經濟部智慧財產局員工消費合作社印製 4 633 4 0 A7 ^__ S^64twf . doc/0〇B B7 一 一1 - -- —«« — - - -- 五、發明說明（，） 本發明是有關於一種在半導體晶片（SemiconductorPrinted by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 633 4 0 A7 ^ __ S ^ 64twf .doc / 0〇B B7 11-1---"«------5. Description of the invention (,) The present invention Is about a semiconductor chip
Chip)進行故障診斷（Trouble Shooting)前，於封蓋上定義 開封區（Decapsulated Area)的方法，且特別是有關於一種 在塑膠封裝（Plastic Package)之封盘上精確定義開封區的 方法。 半導體晶片製造完成之後，會經過一封裝製程，以 在運送與使用半導體晶片的過程中，得以保護半導體晶 片，同時，更使半導體晶片得以便利地安裝至主機板上。 然而，半導體晶片在封裝之後，會經過一連串的可 靠度測試(Reliability Test)，以得知半導體晶片可靠度的優 劣，一旦發生其可靠度無法符合產品規格時，就必須進行 故障診斷，以找出其故障成因。 一般在進行半導體晶片的故障診斷時，必須先將部 分封蓋去除，以暴露出半導體晶片，然後，再依序進行檢 査，以得知故障成因。其中，將部分封蓋去除用以暴露出 半導體晶片的區域，稱爲開封區。 一般而言，在塑膠封裝上去除開封區處之封蓋部分 所使用的方法，包括使用人工與自動工具。 第〗圖係繪示傳統利用人工去除塑膠封裝上之開封 區處封蓋部分的流程示意圖^ 請參照第1圖，首先，進行步驟10 ’利用電鑽在一 塑膝封裝的封蓋上鑽出一小孔。然後’進ί"Γ步驟12 ’將 此塑膠封裝放在加熱盤上加熱，使塑膠封裝達到攝氏70 至100度。 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---：----：---I---^--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 4 633 4 Ο Α7 5664twf.doc/008 37 五、發明說明（V ) 接著，進行步驟14，利用鑷子將置於加熱盤上加熱 的塑膠封裝從加熱盤上移出。然後，進行步驟16，將發 煙硝酸（Fume Nitric Acid，Fume ΗΝ03)滴在此塑膠封裝 之封蓋的小孔處 由於塑膠封裝通常所使用的材料爲環氧樹脂 (Epoxy)，而環氧樹脂在一特定溫度下，會加速其與硝酸 間的反應，因此，塑膠封裝之封蓋的小孔附近的封蓋部 分，在經過步驟12至16的操作後，可在短時間內去除， 而將半導體晶片暴露出來。 然後，進行步驟18，待發煙硝酸與塑膠封裝反應完 畢後，利用丙酮（Acetone)來沖洗去除殘留在半導體晶片 上的發煙硝酸。其中，發煙硝酸與塑膠封裝反應完畢與 否，可以依反應所產生的氣泡是否不再產生來判定。 接著，可依序重複進行步驟12至18的操作程序， 直到半導體晶片所暴露出的大小，達到觀察者的要求爲 止。 接下來，便可進行半導體晶片的故障診斷，此爲熟 習此技藝者所能輕易達成，故於此不再贅述。 至於以自動工具去除塑膠封裝上之開封區處封蓋部 分的方法，其與人工去除塑膠封裝上之開封區處封蓋部分 的方法最主要的不同之處，乃在於利用發煙硝酸去除塑膠 封裝上之開封區處封蓋部分，直到半導體晶片暴露出來的 步驟，即上述步驟12至16。 第2圖你繪示傳統利用自動工具去除塑膠封裝上之 4 ---；----；------Ki------ 訂---------線 (諝先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印*'1衣 4 6 33 40 A7 5664twf.doc/008 B7 五、發明說明（6 ) 開封區處封蓋部分的流程示意圖。 第3圖係繪示傳統去除塑膠封裝上之開封區處封蓋 部分所使用的自動工具分解示意圖。 請同時參照第2與3圖，首先，進行步驟20，先得 知塑膠封裝內之半導體晶片的大小，以決定欲去除之開 封區處封蓋部分的大小。接著，進行步驟22，選擇適合 的橡皮墊30，使其所具有的開口 32，得以匹配欲去除之 開封區處封蓋部分的大小。 然後，進行步驟24，將塑膠封裝置於卡座34的空 孔36中，同時，使塑膠封裝之欲去除之開封區封蓋向下， 而自橡皮墊30之開口 32暴露出來。其中’，卡座34、橡 皮墊30、夾具38與發煙硝酸輸入器40則透過螺絲或卡 榫42而固定在一起。 接著，進行步驟26,設定發煙硝酸輸入溫度與時間， 並經由發煙硝酸輸入器40的入口 44輸入發煙硝酸，以 使發煙硝酸與塑膠封裝之欲去除之開封區處封蓋部分產 生反應，而使塑膠封裝中的半導體晶片得以暴露出來。 接下來，進行步驟28，使暴露出之半導體晶片表面 保持乾淨，此與前述之利用人工方式淸潔半導體晶片表 面的方法相同，故於此不再贅述。 傳統利用人工去除塑膠封裝上之開封區封蓋的方 法，常發生開口大小不易控制的問題。 另外，傳統利用人工去除塑膠封裝上之開封區處封 蓋部分的方法，由於開封區以外的區域並不受到任何物件 5 --l·--------- ^ i ------訂-------- T ' 、 (請先閒讀背面之注音心事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格α?10 X 297公t ) 4 6 33 4 0 A7 經濟部智慧財產局員工消費合作社印*'1衣 5664twf.doc/008 37 五、發明說明（a ) 的保護，因此，常使非開封區的封蓋部分受到發煙硝酸的 破壞。 而傳統利用自動工具去除塑膠封裝上之開封區處封 蓋部分的方法，由於無法直接目視整個去除過程1因此， 常發生開封區處之封裝部分去除不完全，或對不準開封區 的問題。 另外，傳統利用自動工具去除塑膠封裝上之開封區 處封蓋部分的方法，因不易即時觀察，故需進行多次試做 (Test Run)才行。 因此本發明提供一種精確定義塑膠封裝之開封區的 方法，可解決傳統利用人工去除塑膠封裝上之開封區處封 蓋部分份時，所常發生開口大小不易控制與無法保護非開 封區的封蓋部分的問題，以及，利用自動工具去除塑膠封 裝上之開封區處封蓋部分時，所常發生開封區處之封蓋部 分去除不完全，或對不準開封區，以及，需進行多次試做 才可的問題。 本發明提出一種精確定義塑膠封裝之開封區的方 法，包括：首先，提供一塑膠封裝，此塑膠封裝中具有 一半導體晶片，接著，找出此半導體晶片的尺寸與半導 體晶片在塑膠封裝中的位置，然後，形成一罩幕在此塑 膠封裝的表面，此罩幕的尺寸大於塑膠封裝的尺寸，接 著，將罩幕的四邊向下而往塑膠封裝的方向下摺，再於 罩幕中形成一開封區，此開封區與半導體晶片的尺寸與 所在位置爲匹配的，接著，將塑膠封裝置放於一加熱盤 6 ---„---------- ▲--------訂---------線 * (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 463340 A7 5664twf.doc/008 R7 五、發明說明（k ) 上加熱’以達一特定溫度，然後，將塑膠封裝夾離加熱 盤，再將一蝕刻液體滴至塑膠封裝的開封區上，直到塑 膠封裝之開封區的部分被去除，而暴露出半導體晶片，接 著，將罩幕去除，然後，將塑膠封裝浸泡在乙二胺溶液 中，以及，利用丙酮來擦拭半導體晶片的表面，以使半 導體晶片表面保持乾淨。 本發明還提出一種精確定義塑膠封裝之開封區的方 法，包括：首先，提供一塑膠封裝，此塑膠封裝中具有 一半導體晶片，接著，找出此半導體晶片的尺寸與半導 體晶片在塑膠封裝中的位置，然後，形成一罩幕在此塑 膠封裝的表面，此罩幕的尺寸大於塑膠封裝的尺寸，接 著，將罩幕的四邊向下而往塑膠封裝的方向下摺，再於 罩幕中形成一開封區，此開封區與半導體晶片的尺寸與 所在位置爲匹配的，然後，將具有一特定溫度的一蝕刻 液體輸送至塑膠封裝的開封區上，直到塑膠封裝之開封 區的部分被去除，而暴露出半導體晶片，接著，將罩幕去 除，然後，將塑膠封裝浸泡在乙二胺溶液中，以及，利 用丙酮來擦拭半導體晶片的表面，以使半導體晶片表面 保持乾淨。 本發明係使用一尺寸較大於塑膠封裝尺寸的罩幕， 黏貼在塑膠封裝的表面，然後，依照塑膠封裝中之半導 體晶片的大小與位置，於此罩幕中定義出開封區，接著， 將此塑膠封裝加熱至一特定溫度，再以人工的方式，將 蝕刻液體滴在此塑膠封裝的開封區上，或是，以自動輸 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------^------ ^--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟邹智慧財產局員工消費合作社印製 4 6334 0 A7 5664twf.doc/〇〇S B7 五、發明說明（乙） 送方式’將具有一特定溫度之蝕刻液體滴在此塑膠封裝 的開封區上’以去除開封區中的封盖部分’並暴露出半 導體晶片’然後’對半導體晶片進行淸洗。 本發明由於利用顯微鏡（Microscope)來觀察半導體晶 片的大小與其在塑膠封裝中的位置，並使用一罩幕來定義 之，因此可精確定義欲開封之區域。 本發明因開封區以外的封蓋部分被用以定義開封區 之罩幕所保護，因此，在去除開封區之封蓋部分時，開封 區以外的封蓋部分不會受到蝕刻液體的侵蝕。 本發明所使用的罩幕在下摺後仍保留一特定長度， 有利於之後塑膠封裝的夾取，而其下摺的部分可保護塑 膠封裝的接腳，因此，可防止在使用鑷子夾取塑膠封裝 的過程中，破壞塑膠封裝的接腳，進而有利於後續塑膠 封裝的電性量測。 本發明若使用自動工具來去除塑膠封裝上之開封區 處封蓋部分，儘管無法直接目視整個去除過程，但開封區 已由罩幕精確定義，因此不會發生對不準開封區的問題。 爲讓本發明之上述目的、特徵、和優點能更明顯易 懂’下文特舉較佳實施例，並配合所附圖式，作詳細說明 如下： 圖式之簡單說明： 第1圖係繪示傳統利用人工去除塑膠封裝上之開封 區處封蓋部分的流程示意圖； 第2圖係繪示傳統利用自動工具去除塑膠封裝上之Chip) Before the Trouble Shooting is performed, a method of defining a decapsulated area on a cover, and in particular, a method of precisely defining a decapsulated area on a sealing plate of a plastic package. After the semiconductor wafer manufacturing is completed, a packaging process is performed to protect the semiconductor wafer during the transportation and use of the semiconductor wafer, and at the same time, the semiconductor wafer can be conveniently mounted on the motherboard. However, after the semiconductor wafer is packaged, it will go through a series of reliability tests to learn the pros and cons of the reliability of the semiconductor wafer. Once its reliability fails to meet the product specifications, fault diagnosis must be performed to find out Causes of its failure. Generally, when performing a semiconductor wafer fault diagnosis, a part of the cover must be removed to expose the semiconductor wafer, and then a sequential inspection is performed to learn the cause of the fault. The area where a part of the cover is removed to expose the semiconductor wafer is called an unsealed area. In general, the methods used to remove the cover at the unsealed area on a plastic package include the use of manual and automated tools. The first diagram is a schematic diagram of the traditional process of manually removing the cover at the unsealed area on the plastic package. ^ Please refer to Figure 1, first, proceed to step 10 'use an electric drill to drill a cover on a plastic knee package. Eyelet. Then "step 12", the plastic package is placed on a heating plate and heated, so that the plastic package reaches 70 to 100 degrees Celsius. 3 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) ---: ----: --- I --- ^ -------- order ---- ----- line (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 633 4 Ο Α7 5664twf.doc / 008 37 V. Description of Invention (V) Next, proceed to Step 14. Use tweezers to remove the heated plastic package placed on the heating plate from the heating plate. Then, step 16 is performed, and fuming nitric acid (Fume ΝΝ03) is dripped onto the small hole of the cover of the plastic package. Since the material generally used for plastic packaging is epoxy, and epoxy resin At a specific temperature, it will accelerate the reaction between it and nitric acid. Therefore, the cap portion near the small hole of the cap of the plastic package can be removed in a short time after the operations of steps 12 to 16, and the The semiconductor wafer is exposed. Then, step 18 is performed. After the reaction between the fuming nitric acid and the plastic package is completed, acetone (Acetone) is used to rinse and remove the fuming nitric acid remaining on the semiconductor wafer. Among them, whether the reaction between fuming nitric acid and the plastic package is complete or not can be determined based on whether the bubbles generated by the reaction are no longer generated. Then, the operation procedures of steps 12 to 18 may be repeated in sequence until the exposed size of the semiconductor wafer meets the requirements of the observer. Next, the fault diagnosis of the semiconductor wafer can be performed, which can be easily achieved by those skilled in the art, so it will not be repeated here. As for the method of removing the sealing portion at the unsealed area on the plastic package by an automatic tool, the main difference from the method of manually removing the sealing portion at the unsealed area on the plastic package is the removal of the plastic package by using fuming nitric acid. The step of covering the upper unsealing area until the semiconductor wafer is exposed, that is, the above steps 12 to 16. Figure 2 shows the traditional use of automatic tools to remove the 4 on the plastic package ---; -------- Ki ------ order --------- line (谞 Read the precautions on the back before filling this page.) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm). Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs * '1 4 4 33 33 A7 5664twf .doc / 008 B7 V. Description of the invention (6) Schematic diagram of the process of the cover at the unsealed area. FIG. 3 is a schematic diagram showing the disassembly of an automatic tool used to remove the cover at the unsealed area on a conventional plastic package. Please refer to Figs. 2 and 3 at the same time. First, step 20 is performed to know the size of the semiconductor wafer in the plastic package to determine the size of the cover portion at the unsealed area to be removed. Next, step 22 is performed to select a suitable rubber pad 30 so that the opening 32 has a size matching the size of the cover portion at the unsealed area to be removed. Then, step 24 is performed to place the plastic package in the hole 36 of the card holder 34, and at the same time, the cover of the unsealed area of the plastic package to be removed is downwardly exposed from the opening 32 of the rubber pad 30. Among them, the card seat 34, the rubber pad 30, the clamp 38, and the fuming nitric acid input device 40 are fixed together by a screw or a tenon 42. Next, step 26 is performed to set the temperature and time of the fuming nitric acid input, and the fuming nitric acid is input through the inlet 44 of the fuming nitric acid input device 40, so that the fuming nitric acid and the sealing portion at the unsealed area of the plastic package to be removed are generated. The semiconductor chip in the plastic package is exposed. Next, step 28 is performed to keep the exposed surface of the semiconductor wafer clean, which is the same as the method of cleaning the surface of the semiconductor wafer by manual method, so it will not be repeated here. The traditional method of manually removing the cover of the unsealed area on the plastic package often causes a problem that the size of the opening is not easy to control. In addition, the traditional method of manually removing the cover portion of the unsealed area on the plastic package, because the area outside the unsealed area is not affected by any objects 5 --l · --------- ^ i ---- --Order -------- T ', (please read the phonetic notes on the back side first and then fill out this page) This paper size is applicable to China National Standard (CNS) A4 specification α? 10 X 297mm t) 4 6 33 4 0 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs * '1 clothing 5664twf.doc / 008 37 V. Protection of invention description (a), therefore, the cover part of the unopened area is often subject to fuming nitric acid. damage. However, the traditional method of using automatic tools to remove the sealing portion at the unsealed area on the plastic package cannot directly visualize the entire removal process1. Therefore, problems such as incomplete removal of the sealed portion at the unsealed area, or inadmissibility of the unsealed area often occur. In addition, the traditional method of using automatic tools to remove the lid portion of the unsealed area on the plastic package is not easy to observe in real time, so multiple test runs are required. Therefore, the present invention provides a method for precisely defining the unsealing area of a plastic package, which can solve the problem that when the traditional method is used to manually remove the sealing portion at the unsealing area on the plastic package, the size of the opening is not easy to control and the unsealed area cannot be protected Part of the problem, and when using automatic tools to remove the sealing portion at the unsealed area on the plastic package, it often happens that the sealing portion at the unsealed area is not completely removed, or the unsealed area is not allowed, and multiple trials are required. Do it before. The invention proposes a method for precisely defining the unsealing area of a plastic package, which includes: first, providing a plastic package having a semiconductor chip in the plastic package, and then finding out the size of the semiconductor chip and the position of the semiconductor chip in the plastic package Then, a mask is formed on the surface of the plastic package, and the size of the mask is larger than the size of the plastic package. Then, the four sides of the mask are folded downwards to the direction of the plastic package, and then a mask is formed in the mask. Unsealing area. The size and location of the unsealing area and the semiconductor wafer are matched. Then, the plastic sealing device is placed in a heating plate 6 ----------------- ▲ ----- --- Order --------- Line * (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Wisdom of the Ministry of Economic Affairs Printed by the Property Cooperative Consumer Cooperative 463340 A7 5664twf.doc / 008 R7 5. The description of the invention (k) is heated to reach a specific temperature, then the plastic package is clamped away from the heating plate, and an etching liquid is dropped onto the plastic package On the Kaifeng area until The part of the unsealed area of the plastic package is removed to expose the semiconductor wafer. Then, the mask is removed, and then the plastic package is immersed in an ethylenediamine solution, and the surface of the semiconductor wafer is wiped with acetone to make the semiconductor The surface of the wafer is kept clean. The present invention also provides a method for precisely defining the unsealing area of a plastic package, including: first, providing a plastic package having a semiconductor wafer in the plastic package, and then finding out the size of the semiconductor wafer and the semiconductor wafer Position in the plastic package, and then form a mask on the surface of the plastic package. The size of the mask is larger than the size of the plastic package. Then, fold the four sides of the mask downward and down toward the plastic package. An unsealing area is formed in the mask, and the size and location of the unsealing area and the semiconductor wafer are matched. Then, an etching liquid having a specific temperature is sent to the unsealing area of the plastic package until the unsealing area of the plastic package. Part is removed to expose the semiconductor wafer. Then, the mask is removed, and then, The plastic package is immersed in an ethylenediamine solution, and the surface of the semiconductor wafer is wiped with acetone to keep the surface of the semiconductor wafer clean. The present invention uses a mask larger than the size of the plastic package to adhere to the plastic package. The surface, then, according to the size and position of the semiconductor chip in the plastic package, an unsealing area is defined in this mask. Then, the plastic package is heated to a specific temperature, and the etching liquid is dripped there manually. On the unsealed area of the plastic package, or automatically input 7 paper sizes applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) ------- ^ ------ ^- ------ Order --------- line (please read the notes on the back before filling out this page) Printed by the Economic Consumers' Intellectual Property Bureau Employee Consumer Cooperative 4 6334 0 A7 5664twf.doc / 〇〇 S B7 V. Description of the invention (B) Sending method 'Drop an etching liquid with a specific temperature on the unsealed area of this plastic package' to remove the lid portion in the unsealed area 'and expose the semiconductor wafer' then 'to the semiconductor The wafer is rinsed. Since the present invention uses a microscope to observe the size of a semiconductor wafer and its position in a plastic package, and uses a mask to define it, the area to be opened can be precisely defined. In the present invention, because the cover portion outside the unsealed area is protected by a mask used to define the unsealed area, the covered portion outside the unsealed area will not be attacked by the etching liquid when the cover portion of the unsealed area is removed. The cover used in the present invention still retains a specific length after being folded down, which is beneficial to the subsequent clamping of the plastic package, and the folded-down portion can protect the pins of the plastic package, so it can prevent the plastic package from being clamped by using tweezers. During the process, the pins of the plastic package are destroyed, which is beneficial to the subsequent electrical measurement of the plastic package. In the present invention, if an automatic tool is used to remove the cover portion at the unsealed area on the plastic package, although the entire removal process cannot be visually observed directly, the unsealed area has been precisely defined by the mask, so the problem of inaccurate unsealed area will not occur. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, hereinafter, preferred embodiments are described in detail with the accompanying drawings as follows: Detailed description of the drawings: FIG. 1 is a drawing The schematic diagram of the traditional process of manually removing the cover at the unsealed area on the plastic package. Figure 2 shows the traditional method of removing the plastic package with an automatic tool.
S 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----------I--·ν^.------1訂---------線--- (請先間讀背面之注意事項再填寫本頁) 4 6334S This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) ----------- I-- · ν ^ .------ 1 order ---- ----- Line --- (Please read the precautions on the back before filling this page) 4 6334
經濟部智慧財產局員工消費合作社印製 五、發明說明（1 ) 開封區處封蓋部分的流程示意_; 第3圖係繪示傳統去除塑膠封裝上之開封區處封盖 部分所使用的自動工具分解不息圖’ 第4圖係繪示依據本發明之利用人工去除塑膠封裝 上之開封區處封蓋部分的流程示意圖； 第5圖係繪示依據本發明定義塑膠封裝之開封區的 示意圖；以及 第6A至6C圖係繪示依據本發明利用人工將塑膠封 裝之開封區的封蓋部分去除之示意圖° 圖式之標記說明： 10、1 2、1 4、1 6、1 8 :傳統利用人工去除塑膠封裝 上之開封區處封蓋部分所使用的步驟 20、22、24、26、28 :傳統利用自動工具去除塑膠 封裝上之開封區處封蓋部分所使用的步驟 3〇 :橡皮墊 32 :橡皮墊30的開口 34 :卡座 36 :卡座34的空孔 38 :夾具 40 :發煙硝酸輸入器 42 :螺絲或卡榫 44 :發煙硝酸輸入器40的入口 50、52、54、56、58、60 :本發明去除塑膠封裝上 之開封區處封蓋部分所使用的步驟 本紙張尺度適用令國國家標準（CNS)A4規格（210 X 297公釐） ---：----------衣-----——訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 6 33 4 0 5664twf.doc/008 五、發明說明（兮） 70 :塑膠封裝 72 :罩幕 74 :開封區 76 :蝕刻液體 78 :滴管 80 :乙二胺溶液 實施例 第4圖係繪示依據本發明之利用人工去除塑膠封裝 上之開封區處封蓋部分的流程示意圖。 第5圖係繪示依據本發明定義塑膠封裝之開封區的 示意圖。 請同時參照第4與5圖，首先，進行步驟50，找出 塑膠封裝70中之半導體晶片的大小，與其在塑膠封裝70 中所在的位置。 其中’此半導體晶片的大小與位置，譬如是利用感 音顯微鏡（Acoustic Microscope)或X光顯微鏡（X Ray Microscope)等非破壞性分析來得知，或者，亦可由實際 量測另一已開封之塑膠封裝中的半導體晶片大小與位置 而獲得。 而塑膠封裝70可譬如是球柵陣列式（Ball Grid Array，BGA)封裝，亦可是非球柵陣列式（Non-Ball Grid Array，Non-BGA)封裝。 接著，進行步驟52，在塑膠封裝70的表面形成一 罩幕72。 ------^-----------;----訂·-------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 4 5664twf.doc/008 五、發明說明（1 ) (請先閱讀背面之注意事項再填寫本頁) 其中，此罩幕72所使用的材料譬如是膠布，較佳 是使用雙面膠膠布，而罩幕72所使用的尺寸，需大於塑 膠封裝70的尺寸，其較佳的尺寸，譬如是大於塑膠封裝 70的四邊均約略2公分。 然後，進行步驟54，將罩幕72的四邊均以向下而 往塑膠封裝70的方向下摺，而使罩幕72仍保留大於塑 膠封裝70四邊的一特定長度。 此罩幕72的四邊以向下而往塑膠封裝70的方向下 摺的目的，是爲了保護塑膠封裝70的接腳（假使塑膠封 裝70是採用非球柵陣列式封裝）。 而下摺後之罩幕72所保留的一特定長度，則有利 於之後塑膠封裝70的夾取。此下摺後之罩幕72所保留 一特定長度，較佳是約略1公分。 接著，進行步驟56，在此罩幕72中定義出塑膠封 裝70的開封區74。 經濟部智慧財產局員工消費合作社印製 此塑膠封裝70的開封區74定義所使用的方法，譬 如是依照步驟50所找出之半導體晶片的大小與位置，以 美工刀於此罩幕72上切除和半導體晶片的大小與位置匹 配之區域，此區域即塑膠封裝70的開封區74。 然後，進行步驟58，使罩幕72與塑膠封裝70緊緊 貼在一起，用以防止後續將塑膠封裝70之開封區74的 封蓋部分去除時，蝕刻液體侵入開封區74以外的封蓋部 分。 接著，進行步驟60，利用人工或自動工具輸送蝕刻Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (1) Schematic diagram of the sealing part at the Kaifeng area; Figure 3 shows the automatic removal of the sealing part at the Kaifeng area on the traditional plastic package. Unbroken tool drawing 'Figure 4 is a schematic diagram showing the process of manually removing the sealing portion at the unsealed area on the plastic package according to the present invention; Figure 5 is a diagram showing the unsealed area of the plastic package defined according to the present invention ; And FIGS. 6A to 6C are schematic diagrams showing the removal of the lid portion of the unsealed area of a plastic package by hand according to the present invention. The mark description of the diagram: 10, 1 2, 1 4, 16, 6, 18: Traditional Steps 20, 22, 24, 26, 28 for manually removing the sealing portion at the unsealed area on the plastic package by hand: Step 30 used to remove the sealing portion at the unsealed area on the plastic package by a conventional automatic tool Pad 32: opening 34 of rubber pad 30: card holder 36: empty hole of card holder 38: clamp 40: fuming nitric acid input device 42: screw or tenon 44: inlet 50, 52, fuming nitric acid input device 40 54, 56, 58, 60: The steps for inventing the removal of the cover at the unsealed area on the plastic package. This paper size applies the national standard (CNS) A4 specification (210 X 297 mm) ---: ---------- Clothing --------- Order --------- line (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 33 4 0 5664twf.doc / 008 V. Description of the invention (Xi) 70: Plastic package 72: Cover 74: Unsealing area 76: Etching liquid 78: Dropper 80: Ethylene diamine solution Example 4 shows the use of manual removal of plastic according to the present invention A schematic flow chart of the capping portion at the unsealing area on the package. FIG. 5 is a schematic diagram illustrating an unsealing area of a plastic package according to the present invention. Please refer to FIGS. 4 and 5 at the same time. First, step 50 is performed to find out the size of the semiconductor wafer in the plastic package 70 and its position in the plastic package 70. Among them, the size and position of this semiconductor wafer can be learned by non-destructive analysis such as an acoustic microscope or X-ray microscope, or it can also be measured by actually measuring another opened plastic. Obtained from the size and position of the semiconductor wafer in the package. The plastic package 70 may be, for example, a Ball Grid Array (BGA) package, or a non-Ball Grid Array (Non-BGA) package. Next, step 52 is performed to form a mask 72 on the surface of the plastic package 70. ------ ^ -----------; ---- Order · -------- (Please read the precautions on the back before filling this page) This paper size applies China National Standard (CNS) A4 Specification (210 X 297 mm) 4 5664twf.doc / 008 V. Description of the Invention (1) (Please read the precautions on the back before filling this page) Among them, the ones used in this mask 72 The material is, for example, adhesive tape, preferably a double-sided adhesive tape, and the size of the cover 72 needs to be larger than the size of the plastic package 70. The preferred size, for example, is about 2 cm on all four sides of the plastic package 70. Then, step 54 is performed, and the four sides of the cover 72 are folded downwardly toward the plastic package 70, so that the cover 72 remains a certain length longer than the four sides of the plastic package 70. The purpose of folding the four sides of the cover 72 downwards toward the plastic package 70 is to protect the pins of the plastic package 70 (assuming that the plastic package 70 is a non-ball grid array package). A specific length reserved by the folded-down mask 72 is beneficial to the subsequent clamping of the plastic package 70. The folded-down mask 72 retains a specific length, preferably about 1 cm. Next, step 56 is performed in which an unsealing area 74 of the plastic package 70 is defined in the mask 72. The consumer ’s cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the unsealed area 74 of the plastic package 70 to define the method used, for example, the size and position of the semiconductor wafer found in step 50, and cut off on this mask 72 with a utility knife. The area matching the size and position of the semiconductor wafer is the unsealing area 74 of the plastic package 70. Then, step 58 is performed to make the cover 72 and the plastic package 70 tightly adhere to each other, so as to prevent the etching liquid from invading the cover portion other than the unsealing area 74 when the cover portion of the unsealing area 74 of the plastic package 70 is subsequently removed. . Next, proceed to step 60, using manual or automatic tools to transport the etch
1 E 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 4 334 0 A7 5664twf.doc/008 五、發明說明（丨〇) 液體的方式，將開封區74中的封蓋部分去除。 (請先閱讀背面之注意事項再填寫本頁) 第6Α至6 C圖係繪示依據本發明利用人工將塑膠封 裝之開封區的封蓋部分去除之示意圖。 請參照第6 A圖，以人工輸送蝕刻液體的方式爲例， 首先，待已形成有罩幕72與開封區74之塑膠封裝70在 加熱盤（圖未示）上加熱至一特定溫度後，利用鑷子將此 塑膠封裝70從加熱盤上移出。 此塑膠封裝70因加熱而達到的特定溫度，譬如是 攝氏70至100度。 接著，以裝有蝕刻液體76的滴管78，將蝕刻液體 76滴至塑膠封裝70的開封區74上，直到塑膠封裝70之 開封區74的封蓋部分被去除，而暴露出半導體晶片。 其中，若塑膠封裝70是非球柵陣列式封裝，則蝕刻 液體76譬如是使用發煙硝酸，而當塑膠封裝70是球栅 陣列式封裝，則蝕刻液體76譬如是使用硫酸（Sulfuric Acid，H2S04)。 經濟部智慧財產局員工消費合作杜印製 請參照第6B圖，然後，將罩幕72去除，再將塑膠 封裝70浸泡在乙二胺（又稱爲二胺基乙烷，Ethylene Diamine，EDA)溶液80中譬如約略5分鐘，以將形成在 半導體晶片上之聚亞醯胺去除。 請參照第6C圖，之後，利用丙酮來擦拭此半導體 晶片的表面，以使半導體表面保持乾淨。 而利用自動工具輸送蝕刻液體，將開封區74中的 封蓋部分去除所使用的方法，與傳統方式相似，最大的 12 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公ϋ 經濟部智慧財產局員工消費合作社印製 463340 5664twf.d〇c/008 五 '發明說明（（< ) 不同處，係本發明之塑膠封裝70的開封區74，已以罩 幕72精確地定義出來，因此不需要再使用傳統用來匹配 欲去除之開封區大小的橡皮墊30,就能精確地去除開封 區74中的封蓋部分。 接下來，便可進行半導體晶片的故障診斷，此爲熟 習此技藝者所能輕易達成，故於此不再贅述。 本發明係使用一尺寸較大於塑膠封裝尺寸的罩幕， 黏貼在塑膠封裝的表面，然後，依照塑膠封裝中之半導 體晶片的大小與位置，於此罩幕中定義出開封區，接著， 將此塑膠封裝加熱至一特定溫度，再以人工的方式，將 蝕刻液體滴在此塑膠封裝的開封區上，或是，以自動輸 送方式，將具有一特定溫度之蝕刻液體滴在此塑膠封裝 的開封區上，以去除開封區中的封蓋部分，並暴露出半 導體晶片，然後，對半導體晶片進行淸洗。 本發明由於利用顯微鏡來觀察半導體晶片的大小與 其在塑膠封裝中的位置，並使用一罩幕來定義之，因此可 精確定義欲開封之區域。 本發明因開封區以外的封蓋部分被用以定義開封區 之罩幕所保護，因此，在去除開封區之封蓋部分時，開封 區以外的封蓋部分不會受到蝕刻液體的侵蝕。 本發明所使用的罩幕在下摺後仍保留一特定長度， 有利於之後塑膠封裝的夾取，而其下摺的部分可保護塑 膠封裝的接腳，因此，可防止在使用鑷子夾取塑膠封裝 的過程中’破壞塑膠封裝的接腳，進而有利於後續塑膠 13 本紙張尺度適用中國國家標準（CNS)A4覘格（210 X 297公釐） ------------^i — !!--訂----I---* 線 <請先閱讀背面之注意事項再填寫本頁) 4 633 4 0 5664 twf. doc/008 A7 B7 五、發明說明（θ) 封裝的電性量測。 本發明若使用自動工具來去除塑膠封裝上之開封區 處封蓋部分，儘管無法直接目視整個去除過程，但開封區 已由罩幕精確定義，因此不會發生對不準開封區的問題。 雖然本發明已以一較佳實施例揭露如上，然其並非 用以限定本發明，任何熟習此技藝者，在不脫離本發明 之精神和範圍內，當可作各種之更動與潤飾，因此本發 明之保護範圍當視後附之申請專利範圍所際定者爲準。 ------^------^--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）1 E This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 4 334 0 A7 5664twf.doc / 008 V. Description of the invention (丨 〇) The method of liquid will seal the cover in Kaifeng area 74 Partially removed. (Please read the precautions on the back before filling this page.) Figures 6A to 6C are schematic diagrams showing the removal of the lid portion of the unsealed area of a plastic package by hand according to the present invention. Please refer to FIG. 6A. The method of manually transporting the etching liquid is taken as an example. First, after the plastic package 70 having the cover 72 and the unsealing area 74 is formed on a heating plate (not shown), it is heated to a specific temperature. This plastic package 70 was removed from the heating plate using tweezers. The plastic package 70 reaches a specific temperature due to heating, such as 70 to 100 degrees Celsius. Next, the dropper 78 containing the etching liquid 76 is used to drop the etching liquid 76 onto the unsealed area 74 of the plastic package 70 until the lid portion of the unsealed area 74 of the plastic package 70 is removed, and the semiconductor wafer is exposed. Among them, if the plastic package 70 is a non-ball grid array package, the etch liquid 76 is, for example, fuming nitric acid, and when the plastic package 70 is a ball grid array package, the etch liquid 76 is, for example, sulfuric acid (Sulfuric Acid, H2S04). . Please refer to Figure 6B for the printing of consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, remove the mask 72 and soak the plastic package 70 in ethylenediamine (also known as Ethylene Diamine, EDA). The solution 80 is, for example, approximately 5 minutes to remove the polyimide formed on the semiconductor wafer. Referring to FIG. 6C, after that, the surface of this semiconductor wafer is wiped with acetone to keep the semiconductor surface clean. The method for removing the cover part in the unsealed area 74 by using automatic tools to transport the etching liquid is similar to the traditional method. The largest 12 paper sizes are applicable to the Chinese National Standard (CNS) A4 size (210x297). Ministry of Economic Affairs wisdom Printed by the Consumer Affairs Cooperative of the Property Bureau 463340 5664twf.doc / 008 Five 'Invention Description (<) The difference is that the unsealing area 74 of the plastic package 70 of the present invention has been precisely defined by the cover 72, so It is not necessary to use the rubber pad 30 traditionally used to match the size of the unsealed area to be removed, and the cap portion in the unsealed area 74 can be accurately removed. Next, the fault diagnosis of the semiconductor wafer can be performed, which is familiar with this technique This can be easily achieved, so I will not repeat them here. The present invention uses a mask larger in size than the size of a plastic package, adheres to the surface of the plastic package, and then, according to the size and position of the semiconductor chip in the plastic package, An opening area is defined in the mask. Then, the plastic package is heated to a specific temperature, and an etching liquid is dripped on the plastic package manually. On the unsealed area of the package, or by an automatic conveying method, an etching liquid having a specific temperature is dropped on the unsealed area of the plastic package to remove the cover portion in the unsealed area and expose the semiconductor wafer. Then, Rinse the semiconductor wafer. The present invention uses a microscope to observe the size of the semiconductor wafer and its position in the plastic package, and uses a cover to define it, so the area to be opened can be precisely defined. The invention is outside the unsealed area The cover part is protected by the mask used to define the unsealing area, so when the covering part of the unsealing area is removed, the covering part outside the unsealing area will not be attacked by the etching liquid. The mask used in the present invention A specific length is retained after folding down, which is beneficial for the subsequent clamping of the plastic package, and the folded-down portion can protect the pins of the plastic package, so it can prevent 'damaging the plastic package' during the process of using a tweezer to clamp the plastic package. 13 pins, which is conducive to the follow-up plastic 13 This paper size is applicable to China National Standard (CNS) A4 grid (210 X 297 mm) ------- ----- ^ i — !!-Order ---- I --- * Thread < Please read the notes on the back before filling this page) 4 633 4 0 5664 twf. doc / 008 A7 B7 5 Description of the invention (θ) Electrical measurement of the package. If the present invention uses an automatic tool to remove the cover at the unsealed area on the plastic package, although the entire removal process cannot be seen directly, the unsealed area has been precisely defined by the cover. Therefore, the problem of not permitting the unsealed area will not occur. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art will not depart from the spirit and scope of the present invention. Various modifications and retouching can be made, so the scope of protection of the present invention shall be determined by the scope of the attached patent application. ------ ^ ------ ^ -------- Order --------- line (Please read the notes on the back before filling this page) Intellectual Property of the Ministry of Economic Affairs The paper size printed by the Bureau ’s Consumer Cooperatives applies the Chinese National Standard (CNS) A4 (210 X 297 mm)