A7 46321 7 ______B7__ 五、發明說明（f ) 發明領域： 本發明是關於一種步進式曝光製作微透鏡結構陣列方 法’尤指適用於透鏡與基板投影位置變化控制高分子材光 •場能量分佈’以進行曝光微影製程之微透鏡陣列結構，以 供製造-金屬模，可來縣LCD面板或光感面板。 發明背景： 為了能提高例如液晶顯示螢幕、LCD、或是其他光感面 板的可視角度，於面板上必須形成有許多突起的微球面陣 列結構以增進聚光性（或散光性）。這些微球面陣列結構 之面板大多是藉由金屬模具以壓製的方式製造，而該金屬 .模具（壓模）則是藉由在一母模上經濺鍍一層金屬層後’ 再將金屬層自母模脫離開，於是該金屬層即成為可用來壓 製面板的壓模。 習用技術中’用以製造壓模之母模的方式有以下數種： (一）以單道步進機曝光並配合高溫調質法製造： 如圖一A至圖一D所示，首先在一基板11上塗佈一光阻 12層（圖一A)。然後，以一步進機14 (stepper)透過一光 罩13在基板11上進行分區、單次的步進曝光動作（圖一B)。 之後’將未曝光之光阻12以化學藥劑洗掉，而在基板丨丄上 形成右干微圓柱狀光阻15之陣列結構（圖一C)。接下來， 再以尚溫調質的方式’將基板加熱到很接近或甚至高於光 阻點（Tg)的溫度’使微圓柱狀光阻15之表面相對大量融 .化而成為圓弧狀16 (圖一D)。 2 ^纸張尺度適用中國國家標準（CNS)A4規格（21Q X 297公爱) ' _! !裝--- _ - f (請先閱讀背面之注意事項再填寫本頁)A7 46321 7 ______B7__ 5. Description of the invention (f) Field of the invention: The present invention relates to a method for making a microlens structure array by stepwise exposure 'especially suitable for controlling the light and field energy distribution of polymer materials by changing the projection position of the lens and the substrate' The micro-lens array structure for the exposure lithography process is used for manufacturing-metal molds, which can come to the county LCD panel or light-sensitive panel. BACKGROUND OF THE INVENTION: In order to improve the viewing angle of, for example, a liquid crystal display, LCD, or other light sensitive panel, a microspherical array structure with many protrusions must be formed on the panel to improve the light condensing (or astigmatism). Most of these microspherical array structure panels are manufactured by pressing with a metal mold, and the metal. The mold (press) is formed by sputtering a metal layer on a master mold, and then removing the metal layer from The master die comes off, and the metal layer becomes a stamper that can be used to press the panel. In the conventional technology, there are the following methods for manufacturing the master mold of the stamper: (1) Manufactured by single-step stepper exposure and matched with high-temperature quenching and tempering method: As shown in Figures 1A to 1D, first in A photoresist layer 12 is coated on a substrate 11 (FIG. 1A). Then, a stepper 14 (stepper) is used to pass through a photomask 13 to perform partitioned, single step exposure operations on the substrate 11 (Fig. 1B). After that, the unexposed photoresist 12 is washed away with a chemical agent, and an array structure of right dry micro-cylindrical photoresist 15 is formed on the substrate (FIG. 1C). Next, the substrate is heated to a temperature very close to or even higher than the photoresistance point (Tg) in a temperature-stabilizing manner, so that the surface of the micro-cylindrical photoresist 15 is melted in a relatively large amount into an arc shape. 16 (Figure 1D). 2 ^ Paper size applies to China National Standard (CNS) A4 (21Q X 297 public love) '_!! Packing --- _-f (Please read the precautions on the back before filling this page)
*II6J 經濟部智慧財產局員工消費合作社印製 MS321 7 A7 ' ----______ 五、發明說明（>) 士此種技術具有以下缺點：丨.需高溫調質，其製程不僅 費日卞且結果不穩定’無法精碟控制立體圓球面之形狀。2. (請先閱讀背面之注意事項再填寫本頁) 藉由步進聲光只能形成2D圓柱結構，無法產生圓球面或甚 至是非球面的3D立體面面。 (二） 多道步進曝光微影製程： 藉由多道步進曝光微影製程，重複進行圖與圖一 c 之步驟，並配合不同光罩圖案使光阻曝光區域漸次變大， 最後將可得到類似金字塔之光阻結構，然後再進行高溫調 質，於是，調質的溫度將可降低且調質時間較短，而立體 圓球面之形狀亦較易於控制。然而，其缺點是製程步驟多 且十分繁複，不僅費時且成本高，而清洗光阻之化學藥劑 亦易造成環境污染。 (三） 光敏玻璃製程： 如圖二A至圖二β所示，首先以一紫外線光源24 (UV) 透過一光罩23以步進曝光的方式來照射一光^^玻璃21 (圖 二Α)。於該光敏玻璃21上塗有異狀之光敏材22 (photosensitive material)。該光敏材22在受到紫外線光源 經濟部智慧財產局員工消費合作杜印製 照射的區域將會硬化膨脹’並播壓未曝光之光敏材，而在 基板上形成若干突起之結構25 (圖二B)。 此技術的最大缺失是光敏玻璃的成本極高且不易購 得，並且體積膨脹的形狀不易精確控制。 (四） 加溫滴入製程： 如圖三所示，以加溫滴入的方式將光阻32 —滴滴地（或 可一次多滴）少量滴在基板31上而形成突起的立體結構33。 3 本琴張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） 4 63 21 7 五 經濟部智慧財產局員工消費合作社印製 發明說明（)） 構形^技術的缺點是完全無法控制所形成微球面陣列的結 {請先閱讀背面之注意事項再填寫本頁) 由此可知，上述之各種習用技術均各有其缺點，而有 待進一步之改進。 發明概述： /本發日狀主要目的，即是在提供—種步進式曝光製作 微透鏡結獅财法，可以更簡便且姆更便宜的方式， 在-基板上形成可精確㈣職_面或非球續鏡 列結構。 、本發明之另-目的’是在提供一種步進式曝光製作微 透鏡結構陣财法，齡-魏與—基板投影位置變化控 制1¾分子材光場能量分佈，以進行曝光微影製程。控制一 光源透過透鏡對纺a把'高分子叫進仁呼料，可依π穿々 光場能量分佈，使高分子材被蝕刻而形成預定形狀之微透 鏡結構，再控制光源及一χ_γ定位平台進行步進式曝光，使 付微透鏡結構在南分子村之位置與密度被控制’因而可完 成微透鏡陣列結構。 為達上述之目的，於本發明之較佳實施例中’該步進 式曝光製作微透鏡結構方法係包括有下列步驟： (a) 準備一表面塗佈有高分子材之基板，置放於 定位平台上，以及設有預定曲率之至少一透鏡。 (b) 控制一光源透過透鏡’使得該基板之高分子材位 於該透鏡投影位置之一中透鏡光場上。 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 B7* II6J MS321 7 A7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ----______ V. Description of Invention (>) This technology has the following disadvantages: 丨 requires high-temperature quenching and tempering, and its manufacturing process is not only costly. And the result is unstable. 'It is impossible to finely control the shape of the three-dimensional spherical surface. 2. (Please read the precautions on the back before filling this page.) Stepping sound and light can only form 2D cylindrical structures, and cannot produce spherical or even aspheric 3D solid surfaces. (2) Multi-step exposure lithography process: Through the multi-step exposure lithography process, repeat the steps of Figure 1 and Figure 1c, and use different mask patterns to gradually increase the photoresist exposure area. Finally, A pyramid-shaped photoresist structure can be obtained, and then high-temperature quenching and tempering can be performed. Therefore, the tempering temperature can be reduced and the quenching time is shorter, and the shape of the three-dimensional spherical surface is easier to control. However, its disadvantages are that the manufacturing steps are many and complicated, which is not only time-consuming and costly, but also the chemical agents used to clean the photoresist are also liable to cause environmental pollution. (C) Photosensitive glass manufacturing process: As shown in Figures 2A to 2β, a light source 21 (UV) is firstly irradiated with a light through a mask 23 in a stepwise exposure mode. Glass 21 (Figure 2A ). A photosensitive material 22 (photosensitive material) having a special shape is coated on the photosensitive glass 21. The photosensitive material 22 will harden and swell in the area exposed to UV light source employee intellectual property bureau consumer cooperation du printed printing, and will swell the unexposed photosensitive material, and form a number of protruding structures 25 on the substrate (Figure 2B ). The biggest disadvantage of this technology is that the cost of photosensitive glass is extremely high and not easily available, and the shape of volume expansion is not easy to accurately control. (IV) Heating and dropping process: As shown in Figure 3, the photoresist 32 is dripped (or may be dropped multiple times) onto the substrate 31 in small drops to form a three-dimensional structure with protrusions. . 3 This scale is in accordance with the Chinese National Standard (CNS > A4 specification (210 X 297 mm) 4 63 21 7 5. The Intellectual Property Bureau, Ministry of Economic Affairs, Employee Consumer Cooperatives printed invention description ()) Configuration ^ The disadvantage of technology is completely impossible Control the knots of the formed microsphere array {Please read the precautions on the back before filling this page) It can be seen that each of the above-mentioned conventional techniques have their shortcomings and need to be further improved. Summary of the invention: / The main purpose of this publication is to provide a kind of step-by-step exposure method for making micro-lens knots, which can be a simpler and cheaper way to form a precise job on the substrate. Or aspherical continuous mirror structure. Another object of the present invention is to provide a stepwise exposure method for making micro-lens structure arrays. The age-wei and-substrate projection position changes control the energy distribution of the light field of the molecular material to perform the exposure lithography process. A light source is controlled through a lens pair to spin the polymer into the core material. The light field energy distribution can be penetrated according to π, so that the polymer material is etched to form a microlens structure of a predetermined shape. Then the light source and a χ_γ positioning are controlled. The platform performs stepwise exposure, so that the position and density of the micro-lens structure in the South Molecular Village can be controlled, thereby completing the micro-lens array structure. In order to achieve the above-mentioned purpose, in a preferred embodiment of the present invention, the method for making a microlens structure by stepwise exposure includes the following steps: (a) preparing a substrate coated with a polymer material on the surface and placing the substrate on And at least one lens provided with a predetermined curvature on the positioning platform. (b) Control a light source to pass through the lens' so that the polymer material of the substrate is positioned on the lens light field in one of the projection positions of the lens. 4 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) A7 B7
4 6321 7 五、發明說明（ 子材透财鏡對該基㈣—位置上之高分 ’使高分子材被侧而形成—微透鏡結構。 移動至第2止該光源之照射，控制該X—Ys位平台使基板 一八—位置，控制該光源透過透鏡對該基板第二位置 二持進行照射，使第二位置處之高分子材被_ 而形成微透鏡結構。 (e) 重複（d)直到在基板上形成微透鏡結構陣列。 較佳者，本發明更包括有下列步驟： (f) 以化學蝕刻方式去除高分子材之碎屑。 (g) 進行表面處理使微透鏡結構表面的滑順化。 (h) 在基板及微透鏡結構上濺鍍種子層。 (0以電鍍方式在濺鍍種子層上形成一預定厚度之金 屬層。 (j)將金屬層脫離基板及微透鏡結構，使該金屬層成 為可壓製微陣列結構之金屬模β θ 為使貴審查委員對於本發明能有更進一步的了解與 認同，茲配合圖式作一詳細說明如后。 圖式之簡單說明： 圖一係為習用以单道步進機曝光並配合高溫調質法製造的 流程示意圖。 圖二係為習用之光敏玻璃製程的流程示意圖。 圖三係為習用之加溫滴入製程的示意圖。 5 本紙張尺國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 J§J. 經濟部智慧財產局員工消費合作社印製 A7 A74 6321 7 V. Description of the invention (The sub-mature penetrating mirror has a high score on the base-the polymer material is formed by the side-a micro-lens structure. Move to the second stop of the light source to control the X The —Ys position platform makes the substrate 18-position, and controls the light source to irradiate the substrate at the second position through the lens, so that the polymer material at the second position is formed into a micro-lens structure. (E) Repeat (d) ) Until the microlens structure array is formed on the substrate. Preferably, the present invention further includes the following steps: (f) removing the debris of the polymer material by chemical etching. (G) performing a surface treatment to make the surface of the microlens structure (H) Sputtering a seed layer on the substrate and the microlens structure. (0) A metal layer with a predetermined thickness is formed on the sputtered seed layer by electroplating. (J) The metal layer is separated from the substrate and the microlens structure. In order to make the metal layer a metal mold of the compressible microarray structure β θ, in order to allow your reviewers to further understand and agree with the present invention, a detailed description is given below in conjunction with the drawings. Brief description of the drawings: Picture one is a custom Single-step stepper exposure and high-temperature quenching and tempering method manufacturing process. Figure 2 is a schematic diagram of the conventional photosensitive glass manufacturing process. Figure 3 is a schematic diagram of the conventional heating and dropping process. 5 This paper ruler country Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Install J§J. Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 A7
4G3 24^- 五、發明說明（ 圖四A至四G係為本發明步進式曝光製作微透鏡結構陣列 方法之一較佳實施例流程示意圖。 '圖五A為本發明之步進式曝光系統較佳實施例架構示意圖。 圖五B為本發明之步進式曝光系統較佳實施例方向示意圖。 圖六A係本發明之透鏡光場分析之光束寬深度之一較佳實 施例分佈示意圖。 圖六B係本發明之透鏡光場分析之近透鏡平面光強度能量 之一較佳實施例分佈示意圖。 圖六C係本發明之透鏡光場分析之中透鏡平面光強度能量 之一較佳實施例分佈示意圖。 圖六D係本發明之透鏡光場分析之焦點平面光強度能量之 一較佳實施例分佈示意圖。 圖六E係本發明之透鏡光場分析之近透鏡3 D光強度能量 之一較佳實施例分佈示意圖。 圖六F係本發明之透鏡光場分析之中透鏡3 〇光強度能量 之一較佳實施例分佈示意圖。 圖六G係本發明之透鏡光場分析之焦點3 d光強度能量之 一較佳實施例分佈示意圖。 圖號說明： 11〜基板 12〜光阻 13〜光罩 14〜步進機 15〜圓柱狀光阻 16〜圓弧狀 21〜光敏玻璃 22〜光敏材 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 -=° 經濟部智慧財產局員工消貲合作社印製4G3 24 ^-5. Description of the invention (Figures 4A to 4G are schematic diagrams of a preferred embodiment of a method for making a microlens structure array by stepwise exposure of the present invention. 'Figure 5A is a stepwise exposure of the present invention Schematic diagram of the structure of a preferred embodiment of the system. Figure 5B is a schematic diagram of the direction of a preferred embodiment of the step exposure system of the present invention. Figure 6A is a distribution diagram of a preferred embodiment of the beam width and depth of the lens light field analysis of the present invention Figure 6B is a schematic diagram of the distribution of near-lens plane light intensity energy of the lens light field analysis of the present invention. Figure 6C is one of the lens plane light intensity energy of the lens light field analysis of the present invention. Example distribution diagram. Figure 6D is a distribution diagram of a preferred embodiment of the focal plane light intensity energy of the lens light field analysis of the present invention. Figure 6E is a near lens 3D light intensity energy of the lens light field analysis of the present invention A distribution diagram of a preferred embodiment. Fig. 6F is a distribution diagram of a preferred embodiment of the lens 30 light intensity energy in the analysis of the lens light field of the present invention. Fig. 6G is a light field of the lens of the present invention Focal point of analysis 3 d Light intensity energy distribution diagram of a preferred embodiment. Explanation of drawing number: 11 ~ substrate 12 ~ photoresistor 13 ~ photomask 14 ~ stepper 15 ~ cylindrical photoresistor 16 ~ arcuate 21 ~ Photosensitive glass 22 ~ photosensitive material The size of this paper applies to Chinese National Standard (CNS) A4 (21〇X 297 mm) (Please read the precautions on the back before filling out this page) 装-= ° The staff of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Cooperatives
4632U A7 ______ B7 五、發明說明（L ) 24〜紫外線光源 31〜基板 33〜立體結構 42〜尚分子材 46〜表面 48〜金屬層 52〜第二方向 5 5〜光源 57〜快門控制 61〜近透鏡光場 63〜焦點光場 —ιίιιι——— — — — — * 1 I , .f (請先閱讀背面之注意事項再填寫本頁) 23〜光罩 25〜突起之結構 32〜光阻 41〜基板 43〜微透鏡結構 47〜種子層 51~第一方向 54〜透鏡 56〜X-Y定位平台 5 8〜控制系統 62〜中透鏡光場 本發明之較佳實施例說明： 本發明之步進式曝光製作微透鏡結構陣列方法，主要 是藉由一透鏡與一基板投影位置變化控制高分子材光場能 量分佈’以進行曝光微影製程。控制一光源透過透鏡對該 基板之高分子材進行照射’可依不同之光場能量分佈，使 高分子材被蝕刻而形成預定形狀之微透鏡結構，再控制光 經濟部智慧財產局員工消費合作社印製 源及一 X-Y定位平台進行步進式曝光，使得微透鏡結構在 高分子材之位置與密度被控制，因而可完成微透鏡陣列結 構。 以下僅以一較佳實施例詳細說明本發明。 • 請參閱圖四A至圖六G，為本發明之步進式曝光製作微 透鏡結構陣列方法的一較佳實施例，其包括有下列步驟： ___ 7 ^紙張尺國家標準（挪)人4規格（21〇 x 297 ) 4 6321 7 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明（9 ) 步驟（a):如圖四A所示，準備一表面塗佈有高分子材 42之基板41，參閱圖五A，該表面塗佈有高分子材42之基板 41 ’置放於一X-Y疋位平台56上’以及設有預定曲率之至少 一透鏡54。 其中，該南分子材42係以選用鍵結能量相對較低的材 質為較佳，例如光阻材（photoresistmaterial)等，以利於讓 光源照射破壞其鍵結以達到餘刻兩分子材42之目的。高分 子材 42 係以旋塗（Rot ary Sp i ndle)、印刷（printing)、或 是化學增層（Chemical Deposition)等方法塗佈於基板41 (substrate)上。該基板41係為不易被光源所蝕刻的材料為 . 較佳’而可兼作為進行蝕刻之終止層，基板41可為半導體 基板例如砍等。 而該X-Y定位平台56之動作係一控制系統58所控制，該 控制系統58可為電腦、微處理機或pL〇 步驟（b):如圖六A所示，控制一光源55透過透鏡54， 使得該基板41之向分子材42位於該透鏡54投影位置之一中 透鏡光場62上。 請參閱圖六A係本發明之透鏡光場分析之光束寬深度 .之一較佳實施例分佈示意圖，其中光源55透過該透鏡54 可依透鏡54不同之曲率而產生不同之光束寬度以及不同之 光束深度。 清參閱圖六B及圖六E係本發明之透鏡光場分析之近 透鏡光強度能量之-較佳實施例分佈示意圖，如當高分子 材42置於近透鏡光場61日夺，由於近透鏡光強度係為呈現4632U A7 ______ B7 V. Description of the invention (L) 24 ~ UV light source 31 ~ Substrate 33 ~ Three-dimensional structure 42 ~ Still molecular material 46 ~ Surface 48 ~ Metal layer 52 ~ Second direction 5 5 ~ Light source 57 ~ Shutter control 61 ~ near Lens light field 63 ~ Focus light field—ιίιι ——— — — — * 1 I, .f (Please read the precautions on the back before filling out this page) 23 ~ Photomask 25 ~ Protruding structure 32 ~ Photoresist 41 ~ Substrate 43 ~ Micro lens structure 47 ~ Seed layer 51 ~ First direction 54 ~ Lens 56 ~ XY positioning platform 5 8 ~ Control system 62 ~ Medium lens light field Description of a preferred embodiment of the present invention: Stepping type of the present invention The method of making a microlens structure array by exposure is mainly to control the light field energy distribution of a polymer material by changing the projection position of a lens and a substrate to perform an exposure lithography process. Control a light source to irradiate the polymer material of the substrate through the lens. The polymer material can be etched to form a micro-lens structure with a predetermined shape according to the different light field energy distribution, and then control the staff consumer cooperative of the Intellectual Property Bureau of the Ministry of Light Economy The printing source and an XY positioning platform perform stepwise exposure, so that the position and density of the micro lens structure in the polymer material are controlled, so that the micro lens array structure can be completed. In the following, the present invention is described in detail with only one preferred embodiment. • Please refer to FIG. 4A to FIG. 6G, which is a preferred embodiment of the method for fabricating a microlens structure array by stepwise exposure according to the present invention, which includes the following steps: ___ 7 ^ National Standard for Paper Rulers (Norwegian) 4 Specifications (21 × x 297) 4 6321 7 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (9) Step (a): As shown in Figure 4A, prepare a surface coated with a polymer material 42 For the substrate 41, refer to FIG. 5A. The substrate 41 coated with the polymer material 42 is “positioned on an XY stage 56” and at least one lens 54 is provided with a predetermined curvature. Among them, the south molecular material 42 is preferably a material with a relatively low bonding energy, such as a photoresist material, so as to facilitate the light source to destroy its bonding to achieve the purpose of the two molecular materials 42 in the remainder. . The high molecular material 42 is coated on the substrate 41 by a method such as spin coating, printing, or chemical deposition. The substrate 41 is made of a material that is not easily etched by a light source. The substrate 41 is preferably a termination layer for etching. The substrate 41 may be a semiconductor substrate such as a chip. The movement of the XY positioning platform 56 is controlled by a control system 58. The control system 58 may be a computer, a microprocessor, or pL. Step (b): As shown in FIG. 6A, a light source 55 is controlled to pass through the lens 54, The directional molecular material 42 of the substrate 41 is located on the lens light field 62 in one of the projection positions of the lens 54. Please refer to FIG. 6A is a beam width and depth analysis of the light field analysis of the lens of the present invention. A distribution diagram of a preferred embodiment, in which the light source 55 passes through the lens 54 can generate different beam widths and different beam widths according to different curvatures of the lens 54. Beam depth. Refer to Figure 6B and Figure 6E for the near-lens light intensity energy of the lens light field analysis of the present invention-a preferred embodiment of the distribution diagram. For example, when the polymer material 42 is placed in the near-lens light field 61, because Lens light intensity is presented
(請先閱讀背面之注意事項再填寫本頁) --裝 訂. 經濟部智慧財產局員工消費合作社印製 ----— 防___ 五、發明說明（y) 能量擴散狀態 '’故高分子材42會被兹刻成一中心半徑較 大’但深度贱，坡度較和緩之半球面體結構^ 请參閱圖六D及圖六G係本發明之透鏡光場分析之焦 點光強度能f之-健實齡丨分佈示意圖，#高分子材42 置於焦點光場63時，由於焦點光強度係為呈現能量集中狀 態，故高分子材42 f被餘刻成一中心半徑較小，但深度較 深’坡度較陡峻之半球面體結構。 請參閱圖六(：及圖六卩係本發明之透鏡光場分析之中透 鏡光強度能量之-較佳實施例分佈示意圖，於此中透鏡光 場62位置侧出之高分子材42半球面體結構，係介於近透 鏡光％61以及焦點光場63之半球面體結構，為一半徑小於 近透鏡光場61而深度小於焦點光場63之半球面體結構。 步驟（c):如圖五a所示，藉由該光源55透過該透鏡54 對該基板41第-位置上之高分子材進行照射，如圖四B所 .示，使高分子材42被蝕刻而形成一微透鏡結構43。 在本較佳實施例中，該微透鏡結構43係為半徑小於近 透鏡光場61而深度小於焦點光場6 3之半球面體結構。 步驟（d):之後，停止該光源55之照射，控制該χ-γ 定位平台56使基板41移動至第二位置，控制該光源55透過 透鏡54對該基板41第二位置上之高分子材42進行照射，使 高分子材42被蝕刻而形成微透鏡結構43。 其中，該光源55更設有一快門控制57，其係控制該光 , 源55瞬間透過透鏡54對高分子材42進行照射，而該快門控 制57之動作係一控制系統58所控制，該控制系統58可為電 _ 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------裝--- - .( (請先閱讀背面之注意事項再填寫本頁) -3 · 463 2 濟 部 智 慧 財 k 局 員 工 消 費 合 作 社 印 製 B7 五、發明說明（I) 腦、微處理機或PLC。 步驟（e):如圖五B所示，控制光源55及χ-γ定位平台 56進行步進式曝光，使得微透鏡結構43在高分子材犯位置 與密度控制，以完成微透鏡陣列結構。 在本較佳實施例中，微透鏡結構43係為半球面體結 構，故快門控制57只有在當基板41移動至固定位置（第一 位置或第二位置）時開啟，控制該光源55瞬間透過透鏡54 對高分子材42進行照射，而基板41移動時，快門控制57為 關閉（光源55無法進行照射）。 其中該X-Y定位平台56 ’係以第一方向51及第二方向52 取適當距離、適當交錯位移，以完成一陣列點結構，可依 不同之陣列點結構，設計不同之位移方式，在本較佳實施 例中’第一方向51及第二方向52係為垂直。 ’ 纟驟⑴··如所示，以化學侧方式去除高分 子材之碎屑。由於在光源55衝擊高分子材42進行蝕刻時， 可能會有部份剝離的高分子材42碎屑沾附在基板41或微透 鏡結構43的表面上，因此可藉由化學蝕刻方式快速清除這 些碎屑。 步驟（g):如圖四D所示，進行表面處理使微透鏡結 構表面46的_化。由於輯鏡結獅已較齡面結構 了，所以我們可選擇以相對較快速、低溫的方式來少量進 -行表面少量融化的方式使其表面滑·，例如：以低於高 分子材熔點（Tg)的溫度進行低溫調質擴散（refl〇w diffusion)、高能量束快速加工、或是快速熱回火處理 本紙張尺度剌t關家辟(CNS)A4規格(210 X 29fi^7 ---II------裝 i I ,ί- (請先閱讀背面之注意事項再填寫本頁) 訂： 蛭濟部智慧財產局員工消費合作社印製 4 63 2 η Δ7 ' ' --------------- 五、發明說明（丨σ ) (RTA) 〇 步驟（h):如圖四E所示，在基板幻及微透鏡結構層 氣鍍金屬材負之種子層47 (seed layer)，此種子層以鍊金 屬或其合金為較佳。 ，步驟（i):如圖四F所示，以電鍍方式在濺鍍種子層47 $成預疋厚度之金屬層48，此金屬層48之封質可為鎳 金屬或其合金為較佳。 ” 步驟（j):如圖四G所示，將金屬層48脫離基板及微透 鏡結構層以成為一獨立元件，該金屬層48可作為壓製其他 ’微陣列結構之金屬模（m〇ld)。 當然’本發明之技術並非僅僅適用於半球面體結構之 陣列的形成，吾人亦可藉由設計不同的透鏡曲率，產生不 同之光束寬度以及不同之光束深度，配合不同對應方向的 移動H?、射，而可以得到例如满圓球面 '波浪面、或是其他 立體圖案結構者。 ’、 相對於則述之習用技術，本發明至少具有下列優點： (1) 光是藉由光源透過透鏡來進行加工，即可輕 ，易且精密地形成類球面的微結構，所以僅需 要以低溫調質擴散便能得到良好滑順表面q (2) 解決習用技術之製程中，單道微影製作成圓 柱狀結構後，必需以高溫調質的問題。 (3 ) 相對於習用技術以多道微影作成金字塔型妹 構的技術’本發明之製程簡化且可縮短製輕 時間。 --- --------------I i . (請先閱讀背面之注意事項再填寫本頁) 訂： 、· 本紙張尺廑逋用中國固家標準（CNS)A4娟.格（210 X 297公楚Ί A7 玉、發明說明(4) 本發明可因應不同非球面微結構予以設計不 同的製程參數，例如改變透鏡曲率、置於光 束之深度或是改變移動照射時之方向或順 序。 可較精確製作出球面或非球面微結構，以解 決習用技術中以體積膨脹或加溫滴入的方式 無法精確控制微結構形狀的缺失。 相較於習用技術中所使用之高價光敏玻璃， 本發明之成本相對較低。 以上所述係姻—較封_詳細綱本㈣，而非限 制本發明之範圍’而且熟知此類技藝人士皆能明暸，適當 而作些微的改變及調整，仍將不失本發明之要義所在，亦 不脫離本發明之精神和範圍。 綜上所述’本發明實施之具體性，誠 所規定之發明專利要件，謹請責審杳委員氧予2 賜准專利為禱。 針審視，亚 ⑸ (6) (請先M讀背面之注意事項再填寫本頁) 裝 經濟部智慧財產局員工消費合作社印製 f 1 ®ii57cNS)A4 ^ (210 x 297公釐）(Please read the notes on the back before filling out this page)-Binding. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------- Prevent ___ V. Description of the invention (y) Energy diffusion state The material 42 will be engraved into a hemispherical structure with a large center radius but a low depth and a gentle slope. ^ Please refer to Fig. 6D and Fig. 6G are the focal light intensity energy f of the lens light field analysis of the present invention- Schematic diagram of healthy age 丨 distribution, when #polymer material 42 is placed in the focal light field 63, because the focal light intensity is in a state of energy concentration, the polymer material 42 f is carved into a smaller center radius but deeper 'Slopes with steeper hemispherical structures. Please refer to FIG. 6 (: and FIG. 6 are the distribution diagrams of the preferred embodiment of the light intensity energy of the lens in the analysis of the lens light field of the present invention-a preferred embodiment, in which the polymer material 42 hemispherical surface on the side of the lens light field 62 position The body structure is a hemispherical structure between the near lens light% 61 and the focal light field 63, and is a hemispherical structure with a radius smaller than the near lens light field 61 and a depth smaller than the focal light field 63. Step (c): If As shown in FIG. 5A, the polymer material on the first position of the substrate 41 is irradiated by the light source 55 through the lens 54. As shown in FIG. 4B, the polymer material 42 is etched to form a microlens. Structure 43. In this preferred embodiment, the micro-lens structure 43 is a hemispherical structure having a radius smaller than the near lens light field 61 and a depth smaller than the focal light field 63. Step (d): After that, the light source 55 is stopped The irradiation is controlled to control the χ-γ positioning platform 56 to move the substrate 41 to the second position, and the light source 55 is controlled to irradiate the polymer material 42 at the second position of the substrate 41 through the lens 54 so that the polymer material 42 is etched. The micro-lens structure 43 is formed. Among them, the light source 55 is further provided The shutter control 57 controls the light, and the source 55 instantly irradiates the polymer material 42 through the lens 54. The action of the shutter control 57 is controlled by a control system 58, which can be electrically controlled. Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) --------- install ----. ((Please read the precautions on the back before filling this page) -3 · 463 2 Printed by the Consumer Cooperative of the Ministry of Finance, Ministry of Economic Affairs, Bureau B7. V. Invention Description (I) Brain, microprocessor or PLC. Step (e): As shown in Figure 5B, control the light source 55 and the χ-γ positioning platform 56 Perform stepwise exposure so that the position and density of the microlens structure 43 in the polymer material is controlled to complete the microlens array structure. In the preferred embodiment, the microlens structure 43 is a hemispherical structure, so the shutter control 57 is turned on only when the substrate 41 is moved to a fixed position (first position or second position), and the light source 55 is controlled to instantly irradiate the polymer material 42 through the lens 54, and when the substrate 41 is moved, the shutter control 57 is turned off ( The light source 55 cannot be irradiated.) Where the XY The position platform 56 ′ is obtained by taking appropriate distances and staggered displacements in the first direction 51 and the second direction 52 to complete an array point structure. Different displacement methods can be designed according to different array point structures. In this preferred embodiment, The 'first direction 51 and the second direction 52 are perpendicular.' 纟 ⑴ ・ ・ As shown, the debris of the polymer material is removed chemically. As the light source 55 impacts the polymer material 42 for etching, Some fragments of the polymer material 42 that are peeled off may adhere to the surface of the substrate 41 or the micro-lens structure 43. Therefore, these fragments can be quickly removed by chemical etching. Step (g): As shown in FIG. 4D, surface treatment is performed to make the surface 46 of the microlens structure. Since the lion-mirror structure is relatively old, we can choose a relatively fast and low-temperature way to make a small amount of surface melting-make the surface slippery, for example: below the melting point of polymer materials ( Tg) temperature for low-temperature tempering diffusion (reflow diffusion), high-energy beam rapid processing, or rapid thermal tempering. Paper size 剌 t Guan Jia Pi (CNS) A4 (210 X 29fi ^ 7- -II ------ 装 i I, ί- (Please read the notes on the back before filling out this page) Order: Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 63 2 η Δ7 '' --- ------------ 5. Description of the invention (丨 σ) (RTA) 〇 Step (h): As shown in Figure 4E, the substrate and the micro-lens structure layer of the gas-plated metal material are negative. Seed layer 47 (seed layer), which is preferably a chain metal or an alloy thereof. Step (i): As shown in FIG. Layer 48, and the sealing material of the metal layer 48 may be nickel metal or its alloy. "Step (j): As shown in Fig. 4G, the metal layer 48 is separated from the substrate and the microlens structure layer to As an independent element, the metal layer 48 can be used as a metal mold (mold) for pressing other micro-array structures. Of course, the technology of the present invention is not only applicable to the formation of an array of hemispherical structures. Designing different lens curvatures to produce different beam widths and different beam depths, with different corresponding directions of movement H ?, shot, and can get, for example, a full spherical surface 'wavy surface, or other three-dimensional pattern structure.', Relative According to the conventional technology described above, the present invention has at least the following advantages: (1) Light is processed by a light source through a lens, which can lightly, easily and precisely form a spherical microstructure, so it only needs to be tempered at low temperature. Diffusion can get a good smooth surface q (2) Solve the problem that after a single lithography is made into a cylindrical structure in the conventional technology process, it must be tempered at high temperature. (3) Compared with the conventional technology, multiple lithography is used. The technology of making pyramid structure "The process of the present invention is simplified and the lightening time can be shortened. --- -------------- I i. (Please read the notes on the back before filling This page ) Order: The paper size is in accordance with Chinese solid standard (CNS) A4 Juan. Grid (210 X 297 Gong Chu297 A7 Jade, description of the invention (4) The invention can be designed for different aspheric microstructures. Process parameters, such as changing the curvature of the lens, the depth of the beam, or the direction or sequence when moving and irradiating. Spherical or aspherical microstructures can be made more accurately to solve the volumetric expansion or heating dripping in conventional techniques. The method cannot accurately control the lack of the microstructure shape. Compared with the high-priced photosensitive glass used in conventional technology, the cost of the present invention is relatively low. The above is a marriage—more closed_detailed outline, rather than limiting the scope of the present invention ', and those skilled in the art will understand that appropriate changes and adjustments will still make the essence of the present invention. Without departing from the spirit and scope of the invention. To sum up, ‘the specificity of the implementation of the present invention, and sincerely stipulated the elements of the invention patent, I would like to ask members of the reviewing committee to grant 2 patents as a prayer. Needle review, Asia (6) (Please read the notes on the back before filling out this page) Installed Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs f 1 ®ii57cNS) A4 ^ (210 x 297 mm)