5 8852 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 發明領域： 本發明係彳關於基板之化學機械研I，特Μ是一種控 制化學機械研磨塾之方法及設備。 發明赀景= 積體電路一般是藉由沉積導體層、半導體層或绝緣層 之順序形成於例如矽晶圓之基板上，並在各層沉積之後進 行蝕刻以形成電路特徵，當一連串之膜層依序沉積及蝕刻 之後，基板之最外層及最上層表面（例如基板之曝露表面） 會變得不平坦’而此不平坦的表面會在積體電路製程之微 影步騾中產生問題。因此有必要定期使基板表面平坦，並 且’當回磨填充層時（例如以金屬填充介電層之溝渠）更有 其需要。 化學機械研磨法是一種可接受的平坦化方法。這種平 坦化方法典型需要將基板固定於一攜帶頭或是研麼頭，且 基板之曝露表面緊貼於旋轉之研磨塾。該研磨塾可為"標 準型"或是固定研磨墊。標準的研磨墊具有耐用的粗縫化 或軟性表面；固定研磨墊具有由所固定介質所固定之研磨 顆粒。研磨頭於基板上提供一可控制之負載（例如壓力）使 其緊貼研磨墊。某些揭帶頭包含一彈性膜以提供基板固定 表面’以及固定環以握持基板於固定表面下。對彈性膜下 之反應室抽真空以控制基板上之負載。將漿研漿，包含至 少一種化學活性劑’以及研磨顆粒（若使用標準研磨塾）施 加於研磨塾之表面。 第2頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — 1 —-------------1-------1----線 lor - N 一 (锖先閲讀背面之注意事項再填寫本頁) 885 25 8852 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention () Field of the invention: The present invention is related to the chemical mechanical research of substrates, and is a method and equipment for controlling chemical mechanical polishing. The invention of the invention = integrated circuits are generally formed on a substrate such as a silicon wafer by depositing a conductor layer, a semiconductor layer or an insulating layer in order, and then etching is performed after the deposition of each layer to form a circuit feature. When a series of film layers After sequential deposition and etching, the outermost layer and the uppermost surface of the substrate (such as the exposed surface of the substrate) will become uneven ', and this uneven surface will cause problems in the lithography step of the integrated circuit manufacturing process. It is therefore necessary to regularly flatten the surface of the substrate, and it is even more needed when refilling the filling layer (for example, filling the trench of a dielectric layer with a metal). Chemical mechanical polishing is an acceptable method of planarization. This flattening method typically requires that the substrate is fixed to a carrying head or a research head, and the exposed surface of the substrate is closely attached to the rotating grinding pad. The polishing pad may be a "standard type" or a fixed polishing pad. Standard abrasive pads have durable roughened or soft surfaces; fixed abrasive pads have abrasive particles held by a fixed medium. The polishing head provides a controlled load (e.g., pressure) on the substrate to hold it against the polishing pad. Some stripping heads include an elastic film to provide a substrate fixing surface 'and a fixing ring to hold the substrate under the fixing surface. Evacuate the reaction chamber under the elastic membrane to control the load on the substrate. The slurry is ground and contains at least one chemically active agent 'and abrasive particles (if a standard abrasive is used) are applied to the surface of the abrasive. Page 2 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — 1 —------------- 1 ------- 1 --- -Line lor-N 1 (read the precautions on the back before filling this page) 885 2
五、發明說明（ 化學機械研磨製程的效果 果了以其研磨速率、所得結果 (不含小比例粗糙面）及基板表 ®双衣面（千坦性（不含大比例表 面型態）量測之》其中，研磨技i 外磨逮率、所得結果及平坦性取 決於研磨墊與研漿之组合、命过在必 暴板與研磨墊間之相對速度以 及基板緊貼於研磨墊之壓力。 化學機械研磨製程所會遭遇的一種問題是研磨速率 的不穩疋在某些研磨過程中，研磨速率會隨著時間而偏 移，其結果會導致終點偵測以及固定每一基板研磨量的困 難。化學機械研磨製程會遭遇的其他問題還包含溫度偏移 及系統之震動《 發明目的及概述： 本發明之一觀點係關於一化學機械研磨設備’ 具有一研磨面、一以一可控制之壓力使基板下壓緊 研磨表面之攜帶頭、一以產生該研磨面與該攜帶頭 對轉動於一速度之馬達’及一控制器。控制器係用 該壓力及該速度的至少其一，以因應於一相關於該 該研磨面間之摩擦力的訊號，以維持一丨互定力矩、 或是摩擦係數。 本發明之該實施例.可包含一或多個下列特徵： 器係用以改變壓力以維持一慑定力矩，改變壓力以 恆定摩擦力，改變壓力以維持一恆定摩擦係數，改 以維持一恆定力矩，改變速度以維持一恆定摩擦力 速度以維持一恆定摩擦係數，改變速度及塵力以維 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） (請先閱讀背面之迮意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 該設備 貼於該 間之相 以改變 基板與 摩擦力 該控制 維持一 變速度 ，改變 持一怪 · ! — I 丨 I I 訂 *!! *5^ ' A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 定力矩’改變速度及壓力 姙 刀以維持—恆定摩擦力，改變速廣 及恩力以維持一恆定摩檫係數。 本發明之其他觀點係關认 係關於一種化學機械研磨設備，具 有一研磨表面、以一可挺 制义壓力使基板下壓緊貼於該研 磨表面之一攜帶頭、以及—厭 、. 壓力控制器，用以控制施加於 該捣帶頭之壓.力以因應於兮某L^ 、名眾基板與該研磨面間之一摩檫 力，以維持一大致怪定之研磨速度。 本發明之該實施例可自本 + ^ ^ ,,ι a含一或多個下列特徵：該研磨 面包可含-固定研磨物質。一馬達，產生上述研磨面與上 述基板間之相對轉動。該壓力控制器至少包含一數位電 腦，用以接收一代表馬達電流之馬達訊號以產生上述研磨 面與上述基板間之相對轉動，並且藉由減去該馬達訊號之 一臨限值來得到一攜帶頭壓力控制訊號。該數位電腦係用 以放大或縮小上述臨限值與上述馬達訊號間之差動訊號 以決定上述攜帶頭壓力控制訊號。該數位電腦係用以使上 述攜帶頭壓力控制訊號平滑化。該馬達訊號可能是一攜帶 頭控制訊號、一平台控制訊號以及一馬遠電流訊號。該研 磨面係置於一可轉動平台上並以該馬達轉動之。該馬達轉 動上述攜帶頭。 本發明之其他態樣係關於一種化學機械研磨方法’在 此方法中，以一可控制壓力使一基板下壓緊貼於一研磨 面，於一速度下產生上述研磨面與上述基板間之一相對轉 動，且控制壓力及速度之至少其一，以因應於一相關於該 基板與該研磨面間之摩擦力的訊號，以維持一伍定力矩、 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公« ) ---------- --------訂 - ------•線、 • . - (請先閱靖背面之注意事項再填窵本頁) 458852 Α7 Β7 五、發明說明（） 摩擦力或是摩擦係數。 本發明潛在之優點包含：可維持基板與研磨塾間之均 勻的摩擦力，藉此降低研磨速率的變動β儘管基板上圖案 密度、研磨墊之物理性質有所變化，研磨墊衰退及研磨墊 -基板界面之溫度改變，仍可維持大致上恆定的摩擦力。 並且’藉由改善摩擦力的均勻性可以降低研磨機械的震動 及溫度偏移。再者，可以降低基板的碟型效應及腐蝕β 本發明之其他特徵、目的及優點將可由下列說明、圖 示及專利申請範圍凸顯。 圖式簡箪說明： 第ί圖係本發明之一研磨設備的剖面圖。 第2圖係一依據力矩控制系統控制第1圖之研磨設備之攜 帶頭執行方法的流程圖。 第3圖係一依據摩擦力控制系統執行方法的流程圖。 第4圖係一依據摩擦係數控制系統執行方法的流程圖。 第5圖係一軟體控制系統執行方法的流程圖。 不同圖示中的相同之圖號係指相同元件。 {請先閱讀背面之生意事項再填寫本頁) ，裝 ----訂---------線、 經濟部智慧財產局員工消費合作社印製 圖號對照說明： 10 基板 20 化學機械研磨設備 22 轉棱 24 研磨譽 26 平台驅動馬達 30 研磨液 34 攜帶頭 第5頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公爱） 458852 3 8 壓力源 42 平台驅動控制器 A7 B7 五、發明說明（） 36 攜帶頭驅動馬達 40 壓力控制器 44 攜帶頭驅動控制器 發明詳細說明： 吾人想要維持化學機械製程中恆定的研磨速率以確、 保製程的均勻性。本發明藉由調整攜帶頭施加至基板的壓 力來改善研磨速率（例如固定研磨墊）的穩定性，以獲得基 板與研磨塾間恆定的摩擦力。儘管基板上圖案密度、研磨 整之物理性質有所變化，研磨墊衰退及研磨墊-基板界面 之溫度改變’仍可維持大致上恆定的摩擦力。恆定的研磨 速率有助於降低研磨金屬時的碟型效應及腐蝕，並且，藉 由改善摩擦力的穩定度可以降低研磨機械的震動及溫度 偏移。 簡言之，研磨設備之控制器（以硬體或軟體實施之）可 接收基板與研磨墊間之摩擦力所感應的訊號。例如這些訊 號包含力矩量測值、摩擦力量測值以及摩擦係數量測值。 這些量測可於平台或攜帶頭上進行。該控制器包含一回授 機構，其以訊號控制攜帶頭壓力並維持相對恆定之摩擦 力。例如’可將施加至一平台或攜帶頭驅動馬達之控制訊 號與一臨限訊號做一比較，再將其差值放大或是縮小以調 整攜帶頭壓力。 第1圖係一包含轉檯22之化學機械研磨設備20。一 研磨整24(例如一含以固定介質固定之研磨顆粒的固定研 第6頁 本紙張尺度適用尹國國家標準（CNS)A4規格<210 X 297公釐） (請先閱讀背面之注意事項再填窝本頁> /裝-------訂---------線、 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 磨墊），貼附於轉檯22之上表面.該轉檯係以一平台驅動 馬達26驅動之，例如以每分鐘三至兩百轉，但也可使用 更低或更高之轉速。施加一研磨液3〇(若使用固定研磨墊 則不需研磨顆粒）至該研磨塾24之表面，.例如藉由延漿供 給/沖洗臂3 2。 一攜帶頭34握持一基板1〇並施壓使其以可控制之負 載方式緊貼於一研磨墊24。該攜帶頭34包含一彈性膜層 或是一固定置架以提供該基板固定面，以及—氣密反應室 以控制基板上之向下力量；或者是，整個攜帶頭可以—氣 動裝置垂直移動以控制基板上之壓力。攜帶頭34在一攜 帶頭驅動馬達36的帶動下繞其自身的轴旋轉，並且於研 磨墊上水平擺動。一可變壓力源38以非固定方式連接於 該攜帶頭3 4 (例如以一未顯示之旋轉接合）以維持攜帶頭 34於想要之壓力。該揭帶頭之實施例已描述於1999年12 月23曰申請之美國專利申請案第〇9/470,820號中，本案 在此將其引用為參考文獻。 該化學機械研磨設備20亦可包含一未顯示之研磨塾 調節器或是清潔器以维持該研磨墊之研磨狀況。一包含多 平台及多攜帶頭之化學機械研磨設備的描述可參見美國 專利第5,738,574號，本案在此將其整篇引用為參考技 術β 平台驅動馬達26可以一平台驅動控制器42控制之， 該平台驅動控制器4 2使用一回授控制迴路以偵測力矩及/ 或平台之轉速（例如以一光解碼器），並產生一代表平台驅 第7育 本紙張尺度適用t國國家標準（CNS)A4規格（210 X 297公釐） {請先閲讀背面之注意事項再填寫本頁) \裝I丨丨訂·！--- -線^ ；S B 2 A7V. Description of the Invention (The effect of the chemical mechanical polishing process is measured by its grinding rate, the results obtained (excluding small proportions of rough surfaces), and the substrate surface® double-coat surface (thousand nature (excluding large proportions of surface types). Among them, the polishing rate, the obtained results, and the flatness of the polishing technique depend on the combination of the polishing pad and the slurry, the relative speed of the life between the plate and the polishing pad, and the pressure of the substrate close to the polishing pad. A problem encountered in the chemical mechanical polishing process is the instability of the polishing rate. In some polishing processes, the polishing rate will shift with time. As a result, it will lead to endpoint detection and difficulty in fixing the polishing amount of each substrate. Other problems encountered in the chemical mechanical polishing process include temperature excursions and system vibration. "Objective and Summary of the Invention: One aspect of the present invention relates to a chemical mechanical polishing equipment, which has a polishing surface and a controllable pressure. A carrying head for pressing the grinding surface under the substrate, a motor to generate the grinding surface and the carrying head to rotate at a speed, and a controller. The controller is used At least one of the pressure and the speed is in response to a signal related to the frictional force between the abrasive surfaces to maintain a mutual fixed moment or a friction coefficient. This embodiment of the present invention may include one or Many of the following features: The device is used to change the pressure to maintain a deterrent moment, change the pressure to maintain a constant friction force, change the pressure to maintain a constant friction coefficient, change to maintain a constant torque, and change the speed to maintain a constant friction velocity In order to maintain a constant friction coefficient, change the speed and dust force, apply the Chinese national standard (CNS > A4 size (210 X 297 mm)) to the paper size (please read the intention on the back before filling this page) The property bureau employee consumer cooperative prints the phase of the device attached to the room to change the substrate and friction. The control maintains a variable speed and changes. — — I 丨 II Order * !! * 5 ^ 'A7 B7 Ministry of Economic Affairs Printed by the Intellectual Property Bureau's Consumer Cooperatives V. Invention Description (Constant torque 'changes speed and pressure to maintain the knife-constant friction, change speed and grace to maintain a The friction coefficient is determined. Other aspects of the present invention are related to a chemical mechanical polishing device, which has a polishing surface, a carrier head pressed against the polishing surface with a flat pressure, and— The pressure controller is used to control the pressure applied to the tamping head in response to a frictional force between a certain L ^, Mingzhong substrate and the grinding surface, so as to maintain a roughly strange grinding speed. This embodiment of the present invention may include one or more of the following features from the present invention: The grinding bread may contain-a fixed grinding substance. A motor generates relative rotation between the grinding surface and the substrate. The The pressure controller includes at least a digital computer for receiving a motor signal representing a motor current to generate relative rotation between the above-mentioned polished surface and the substrate, and obtaining a carrying head by subtracting a threshold value of the motor signal Pressure control signal. The digital computer is used to enlarge or reduce the differential signal between the threshold value and the motor signal to determine the head pressure control signal. The digital computer is used to smooth the above-mentioned portable head pressure control signal. The motor signal may be a head control signal, a platform control signal, and a horse far current signal. The grinding surface is placed on a rotatable platform and rotated by the motor. The motor rotates the carrying head. Another aspect of the present invention relates to a chemical mechanical polishing method. In this method, a substrate is pressed against a polishing surface under a controllable pressure, and one of the polishing surface and the substrate is generated at a speed. Relative rotation and control of at least one of pressure and speed in order to respond to a signal related to the friction between the substrate and the abrasive surface to maintain a uniform torque. This paper size applies Chinese National Standard (CNS) A4 Specifications (210 X 297 male «) ---------- -------- Order------- • line, •.-(Please read the precautions on the back of Jing before (Fill in this page) 458852 Α7 Β7 V. Description of the invention () Friction or coefficient of friction. The potential advantages of the present invention include: it can maintain the uniform friction between the substrate and the polishing pad, thereby reducing the variation of the polishing rate β. Although the pattern density on the substrate and the physical properties of the polishing pad have changed, the polishing pad decays and the polishing pad- The temperature at the interface of the substrate changes, and the friction force can be maintained substantially constant. Furthermore, by improving the uniformity of the friction force, vibration and temperature deviation of the grinding machine can be reduced. Furthermore, the dishing effect and corrosion of the substrate can be reduced. Other features, objects, and advantages of the present invention will be highlighted by the following description, illustrations, and scope of patent applications. Brief description of the drawings: The first figure is a sectional view of a grinding apparatus according to the present invention. Fig. 2 is a flow chart of a method for controlling the lead of the grinding equipment of Fig. 1 according to the torque control system. FIG. 3 is a flowchart of a method for executing a friction control system. FIG. 4 is a flowchart of a method for performing a control system based on a friction coefficient. FIG. 5 is a flowchart of a software control system execution method. The same drawing numbers in different drawings refer to the same elements. {Please read the business matters on the back before filling in this page). ---------------- Line, printed by the consumer property cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Mechanical grinding equipment 22 Turning edge 24 Grinding reputation 26 Platform drive motor 30 Grinding fluid 34 Carrying head page 5 This paper size applies to China National Standard (CNS) A4 (210 χ 297 public love) 458852 3 8 Pressure source 42 Platform drive control A7 B7 V. Description of the invention (36) Carrying head drive motor 40 Pressure controller 44 Carrying head drive controller Detailed description of the invention: I want to maintain a constant grinding rate in the chemical mechanical process to ensure the uniformity of the process. The present invention improves the stability of the polishing rate (such as a fixed polishing pad) by adjusting the pressure applied to the substrate by the carrying head to obtain a constant friction between the substrate and the polishing pad. Although the physical density of the pattern on the substrate and the polishing physical properties are changed, the polishing pad decays and the temperature of the polishing pad-substrate interface changes' can still maintain a substantially constant friction. Constant grinding rate helps reduce dishing effect and corrosion when grinding metal, and by improving the stability of friction, vibration and temperature shift of the grinding machine can be reduced. In short, the controller (implemented in hardware or software) of the polishing equipment can receive signals induced by the friction between the substrate and the polishing pad. These signals include, for example, torque measurements, friction force measurements, and friction coefficient measurements. These measurements can be made on the platform or on a carrying head. The controller includes a feedback mechanism that controls the pressure of the carrying head with a signal and maintains a relatively constant friction. For example, a comparison can be made between a control signal applied to a platform or a head drive motor and a threshold signal, and the difference can be enlarged or reduced to adjust the pressure of the head. FIG. 1 is a chemical mechanical polishing apparatus 20 including a turntable 22. A grinding complete 24 (for example, a fixed ground containing abrasive particles fixed with a fixed medium, page 6) The paper size applies to the national standard (CNS) A4 specification < 210 X 297 mm) (Please read the precautions on the back first Refill the nest page > / install ------- Order --------- line, printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by employees' cooperatives of the Ministry of Economics, Intellectual Property Bureau 5. Description of the invention () Grinding pad) attached to the upper surface of the turntable 22. The turntable is driven by a platform drive motor 26, for example, three to two hundred revolutions per minute, but lower or higher can also be used Of speed. Apply an abrasive liquid 30 (no abrasive particles are required if a fixed abrasive pad is used) to the surface of the abrasive pad 24, e.g., by supplying / rinsing the arm 32 with a slurry. A carrying head 34 holds a substrate 10 and presses it against a polishing pad 24 in a controllable load manner. The carrying head 34 includes an elastic film layer or a fixed rack to provide the substrate fixing surface, and an airtight reaction chamber to control the downward force on the substrate; or, the entire carrying head can be vertically moved by a pneumatic device to Control the pressure on the substrate. The carrying head 34 is rotated around its own axis by a carrying head driving motor 36, and swings horizontally on the grinding pad. A variable pressure source 38 is connected to the carrying head 34 in a non-stationary manner (e.g., by a rotational joint not shown) to maintain the carrying head 34 at the desired pressure. This uncovered embodiment has been described in U.S. Patent Application No. 09 / 470,820, filed December 23, 1999, which is hereby incorporated by reference. The chemical mechanical polishing device 20 may also include an unillustrated polishing 调节 adjuster or cleaner to maintain the polishing condition of the polishing pad. A description of a chemical mechanical polishing device including a multi-platform and multi-carrying head can be found in US Patent No. 5,738,574, which is hereby incorporated by reference in its entirety. The platform driving motor 26 can be controlled by a platform driving controller 42, The platform drive controller 4 2 uses a feedback control loop to detect the torque and / or the speed of the platform (for example, using an optical decoder), and generates a representative drive of the platform. The paper dimensions are applicable to national standards (CNS). ) A4 size (210 X 297 mm) {Please read the notes on the back before filling this page) \ Install I 丨 丨 Order ·! ----line ^; S B 2 A7
五、發明說明（） 動馬達所意之功率或電流的訊號’以維持該平台於一禅要 之轉速。同樣地，攜帶頭34可以一攜帶頭驅動控制器42 控制之，該攜帶頭驅動控制器42使用—回授控制迴路以 偵測力矩及/或攜帶頭之轉速（例如以一光解碼器），並產生 —代表攜帶頭驅動馬達所需之功率或電流的訊號，以維持 該攜帶頭於一想要之轉速。 通常’研磨速率原則上是視研磨墊施加至基板之摩擦 力而定，該摩擦力正比於研磨墊與基板間之摩擦係數（有 時係指表面摩擦力）、基板緊貼於研磨墊之負載，以及研 磨墊與基板間之相對速度。並且平台上之力矩正比於摩擦 力及基板之徑向部份。 化學機械研磨所遭遇的一個問題是難以得到製程穩 定性’特別是研磨速率的穩定性。在某些研磨過程中，若 研磨壓力維持固定研磨速率會隨著時間而改變。這些變化 發生於基板間甚至是研磨單.-基板時，例如某些研磨塾具 有11磨合”期’在此期間研磨墊之表面摩擦力會改變。特別 是當研磨時研磨墊之摩擦係數（及研磨速率）有增加之傾 向’直至其在"磨合"期末達到一具有恆定研磨速率之，，靜態 "。若該基板為平坦及平滑，則研磨墊之表面摩擦力會改 變地非常慢。例如，對一研磨銅之固定研磨墊而言，達到 一穩態研磨速率及對基板的恆壓約需1 0 0分鐘。其他化學 機械研磨會遭遇的問題是製程中的變動，例如溫度或是研 磨墊之研漿供给’因而導致研磨墊與基板間之摩擦力以及 研磨速率的改變。對於固定摩擦研磨墊而言，製程穩定性 第8貰 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) ，裝 訂---------終 經濟部智慧財產局員工消費合作社印製 45 885 2 Α7 Β7 經濟部智慧財產局員工消费合作社印製 五、發明說明（） 特別難以控制。 為補償這些效應，控制攜帶頭34施加於基板1〇之壓 力以維持研磨整與基板間大致,|·亙定之摩擦力，因而可得一 大致恆定之研磨速率。與傳統化學機械研磨製程（其基板 壓力及速度大致固定）相反的是，在本發明之化學機械研 磨設備20中調整基板壓力及速度以維持基板與研磨墊間 大致恆定之摩擦力、力矩或是摩擦係數。該壓力源38轉 合於一壓力控制器40，例如一數位電腦程式化製程控制迴 路’其選擇及調整壓力以產生一恆定之研磨速率·在某些 實施例中，壓力控制器4 0接收一伴隨驅動馬達之一（例如 平台驅動馬達26)的控制訊號。如之前所述，此控制訊號 代表平台驅動馬達以預設轉速轉動平所需之功率或電流 的訊號。因為維持驅動馬達於恆定轉速所需之功率增加， 若基板施加一增加之摩擦拉力於於平台上，則控制訊號將 正比於平台上之力矩》 請參閱第2圖，壓力控制器40進行一以力矩為依據 之控制迴路以決定適當之攜帶頭壓力。該壓力控制器4〇 儲存代表當基板無施加壓力時之力矩的第一臨限值（或是Μ 無載力矩"）。因此，低於此第一臨限值的力矩（導因於平台 之軸承或類似物的實際拉力）。此第一臨限值可以實驗方 式決定之。此壓力控制器40亦儲存代表研磨時使用者想 要之力矩的第二臨限值。此第二臨限值可由使用者設定 (例如以一軟體使用者介面）》 第2圖顯示控制迴路之一單向步驟。首先，壓力控制 第9贯 (請先閲讀背面之注意事項再填寫本頁) 袭 ---訂----- 線、 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 45 885 2 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 接收伴隨力矩之信號（例如步驟5 0之馬遠控制訊號）。儲存 之第一臨隈值減去控制信號（步驟5 2)以產生一第二信 號，該第二信號正比於研磨墊上基板之壓力所造成的力 矩。然後儲存之第二臨限值減去第二信號（步驟54)以產生 一差動訊號。放大或縮小所得之差動訊號（步驟56)，視攜 帶頭之回授強度及攜帶頭壓力需調整多少而定。然後該控 制器計算出一攜帶頭壓力以提供所需之力矩（步驟58)。例 如，放大或縮小之差動訊號可減去（假設此控制訊號高於 此臨限訊號）或加上（假設此控制訊號低於此臨限訊號）一 預設壓力以產生一攜帶頭壓力訊號。最後，可將此攜帶頭 壓力訊號平顺化以避免震盪（步驟59)。 若研磨墊之摩擦係數增加，則維持平台於一恆定轉速 所需之馬達電流增會增加，並且此控制訊號將會高於第二 臨限值。結果是攜帶頭壓力減至低於預設壓力因而基板與 研磨墊間之摩擦力及研磨速率可維持大致恆定。同樣地， 若研磨墊之摩擦係數減少’則維持平台於一恆定轉速所需 之馬達電流增會減少，並且此控制訊號將會低於第二臨限 值。結果是攜帶頭壓力會增至高於預設壓力因而基杈與研 磨塾間之摩擦力及研磨速率可維持大致恆定。 請參聞第3圖’在其他實施例中，壓力控制器進 行一以摩擦力為依據之控制迴路以夹定適當之攜帶頭壓 力。在此實施例中’控制器儲存代表使用者想要之摩擦力 的第二臨限值。首先’壓力控制接收該力矩訊號（步驟6〇) 並減去"無載••力矩（步驟62)以產生一代表研磨墊-基板交 第10頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱請背面之注意事項再填窝本頁) 48^ ·-------訂--------- 458852 經濟部智慧財產局員工消費合作社印t Α7 Β7 五、發明說明（） 互作用所產生之力矩的第一訊號《此第二訊號被基板之徑 向部份所除之以產生一正比於基板與研磨塾間之摩擦力 的訊號（步驟64)。第二臨限值減去所得之摩擦訊號（步驟 65) 以產生一差動訊號。放大或縮小所得之差動訊號（步驟 66) ’視攜帶頭壓力需調整多少而定。然後調整攜帶頭壓 力以提供所需之摩擦力（步驟68)。例如放大或縮小之差動 訊號可減去（假設此控制訊號高於此臨限訊號）或加上（假 設此控制訊號低於此臨限訊號）一預設壓力以雇生—摘帶 頭壓力訊號。最後’可將此攜帶頭壓力訊號平順化以避免 震盪（步驟69)。 請參閱第4圖’在其他-實施例中，壓力控制器40進 行一以摩擦係數為依據之控制迴路以決定適當之擴帶頭 壓力。在此實施例中，控制器儲存代表使用者想要之摩擦 係數的第二臨限值β首先，此控制器接收此力矩訊號（步 驟70)並減去”無載"力矩（步驟72)以產生一第二訊號。此 第二訊號被平台上基板之徑向部份所除之以產生一正比 於基板與研磨墊間之摩擦力的第三訊號（步驟74)。並且此 第三訊號被基板與研磨整間之相對速度除之，以產生一正 比於摩擦係數之第四訊號（步騾75) »此第二臨限值減去此 第四摩擦係數訊號（步騾76)以產生一差動訊號。放大或縮 小所得之差動訊號（步驟77)，視攜帶頭壓力需調整多少而 定。然後調整攜帶頭壓力以提供所需之摩擦力（步驟78)。 例如，放大或縮小之差動訊號可減去（假設此控制訊號高 於此臨限訊號）或加上（假設此控制訊號低於此臨限訊據） 第11百 本紙張尺度適用中國國家標準（CNS)A4規格<210 297公釐） (锖先閲續背面之注意事項再填窝本瓦) ----訂---------線-ο··V. Description of the invention () The signal of power or current intended by the moving motor 'to maintain the speed of the platform at a critical speed. Similarly, the carrying head 34 can be controlled by a carrying head drive controller 42 which uses a feedback loop to detect torque and / or the rotational speed of the carrying head (for example, using an optical decoder), And generate-a signal representing the power or current required to drive the motor of the portable head to maintain the portable head at a desired speed. Generally, the polishing rate is determined in principle by the frictional force applied to the substrate by the polishing pad, which is proportional to the coefficient of friction between the polishing pad and the substrate (sometimes referred to as surface friction), and the load of the substrate close to the polishing pad. , And the relative speed between the polishing pad and the substrate. And the moment on the platform is proportional to the friction and the radial portion of the substrate. One problem encountered in chemical mechanical polishing is that it is difficult to obtain process stability ', especially the polishing rate. In some grinding processes, the grinding rate will change over time if the grinding pressure is maintained constant. These changes occur between substrates and even polishing sheets.-For substrates, for example, some polishing pads have 11 running-in "periods" during which the surface friction of the polishing pad will change. Especially when polishing, the friction coefficient of the polishing pad (and The polishing rate) tends to increase until it reaches a constant polishing rate at the end of the "run-in" period, static. If the substrate is flat and smooth, the surface friction of the polishing pad will change very slowly. For example, for a fixed polishing pad that polishes copper, it takes about 100 minutes to reach a steady-state polishing rate and constant pressure on the substrate. Other problems encountered with chemical mechanical polishing are process variations, such as temperature or It is the slurry supply of the polishing pad, which results in changes in the friction between the polishing pad and the substrate and the polishing rate. For fixed friction polishing pads, the process stability is 8th. This paper standard applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling out this page), binding ------------ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 45 885 2 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description () is particularly difficult to control. In order to compensate for these effects, the pressure exerted by the carrying head 34 on the substrate 10 is maintained to maintain a rough distance between the substrate and the substrate. | · Fixed friction, so a substantially constant polishing rate can be obtained. In contrast to the traditional chemical mechanical polishing process (its substrate pressure and speed are approximately fixed), in the chemical mechanical polishing equipment 20 of the present invention, the substrate pressure and The speed is to maintain a substantially constant friction force, torque or friction coefficient between the substrate and the polishing pad. The pressure source 38 is turned into a pressure controller 40, such as a digital computer-programmed process control circuit, which selects and adjusts the pressure to generate A constant grinding rate. In some embodiments, the pressure controller 40 receives a control signal accompanying one of the drive motors (eg, the platform drive motor 26). As previously described, this control signal represents the platform drive motor to Set the signal of the power or current required for the rotation speed to level, because the power required to maintain the drive motor at a constant speed In addition, if the substrate applies an increased frictional pulling force to the platform, the control signal will be proportional to the torque on the platform. Please refer to Figure 2. The pressure controller 40 performs a torque-based control circuit to determine the appropriate carrying Head pressure. The pressure controller 40 stores a first threshold value (or M no-load torque ") which represents the moment when no pressure is applied to the substrate. Therefore, a torque below this first threshold value (guide Due to the actual pulling force of the bearing of the platform or the like). This first threshold value can be determined experimentally. The pressure controller 40 also stores a second threshold value representing the torque desired by the user during grinding. The two thresholds can be set by the user (for example, using a software user interface). Figure 2 shows a one-way step of the control loop. First of all, pressure control No. 9 (please read the precautions on the back before filling this page) ----- Order ----- The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297) 45) 885 2 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Receive the signal accompanied by the moment (such as the Ma Yuan control signal of step 50). The stored first threshold value is subtracted from the control signal (step 5 2) to generate a second signal, which is proportional to the moment caused by the pressure of the substrate on the polishing pad. The second threshold is then subtracted from the stored second threshold (step 54) to generate a differential signal. The differential signal obtained by enlarging or reducing (step 56) depends on the feedback intensity of the carrying head and how much the carrying head pressure needs to be adjusted. The controller then calculates a head pressure to provide the required torque (step 58). For example, the differential signal for zooming in or out can be subtracted (assuming that the control signal is higher than the threshold signal) or added (assuming that the control signal is lower than the threshold signal) to a preset pressure to generate a head pressure signal . Finally, the head pressure signal can be smoothed to avoid shock (step 59). If the friction coefficient of the polishing pad increases, the motor current required to maintain the platform at a constant speed will increase, and the control signal will be higher than the second threshold. As a result, the pressure of the carrying head is reduced below a preset pressure, so that the friction between the substrate and the polishing pad and the polishing rate can be maintained approximately constant. Similarly, if the friction coefficient of the polishing pad is reduced, the increase of the motor current required to maintain the platform at a constant speed will decrease, and the control signal will be lower than the second threshold value. As a result, the pressure of the carrying head will be increased above the preset pressure so that the friction between the base and the grinding wheel and the grinding rate can be maintained approximately constant. Please refer to Fig. 3 'In other embodiments, the pressure controller performs a friction-based control circuit to clamp the appropriate carrying head pressure. In this embodiment, the 'controller stores a second threshold value representing the frictional force desired by the user. First, the pressure control receives the torque signal (step 60) and subtracts the “unloaded torque” (step 62) to generate a representative polishing pad-substrate page. This paper applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) (Please read the notes on the back before filling in this page) 48 ^ · --------- Order --------- 458852 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Consumption cooperative print t Α7 Β7 V. Description of the invention () The first signal of the torque generated by the interaction "This second signal is divided by the radial portion of the substrate to produce a friction force proportional to the substrate and the grinding pad Signal (step 64). The second threshold value is subtracted from the resulting friction signal (step 65) to produce a differential signal. The differential signal obtained by zooming in or out (step 66) ′ depends on how much the head pressure needs to be adjusted. The head pressure is then adjusted to provide the required friction (step 68). For example, the differential signal for zooming in or out can be subtracted (assuming that the control signal is higher than the threshold signal) or added (assuming that the control signal is lower than the threshold signal) a preset pressure to hire students-pick the lead pressure signal . Finally, the head pressure signal can be smoothed to avoid shock (step 69). Please refer to Fig. 4 '. In other embodiments, the pressure controller 40 performs a control circuit based on the coefficient of friction to determine the appropriate expansion head pressure. In this embodiment, the controller stores a second threshold β representing the friction coefficient desired by the user. First, the controller receives the torque signal (step 70) and subtracts the "unloaded" torque (step 72). A second signal is generated. This second signal is divided by the radial portion of the substrate on the platform to generate a third signal that is proportional to the friction between the substrate and the polishing pad (step 74). And this third signal Divided by the relative speed between the substrate and the grinding unit to produce a fourth signal proportional to the coefficient of friction (step 骡 75) »This second threshold value is subtracted from this fourth coefficient of friction signal (step 骡 76) to produce A differential signal. The differential signal obtained by zooming in or out (step 77) depends on how much the head pressure needs to be adjusted. Then adjust the head pressure to provide the required friction (step 78). For example, zoom in or out The differential signal can be subtracted (assuming that the control signal is higher than the threshold signal) or added (assuming that the control signal is lower than the threshold signal). The 100th paper standard applies the Chinese National Standard (CNS) A4 specification. < 210 297 mm) (read first Notes on the back of this tile reloading nest) ---- --------- order line -ο ··
4 5 88 S Α7 Β7 五、發明說明（ -預設壓力以產生-攜帶頭壓力訊號。最後，可將此攜帶 頭壓力訊號平順化以避免震盈（步觸79)。 請參閱第5圖’在其他實施例中，壓力控制器邨進 行一更複雜且以摩擦力為依據之控制迴路。在此實施例 中，壓力控制器接收正比於力矩之訊號（步驟8〇)並減去" 無載"力矩量測值（步驟82)以產生一第二訊號。此揸制器 根據攜帶頭掃過之輪廓計算出平板上攜帶頭有效的徑向 部份（步驟84)。此第二訊號以一預設時間週期平均或積分 以降低雜訊（步驟86)，並且雜訊降低之訊號以攜帶頭有效 之徑向部份除之以決定平均有效摩擦力（步驟88)。計算攜 帶頭達到想要之有效摩擦力所需施加的壓力（步驟9〇) β計 算系統響應延遲（步驟92)’調整壓力以反應此系統響應延 遲（步驟94)’並且將調整過之壓力施加至基板（步驟β 第2,5圖所示之每種方法均可以硬體、軟體或是硬體 與軟體之結合執行之。許多步驟可以其他順序進行。例如 訊號之平滑化及平均可進行於力矩訊號接收後的任意時 間。相對速度之除之可進行於基板徑向部分的除之前。個 別的計算步驟可結合於單一的計算中。 經濟部智慧財產局員工消费合作社印製 本發明之優點包含下列：首先，初始的緩慢研磨期間 (固定研磨墊之磨合期）可大幅地降低。第二，可以增加製 程穩定性。第三，基板與研磨面間之摩擦力可維持恆定以 提供具不同圖案之基板均勻的研磨速率。第四，恆定的摩 擦力可減少化學機械研磨設備的震動及降低溫度偏移。第 五’可降低碟型效應及腐蝕。 第12貫 本紙張尺度適用中國國家標準（CNS)A4規格<210 X 297公釐） 4 5 885 2 A7 ------------ B7 五、發明說明（） 雖”’，圖說明使用來自平台驅動控制器42之訊號， 但亦可使用來自攜帶頭驅動控制器44之訊號。或者是， 可以量測流至馬達之電流（馬達電流訊號）並將其傳至壓力 控制器40 -並且，雖然本發明已描述於—使用轉動平台及 ㉟帶頭疋化學機械研磨設備，本發明仍適用於其他研磨機 台，例如一線性皮帶研磨機。 為增加基板與研磨墊間之相對速度，可調整攜帶頭及 /或平台之轉速以維持相蚜恆定之摩擦力，而不是調整攜帶 頭之壓力》例如，可使用自動調整產生想要之力矩的馬 達，且其他維持恆定力矩的控制功能可整合於此馬達中。 雖然本發明已以數個實施例說明之，但是本發明不限 定於所述之實施例，而是以審查中之申請專利範圍所定義 之範圍認定之β C琦先閱讀背面之注意事項再填寫本頁) S裝--------訂---- -----線\ 經濟部智慧財產局員工消費合作社印製 頁 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）4 5 88 S Α7 Β7 V. Description of the invention (-Preset pressure to generate-Carrying head pressure signal. Finally, the carrying head pressure signal can be smoothed to avoid shock (step touch 79). Please refer to Figure 5 ' In other embodiments, the pressure controller performs a more complex and friction-based control loop. In this embodiment, the pressure controller receives a signal proportional to the torque (step 80) and subtracts " None Load the torque measurement value (step 82) to generate a second signal. The controller calculates the effective radial portion of the carrying head on the tablet based on the contour swept by the carrying head (step 84). This second signal A predetermined time period is averaged or integrated to reduce the noise (step 86), and the reduced noise signal is divided by the effective radial portion of the carrying head to determine the average effective friction (step 88). Calculate the carrying head reached The pressure required to apply the effective friction (step 90) β Calculate the system response delay (step 92) 'Adjust the pressure to reflect this system response delay (step 94)' and apply the adjusted pressure to the substrate (step β Figures 2, 5 Each method shown can be performed in hardware, software, or a combination of hardware and software. Many steps can be performed in other orders. For example, signal smoothing and averaging can be performed at any time after receiving the torque signal. Relative speed The division can be performed before the division of the radial portion of the substrate. The individual calculation steps can be combined in a single calculation. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics The advantages of the present invention include the following: First, the initial slow grinding period (The running-in period of the fixed polishing pad) can be greatly reduced. Second, the process stability can be increased. Third, the friction between the substrate and the polishing surface can be maintained constant to provide a uniform polishing rate for substrates with different patterns. Fourth Constant friction can reduce the vibration and temperature deviation of chemical mechanical grinding equipment. Fifth 'can reduce dish effect and corrosion. The twelfth paper size is applicable to China National Standard (CNS) A4 specifications < 210 X 297 (Mm) 4 5 885 2 A7 ------------ B7 V. Description of the invention () Although "', the diagram illustrates the use of the drive controller from the platform 42 Signal, but it is also possible to use a signal from the portable head drive controller 44. Alternatively, the current to the motor (motor current signal) can be measured and transmitted to the pressure controller 40 -and, although the present invention has been described in —Using the rotating platform and the ㉟-head 疋 chemical mechanical polishing equipment, the present invention is still applicable to other polishing machines, such as a linear belt polishing machine. In order to increase the relative speed between the substrate and the polishing pad, the carrying head and / or the platform can be adjusted. The rotation speed is to maintain the constant friction of the aphid, instead of adjusting the pressure of the carrying head. For example, a motor that automatically adjusts to generate the desired torque can be used, and other control functions that maintain a constant torque can be integrated into this motor. Although the present invention It has been illustrated by several embodiments, but the present invention is not limited to the described embodiments, but β C, which is identified by the scope defined by the scope of the patent application under review, read the precautions on the back before filling this page) S Pack -------- Order ---- ----- Line \ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, page 3 This paper size applies to Chinese National Standards (CNS) A4 size (210 X 297 mm)