經濟部智慧財產局員工消費合作社印製 6 6 7 1 4 54 1 3twf.doc/00S _B7_____ 五、發明說明（f ) 發明背景 發明領域 本發明是有關於一種晶片保護盒（wafer Protective container)，並且特別是關於一種能安全保存並且輕易裝卸 積體電路晶片（integrated circuit wafer)的晶片保護盒，以 避免污染並損壞積體電路晶片。 習知技藝 根據習知的方式，積體電路晶片是儲存在一種圓筒狀 儲存盒（cylindrical storage box) ’其包括盒蓋（lid)以及主體 (body)。因爲積體電路晶片本身很薄（thin)且很脆弱 (fragile)，所以通常在積體電路晶片之間插入幾層海綿 (sponge)，以防止搬運時，因積體電路晶片在盒內的劇烈 動作而造成損壞。另外，承裝積體電路晶片的儲存盒在製 作上一般具有配合晶片大小的盒口設計’因此使裝卸 (load/imload)晶片的工作變得格外困難。由習知技藝可知， 儲存盒必須經由倒置的方式以取出積體電路晶片’而以這 種方式取出積體電路晶片將容易損壞積體電路晶片。因此 造成晶片的損失。在儲存盒內裝入所需數目的積體電路晶 片後，將主體蓋上盒蓋以關閉儲存盒。由於儲存盒只以盒 蓋進行關閉，在搬運時，盒蓋可能因劇烈動作而爆開。結 果使儲存盒內的積體電路晶片受到周圍環境的污染 (contamination)。克服此問題的傳統方法是將儲存盒封上 多層膠帶，以覆蓋盒蓋與主體的接合處(junction)。然而這 提高了積體電路晶片的包裝成本，並且使整個過程更加繁 3 A7 ------^---ΓΙΙ---裝 ------—訂------！-線—- C請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 6 7 1 4 54 1 3twf.doc / 00S _B7_____ V. Description of the Invention (f) BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a wafer protective container, and In particular, it relates to a wafer protection box that can be safely stored and easily loaded and unloaded with integrated circuit wafers to avoid contamination and damage to integrated circuit wafers. Conventional technology According to the conventional method, the integrated circuit chip is stored in a cylindrical storage box, which includes a lid and a body. Because the integrated circuit wafer itself is thin and fragile, several layers of sponge are usually inserted between the integrated circuit wafers to prevent the integrated circuit wafers from being violent in the box during transportation. Damage due to movement. In addition, the storage box that houses the integrated circuit wafer generally has a box mouth design that matches the size of the wafer. Therefore, loading / imloading the wafer becomes extremely difficult. It can be known from the conventional art that the storage box must be inverted to take out the integrated circuit chip ', and taking out the integrated circuit chip in this way will easily damage the integrated circuit chip. As a result, the wafer is lost. After loading the required number of integrated circuit wafers into the storage box, close the main body with the box cover to close the storage box. Since the storage box is only closed with the lid, the lid may burst due to violent movement during transportation. As a result, the integrated circuit chip in the storage box is contaminated by the surrounding environment. The conventional method to overcome this problem is to seal the storage box with multiple layers of tape to cover the junction of the cover and the main body. However, this increases the packaging cost of the integrated circuit chip, and makes the whole process more complicated. 3 A7 ------ ^ --- ΓΙΙ --- installation -------- order ------! -Line—- C Please read the notes on the back before filling in this page) This paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
^ 6 7 1 A A7 54 1 3twf.doc/008 所 五、發明說明（7,) 瑣。 發明摘要 因此本發明的目的是要提供一種晶片保護盒’其使積 體電路晶片之裝卸工作更爲簡易，並能穩固的保存積體電 路晶片，以克服上述的問題。 根據本發明，提供一1種晶片保護Sl ’包括了盒體 (container body)、固定裝置(locking device)、盒蓋（container cover)、以及複數個栓扣物（fasteners)組合在一起’以保護 積體電路晶片在運送時，不受污染以及劇烈動作的破壞。 盒體包括平扁的圓底（circular base) ’在其上方裝載所 需數目的積體電路晶片，以及架設在圓底上方的開放式圓 筒（open barrel)。開放式圓筒是由圓弧（rim)以及形成在圓 弧上方的一體成型之圓拱牆（wall segments)所形成。在圓 拱牆之間至少具有一開口（opening)，以便輕易地裝卸所需 數目的積體電路晶片。開口的垂直邊緣（vertical edges)具 有鋸齒凹入（indentations)，其使用性將在以下固定裝置的 內容中再進行說明。盒體在圓底下也具有圓環（circular ring)，其包含複數個勾形構件(hook members)使栓扣物能 架設在其上方。固定裝置包括圓形凸起物（circular protrusion)、以及環狀區域（annular region)，其中圓形凸 起物具有複數個凸出物（projections)從其邊緣伸出，而凸 出物能與盒體之開口的鋸齒凹入產生嚙合（engage)以將積 體電路晶片保持在原位。因此在搬運的過程中，這避免了 4 ----------I----裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國固家標準（CNS)A4規格（210 x 297公釐〉 A7 466714 541 3twf.doc/008 五、發明說明（彳） 積體電路晶片的任何劇烈動作，所以降低了破壞積體電路 晶片的風險。盒蓋包括了圓形蓋狀物（circular cap)，其上 方具有凹陷（notches)使打開晶片保護盒的工作變得輕鬆。 盒蓋也包括空心圓柱體(hollow cylindrical body),具有複 數個凹處(troughs)在其外表面，而覆蓋在盒體的盒蓋也對 積體電路晶片提供了更多的保護。栓扣物包括複數個連接 腳（connecting feet)、複數個連接棒（connecting bars)、複數 個連接頸（connecting necks)、以及半圓圈（Semi-circular loop)。在勾形構件上架設栓扣物之後，將連接棒對入凹處， 使連接頸能固定在空心圓柱之頂端，並使半圓圈靠在缺 口。於是完成了晶片保護盒的組合。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 圖式之簡單說明： 第1圖是繪示本發明之晶片保護盒的兮解圖： 第2A與2B圖是根據本發明的一較佳實施例繪示了 盒體之上下面的立體圖； 第3圖是根據本發明的一較佳實施例繪示了固定裝置 的立體圖； 第4圖是根據本發明的—較佳實施例繪示了盒蓋的立 體圖； 第5圖是根據本發明的—較佳實施例繪示了栓扣物的 5 本紙張尺度適用中國國家標準（CNS)aTK (21〇 X --- -------I--11 -------—訂—！-線 ("請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1 6 6 7 1 4 54 1 3t\vf.doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（) 放大圖；以及 第6圖是根據本發明的 盒在組合後的立體圖。 圖式之標記說明： 10 :盒體 Π :開放式圓筒 12 :圓拱牆 13 :鋸齒凹入 14 圓弧 15 :開口 16 :圓環 17 :勾型構件 18 :圓底 20 :固定裝置 21 :環狀區域 22 :凹槽 23 :圓形凸起物 24 .凸出物 30 :盒蓋 31 :空心圓柱體 32 :圓形蓋狀物 33 :缺口 34 :凹處 35 :環狀凹陷 較佳實施例繪示了晶片保護 --------;—-------裝 -----— —訂---------線 C請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局貝工消費合作社印製 4667" A7 5413twf.doc/008 gy 五、發明說明（t) 40 :栓扣物 41 :連接腳 42 __連接棒 43 :連接頸 44 :半圓圏 實施例 本發明的晶片保護盒是參考第1圖到第6圖在以下進 行說明。 第1圖是繪示本發明之晶片保護盒的分解圖，該晶片 保護盒一般包括盒體10、固定裝置20、盒蓋30、以及複 數個栓扣物40。在盒體10上裝入固定裝置20以確保裝在 盒體內的積體電路晶片（未繪示於圖中）能牢固地保持在原 位，而盒體10卻間接的由盒蓋30所覆蓋。架設在盒體1〇 上的栓扣物40再把盒蓋30與盒體10緊靠在一起，以完 成晶片保護盒的組合。 第2A與2B圖是根據本發明的一較佳實施例繪示了 盒體之上下面的立體圖。根據上述的相關圖示，發現盒體 1〇包括了開放式圓筒11、圓底18、以及圓環16。開放式 圓筒11是由圓底18的上方之圓弧14、以及至少一個圓拱 牆12所形成’而在圓底18的上方能裝載積體電路晶片。 在圓拱牆12內至少具有一個開口 15，使裝卸積體電路曰曰 片的工作能輕鬆地進行，並且如第2A圖所繪不，在圓拱 牆12之每一邊緣具有複數個鋸齒凹入13襯出開口 15。曰R 7 _ 本紙張足度適用中_家標準（CNS)A4 — χ观 -* " I ---------- i_ il!丨訂·-- (.請先閱讀背面之注意事項再填寫本頁) 4 Ο A7 B7 5413twf,doc/008 五、發明說明（G) 參照第2B圖，提供圓環16作爲保護盒的底部，其包括複 數個勾形構件17=在此情況下’能經由開口 15輕易地取 出積體電路晶片而不需將整個晶片盒反倒。因此，減少了 破壞積體電路晶片的風險。 以下將參考第3圖對固定裝置20進行說明。固定裝 置20是以一體成型(integrally)的方式製作，且具有類似於 倒反盤（inverted dish)的外型。其形成方式包括從環狀區域 21所升起的一圓形凸起物23，其中較佳的圓形凸起物23 之外表類似倒反的平底盤(inverted pan)。固定裝置20更 包括複數個凸出物24伸出圓形凸起物23的邊緣、以及在 環狀區域21與部分圓形凸起物23內的複數個凹槽22。在 組合晶片保護盒的同時，凸出物24能與盒體10的鋸齒凹 入13產生嚙合，因此在盒體10的積體電路晶片能牢固地 維持在盒體10內的原位。結果，在搬運的過程中，晶片 保護盒內的積體電路晶片將不會移動，因此降低了破壞積 體電路晶片的風險。另外，使用固定裝置2〇能減少避免 積體電路晶片移動所使用的海綿墊數量。 第4圖是根據本發明的一較佳實施例繪示了盒蓋的立 體圖。提供盒蓋30以覆蓋盒體10，其中盒蓋30包括圓形 蓋狀物32具有複數個缺口 33在其上方。盒蓋30更包括 空心圓柱體31具有複數個凹處34在其外表面、以及在圓 形蓋狀物32與空心圓柱體31之頂端之間的環狀凹陷35。 在圓形蓋狀物32上的缺口 33能使開蓋晶片保護盒的工作 變得輕鬆，而缺口 33與凹處34則同時提供了停靠栓扣物 8 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） I---------i i -裝---I---- 訂---------線 (-請先閱讀背面之注項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 經 濟 部 智 慧 財 產 局 消 費 合 作 製 C 7 1 4 A7 5413t\vrdoc/008 gy__ 五、發明說明) 40的位置。根據此盒蓋結構的排列’其中環狀凹陷35是 位於圓形蓋狀物32與空心圓柱體31的頂端之間’於是一 個晶圓保護盒的圓環16能完全處於另一個晶圓保護盒之 環狀凹陷35的上方。因此數個本發明的晶片保護盒能相 互重疊（stacked)在一起。 第5圖是根據本發明的一較佳實施例繪示了栓扣物的 放大圖。栓扣物40 —般包括複數個連接腳41、與該些連 接腳41連接的複數個連接棒42、與該些連接棒42連接的 複數個連接頸43、以及連接該些連接頸43的半圓圏44。 在此所描述的栓扣物40將保持盒蓋30與盒體10牢固地 栓扣在一起。於是避免了利用膠帶進行密封晶片儲存盒的 習知步驟，以避免晶片儲存盒意外的暴開。因此，裝在晶 片保護盒內的積體電路晶片就不再受污染以及損壞的影 ----------——装--------訂. (‘諸先閱讀背面之注旁¥項再填寫本頁) 接著，對裝有積體電路晶片之晶片保護盒的完整組合 進行說明如下。首先，提供盒體10以及裝載在其中之所 需數目的積體電路晶片，而此時開口 15將加速晶片的裝 載過程。在裝入足夠的積體電路晶片之後，使固定裝置20 與盒體10產生接觸’其中追樣的接觸是藉由凸出物24與 鋸齒凹入13的嚙合所產生。然後利用盒蓋30覆蓋盒體1〇 以關閉晶片保護盒。盒蓋30是經由栓扣物40與盒體1〇 產生緊密的接合，其中栓扣物40是藉由將栓扣物40的連 接腳41架設在勾型構件17而固定在盒體1〇。接著將栓扣 物40的其他組件向盒蓋30上擠壓，使連接棒42對入空 線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 6 7 1 5413twf.doc/008 Β7_______ 五、發明說明（g ) 心圓柱體31上的凹處34’而連接頸43扣在空心圓柱體31 之頂端，以及半圓圈44靠在缺口 33的上方。結果完成了 晶片保護盒的組合’並且在第6圖中顯示其組合結果。 綜上所述，本發明的晶片保護盒具有以下的優點。盒 體具有複數個開口，使運送積體電路晶片的工作變得輕 鬆。使用固定裝置不但能將積體電路晶片維持在盒體內的 一定位置，更能減少避免積體電路晶片產生震動的海綿用 量。根據本發明，覆蓋在盒體的盒蓋以及盒蓋對在晶片保 護盒內的積體電路晶片提供了雙重保護°由於栓扣物能使 盒蓋與盒體產生緊密的接合’晶片保護盒不會在搬運的過 程中意外地暴開，所以降低了污染以及破壞積體電路晶片 的風險。 雖然本發明已以一較佳實施例揭露如上’然其並非用 以限定本發明，任何熟習此技藝者’在不脫離本發明之精 神和範圍內，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者爲準。 --------'l·-— i _ ------—丨訂 *------ ('請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印繁 本紙張又度適用中國國豕標準（CNSM4规格（21〇 X 297公餐）^ 6 7 1 A A7 54 1 3twf.doc / 008 V. Explanation of the invention (7,) Trivial. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a wafer protection box 'which makes the assembling and unloading of integrated circuit wafers easier, and can stably store integrated circuit wafers to overcome the above problems. According to the present invention, a chip protection Sl is provided, which includes a container body, a locking device, a container cover, and a plurality of fasteners combined to protect the chip. Integrated circuit chips are protected from contamination and violent movement during transportation. The box body includes a flat circular base ′ on which the required number of integrated circuit chips are mounted, and an open barrel erected above the round base. The open cylinder is formed by a rim and an integrally formed wall segment formed above the rim. There is at least one opening between the arch walls to easily load and unload the required number of integrated circuit chips. The vertical edges of the openings have jagged indentations, and their usability will be explained in the content of the fixture below. The box body also has a circular ring under the round bottom, which includes a plurality of hook members to enable the buckle to be erected above it. The fixing device includes a circular protrusion and an annular region, wherein the circular protrusion has a plurality of projections protruding from its edge, and the projection can interact with the box The indentation of the opening in the body creates engagement to hold the integrated circuit wafer in place. So in the process of transportation, this avoids 4 ---------- I ---- installation -------- order --------- line (please read first Note on the back, please fill in this page again) This paper size is applicable to China Solid Standard (CNS) A4 specification (210 x 297 mm> A7 466714 541 3twf.doc / 008 5. Description of the invention (彳) Any of the integrated circuit chip Vigorous action, so the risk of damaging the integrated circuit chip is reduced. The box cover includes a circular cap with notches above it to ease the work of opening the wafer protection box. The box cover also includes A hollow cylindrical body with a plurality of troughs on its outer surface, and a lid covering the box also provides more protection for the integrated circuit chip. The buckle includes a plurality of connections Connecting feet, connecting bars, connecting necks, and semi-circular loops. After the buckle is set on the hook member, the connecting rod is inserted into The recess allows the connection neck to be fixed at the top of the hollow cylinder and the semi-circle against the lack Then, the combination of the wafer protection box is completed. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below and described in detail with the accompanying drawings as follows : Brief description of the drawings: Figure 1 is a schematic view showing the wafer protection box of the present invention: Figures 2A and 2B are perspective views showing the top and bottom of the box body according to a preferred embodiment of the present invention; Figure 3 is a perspective view of a fixing device according to a preferred embodiment of the present invention; Figure 4 is a perspective view of a box cover according to the present invention-a preferred embodiment; Figure 5 is a view according to the present invention —The preferred embodiment shows 5 paper sizes of the fasteners that are applicable to the Chinese National Standard (CNS) aTK (21〇X --- -------- I--11 --------- Order —!-Line (" Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 1 6 6 7 1 4 54 1 3t \ vf.doc / 008 A7 B7 Ministry of Economy Wisdom Printed by the Consumer Cooperative of the Property Bureau V. Description of the invention () Enlarged view; and Figure 6 is a box in accordance with the present invention The assembled perspective view. Symbols of the drawings: 10: box body Π: open cylinder 12: circular arch wall 13: serrated recess 14 circular arc 15: opening 16: ring 17: hook member 18: round bottom 20: Fixing device 21: Annular area 22: Groove 23: Circular protrusion 24. Protrusion 30: Box cover 31: Hollow cylinder 32: Round cover 33: Notch 34: Recess 35: The preferred embodiment of the ring-shaped recess shows the protection of the wafer. (Please read the notes on the back before filling this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, 4667 " A7 5413twf.doc / 008 gy V. Description of the invention (t) 40: buckle 41: connecting foot 42 __ connecting rod 43: connecting neck 44: semicircle 圏 Example The wafer protection box of the present invention is described below with reference to FIGS. 1 to 6 . FIG. 1 is an exploded view showing a wafer protection box of the present invention. The wafer protection box generally includes a box body 10, a fixing device 20, a box cover 30, and a plurality of buckles 40. A fixing device 20 is installed on the box body 10 to ensure that the integrated circuit chip (not shown) installed in the box body can be firmly held in place, while the box body 10 is indirectly covered by the box cover 30 . The buckle 40 erected on the box body 10 then abuts the box cover 30 and the box body 10 together to complete the assembly of the wafer protection box. Figures 2A and 2B are perspective views showing the top and bottom of the box body according to a preferred embodiment of the present invention. According to the related illustrations above, it is found that the box body 10 includes an open cylinder 11, a round bottom 18, and a ring 16. The open cylinder 11 is formed by an arc 14 above the round bottom 18 and at least one arcuate wall 12 ', so that an integrated circuit chip can be mounted on the round bottom 18. There is at least one opening 15 in the arcuate wall 12, so that the work of loading and unloading the integrated circuit can be easily performed, and as shown in FIG. 2A, each edge of the arcuate wall 12 has a plurality of sawtooth recesses入 13 Lining out the opening 15. Said R 7 _ This paper is adequately applicable _ Home Standard (CNS) A4 — χ 观-* " I ---------- i_ il! 丨 Order ·-(. Please read the first Please fill in this page again) 4 〇 A7 B7 5413twf, doc / 008 5. Description of the invention (G) Referring to Figure 2B, provide the ring 16 as the bottom of the protective box, which includes a plurality of hook-shaped members 17 = In this case The bottom can easily take out the integrated circuit wafer through the opening 15 without turning the entire wafer cassette upside down. Therefore, the risk of damaging the integrated circuit wafer is reduced. Hereinafter, the fixing device 20 will be described with reference to FIG. 3. The fixing device 20 is manufactured in an integrally formed manner and has an appearance similar to an inverted dish. The formation method includes a circular protrusion 23 rising from the annular area 21, and the preferred circular protrusion 23 is similar to an inverted pan in appearance. The fixing device 20 further includes a plurality of protrusions 24 protruding from the edges of the circular protrusions 23 and a plurality of grooves 22 in the annular region 21 and the partially circular protrusions 23. When the wafer protection box is combined, the protrusions 24 can be engaged with the serrated recesses 13 of the box body 10, so that the integrated circuit wafer in the box body 10 can be firmly maintained in place in the box body 10. As a result, the integrated circuit wafer in the wafer protection box will not move during the transportation process, thereby reducing the risk of damaging the integrated circuit wafer. In addition, the use of the fixing device 20 can reduce the number of sponge pads used to avoid the movement of the integrated circuit chip. Fig. 4 is a perspective view showing a box cover according to a preferred embodiment of the present invention. A box cover 30 is provided to cover the box body 10, wherein the box cover 30 includes a circular cover 32 having a plurality of notches 33 above it. The lid 30 further includes a hollow cylinder 31 having a plurality of recesses 34 on its outer surface, and an annular recess 35 between the circular lid 32 and the top end of the hollow cylinder 31. The notch 33 on the round cover 32 can make the work of opening the wafer protection box easier, and the notch 33 and the recess 34 provide a docking buckle at the same time. 8 This paper size applies to Chinese National Standards (CNS) A4 specification (210x297 mm) I --------- ii-equipment --- I ---- order --------- line (-please read the note on the back before filling (This page) Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the Consumer Cooperative System of the Intellectual Property Bureau of the Ministry of Economic Affairs, C 7 1 4 A7 5413t \ vrdoc / 008 gy__ V. Description of the invention 40). According to the arrangement of the box cover structure, wherein the ring-shaped recess 35 is located between the circular cover 32 and the top of the hollow cylinder 31, the ring 16 of one wafer protection box can be completely placed in another wafer protection box. Above the annular depression 35. Therefore, several wafer protection boxes of the present invention can be stacked on each other. Fig. 5 is an enlarged view showing a buckle according to a preferred embodiment of the present invention. The buckle 40 generally includes a plurality of connection legs 41, a plurality of connection rods 42 connected to the connection legs 41, a plurality of connection necks 43 connected to the connection rods 42, and a semicircle connected to the connection necks 43.圏 44. The buckle 40 described here securely fastens the holding lid 30 and the case body 10 together. Thus, the conventional step of sealing the wafer storage box with tape is avoided to avoid accidental bursting of the wafer storage box. Therefore, the integrated circuit chip mounted in the chip protection box is no longer contaminated and damaged .------------------------ Order. ('Zhu first read (Note the ¥ item on the back and fill in this page) Then, the complete combination of the chip protection box containing the integrated circuit chip is described below. First, the case 10 and the required number of integrated circuit wafers loaded therein are provided, and at this time the opening 15 will speed up the wafer loading process. After a sufficient integrated circuit chip is loaded, the fixing device 20 is brought into contact with the case 10 ', wherein the contact of the sample is generated by the engagement of the protrusion 24 and the serration recess 13. Then, the case body 10 is covered with the case cover 30 to close the wafer protection case. The lid 30 is tightly connected to the box body 10 via a buckle 40, wherein the buckle 40 is fixed to the box body 10 by setting up the connecting pin 41 of the buckle 40 on the hook-shaped member 17. Then press the other components of the buckle 40 onto the box cover 30, so that the connecting rod 42 is aligned with the empty line. The paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) 6 7 1 5413twf.doc / 008 Β7 _______ 5. Description of the Invention (g) The recessed portion 34 'on the core cylinder 31 and the connection neck 43 are fastened to the top of the hollow cylinder 31, and the semicircle 44 rests above the notch 33. As a result, the combination of the wafer protection box was completed 'and the combined result is shown in FIG. In summary, the wafer protection box of the present invention has the following advantages. The box body has a plurality of openings, which makes it easy to transport the integrated circuit wafer. The use of a fixing device can not only maintain the integrated circuit chip in a certain position in the box, but also reduce the amount of sponge to avoid vibration of the integrated circuit chip. According to the present invention, the box cover and the box cover which cover the box body provide double protection for the integrated circuit wafer in the wafer protection box. ° Because of the buckle, the box cover and the box body can be tightly bonded. It can be accidentally burst during the transportation process, so the risk of contamination and damage to the integrated circuit chip is reduced. Although the present invention has been disclosed above with a preferred embodiment, 'but it is not intended to limit the present invention. Any person skilled in the art' can make various changes and decorations without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application. -------- 'l · -— i _ ---------- 丨 Order * ------ (' Please read the notes on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Employees' Cooperatives printed and printed this paper to the Chinese National Standard (CNSM4 specification (21〇X 297 meals))