TW463985U - Holding structure of heat dissipation device of chip - Google Patents

Holding structure of heat dissipation device of chip

Info

Publication number
TW463985U
TW463985U TW88201347U TW88201347U TW463985U TW 463985 U TW463985 U TW 463985U TW 88201347 U TW88201347 U TW 88201347U TW 88201347 U TW88201347 U TW 88201347U TW 463985 U TW463985 U TW 463985U
Authority
TW
Taiwan
Prior art keywords
chip
heat dissipation
holding structure
dissipation device
holding
Prior art date
Application number
TW88201347U
Other languages
English (en)
Inventor
Ming-Feng Chen
Original Assignee
Taiwan Da Long Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Da Long Ind Co Ltd filed Critical Taiwan Da Long Ind Co Ltd
Priority to TW88201347U priority Critical patent/TW463985U/zh
Publication of TW463985U publication Critical patent/TW463985U/zh

Links

TW88201347U 1999-01-27 1999-01-27 Holding structure of heat dissipation device of chip TW463985U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88201347U TW463985U (en) 1999-01-27 1999-01-27 Holding structure of heat dissipation device of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88201347U TW463985U (en) 1999-01-27 1999-01-27 Holding structure of heat dissipation device of chip

Publications (1)

Publication Number Publication Date
TW463985U true TW463985U (en) 2001-11-11

Family

ID=21644378

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88201347U TW463985U (en) 1999-01-27 1999-01-27 Holding structure of heat dissipation device of chip

Country Status (1)

Country Link
TW (1) TW463985U (zh)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees