TW458896B - Apparatus and method for using bubble as virtual value in microinjector to eject fluid - Google Patents

Apparatus and method for using bubble as virtual value in microinjector to eject fluid Download PDF

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Publication number
TW458896B
TW458896B TW89101599A TW89101599A TW458896B TW 458896 B TW458896 B TW 458896B TW 89101599 A TW89101599 A TW 89101599A TW 89101599 A TW89101599 A TW 89101599A TW 458896 B TW458896 B TW 458896B
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Taiwan
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bubble
fluid
fluid cavity
heater
cavity
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TW89101599A
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Chinese (zh)
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Chang-Jin Kim
Fan-Gang Tseng
Chih-Ming Ho
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Kim Chang Jin
Tseng Fan Gang
Ho Chih Ming
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Publication of TW458896B publication Critical patent/TW458896B/en

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Abstract

An apparatus and method for forming a bubble within a microchannel of a microinjector to function as a valve mechanism between the chamber and manifold, that provides for a high resistance to liquid exiting the chamber through the manifold during fluid ejection through an orifice and that also provides a low resistance to refilling of liquid into the chamber after ejection of fluid and collapse of the bubble. This effectively minimizes cross talk between adjacent chambers and increases injection frequency of the microinjector. The formation of a second bubble within the chamber coalesces with a first formed bubble between the chamber and manifold to abruptly terminate the ejection of fluid, thereby eliminating satellite droplets.

Description

五、發明說明(l) 發明背景 發明之領诚 本發明係關於液體喷射器,尤其係關於一用以由一微 裝置射出流體之裝置及方法。 相關拮術之描沭 液珠喷射器係廣泛用於喷墨印表機之列印。然而,液 珠喷射器亦具有眾多其他的可能應用,例如,燃料喷射系 統、細胞分類、藥物釋放系統、直接噴印光刻術以及微喷 射推進系統。上述所有應用的共通點在於其皆極需一可靠 且低成本之可提供高頻率及高空間解析度之高品質液滴的 液珠喷射器。 只有數種裝置能夠個別地射出形狀一致的液滴。在目 前所知且被使用的液珠喷射系統中,利用熱驅動氣泡 (thermally driven bubble)以射出液珠的方法由於簡單 且成本相當低廉,因此—直係此等裝置中最成功的設計。 熱驅動式氣泡系統(亦稱為氣泡喷射系統)的缺點在於交 相干擾(cross talk)以及衛星液珠(satellite drop 1 e t)。氣泡喷射系統係利用—電流脈衝加熱一電極, 藉以使流體腔中的液體沸騰。當液體沸騰時,一氣泡在液 體中形成並向外膨脹,此氣泡的功用係如同泵浦一般將流 體腔中之液體從一銳孔射出成一液體柱,.最後形成液珠。 當電流脈衝結束時’此氣泡隨之收縮,同時液體藉由毛細 張力而再度填滿流體腔。此等系統之效能可以下列表現加 以評估:喷射速度及方向、液珠尺寸、最大喷射頻率、鄰 第5頁 458896 五、發明說明(2) 近的流體腔之間的交相+说 BS XL -t- 十擾、液體回填期間的回填過度 (overshoot)及液面振湯 佩盈現象、以及衛星液珠的產生。在 列印過程中,衛星液砝I @ 會降低影像的清晰度,此外,在液 體控制的精確性上’衛星液珠亦會減少流量估計的準確 f。當氣泡嘴射器士以間距窄小的陣列型態配置,且液珠由 鄰近的喷嘴射出日,',交相干擾於焉發生。 珠由 大多數的熱軋泡喷射系统係將加熱器設置於流體腔之 底部,而這樣的設計會使得大部份的熱流失至底材材料。 再者,接合一般係用於將噴嘴板接合至其加熱器板,此 作去會因必要的裝配公差(assemMy t〇lerance)而限制 嘴的空間解析度。此外,接合手續未必相容於〖c製程,♦ 微喷射器陣列與控制電路需整合成—體以減少配線並確^ 封裝緊密時,這個不相容的問題將更突顯出其重要性。 為了解決交相干擾及回填過度的問題,長久以來的作 法係增加流體腔的長度或加長流體腔的頸部,藉以辦加 體腔與儲存槽之間的流體流阻《然而,此等作法會減緩 體回填至流體腔的速度’並大幅降低該裝置的最大喷射^ 率 〇 ' 現存噴墨系統最麻煩的問題係衛星液珠,因為衛星、 珠會導致影像模糊。衛星液珠係尾隨在主要液珠後^$ 列印頭與紙張處於相對運動時’衛星液珠打在ΜL ’當 上的位 置會略不同於主要液珠的位置。現今並無任何知名有效 輕易經濟的方法或手段可解決衛星液珠的問題。 > 且 因此’目前極需一種液珠喷射系統,其可^參-交相干擾V. Description of the invention (l) Background of the invention The invention relates to a liquid ejector, and more particularly to a device and method for ejecting fluid from a microdevice. Description of related techniques Liquid droplet ejectors are widely used for printing on inkjet printers. However, there are many other possible applications for bead ejectors, such as fuel injection systems, cell sorting, drug delivery systems, direct-print lithography, and micro-jet propulsion systems. All these applications have in common the need for a reliable and low cost liquid bead ejector that can provide high quality droplets with high frequency and high spatial resolution. Only a few devices can individually eject droplets of uniform shape. In the known and used liquid bead ejection systems, the method of using thermally driven bubbles to eject liquid beads is simple and relatively inexpensive, so it is the most successful design of these devices. The disadvantages of thermally driven bubble systems (also known as bubble jet systems) are cross talk and satellite drop 1 e t. The bubble jet system uses an electric current pulse to heat an electrode, thereby boiling the liquid in the fluid cavity. When the liquid boils, a bubble is formed in the liquid and expands outward. The function of the bubble is to eject the liquid in the fluid cavity from a sharp hole into a liquid column like a pump, and finally form liquid beads. When the current pulse ends, the bubble will shrink and the liquid will again fill the fluid cavity by capillary tension. The performance of these systems can be evaluated by the following performances: jet speed and direction, bead size, maximum jet frequency, adjacent page 5 458896 V. Description of the invention (2) Interphase between nearby fluid cavities + say BS XL- t- ten disturbances, overshoot during liquid backfilling, liquid surface vibration, and the phenomenon of satellite liquid droplets, and the generation of satellite liquid beads. During the printing process, the satellite liquid weight I @ will reduce the sharpness of the image. In addition, the accuracy of the liquid control will reduce the accuracy of the flow estimation f. When the bubble nozzle ejectors are arranged in an array with a narrow pitch, and the liquid beads are ejected from the adjacent nozzles, the interphase interference occurs in the radon. Beads Most hot-rolled bubble spray systems have a heater located at the bottom of the fluid cavity, and this design will cause most of the heat to be lost to the substrate material. Furthermore, joining is generally used to join the nozzle plate to its heater plate. This will limit the spatial resolution of the nozzle due to the necessary assembly tolerances. In addition, the bonding procedure may not be compatible with the [c] process. ♦ The micro-injector array and the control circuit need to be integrated into a single body to reduce wiring and ensure that the package is tight. This incompatibility will highlight its importance. In order to solve the problems of cross-phase interference and excessive backfilling, the long-term practice is to increase the length of the fluid cavity or the neck of the fluid cavity, so as to increase the fluid flow resistance between the body cavity and the storage tank. However, these practices will slow down The velocity of the body backfilling into the fluid cavity 'and greatly reduces the maximum ejection rate of the device. The most troublesome problem of the existing inkjet system is the satellite liquid beads, because satellites and beads can cause blurry images. The satellite liquid beads are trailing behind the main liquid beads ^ When the print head and the paper are in relative motion, the position of the 'satellite liquid beads on the ML' position will be slightly different from the position of the main liquid beads. There is no known effective, easy and economical method or method to solve the problem of satellite liquid beads. > And therefore, 'a liquid bead ejection system is currently highly needed, which can interfere with cross-phase interference

第6頁 458896Page 6 458896

降到最低而不減緩液體回填 下仍能消除衛星液珠,而這 及製造上的複雜性。本發明 大體上並能克服習知技術中 速度,並可在維持高頻率響應 些目的的達成將不會增加設§十 可滿足此等及其他要求,此外 所發現的缺陷。 發明概要 本發明係關於一種^由在一微一喷〜射器之—微通道中產 生一氣泡以做為流體腔與歧管之間的閥機構之裝置及方 法,該、閥機構在流體從銳孔射出期間會對流體提供一高阻 力,以防止流體由流體腔流失至歧管,此外,在流體射出 及氣泡收縮後,該閥機構對流體回填至流體腔會提供一低 阻力。 曰 _ 。 大體百之,本發明之裝置.包含一微噴射器,該微噴射 裔具有一流體腔及一與該流體腔相通之歧管、一與該流體 腔相通之銳孔、至少一用以在該流體腔與該歧管之間生成 ~氣泡之構—身、以及一用以對該流體腔加壓之_構件。 當氣..泡在該流體腔之入口形成時,會限制流體由流體 腔流至歧管。加壓構件在氣泡形成之後對流體腔加壓,使 流體腔之壓力上升至可強迫流體由銳孔射出。流體由銳孔 射出後,氣泡會收縮而使得流體能快速地再度填滿流體 腔。 在流體腔被加壓之同時,氣泡會將該流體腔與歧管及 鄰近的流體腔隔絕’交相干擾之問題因而得以降至最低。 在本發明之較佳實施例中’用以形成氣泡之構件係包Minimizing without slowing down liquid backfill can still eliminate satellite droplets, and this has manufacturing complexity. The present invention is generally and capable of overcoming the speeds in the conventional technology and maintaining high frequency response. The achievement of these objectives will not increase the design to meet these and other requirements, in addition to the defects found. SUMMARY OF THE INVENTION The present invention relates to a device and method for generating a bubble in a micro-channel of a micro-injector to a micro-channel as a valve mechanism between a fluid cavity and a manifold. During the ejection of the sharp hole, a high resistance will be provided to the fluid to prevent the fluid from being lost from the fluid cavity to the manifold. In addition, after the fluid is ejected and the bubbles are contracted, the valve mechanism will provide a low resistance to the fluid backfilling into the fluid cavity. _. Generally, the device of the present invention includes a micro-injector, the micro-injector has a fluid cavity and a manifold communicating with the fluid cavity, an acute hole communicating with the fluid cavity, and at least one for communicating with the fluid. A bubble structure is generated between the cavity and the manifold, and a member for pressurizing the fluid cavity. When gas .. bubbles form at the inlet of the fluid cavity, it restricts fluid flow from the fluid cavity to the manifold. The pressure member pressurizes the fluid cavity after the bubble is formed, so that the pressure of the fluid cavity is increased to force the fluid to be ejected from the sharp hole. After the fluid is ejected from the sharp hole, the air bubbles will shrink and the fluid can quickly fill the fluid cavity again. At the same time that the fluid chamber is pressurized, the problem of cross-phase interference that the bubble will isolate the fluid chamber from the manifold and adjacent fluid chambers is minimized. In a preferred embodiment of the present invention, a component package for forming bubbles

45889a 五、發明說明(4) 含一配置於近流體腔處之第一加熱器。加壓構件係包含一 能於流體腔内形成一第二氣泡之第二加熱器。這些加熱器 係配置於近銳孔處、包含一以串聯連接之電極,且其電阻 因電極寬度不同而相異。第一加熱器之電極較第二加熱器 之電極為窄’藉此’即使此兩加熱器被施加一共同電性訊 號’第一氣泡將可於第二氣泡之前形成。 隨著第一及第二氣泡膨脹,它們相互接近直至結合, 藉以確實地切斷由銳孔流出之流體,而消除或大大減少衛 星液珠。 本發明之一目的係提供一可消除衛星液珠之微噴射器 裝置。 本發明之另一目的係提供一可將交相干擾降到最低之 微喷射器裝置。 本發明之又一目的係提供一微噴射器裝置,其可使在 流體射出後流體快速回填至流體腔。 本發明之再一目的係提供一用以將流體由一微喷射器 流體腔射出之方法,其可將衛星液珠最小化。 本發明之另一目的係提供一用以將流體由一微嗔射器 流體腔射出之方法,其可將交相干擾降到最低。 本發明之又·一目的係k供一用以將流體由一微嗔射5| 流體腔射出之方法,其可使在流體射出後流體快速回填至 流體腔。 本發明之其他目的及優點將描述於以下之說明書各部 分,其中詳細說明僅為了充分揭露本發明之較佳實施例,45889a V. Description of the invention (4) Contains a first heater arranged near the fluid cavity. The pressurizing member includes a second heater capable of forming a second bubble in the fluid cavity. These heaters are located near the sharp hole and include an electrode connected in series, and their resistance varies with the width of the electrode. The electrode of the first heater is narrower than the electrode of the second heater. 'Even if the two heaters are applied with a common electrical signal', the first bubble will be formed before the second bubble. As the first and second bubbles expand, they approach each other until they are combined, thereby reliably cutting off the fluid flowing from the sharp holes, thereby eliminating or greatly reducing the satellite liquid beads. An object of the present invention is to provide a micro-injector device capable of eliminating satellite liquid beads. Another object of the present invention is to provide a micro-injector device capable of minimizing cross-phase interference. Yet another object of the present invention is to provide a micro-injector device, which can quickly fill the fluid back into the fluid cavity after the fluid is ejected. Another object of the present invention is to provide a method for ejecting fluid from a fluid cavity of a micro-injector, which can minimize satellite liquid beads. Another object of the present invention is to provide a method for ejecting fluid from a fluid cavity of a micro-injector, which can minimize cross-phase interference. Another object of the present invention is to provide a method for ejecting fluid from a microprojectile 5 | fluid cavity, which can quickly backfill the fluid into the fluid cavity after the fluid is ejected. Other objects and advantages of the present invention will be described in the following parts of the description, wherein the detailed description is only to fully disclose the preferred embodiments of the present invention,

第8頁 五、發明說明(5) 而並非將本發明狹義地限制於該實施例。 之簡單説 本發明藉由參考以下圖式當可更充分明白,這些圖示 僅供§兒明用,其中: 圖1係根據本發明之一微喷射器陣列裝置的一部份之立體 圖。 圖2A係圖1中所示之微喷射器陣列的一流體腔及歧管之橫 剖面圖。 圖2 B係圖2 A中所示之一流體腔及歧管之橫剖面圖,用以表 示在一第一氣泡形成後’ 一第二氣泡接著形成,藉以將流 體由一銳孔射出。 圖2C係圖2A中所示之一流體腔及歧管之橫剖面圖,用以表 示一第一氣泡及一第二氣泡結合,藉以終止液體由一銳孔 射出。 圖2D係圖2A中所示之一流體腔及歧管之横剖面圖,用以表 示在一第一氣泡收縮後,一第二氣泡接著收 流體回填至流體腔。 精以允夺 圖3係一用於製造本發明之一微噴射器陣列 視圖。 J 7日日圓之俯 圖4係一沿著圖3中所示之石夕晶圓的線段4 _ 4之構 圖5係一俯視圖,表示圖3中所示之砂晶圓從昔'、°面圖。 ^ y曰曰圓從者面被蝕刻以 圖6係一沿著圖5中所示之石夕晶圓的線段6 _ 6之〆 仏剖面圖。Page 8 V. Description of the invention (5) Instead of narrowly limiting the invention to this embodiment. To put it simply, the present invention can be more fully understood by referring to the following drawings. These diagrams are for clarification only, in which: Figure 1 is a perspective view of a part of a micro-injector array device according to the present invention. FIG. 2A is a cross-sectional view of a fluid cavity and a manifold of the micro-injector array shown in FIG. 1. FIG. Fig. 2B is a cross-sectional view of a fluid cavity and a manifold shown in Fig. 2A, which is used to indicate that after a first bubble is formed ', a second bubble is subsequently formed to eject the fluid from an acute hole. Fig. 2C is a cross-sectional view of a fluid cavity and a manifold shown in Fig. 2A, which is used to represent the combination of a first bubble and a second bubble, thereby stopping the ejection of liquid from an acute hole. Fig. 2D is a cross-sectional view of a fluid cavity and a manifold shown in Fig. 2A, which shows that after a first bubble has contracted, a second bubble then receives the fluid and backfills the fluid cavity. Figure 3 is a view of a micro-injector array used to make the present invention. The top view of the Japanese Yen 4 is a composition of the line segment 4 _ 4 along the stone evening wafer shown in FIG. 5 is a top view showing the sand wafer shown in FIG. Illustration. ^ y said that the circle follower surface is etched to FIG. 6 is a cross-sectional view taken along line 6 _ 6 of the Shixi wafer shown in FIG. 5.

45δ89β 五、發明說明(6) 圖7係一俯視圖,表示圖5中所示之矽晶圓被蝕刻以擴大一 流體腔之深度。 圖8係一沿著圖7中所示之石夕晶圓的線段8 - 8之橫剖面圖。 圖9係一俯視圖,表示圖7中所示之石夕晶圓,其上沈積具有 圖案之加熱器。 圖1 0係一沿著圖9中所示之矽晶圓的線段1 0 -1 0之橫剖面 圖。 圖1 1係一俯視圖,表示圖9中所示之石夕晶圓具有一已形成 之銳孔。 圖1 2係一沿著圖11中所示之矽晶圓的線段1 2 -1 2之橫剖面 圖。 符號說明 1 0微喷射器陣列 1 2微喷射器 1 4流體腔 16歧管 1 8銳孔 2 0第一加熱器 2 2第二加熱器 2 4共同電極 26流體 28液面高度 3 0第一氣泡45δ89β 5. Description of the invention (6) FIG. 7 is a top view showing that the silicon wafer shown in FIG. 5 is etched to enlarge the depth of a fluid cavity. FIG. 8 is a cross-sectional view along the line segment 8-8 of the Shixi wafer shown in FIG. 7. Fig. 9 is a plan view showing the Shi Xi wafer shown in Fig. 7 on which a heater having a pattern is deposited. FIG. 10 is a cross-sectional view taken along the line segment 10-10 of the silicon wafer shown in FIG. FIG. 11 is a top view showing that the Shi Xi wafer shown in FIG. 9 has a sharp hole formed. FIG. 12 is a cross-sectional view along the line segments 1 2-1 2 of the silicon wafer shown in FIG. 11. DESCRIPTION OF SYMBOLS 1 0 micro-injector array 1 2 micro-injector 1 4 fluid cavity 16 manifold 1 8 sharp hole 2 0 first heater 2 2 second heater 2 4 common electrode 26 fluid 28 liquid level height 3 0 first bubble

第10頁 45889β 五、發明說明(7) 32第二氣泡 34液柱36之尾部 3 6 液柱 3 8矽晶圓 4 0 流體腔犧牲層 4 2低應力之氤化矽 4 4 金屬配線 4 6氧化層 4 7 流體腔1 4之凸角 4 8内連線層 較佳實施例之詳細說明 詳細地參考說明用的圖示,本發明之具體化係如同圖 1至圖12所示之裝置。 首先參考圖1,圖1表示一微喷射器裝置12之一陣列 1 〇。該陣列1 〇包含複數個相互鄰接之微喷射器1 2。每一微 喷射器包含一流體腔1 4、一歧管1 6、一銳孔1 8、一第一加 熱器20以及一第二加熱器22。第一加熱器20及第二加熱器 2 2 —般係以串聯連接至一共同電極2 4之電極。 參考圖2Α,流體腔14係適合以流體26填滿。流體26可 包括但並未限制於下列流體:墨水、汽油、油、化學藥 品、生醫溶液、水等等類似物,而選用何種流體係取決於 特定的應用場合。一般而言,流體2 6之液面高度2 8會於銳 孔1 8處呈穩定狀態。歧管1 6係鄰近於流體腔1 4並與流體腔Page 10 45889β 5. Description of the invention (7) 32 Second bubble 34 Tail of liquid column 36 3 Liquid column 3 8 Silicon wafer 4 0 Fluid cavity sacrificial layer 4 2 Low-stress tritium silicon 4 4 Metal wiring 4 6 Oxidation layer 4 7 The convex corner 4 8 of the fluid cavity 14 The detailed description of the preferred embodiment of the interconnecting layer refers to the illustrations in detail. The embodiment of the present invention is the device shown in FIGS. 1 to 12. Reference is first made to FIG. 1, which shows an array 1 0 of a microinjector device 12. As shown in FIG. The array 10 includes a plurality of adjacent micro-injectors 12. Each micro-injector includes a fluid cavity 14, a manifold 16, an acute hole 18, a first heater 20 and a second heater 22. The first heater 20 and the second heater 2 2 are generally electrodes connected in series to a common electrode 24. Referring to FIG. 2A, the fluid cavity 14 is adapted to be filled with a fluid 26. The fluid 26 may include, but is not limited to, the following fluids: ink, gasoline, oil, chemicals, biomedical solutions, water, and the like, and which flow system is selected depends on the particular application. In general, the liquid level 28 of the fluid 26 will be stable at the sharp holes 18. The manifold 16 is adjacent to the fluid cavity 1 4 and is connected to the fluid cavity

第11頁 4^Β89Θ 五、發明說明(8) —-- 14相通。來自一儲存槽(未顯示於圖中)之液體流經歧管16 而供應至流體腔14。第~加熱器20及第二加熱器22係設置 於鄰近銳孔18之處、流體腔14之上,藉以防止熱散失至底 材。第一加熱器20係配置於鄰近歧管丨6之處,而第二加熱 器22則係配置於鄰近流體腔丨4之處。如圖2A所示,第一加 熱器20之橫剖面較第二加熱器22之橫剖面為窄。 參考圖2B,由於第一加熱器2〇及第二加熱器22係以串 聯相連,因此一共同電性脈衝便可用以同時啟動第一加熱 器20及第二加熱器22。因為第一加熱器2〇之橫剖面較窄, 所以電流脈衝之功率消耗在第一加熱器2 〇上相對地較高, 在對共同電性脈衝的回應上,第一加熱器2〇之加熱速度因 而快於横剖面較寬之第一加熱器2 2。此法因毋需連續地啟 動第一加熱裔20及第二加熱器22,因此在設計上相當簡 單。啟動第一加熱器20會導致—第一氣泡3〇形成於歧管16 與流體腔1 4之間。當第一氣泡3 〇沿著箭頭p之方向膨脹 時’第一氣泡30會開始限制流體流向歧管丨6,因而形成一 擬真閥,此擬真閥可將流體腔1 4隔絕,並保護鄰近的流體 腔免於交相干擾。在第一氣泡3 0形成後,一第二氣泡3 2亦 形成於第二加熱器22之下。隨著第二氣泡32沿著箭頭p之 方向膨脹’流體腔1 4之壓力亦隨之增加,因而可將流體2 6 沿著方向F從銳孔1 8射出成一液柱3 β。 參考圖2 C,隨著第一氣泡3 〇及第二氣泡3 2持續膨脹, 第一氣泡3 0與第二氣泡3 2會相互接近,進而終止流體從銳 孔1 8射出。當第一氣泡3 0與第二氣泡3 2開始結合時,液枉Page 11 4 ^ B89Θ V. Description of the Invention (8) --- 14 are connected. Liquid from a storage tank (not shown) flows through the manifold 16 and is supplied to the fluid chamber 14. The first to second heaters 20 and 22 are disposed adjacent to the sharp holes 18 and above the fluid cavity 14 to prevent heat from being lost to the substrate. The first heater 20 is disposed adjacent to the manifold 6 and the second heater 22 is disposed adjacent to the fluid chamber 4. As shown in FIG. 2A, the cross section of the first heater 20 is narrower than that of the second heater 22. Referring to FIG. 2B, since the first heater 20 and the second heater 22 are connected in series, a common electrical pulse can be used to start the first heater 20 and the second heater 22 at the same time. Because the cross section of the first heater 20 is narrow, the power consumption of the current pulse is relatively high on the first heater 20, and in response to the common electrical pulse, the heating of the first heater 20 is heated. The speed is thus faster than the first heater 22 having a wider cross section. This method is relatively simple in design because it is not necessary to continuously activate the first heater 20 and the second heater 22. Activation of the first heater 20 will result in the formation of a first bubble 30 between the manifold 16 and the fluid chamber 14. When the first bubble 30 expands in the direction of the arrow p, the first bubble 30 will begin to restrict the flow of fluid to the manifold 6 and thus form an imaginary valve, which can isolate the fluid cavity 14 and protect it. Adjacent fluid chambers are protected from cross-phase interference. After the first bubble 30 is formed, a second bubble 32 is also formed under the second heater 22. As the second bubble 32 expands in the direction of the arrow p, the pressure of the fluid chamber 14 also increases, so that the fluid 2 6 can be ejected from the acute hole 18 in a direction F into a liquid column 3 β. Referring to FIG. 2C, as the first bubble 30 and the second bubble 32 continue to expand, the first bubble 30 and the second bubble 32 will approach each other, thereby stopping the ejection of the fluid from the sharp hole 18. When the first bubble 30 and the second bubble 32 are combined,

第12頁Page 12

A 5 8 8 P S 五、發明說明(9) 36之尾部34會突然被切斷,藉以防止衛星液珠之形成。 參考圖2D ’電脈衝之終止會使得第一氣泡3〇開始沿著方向 P收縮。第一氣泡30 —收縮,歧管16與流體腔14之間便不 再有阻礙存在’流體2 6也就得以快速地沿著方向r再度填 滿流體腔1 4。 ' 由上述可知,根據本發明將流體26從一微喷射器裝置 1 2射出之方法,一般而言包含以下步驟: (a )在微喷射益裝置1 2之充滿流體的流體腔1 4中產生 第一氣泡3 0 ; (b)對流體腔1 4加壓以將流體2 6由流體腔1 4射出,其 中此加壓步驟包含在流體腔1 4中產生第二氣泡32 ; (c )增大流體腔1 4中之第一氣泡3 〇以做為擬真閥,藉 以限制流體在流體腔1 4與歧管1 6之間流動; (d)增大流體腔14中之第二氣泡32,藉此,第一氣泡 30與第二氣泡32會相互接近,進而突然終止流體由流體腔 1 4射出;以及 (e )使第一氣泡3 〇收縮以加速流體回填至流體腔1 4。 參考圖3及圖4,本發明係結合面型微加工技術及體型微加 工技術’在不需晶圓接合製程下’將一微喷射器陣列丨〇製 作於一破晶圓3 8上。此製作過程首先沉積—碌矽玻璃 (PSG)層做為流體腔犧牲層4〇 ’並對流體腔犧牲層4 〇進行 圊案轉移’之後,再沉積一低應力之氮化矽42做為流體腔 上層。 接著’如圖5及圖6所示,使用氫氧化鉀(koh )從矽晶A 5 8 8 P S V. Description of the Invention (9) The tail 34 of the 36 will be cut off suddenly to prevent the formation of satellite liquid beads. Referring to FIG. 2D, the termination of the electrical pulse will cause the first bubble 30 to begin to contract in the direction P. The first bubble 30 shrinks, and there is no longer any obstruction between the manifold 16 and the fluid cavity 14. The fluid 26 can quickly fill the fluid cavity 14 again in the direction r. As can be seen from the above, the method for ejecting the fluid 26 from a micro-injector device 12 according to the present invention generally includes the following steps: (a) generated in the fluid-filled fluid cavity 14 of the micro-injection device 12 The first bubble 3 0; (b) pressurize the fluid cavity 14 to eject the fluid 26 from the fluid cavity 14, wherein this pressurizing step includes generating a second bubble 32 in the fluid cavity 14; (c) increase The first bubble 30 in the fluid cavity 14 serves as a simulative valve, thereby restricting fluid flow between the fluid cavity 14 and the manifold 16; (d) increasing the second bubble 32 in the fluid cavity 14, Thereby, the first bubble 30 and the second bubble 32 will approach each other, and then the fluid ejection from the fluid cavity 14 is suddenly stopped; and (e) the first bubble 30 is contracted to accelerate the backfilling of the fluid into the fluid cavity 14. Referring to FIG. 3 and FIG. 4, the present invention combines a surface micromachining technology and a body micromachining technology ′ without a wafer bonding process to fabricate a micro-injector array 丨 0 on a broken wafer 38. In this manufacturing process, a silicon-silicon (PSG) layer is first deposited as a fluid cavity sacrificial layer 40 'and a fluid cavity sacrificial layer 40 is subjected to a case transfer', and then a low-stress silicon nitride 42 is deposited as a fluid cavity. upper layer. Next, as shown in FIG. 5 and FIG. 6, potassium hydroxide (koh) is used to remove silicon crystals.

第13頁 S8g $Page 13 S8g $

圓38之背面蝕刻以形成歧管16。犧牲psG層4〇以氫氟酸 (HF )移除。參考圖7及圖8,在精確地控制時間下進行另一 = ΚΟΗ蝕刻以加大流體腔14之深度。在進行此步驟期間, 需特別留意,因為流體腔丨4之凸角亦會被攻擊且會被蝕刻 成圓形。The back of the circle 38 is etched to form the manifold 16. The sacrificial psG layer 40 is removed with hydrofluoric acid (HF). Referring to FIG. 7 and FIG. 8, another etching is performed under a precisely controlled time to increase the depth of the fluid cavity 14. Pay special attention during this step, as the convex corners of the fluid cavity 4 will also be attacked and etched into a circle.

參考圖9及圖1〇,沉積第一加熱器2〇及第二加熱器 22 ’ ^對其進行圖案轉移。對第一加熱器2〇及第二加熱器 22而5 ’較佳的材料為鉑(Platinum)。接著,形成金屬配 線44 ’再沉積一氧化層46於金屬配線乜之上做為保護層。 第一加熱器20與共同電極24之間的内連接層48係配置於氧 化層46之下。最後參考圖^及圖12,銳孔18於此形成。若 光刻術可容3 μ ra之線寬,則銳孔丨8約可小至2 " m,且銳孔 ^之間的間距(P i七Ch )約可小至1 5 # m。由圖中亦可看出流 體腔14之凸角47經過蝕刻後,已呈現出清晰的形狀。 ,因此,由上述可知本發明係提供一新穎之微喷射器, 此微喷射器利用一氣泡來限制流體流入一流體腔,並藉此 防止在流體從銳孔射出期間該流體由流體腔流失至歧^。 3 ί ί Ϊ明利用一第二氣泡結合一第一氣泡來突然切斷 ,兒孔射出之液柱,藉以消除衛星液珠。 在較佳實施例之詳細說明中所提出之具體的實施例 二I易於說明本發明之技術内容,而並非將本發明狹義 於該實施例’在不超出本發明之精神及以下申請* 範圍之情況,可作種種變化實施。 腎專Referring to FIG. 9 and FIG. 10, the first heater 20 and the second heater 22 'are deposited for pattern transfer. For the first heater 20 and the second heater 22, 5 'is preferably platinum. Next, a metal wiring 44 'is formed, and an oxide layer 46 is deposited on the metal wiring 乜 as a protective layer. An interconnect layer 48 between the first heater 20 and the common electrode 24 is disposed under the oxidation layer 46. Finally, referring to FIG. 12 and FIG. 12, a sharp hole 18 is formed here. If the lithography can accommodate a line width of 3 μra, the sharp holes 丨 8 can be as small as 2 " m, and the distance between the sharp holes ^ (P i7Ch) can be as small as 1 5 # m. It can also be seen from the figure that the lobes 47 of the fluid cavity 14 have shown a clear shape after being etched. Therefore, from the above, it can be known that the present invention provides a novel micro-injector. The micro-injector uses a bubble to restrict the fluid from flowing into a fluid cavity, and thereby prevents the fluid from being lost to the fluid cavity during the ejection of the fluid from the sharp hole. ^. 3 ί ί Ming uses a second bubble in combination with a first bubble to suddenly cut off the liquid column ejected from the hole to eliminate satellite liquid beads. The specific second embodiment I proposed in the detailed description of the preferred embodiment is easy to explain the technical content of the present invention, but not narrow the invention to the embodiment 'without exceeding the spirit of the present invention and the scope of the following applications * The situation can be implemented in various changes. Kidney

第U頁Page U

Claims (1)

ra 9 9 g--«·〇--— 六、t請專利範圍 1. 一利用一氣泡做為一微喷射器之擬真閥以射出流體之裝 置,包含: (a) —流體腔,其内含有流體; (b) —與該流體腔相通之銳孔,該銳孔係配置於該流 體腔之上; (c) 一用以當該流體腔充滿流體時,在該流體腔中產 生—弟一氣泡以做為一擬真閥之第一氣泡產生構件,該第 一氣泡產生構件係配置於極近該銳孔處且位於該流體腔之 外部;以及 (d) —用以當該流體腔充滿流體時,在該流體腔中繼 該第一氣泡產生後’產生一第二氣泡以將流體由該流體腔 射出之第二氣泡產生構件,該第二氣泡產生構件係配置於 極近該銳孔處且位於該流體腔之外部。 2. 如申請專利範圍第1項之裝置,其中該第一氣泡產生構 件包含一第一加熱器。 3. 如令請專利範圍第2項之裝置,其中該第二氣泡產生構 件包含一第二加熱器D 4. 如申請專利範圍第3項之裝置,其中該第一加熱器及該 第二加熱器之配置位置係使得該第一氣泡及該第二氣泡膨 脹時相互接近’藉以突然終止流體由該流體腔射出。 ^ 5 ·如申請專利範圍第3項之裝置,其中該第一加熱器及該 第二加熱器係適合以一共同信號加以驅動。 6.如申請專利範圍第3項之裝置,其中該第一加熱器及該 第二加熱器係以串聯連接。ra 9 9 g-«· 〇 --- VI. T patent scope 1. A device that uses a bubble as a simulative valve of a micro-injector to eject fluid, including: (a) a fluid cavity, which Contains fluid; (b)-an acute hole communicating with the fluid cavity, the sharp hole is arranged above the fluid cavity; (c) a fluid cavity is created when the fluid cavity is filled with fluid- The first bubble is used as the first bubble generating member of an imaginary valve, and the first bubble generating member is arranged close to the sharp hole and located outside the fluid cavity; and (d)-used as the fluid When the cavity is filled with fluid, after the fluid cavity relays the first bubble generation, a second bubble is generated to generate a second bubble generation member for ejecting fluid from the fluid cavity, and the second bubble generation member is disposed near the The sharp hole is located outside the fluid cavity. 2. The device as claimed in claim 1, wherein the first bubble generating member includes a first heater. 3. If requested, the device in the second scope of the patent, wherein the second bubble generating member includes a second heater D 4. If the device in the third scope of the patent application, the first heater and the second heater The position of the device is such that the first bubble and the second bubble are close to each other when they expand, thereby abruptly stopping fluid from being ejected from the fluid cavity. ^ 5 The device of claim 3, wherein the first heater and the second heater are adapted to be driven by a common signal. 6. The device as claimed in claim 3, wherein the first heater and the second heater are connected in series. 45 889 β 六'申請專利範圍 7.如申請專利範圍第i...項之裝置,其中該第一氣泡之產生 係做為一擬真閥,用以限制流體由該流體腔流出。 8 · 一利用一氣泡做為一微喷射器之擬真閥以射出流體之 裝置,包含: (a ) —流體腔; (b) —與該流體腔相通之歧管’用以供應流體至該流 體腔; (c ) 一與該流體腔相通之銳孔; (d ) —用以當該流體腔充滿流體時,在該流體腔中產 生一第一氣泡以做為一擬真閥之第一氣泡產生構件,該第 一氣泡產生構件係配置於極近該銳孔處且位於該流體腔之 外部;以及 i (e) —用以繼該第一氣泡產生後,產生一第二氣泡之 第二氣泡產生構件,該第二氣泡產生構件係配置於極近該 銳孔處且位於該流體腔之外部,其中該銳孔係配置於該^ 一氣泡產生構件與該第二氣泡產生構件之間,且該第二氣 泡之形成會導致該流體腔中之流體由該銳孔射出=一、 9件請ί利範圍第上項之裝置’其中該第-氣泡產生構 件包含一第一加熱器。 丹 如人申請/利範圍第、9項之裝置’其中該第二氣泡產生構 件包含一第二加熱器。 僻 。笛如申Λ專利範圍第10項之裝置’其中該第—加熱器及 ^第一加熱係適合以一共同信號加以驅動。 1 2.如申請專利範圍第丨〇項之裝置,其中該第—加熱器及45 889 β Six 'scope of patent application 7. For the device in the scope of application for patent item i ..., the generation of the first air bubble is used as an imaginary valve to restrict fluid from flowing out of the fluid cavity. 8 · A device that uses a bubble as a micro-injector to emulate a fluid to eject a fluid, including: (a)-a fluid cavity; (b)-a manifold communicating with the fluid cavity 'for supplying fluid to the Fluid cavity; (c) an acute hole communicating with the fluid cavity; (d)-used to generate a first bubble in the fluid cavity when the fluid cavity is filled with fluid as the first of an illusion valve A bubble generating member, the first bubble generating member is disposed close to the sharp hole and is located outside the fluid cavity; and i (e) —a first step for generating a second bubble after the first bubble is generated Two bubble generating members, the second bubble generating member is disposed near the sharp hole and located outside the fluid cavity, wherein the sharp hole is arranged between the first bubble generating member and the second bubble generating member And the formation of the second bubble will cause the fluid in the fluid cavity to be ejected from the sharp hole = one, nine pieces of the device of the above item, wherein the first bubble generating member includes a first heater. The device according to item 9 of the Danish Application / Profit Range 'wherein the second bubble generating member includes a second heater. Secluded. The device according to item 10 of Di Rushen's patent scope, wherein the first heater and the first heating system are adapted to be driven by a common signal. 1 2. The device according to the scope of the patent application, wherein the-heater and 第17頁 458896 六、申請專利範圍 該第二加熱器係以串聯連接。 13.如申請專利範圍第1-0.項之裝置,其中該第一加熱器及 該第二加熱器係配置於近該銳孔處,使得該第一氣泡及該 第二氣泡可結合,藉以突然終止流體由該銳孔射出。 1 4.如申請專利範圍第8項之裝置,其中該第一氣泡之產生 係做為一擬真閥,用以限制流體由該流體腔流出。 1 5, —種用以將流體由一具有一銳孔之微通道射出之方 法,包含以下步驟: (a) 在極為接近一充滿流體之微通道中的銳孔處產生 一第一氣泡; (b) 在極為接近該微通道中之銳孔處產生一第二氣 泡,藉以對該微通道加壓而將流體由該微通道射出,該第 二氣泡產生步驟係於該第一氣泡產生步驟之後進行,其中 該第一氣泡及該第二氣泡各與該銳孔並列; (c) 增大該微通道中之該第一氣泡以做為一擬真閥, 藉以限制流體流入該微通道;以及 (d) 增大該微通道中之該第二氣泡,藉以使該第一氣 泡與該第二氣泡相互接近,進而突然終止流體由該銳孔射 1 6.如申請專利範圍第1 5項之方法,更包含以下步驟:使 該第一氣泡收縮以加速流體流入該微通道。 1 7.如申請專利範圍第1 5項之方法,其中一共同信號被用 以連續地開始產生該第一氣泡及該第二氣泡。 1 8.如申請專利範圍第項之方法,其中該第一氣泡被增Page 17 458896 6. Scope of patent application The second heater is connected in series. 13. The device according to the scope of claims 1-0. Wherein the first heater and the second heater are arranged near the sharp hole, so that the first bubble and the second bubble can be combined, thereby Sudden termination of fluid ejection from this sharp hole. 1 4. The device according to item 8 of the scope of patent application, wherein the generation of the first air bubble is used as an imaginary valve to restrict fluid from flowing out of the fluid cavity. 15 — A method for ejecting fluid from a microchannel having an acute hole, comprising the following steps: (a) generating a first bubble at a sharp hole very close to a fluid-filled microchannel; ( b) A second bubble is generated near the sharp hole in the microchannel, and the fluid is ejected from the microchannel by pressurizing the microchannel. The second bubble generation step is after the first bubble generation step. Performing, wherein the first bubble and the second bubble are each juxtaposed with the sharp hole; (c) increasing the first bubble in the microchannel as a quasi-valve to restrict fluid from flowing into the microchannel; and (d) Enlarge the second bubble in the microchannel, so that the first bubble and the second bubble are close to each other, and then suddenly stop the fluid from being ejected from the sharp hole. The method further includes the following steps: shrinking the first bubble to accelerate fluid flow into the microchannel. 17. The method according to item 15 of the scope of patent application, wherein a common signal is used to continuously start generating the first bubble and the second bubble. 1 8. The method of claim 1 in which the first bubble is increased 第18頁 45889s 六、申請專利範圍 大之速度快於該第二氣泡被增大之速度。 1 9, 一種用以將流體由一具有一流體腔、一與該流體腔相 通以供應流體至該流體腔之歧管及一與該流體腔相通之銳 孔的微喷射器射出之方法,包含以下步驟: (a )當該流體腔充滿流體時,在極為接近該流體腔中 之該銳孔處產生一第一氣泡以做為擬真閥; (b) 在極為接近該銳孔處產生一第二氣泡以將流體由 該銳孔射出,其中該第二氣泡產生步驟係於該第一氣泡產 生步驟之後進行;以及 (c) 結合該第一氣泡及該第二氣泡以突然終止流體由 該銳孔射出。 2 0.如申請專利範圍第1 9項之方法,更包含以下步驟:使 該第一氣泡收縮以加速流體流入該流體腔。 21.如申請專利範圍第1 9項之方法,其中一共同信號被用 以連續地開始產生該第一氣泡及該第二氣泡。 2 2.如申請專利範圍第1 9項之方法,其中該第一氣泡被增 大之速度快於該第二氣泡被增大之速度。Page 18 45889s 6. The scope of patent application is larger than the speed at which the second bubble is enlarged. 19, A method for ejecting fluid from a micro-injector having a fluid cavity, a manifold communicating with the fluid cavity to supply fluid to the fluid cavity, and a sharp hole communicating with the fluid cavity, including the following Steps: (a) When the fluid cavity is filled with fluid, a first bubble is generated at the sharp hole in the fluid cavity as a quasi-valve; (b) A first bubble is generated in close proximity to the sharp hole. Two bubbles to eject fluid from the sharp hole, wherein the second bubble generating step is performed after the first bubble generating step; and (c) combining the first bubble and the second bubble to suddenly stop the fluid from the sharp hole Hole shot. 20. The method according to item 19 of the scope of patent application, further comprising the following steps: shrinking the first bubble to accelerate the flow of fluid into the fluid cavity. 21. The method of claim 19, wherein a common signal is used to continuously start generating the first bubble and the second bubble. 2 2. The method according to item 19 of the scope of patent application, wherein the speed at which the first bubble is enlarged is faster than the speed at which the second bubble is enlarged. 第19頁Page 19
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