TW450866B - Carrier head with an flexible membrane and an edge load ring - Google Patents

Abstract

A carrier head for chemical mechanical polishing includes a base and a flexible membrane. A lower surface of the flexible membrane provides a substrate receiving surface of a substrate. The lower surface includes a first surface to apply a first pressure to a first portion of the substrate. A second surface surrounding the first surface applies a second pressure on a second portion of the substrate. An edge load ring surrounds the second surface. A lower surface of the edge load ring provides a third surface to apply a third pressure to a third portion of the substrate surrounding the second portion.

Description

4508 66 Printed by Ai B7, B7 Consumer Cooperative, Intellectual Property Bureau of the Ministry of Economic Affairs 5. Field of the Invention: The present invention relates generally to chemical mechanical polishing of substrates, and more specifically, to a method for chemical mechanical polishing. Grinding head for ground elastic film. BACKGROUND OF THE INVENTION Integrated circuits are typically formed on a substrate, particularly a silicon wafer, by sequential deposition of conductors, semiconductors, and insulating layers. After each layer is deposited, it is etched to create a circuit feature. After a series of layers are sequentially deposited and etched, the outermost or uppermost surface of the substrate, that is, the exposed surface of the substrate, becomes non-planar. This uneven surface can cause problems for lithography imaging steps in integrated circuit manufacturing processes. Therefore, it is necessary to periodically planarize the surface of the substrate. Chemical mechanical polishing (CMP) is one of the accepted planarization methods. Β This planarization method typically requires the substrate to be mounted on a carrier or polishing. The exposed surface of the substrate is configured to resist a rotating abrasive finish. The polishing pad may be a " standard " or a fixedly adhered pad. A standard abrasive pad has a durable rough surface, while a fixed adhesive pad has adhesive particles fixed in an accommodating medium. The abrasive head provides a controlled load, i.e. pressure, onto the substrate to apply It is correct for this grinding. Some abrasive heads include an elastic film that provides a mounting surface to the substrate, and a retaining ring to hold the substrate under the mounting surface. The pressure or emptiness of a chamber behind the elastic film controls the load on the substrate. — 2T This paper size is applicable to country B standard (CNS) A4 specifications (210 * 297 mm) '----- (Please read the precautions on the back before filling out this page) Order ----- -Line · 450866 A7 B7 V. Description of the invention () Grinding slurry and abrasive particles (if a standard polishing pad is used) including at least one chemical reactant are supplied to the surface of the polishing pad. The effectiveness of the CMP process can be judged by its polishing rate and the density (no roughness of small size) and flatness (no topography of large size) obtained on the surface of the substrate. The polishing rate, density, and flatness are determined by the combination of pad and mud, the relative speed between the substrate and the pad, and the force with which the substrate is pressed against the pad. The problem encountered in CMP is commonly known as "edge effect", that is, the grinding rate at the edge of the substrate is different from the grinding rate at the center of the substrate. This edge effect usually results in the periphery of the substrate (such as a The 200 mm crystal garden's outermost 5 to 10 mm) is excessively ground (that is, excessive substrate material is removed). Purpose and sincerity of the invention: In one aspect, the present invention relates to a chemical Grinding head for mechanical grinding. The grinding head has a base, an elastic film extending under the base to define a pressurizable chamber, an edge load ring and a retaining ring. The elastic film provides a substrate The substrate receiving surface includes a first surface to apply a first pressure to a first portion of the substrate. A second surface surrounds the first surface to apply a second pressure to a first portion of the substrate. The second surface of the edge load ring. The lower surface of the edge load ring provides a third surface for applying a third pressure to the third part of the second ring for securing the substrate. The maintenance ring is negative around the edge The ring is used to keep the substrate under the first, second, and third surfaces. Page 3 This paper size applies to a national standard (CNS) A4 specification (210 X 297 mm) < Please read M first (Notes on the back then fill out this page)

-~ ^ l.x I I I l · I I I I Printed by Shellfish Consumer Cooperation, Intellectual Property Bureau, Ministry of Economy 450866

Employees ’cooperation with the Intellectual Property Bureau of the Ministry of Economic Affairs, Du Yin, Jade, Invention Description (1) The implementation of the present invention may include the following—or a number of features—an annular wall may be gardened and connected to the first surface of the elastic film. The wall portion may have a lower surface and an upper surface, and the lower surface defines the second surface. An isolation ring may have a lower surface and an upper surface. The upper surface of the spacer ring is arranged to receive a load in response to the pressure of the chamber, and the lower surface of the spacer ring can abut the upper surface of the wall portion, thereby transferring the load received by the upper surface of the spacer ring. The wall section. The isolation ring may be disposed between the edge load ring and the wall (or disposed on the wall portion and aligned substantially horizontally with a top of the edge load ring. The surface area of the upper surface of the isolation ring may be greater than or Approximately equal to the surface area of the lower surface of the spacer ring. The edge load ring includes a top that extends above the upper surface of the wall member and defines an upper surface of the edge load ring ', and the upper surface can be designed to accept a The shape of the load is used to respond to the pressure of the chamber and apply the second pressure to the second portion of the substrate and a third pressure to the third portion of the substrate. A portion of the upper surface of the edge load ring The surface area may be larger or smaller than the surface area of the lower surface of the edge load ring. In another aspect, the present invention relates to a grinding head for chemical mechanical grinding. The grinding head has a base, and an elastic film extends from the base. The bottom defines a pressurizable chamber, an edge load ring and a retaining ring β. The lower surface of the elastic film provides a first surface to apply a first pressure to a first portion of the substrate. The edge The edge load ring surrounds the first surface and has an upper surface and a lower surface. The lower surface of the edge load ring provides a second surface to apply a second pressure to a second portion of the substrate. The surface area of the trapped upper surface of the edge load ring is at least the edge load ring. Page 4 This paper is applicable to a national standard (CNS) A4 specification (210 X 297 cm) ------ ^ ---- : -------- r --- Order --------- line ------ < 谙 Read the notes on the back before filling this page) 4 5 0866 A7 B7 Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives V. Invention Description (50% of the surface area of the lower surface of the enclosure. The retaining loop surrounds the edge load loop to maintain the substrate at the first and second Under the surface. The implementation of the present invention may include one or more of the following features. The elastic film includes an annular wall portion to provide a third surface to apply-a third pressure to the substrate between the first portion and the second portion Between-the third part. An isolation ring is placed over the upper surface of the wall and cooperates with the edge load ring to provide the Three pressures on the third part of the substrate. In another aspect, the invention is a grinding head for chemical mechanical grinding. The grinding head has a base, and an elastic film extends under the base to define A pressurizable chamber, an edge load ring and a retaining ring. The lower surface of the elastic film provides a substrate receiving surface of a substrate, and the lower surface includes a first surface for applying a first pressure to the substrate. A first portion and a second surface of the material are used to apply a second pressure to a second portion of the substrate surrounding the first portion. The edge load surrounds the second surface, and the edge load A contact surface of the ring provides a third surface to apply a third load to the third portion of the second portion trapped by the substrate. The retaining ring surrounds the edge load ring to hold the substrate at The first, second and third surfaces are underneath. In another aspect, the invention relates to a method for grinding a substrate. In the method, a substrate is disposed in contact with an abrasive surface, a first pressure is applied to a first portion of the substrate through a first-part of an elastic film, and a second pressure is applied by A second portion of the elastic film is applied to a second portion of the substrate, and a third pressure is applied to a third portion of the substrate through an edge load ring.

Article S7T This paper size is applicable to China Standard for Household Standards (CNS) A4 (210 * 297 male H) —----- --------- ^ ---- OX ------- --- Order --------- line t (please read the notes on the back before filling out this page) Staff Consumers Bureau of Intellectual Property, Ministry of Economic Affairs # Cooperative Society Printing_ 450866 A7 B7 V. Description of Invention () Implementations of the invention may include one or more of the following advantages. Excessive grinding and insufficient grinding at the periphery of a substrate can be reduced by applying different forces to selected areas of the substrate. Details of one or more embodiments of the invention are shown in the appendix and are explained below. Other advantages and features of the present invention will become apparent from the following description including the circular form and the scope of patent application. Description of the drawing rib m: FIG. 1 is an exploded perspective view of a chemical mechanical polishing equipment. Figure 2 shows the inconsistent polishing rate of the periphery of a substrate under the CMP method. Figure 3 shows the inconsistent polishing rate in the second example by applying different forces along the radial direction of the substrate. Be compensated. Figure 4 is a schematic cross-sectional view of a grinding head according to the present invention. Figure 5 is an enlarged view of the grinding head in Figure 4. It shows an edge load ring-No. 6 is for the grinding head in the fifth circle. Sectional view of the elastic film a The 7A circle is the circle of the 5th circle of the spacer ring by the grinding head. 7B-7D are cross-sectional views of different embodiments of the spacer ring in FIG. 7A. FIG. 8 is a cross-sectional view of the edge load ring of the grinding head in FIG. 5. Fig. 9 is a schematic cross-sectional view of a grinding head according to an embodiment of the present invention. Fig. 10 is a schematic sectional view of a grinding head according to another embodiment of the present invention. Article 6: This paper size applies + B National Standard (CNS) A4 specification (210 X 297 mm) ----—. 1 I 1Ί --- · 1 --- = ---- Order · I! I —! * Line (please read the note on the back ¥ item before filling out this page) 4 5 08 6 6 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Drawing number comparison description: 10 Substrate 20 Chemistry Mechanical polishing equipment 25 Grinding station 27 Conveying station 30 Rotary table 32 Grinding and finishing 40 Grinding pad adjustment equipment 50 Mud 52 Mud / washing arm 60 Multi-head rotating tower 62 Center column 64 Rotating tower shaft 70 Grinding head system 100 Grinding head 72 Slot 74 Drive shaft 76 Grinding head rotation motor 68 Rotating tower cover 102 Housing 104 Base 106 Gimbal mechanism 108 Load chamber 1 10 Maintenance ring 112 Substrate support assembly 107 Rotary cypress 130 Vertical hole 1 32, 1 34 Channel 138 0-ring 140 Elastic film 142 Clamp ring 144 Pouch 146 Channel 148 Clamp 159 Valve 150 Gimbal 152 Flexible ring 154 Channel 160 Rolling film 162 Inner clamp ring 164 Outer clamp ring 128 Bolt 124 Bottom surface 126 Inner surface 114 Support structure 1 16 Isolation ring 118 Elastic film 71Γ {Please read the precautions on the back before filling in this page) {3 ^ ---------- Order --------- line_ This paper applies Chinese national standards < CNS) A4 size (210 * 297 mm)

4 5 08 6 G Α7 Β7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (120) Edge load ring 121 Substrate support assembly 210 Center portion 122 Mounting surface 2 12 Peripheral portion 222 Thick-walled portion 218 Thin-walled Part 184 outer surface 1 19b lower surface 196 upper surface 198 outer surface 204 inner surface 226 step portion 214 edge portion 190 pressurizable chamber 220 crossbow portion 222a upper surface 222b lower surface 170 plate portion 172 5L 174 & edge portion 176 Lip 180 Edge 182 Lug 119a Upper surface 119c Base 230 Flange 232 Base 234 Flat lower surface 236 Upper surface 238 Lower surface 240 Squeezable material layer 100, grinding head 200 Support structure 12Γ Load assembly 118 'Elastic film 120 'edge load ring 222' wall 202 ring edge 1 16 'spacer ring 226' step section 230 'flange section 236' upper surface 148 'lip 190' chamber 210 'center section 1 0 " grinding head 300 support structure Page B The paper size is applicable to the national standard (CNS) A4 specification (210 * 297 mm) --------; --------- Γ-order ------ --- line (Please read the precautions on the back before filling this page) 4508 66 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () 12 1 ”Load module 302 Support film 304 Base plate 306 Side wall 308 Support structure Edge 145 Pouch 110 " Maintenance ring 3 10 Edge 312 Lower surface 3 14 Another part 3 16 Inner surface 3 18 Outer surface 320 Central portion 322 First surface 2 3 4 " Lower surface 324 Second surface A7 B7 Invention # 细 说明 \ Referring to Figure 1, one or more substrates will be ground using a chemical mechanical polishing (CMP) apparatus 20. A description of a similar CMP apparatus can be found in U.S. Patent No. 5,73 8,574, which patent The entire disclosure is incorporated herein by reference. CMP equipment 20 includes a series of polishing stations 25 and a transfer station 27 for loading and unloading substrates. Each polishing station 25 includes a rotary table 30, a polishing pad 32 is placed on the rotary table 30. If the substrate is an 8-inch (200 mm) or 12-inch (300 mm) diameter disk, the rotary table 30 and the polishing pad 32 Diameter will be 20 or 30 respectively Inch "diameter of the rotary table 30 and the polishing pad 32 that is also 20 inches, if the substrate 10 is a diameter of 6 inches (150 mm) disk words. For most grinding processes, a rotary table flexion motor (not shown) rotates the rotary table 30 'at a speed of 3 to 200 rpm, although lower or higher transfers can also be used. Each grinding station may further include an associated pad adjustment device 40 to maintain the grinding 9th Γ This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 11 i IJ ---- 1J l * rw ^ ---- l · I 丨 —Order —------- Line 1 / K * (Please read the notes on the back before filling out this page) 4 5 08 6 6 Intellectual Property Bureau, Ministry of Economic Affairs A7 printed by the employee's cooperative. ______B7______ 5. Description of the invention () Grinding condition of the pad. A slurry 50 containing a fluid (such as deionized water used in oxidative milling) and a pH adjuster (such as potassium hydroxide used in oxidative milling) is supplied to the via a slurry / rinsing arm 52. The surface of the polishing pad 32. If the polishing pad 32 is a standard polishing pad, the slurry 50 may further include abrasive particles (such as silicon dioxide used in oxide polishing). Typically, sufficient sludge is provided to cover and wet the entire abrasive pad 32. The mud / rinsing arm 52 includes several spray nozzles (not shown) which provide a high-pressure abrasive pad 32 washing fluid at the end of each grinding and adjustment cycle. A rotatable multi-headed turret 60 is supported by a center post 62 and is rotated about the turret axis 64 by a turret motor assembly (not shown). The multi-head turret 60 includes four grinding head systems 70 mounted on a turret mounting plate 66 around the turret shaft 64 at equal angular intervals. Three of these grinding head systems 70 place the substrate on a grinding station. Another grinding head system receives a substrate from the transfer station and sends the substrate to the transfer station. The turret motor allows the grinding head systems 70 and the substrate placed thereon to orbitally move around the turret axis 64 between the grinding stations and the transfer station. Each of the grinding head systems 70 includes a grinding head. Each of the grinding heads 100 independently rotates around its own axis, and independently oscillates laterally in a radial groove 72 formed in the turret support plate 66. A grinding head drive shaft 74 extends through the slot 72 to connect a grinding head rotation motor 76 (shown by removing a quarter of a turret cover 68) to the grinding head. Each grinding head has a drive shaft and a motor. Each motor and drive shaft can be supported on a slider (not shown), which can be driven by a radial drive motor along the groove to transverse 107Γ This paper size applies to China's 0 standard (CNS) A4 specifications (210 * 297 mm) {Please read the notice on the back before filling this page)-1 --- r--1 Order ---- it · line "-J. 4508 6 6 A7 B7 V. Description of the invention () The grinding head is fabricated in a manner '> During the actual grinding, three grinding heads are placed on three grinding stations. Each grinding head 100 lowers a substrate to a grinding pad 32 Contact position. Generally, the grinding head 100 holds the substrate at a position against the grinding pad 32 and distributes a force across the entire back surface of the substrate. The grinding head also transmits torque to the substrate through a drive shaft. Referring to Figure 2, a problem encountered in CMP is that the polishing rate at the edge of the substrate is different from the polishing rate at the center of the substrate. The outermost portion of a substrate (eg, a diameter of 200 mm) 3 mm at the outermost periphery), there will be the result of excessive grinding (too much material is removed from the substrate in the immediate vicinity of the outermost periphery The inner peripheral part of the inner garden (such as 3 to 8 mm from the outermost edge) is insufficiently ground. The inner peripheral part (such as 8 to 20 mm from the outermost edge) of the inner circumference immediately adjacent to the middle peripheral part ) Is over grinding. Referring to Figure 3, these differences in grinding rate can be compensated by masking different pressures and forces on the edge of the substrate 10, that is, applying the Large pressure and small pressure applied in the area of excessive grinding. Referring to Figure 4-5, the grinding head 100 includes a housing 102, a base 104, a universal mechanism 106, and a load chamber 108. , A maintenance ring ho, and a substrate support assembly! 12. A description of a similar grinding head can be filed on November 8, 1996 by Zuniga et al. 'The name is a CARRIER HEAD WITH A FLEXIBLE MEMBRANE FOR a CHEMICAL US Patent Application No. 08 / 745,670 of MECHANICAL POLISHING SYSTEM was found 'All disclosures in this case were used by this reference to be ιΐΤ The national standard (CNS) A4 specification of this paper standard is applicable (210 * 297 mm) (Please read the note on the back ^ before filling in this page) ------ --- Order ----- I --- line · Member of Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperation Du printed 4 5 08 66 Employees of the Intellectual Property Bureau of the Ministry of Economic Cooperation Du printed A7 B7 5. Description of the invention () The housing 102 can be connected to the dynamic pump 74 for rotation with a linkage sleeve around a rotating sleeve 107 during grinding, and the rotating shaft is substantially perpendicular to the ground surface during grinding. The shape of the casing is substantially circular to correspond to the shape of the base of the substrate to be ground. A vertical hole 130 may be formed through the housing 102 to pneumatically control the grinding head. The o-ring 138 can be used to form an impervious seal between the path through the housing and the path through the drive shaft. The base 104 is a rigid ring-shaped or dish-shaped body located under the casing 102. An elastic and flexible film 140 may be attached to the bottom surface of the base 104 by a clip ring 142 to define a pouch 144. A channel 146 can extend through the clamp ring and base, and two clamping members 148 (only the clamping members fixed to the housing 102 are shown) can provide a fixing point to connect a flexible tube to the housing 102 It is used to fluidly connect the channel 1 34 to the bag 144 with the base 104. A first pump (not shown) may be connected to the bladder 144 for introducing a body, such as a gas, such as air, into or out of the bladder. In addition, an actuable valve 159 can be placed in the channel 146 and used to sense the presence of a substrate. * As suggested by Govzman et al. May 23, 1997, named A CARRIER HEAD WITH A SUBSTRATE DETECTION SYSTEM FOR A CHEMICAL MECHANICAL POLISHING SYSTEM is described in US Patent Application No. 08 / 862,350, the entire contents of which are incorporated herein by reference. The gimbal mechanism 106, which can be considered as part of the base 104, enables the base to pivot relative to the housing 102 so that the base can remain approximately parallel. Page 12 This paper size applies to the National Standard (CNS) A4 specifications (210 X 297 public love) ------------- 1 1 II Order I — ———— II "Please read the precautions on the back before filling this page) 45〇866 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (on the surface of the polishing pad. The universal mechanism 106 includes a universal rod 150 which is embedded in the vertical hole 130 and an elastic ring 152 which is fixed to the The base 104. The universal rod 150 can be slid vertically in a bush 136 located in the hole 130 to provide vertical movement of the base 104, but it can prevent any movement of the base 104 relative to the housing 102. Lateral motion: The universal joint 150 also includes a channel 154 that extends the entire length of the universal joint to pneumatically control the grinding head. A generally annular rolling diaphragm (diaphragm) 160 has an inner edge that can be clamped by an inner clamp Ring 162 is clamped to the housing 102, and an outer clamp ring 164 can be used to roll the thin The outer edge of 160 is clamped to the base 104. Therefore, the rolling film 160 closes the space between the housing 102 and the base 104 to define a load chamber 108. A second pump (shown as (Out) can be fluidly connected to the load chamber 108 through the channel 132 to control the pressure in the load chamber and the pressure applied to the base 104. The vertical position of the base 104 relative to the polishing pad 32 is also The β maintenance ring U0 is controlled by the load chamber 108, which is a generally annular ring, which is fixed to the outer edge of the base 104 by the yoke 128. When the fluid is pumped into the load chamber 108, and When the base 104 is pushed down, the maintenance ring 110 is substantially concerned, or it has a plurality of pipes to facilitate the mud from the outside of the maintenance ring to the substrate. An inner surface 126 of the maintenance ring 110 and The substrate is in contact to prevent it from detaching from under the abrasive head. The substrate support assembly 112 includes a support structure 114, an elastic member or film, 18, an isolation ring 116, and an edge load ring 12. The substrate support assembly U2, respectively Providing a first pressure, a second pressure, and a third pressure to the first of the substrate (Central part), the second part (inner peripheral part), and the 13th lull. --- Ί II i II l · III ^ i — — — — —! (Please read the notes on the back before filling in this Page > 45〇8 66 Economic Village Intellectual Property Bureau Employee Consumption Cooperation Du printed A7 B7 V. Description of the invention () Part III (middle peripheral part), which will be explained in detail later. Refer to Figures 4 and 6, flexibility The film 118 is a generally sloping plate made of a flexible and elastic material, such as chloroprene, ethylene propylene rubber, or silicon. A central portion 210 of the elastic film 118 extends under the support structure Π4 to provide a mounting surface 122 to engage the substrate. A peripheral portion 212 of the elastic film extends to the support structure 114, an edge load ring 120, and a spacer ring. In a spiral path between 116, it is then fixed to the grinding head across the edge ring 120, such as to the base 104 or the retaining ring 110. The peripheral portion 212 includes a thick-walled portion 222 at the edge of the central portion 210, a thin-walled portion 218 extending upwardly around the outer surface of the support structure 114, and inwardly interposed between the lower surface 11 and 9b of the spacer ring 116. An upper surface 196 of the structure 114 is upwardly interposed between an inner surface 204 of the isolation ring 166 and an outer surface 198 of the supporting structure Π4. The peripheral portion 212 also includes a first-level dark portion 226 that extends outward along the upper surface 202 of the edge load ring 120. The elastic film 118 terminates at an edge portion 214 which is sandwiched between the base 104 and the retaining ring 110 to form a fluid-tight seal. A cross-shaped " free span " portion 220 of one of the elastic films extends between the edge portion 214 and the step portion 226. The elastic film can be pre-molded into a spiral shape ^ sealed in elasticity The space between the membrane 118 and the base 104 defines a pressurized chamber 190. A third pump (not shown) can be fluidly connected to the chamber 1 90 through the channel 154 for control in the chamber 1 90 The pressure of the mounting surface and the downward force exerted on the substrate by the mounting surface. The pressure of the chamber 190 applies a uniform pressure to the stage 226 and the solid curved portion 220. The edge load ring 120

The U-th paper size is applicable to the national standard (CNS) A4 (210 X 297 mm) ^ --------- r ------------ < 5 ^ · (Please read the precautions on the back before filling this page)! 45〇866

5. Description of the invention () The uniform pressure of 190 is used to apply two different pressures on the periphery of the substrate 10, which will be described in detail below. In addition, the chamber 190 can be emptied to pull the elastic film π 8 upwards and thereby vacuum-hold the substrate on the grinding head. The wall of the joint of β and the central portion 21 is provided with a second surface for contact with The inner peripheral portion of the base material is engaged. The wall portion 222 includes an upper surface 222 & to receive a load and a lower surface 222b to apply the load to an inner peripheral portion of the substrate. Assuming that the downward force transmitted from the spacer ring 116 to the upper surface 222 & is constant, the pressure applied to the inner peripheral portion is inversely proportional to the surface area of the lower surface 2221) of the wall portion 222. In detail, the pressure (P) applied by a fixed force (F) changes with the surface area (A) to which the pressure (p) is applied, that is, F / A. The dust force applied to the inner peripheral portion can be controlled by designing the wall portion 222 to have an appropriate lower surface area. That is, if the width (W1) of the wall portion 222 increases, the pressure applied to the inner peripheral portion of the base material decreases. Alternatively, if the width (W1) decreases, the pressure applied to the inner peripheral portion of the substrate increases. The support structure 114 is located in the chamber 190 to provide a solid support for the substrate during substrate clamping, and to limit the upward movement of the substrate and the elastic film when the substrate 190 is evacuated, and to maintain the elastic film 118. In detail, the supporting structure 114 may be a substantially rigid element having a disc-shaped plate portion 170 with a plurality of holes 172 penetrating the structure, and a generally annular flange portion. 174 It extends upward from the plate portion 172. In addition, the plate portion 170 has a lip portion 176 protruding downward at its outer edge. The supporting structure 1 1 4 is " non-suspended ", that is, it is not fixed to the rest of the grinding head. 157Γ This paper size applies + National Standard (CNS) A4 specification (21〇χ 297 male dragon) 1 II 1 I Ί t I HI — — ^ rcw ^-i II l · 11 I-— — 111 — — uiv- (Please read the precautions on the back before filling this page)

Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, 3 Industrial Consumer Cooperatives 45 0866 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives A7 B7 V. Description of the invention (), and can be held in place by elastic film. The flange portion 174 of the support structure includes an edge 180 that extends across a lug 182 formed on the base 104 »When grinding is complete and the load chamber 108 is evacuated to lift the base 104 away from the polishing pad, and the chamber When 190 is pressurized or evacuated, the lower surface of the edge 180 engages with the lug 182 as a rigid catch, which restricts the downward movement of the support structure 114 and prevents the elastic film from stretching. Referring to Figures 4 and 7A, the spacer ring 1 is a ring-shaped member, which is disposed on the upper surface 222a of the wall portion 222 between the elastic film 118 and the edge load ring 120. An upper surface 119a and a lower surface 119b of the spacer ring 116 are respectively designed to receive a load from the chamber 190 and transfer the load to the wall portion. The load received by the isolator ring 116 from the chamber 190 is proportional to the surface area of the upper surface of the isolator ring. The width (W2) of the upper surface 119a can be changed to control the acceptance by the isolator ring 116 from the chamber 190. Similarly, the width (W3) of the lower surface 19b can be changed to control the pressure applied to the wall portion 222. * Referring to Figures 7B-7D, a base 119c of the spacer ring 116 can be made to control the load. The shape of the position of the wall part and the control of the pressure applied to the selected area of the wall part 222. Referring to Figures 4 and 8, the edge load ring 120 is a generally annular body between the retaining ring 110 and the wall portion 222. The edge load ring 120 includes a base portion 232, a flange portion 230 extending upwardly from the base portion 232 to the isolation ring Π6 for receiving a load from the chamber 190 through the elastic film 118, and a generally flat lower surface 234 is used to apply pressure to the peripheral portion of the substrate 10. The flange portion 230 includes an upper surface 236 which is in contact with the elastic film 118. 16th ______ This paper size applies to the Chinese National Standard (CNS > A4 specification (210 X 297 mm) I 1 ----- Ϊ I- 111 l · III ^ «— — — — — — I— (Please read the notes on the back before filling out this page) 4508 6 6 A7 B7 Printed by the Shellfish Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () and The lower surface 238 is in contact with the isolation ring 1 and 6a. The edge load ring 120 receives the load from the stepped portion 226 and the bent portion 220 of the elastic film. The crossbow portion 220 also applies a load to the retaining ring 110. The total load to which the edge load ring 120 is subjected is proportional to the surface area of the upper surface 236 in contact with the step 226. The surface area of the upper surface 236 is at least 50% of the surface area of the lower surface 238 of the edge load ring. The upper surface 236 The surface area can be changed by adjusting the width (W4) of the flange portion 230 to control the load D received from the edge load ring 120. The width (W4) should be sufficiently wide to allow the chamber 190 to bear a sufficient load such that The second pressure and the third pressure can be applied separately To the inner peripheral portion and the middle peripheral portion of the substrate "The edge load ring 120 transmits a part of the total load received from the chamber 190 to the spacer ring 116 to apply a second overall force to the inner peripheral portion 9 and is transmitted. The load to the spacer ring 116 is directly proportional to the surface area of the upper surface 119a of the spacer ring 116 that is in contact with the edge load ring. If the upper surface area of the spacer ring 116 is increased, 'is transferred from the edge load ring 20 to the spacer ring The proportion of the total load of 116 will increase. ”Conversely, if the upper surface area of the isolation ring 116 is reduced, the proportion of the total load transferred from the edge load ring 120 to the isolation ring 116 will be reduced. The remaining load on the load ring 120, that is, the portion that is not transferred to the isolation ring 116, is transferred to the lower surface 234 to apply a third pressure to the middle peripheral portion of the substrate. It is applied to the middle peripheral portion The upper pressure can be controlled by appropriately selecting the width (W5) of the lower surface 234 of the edge-loading ring. Article 17: This paper size applies the Chinese National Standard (CNS) A4 specification (210 * 297) Mm) f ^ i ----- I l · I-I ^ ------ I--n · '· (Please read the notes on the back before filling this page) 4508 66 Α7 Β7 V. Description of the Invention () < Please read the notes on the back of Jing before filling this page) Therefore, the grinding head 100 can apply three different pressures to the substrate by using the same pressure in the chamber 90. The central portion 210 applies a first force to the central portion of the substrate. The load assembly 121 applies a second pressure and a third pressure to the inner peripheral portion and the middle peripheral portion, respectively. The second and third pressures can be controlled by selecting an appropriate ratio of the upper surface area of the edge load ring 'to the lower surface area of the edge load ring, the upper surface area of the spacer ring, and the lower surface area of the wall portion. The edge load ring 120 is made of a material that is relatively rigid compared to the elastic film, such as stainless steel, ceramic, field-polarized aluminum, or plastic, such as polyethylene sulfur (PPS). A layer of compressible material 240 may be adhered to the lower surface 234 of the base 232 to provide a mounting surface for the substrate. In one embodiment, the width (W1) of the wall portion 222 of the elastic film 118 is within the range of 15 to 0.3 inches, and the spacer ring 116 has an inner diameter (ID 1) of approximately 6.2 inches. The spacer ring The width (W2) of the upper surface 119a of the 116 and the width (W3) of the lower surface Π 9b are in the range of 0.05 to (M inches). The edge load ring 120 has an inner diameter (ID2) of about 6.35 inches The width (W4) of the flange portion 230 of the edge load ring 120 is in the range of 0.5 to 0.6 inches, and the width (W5) of the lower surface 234 of the edge load ring 120 is in the range of 0,4 to 0.5 inches. between. Printed with reference to Figure 9 by the Intellectual Property Bureau of the Ministry of Economic Affairs, a grinding head 100 ′, a grinding head 100 ′ includes a support structure 200 and a load assembly 12Γ, which includes an inner 120′G and a wall portion 222, Elastic film 1 18 ', a spacer ring 1 16' and an edge load ring 120 ,. The support structure 200 includes a generally annular edge 202 that protrudes between the edge load ring 120 'and the pouch 144. "Page 1β This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm> 4 ^ 〇86 6 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () The isolation ring 116 'is placed on the wall 222' and is in contact with the elastic film 118. The edge load ring 120 ' _a The edge portion 23CT is designed to be parallel to the spacer ring 116 'such that the upper surface 236' of the edge load ring 丨 2 · is coplanar with an upper surface 1a of the spacer ring 116 '. The edge load ring 12 A lip 148 'is slightly shorter than a lip 148 of the edge load ring 120. In operation, a pressure of 190 mm is applied to the center portion 210' of the elastic film 1 18 ', and the isolation ring 1 16 'and the edge load ring 12 (T. Then, the center portion 210' applies a first pressure to the center portion of the substrate, and the spacer ring 116 'applies a second pressure to the wall portion 222' of the elastic film to The inner peripheral portion of the substrate and the edge load ring 12 (T apply a third pressure to the middle of the substrate With reference to FIG. 10, a grinding head 100 includes a supporting structure 300 and a load module 121, which includes a supporting film 302 having the functions of a flexible film 116 and a flexible film 118. And an edge load ring 120. The support structure 300 is a rigid bowl-shaped piece, which includes a disc-shaped chassis 304, a cylindrical side wall 306, and a generally annular edge 308. The edge 308 protrudes from The edge load ring 120 is above and is placed under the pouch 145. The supporting film 302 is a generally circular plate having an outer edge 310 sandwiched between the retaining ring 110 and the base 104. The support film 302 is fixed on the polishing head. A part 311 of the support film 302 extends inward from the outer edge 310 and is sandwiched between the upper surface of the edge load ring 120 · • and the lower surface 312 of the edge 308 of the support structure. Q. Another portion 314 of the support film 3 02 extends between the inner surface 3 1 6 of the edge load ring 120 " and the upper surface 318 of the support structure side wall 3 06. A central portion 32 of the support film extends from the support 19ΤΓ This paper is suitable for + country House standard iMCNS) A4 specification (210 X 297 male; »> " III — IJ --- 1 丨 III il · III * I--I — I — I Li-. (Please read the precautions on the back before (Fill in this page) 668 ο 54 A7B7 V. Description of the invention () The supporting structure underneath the base plate 304 is used to provide a first surface 322 and the central part of the substrate. The edge load ring 1 20 " is placed between the support structure 3 00 and the maintenance ring 丨 丨 0 "* The lower surface 234" of the edge load ring 120 " can be covered by an erasable material. The edge load ring 1 20 " provides a second surface to engage with the peripheral portion of the substrate " during operation, the pressure of the chamber 190 " forces the support film 302 and the edge load ring 120 " down to apply a load to The central part and peripheral parts of the substrate. The invention has been described on the basis of several embodiments. However, the invention is not limited to the illustrated and described embodiments. The scope of the present invention is defined by the following patent claims. (Please read the notes on the back before filling out this page) -Λ (κ

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Claims (1)

888¾ ABCD 45〇8 66 The consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs Du printed the scope of patent application h A grinding head for chemical mechanical grinding, which at least contains:-base; (please read the unintentional matter on the back before (Fill in this page) ~ An elastic film 'extends under the base to define an integral chamber. The elastic film provides a substrate acceptance table for the substrate, and the lower surface includes a first surface to apply a first Pressure to a first portion of the substrate;-a second surface, which surrounds the first surface to apply a second pressure to a second portion of the substrate;-an edge load ring, which surrounds the second Surface, a lower surface of the edge load ring provides a third surface for applying a third pressure to the third portion of the substrate surrounding the second portion of the substrate: and a retaining ring surrounding the edge load ring The substrate is held under the first, second and third surfaces. 2. The polishing head according to item 1 of the scope of patent application, further comprising an annular wall portion which can be circled and connected to the first surface of the elastic film. The wall portion may have a lower surface and an upper surface. The surface defines the first surface 4, 3. The polishing head as described in item 2 of the scope of patent application, further comprising a spacer ring having a lower surface and an upper surface, the upper surface of the spacer ring is arranged to receive a load to In response to the pressure of the chamber, and the lower surface of the spacer ring can be adjacent to the upper surface of the wall portion, the load received by the upper surface of the spacer ring can be transmitted to the crotch ° 21st Λ 5 〇SS 6 C8 D8 6. Scope of patent application 4 · The grinding head described in item 3 of the scope of patent application, wherein the isolation ring is arranged between the edge load ring and the crotch ° 5. As in the case of patent application 3 The grinding head described above, wherein the spacer ring may be disposed on the wall portion to face the top of the edge load ring approximately horizontally. 6. The polishing head according to item 3 of the scope of patent application, wherein a surface area of an upper surface of the spacer ring is larger than a surface area of a lower surface of the separation ring. 7. The grinding head described in item 3 of the patent application scope, wherein a surface area of the upper surface of the spacer ring is substantially equal to the surface area of the lower surface of the separation ring, 8. The grinding head described in item 2 of the patent application scope Wherein, the edge load ring includes a top portion which extends above the upper surface of the wall piece and defines an upper surface of the edge load ring. It can be seen that the upper surface can be designed to receive a load to respond to the chamber's Press and apply the second pressure to the second part of the substrate and apply a third pressure to the third part of the substrate 9. The polishing head according to item 8 of the scope of patent application, wherein the edge is loaded A surface area of an upper surface of the ring is larger than a surface area of a lower surface of the edge load ring. Page 22 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) Q, -------- Order ---- ----- Line Γ- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6e A8 B8 C8 D8 6. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs for the scope of patent application 10. As described in item 8 of the scope of patent application Grinding head, wherein a surface area of an upper surface of the edge negative ring is smaller than a surface area of a lower surface of the edge load ring. Nine types of grinding heads for chemical mechanical polishing include at least: a base; Under the base to define a pressurizable chamber, the elastic film provides a first surface to apply a first pressure to a first portion of the substrate; an edge load ring that surrounds the first surface and It has an upper surface and a lower surface. The surface area of the upper surface of the edge load ring is at least 50% of the surface area of the lower surface of the edge load ring. The lower surface of the edge load ring provides a second surface. To impose a second Energize to a second portion of the substrate; and a retaining ring surrounding the edge load ring to hold the substrate under the first and second surfaces. 12. The grinding head according to item 1 of the patent application scope, wherein the elastic film further includes an annular wall portion to provide a third surface to apply a third pressure to the substrate located on the first portion and the ^ U 1 3 on a third part between the two parts The grinding head as described in item 11 of the patent application scope, further comprising a spacer ring placed on the upper surface of the wall and the edge Load page 23 This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 male «) (Please read the precautions on the back before filling out this page > II i I Order-II 丨 — | 丨 | 1 45 〇86g 6. The scope of the patent application is to cooperate to provide the third pressure to the third part of the substrate. 14. A grinding head for chemical mechanical polishing, which at least comprises: a base; an elastic film, which Extending under the base to define a pressurizable chamber, the lower surface of the elastic film provides a substrate receiving surface of a substrate, the lower surface includes a first surface to apply a first pressure to the substrate. For a first part and a second surface Applying a second pressure to a second portion of the substrate surrounding the first portion; an edge load ring, the edge load ring holding the second surface, and a contact surface of the edge load ring providing a A third surface to apply-a third load to the third portion of the substrate surrounding the second portion; and a retaining ring which surrounds the edge load ring to hold the substrate at the first, Under the second and third surfaces a 15. A method of grinding a substrate 'The method includes at least: placing a substrate in contact with a grinding surface; applying a first pressure with a first portion of an elastic film To a first portion of the substrate; applying a second pressure to a second portion of the substrate with a second portion of the elastic film; and applying a third pressure to the second portion with an edge load ring On the third part of the base material. This paper size is in accordance with China Standard for Household Standards (CNS) A4 (210 * 297 mm). F 锖 Read the precautions on the back before filling in this page> IIIII II · II! Ministry of Economic Affairs Intellectual Property Bureau employee consumption Printed cooperatives