TW469262B - Method of cutting glass substrate and apparatus for doing the same - Google Patents

Abstract

There is provided a apparatus for cutting a glass substrate by heating or cooling the glass substrate to thereby produce thermal stress in the glass substrate and have the glass substrate cracked, including (a) a heater which heats the glass substrate along a line along which the glass substrate is to be cut, (b) a sensor which detects a head of a crack developing in the glass, (c) a cooler which partially cools the glass substrate in the vicinity of the head of a crack, (d) a first unit which transfers the sensor along the line, and (e) a second unit which transfers the cooler along the line. The apparatus makes it possible to cut a glass substrate without generation of glass chip, even if the glass substrate is thick.

Description

46 92 6 2 V. Description of the invention (1) ~ '— [Background of the invention] [Field of the invention] The present invention relates to a method for cutting a glass substrate. The glass substrate 2 is used as a display device such as a liquid crystal display device or a plasma display device. , Screen, and also about a glass substrate cutting equipment. In particular, the present invention relates to a method and a device for cutting a glass substrate, which heats or cools the glass substrate to generate thermal stress in the glass substrate and break the glass substrate. [Explanation of Related Techniques] The conventional method of cutting fragile materials such as glass includes: scraping the fragile materials with a harder material such as diamond to successfully form a crack or groove on one of the surfaces of the fragile material And applying force along the crack or groove: impulse or load on the fragile material. For example, a method of manufacturing a liquid crystal display device or a plasma display device usually includes the aforementioned step of cutting a glass substrate. However, the aforementioned conventional method of cutting fragile materials is accompanied by a problem: when cutting fragile materials, fragments are generated. In the manufacture of liquid crystal display devices and plasma display devices, a circuit pattern is formed on a glass substrate with a southerly degree. Therefore, when the glass substrate is cut by the aforementioned conventional method, fragments generated by cutting the glass substrate remain on or adhere to the circuit pattern, causing defects in the circuit pattern, such as a short circuit due to the fragment. Accordingly, the manufacturing method of the liquid crystal display device or the plasma display device must include a step of washing away the debris after the glass substrate is cut.

469262 V. Description of the invention (2) Therefore, in a liquid crystal display device or a plasma display device, a glass substrate cutting method that does not generate debris is needed. In response to this demand, a cutting method of a glass substrate has been proposed which causes heat stress in the glass substrate by heating or cooling the glass substrate. ... / v

For example, one of these methods has been proposed in Japanese Unexamined Proclamation No. 5-221 6 73. The method proposed in Japanese Unexamined Patent Publication No. 5-221 673 will be described below with reference to the drawings] and 2. W, FIG. 1 shows a fragile perspective view to be cut by the proposed method, and FIG. 2 shows a plane circle of the fragile plate. Referring to FIG. 1, the fragile plate 丨 will be cut along a target line 2. An earthenware 3 is located just below the target line 2. The heater 3 includes a heating port. Although the electric power is supplied from a power source (not shown) to the heating wiring, the heating unit 3 is heated at the target line 2 to heat the fragile plate 1. A vertical groove 5 is formed at the end surface 4 of the fragile plate 1, and π visits A ″ I. For example, the vertical groove 5 is formed by a m stone glass cutter. The upper surface 6 of the fragile plate 1 is drilled and drilled to form a small groove 7 along the target line 2. Capability: The formation makes it possible to accurately cut the fragile flat plate along the target line 2] becomes a small markable line 2: easy to add: the flat plate is required: -Operator operation. Although the 1-unit and 8-unit heaters are not heated, the fragile plate Γ is locally heated. The required heating ... 8 includes cutting of the fragile plate 1 as follows. 46 92 6 2 V. Description of the invention (3) First, the lower surface of the fragile plate 1 is heated by the heater 3 along the target line 2. The fragile plate 1 is heated by the & heater 3, and thermal stress is generated at the target line 2. Specifically, as shown in FIG. 2, the tension A is generated on the opposite side of the target line 2 and the tension A is pulled outward from the target line 2 from the target line 2. As shown in FIG. 1, the tension A is easily generated on the fragile plate i. Of the end surface 4.然 ^ 'The main heater unit 8 is along the target line 2 1 from the vertical groove 5 @: Borrow-the main heater unit 8 is used to locally generate the thermal stress field, & A part of the flat plate 1 is a radial real estate L = where the fragile plate 1 is heated by the main heater unit 8. Exceeding the "flat heating ^ yuan 8 force mouth heat fragile flat plate 1 tension target line 2 rupture ... the world tensile strength is increasing, the fragile flat plate 1 starts to break along the flattening surface 4 along the target The main plate moving along line 2 is followed by: standard: 2 easy: ^ ^ degrees and plus: surface ί :: J1 The rupture rate is determined by the temperature of the heater 3. The temperature of the required heating unit 8 and The group of heating area 〇 county touches the foregoing by heating or cooling the fragile flat yoke-Shengshi engages in the custom of the seven private fragile plates = 2 ten plates cause thermal stress in the previously known The square-flavored cutting method is accompanied by the following problems. Small grooves are formed along the target line 2 / A flat plate i must be absolutely cut before cutting the fragile plate 1.… wide groove 7 to accurately cut the fragile along the target line 2 When the fragile plate 1 is thick, a deep groove 7 must be formed so that

Page 7 469262 V. Description of the invention (4) A flat cutting table is obtained at the place where the fragile flat plate 1 is cut. Therefore, in the aforementioned conventional method, °. A large amount of debris for precise cutting of fragile flats can avoid a flat spot where a flat cutting surface is produced. The resulting defect in the circuit on the frangible plate 1 is cut. Potentially formed in the aforementioned conventional method, the fragile flat is controlled by conditions for heating the fragile flat plate 1. Missing: Knife f: The rate is only increased by the rate. In other words, once the rate is easily controlled, the conventionally impossible method cannot increase the rate, and therefore the rate at the time of rupture. j can be accurately increased under control. In addition, in the conventional method described above, when the rupture of the stalk 1 occurs, the main heater unit 8 is moved: and therefore broken: added to the fragile plate 1. The rate is different from the expected rate according to the predetermined conditions for fragile flattening, then the operator must = it follows the development of cracks in the fragile plate i, which is similar to the operator. [Summary of the Invention] In view of the foregoing problems of the prior art, one object of the present invention is to provide a method and apparatus for accurately cutting a glass substrate without generating glass fragments, even for a thick glass substrate. 2. Another object of the present invention is to provide a method and a device for cutting a glass substrate. The method and the device can increase the rate at which the glass substrate is cut. 469262 V. Description of the invention (5) The rate can be controlled more. Another object of the present invention is to provide a method and equipment for cutting a glass substrate, which no longer requires an operator to follow the development of cracks in the glass substrate, thereby ensuring productivity and thus enhancing the manufacturing rate. In one aspect of the present invention, a method for cutting a glass substrate is provided. By heating or cooling the glass substrate, thermal stress is caused in the glass substrate and the glass substrate is broken, including the following steps: a) in the glass Before a crack in the substrate develops, a line is heated, the glass substrate will be cut along the line, and (b) partly cools the vicinity of the head of the developed crack in the glass substrate. Step (a) may be performed before step (b), or simultaneously with step (b). According to this method, since a glass substrate is preheated at a target line before a crack develops in the glass substrate, the glass substrate can be cut with high accuracy. In particular, if the target line of the glass substrate to be cut is a straight line, the glass substrate can be cut more straightly. In addition, since the vicinity of the head of a crack developed in one of the glass substrates is partially cooled, the temperature gradient near the head of the crack in the glass substrate can be appropriately controlled. So 'now it is possible to cut a glass substrate accurately without generating glass fragments, even for thick glass substrates. Furthermore, the rate at which the glass substrate is cut can be enhanced. The invention further provides a cutting method of a glass-breaking substrate. By heating or cooling the glass substrate, thermal stress is caused in the glass substrate and the glass is cut.

469262 V. Description of the invention (6) The glass substrate is broken, including the following steps: (a) Before a crack in the glass substrate develops, a line is heated, and the broken glass substrate will be cut along the line. The heater heats the glass substrate when contacting the line, and (b) partially cools the vicinity of the head of a developed crack in the glass substrate by a cooler designed to move along the line. According to this method ', since a glass substrate is preheated at a target line before a crack develops in an edge glass substrate by a heater, the glass substrate can be cut with higher accuracy. In particular, if the target line where the glass substrate is cut is straight, the glass substrate can be cut more straightly. In addition, since the heater contacts the glass substrate, the heater can heat the glass substrate with high thermal conductivity. In addition, since the vicinity of the head of a crack that develops in a broken glass substrate is partially cooled by a cooler that can be moved along the line, the glass substrate can be effectively cooled along the line, and the glass substrate can be appropriately cooled. Control the temperature gradient near the head of a crack in the glass substrate. Therefore, it is now possible to cut a glass substrate finely without generating glass fragments' even for thick glass substrates. Furthermore, the rate at which the glass substrate is cut can be enhanced. The present invention also provides a method for cutting a glass substrate. A heater or a cooler is used to locally heat or cool the broken glass substrate, which causes thermal stress in the glass substrate and breaks the glass substrate. The method includes the following steps: (a) the position of the head of a crack generated in the glass substrate is sensed by a sensor, and (b) the position of the cooler is controlled according to a signal sent from the sensor.

Page 10 46926? 5. Description of the invention (7) According to this method, the position of a cracked head is detected by the sensor 'and the position or movement of the cooler is controlled according to the detection result of the sensor rate. Therefore, the temperature gradient near the head of a crack in the glass substrate can be appropriately controlled. Accordingly, 'a glass substrate can be accurately cut without generating glass fragments' even for a thick glass substrate. In addition, the rate at which the glass substrate is cut can be enhanced without the need for an operator to observe a developing crack. The present invention further provides a cutting method of a glass substrate. The glass substrate is locally heated or cooled by a heater or a cooler, thereby causing thermal stress in the glass substrate and rupturing the glass substrate. The method includes: applying: A force reaches the end of the line in the glass substrate, and the force promotes the glass substrate to be easily cut. Generally, the thermal stress used to split a glass substrate along the line is reduced at the terminating end of the line in the glass substrate. According to this method, an external force applied to a glass substrate to break the termination end of the line in the glass substrate is used to ensure an enhanced rate at which the glass substrate is cut. This method preferably further comprises a step of heating the end of the wire so that the increase in temperature at the end is less than the increase in temperature at other parts of the line. According to this method, the temperature gradient at the end surface of the glass substrate can be reduced, and the position is closer to the end of the line. According to this, even if a small crack | mark is generated on the end surface of the glass substrate, it is possible to prevent a crack from developing from the termination end of the line. In another aspect of the present invention, ‘provide a cutting device for a glass substrate’ by heating or cooling the glass substrate, thereby causing thermal stress on the glass.

469262 V. Description of the invention (8) The substrate and the glass substrate are broken, including a heater for heating the glass substrate along a line, the glass substrate will be cut along the line, (b)-sensor 'The head for detecting a crack developed in the glass substrate, (c) a cooler for partially cooling the vicinity of the head of the crack in the glass substrate, (d)-the first unit, To move the sensor along the line, and (e) a second unit to move the cooler along the line. ~ According to this equipment, since a glass substrate is preheated at the target line before a crack develops in the glass substrate, the glass substrate can be cut with higher accuracy. "Especially, if the target of the glass substrate is cut, If the line is straight, the glass substrate can be cut more straight. In addition, since the vicinity of the head of a crack in a bun in a glass substrate is partially cooled, the temperature gradient near the head of a crack in a glass substrate can be appropriately controlled. Therefore, 'a glass substrate can be cut accurately today without generating glass fragments' even for thick glass substrates. Furthermore, the rate at which the glass substrate is cut can be enhanced. For example, the first unit may be designed to act like the second unit, thereby moving the sensor and the cooler along the line. For example, the sensor may include: (b 1)-a beam source for radiating a beam to the glass substrate, which is located below the glass substrate, and (b2)-a light detector for receiving In the beam, the light detector is arranged to receive a beam that has passed through the glass substrate and has been reflected on a surface of the glass substrate. The sensor with the aforementioned structure can accurately detect how a crack develops in

Page 12 5. Description of the invention (9) In a glass substrate. In addition, since the light detector is designed to receive a beam that has been reflected on a surface of a glass substrate, the light source and the light detector can be positioned on the same side as the broken glass substrate. Therefore, a unit for transferring the beam source and the photodetector support can be appropriately moved below the glass substrate. 0 or 'The sensor must include: (b 1) — a beam source for emitting a beam To the glass substrate, and it is located below the glass substrate, (b2)-the first light detection is used to receive the beam, the light detector is arranged to receive the light that has passed through the glass substrate and has been on the glass substrate The beam reflected on the upper surface, and (b3)-the second light detection 'receives the beam, and the light detector is arranged to receive a beam which has been reflected on the lower surface of the glass substrate, in this example The detection of the head of the crack is based on the ratio between the outputs of the first and second light detectors. By using two light detectors, it is possible to accurately detect how a crack develops in a glass substrate. The cooler preferably includes: (c 1) an air source for supplying compressed air, (c2) a first air nozzle, the compressed air is blown to the glass substrate via the first air nozzle, and (c3) A second air nozzle, the compressed air is blown to the glass substrate via the second air nozzle, and the position of the second air nozzle is the opposite side of the first air nozzle with respect to the line. By using two air nozzles', the glass substrate can be cooled by the temperature profile of the glass substrate which is almost symmetrical about a line, and the glass substrate is cut at the line. Therefore, the glass substrate can be cut with high accuracy

Page 13 469262 V. Description of Invention (ίο) Board. The position of the second air nozzle is preferably symmetrical to the first air nozzle. The heater is preferably a heater which is in line contact with the glass substrate at the line. Since the heater wire is in contact with the glass substrate, the heater can heat the broken glass substrate with high thermal conductivity to ensure that the glass substrate can be effectively cut. The heater is preferably located just below the glass substrate so that the heater heats the lower surface of the glass substrate. For this end, the apparatus preferably includes a heater moving unit 'for moving the heater below the glass substrate upward and downward. The heater moving unit ensures that the heater is in contact with the glass substrate, and then ensures the thermal conductivity of the heater to the glass substrate. The apparatus preferably further includes an elastic body, and the heater is connected to the heater moving unit via the elastic body. For example, the elastomer must include a leaf spring. The elastomer guarantees that the heater can closely contact the glass substrate, even if the glass substrate has an uneven surface. Therefore, the heater can heat the glass substrate with high thermal conductivity to ensure that the glass substrate can be effectively cut. Preferably, the apparatus further includes an external force applying device for applying an external force to a termination end of the line in the glass substrate toward the head of the line. For example, the external force applying device includes a pad portion for holding the glass substrate 'and holding the glass substrate, and a roller for applying the external force to the glass substrate.

Page 14 469262

5. Description of the invention on page 15; 11) In general, ί is used to split along the line—the thermal stress of the glass substrate is reduced at the end of the line of the glass substrate t. The external force applying device can be used to split An external force applied to a glass substrate to the terminating end of the line in the glass substrate ensures an enhanced rate at which the glass substrate is cut. The device preferably includes a unit for initially breaking the end surface of the glass substrate. 9 The line starts from the end surface. For example, the unit may include a round cutter. The unit can cut the glass substrate at a predetermined end surface of one of the glass substrates. The device preferably further includes a second cooler for cooling at or near the termination end of the line in the glass substrate. The second cooler must include an air source for supplying compressed air; and an air nozzle located above the glass substrate, so that the compressed air supplied from the air source is blown to the glass substrate through the air nozzle. -The cooler reduces the temperature gradient at the end surface of the glass substrate and its position is closer to the end of the line. According to this, even if a small crack is generated on the end surface of the glass substrate, a crack can still be prevented from the line Development at the end of the termination. [Detailed description of the preferred embodiment] Back to the garden 3 shows the comparison according to the present invention. The front view of the device for cutting the glass substrate of the preferred embodiment is shown in FIG. 4 is a plan view of the device. T > Although the glass substrate 11 is shown by a dotted line in FIG. 4 for the sake of convenience, 12) Non-represents the positional relationship between the glass substrate 11 and the equipment. As shown in Figs. 3 and 4, the glass substrate cutting equipment includes a heater 14 'to uniformly heat the lower surface of a glass substrate 11 along a line 13, and the glass substrate 11 will be along this line (hereinafter referred to as & quot Target line 1 3 ") and a sensor 17 is cut to detect the head of the crack 40 (refer to FIG. 7), the crack 40 is the first to the end of the glass substrate 11 that breaks along the target line 13 The surface 15 develops to the second end surface 16 where the glass substrate 11 is terminated, a pair of coolers 18, each of which partially cools the glass substrate 11 located near the head of the crack 40, and a pair of moving units 19 'each It is designed to be movable parallel to the target line 13 and each of them moves the sensor 17 and the cooler 18 along the target line 丨 3. Although not shown, a circuit pattern is formed on the upper surface 20 of the glass substrate to be cut. When the glass substrate 11 is cut, the glass substrates are arranged so that the surface 20 faces upward, as shown in FIG. 3. The heater 14 is designed to be in line contact with the glass substrate at the target line 13. In the embodiment, the heater 14 is a rod-shaped sleeve heater, which includes a thermal resistance tube and a heating wire, such as a nickel-chromium alloy contained in the tube. The heater 14 is located directly below and parallel to the target line 13: As shown in FIG. 3, a heater moving unit 21 is located just below the heater ". The heater moving unit 21 supports the heater 14 via a leaf spring 22 In the embodiment, although the leaf spring 22 is used as an elastic body, it is necessary to use other elastic restoring parts, such as rubber or a coil instead of the leaf spring 22. π Supervisor

Page 16 46 92 62 V. Description of the invention (13) The heater moving unit 21 is provided with a heater support member 23. Therefore, although the heater 14 is biased upward by the leaf spring 22, the heater 14 is adjacent to the heater support 23 'so that the heater 14 is held in the heater moving unit 21. The heater moving unit 21 is supported by a On the base 24, the heater moving unit 21 can be moved upward and downward relative to the base 24 in the direction indicated by the arrow A. Accordingly, the heater 14 can also move upward and downward with respect to the base 24. As shown in FIG. 3 'the sensor 17 includes a beam source 25, which is located below the glass substrate 11 and emits a beam obliquely to the target line 1 3, and a light detector 26' for receiving the light beam source 25 The beam transmitted through the glass substrate 11 and reflected on the upper surface 20 of the glass substrate 11 is transmitted. The positions of the beam source 25 and the photodetector 26 are symmetrical with respect to the heater 14. When the glass substrate 11 is not broken at the target line 13, the light detector 26 receives the beam which has been reflected on the upper surface 20 of the glass substrate 11. If the crack 40 is generated in the path through which the beam passes, the beam will be completely reflected at the crack 40, and accordingly, its reflection direction is different from that of the beam when the crack 40 is not generated in the glass substrate 11. Therefore, the photodetector 26 does not receive the reflected beam or receives only a small intensity of the reflected beam. Accordingly, according to the intensity of the beam received by the light detector 26, it can be detected whether the crack 40 is generated in the target line 13 or not. Although the sensor 17 is designed to include only one light detector 26, the number of light detectors is not limited to one. The sensor 17 must be designed to include two light detectors. In this example, one light detector is arranged to receive the beam that has passed through the glass substrate 11 and that has been reflected on the surface 20 above the glass substrate 11 , And another

Page 17 4 6 9 2Έ 2_____ V. Description of the invention (14) A light sensor is set to receive the beam which has been reflected on the lower surface 12 of the glass substrate 11. Based on the ratio between the output of these light detectors', it can be detected whether the crack 40 is generated at the target line 13 or not. By using two optical debt detectors', it is possible to more accurately measure how the crack 40 is developed in the glass substrate 11. As shown in FIG. 3, the cooler 18 includes an air source (not shown) for supplying compressed air, and two air nozzles 27 ′. The compressed air is blown obliquely to the vicinity of the target line 13 through the two air nozzles 27. Lower surface 12 of glass substrate 1 1. The positions of the two air nozzles 27 are symmetrical with respect to the target line 13. The air nozzle 27 of the cooler 18 causes the compressed air to be blown along the target line 13 to the glass substrate 11 heated by the heater 14, thereby increasing the temperature gradient of the glass substrate 11. The rate at which the four glass-retaining substrates 11 are cut is enhanced. In addition, since the positions of the air nozzles 27 and 7 are symmetrical to each other with respect to the heater 14, the glass substrate 11 can be cooled by the temperature profile of the glass substrate 11 that is symmetrical with respect to the target line 13 to ensure that the glass substrate 丨 丨 is cut. Accuracy. As shown in Figures 3 and 4, the sensor 17 and the cooler 18 are fixed to the mobile unit 19. The sensor 17 is located on the head of each mobile unit 19, and the cooler 18 is located on the back of each mobile unit 19. As shown in Figures 3 and 4, the positions of the mobile units 19 are symmetrical to each other with respect to the base 24] The mobile units 19 are designed to slide along the rails 28, and the positions of the bars 28 are symmetrical to each other with respect to the base 24, And parallel to the base 24. The mobile unit 19 is controlled by a controller (not shown). As shown in FIG. 4, a unit 30 is located in front of the first end surface 15 of the glass substrate 丨, and the target line 3 starts from the first end surface 15. Unit 30

Page 18 469262

And it includes a round 15-shaped cutter 29 that first breaks the first end surface of the glass substrate π. Fig. 5 is a side view showing the structure of the unit 30. Hereinafter, a description will be given with reference to FIG. 5 to 29 to apply an initial crack to the drive shaft 31 to drive the wheel cutter 29 to the glass substrate 11, the body 32, and the drive shaft 31. The unit 30 includes a first end surface 15 of a wheel-shaped cutter glass substrate, a cutter 29, and a cylinder 32 to make the wheel shape and a driving portion 33 to drive the column driving portion 33 to make the wheel shape in the direction indicated by arrow B. The cutter 29, the drive shaft 3, and the post 32 are swelled upward and downward together. As detailed below, before the glass substrate is heated by the heater 14, the first end surface of the glass substrate is broken or scraped by the wheel cutter 29 to ensure that the crack 40 is along the target line 1. 3 develops smoothly. As shown in FIG. 4, an external force applying device 34 is located in front of the first end surface 16 of the glass substrate η, and the crack 40 ends at the second end surface 16. The external force applying device 34 applies an external force. The terminating end of the target line 13 to the second end surface 16 of the glass substrate 丨 is toward the head of the target line 13. Fig. 6 is a side view of the external force applying device 34. Refer to Fig. 4 below The external force applying device 34 is described with 6. The external force applying device includes a pad portion 35 for holding the glass substrate 11 to hold the broken glass substrate 11 and a first roller 36 for applying an external force to the first portion of the glass substrate 11. At the terminating end of the target line 13 of the two end surface 16, the direction of application of the external force is opposite to the direction in which the crack 40 develops along the target line 3, and a second roller 37 is used to terminate the target line 13 At

Page 19 469262 V. Description of the invention (16) The glass substrate 11 is pressed down 11 °, and the first part 35 and the first roller 37 are driven by a driving part (not shown) included in the external force applying device 34. As a result, it moves upward and downward relative to the glass substrate 11 as indicated by the clear number C. The first roller 36 is also driven by the driving unit to move horizontally relative to the glass substrate, as indicated by arrow D. As shown in Fig. 4, the 'external force applying device 34 is designed to include a second cooler 38' for cooling at or near the termination end of the target line 13 in the glass substrate. The second cooler 38 includes an air source (not shown) for supplying compressed air, and an air nozzle 39 located above the glass substrate 11 so that the compressed air supplied from the air source is blown obliquely to the glass substrate 丨 i . The operation of the cutting apparatus for the aforementioned glass substrate 1 will be described below. First, 'the glass substrate 11 is moved to one of the positions shown in Figs. 3 and 4, that is,' the target line 13 is positioned just above the heater 14 and the glass substrate 11 is not adjacent to the position of the air nozzle 27. 'Then' lower the pad portion 35 onto the glass substrate 11 and hold the glass substrate 11 to thereby horizontally fix the glass substrate 11 at the aforementioned position. Then, as shown in Fig. 5, the first end surface 15 of the glass substrate 11 is initially broken by the wheel cutter 29 of the unit 30. In detail, the rotating cutter 29 is pressed to the intersection of the target line 13 and the first end surface 15 in the first end surface 15. Then, the wheel cutter 29 moves downward to scrape the glass linearly. The first end surface 15 of the substrate 1 1. By breaking or rubbing the first end surface 15 at first, the crack 40 can be developed smoothly and accurately, even if the first end surface 5 has a minute crack. Then, as shown in FIG. 6, the external force applying device 34 applies a force to the squat

46 92 62 V. Description of the invention (17) The terminating end of the target line 13 in the first end surface 16 of the substrate 11. In detail, the first roller 36 is pressed to the second end surface 16 'of the fixed glass substrate 11 and the second roller 37 is pressed to the upper surface 20 of the glass substrate 11. The reason why a force is applied to the termination end of the target line 13 by the first roller 36 is that when the crack 40 develops to the termination end of the target line 13, the thermal stress for developing the crack 40 is reduced, so it is necessary to apply a The end of the force reaching the target line 3 is further cracked by the cracked surface of the glass substrate 11. The reason for applying a force to the upper surface 20 of the glass substrate 藉 by the second roller 37 is to prevent the glass substrate 丨 from bending upward near the second end surface 16 ′. A circuit pattern is formed on the glass substrate 11. If the glass substrate ^ is bent upward at the second end surface 16, the heater 4 cannot uniformly heat the glass substrate 11. Then, the target line 13 is heated by the heater 14 and at the same time, the end end of the target line 13 is cooled by the first cooler 3 8 so that the end end of the target line 3 is not heated. In detail, the heater moving unit 21 moves upward ', and subsequently, the heater 14 contacts the target line 1 3, and at the same time, the compressed air is blown down to the glass substrate through the air nozzle 39. Since the heater 14 is always pushed upward by the plate spring 22, the heater 14 can closely contact the lower surface 12 of the glass substrate u, even if the lower surface 2 is uneven. Therefore, the heater 4 can effectively heat the glass substrate 1 1. By using the heater 14 to generate an external tension C on the opposite side of the target line 13 produced by β, cracks or scratches are formed on the first end to heat the target line 13 to cause thermal stress. The receiver is connected to the target line 13 as shown in FIG. 7. So, since the initial surface is 15

469262 V. Description of the invention (18) The crack 40 in the glass substrate 11 develops along the target line 13. In addition, 'since the vicinity of the termination end of the target line 1 3 is cooled by the second cooler 38, the crack 40 will never develop from the termination end of the target line 3, that is, closer to the second end surface 16 of the glass substrate 11. Even if a minute crack is generated on the second end surface 16 of the glass substrate 11. The 'sensor 17 then detects the head of the crack 40 which develops along the target line [3]. According to the detection results completed by the sensor 17, the cooler 1 § partially cools the glass substrate 11. For example, the mobile unit 9 and the sensor 7 are initially positioned so that the beam emitted from the beam source 25 of the sensor 17 is at a position about 10 minutes away from the first end surface 15 of the glass substrate U. Everywhere reflection. When the heater 14 contacts the glass substrate 11 for the first time, the beam source 25 starts to emit a beam, and continues to emit the beam until the glass substrate n is completely cut. When the crack 4 starts to develop in the glass substrate 11 along the target line 1 3 as described above, when the sensor 2 is located at the initial position, the sensor 2 is located in the initial position. FIG. 7 shows the sensor 17 Detect cracked 4G head. When the head of the sensor Π 2 ^, the cooler 18 allows compressed air to pass through the air nozzle τ ^ f to partially cool the area D of the glass substrate 11 using the cooler 18, and the temperature gradient of the nearby glass substrate corrects: J mark is then moved to point d in accordance with the development of crack 40, so cg tg19 is moved to 筮 -gu, mountain * is also a symbol, and the single brother is as surface 16 as it is. In detail, when the head of the sensor 1 7 彳 i π π 40 is dark, 弑 ~ is called the i Μ 贞 裂 测 ^ λ „'The mobile unit 1 9 moves forward to the sensor 1 7 not i hb 丨5, ι Mark 40, Yu, Bg (No more detection of Psalm P and stop at this position. Then, when sensor 1? Detects again

Page 22 469262

When 淠 = head of the crack 40, the moving unit 19 moves forward again. As described above, the 'moving unit 9' is repeatedly stopped and operated as the crack 40 develops. Accordingly, the cooler 18 moving with the sensor 1γ always cools the vicinity of the head of the developing crack 40 in the glass substrate 11 to promote the development of the crack 40. According to the thickness of the glass substrate 11 and the degree to which the glass substrate 11 is heated by the heater 14, the development rate of the crack 40 is different from the desired rate, or sometimes it is scored for a specific time period, such as 10 seconds . In this example, the amount of the compressed air ejected from the cooler 18 is adjusted according to the development of the crack 40. When the sensor 17 detects that the crack 40 has developed to the termination end of the target line 13, the sensor 17 stops its sensing operation, and the cooler 18 also stops its cooling operation. The mobile unit 19 returns to its initial position. Therefore, the fine work of cutting the glass substrate 11 is finished. In the foregoing embodiment, when the target line 13 is heated by the heater 14, the second cooler 38 cools the termination end of the target line 13 and does not increase the temperature at the termination end of the target line 13. Alternatively, the heater 14 may be designed to heat the terminating end of the target line 13 to the extent that it is smaller than other portions of the target line 13 and in this example, 'the second cooler 38 is no longer needed.

Page 23 4 6 9 2 6 2 Brief Description of Drawings Figure 1 shows a perspective view of a fragile plate to be cut by conventional methods. FIG. 2 is a plan view of the fragile flat plate shown in FIG. 1. FIG. Fig. 3 is a front view of a cutting device for a glass substrate according to an embodiment of the present invention. FIG. 4 is a plan view of the apparatus shown in FIG. 3. Fig. 5 shows a side view of a unit which initially fractured the end surface of a glass substrate. Fig. 6 is a side view showing an external force applying device. Fig. 7 is a plan view showing a glass substrate broken by the apparatus shown in Figs. C Symbol description] 1 Fragile plate 2 Target line 3 Heater 4 End surface 5 Vertical groove 6 Upper surface 7 Groove 8 Early 11 Glass substrate 12 Lower surface 13 Target line

Page 24 46 92 62 Brief description of drawings 14 Heater 15 First end surface 16 First end surface 17 Sensor 18 Cooler 19 Moving unit 20 Upper surface 21 Heater moving unit 22 Leaf spring 23 Heater support 24 base 25 beam source 26 light detector 27 air nozzle 28 rail 29 wheel cutter 30 initial crack introduction unit 31 drive shaft 32 cylinder 33 drive unit 34 external force applying device 35 pad 36 first roller 37 second roller child

Page 25

469262 Simple illustration 38 Second cooler 39 Air nozzle 40 Crack

(III p. 26

Claims (1)

469262__ VI. Patent application scope 1. A method for cutting a glass substrate, by heating or cooling the glass substrate to cause thermal stress in the glass substrate and cause the glass substrate to crack, including the following steps: (a) in the glass Before one of the cracks in the substrate develops, a line is heated and the glass substrate will be cut along the line; and (b) partly cools near the head of the crack that has developed in the broken substrate. 2 _ The method for cutting glass substrates in item 1 of the patent application, wherein steps (a) and (b) are performed simultaneously. 3. The method of cutting glass substrates according to item 丨 of the patent application, further comprising the following steps: (C) sensing the position of the head of the crack; and (d) controlling according to the result of step (a) The glass substrate is partially 4. If the application for a patent If is @ 1, the cutting method of the glass substrate according to any one of items 1 to 3, further includes a step,... ^ Township (e): Apply a force To the end of the line in the glass substrate, the force pushes # ^ _ into the glass substrate valley to be easily cut. 5. For example, the patent application for the method of cutting glass substrates in any of items 1 to 3 of t. L ^ solid ', where § 在 is on the line r * β Λ Λ w on the line (pass) in the line The end is heated so that the increase in temperature at the end is less than the increase in temperature at the other parts of line 4. Page 27, 419262 ------------------- 6. Scope of patent application 6. A method for cutting a glass substrate, by heating or cooling the glass substrate, causing thermal stress to The step of breaking the glass substrate in the glass substrate includes the following steps: (a) before a crack in the glass substrate develops, heating a line, the glass substrate will be cut along the line, and a heater is used to Heating the glass substrate when contacting the line, and (b) partially cooling the vicinity of the head of the developed crack in the glass substrate by a cooler designed to move along the line. 7. The cutting method of the glass substrate according to item 6 of the application, wherein steps (a) and (b) are performed simultaneously. 8. The cutting method of the glass substrate according to item 6 of the patent application scope, further comprising the following steps: (c) sensing the position of the head of the crack by a sensor; and (d) The signal sent by the sensor controls the moving speed of the cooler. 9. The method for cutting a glass substrate according to any one of claims 6 to 8 of the patent application scope further includes a step (e): applying a force to the end of the line in the broken glass substrate, the force urging the glass The substrate is easily cut. Page 28 46 9 2 6 2 6. Application for patent scope 10. The method for cutting a glass substrate as described in any one of items 6 to 8 of the scope of patent application 'wherein in step (a), the end of the wire is heated So that the increase in temperature at the end is less than the increase in temperature at other parts of the line. 11. A method for cutting a glass substrate, which heats or cools the glass substrate locally by a heater or a cooler, causes thermal stress in the glass substrate and breaks the glass substrate, and includes the following steps: (a) The position of the head of a crack generated in the glass substrate is sensed by a sensor; and (b) the position of the cooler is controlled based on a signal sent from the sensor. 1 2 _If the method for cutting a glass substrate according to item 11 of the scope of patent application, it further includes a step: heating the end of a line, the glass substrate will be cut along the line, so that the temperature increase at the end is less than that of the line Increase in temperature at other parts. 13 _—— A method for cutting a glass substrate. The glass substrate is heated or cooled locally by a heater or a cooler, which causes thermal stress in the glass substrate and breaks the glass substrate. It includes a step: applying a A force to the end of the § helical line in the glass substrate 'This force causes the glass substrate to be easily cut. 14. If the glass substrate cutting method of item 13 of the scope of patent application, more package Page 29 4 i i 2 6 2 6. Scope of patent application Contains a step: heating the end of the line so that the temperature increase at the end is less than the temperature increase at other parts of the line. 15. A cutting device for a glass substrate, by heating or cooling the glass substrate, causing thermal stress in the glass substrate and breaking the glass substrate, comprising: (a) a heater for heating the glass along a line; Glass substrate 'The sloped glass substrate will be cut along the line; (b) — a sensor to detect the head of a developing crack in the glass substrate; (c) a cooler to partially Cooling near the head of the crack in the glass substrate; (d) — a first unit to move the sensor along the line; and (e) — a second unit to move along the line Turn the cooler. 16. For example, the cutting device for glass substrate of item 15 of the application scope, wherein the operation of the first unit is also the same as that of the second unit, so that the sensor and the cooler are moved along the line. 17. The cutting device for a glass substrate according to item 15 of the scope of patent application, wherein the sensor includes: (bl)-a light source for emitting a beam to the glass substrate 'and located below the glass substrate; and (b2) — light detector for receiving the beam, the light detector is 469262 6. Scope of patent application Set to receive a beam that has passed through the glass substrate and has been reflected on one surface of the glass substrate. 18. The cutting device for a glass substrate according to item 15 of the scope of patent application, wherein the sensor comprises: (bl) — a beam source for radiating a beam to the glass substrate 'and it is located below the glass substrate; ( b2)-the first light detection for receiving the beam; the light detector is arranged to receive a beam that has passed through the glass substrate and has been reflected on the upper surface of the glass substrate; and (b3)- A second light detector is used to receive the beam. The light detector is configured to receive a beam that has been reflected on the lower surface of the glass substrate; the head of the crack is detected based on the first and Second light zhenzhen? The ratio between the output of the stomach. 19. The cutting device for glass substrates such as item 15 of the scope of application for patent, wherein the cooler includes: (c 1) an air source for supplying compressed air; (c2)-the first air nozzle; the compressed air system Blown to the glass substrate through the first air nozzle; and (c3) a second air nozzle, the compressed air is blown to the glass substrate through the second air nozzle, and the position of the second air nozzle is the first air The opposite side of the nozzle with respect to the line. 469262 ^ Application for patents 20. If the glass substrate cutting equipment of item 19 of the patent application scope, wherein the position of the second air nozzle is symmetrical to the first air nozzle. 21. The cutting device for a glass substrate according to any one of claims 15 to 20, wherein the heater is a heater which is in line contact with the glass substrate at the line. 22. The cutting device for a glass substrate according to any of claims 15 to 20, wherein the heater is located just below the glass substrate, so that the heater heats the lower surface of the glass substrate. 23. The cutting device for a glass substrate, such as the item 22 of the scope of patent application, further comprises a heater moving unit 'for moving the heater below and below the glass substrate. 2 4. The cutting equipment for glass substrates according to item 22 of the patent application park further comprises an elastomer, and the heater is connected to the heater moving unit via the elastomer. 25. The cutting device for a glass substrate as claimed in claim 24, wherein the elastic system is a leaf spring. 26. The cutting device for a glass substrate according to any one of claims 15 to 20, further comprising an external force applying device 'for applying an external force to the glass 469262 VI. Scope of patent application At the termination end of the line in the glass substrate, it faces the head of the line. 2 7. The cutting device for a glass substrate according to item 26 of the patent application scope, wherein the external force applying device includes: a crotch for holding the glass substrate and holding the glass substrate; and a roller 'for applying The external force is applied to the glass substrate. 28. If the glass substrate is cut in any one of the 15th to 20th of the scope of the patent application, 3 is also prepared to further include a unit for breaking an end surface of the glass substrate at an early stage, and the line is from the end surface Start. 2 9. The cutting device for a glass substrate according to claim 28, wherein the unit includes a wheel cutter. 30. The cutting device of the glass substrate according to any of the items 15 to 20 in the scope of the patent claim further includes a second cooler for cooling the end of the line in the glass substrate or the nearby. 31. The cutting device for a glass substrate according to claim 30, wherein the second cold part includes:-an air source for supplying compressed air; and an air nozzle located above the glass substrate, so that The compressed air supplied from the air source is blown to the glass substrate through the air nozzle. Page 33