312 ... opening 160 ... liquid crystal 320 ... crack generation unit 17 0 ... heating source 321, 322 ... laser introduction unit 175 ... seal line 323, 333 ... housing 180 ... cooling fluid 324 ... profile change lens 210 ... base 324a ... Concave lens 212 ... bottom plate 3 2 4 b ... convex lens 220 ... pillar 32 5. 334b ... upper and lower unit 230 ... bracket 326 ... gate-240 ... transfer assembly 327 ... quick cooling unit 24b ... fixing rod 328 ... laser beam path conversion mirror 241a ... claw 328a, 328b ... beveled surface 242 ... conveyor belt 328c ... laser beam path conversion lens (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 30 473794 A7 B7 t V. Description of the invention (28) 328d ... receiving hole 328e ... laser focusing lens 329a ... cooling fluid 329b ... cooling gas injection pipe 329c ... cooling water injection pipe 329cl ... cooling water absorption pipe 329e ... Pa Ear sticker module 330 ... preheating unit 331 ... laser beam direction conversion mirrors 332, 332a ... laser beam 334 ... lens unit 334a ... lens 340 ... fixing plate 350 ... initial crack generating unit 35 diamond Knife 353 ·· Diamond Knife Drive Unit 362 ·· Residual Cooling Water Absorption Unit 366 ·· Erase Wheel 400 ·· Laser Beam Generation Unit 410 ·· First Laser Beam Generation Unit 420 ·· Second Laser beam generating unit 500 ... cutting device 600 ... vibrator 11 00… cutting start point 1200… cutting end point ------------- installation -------- order · (Please read the precautions on the back before filling this page)

V Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy-Line · 31 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

88899 ABCD Printed clothing for employees' cooperatives in the Intellectual Property Bureau of the Ministry of Economic Affairs, applied for patent coverage 1. A device that can divide non-metal substrates, including:. A gift; a transfer assembly is located in the seat, can be The non-metallic substrate is conveyed in the cutting direction. A rapid heating unit is set in the base and separated from the non-metallic substrate by a predetermined distance. A pre-cut line can be included on the surface of the substrate by irradiating a heating beam. One of the first zones for rapid heating; a fast cooling unit is arranged on the irradiation path of the heating beam, and can be quickly cooled by injecting a cooling source into one of the second zones containing the heated pre-cut line on the surface of the substrate; And an optical path conversion unit can change the irradiation path of the heating beam, so that the heating beam output by the rapid heating unit can reach the surface of the non-metal substrate without being blocked by the rapid cooling unit. 2. The device according to item 丨 of the patent application range, wherein the rapid heating unit includes: a heating beam generating unit that can generate a heating beam; and a heating beam shape processing unit that can process the heating beam output by the heating beam generating unit. Shape, and the heated beam whose shape has been processed is projected on the aforementioned first area. 3. The device according to item 2 of the scope of patent application, wherein the heating beam shape processing unit includes: a cylindrical housing having two open ends; and a compound lens unit provided in the housing, and including a concave lens having r-concave The curved part is set on the top surface of the compound lens unit and a convex lens. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love). 32 — ^ ------- Order · ——IAWI (Please read the notes on the back before filling this page) A convex arch portion is provided on the bottom surface of the compound lens unit; (Please read the precautions on the back before filling this page) The compound lens will convert a circular input beam into an elliptical output beam. 4. The device according to item 3 of the scope of patent application, wherein the housing includes an upper part and a lower part, and the composite lens unit can be moved up and down to control the scanning area of the heating beam. 5. The device according to item 3 of the patent application, wherein the casing includes a gate provided in the casing to block a portion of the heating beam passing through the compound lens unit. 6. The device according to item 1 of the patent application scope, wherein the rapid cooling unit comprises: a cooling source supply unit capable of supplying a cooling source; and a cooling source injection pipe forming a passage to transport the supply from the cooling source supply unit Cooling source. 7. The device according to item 6 of the scope of patent application, wherein the light path conversion unit includes: a clothing order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, a clothing printing path, a heating beam path conversion lens covering the cooling source injection tube, and fixed to the In the rapid heating unit, the forward path of the heating beam can be converted into a first path; a heating beam focusing lens can transform the first path into a second path, so that the heating beam traveling along the first path can be focused on The first zone. 8. The device according to item 1 of the scope of patent application, wherein the transfer assembly includes: • one conveyor belt has one belt; 33 of this country ’s national standard (CNS) A4 specification (〇x 297 public love) 4 9 7 m A8B8C8D8 6. Scope of patent application A plate is fixed on the belt and can be transferred in the cutting direction; a rotating unit is provided on the top surface of the plate and can rotate the non-metal substrate parallel to the plate; and A receiving plate is fixed on the rotating unit and can rotate with the rotating unit, and the non-metal base material can be fixed on the receiving unit. 9. The device according to claim 1 in which the non-metal substrate is a glass substrate or a broken substrate. 10. The device according to item 9 of the scope of patent application, wherein the heating beam is a laser beam emitted by a CO2 laser, and the laser beam has a wavelength of 1.06 // m when it is applied to a glass substrate, For silicon substrates, the wavelength is ⑽⑽ to ⑺ or lower. 11. The device according to item 丨 of the patent application scope further includes an initial crack generation unit capable of causing an initial crack at the starting point of the pre-tangent line, which includes: a rod provided at a predetermined position of the rapid heating unit, Between the rapid heating unit and the rapid cooling unit, it can move up and down; and a rotatable diamond knife is coupled to a rotating shaft of the rod. 12. The device according to item 11 of the patent application scope, wherein the initial crack generating device includes: a heating beam generating green element can generate an initial heating beam to cause the initial crack; and an output unit can be generated by the heating beam generating unit The generated initial heating beam is projected on the starting point of the pre-tangent line. 13. · For example, the device in the scope of application for patent, the heating beam will quickly adapt to the Chinese standard (CNS) A4 specification (210 X 297 mm). Fill out this page ℴ Printed by the Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economics 34 173794 A8 B8 C8 D8 Printed by the Employees’ Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 6. Scope of patent application The surface of the non-metal substrate is heated in a bundle, and the cooling source will quickly cool the surface of the non-metal substrate. 14. The device according to item 1 of the patent application scope, wherein the second zone is located in the first zone. 15 · —A device for slicing a non-metallic substrate, including: a body; a transfer assembly is disposed in the base, and can transfer the non-metallic substrate along the cutting direction; a crack generating unit includes: ( a) —The rapid heating unit is arranged in the base body, and is separated from the non-metal substrate by a predetermined distance. The first region can be rapidly heated by irradiating a heating beam, and the first region includes the surface of the substrate. One of the pre-cut lines' the pre-cut line will be set with a heating beam; and (b)-a rapid cooling unit is provided in the irradiation path of the heating beam, and a second source can be rapidly cooled by injecting a cooling source, the The second zone includes a pre-cut line that has been heated on the surface of the substrate; and a pre-heating unit can pre-heat the pre-cut line with a pre-heated beam before projecting a rapid heating beam. 16. The device according to item 15 of the scope of patent application, wherein the preheating unit comprises: a cylindrical casing having two open ends; and a preheating beam generating lens is provided in the casing, when at least one preheating beam is inputted The preheating beam can be processed at a time; and an up and down unit can move the preheating beam generating lens up and down to control the focus of the preheating beam emitted by the lens. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -------------- installed ------ order ---- · line {Jing Xian Read the notes on the back and fill out this page} 35 Scope of patent application Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 17. If the device under the scope of patent application is No. 15, the second area is located in the * area. I8 · —A device capable of slicing non-metallic substrates, including: a body; a transfer assembly is provided in the base, which can convey a non-metallic substrate along the cutting direction, and The substrate is fixedly mounted on the substrate; ° An auxiliary cutting unit is provided at a predetermined position of the transfer assembly, and a physical external force can be applied to a pre-cut line on the surface of the non-metal substrate to help the substrate completely separate ; A rapid heating unit is set in the base and separated from the non-metal substrate by a predetermined distance. A first zone can be rapidly heated by irradiating a heating beam, and the first zone includes a pre- Tangent line; a rapid cooling unit can rapidly cool a second zone by injecting a cooling source, the second zone includes a pre-tangent line on the surface of the non-metallic substrate; and a light path conversion unit can change the irradiation path of the heating beam 俾The heating beam output by the rapid heating unit can reach the surface of the non-metal substrate without being blocked by the rapid cooling unit. 19. The device according to item 8 of the scope of patent application, wherein the auxiliary cutting unit includes: a receiving groove is provided on the receiving plate of the transfer assembly in a grid shape corresponding to the pre-cut line; Installed in the receiving groove, you can inject liquid into the tube 1 ^ Today -------- ^ --------- (Please read the precautions on the back before filling this page) 473794 A8 B8 C8 __D8 6. Within the scope of the patent application u, it expands and protrudes from the surface of the receiving plate; and-a liquid supply unit can supply liquid into the expansion tube. ^ 20. The device according to item 18 of the patent application scope, wherein the auxiliary cutting unit package * includes a vibration generating unit, which can apply vibration to the pre-cut line on the back of the non-metal substrate. 21 • The device according to item 18 of the patent application scope, wherein the second zone is located in the first zone. 22. —A device capable of cutting non-metallic substrates, comprising: a transfer assembly having a receiving plate for fixing a non-metallic substrate, and the substrate can be conveyed along a cutting direction; a cutting assembly Including: (a)-the heating unit can rapidly heat a first zone by irradiating a heating beam; the first zone contains a pre-cut line on the surface of the non-metallic substrate; (b)-the cooling unit can be injected by a cooling source To quickly cool a first. The first zone contains the heated pre-cut line on the surface of the non-metallic substrate; and the printed clothing of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ------------- -Install -------- Order · (Please read the precautions on the back before filling in this page) (C) An optical path conversion unit can change the irradiation path of the aforementioned heating beam ', so that the rapid heating unit output The heating beam can reach the surface of the non-metal substrate without being blocked by the cooling unit; a cooling residue absorbing unit can absorb the cooling residue left on the pre-tangent line. Device, wherein the transfer assembly includes a thermal expansion element It has a high thermal expansion coefficient, and the paper size corresponding to the non-metallic substrate applies the Chinese National Standard (CNS) A4 specification (210 X 297 g) 37 0794 A8 B8 C8 D8 24. The device according to item 22 of the scope of patent application, wherein the transfer assembly includes a flexible member provided on the receiving plate and has softness, and can be absorbed when an external force is applied to the non-metal substrate. 25. The device according to item 24 of the scope of patent application, wherein the softness of the flexible member is in the range of 70 A to 80 A, and the order is that the sheet metal strip is provided on the top surface of the flexible member and 26. The device according to item 22 of the patent application scope, wherein the cooling residue absorbing unit comprises: a residual cooling liquid absorbing part capable of generating vacuum suction, and having an absorbing pipe for absorbing the cooling liquid remaining on the pre-cut line And a pair of wheels are elastically pressed on both sides of the residual cooling liquid absorbing portion, and a predetermined interval can be maintained between the end of the absorbing tube and the surface of the non-metal base material during the absorbing operation. The device according to item 26, wherein the absorption tube is located at 0 to 200 mm behind the rear edge of the heating beam. 2 8. The device according to item 22 of the patent application range, wherein the second area is located in the first area 29 · —A method for slicing a non-metallic substrate, including the following steps: conveying a conveying plate on which the non-metallic substrate is fixed along the conveying direction; preheating a first zone 'which includes the surface of the non-metallic substrate One of the pre-cut lines, •• Using a heating beam to quickly heat the pre-heated first (please read the precautions on the back before filling this page) -----— 丨 —Order ---— — — — — — · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -38 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs—injection-cooling originates from-the second zone including the aforementioned pre-cut line 'and the first zone that has been rapidly heated is quickly cooled again to divide the non-metal-based material. 〇 The method of claim 29, wherein the non-metallic substrate has a faster transfer speed between the start point and the end point of the pre-tangent line than the transfer speed between the start point and the end point. 31. The method of claim 30, wherein the energy level at the start point and the end point of the pre-tangent line is lower than the energy between the start point and the end point. 32. The method of claim 29 in the patent scope, wherein the second zone is located at the -033 type of device capable of slicing non-metallic substrates, including: a rapid heating unit can irradiate a heating beam to quickly Heating a first zone, the first zone including a pre-cut line on the surface of the non-metallic substrate; and a rapid cooling unit provided on the irradiation path of the heating beam, which can be rapidly cooled by injecting a cooling source The second zone includes a pre-cut line on the surface of the non-metal substrate; wherein the rapid cooling unit includes: (a) a cooling source supply unit that can supply the first and second cooling sources; (b) a cooling source injection unit A first cooling source injection pipe can be used to inject the first cooling source onto the second zone, and a second cooling source injection pipe surrounds the first cooling source injection pipe, and a second cooling source can be injected into the paper Standards are applicable to China National Standard (CNS) A4 specifications (21 × X 297 mm) ------------- Installation -------- Order · C Please read S3 on the back first Intentions to save and fill the tribute] Line 39 173794 A8 B8 C8 D8 Co-op Board printed six employees, the scope of patent application a second region; and (C) a cooling source of the absorption unit surrounding the outer surface of the second cooling tube of the injection source, and can absorb the first and second cooling source. 34. The device of claim 33, wherein the first cooling source is a cooling water and the second cooling source is a cooling gas. 35. For a device in the scope of application for item 33, the second zone is located in the first zone. 36. A method for slicing a non-metallic substrate, comprising the steps of: embossing a selected portion of a transfer plate on which a non-metallic substrate to be sliced is fixed, and applying a tensile stress to the substrate A pre-cut line corresponding to the raised portion; conveying the conveying plate along a conveying direction; generating an initial crack at a cutting starting point of the pre-cut line of the non-metal substrate; irradiating a heating beam to Quickly heating a first zone containing the pre-cut line; by injecting a cooling source from a second zone containing one of the pre-cut lines that has been rapidly heated, and rapidly cooling the fast-heated first zone to divide the non- Metal substrate. 37. According to the method of claim 36 in the scope of patent application, the selected part of the transmission plate in # includes a receiving groove to accommodate an expansion tube, and the expansion tube can be expanded by supplying a cooling fluid into the expansion tube. . 38. The method of claim 36, wherein the second zone is located in the first zone. This paper size ⑽ ---- J --- ^ ------------- ^ --------- IA _ ^ — < Please read the notes on the back before filling (This page) 40 i? 3794 A8 B8 C8 D8 # Consumption of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the agency. 6. Patent application scope 39. A method for cutting non-metallic substrates, including the following steps: Transport a non-metal substrate in the direction; firstly preheat the top surface of the substrate by blowing a high-temperature dry air onto the surface of the substrate; pre-heat a first zone again, which contains the substrate to be cut A pre-cut line on the surface; an initial crack is generated at the cutting start point of the pre-cut line of the substrate; a pre-heated first area of the substrate is rapidly heated by irradiating a heating beam; and the use of a forced cooling The unit injects a cooling source to rapidly cool a second zone containing the pre-cut line to slice the non-metallic substrate. 40. The method according to claim 39, wherein the forced cooling unit is a Peltier module. 41. The method of item 39 of the patent scope of claim 4, wherein the second zone is located in the first zone. 42. A method for slicing a non-metallic substrate, comprising the following steps: conveying a non-metallic substrate along a conveying direction; irradiating an oval heating beam on a pre-cut line on the surface of the substrate; and rapidly heating a substrate including The first region of the pre-cut line; and • rapidly cooling a first region containing the pre-cut line by an injection-cooling source to cut the non-metal substrate. 43. The method of claim 42 in which the second zone is located in the first zone. With -------- ^ --------- itch, (please first «read Jiang Yishi on the back side 顼 Cunqi write Ben Gong) 41