TW450017B - Composite interconnection elements for microelectronic components, and methods of making same - Google Patents

Composite interconnection elements for microelectronic components, and methods of making same Download PDF

Info

Publication number
TW450017B
TW450017B TW085105623A TW85105623A TW450017B TW 450017 B TW450017 B TW 450017B TW 085105623 A TW085105623 A TW 085105623A TW 85105623 A TW85105623 A TW 85105623A TW 450017 B TW450017 B TW 450017B
Authority
TW
Taiwan
Prior art keywords
core
intermediate connection
elements
scope
sheet
Prior art date
Application number
TW085105623A
Other languages
Chinese (zh)
Inventor
Igor Y Khandros
Gaetan L Mathieu
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Application granted granted Critical
Publication of TW450017B publication Critical patent/TW450017B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys

Landscapes

  • Measuring Leads Or Probes (AREA)

Abstract

Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The elongate element may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. In one embodiment, a hybrid composite interconnection element is formed by mounting a core to an end of an flat elongate element formed from a sheet, and overcoating at least the core, the flat elongate element providing a ""floating"" support for the overcoated core, capable of absorbing non-planarities (tolerances) of an electronic component. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures and contact tips at the end of interconnection elements are described.

Description

450017 經濟部中央標準局貝工消費合作社印製 A7 B7五、發明説明(1 ) 發明埒術背署 本發明係有翡於製造特別是微霣子姐件之電子元件間 的中間速接元件,尤闞於展現彌性之互連元件及其製造方 法0 耜翮由緒案:&gt;前後兹照 本申請案為199 5年5月26日提出申請之共用、共同尚 待核定之美圃專利第08/452 , 255號申請案之部分連續案( «專利案例》狀態:待核定)•因此,尚待核定之申請案 則為1994年11月15日提出申請之共有、共同尚待核定之美 國専利第〇8Λ52,812號申請案之部分連讀案(狀態:待核 定),此一申請案係1 99 3年11月16日提出申請之共有、共 同尚符核定之美國專利第08/152,812號申請案之部分達績 案(狀態:待核定/已核准)。 發明赀备 電子組件》特別是諸如半専«元件(晶片)之微霣子 姐件,通常具有多數個端子(亦指接合塱、霣極、或傳導 區)。為將此等元件鎮姐装成一有的系统(或子系统), 若干的届別元件必須彼此互相轚氣互連,一般逸過一印刷 霣路(或接線)板(PCB、PVB)之中間物。 半導體元件一般配置於一具有多數個K接腳、墊、引 嬢、焊球、及類似物之形式之外部接點的半専酱包装内部 。許多形式的半導賬包裝為已知•且連接包裝内部半専應 元件的技術包括接線、TAPED-AUTOMAED BONDING (TAB) 及其類似者。於某些例子中,半導髖元件提供有提升突瑰 ^n- Amf ^^^^1 14 &gt;^^^1 an fn· - V .yf.1 (許先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 45〇〇 經濟部中央樣率局貝工消費合作杜印装 Α7 Β7 i'發明説明(2 ) 觴點•且藉浮片晶片技術達接至另一電子組件上。 一般而言•電子組件間之互理可分類成Λ相對永久” 及“容易拆卸”之兩個概括的種類。 一個w相對永久”連接的例子為軟焊接。一旦兩個組 件彼此焊接時,去銲接的程序必須用來分開該等元件。線 接合則係另一個“相對永久”連接的例子。 一個“容易拆卸&quot;連接的例子為一電子组件的剛性接 脚由另一窜子組件的弹性插榷元件所收納。此插槽元件在 諸接脚上使用一充分的接觸力(壓力)俾確保該處可靠的 罨氣連接。此處欲造成與一電子組件壓力接觸的互連元件 係指“彈簧”或“彈簧元件”。 彈簧元件係眾所遇知且Μ多樣的形狀及大小呈現。於 現今微電子環境中•十分霈要包括彈簧之所有的互連元件 變得愈來愈小,Μ便大多數此等互連元件能配置於一小的 區域·俾達成對霣子姐件的高密度互連。 製造弹簧元件的習知技術一般涉及衡鍛(衝孔)或牲 刻諸如磷青網或鈹鋸合金或鎘或鎳一鐵一鈷(如kovar) 合金的彌簧材料*俾形成個別的彌簧元件、形成彌簧元件 俾具有一彌簧肜狀(如弧形的等)、M —良好接觸材質( 例如,諸如金的貴金騰•其接觸同類材質時可展現低接觸 霣阻)電嫌弹簧元件、Μ及將多數個此種形狀、電鐮的揮 簧元件造棋成一線性的、一遇邊或一陣列模圖。當將金留 鍍上前述的諸材質時,有時一薄(例如,30 — 50微英吋) 的辣姐隔劑層乃恰當的。 本紙張尺度適用中國國家標準(CNS ) A4規格(2]〇X29·/公釐) —f^i I ^—tlr - I nil— - J (請先閱讀背面之注意事項再填寫本莧) 450017 A7 B7 經濟部中央標準局貝工消费合作杜印裝 五、發明説明(3 ) 種種問題與限制和此等製造揮簧元件的技術一致。 例如•當應用要求多數涠弾簧(中間互連元件)Μ — 微细的間距(例如,ΙΟώ)間距配置時,此等程序即受到 限制。如此微细的間距勢必要每涸彈簧的大小(例如Μ横 截面而言)實質上較小(例如3ώ)於間距。衝床區必須 調節,且將會限制有多少的材料留下俾形成彈簧。最好, 號即使其可Κ相當筆直地衡床與1 ώ一樣小的彈簧,此等 小的尺寸強制能被彈簧儘量使用之接觸力的限度。此對於 彈簧製造區陣列特別嚴厲。 一般而言,需要一特定最小接觸力専致對《子驵件( 例如對於電子組件上的端子)可靠的Μ力接觸。舉例而言 ,一約為15公克(每接觸包括,與2公克一樣小或更小· 及與150公克或更多)的接觸(負栽)力可被爾要來確保 一可靠的電氣連接被施於一電子姐件的端子上,該端子可 能會受其表面上薄膜的污染或其表面上產生腐蝕或氧化。 每俚强簧要求於彈簧材料降伏強度或弹簧元件的尺寸之所 痛的最小接觸力係撙加的。一般的設計而言* 一材料的屈 服強度愈高》愈難加K利用之(例如街床、彎曲等)。且 欲使彈簧更小的要求必需排除使其在檐截面較大。 另一附随習知中間連接元件的限制在於,當運用了硬 材質(如可被用來製造彈簧者)時,則必須要有相當&quot;敵 對的”(如,高溫)程序,諸如硬銲,來安裝中間邃接元 件於一電子姐件的端子上。例如•吾人皆知將觏性接腳硬 銲至相當“經久酎用**的半導俄包裝上。此種“敵對的” (請先聞讀背面之注意事項再填寫本頁) 装. 訂 泉- 本紙張尺度適用中國國家梯準(CNS ) A4規格(210X29?公釐) 45〇〇1 7 Λ7 --------- Β7 五、發明説明(4 ) 程序在就確實相當“脆弱的”之諸如半導體元件的霣子姐 件而言,大致是不補要的(且往往是不可行的)。相對地 *線接合為一相當“友好的”程序的例子,其比硬銲更不 可能損害脆弱的電子組件。软择則為另一個相當“友好的 ”程序的例子。 伴播安裝彈簧於電子組件上的問題在於主要的機械本 性。倘若彈簧安裝於一基材之一端上(其目的在於此一設 計被認為是一固定的物體)•且必須對施於其自由端上的 力產生反應,該“弱壤接”(最弱點•於使用中)將往注 會是彈簧(例如*强簧接合的底座)接上至基材上(例如 *一霣子組件的端子)的點。逭可作為•至少一部分需要 浬用&quot;敵對的Λ程序(如,硬銲)程序K安裝弹簧於基材 上的理由。 另一中間連接元件之難解的問趄·包括揮簧接觸*在 於,注往霣子組件的端子並非完全共面的。缺乏某些合併 櫬構Κ調節此等“公差”(總非平面性)之中間連接元件 將硬壓Κ製造與罨子組件之諸端子一致的接觴®力接觴。 經濟部中央標隼局員工消費合作社印製 (請尤閱讀背面之注意事項再填寫本頁) 下列的美画專利係如所闞切而述者:第5,386,344、5 ,336,380、 5,317,479、 5,086,337、 5,067,007、 4,989,0 69' 4,893,172' 4,793,814' 4,777,564' 4,764,848' 4, 667,219、 4,642,889、 4,330,165、 4,295,700、 4,067,10 4、3,795,037、3,616,532 ' 及 3,509,27 ❶。 發昍檯沭 因此本發明之一目的在於提供製造霣子組件*尤其是 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 450 0 1 Α7 Β7 經濟部中央標準局員工消費合作社印装 五、發明説明(5 ) 微電子組件之中間連接元件的技術。 本發明之另一目的在於提供通於製造對锺子姐件之懕 方接觸的中間建接元件。 本發明之另一目的在於提供一具有受控阻抗的安全固 定中間連接元件的技術。 根據本發明·所掲®者為製造中間速接元件,特別是 彈簧元件的技術,及安裝中間連接元件至轚子組件的技術 。所掲费的技術克服了製造相當小尺寸之弹簧元件時問豳 •卻亦能運用充分大小的的接觸力K確保可靠的中間瘥接 。所揭露的技術亦克服安裝彈簧於諸如半専»元件之電子 組件上時的問題。 根據本發明,一複合中間連接元件的製造係藉安裝一 细長的元件(“核”)至一霣子組件上、將該核定形為猓 簧形狀、及外覆該核Μ強化最终複合中間元件及/或从安 全地固定該最終複合中間元件至霄子姐件上。 如此處所用者,名詞“彈簧肜狀Μ係指實際上任何形 狀的细長元件,其會展現细長元件之一媸(頂)之相對於 腌於該頂上之力作藤性的(恢復的)移動。此包括形狀具 有一或更多彎曲Μ及實質上筆直细長元件的细長元件。 或者是,核在安装於一®子姐件之前即被定形。 或者是*核被安裝或靨一部分之非一電子組件之播牲 基材。播牲基材在定形後被移除,且在外覆重作之前或之 後。根撺本發明之一曆面1具有不同粗表面完工處理的頂 端可Κ配置於中間元件之接觸端上。(亦參見專利案第11 (請先鬩讀背面之注意事項再填寫本頁) Γ 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 4 5 0 0 1 7 Α7 Β7 鯉濟部中央標準局員工消費合作社印装 五、發明説明(6 ) A - 11F 圖)。 於本發明之一實施例中,該核係一具有一相當低產量 強度之“软的”材料,且外覆以一具有一相當高降伏強度 之“硬的”材料。例如,一諸如金線之钦的材料被附著( 如,糖埭接合)在一半専體元件之接合墊上*且被外覆( 如•賴霣化電鍍)Μ—諸如鎳及其合金之硬材料。 相對外覆該核、軍一及多曆外覆層、具有微突出物( 見專利案第5C及5D圖)之“粗”外覆餍、及延伸該梭 整個或僅是部分長度之外覆層乃被描述。於後者情況中, 該核之頂端可合逋地暴露,Μ供作為一霣子組件(亦見專 利案之第5_)的接觴點。 一般而言,由整篇此處所述之内容*名詞“電鍍”係 作為數個外覆該核之實驗之用。其係羼本發明之範疇之內 *該核能被任何合適的技術*包括但非限定於:涉及自水 溶液中沈積材料、電解霣鍍、無霣霣鍍、化學蒸汽沈稹法 (CVD)、物理蒸汽沈稹法(PVD)、造成液體、固體或汽 體分解的過程、及所有此等為一般所通知之沈稹材料之技 術之類似者的不同a程。 一般而言,為外孩該核K一諸如鎳之金覼材枓•電化 步驟較為合宜,尤其是無霣電鍍。 於本發明之另一實施例中*核係一“硬的”材科的细 長元件*固有逋於作為®簧元件•且係安裝於轚子組件之 一端子的一端。該核,及至少該蠛子的鄰接區,係外覆Μ 一會強化固定該核至該端子之材料。Κ此方式,該核毋需 (請先閱讀背面之注意事項再填寫本頁) '裝- 訂 涑 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X29?公釐) 10 經濟部中央標準局貞工消费合作社印製 4 50 01 7 A7 B7五、發明説明(7 ) 在外覆步驟之前即安裝好*且較不可能損害電子组件的諸 步味可被理用來將該核“定位(tack) ”於缠當位置Μ供 後缅的外覆動作。此等&quot;友好的&quot;步驟包括软銲、膠合、 及寅穿硬核之一端至端子之一軟部分内。 其中核係一線之實雎例乃被揭霓。其中核為一平坦分 接頭之實施例亦被揭露。 作為核及外覆雇二者之代表的材科乃被揭露。 在主要的下文中*有鼷以一相當砍(低降伏強度), 大致非常小尺寸(例如,2 . 0 ώ或更小)的核*為開始的 技術乃被描述。容易貼附半導體元件上之软的材料,諸如 金,一般缺乏作為彈簧之充分的弹性能。(此種軟、金屬 的材科主要展現塑性,而非彈性形變。)其它可Κ容易貼 附於半導體元件且具有合逋强性能之軟材料係注往非導霉 性的,如於最彈性的材科的情形中。於任一情形中,所箱 之结檐及電氣的特性能可藉雎於核外之外覆醑而傅給最後 的禊合中間連接元件。最後的複合中間連接元件可被作得 非常小*卻能展現合逋的接觸力。再者•數個此等梭合中 間連接元件能被配置於一激细的(例如,l〇»as)之間隙 中•即使其具有一逭大於該間隙之長度(如· 100 nfls) 複合中間連接元件能被以一超小型比洌製造,例如供 連接器及插槽之用的“微强簧” *具有25微米(tfm)或 更小级的横截面尺寸。此一製造具有以微米而非密耳测量 之尺寸的可靠中間連接,充分地解決現存中間連接技術及 (請·先閱讀背面之注意事項再填寫本盲〈) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 11 4 5 0 0 1 7 Α7 Β7 經濟部中央標準局貝工消費合作社印製 五、發明説明(8 ) 未來區域陣列技術之發展铺求。 本發明之複合中間連接元件展現優越的電氣特性*包 括導電性、软銲能力及低接觸阻力。於許多情況中,中間 連接元件相對所施加之接觸力的偏向畲専致一“塗抹(wi Ping) ”接觸,其有助於確保形成一可靠的接觸。 本發明之額外優點在於以本發明之中間連接元件形成 的連接係可容易卸除的。為造成霣子姐件一纗子的中間埋 接•耽焊係可理擇性的*但一般而言,在系統禰準内較不 合宜。 根據本發明之一雇面*描述作為製造具有受控阻抗之 中間連接元件的技術。此等技術一般有醐塗層(例如,筲 泳)一傳導核或一整個具一介電材料之複合中間連接元件 (絕緣層)、及外覆具一傳導材料之外部曆的介霣材料。 藉將外部層傳導材料接地,結果中閬速接元件能有效地被 屏蔌,且其且胆抗能容易被控制。(亦參見専利案之第10 Κ画)。 根捶本發明之一層面,中間連接元件可Μ預製成一單 一軍元,作為後來附接至電子組件之用。完成此一目的之 不同的技術乃敘述於此。雖非特別涵括於此文獻中,但欲 製埴可Μ庳理安裝多數個涸別中間連接元件至一基材、或 者懸掛多數個個别中間連接元件於一弹性體内或於一支撐 基材上之櫬器可視為相當軍純的。 應可容易瞭解到,本發明之複合中間連接元件大大地 有別於已塗層來強化専轚特性或強化對腐蝕的姐力之習知 (請先閲讀背面之注意事項再填寫本頁) Τ 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 12 A7 B7 4 5〇 cm 五、發明説明(9 ) 技術。 本發明的外覆層特別企矚賈霣強化固定中間連接元件 至®子組件之端子上及/或傳授所铕弹性特性至结果複合 中間連接元件。應力(接觸力)係有鼷中間連接元件之特 別意圖吸收應力之部分。 本發明之一優黏在於此處所逑之程序係通於“預製” 中間連接元件,揮性中間連接元件,諸如於一播牲構件上 ,接著安裝諸中間連接元件於一電子組件上。相對於直接 製造中間連接元件於霣子組件上,本發明減少處理電子組 件過程中的遇期時間。此外,可能會與中間連接元件的製 造结合的屈服問題可因此而自霣子組件分離。舉例而言· 對於一另一方面完全優良、相當昂贵的稹髓鬣路元件被製 造安裝於該處之中間達接元件的過程之錯誤所破壞而言係 虛偽的。安装預製中間連接元件於«子組件上係相當簡單 的•可由下述內容獲得證明。 亦應被諶知的是,本發明提供涵對新穎的製造强簧技 術。一般而言*成果獐簧的操作结構係一霣鍍、而非彎曲 及定肜的產物。此提供使用廣泛材料來建構®簧形狀•及 多種將核之^‘臨時支架(falsowork) ”貼附至霣子姐件 之“友好的”程序的櫬#。作為核之“臨時支架”外的“ 船播(superstructure) ”功用之外覆靥,兩個名詞皆源 自土木工程領域。 本發明之其它目的。特微及優點將因以下說明而變得 明顯。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部中央標準局員工消費合作社印裝 13 450 0 1 7 A7 B7 經濟部中央橾準局貝X消費合作社印製 五、發明説明(10 ) 參考資料琨將針對本案之較佳實腌例詳述之·諸範例 將Μ附鬮說明之。雖然本發明將就此等較佳實賍例作說明 ,吾人應瞭解到·其並不意圈偈限本發明之精神及範晡於 此等特定的實施例中。 第1 Α圖像根據本發明之一實施例*包括一中間連接 元件之一端的蹤向部分的横截面圖; 第1 B圖係根據本發明之另一實施例,包括一中間連 接元件之一端的縱向部分的横截面圔; 第1 C圈係根據本發明之另一實施例*包括一中間連 接元件之一端的縱向部分的横截面: 第1 Dil係根據本發明之另一實施例•包括一中間連 接元件之一皤的嫌向部分的橫截面画; 第1 E圈係根據本發明之另一實施例·包括一中間連 接元件之一纗的擗向部分的横截面騙·· 第2A圓係根據本發明之安裝至一轚子組件之蟠子上 •且具有一多磨毅之中間連接元件的横截面國; 第2B围係根據本發明之具有一多庸骰的中間連接元 件的横截面圖*其中一中間層係一介霣材料; 第2C園係根撺本發明之多數俚安裝至一電子組件( 如,探針卡嵌入)上之中間連接元件的立體圆; 第2D圖係根據本發明,供製造中間連接元件之技術 的示範性第一步驟的檐截面圈: 第2E圖係根據本發明•供製埴中間連接元件之第2 (請先閲讀背面之注意事項再填寫本頁)450017 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, printed A7 B7 V. Description of the invention (1) Invention technology The invention is an intermediate quick-connecting element for the manufacture of electronic components, especially micro-sisters. In particular, it shows the interconnected components that are dim and its manufacturing method. 0 The original case: &gt; This application is based on the common and pending pending Meipu Patent No. 08, filed on May 26, 1995. / 452, Part of 255 consecutive applications ("Patent Case" status: pending approval) • Therefore, the pending applications are the joint and pending pending US patent applications filed on November 15, 1994. Part of the consecutive reading of the application No. 〇52Λ812 (status: pending approval), this application is a joint and jointly approved US patent No. 08 / 152,812 filed on November 16, 1983 Achievement of part of the application (status: pending approval / approved). Inventive Devices Electronic Components, especially micro-electronic devices such as half-cell components (chips), usually have a large number of terminals (also referred to as junctions, poles, or conductive areas). In order to install these components into a system (or subsystem), several components must be interconnected with each other, and usually pass through the middle of a printed circuit (or wiring) board (PCB, PVB). Thing. The semiconductor device is generally arranged inside a half-jam sauce package having a plurality of external contacts in the form of K pins, pads, leads, solder balls, and the like. Many forms of semi-lead packaging are known • and the technology for connecting the semi-response components inside the packaging includes wiring, TAPED-AUTOMAED BONDING (TAB), and the like. In some examples, the semiconducting hip element is provided with a lifting protrusion ^ n- Amf ^^^^ 1 14 &gt; ^^^ 1 an fn ·-V .yf.1 (This page) The paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 450,000. The Central Sample Rate Bureau of the Ministry of Economic Affairs, Shellfish Consumption Cooperation Du printed Α7 Β7 i 'Invention Description (2) The floating wafer technology is connected to another electronic component. Generally speaking, the mutual relationship between electronic components can be classified into two general types: Λ relatively permanent "and" easy to disassemble ". An example of w relatively permanent connection is soft soldering. Once two components are soldered to each other, a de-soldering procedure must be used to separate the components. Wire bonding is another example of a "relatively permanent" connection. An example of "easy to disassemble" connection is that the rigid pins of an electronic component are accommodated by the elastic insertion elements of another channel subassembly. This socket element uses a sufficient contact force (pressure) on the pins. Ensure a reliable radon connection there. The interconnecting elements that are to be brought into pressure contact with an electronic component here are referred to as "springs" or "spring elements." Spring elements are known and present in various shapes and sizes. In today's microelectronics environment, it is very important that all interconnecting components including springs become smaller and smaller, so that most of these interconnecting components can be deployed in a small area. High-density interconnects. Conventional techniques for manufacturing spring elements generally involve forging (punching) or inscriptions of spring materials such as phosphor screens or beryllium saw alloys or cadmium or nickel-iron-cobalt (such as kovar) alloys. Form individual reed elements, form reed elements, have a reed shape (such as an arc), M — good contact material (for example, precious gold such as gold • it can exhibit low contact when it comes in contact with similar materials Obstruction) Electric suspected bomb Element, M, and a large number of such shaped, electric sickle spring elements into a linear, edge-to-edge, or array pattern. When gold is plated with the aforementioned materials, it is sometimes thin (such as , 30-50 microinches) is suitable. The paper size is applicable to China National Standard (CNS) A4 specifications (2) 0 × 29 · / mm) —f ^ i I ^ —tlr-I nil—-J (please read the precautions on the back before filling in this card) 450017 A7 B7 DuPont Packing Cooperate with the Consumers of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of the Invention (3) Various Problems and Restrictions and the Manufacturing of Spring Elements The technology is the same. For example, when the application requires most springs (intermediate interconnect elements) M — fine pitch (for example, 10 μ) pitch configuration, these procedures are limited. Such fine pitch is necessary for each spring The size (for example, in terms of M cross section) is substantially smaller (for example, 3) in the pitch. The punching area must be adjusted and will limit how much material leaves the spring to form a spring. Best, even if it can be quite straight Weighing springs as small as 1 free The small size forces the limit of the contact force that can be used by the spring as much as possible. This is particularly severe for arrays of spring manufacturing areas. In general, a specific minimum contact force is required to cause damage to sub-assemblies (such as terminals on electronic components) Reliable M-force contact. For example, a contact (load) force of about 15 grams (including as little as or less than 2 grams per contact and 150 grams or more per contact) can be guaranteed A reliable electrical connection is applied to a terminal of an electronic component, which may be contaminated by a thin film on its surface or cause corrosion or oxidation on its surface. Each strong spring requires the spring material's drop strength or the spring element's The minimum contact force of the size is increased. Generally speaking, the higher the yield strength of a material, the more difficult it is to use K (such as street beds, bending, etc.). And the requirement to make the spring smaller must be ruled out to make it larger in cross section. Another limitation of the accompanying conventional intermediate connection element is that when using hard materials (such as those that can be used to make springs), there must be quite &quot; hostile &quot; (e.g., high temperature) procedures, such as brazing, Come to install the intermediate connection components on the terminals of an electronic sister. For example, we all know that the flexible pins are brazed to the semi-conducting Russian packaging which is quite durable. This kind of "hostile" (please read the notes on the reverse side before filling out this page). Binding.-Chuanquan-This paper size is applicable to China National Standard (CNS) A4 (210X29? Mm) 45〇〇1 7 Λ7 --------- Β7 V. Description of the Invention (4) The program is generally unnecessary (and often not feasible) in the case of sister-in-law pieces such as semiconductor components that are indeed quite "fragile". of). Relatively ground wire bonding is an example of a fairly "friendly" procedure that is less likely to damage fragile electronic components than brazing. Soft selection is another example of a fairly "friendly" program. The problem with companion mounting of springs to electronic components is the main mechanical nature. If the spring is mounted on one end of a substrate (the purpose of which is to design this as a fixed object) • and it must respond to the force applied to its free end, the “weak soil joint” (weakest point • (In use) The point where the injection will be a spring (such as a base with a strong spring joint) connected to the substrate (such as a terminal of a subassembly).逭 Can be used as a reason for at least part of the 安装 to use a hostile Λ procedure (eg, brazing) procedure K to mount the spring on the substrate. Another difficult question about the intermediate connection element includes spring contact *. However, the terminals directed to the sub-assembly are not completely coplanar. Lack of certain mergers. Intermediate connection elements that adjust for these "tolerances" (total non-planarity). Hard-pressed joints are manufactured to conform to the terminals of the subassembly. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the notes on the back and fill in this page). The following patents for paintings are as follows: 5,386,344, 5,336,380, 5,317,479, 5,086,337, 5,067,007 , 4,989,0 69 '4,893,172' 4,793,814 '4,777,564' 4,764,848 '4, 667,219, 4,642,889, 4,330,165, 4,295,700, 4,067,10 4, 3,795,037, 3,616,532' and 3,509,27 ❶.昍 台 昍 Therefore, one of the purposes of the present invention is to provide manufacturing sub-assemblies. * Especially this paper size applies Chinese National Standard (CNS) A4 (210X297 mm) 450 0 1 Α7 Β7 printed by the staff consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Fifth, the description of the invention (5) the technology of the intermediate connection elements of microelectronic components. Another object of the present invention is to provide an intermediate connection element for making contact with a sister-in-law piece. Another object of the present invention is to provide a technique for safely fixing an intermediate connection element with controlled impedance. According to the present invention, the technology of manufacturing intermediate quick-connecting elements, especially spring elements, and the technology of installing intermediate connecting elements to the sub-assembly. The costly technology overcomes the problem of making relatively small spring elements. • It can also use a sufficient contact force K to ensure a reliable intermediate connection. The disclosed technology also overcomes problems when mounting springs on electronic components such as half-diaphragm »components. According to the present invention, a composite intermediate connecting element is manufactured by installing an elongated element ("nucleus") on a sub-assembly, forming the core into a spring shape, and covering the core to strengthen the final composite intermediate. Element and / or from securely fixing the final composite intermediate element to the Xiaozi sister piece. As used herein, the term "spring-shaped M" refers to an elongated element of virtually any shape that will exhibit one of the elongated elements (top) as being rattan (restored) relative to the force marinated on the top. Move. This includes elongated elements that have one or more curved M and substantially straight elongated elements. Or, the core is shaped before being installed on a child piece. Or the core is installed or partially It is not a sowing substrate for an electronic component. The sowing substrate is removed after being shaped, and before or after the outer cover is reworked. According to one aspect of the present invention, the top surface of the calendar surface 1 has a different rough surface finish treatment. It is arranged on the contact end of the intermediate element. (See also the patent case 11 (Please read the precautions on the back before filling this page) Γ This paper size applies to China National Standard (CNS) Α4 size (210X297 mm) 4 5 0 0 1 7 Α7 Β7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China. 5. Description of Invention (6) (A-11F). In one embodiment of the present invention, the nuclear system has a relatively low output intensity. "Soft" material, and outside Covered with a "hard" material with a fairly high drop strength. For example, a material such as gold thread is attached (eg, glycocalyx) to the bonding pads of half of the carcass element * and is covered (eg • Laihuahua Electroplating) M—hard materials such as nickel and its alloys. Relative to the "coarse" of the core, military and multi-calorie outer coating, with microprojections (see Figures 5C and 5D of the patent case) The outer covering and the outer covering extending the whole or only a part of the length of the shuttle are described. In the latter case, the top end of the core can be exposed in combination, and M is provided as a sub-assembly (see also the patent case). The connection point of the 5th). Generally speaking, the content described here * noun "plating" is used for several experiments covering the core. It is within the scope of the present invention * this Nuclear energy is covered by any suitable technology * including but not limited to: involving the deposition of materials from aqueous solutions, electrolytic thorium plating, thorium-free plating, chemical vapor deposition (CVD), physical vapor deposition (PVD), causing liquids, solids or vapors The process of decomposition, and all these are generally notified Different processes of similar materials. Generally speaking, it is more suitable for the child to use a gold material such as nickel. Electrochemical steps are more suitable, especially for electroless plating. In another embodiment of the present invention, a core is used. A slender element of the "hard" material family * inherently acts as a spring element and is mounted on one end of one of the terminals of the rafter assembly. The core, and at least the adjacent area of the rafter, is covered with M The material that fixes the core to the terminal will be strengthened in a while. This way, the core is not required (please read the precautions on the back before filling out this page) 'Binding-Bookmark This paper size applies to China National Standard (CNS) Α4 specifications (210X29? Mm) 10 Printed by Zhengong Consumer Cooperative, Central Standards Bureau, Ministry of Economic Affairs 4 50 01 7 A7 B7 V. Invention Description (7) Installed before the covering step * and less likely to damage the taste of electronic components It can be used to "tack" the nucleus at the tangent position M for the overburden action. These &quot; friendly &quot; steps include soldering, gluing, and threading one end of the hard core into one of the soft parts of the terminal. One of the first examples of nuclear systems is being exposed. An embodiment in which the core is a flat tap is also disclosed. The materials department, which represents both nuclear and external employment, was revealed. In the main text below, there is a technique that starts with a core that is quite chopped (low yield strength), roughly very small size (for example, 2.0 or less) or less. Soft materials such as gold, which are easily attached to semiconductor elements, generally lack sufficient elastic properties as springs. (This kind of soft and metallic materials mainly exhibits plasticity rather than elastic deformation.) Other soft materials that can be easily attached to semiconductor components and have strong properties are injected into non-fungus, such as the most elastic In the case of wood. In either case, the eaves and electrical characteristics of the box can be overlaid outside the core and given to the final coupling intermediate connection element. The final composite intermediate connection element can be made very small * yet exhibits a good contact force. Furthermore • several of these shuttle intermediate connecting elements can be arranged in a fine (for example, 10 »as) gap even if it has a length larger than the gap (for example, · 100 nfls) compound intermediate The connecting element can be manufactured with an ultra-small size, such as a "micro-strong spring" for connectors and sockets * having a cross-sectional size of 25 micrometers (tfm) or less. This manufacturing has a reliable intermediate connection with dimensions measured in micrometers instead of mils, which fully solves the existing intermediate connection technology and (please read the notes on the back before filling in the blind <) This paper standard applies to Chinese national standards (CNS ) Α4 specifications (210 × 297 mm) 11 4 5 0 0 1 7 Α7 Β7 Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (8) Development of future regional array technology. The composite intermediate connection element of the present invention exhibits superior electrical characteristics * including electrical conductivity, solderability, and low contact resistance. In many cases, the bias of the intermediate connection element relative to the applied contact force results in a "wi Ping" contact, which helps to ensure that a reliable contact is formed. An additional advantage of the present invention is that the connection system formed with the intermediate connection element of the present invention can be easily removed. In order to cause the sister-in-law to bury in the middle, the delay welding is optional *, but in general, it is not appropriate within the system standard. According to one aspect of the present invention, a technique is described as an intermediate connecting element with a controlled impedance. These technologies typically have a plutonium coating (eg, swimming), a conductive core, or an entire composite intermediate connection element (insulating layer) with a dielectric material, and a dielectric material overlying an external calendar with a conductive material. By grounding the conductive material of the outer layer, as a result, the quick coupling element can be effectively shielded, and its impedance can be easily controlled. (See also No. 10K painting in the case of Tongli). Based on one aspect of the present invention, the intermediate connection element can be pre-made into a single military unit for later attachment to an electronic component. The different techniques for accomplishing this are described here. Although not specifically covered in this document, it is necessary to install multiple individual intermediate connecting elements to a substrate or to suspend most individual intermediate connecting elements in an elastomer or a support base. The stoneware on the wood can be considered quite pure. It should be easy to understand that the composite intermediate connection element of the present invention is greatly different from the conventional coatings that have been used to strengthen concrete properties or strengthen the ability to resist corrosion (please read the precautions on the back before filling this page). This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 12 A7 B7 4 50cm. 5. Description of invention (9) technology. The outer coating of the present invention pays special attention to Jia's strengthening and fixing of the intermediate connection element to the terminals of the ® subassembly and / or imparts the elastic characteristics to the resulting composite intermediate connection element. Stress (contact force) is the portion of the intermediate connection element that is specifically intended to absorb stress. One of the advantages of the present invention is that the procedures described here are based on "prefabricated" intermediate connection elements, such as on a sowing member, and then the intermediate connection elements are mounted on an electronic component. Compared with directly manufacturing intermediate connecting elements on the sub-assembly, the present invention reduces the period of time during the processing of electronic components. In addition, yield problems that may be combined with the manufacture of intermediate connecting elements can thus be separated from the subassembly. For example, • It is hypocritical to destroy a completely superior and rather expensive sacroiliac element on the other hand by an error in the process of manufacturing and installing the intermediate access element there. Installation of prefabricated intermediate connection elements on the «subassembly is fairly straightforward. • Proof can be obtained from the following. It should also be understood that the present invention provides novel techniques for manufacturing strong springs. Generally speaking, the operating structure of the fruit spring is a product of plating, not bending and fixing. This provides a wide range of materials for constructing the spring shape • and a variety of "friendly" procedures for attaching the core's "temporary support (falsowork)" to the sister-in-law's part. "Ship structure (superstructure)" functions outside the cover, both terms are derived from the field of civil engineering. Other purposes of the present invention. Features and advantages will become apparent from the following description. This paper size applies Chinese national standards ( CNS) A4 size (210X297mm) (Please read the notes on the back before filling out this page) Order printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 13 450 0 1 7 A7 B7 (5) References for the invention (10) Reference materials, which will be described in detail for the best practice examples in this case. The examples will be attached to M. Although the present invention will explain these better practice examples, I should It is understood that it is not intended to limit the spirit and scope of the present invention in these specific embodiments. The first A image according to an embodiment of the present invention * includes a tracking portion at one end of an intermediate connection element. Sectional view; Figure 1B is a cross-section 圔 of a longitudinal portion including one end of an intermediate connection element according to another embodiment of the present invention; Ring 1C is according to another embodiment of the present invention * including an intermediate connection Cross section of the longitudinal part of one end of the element: The first Dil is according to another embodiment of the present invention. A cross-section drawing of a susceptible part including one of the intermediate connecting elements. The first E-ring is according to another of the present invention. An embodiment. A cross-section of a facing part including one of the intermediate connecting elements. The second 2A circle is according to the present invention, which is mounted on a roller of a roller assembly. The cross section of the 2B wall is a cross-sectional view of the intermediate connecting element with a multi-die according to the present invention * One of the intermediate layers is an intermediary material; The 2C garden is based on the majority of the present invention installed to a The three-dimensional circle of the intermediate connection element on the electronic component (eg, the probe card is embedded); Figure 2D is an eaves section circle according to the present invention, an exemplary first step of the technology for manufacturing the intermediate connection element: Figure 2E is based on The hair • for the second intermediate connecting element made of Zhi (Read Notes on the back and then fill the page)

T 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 14 4 5 0 0 1 7 A7 B7 經濟部中央橾準局貝工消費合作社印製 五、發明説明(11 ) D圖技術的示範性進一步驟的横截面圃; 第2F圖係根據本發明,供製造中間連接元件之第2 E圈技術的示範性第一步》的橫截面圖; 第2G圖係根據本發明,實驗性多數個依第2D — 2 F匾技術製造之個別中間連接元件的桷截面圈; 第2H圖係根據本發明•示範性多數涸依第2D—2 F圃技術及互相M —規定的空間闞係製造之個別中間連接 元件的横截面國; 第2 I圔係根據本發明* 一製造中間連接元件之替代 實施例的横截面圖•顯示一元件之一孅; 第3A圖係根掸本發明之一插入物之一寊施例的横截 面晒; 第3B圖係根據本發明之一插入物之另一賁施例的横 截面豳; 第3C圖係根據本發明之一插入物之另一寊施例的梢 截面圖; 第4 A圃係根撺本發明,於一製造一插入物初步步驟 中,一軟金屬箔的頂平面圖; 第4 B圃係根據本發明,於一後績程序步驟中,第 4A圃之軟金覼萡的横截面圖; 第4C圖係根攆本發明,於一後纊程序步驟中•第 4 A圖之軟金屬萡的立體圖; 第4D_係根據本發明,於一後績程序步驟中,第4 A圖之軟金屬箔作為二電子組件間之插人物的立《圖; (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α·4規格(210 X 297公釐) 15 450017 A7 B7 五、發明説明(12 第5 A圔係根據本發明之一替代實life钶,於一製造一 插入物初步步揉中,一砍金雇箔的頂平面圖; 第5B圖係根據本發明*於一後鑛程序步琢中•第5 A圓之軟金臛箔的立鼉圖; 第5 C圖係根撺本發明 A B之耽金靨箔的立體圈; 第5 D圔係根據本發明 於一後鑛程序步驟中,第5 於一後續程序步驟中*第5 A圔之炊金雇箔作為二霣子組件間之插入物的立通圖; 第6A1I係根據本發明之一替代實施例|於一造插入 件之初步步»中,一砍金腾萡的頂平面酾; 第6B圈係根據本發明,於一後鑛程序步《中,第6 A圓之軟金羼箔的立通豳; 第6C圈係根據本發明 A圖之軟金屬箔的立»圖; 第6 D围係根據本發明 於一後續程序步驟中,第6 於一後鑛程序步賅中,第6 (請先閲讀背面之注意事項再填寫本頁) ,π 經濟部中央標準局員工消費合作社印裝 A圏之软金羼箔作為二霣子组件間之插入物的立»鼷; 第7 A圖係根據本發明之一替代實胞例,於一製造一 插入物初步步嫌中,一炊金雇萡的頂平面麵; 第7B國係根據本發明,於一後績程序步驟中,第7 A圈之软金雇箔作為二電子組件間之插入物的立髓圖; 第8A圖係根據本發明,一特別通合製造個別中間連 術的横截面圖; $根據本發明,另一特別缠合製造個别中間 連接元件:ί 的横截面圈;T This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 14 4 5 0 0 1 7 A7 B7 Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (11) Exemplary further cross section; Figure 2F is a cross-sectional view according to the present invention, an exemplary first step of the second E-ring technology for manufacturing an intermediate connection element; Figure 2G is an experimental view according to the present invention. Sectional loops of a plurality of individual intermediate connecting elements manufactured according to the 2D-2F plaque technique; Figure 2H is according to the present invention. • Exemplary majority relies on 2D-2F garden technology and mutual M-specified space system. A cross-section of an individual intermediate connection element manufactured; 2I 圔 is a cross-sectional view of an alternative embodiment of manufacturing an intermediate connection element according to the present invention * shows one of the elements; FIG. 3A is based on the invention A cross-section of one embodiment of an insert; FIG. 3B is a cross-section of another embodiment of an insert according to the invention; FIG. 3C is another embodiment of an insert according to the invention Example sectional view; 4A root According to the present invention, in a preliminary step of manufacturing an insert, a top plan view of a soft metal foil; and Section 4B is a cross-sectional view of Section 4A of a soft gold raft in accordance with the present invention in a subsequent performance procedure step. Figure 4C is based on the present invention, in a subsequent program step. • A perspective view of the soft metal frame in Figure 4A; Figure 4D_ is a step in a subsequent program, according to the present invention, in Figure 4A. Soft metal foil as the figure between the two electronic components; (Please read the precautions on the back before filling out this page) This paper size applies the Chinese National Standard (CNS) Α · 4 size (210 X 297 mm) 15 450017 A7 B7 V. Description of the invention (12 The 5th A (a) is a top plan view of a gold foil in a preliminary step of manufacturing an insert according to one of the present invention instead of the real life; (5) The present invention * is in the step-by-step process of a post-mining process. • The vertical drawing of the soft gold foil of the 5th A circle; FIG. 5C is a three-dimensional circle based on the gold foil of the AB of the present invention; According to the present invention, in a post-mine process step, the fifth in a subsequent process step * 6A1I is an alternative embodiment of the insert between two sub-assemblies; 6A1I is according to an alternative embodiment of the present invention | In the initial step of a insert », a top plane 砍 of gold is cut; Circle 6B In accordance with the present invention, in the subsequent mining process step "Medium, the 6th round of the soft gold foil foil stand up; the 6C circle is the soft metal foil in accordance with the present invention, the drawing of the A»; Figure 6 D According to the present invention, in a subsequent program step, the sixth in a post-mine program step, the sixth (please read the precautions on the back before filling this page), π Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs The soft gold foil is used as an insert between the two sub-assemblies; Figure 7A is an example of the replacement of a cell according to the present invention. The top plane of 萡; Country 7B is an erection diagram of the soft gold foil of circle 7A as an insert between two electronic components in a subsequent procedure step according to the present invention; FIG. 8A is based on this Invention, a cross-section view of one particular joint manufacturing individual intermediate joint surgery; $ According to the present invention, another particular entanglement system Make individual intermediate connection elements: cross-section rings of ί;

本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 16 五、發明説明(爲) Α7 Β7 經濟部中央樣準局負工消費合作社印製 第係根據本發明,一連接器及一位於插入該連 接器之適邊之罨子組件的横截面圈。 發明誰沭 前述於5 /26/95提出申請之美國第08/452,255虢申請 案(母案)係併入本案參考。本申講案概要地敘述所揭示 的數個技術。 本發明之一重要的層面在於一複合中間《接元件的形 成可Μ核(其可被安装至罨子組件之嬙子上)為開始,然 後外覆該核Κ合癰的材料俾:⑴建立结果複合中間連接元 件之櫬械特性;及/或⑵當該中間連接元件被安装於一霣 子組件之端子上時,安全地固定該中間連接元件於該端子 上。Μ此方式,可製造一彈性的中間連接元件(强簧元件 )•起始於一軟材科的核,其可容易地被定形成一可弹簧 的形吠且易於貼附至甚至最脆弱的電子组件上。鑑於自硬 材料形成彈簧元件的習知技術不易明睐,且可論證反直覺 的,软材科能形成彈簧元件。 第ΙΑ、IB、1C及1D圖繪示*根據本發明,Κ 一般的方式,複合中間連接元之不同的形狀。 下文主要描述展琨彈性鹿之複合中間逋接元件。然而 •應瞭解到,非彈性複合中間連接元件亦羼於本發明範« 之内。 進一步言之,下文主要描述具有一软(容易定形|且 容易藉友好程序附加至锺子姐件上)核,外覆Μ硬(有彈 力的)材料之複合中.間連接元件。然而•核可以是一硬材 請· 先 閱 讀 背 之 注 意 事 項 再 寫 本 頁 訂 本紙張尺度適用中國國家榇準(CNS ) Α4規格(210X297公釐) 17 450 0 1 A7 B7 經濟部中央樣準局貞工消費合作杜印敦 五、發明説明(14 ) 料亦屬於本發明的範《之内*外覆程序主要係安全地固定 中間連接元件至一電子組件之端子上。 於第1 A圈中,霣氣中間連接元件110包括一 “软” 材料(例如*具有一小於40,00(1 psi之降伏強度的材料) 的核112、及一“硬&quot;材料(例如,具有一大於80,000psi 之降伏強度的材料)的般。核112係一细長形(構形)作 為一實質直的懸臂樑,且可以是一具有一 0.0005至0.0020 英吋(0.001英吋=1密耳N25微米(Wm))直徑之引 線。殼114係賴任何逋當的程序,諸如一適當的電鍍程序 (例如,藉電化電鍍),施於已成形之核112上。 第1A圖繪示可能是供本發明之中間連接元件之一最 簡箪暉簧形狀,亦即•對一雎於其頂端llflb之力“ F ”成 一角度直的想樑臂。當此種力被«子組件之一蟠子腌加至 一中間連接元件正作一懕力接觸之處時,該頂嫌之向下( 如所示)偏向將明顧地専致該頂*·以一“塗抹”的動作 ,移遇該皤子。此種塗抹接觸確保一可靠的接觸形成於中 間連接元件與轚子姐件之被接觸的端子之間。 因其“硬度”之故,且薄控制其厚度( 0.00025至0.0 0500英吋),殻114傳授一所锊之彈性能至全部的中間連 接元件110 。以此方式,一種位於諸電子組件(未願示) 間之彌性中間連接能於中間連接元件110之二端ll〇a及110 b之間達成。(於第1A圈中,參考捕號110a係補示中間 連接元件110之一端部,而相對於端11 Ob之實際端並未 顯示)。於接觸電子組件之一嬙子時,中間連接元件11〇 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 18 (請先閲讀背面之注意事項再填寫本頁) 訂 r~~4 5〇 〇 1 7 經濟部中央標準扃貝工消費合作社印裝 A7 五、發明説明(15 ) 受一接觸力(ffi力)所影響,如標示“F”的箭諕所示。 中間連接元件(如,Πβ )將會響應一施加的力而偏 向,該偏向(彈性能)多少取決於中間連接元件之全部彤 狀、於外覆材料ί相對於核之材料)之優勢的(較大的) 降伏強度、Κ及外覆材料之厚度。 於第1 Β画中,霣氣中間連接元件120類似地包括一 軟核122 (比較112 )及一硬殼124 (比較114)。於此 例中,核122被定形成具有兩個彎曲,且因而可被視為S 形。如第1Α圖之例子中,Μ此方式*位於諸霣子組件( 未顧示)間之弭性中間連接元件能於中間連接元件120之 二端120a與12Qb間被達成。(於第1Β画中,參考標號 120a係標示中間連接元件120之一蟠部*而相對於端120b 之實際端並未顬示)。於接觸電子姐件之一端子時•中 閬連接元件120受一接觸力(壓力)所影響•如補示“F w的箭號所示。 於第1 C圖中,霣氣中間邃接元件130類似地包括一 软核132 (比較112 )及一硬殼134 (比較114)。於此 例中,核132被定形成具有一個彎曲,且因而可被視為υ 形。如第1Α圈之例子中·Μ此方式•位於諸罨子姐件( 未蹰示 &gt; 間之弹性中間連接元件能於中間達接元件130之 二端130a與130b間被達成。(於第1C圈中,參考禰號 130a係禰示中間連接元件130之一嬸部•而相對於靖130b 之實際端並未顯示)。於接觸霣子姐件之一斓子時,中間 連接元件13Q受一接觸力(颳力)所影響,如補示 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) • H^. 19 m 4 50 01 7 A7 B7 經濟部中央標準局貝工消費合作社印製 五、發明説明(16 ) 的箭號所示。或者·中間連接元件130能被蓮用Μ作除了 其端130b之蟠處的接觸*如捅示“ F ”之箭號所示。 第1 D治示具有一軟核142及一硬毅144之彈性中間連 接元件的另一實施例。於此例中,中間連接元件140係一 絕對簡單的想樑臂(比較第1 A圖)*其具有一_曲的頂 端140b,受一垂直作用於其級向_之接觸力“F”所影響 〇 第1 E團嫌示一具有一软核152及—硬败154之弹性中 間連接元件之另一實施例。於此例中*中間連接元件150 大致圼“C形”·最好具有一稍微彎曲的頂嫌150b,且適 於作一如播示之箭虢所示之壓力接觸。 應瞭解到·耽核能容易地被定形成任何可彈簧的形狀 •換言之,一種將會使一结果複合中間連接元件響應於一 施加於其頂端上之力而偏向的形狀。舉例言之,核可能被 定形成一傳統的媒圈形狀。然而,一婊圈形狀並不合宜, 乃由於中間連接元件之全部長度及伴陲而來的電専(或類 似者)及在高頻(速度)下搡作時對電路所產生的不利效 果。 殻的財料,或至少一多餍般之一層(下述)具有一顯 然比核之材料更高的降伏強度。因此,在建立最終中間逋 接元件之掮械特性(例如|弹性能)方面,殻使核相形失 色。觳與核之降伏強度比最好至少為2 : 1 *包括至少3 :1及至少5 : 1,且可Μ與10: 1—樣高的比例。亦顯 然可見的是,該般,或至少一多層殺之一外部曆應該覆蒹 I tyti衣 I I 訂 -(請先Μ讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家梯準(CNS ) Α4規格(210X297公釐) 20 5 0 0 1 7 A7 B7 五、發明説明(17 經濟部中央橾率局負工消费合作社印製 該核的端。(然而,母案所描述之實賍例中1核的端係暴 露的,該案中•核必須是可傳導的。) 從一理論的觀點*僅需要最終的複合中間連接元件之 彈性(彈簧形狀)部分外覆Μ硬材料。從此觀點,對於核 的兩端必須被外覆則大致不必要的。然而,以寅際的問題 來看,最好是外覆整個核。外覆核之固定(貼附)至一電 子組件上之一端的特別原因及所產生的優點則更詳细地討 論於下文。 核(112、122、132、142)之合遽材料包括,但並不 限於:金、鋁、矽、鎂及頚似者。使用銀、鈀、鉑;諸如 鉑族金属之元素的金屬或合金亦羼可行。亦能使用由鉛、 錫、絪、鉍、鎘、銻及其等之合金所構成之软銲。 相對將核(媒)之一嫱貼附在一霣子元件之皭子上( 下文會更詳加討論),一般而言,易於接合(使用溫度、 懕力及/或超音波能來達成接合)之任何材料(例如,金 )的線將遘於實腌本發明。任何易於外覆(例如,霣鍍) 之材料,包括非金羼材料*能為核所使用的概念亦邐本發 明之範疇之內。 殼的合逋材料(114、124、134、14 4)包括(且,如 下文所述,對一多靥般之個別層而言)•但並不限於:鎳 、及其合金;網、鈷、锇、及其等之合金;金(尤其是硬 金)及銀,二者皆展現保出的霣流載送能力及優良的接觸 電阻係數特性;鉑族元素;貴金羼及其等之合金;搏及鉬 。於一似软銲處理為爾要的情況中,亦能使用錫、鉛、鉍 .請 先 閲 讀 背 面 之 注 意 事 項 再 填 寫 本 頁 本紙張尺度適用中國國家標準{ CNS ) Α4規格(210X297公嫠) 21 經濟部中央標芈局身工消背合作杜印裝 50 017 A7 _B7_ 五、發明説明(l8 ) 、絪及其等之合金。 埋作為施加此等外覆材料於上述不同之核材料的技 術必然會因應用的不同而有不同。大致而言•霣鍍及無s 霣鍍係較為合宜的技術。然而•一般而言·欲霄鍍金核可 能係反直梵的。根撺本發明的一涸雇面,當霣鍍(尤其是 無霣電電鍍)一鎳般於一金核上,首先施予一薄鋦初始蘑 於該金線桿上•俾促進«鍍的開始。 一示範性的中間連接元件*諸如第1 A- 1 E鼷所治 示者,可能具有一約為0.001英吋之核直徑及0_001英吋之 殻厚度,該中間連接元件因而具有一 0.00 3英时之全部直 徑(亦即,核直徑加二倍殻厚度)。大致而言*該般的此 種厚度將在0.2至5.0(1/5對5)倍於該核之厚度(例如 •直徑)的级數。 一些複合中間連接元件之示範性參數為: (a) —具有1.5密耳之直徑的金線核係定形成具有一 40 密耳全高度及一9密耳半徑之大致為C形曲嫜(比較第1 E匯)係M0.75密耳的鎳電鍍(全直徑=1.5+2x0.75 =3密耳)*且可理擇性地接受一 50撤英时之金的最终外 覆(例如降低及強化接觸阻力)。结果禊合中間建接 元件展現一3 — 5公克/密耳之猓簧常數(k)。使用時 ,3 — 5密耳的偏向會造成9 一 25公克的接觸力。此一例 子就作為一插入物之彈簧而言係有用的。 (b) —具有1.0密耳直徑之金核媒係定形為具有一 35密 耳全高度及一彎曲的懸棵寶形狀•係K 1.25密耳之嫌轚鍍 本紙張尺度適用中國國家標準(CNS〉A4規格(210X297公釐) 22 ----------装------1T------^ (請先閱讀背面之注意事項再填寫本X ) 450017 Α7 Β7 經濟部中央摞準局貝工消費合作社印装 五、發明説明(l3 ) (全直徑= 1.0+2X1.25=3.5密耳),且堪擇性地接受 5fl撤英时之金的最後霉鍍。结果禊合中間連接元件展規一 約3公克/密耳之強簧常數,就一探針之彈簧元件而言係 有用的。 (c) 一具有一 1,5直徑之金核媒係定形為具有一 2 0密耳 全高度及一具約密耳之半徑之大致為S形的曲線,係以 0.75密耳的練或飼轚鍍(全直徑=1,5+2X0.75=3密 耳)。該结果換合中間連接元件展現一值約2—3公克/ 密耳的彈簧常数(k) *且就一安装於一半導«元件上的 铒簧元件而言係有用的。 如下文將被更詳述者,核並不補要一圓的檐截面,但 反而可以是一自一片延伸之平坦的分接頭(具有一方形横 截面)。應瞭解到,如此處所使用者•名詞《tab”並非 要與名詞 w TAB (Tape Automated Boding) ’’ 混淆。 多《躲 第2A画繪示一安裝於一設有一端子214之霄子组件 212上的中間連接元件210的一實施例200 。於此例中* 一软的(例如,金)線核216係接合(附接)於端子214 之一端216a上,係建構俾自端子延伸旦具有一弹簧肜狀( 比較第1B園),旦分別具有一自由端216b。Μ此方式之 接合、定形及分離係«使用線接合装置來達成。在核之媾 216a的接合僅覆蓋蟠子214—相當小部分的暴露表面。 一殼係K置於線核216上,於此例中,其係顯示K多 層的,具有一内層218及外曆220 ,二者皆可Μ被霣鍍和 (請先聞讀背面之注意事項再填寫本頁) -裝. 訂 泉 本紙張尺度適用中國國家標準(CNS )六4洗格(210Χ297公釐) 23 4 5 Ο (Π γ Α7 Β7 經濟部中央標準局貝工消費合作社印製 五、發明説明(2〇 ) 序合適地施加。多雇般之一或多曆係以一硬材料(諸如嫌 及其合金)所形成K傳授一所需之彈性能至中問連接元件 210 。例如,外層220可Μ為一硬材料,而内蹰WTW為一 種將硬材料220電鍍至核材料216上時,充當一缓癬器或 阻隔劑層(或作為一激活画•或作為一货f著層】的材料。 或者•内層218可Μ為硬材料·而外層220可Μ是一種展 現包括電氣傳導性及软銲性之著越罨氣特性的材料(諸如 软金)。當播要软銲料或黃網銲型接觸時,中間連接元件 之外層可Μ分別是鉛鎘軟銲料或金錫黃網材料。 固亩革一端芊h 第2A圈K一大致的方式鑰示,本發明之另一主要特 性,印·彈性中間連接元件能被安全地固定至霉子姐件上 之端子上。中間連接元之接附端210a將受相當的機械應力 所影《,结果一施加於中間連接元件之自由端210b之壓縮 力(筋號“ F ”)。 如第2A圖所搶示*外覆(i'Mk、220)不僅覆蓋核 216,亦覆蒹以一邃缅(非中斷)的方式鄰接於核216之端 子214整個其餘(即,除了接合點216a之外)暴®表面。 此安全且可靠地固定中間連接元件210於皤子上·外覆材 料提供一實質(例如*大於513%)之貢歒予固定结果的中 間連接元件至端子上。一般而言,僅需要外覆材料覆蓋至 少一部分鄰接核的端子。然而,一般較為合宜的是•外覆 材科覆蓋端子之整個剩餘表面。最好是,殼的每一曆皆是 金屬的。 ---------Λ------訂------良 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS &gt; A4規格(210X297公釐) 450017 經濟部中央標隼局貞工消f合作社印製 A7 B7五、發明説明(21 ) 如一一般的設計•核所接附至端子(如,接合)之一 相當小的區域上並不完全缠合調整由於強制於结果複合中 間連接元件之接觸力(“F”)所產生的應力。由於殻覆 篕蟠子之整涸暴®表面(除了包含核端216a附接至端子之 附接處的小區域外)*全部的中間連接结構係牢靠地固定 至饑子上。外覆之附著力及反應接觸力的能力將會造超過 核皤(216a)本身所具備者 如此處所用者,名詞“锩子姐件w (例如,212)包 括•但非限定於··中間連接及插入物基材;半導體晶圃及 棋具,由任可適合的半導級材科•諸如矽(Si)或砷化鎵 (GaSa)所形成;產物中間連接插槽;测試插槽;锇牲構 件、元件及基材•如本案所述;半導體包裝•包含陶磁及 塑膠包裝、及晶片載體;及連接器。 本發明之中壯連接元件特別逋用為: ♦直接安裝中間連接元件至矽棋具之*消除有半導體 包裝的需要; 離中間連接元件如探針般自基材(下文將詳述之)延 伸供測試霣子組件之用;及 參插入物之中間連接元件(下文詳述之)。 本發明之中間連接元件獨特之處在於其可自一硬材料 的櫬械特性(例如,高降服強度)中獾利,而不受限於硬 材料伴随之典型不良的接合特性。如母案所述,此一特黏 使殼(外覆)作用為核之一“臨時支架”上的“船楼&quot;的 事實大為可行•該二名詞皆借自土木工程領域。此大大有 ---------裝------訂------泉 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度通用中國國家標準(CNS ) A4規格(2!〇X 297公釐) 25 450017 經濟.那中央樣準局貝工消費合作社印裝 A7 B7五、發明説明(22 ) 別於習知技術的甯被的中間連接元件,其中罨鍍係作為一 保護(如,抗腐胜)的塗曆之用》且大致是無法溥授所霈 之懺械特性給中間速接结構。且此的確為一顯著的相對於 任何非金羼、抗腐鈾外覆層,諸如陁於電氣中間連接之苯 并三氮唑(BTA)。 本發明之多數傾優黏在於多數個分立的中間連接结構 係容易形成於基材上者,自不同準位*諸如一 PCB具有一 去耦接罨容至高於基材之一相同高度,所Μ其等之自由斕 彼此共平面。此外•根據本發明之中間連接元件之電氣及 機械特性(例如•塑性及彈性)皆容易遑合多種特定的應 用。例如I於一給定的應用中可能補要中間建接元件同時 展琨出塑性及弹性偏向。(塑性偏向可能被需要用Μ調節 被中間達接元件所互連之姐件中的總平面性當薄要獮 性動作時,中間連接元件必須產生一臨界最小值的接觭力 Κ完成可靠的接觸。亦有利的是中間連接元件形成與一轚 子組件之端子的塗抹接觸,由於接觸表面上之混嫌物污染 物膜的偁然出現。 若干特性詳述於本案中,包括》但非限定於:製埴中 間連接元件於犧牲基材上;驵傳输多數個中間連接元件至 一電子組件;提供具接觸端之中間連接元件,最好具有粗 表面完工;理用中間連接元件於一霣子組件上Μ形成與電 子組件暫時*然後永久的連接;配置諸中間建接元件Μ在 其等之一端與其等之相對端具有不同的空間;於與製造中 間連接元件相同的程序中製造彈簧夾及對隼銷;運用中間 ----------^------1Τ------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(2Ϊ0Χ297公釐) 26 450017 Α7 Β7 經濟部中央標準局貝工消费合作社印装 五、發明説明(23 ) 連接元件以調節被連接之組件間的热膨脹的差異;排除不 連績半専髖包裝(諸如SIMMs的)的铺要;及S擇性地软 銲猓性中間連接元件(彌性接觸结構)° 眘埤的昍抗 苐2B圖顯示具有多曆之禊合中間連接元件22G 。中 間埋接元件220之最内部(内部细長傳導元件)222係一 未塗層核或已被外覆之核•如上述。最内部222的端22 2b 係Μ—合適的光軍材科(未顯示)所摞識。一介霣雇224 係以電泳步驟施加於最內部222上。一傅専材科之外曆226 係施加於介罨層224上》 使用時,將外層226電氣接地將會造成中間埋接元件 22 0具有受控阻抗。一介轚層224之示範性材料係一聚合材 料,以任何的方式腌於任何適合的厚度(例如· 0 . 1 - 3.0 密耳)上。 外曆22 6可以為多雇的。例如*最内部222係一未塗層 之核的例子中,至少一層外曆226係一揮簧材料,當有需 要全部的中間連接元件展現镡性時。 傑針卡捆入 第2C圖繪示一實施例23Q ,其中多數個(所示六個 )中間連接元件231…236係安装於一電子姐件24Q之一 ^ —--h_ 表面上,諸如一探針卡插入(一Μ傅統方式安装至一探針 卡之副總成)。探針卡插入之諸媾子及傳導軌跡為說明濟 晰起見,係排除於此_之外。丄… 接端2 …236a起始於一第一間隙(空間),諸如一 0·01 ---------f------ΐτ------..A (請先閣讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家榡準(CNS &gt; A4規格(210X297公釐) 27 4 5〇〇 A7 B7 經濟部中央梯準局貝工消费合作社印装 五、發明説明(24 ) 0英吋的間隙。中間連接元件231…236係定形及/或定向 K便其等之自由端(頂)在一第二、更细的間隙内,諸如 0.00 5英时。從一間隙至另一間隙形成中間接合之中間接 合總成典型係指為“空間變換”。 如所编示•所有此處所揭露之實施例*雖僅有一中間 理接元件可以顯示,本發明可應用於製造多數個Μ彼此規 定之空間Μ係配置之中間連接組件,諸如於一遇邊棋圖或 於一方形陣列棋匾。 稗某材的使用 直接安装中間連接元件至霣子姐件之端子上已於上文 討諭過。一般而言》本發明之中間連接元件能被製造於, 或被安裝至包括儀牲座之任何合逋基材的合適表面上。 注意專籾案,其描述,例如對於第11Α — 11F之製造 多數®中間速接结構(例如*彈性接觭结構)作為分離且 不同結構供安裝至轚子組件上,且其描述有Μ第12Α - 12 C安装一播牲基材(載體)然後轉移該多数钃中間連接元 件至一電子組件上。 第2D—2F编示供使用一犧牲基材製造多數個具有 預塑端结構之中間連接元件之用的技術。 第2 D编示技術250之第一步驟,其中光軍材料252之 一棋型層係施加在犧牲基材2 54之一表面上。犧牲基材254 可从是薄(1一1〇密耳)的網或鋁箔*賴由例子·光軍材 料252可Μ為普通光阻。光罩雇252係鏞型為具多數涸(所 示有三個)在位置256a、256b、256c的開口,在該處,需 I---------种衣-------IT------^ (請先閱讀背面之注^^項再靖寫本!) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 28 4 50 0 1 7 經濟部中央標準局貝工消費合作社印裝 A7 B7五、發明説明(25 ) 要製埴中間連接元件。位置256a、2 5 0b及256c,於此例中 ,係可比得上霣子姐件之端子。位置256a、2 56b及2 56c最 好於上階段處理成具有一粗或有特性的表面结構。如所示 ,此可以一懕花工具257M楢械的方式在箔254内之位置25 6a、2 5 6b及2 5Sc處形成低降而完成之。或者_在此等位置 之箔的表面能Μ化學蝕刻的方式以具有表面结構。任何通 於完成此一般目的的技術皆羼於本.發明之範國之内*例如 噴砂法、鎚平及類似者。 接著,多數個(此顯示一個)傅導端结構258係形成 於各位置(如· 256 b)處,如第2Ε國所示。此可用任何 逋合的技術•諸如電鍍,完成之,且及可Μ包括具有多靥 材料之端结構。例如,端结構258可Μ具有一薄(如,10 - 100微英时)之施於櫬牲基材上之鍊的阻隔層*接著為 一薄(如,1G微英时)層的软金*接著為一薄(如,20微 英吋)曆的硬金*接著一相當厚(如* 20(5微英时)的練 •最後為薄(如,10D撖英吋)的软金。一般而言*第一 薄阻隔曆的鎳係作為保護後績曆金免於被基材2 54的材料 (如•鋁、飼)“毒害” •此相當厚的鎳層係作為提供強 度至可容易接合之端结構者。本發明不限於任何端结構如 何形成於«牲基材上的項目,因為此等項目食因應用之不 闻而不同。 如第2Ε臞所示,多數傾(此顯示一僩)供中間連接 元件之用的核260可Μ形成於端结構258上·諸如賴任何將 一軟線核接合至上述電子組件之端子的技術。核26Q接著 ---------矣------ΐτ------# 1 (诗先閲讀背面之注意事項再填寫本頁) 本紙張尺度逋用中國國家標準 ( CNS ) Α4規格(210Χ297公釐) 4 5〇 〇 A7 B7 經濟部中夬榇準局員工消費合作社印製 五、發明説明(26 ) W—最好是硬的金靨262 Μ上述之方式外覆之,且光罩材 料252接著被移除•結果多数届分立的中間連接元件264安 裝至播牲基材的表面上,如第2F圃所示。 Μ —類似於至少覆螢如第2Α圖所述之端子(214) 之鄰接區域之外覆材料26 2牢靠地固定核2 6Q至其等相對的 端结構2 58,且若有霈要,傳授彈性特性至最终中間連接 元件2664。如見於専利案,該多數涸安裝至馕牲基座的中 間連接元件可以為組傳輸至一霄子組件之諸端子上。或者 ,可採用二個頗分岐的路徑。 如第2G_所嬢示,《由任何逋合之步费*諸如S擇 的化學牲刻*播牲基材254可簡單地被移除。因為多數薄 擇的化學蝕刻步驟將舍以一适大於一其它材料的速率蝕刻 一材料,且其它材料可以稍微於此步驟中被触刻•此一現 象則有利地被浬用以與移除犧牲基材同時移除端结構中薄 鎳阻隔曆。 然而·若霈要*薄辣阻隔雇能於一後獼的蝕刻步骤被 移除。此造成數個(此顧示三個&gt; 中間連接元件個別、分 離、單一的中間連接元件204·如虛266所標示者》其可》 後被安裝(賴諸如砍焊或硬銲的方式)至霣子組件上之諸 端子上。 可提及的是外覆材料亦可稍微地於移除懾牲基材及/ 或薄阻隔曆之程序中稍微變薄。然而,此情形最好不要發 生0 為防止外覆的薄化,較佳利用金薄曆•或者如在約20 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 30 ----------裴-- (請先閱讀背面之注意事項再填寫本頁)This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) 16 V. Description of the invention (for) Α7 Β7 Printed by the Consumers Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs According to the present invention, a connector and a The cross-section ring of the rafter subassembly located on the right side of the connector. Who Invented? The aforementioned US Application No. 08 / 452,255 filed on 5/26/95 (the parent case) is incorporated herein by reference. This application note outlines several of the technologies disclosed. An important aspect of the present invention is that a composite intermediate element is formed to form a core (which can be installed on the core of the core assembly), and then the core material is covered by the core 俾: As a result, the mechanical characteristics of the composite intermediate connection element; and / or, when the intermediate connection element is mounted on a terminal of a sub-assembly, the intermediate connection element is securely fixed to the terminal. In this way, an elastic intermediate connection element (strong spring element) can be manufactured. Starting from a core of a soft material family, it can be easily formed into a spring-shaped bark and easily attached to even the most vulnerable Electronic components. In view of the fact that the conventional technique of forming spring elements from self-hardening materials is not easy to favor, and it can be demonstrated that counter-intuition, soft materials can form spring elements. Figures IA, IB, 1C, and 1D show * According to the present invention, the general shape of the K, the different shapes of the composite intermediate link. The following mainly describes the composite intermediate joint element of the elastic deer. However, it should be understood that inelastic composite intermediate connection elements are also within the scope of the present invention. Further, the following mainly describes a composite intermediate connecting element having a soft core (easy to shape | and easy to attach to the sister-in-law by a friendly program), and covered with a hard (elastic) material. However, the core can be a hard material. Please read the precautions on the back before writing this page. The paper size is applicable to China National Standards (CNS) Α4 specifications (210X297 mm) 17 450 0 1 A7 B7 Central Ministry of Economic Standards Duzhen Dun, Consumer Cooperation of the Bureau of Industry, V. Explanation of the Invention (14) The material also belongs to the scope of the present invention. The "inner * outer covering procedure" is mainly used to securely fix the intermediate connection element to the terminal of an electronic component. In circle 1A, the radon intermediate connecting element 110 includes a "soft" material (such as a core 112 having a material having a drop strength of less than 40,00 (1 psi), and a "hard" material (such as Material with a drop strength greater than 80,000 psi). The core 112 is an elongated (configuration) as a substantially straight cantilever, and may be a material having a 0.0005 to 0.0020 inch (0.001 inch = 1 mil N25 micron (Wm)) diameter lead. The shell 114 is based on any suitable procedure, such as an appropriate electroplating procedure (eg, by electroplating), onto the formed core 112. Figure 1A This may be one of the simplest spring-spring shapes for the intermediate connection element of the present invention, that is, a beam arm that is straight at an angle to the force "F" held at its top llflb. When this force is used by one of the «sub-assemblies" When the dumpling is marinated and added to an intermediate connection element, the top is distorted downward (as shown), and the top will be directed to the top. * · Use a "smear" action to move Meet the cricket. This smearing contact ensures a reliable contact is formed in the intermediate connection element And the contacted terminals of the sister-in-law piece. Because of its "hardness" and its thinness controls its thickness (0.00025 to 0.0 0500 inches), the shell 114 imparts a flexible elasticity to all the intermediate connection elements 110. In this way, a kind of indirect intermediate connection between electronic components (not shown) can be achieved between the two ends 110a and 110b of the intermediate connection element 110. (In the circle 1A, reference capture No. 110a refers to one end of the intermediate connection element 110, and the actual end relative to the end 11 Ob is not shown.) When contacting one of the electronic components, the intermediate connection element 11 applies this Chinese paper standard ( CNS) A4 specification (210X297mm) 18 (Please read the precautions on the back before filling this page) Order r ~~ 4 5〇00 7 Printed by the Central Standard of the Ministry of Economic Affairs, Cooper Cooperative, A7, 5. Description of the invention ( 15) Affected by a contact force (ffi force), as shown by the arrowhead marked "F". Intermediate connecting elements (eg, Πβ) will be biased in response to an applied force, and the bias (elastic energy) depends on how much In the middle of all connecting elements, The advantage (larger) of the covering material (relative to the material of the core) is the drop strength, K, and the thickness of the covering material. In the first drawing, the radon intermediate connection element 120 similarly includes a soft core 122 ( Comparison 112) and a hard shell 124 (Comparison 114). In this example, the core 122 is determined to have two bends, and can therefore be regarded as an S-shape. As in the example in Figure 1A, M this way * is located in The flexible intermediate connection element between the sub-assemblies (not shown) can be achieved between the two ends 120a and 12Qb of the intermediate connection element 120. (In the first drawing, the reference numeral 120a designates one of the cymbals * of the intermediate connection element 120, and the actual end relative to the end 120b is not shown). When contacting one of the terminals of the electronic component • The connecting element 120 is affected by a contact force (pressure). As shown by the arrow “F w.” In Figure 1C, the gas is connected to the middle element. 130 similarly includes a soft core 132 (comparative 112) and a hard shell 134 (comparative 114). In this example, the core 132 is determined to have a bend, and can therefore be regarded as a υ. As in circle 1A In the example · M this way • The elastic intermediate connection element located between the sister-in-law pieces (not shown) can be achieved between the two ends 130a and 130b of the intermediate connection element 130. (In the circle 1C, reference No. 130a shows a part of one of the intermediate connecting elements 130, and the actual end relative to Jing 130b is not shown.) When contacting one of the sister-in-law pieces, the intermediate connecting element 13Q receives a contact force (scratching Force), such as supplementary note that this paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling this page) • H ^. 19 m 4 50 01 7 A7 B7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, V. Invention Description (16) Alternatively, the intermediate connection element 130 can be used by the lotus to make contact except at its end 130b. * As shown by the arrow "F". The first D rule has a soft core 142 and a hard core 144. Another embodiment of the elastic intermediate connection element. In this example, the intermediate connection element 140 is an absolutely simple beam arm (compare Fig. 1A) * which has a curved top 140b, which is subjected to a vertical action on it Affected by the contact force "F" of the step_. The 1st E group suspects another embodiment of an elastic intermediate connection element with a soft core 152 and -hard 154. In this example, the intermediate connection element 150 is roughly "C-shape" · It is best to have a slightly curved tip 150b, and it is suitable for pressure contact as shown in the arrow of the broadcast. It should be understood that the delay core can be easily formed into any springable shape • In other words, a shape that will bias a result composite intermediate connection element in response to a force applied to its tip. For example, the core may be set to form a traditional media shape. However, a loop shape Not suitable due to the full length of the intermediate connection element Accompanying electricity (or similar) and the adverse effects on the circuit when operating at high frequencies (speeds). The property of the shell, or at least one of the layers (described below) has a Obviously higher yield strength than core material. Therefore, the shell discolors the core in terms of establishing the mechanical properties (e.g., elastic energy) of the final intermediate bonding element. The ratio of yield strength to the core is preferably at least 2 : 1 * Including at least 3: 1 and at least 5: 1, and the ratio of M to 10: 1 is the same. It is also obvious that the external calendar should be overlaid like this or at least one multilayer tyti clothing II order- (Please read the precautions on the back before filling in this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) 20 5 0 0 1 7 A7 B7 V. Description of the invention ( 17 The Central Government Bureau of the Ministry of Economic Affairs printed the core end of the Consumer Cooperatives. (However, in the case described in the mother case, the core of the 1 core is exposed. In this case, the core must be conductive.) From a theoretical point of view * only the elasticity of the final composite intermediate connection element (spring Shape) part is covered with M hard material. From this point of view, it is generally unnecessary to have both ends of the core covered. However, in terms of interpersonal issues, it is best to cover the whole core. The special reasons for the fixation (attachment) of the external review to one end of an electronic component and the resulting advantages are discussed in more detail below. Composite materials of nuclear (112, 122, 132, 142) include, but are not limited to: gold, aluminum, silicon, magnesium, and the like. The use of silver, palladium, platinum; metals or alloys of elements such as platinum group metals are also not feasible. Soft solders made of lead, tin, thallium, bismuth, cadmium, antimony and their alloys can also be used. Compared to attaching one of the nuclear (medium) plutonium to the puppet of a pupal element (discussed in more detail below), in general, it is easy to join (using temperature, pressure, and / or ultrasonic energy to achieve bonding ) Of any material (for example, gold) will simmer in the present invention. Any material that is easy to cover (for example, thorium plating), including non-metallic thorium materials *, can be used as a nuclear concept and is within the scope of this invention. Composite materials for the shell (114, 124, 134, 14 4) include (and, as described below, for a multiplicity of individual layers), but are not limited to: nickel, and its alloys; mesh, cobalt , Rhenium, and other alloys; gold (especially hard gold) and silver, both of which show the guaranteed current carrying capacity and excellent contact resistivity characteristics; platinum group elements; precious gold rhenium and others Alloy; stroke and molybdenum. In a situation where soldering is essential, tin, lead, and bismuth can also be used. Please read the precautions on the back before filling out this page. This paper applies the Chinese national standard {CNS) A4 size (210X297mm) 21 Ministry of Economic Affairs, Central Bureau of Standards, Industry, Labor and Cooperation, Du Duan 50 017 A7 _B7_ V. Invention Description (18), rhenium, and other alloys. The technique of burying these covering materials in the different nuclear materials mentioned above will inevitably vary depending on the application. Generally speaking, 霣 and 霣 -free 霣 plating are more suitable technologies. However, in general, the gold-plated core may be counterproductive. According to a working surface of the present invention, when the electroplating (especially electroless plating) is nickel-like on a gold core, a thin initial mushroom is first applied to the gold rod. Start. An exemplary intermediate connection element *, such as those shown in Sections 1 A-1 E 鼷, may have a core diameter of about 0.001 inches and a shell thickness of 0-001 inches. The intermediate connection element thus has a 0.003 inch The full diameter of time (ie, the core diameter plus twice the shell thickness). Broadly speaking * such thicknesses will be in the order of 0.2 to 5.0 (1/5 to 5) times the thickness of the core (eg, • diameter). Exemplary parameters of some composite intermediate connection elements are: (a)-a gold wire core with a diameter of 1.5 mils is determined to form a substantially C-shaped curved ridge with a full height of 40 mils and a radius of 9 mils (comparison Section 1 E) is a nickel plating of M0.75 mils (full diameter = 1.5 + 2x0.75 = 3 mils) * and can optionally accept a final overcoat of gold at 50 withdrawals (eg reducing And strengthen contact resistance). As a result, the coupling element in the middle exhibits a spring constant (k) of 3-5 g / mil. In use, a deflection of 3 to 5 mils will cause a contact force of 9 to 25 grams. This example is useful in terms of a spring as an insert. (b) —The gold core media with a diameter of 1.0 mil is shaped as a suspended tree with a full height of 35 mils and a curved shape. • It is suspected to be K 1.25 mils. The paper size is applicable to Chinese national standards (CNS 〉 A4 size (210X297mm) 22 ---------- Installation ----- 1T ------ ^ (Please read the precautions on the back before filling in this X) 450017 Α7 Β7 Printed by Shellfish Consumer Cooperative of Central Bureau of Standards of the Ministry of Economic Affairs. 5. Description of Invention (l3) (full diameter = 1.0 + 2X1.25 = 3.5 mils), and optionally accept the final mold plating of gold when 5fl withdrawal The result is that the intermediate connecting element has a strong spring constant of about 3 g / mil, which is useful for a spring element of a probe. (C) A gold core medium with a diameter of 1,5 is shaped. It is a roughly S-shaped curve with a full height of 20 mils and a radius of about mils. It is plated with 0.75 mils of training or feeding (full diameter = 1,5 + 2X0.75 = 3 mils) Ear). This result shows that the intermediate connecting element exhibits a spring constant (k) of about 2-3 g / mil * and is useful for a reed element mounted on a half-conductor element. As follows will be In more detail, the core does not require a round eave section, but can instead be a flat tap (which has a square cross-section) that extends from a piece. It should be understood that as the user uses herein, the term "tab" is not It is to be confused with the noun w TAB (Tape Automated Boding) ”. The second drawing hides an embodiment 200 of an intermediate connection element 210 installed on a sub-assembly 212 provided with a terminal 214. In this example, Medium * A soft (for example, gold) wire core 216 is joined (attached) to one end 216a of the terminal 214, which is constructed from a terminal extending from the terminal and has a spring-like shape (compare 1B garden), each having a Free end 216b. The joining, shaping and disengaging system in this way «is achieved using a wire bonding device. The bonding at the core 媾 216a covers only the mule 214-a relatively small exposed surface. A shell K is placed at the core of the line On 216, in this example, it shows K multilayers, with an inner layer 218 and an outer calendar 220, both of which can be plated and coated (please read the precautions on the back before filling out this page)-installed. The size of the paper used for the book is applicable to the Chinese national standard (C NS) 6 4 grids (210 × 297 mm) 23 4 5 Ο (Π γ Α7 Β7 Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. The invention description (2)) The sequence is appropriately applied. One of the more employed or The multi-calendar system uses K formed by a hard material (such as its alloy) to impart a required elastic energy to the intermediate connection element 210. For example, the outer layer 220 may be a hard material, while the inner WTW is a hard material When the material 220 is plated on the nuclear material 216, it acts as a material for a ringworm retarder or a barrier layer (either as an activation picture or as a cargo landing layer). Or • The inner layer 218 may be a hard material and the outer layer 220 may be a material (such as soft gold) that exhibits more gaseous properties including electrical conductivity and solderability. When soldering or yellow mesh soldering is required, the outer layers of the intermediate connection elements may be lead-cadmium solder or gold-tin yellow mesh materials, respectively. One end of Gumu leather 芊 h 2A circle K is shown in a rough way. Another main feature of the present invention is that the printed-elastic intermediate connecting element can be securely fixed to the terminal on the mold. The attachment end 210a of the intermediate connection element will be affected by considerable mechanical stress. As a result, a compressive force (rib number "F") applied to the free end 210b of the intermediate connection element. As shown in Figure 2A * The outer cover (i'Mk, 220) covers not only the core 216, but also the entire rest of the terminal 214 adjacent to the core 216 in a sloppy (non-disruptive) manner (ie, except for the junction Outside 216a) Storm® surface. This securely and reliably fixes the intermediate connection element 210 on the rafter. The covering material provides a substantial (for example, * greater than 513%) to the intermediate connection element that is fixed to the terminal. In general, only a portion of the adjacent core's terminals need to be covered with a covering material. However, it is generally more suitable to cover the entire remaining surface of the terminal. Preferably, each calendar of the shell is metallic. --------- Λ ------ Order ------ Good (please read the notes on the back before filling this page) This paper size applies to Chinese national standards (CNS &gt; A4 specifications (210X297 mm) 450017 A7 B7 printed by Zhengong Consumer Co., Ltd. of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (21) As a general design • The nuclear laboratory is attached to a relatively small area of the terminal (eg, joint) The incomplete entanglement adjusts the stress due to the contact force ("F") forced on the resulting composite intermediate connection element. Due to the integral surface of the shell-covered rafters® surface (except that includes the core end 216a attached to the terminal Outside the small area of the attachment) * All the intermediate connection structures are firmly fixed to the hungry. The overlying adhesion and ability to respond to contact forces will exceed those of the nuclear plutonium (216a) itself as here User, the noun "锩 子 姐 ww (eg, 212) includes, but is not limited to, intermediate substrates and insert substrates; semiconductor crystal gardens and chessware, by any suitable semiconducting material department such as silicon (Si) or gallium arsenide (GaSa); product intermediate connection slot; test slot; 锇Components, components and substrates • As described in this case; semiconductor packaging • Ceramic ceramic and plastic packaging, and chip carriers; and connectors. The Zhuang connection element in the present invention is particularly useful as: ♦ directly install the intermediate connection element to the silicon chess piece * Eliminates the need for semiconductor packaging; the intermediate connection element extends like a probe from the substrate (described in detail below) for the test sub-assembly; and the intermediate connection element of the reference insert (described in detail below) The intermediate connecting element of the present invention is unique in that it can benefit from the mechanical properties (for example, high drop strength) of a hard material, without being limited by the typical poor joining characteristics associated with hard materials. As mentioned, the fact that this special sticky shell (overlay) acts as a "ship building" on one of the "temporary supports" of the core is very feasible. • Both terms are borrowed from the field of civil engineering. This greatly has- ------- Installation ------ Order ------ Quan (Please read the precautions on the back before filling this page) This paper standard is in accordance with Chinese National Standard (CNS) A4 specification (2! 〇X 297 mm) 25 450017 economy. A7 B7 printed by the Bureau Cooperative Consumer Cooperative Co., Ltd. 5. Description of the invention (22) The intermediate connecting element is different from the conventional technology, in which the tin plating system is used as a protective (such as anti-corrosion) coating calendar. It is generally impossible to impart the mechanical properties of the intermediate quick-connect structure. And this is indeed a significant relative to any non-metallic, anticorrosive uranium coating, such as benzotriazole that is connected to the electrical intermediate. (BTA). Most of the advantages of the present invention lies in the fact that a plurality of discrete intermediate connection structures are easily formed on the substrate, from different levels * such as a PCB with a decoupling capacity higher than one of the substrates. The heights, and their free degrees, are coplanar with each other. In addition, the electrical and mechanical characteristics of the intermediate connection element according to the present invention (e.g., plasticity and elasticity) are easily adapted to a variety of specific applications. For example, in a given application, the intermediate connection element may be supplemented to simultaneously exhibit plasticity and elasticity. (The plastic deviation may be required to adjust the overall planarity in the sister piece interconnected by the intermediate contact element when M is thin. When the intermediate action is performed, the intermediate connection element must generate a critical minimum contact force. Contact. It is also advantageous that the intermediate connection element forms a smearing contact with the terminals of a stack of sub-assemblies, due to the sudden appearance of a mixed contaminant film on the contact surface. Several characteristics are detailed in this case, including "but not limited to" Yu: making intermediate connection elements on a sacrificial substrate; transmitting most intermediate connection elements to an electronic component; providing intermediate connection elements with contact ends, preferably with a rough surface finish; using intermediate connection elements in a stack The sub-assembly M forms a temporary * then permanent connection with the electronic component; the intermediate building elements M are arranged to have different spaces at one of their ends and their opposite ends; the spring clip is manufactured in the same procedure as the intermediate connection element And counter-offering; using the middle ---------- ^ ------ 1Τ ------ ^ (Please read the precautions on the back before filling out this page) This paper size applies to China country Standard (CNS) Α4 specification (2Ϊ0 × 297 mm) 26 450017 Α7 Β7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperative Co., Ltd. 5. Description of the invention (23) Connection elements to adjust the difference in thermal expansion between the connected components; exclude Consecutive layout of semi-concrete hip packages (such as SIMMs); and selective soldering of intermediary intermediate connection elements (difficult contact structure) ° Careful anti-resistance 2B image shows multi-calendar joints Connection element 22G. The innermost (internally elongated conductive element) 222 of the intermediate embedding element 220 is an uncoated core or an over-cored core as described above. The end 22 2b of the innermost 222 is M—suitable light Known by the Military Materials Division (not shown). A medium 224 is applied to the innermost 222 by electrophoresis steps. A 226 degree is applied to the medium layer 224. When used, the outer layer 226 is electrically grounded. This will cause the intermediate buried component 22 0 to have a controlled impedance. An exemplary material for the dielectric layer 224 is a polymeric material, marinated in any suitable thickness (eg, · 0.1-3.0 mils) in any manner. Foreign calendar 22 6 can be overemployed For example, in the example where the innermost 222 is an uncoated core, at least one layer of the outer calendar 226 is a spring material. When all the intermediate connecting elements are required to show the elasticity. The needle card is bundled in Figure 2C to show a Embodiment 23Q, in which most (six shown) intermediate connecting elements 231 ... 236 are mounted on one of an electronic sister piece 24Q ^-h_ surface, such as a probe card inserted To the vice assembly of a probe card). The inserts and conduction tracks of the probe card are excluded from this for the sake of clarity. 丄 ... Terminal 2… 236a starts at a first Gap (space), such as a 0 · 01 --------- f ------ ΐτ ------ .. A (Please read the precautions on the back before filling this page) This paper size applies to China National Standards (CNS &gt; A4 size (210X297 mm) 27 4 500A7 B7 Printed by the Central Laboratories of the Ministry of Economic Affairs of the Bayer Consumer Cooperatives. 5. Description of the invention (24) 0 inch gap . Intermediate connecting elements 231 ... 236 are shaped and / or oriented K and their free ends (tops) are within a second, finer gap, such as 0.005 inches. Indirect joints that form an intermediate joint from one gap to another are typically referred to as "spatial transformations." As shown • All the embodiments disclosed here * Although only one intermediate connection element can be displayed, the present invention can be applied to the manufacture of a plurality of intermediate connection components in a space M system configuration specified by each other, such as in a side game Figure or plaque on a square array. The use of a certain material has been discussed above for directly mounting the intermediate connection element to the terminal of the sister-in-law piece. Generally speaking, the intermediate connection element of the present invention can be manufactured on, or mounted on, a suitable surface of any composite substrate, including an instrument holder. Pay attention to the project, its description, for example, for the manufacture of 11A-11F, most of the intermediate quick-connection structure (such as the * elastic connection structure) as a separate and different structure for installation on the sub-assembly, and it is described in the 12th -12 C Mount a sowing substrate (carrier) and transfer the majority of the intermediate connection elements to an electronic component. Sections 2D-2F show techniques for manufacturing a plurality of intermediate connecting elements with a pre-molded end structure using a sacrificial substrate. The first step of the 2D editing technique 250, wherein a chess-type layer of the light military material 252 is applied on one surface of the sacrificial substrate 2 54. The sacrificial substrate 254 can be from a thin (1 to 10 mil) mesh or aluminum foil * depending on the example. The light military material 252 can be a common photoresist. The photomask employs the 252 series 镛 type as the opening with most 涸 (three shown) at the positions 256a, 256b, and 256c. At this point, I -------- seed coat -------- -IT ------ ^ (Please read the note ^^ on the back first, and then write it!) This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 28 4 50 0 1 7 Central Ministry of Economic Affairs Standard Bureau Shellfisher Consumer Cooperative Co., Ltd. printed A7 B7 V. Description of Invention (25) Intermediate connecting elements shall be made. Positions 256a, 250b, and 256c. In this example, they are comparable to those of the sister-in-law. The positions 256a, 2 56b, and 2 56c are better processed in the previous stage to have a rough or characteristic surface structure. As shown, this can be accomplished by forming a low drop at positions 25 6a, 2 5 6b, and 2 5Sc within the foil 254 in the manner of a 257M tool. Or the surface of the foil at these locations can have a surface structure by means of chemical etching. Any technology that accomplishes this general purpose is within the scope of this invention * such as sandblasting, hammering, and the like. Next, a large number of (leadingly shown here) 258 systems are formed at various positions (such as · 256 b), as shown in country 2E. This can be done with any combination of techniques such as electroplating, and can include end structures with multiple materials. For example, the end structure 258 may have a thin (e.g., 10-100 micro-in.) Barrier layer applied to the chain on the animal substrate * followed by a thin (e.g., 1 G micro-in.) Layer of soft gold. * Next is a thin (eg, 20 micro-inch) calendar of hard gold * Then a rather thick (eg * 20 (at 5 micro-inch)) of training • Finally, thin (eg, 10D 撖 inch) soft gold. Generally speaking, the first thin barrier nickel system is used to protect the post-history gold from being "poisoned" by the material of the substrate 2 54 (such as • aluminum, feed). • This fairly thick nickel layer system provides strength to Those who can easily join the end structure. The present invention is not limited to any item of how the end structure is formed on the substrate, because these items are different due to their unheard application. As shown in Section 2E, most of them are tilted (this display A) The core 260 for the intermediate connection element can be formed on the end structure 258. Such as relying on any technology that joins a flexible core to the terminal of the above electronic component. The core 26Q then ---------矣 ------ ΐτ ------ # 1 (Read the notes on the back of the poem before filling this page) This paper uses the Chinese National Standard (CNS) Α4 rule (210 × 297 mm) 4 500A7 B7 Printed by the Consumers' Cooperative of the China Standards and Quarantine Bureau of the Ministry of Economic Affairs 5. Description of the invention (26) W—It is best to use the hard gold 262 Μ as described above and cover it with light. The cover material 252 is then removed. As a result, most of the discrete intermediate connection elements 264 are mounted on the surface of the sowing substrate, as shown in Figure 2F. Μ — Similar to at least the terminals as described in Figure 2A ( 214) The outer covering material 26 2 securely fixes the core 2 6Q to its opposite end structure 2 58 and, if necessary, imparts elastic properties to the final intermediate connecting element 2664. As seen in the case of Lili, the majority The intermediate connecting element mounted to the base of the animal can be transmitted to the terminals of the sub-assembly as a group. Alternatively, two divergent paths can be used. As shown in Section 2G_, "by any combination of Step cost * Such as chemical selection * The seeding substrate 254 can be simply removed. Because most thin chemical etching steps will etch a material at a rate greater than that of other materials, and other materials can Slightly touched in this step • This phenomenon It is advantageously used to remove the thin nickel barrier calendar in the end structure at the same time as the sacrificial substrate is removed. However, if the thin barrier is to be removed, it can be removed in a subsequent etching step. This causes several (There are three &gt; individual connecting elements, separate and single intermediate connecting elements 204 · as indicated by virtual 266, and may be installed later (by means such as cutting or brazing) to the sub-assembly It can be mentioned that the covering material can also be slightly thinned during the process of removing the substrate and / or the thin barrier calendar. However, this situation is best not to occur. 0 In order to prevent external The thinning of the cover is better to use the thin gold calendar. Or, if the Chinese national standard (CNS) A4 specification (210X297 mm) is applied at about 20 paper sizes, 30 ---------- Pei-(Please (Read the notes on the back before filling out this page)

、1T 線 45〇〇17 Α7 Β7 經濟部中央標準局貞工消费合作社印製 五、發明説明(27 ) •V 微英时之硬的金上外覆約10撤英吋之软的金;Μ作為外覆 材料262外之最外層*使用此種金的外雇主要係因其優越 専電性、接觸抗性及可焊性,且其通常為不受使用Κ去除 薄陣礙曆及待去除基材的蝕刻溶液所影饗。 另外》如第2Η圖所說明,在移去待去除基材254之 前,可藉由如其中具許多孔之薄板之任何合逋支撐结構26 6;將許多(示出其中三個)連接元件Κ所欲之相對空間 h 一 位置關係“固定”之•待去除板上之洞將被移去。支撐结 構266可為闼緣衬料,或外覆有闼緣材料之導霉材料。可 進行進一步之處理(不另說明);如將許多連接元件裝設 於如矽晶片或印刷電路板之霣子零件上。此外,在某些應 用中·有必要穩定連接元件264之尖嬙(相對於尖端结構 )Μ避免移動*特別是使用接«力時,為此一目的,有必 要以適當之具有許多孔之片材268 ,如缍掾材料製成之篩 網來限制連接元件尖嫱的移動。 上述之技術25D之獨特優點在於:尖*结構258可由寅 際上所欲之材科製成•且可為任何所欲之構造◊如前所述 ,金係一種表現棰佳鼋導通性質、低接觸抗性、可焊性及 抗腐蝕等II的特性之貴金羼的典型。由於金亦為可延展的 *其特別遽合做為腌於此處所述任何連接元件之最後外覆 ,特別係此處所述之弹性連接元件*其它貴金靥展示相似 的所欲性霣。然而,展示此頬優異電的持性之如挪的某些 材料並不逋合供外覆蝥涸連接元件。舉例而言*鞠係明顯 易碎的,且當其作為强性連接元件之外覆時,表現並不好 ----------装------訂------東 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 31 m 4 50 0 1 7 A7 B7 經濟部中央標準局貝工消費合作社印裝 五、發明説明(28 ) * K此作考fi,Μ技術250作為典型之技術穩定地克眼此 種限制,例如•多層尖端结構(見258)之第一雇可為掷 (非Μ上所述之金)·賴此利用其優異電的特性供連接電 子零件,而不致對所得之連接元件之機械行為產生影響。 第2 I圈說明供製造連接元件之另一實施例270。在 此實施例中· Μ相當於Κ上第2D画所.述_之技術*在待去 除基材上施以一光覃材料272 ,並將jk圈案化使之具有許 多(示出其中之一)開口 276。在該等開口 276所定義之區 域上,K分立结檮形式製造連接元件·(如直至目前為止 ,說明軎中所逑者,當其一蠊接合至霣子零件之终媸或待 去除基材之區域*且連接元件之相對端並未接合至霣子零 件或待去除基材時,一連接元件係“分立的”。) 以任何適酋方法|可造成開口中之區域,如一次以上 之饜縮,其如延伸入待去除基材274之表面之單一®線278 所示者。 一核(線幹)280係接合至開口 27 6中之待去除基材的 表面,且可為任何適當型狀*此說明中*為清楚說明起見 •僅示出一連接元件之一端,(未示出)另一端可附於一 霣子零件上,可濟楚観察到,技術270不同於前逑技術250 者在於:核係直接接合至待去除基材274,而非接合至尖 端结構258上。«由此例,Μ傅统皞接合技術·金線核( 280) S固地接合至鋁基材( 2 74)之表面。 在方法( 270)之下一步驟中,包含在壓墒28卩中*在 核280上及開口 276中基材274之曝露區上施以(如,Κ種 (請先閱讀背面之注意事項再填寫本買) •裝- •-0 泉 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇乂297公釐) 32 4 經濟部中央標準局貝工消費合作社印製 5 0 0 17 A7 ___ B7五、發明説明(29 ) 鍍法)一金磨282 ,此層282之主要目的係在所得連接元件 (如,一旦移除待去除基材)之皤部形成一接觸表面。 之後,在層284外施以一如鎳之相對料雇284 * 如前所述•曆284之主要目的在於將所欲機械性質(如弭 性)加入所得之複合連接元件。在此實施例中•層284之 另一主要目的係加強所得埋接元件較低端上所製造之接觭 表面的耐久性。金的最终層可雎於靥284外,Μ加強所得 連接元件之電的性»。 在最终步驟中,除去光軍材料27 2及待去除基材2 74, 造成許多軍一連接元件(比較第2G圖);或具有預定之 彼此空間闢係的許多連接元件(比較第2Β圓)。 此實施例270係供在連接元件之鳙部製造突出之接觸 尖嬙的技術的典型*在此例中,說明一“金外覆鎳”接觸 尖*之優異實例。然而,在本發明之範皤中*根據此處所 述之技術,可在連接元件之端部製造其它類比的接觸尖灌 。此實施例270之另一特激在於:接觸尖靖係完全突出於 待去除基材( 2 74)上,而非如前述實賍例250所設計在待 去除基材(254)的表面。 插人物 使用本發明之中間連接元件的主體已於敘述於上文中 。一般而言,如此處所用者,一“插入物w係指一基材, 其在二相對表面具有接觸點,配置於二霣子組件之間从互 逋二電子組件。注注,需要插入物讓至少二俚互連的霣子 姐件之其中之一被移除(例如,為取代、改良、及類似之 ----------批衣------11------^ - (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨0'〆297公釐) 33 4 5〇〇&quot; A7 B7 經濟部中央標準局員工消費合作社印裝 五、發明説明(3〇 ) 目的&lt;〇 第3A圖係嫌示一使用本發明之中間a接元件之插入 物的實斑例300 。大致上,一絕緣基材302 ,諸如PCB型 基材•係設有多數e (此顧示二傾)専轚的穿透孔(例如 ,霄鍍通道)306、308、或類似者,各具有暴露於絕緣基 材302之頂(上)302a及底(下)302b表面。 一對軟核311及3 12係附接至基材3Q2之頂表面3Q2a上 之穿透孔30 6的暴霣部分。一對软核313及314係附接至基 座302之底表面上之穿透孔3D 6的赛露部分。類似地,一對 軟核3 15及3 16係附接至基材302之頂表面上之穿透孔3G8的 暴露部分,且一對軟核317及31&amp;係附接至基衬302之底表 面上之穿透孔308的暴B部分。核311…3 18於是外覆以一 ^硬材料320M在基材302之頂表面302a上形成中間連接结構 322及324,且於在基材302之底表面3D2b上形成中間連接 结構326及328。以此方式,對應的核311··· 318乃牢靠地固 定於穿透孔的對應赛露部分,中間連接结構322M®氣的 方式連接至中間邃接结構326 ·且中間建接结構3 2 4則霣氣 連接至中間連接结構328。將被瞭解的是,藉將各中間建 接结構(如· 322 )設為一對中間連接元件(如,322、 312),則可達成外部組件(未顕示)之更加與可靠的雄 接(如,相較於單一中間連接元件而言)。 如所示,中間連接元件311、312、315及316之頂群皆 K同樣的形狀形成•且中間連接元件之底群皆具有相同的 -----------界— (請先閑讀背面之注意Ϋ項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(2〖0X297公釐) 34 經濟部中央樣準局貝工消費合作社印装 4 5〇 Ο 1 η Α7 _!Ζ__________ 五、發明説明(31 ) 形狀。應被瞭解的是,中間連接元件之底群能設有一種與 中間連接元件之頂群不同的形狀*其將能提供製造從具有 與從基材之底表面延伸之中間連接元件不類似之機械结構 之絕緣基材的頂表面延伸之中間連接结構的櫬會。 栝人物莆油ί例a 2 第3B圖係繪示使用本發明之中間速接元件之一插入 物的另一實施例3 30。於此實施例中,多數個(此顯示一 個)中間連接元件332係製逭於一所要衣播牲基材(未顯 示)的模圖(例如·一陣列)上。一支撐基材3 34於一對 懕模画中係設有多數涠孔336。支撐基材334係置於中間連 接元件332之上,以便中間連接元件332伸透孔336。中間 連接元件3 3 2藉一合適的材料338 (諸如一强性髑)鬆弛地 固持於支撐基材之內•且從該支撐基材之頂及底表面延伸 。犧牲基材於是被移除》明顯地•於製造此一插入物雄成 的程序中,支撐基材334 (比較266)能簡單地被44掉落” 在多數個安裝於犧牲基材(254)之中間連接元件(比較 264)上。 插λ物营施锎tt 3 第3C_係鎗示使用本發明之中間達接元件之一插入 物的另一實施例360。此實施例360類似前述之霣施例330 ,除了中間連接结構362 (比較332)係賴將中間連接结構 362之中間部分耽銲至支撐基材之穿透孔366上之電教368 而支撐於孔366 (比較336)。此外,支撐基材384 (比較 266)能簡單純地於製造此插入物缠成之程序中被掉落 本纸張尺度適用中國國家標準(CNS ) Λ4規格(210 X 297公釐) 35 1--------1------、1T------# * (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印製 4 50 0 1 7 A7 _____B7 __五、發明説明(32 ) ”在多數個安裝於播牲基材(254)之中間連接元件(比 較266)上。 第3B及3C繪示的事實為,一單一中間連接元件 ( 3 32、362)能被用作完成兩件電子組件之對應蟠子的單 一連接。應被瞭解且羼本發明範圃的是,任何傳導元件可 K用以代替本發明之中間連接元件,如第3及3C所示。 應被瞭解的是》於第3A、3B及3C·之插入物的 實施例中*轚子姐件(未顯示)可配置於插入物( 300、 330、360)的兩端上,便插入物於諸纗子(未類示)間形 成霣氣連接。 由蒱Η形成中間璩培朵件 上述内容巳主要集中於由软線核形成中間連接元件, 其Κ一硬材料定形與外覆。本發明亦通於形成中間連接元 件,其Κ鑲形過(諸如藉衝鍛或蝕刻)之軟的金羼薄片形 成·且外覆以一硬材科。 闞於由彈性材霣之平坦金属曆形成可向垂直方向變形 之連接结構的習知技術乃被說明*例如,於USP4,833,172 (“MATSUH0T0”)中。HATSUMOTO案掲β製造於一链緣薄 片上之鏍旋的傳専平坦强簧。各該彈簧之内部嬙係與一穿 治絕蝝片之孔對齊,該絕緣片對應於晶片霣極(32)的位 置•且係软銲(31)至該霣捶上。各彌簧之外部端係固定 至絕掾薄Η,且係與一基材電極Κ钦銲料(41)連接。 MATSUMOTO案的强簧的製造乃藉將一薄、平坦的强簧 材料(铜、一緬合金、或一飼的複合金属)黏著至一絕緣 .n 1^— m ^^^1 n ^^^1 m ^^^1TJ •yfi (請先閣讀背面之注意事項再填寫本頁) 本紙張尺度適用中囷國家標準(CNS ) A4规格(210X 297公釐) 36 45〇 Ο A7 B7 五、 發明説明(33 ) 經濟部中夬標準局貝工消費合作社印«. 薄片(聚醢亞胺樹脂、玻璃、環氣樹脂、玻璃聚醵亞胺樹 脂、多元脂樹脂、包含石英期維之聚醢亞胺樹脂、或一聚 皤亞胺、包含碳纖維之環氣樹脂或多元脂)。接著•各個 大於尚被形成之傳導平坦弾簧之鏍旋部分之孔乃被形成於 絕緣薄片材料上。接著,該平坦弹簧材料_光蝕刻形成一 蠼旋形狀。最後,傳導平坦強簧被軟銲至對應的切角電棰 (32)及基材«極(42)上。對此一步》次序的一些替換 係敘述於MATSUMOTO案中(見,例如第4行· 27 - 36行) ,其包括热壓鎺接合、硬銲或取代软銲的焊接。所述各彈 簧之較宜的大小範画為· 10 — 40 μιη厚度及40 — 70//m寬 度(直徑)。敘述於MATSUMOTO案中之®簧结構在於在互 連霄極(32、42)間之固有的長傳導路徑•如上述者•該 結構並不通於許多應用。此外•在垂直方向(M給定之彈 簧常數)之增加的埋行使一較大直徑的螺遊强簧成為必要 。再者,MATSUMOTO案之裝置僅僅為諸甯棰間之全部中間 連接之每彈簧確立一單一彌簧常數。 上述可顯見·本發明易於建立複合中間理接元件(外 覆核)之一第一彌簧常數,該中間逋接元件向上突出Μ與 一第一®子組件連接;Μ及建立複合中間連接元件(外覆 核)之一與該第一彈簧常數不類似之第二彈簧常數,該中 間連接元件向下突出以與一第二霣子組件連接(例如,見 3ΑΜ)。一般而言,對一給定的外覆*且就同時對所有 核進行外覆而言*完全不闻的弹簧率乃容易地由視 薄要調蝥核元件之物理特性(例如•厚度、形狀等等)。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) ---.1'-----'才-- (請先閲讀背面之注意事項再填寫本頁) *τ Γ 450017 A7 B7 經濟部中夬標準局貝工消費合作社印褽 五、發明説明(34) 而確立之。此概念乃由下述之懸费霣施例所推行。 醍臀窨掄例1 第4A、4B、4C及4D麵說明根據本發明之用Μ 製造一插入物的技術。於第4Α晒中,其顯示一平坦、薄 (諸如0 . 0 G1 — 0 · Q 05英时)的軟金臈(例如,金、軟網合 金、软鋁合金)薄片402被_形(如藉由衝孔或蝕刻)Κ 界定處所述之多數届(此顧示二涸)细長元件404、406 。各细長元件具有一個中間部分及二俚自中間部分在薄片 平面上延伸的镧部分。 如第4B圖所示,一層光罩衬料4 08·諸如光阻•乃 施於諸细長元件區域外之软金羼薄層。各细長元件之鏞部 係相對該薄片彎雛平面的。细長元件404之一端部404a向 一單一方向(向上*如所示)彎曲》藉Μ形成一自薄片40 2向上延伸的分接頭。該细長元件之另一端部404 b向一相 對(向下•如所示)方向彎曲,藉K肜成一自薄片402向 片下延伸的分接頭。分接頭( 404a、4 0 4b)可以自薄片延 伸至實質上任何所箱的距雠•例如5 - 100密耳· K供微 電子上的應用。此等分接頭( 404a、404b)的形狀能玀立 地受控於彎曲步驟》故向上延伸的分接頭具有與向下延伸 之分接頭相同或不同的形狀。 應瞭解到,分接頭能以與细長元件之鏑形相同的步班 成形,且此等步》能K習有的設備執行之。 如第4C圔所鑰示,一絕嫌曆(介電質)支撐曆410 *諸如铥(Tm)或聚醢亞胺的薄層(瞑、板)·係設有 I I I I I I ϋ I H 線 f (請先聞讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X25*7公釐) 4 50 Ο 1 7 Α7 經濟部中央標準局員工消費合作社印裝 ^_ Β7五、發明説明(35 ) 多數個孔4 12。絕緣薄片410係置於软金屬薄片402上*故 諸孔412·於相對於光罩材料的薄片之一 側與諸分接頭對齊,且Μ合適的黏劑(未顯示)被固定於 软金臞薄片上。 於此實施例及下述之諸實施例中的絕緣薄Η能為一具 有一介電材料塗層的技術•乃羼於本發明範β者。 整俚總成於是被外覆以一硬材料4 12·諸如鎳及其合 金。支撐薄Η4 10及光罩材料4 08確保僅有细長元件被外覆 Μ硬材料〇最後,光軍材料408被剝除,而尚未被外覆的 软金屬被諸如選定的化學蝕刻法移除。可进擇的方式為, 於後完工步驟時,中間連接元件可ΜΚ—展現良好接觸阻 力特性,諸如金的材質加以外覆。 此造成一中間連接结構具有複合中間連接元件(外覆 的分接頭)自其頂及底表面延伸*如第4D圖所示,各該 向上延伸之禊合中間連接元件的作用為一懸费•且被一線 圈( 402)連接至一亦作為想货之向下延伸的其中之一個 相對分接頭*各該複合中間理接元件足Κ傳授一所需之接 觸力(例如*15公克)至一電子姐件之對懕媾子處。 Κ此方式*可獲得一插入物400 ,其具有二尖端供連 接一第一電子姐件(未顯示)之端子420至一第二霣子组 件(未顯示)之端子422之用,且可獲得一癞於使用於一 插入物之第二中間連接结構件,該结構具有二尖端供連接 該第一霣子組件(未顯示)之端子424至該第二電子組件 (未顯示)之對應端子426之用。 ----------批衣------1Τ------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 39 4 500 1 A7 B7 經濟部中央標準局男工消費合作社印製 五、發明説明(36 ) 第4D鬮獪示一中間連接结構400,其由一细長元件4 16所形成,Μ形成前述中間連接结構的方式外覆以相同的 材料412。细長元件416係與细長元件40 6以一距離縱向地 成一列,而细長元件404則與迪長元件4〇6以一距離横向地 成一列,則表示中間連接元件可以Κ陣列配置。鄰接的细 長元件之間的空間將针對第7 Α及7 Β圆更詳述之。 此技術的一涸優點,及將會明顯之後述的技術在於, 一可輕易成形(衡床及定形)的软、非弹性金靥薄片可K 被外覆,俾Μ —類似於軟嬅核被定形及外覆Μ展現彌性之 方式,展現強韌的彈性特性。 一夾具可Κ於外覆(例如,電鍍)程序期間執行光罩 的功能|而使光罩材料為非必要的技術層面,乃羼於本發 明之技術範哦之内。 多數個中間連接元件可Κ形成一對應接觸结構,接著 在彼此附近Μ諸如一支撐薄片被支撐*亦羼本發明之技術 範園之内。 —般而言*支撐層(410)以一規定之彼此的關係, 諸如Κ一垂直(X * y&gt;陣列横形,支撐多數画中間連接 元件。支撐層可K是可撓的*如上逑者,或可以是剛性的 (例如*諸如陶磁作成者)。一可撓的支撐曆具有可讓被 支播的中間連接元件於某一定程度的垂直位置“懸浮”的 優黏,俾調蹩待連接之電子驵件的表面差異(公差)。此 主鹿將會於討論第7A及7B圖時予Μ詳述。 鞔營奮施例tt 2 .1. n I n . n ^ ti 線 * (請先閲讀背面之注意事項再填寫本頁〕 本紙張尺度適用中國國家榡準(CMS ) A4規格(21 ο X 297公釐) 40 經濟部中央樣準局員工消費合作社印製 Α7 Β7 五、發明説明(37 ) 第5A— 5F圈繪示由一平坦金屬薄片製造一插入物 的替代技術0 如第5A圈所示,一平坦吹金雇(例如,飼)薄片( 如,箔)被鑄形(街床、蝕刻、或類似者)•俾具有對立 的细長元件504及506,其等大致彼此鄰接且平行。细長元 件502及5 0 4之底端由一環506所固持。 K 一類似於第4A — 4D的實施例,细長元件504的 其中之一係被«曲成一向一方向彎曲的分接頭,而其中另 —個被彎曲成向一相反方向的分接頭,導致第5B (比較 第4 B圔)所示之组態。 如第5C_所示* 一合遘的光罩材料510,諸如光阻 ,施於薄片502上,在環508及细長元件504及506的區域之 外。 薄片50 2於是被外S (如,霣鍍)K一硬金圈材料( 如鎳或其合金)512,藉K將分接頭(定形的细長元件504 及506)轉換成功能為®簧的中間連接元件。接著•賴由 諸如埋定的蝕刻法將光罩材料510移除,造成第5 D國所 示之插入物结構500 *其具有上指的複合中間連接元件且 對應於下指的複合中間連接元件,向上及向下箝的中間逋 接元件二者皆作用為懸臂,各足K傳授一所需之接觸力( 如,15公克)至一電子組件的對應皤子。 Μ此方式,可獲得插入物500 *其具有兩嬸,供將一 第一轚子組件(未顯示)之蟠子52DS接至一第二®子驵 件(未顯示)之對應皤子522之用。 本紙張尺度逋用中國國家標準(CNS ) Α4規格(210X297公釐) 41 I--.------------1Τ------&amp; (請先閲讀背面之注意事項再填寫本頁) 經濟部中央橾準局員工消费合作社印装 4 500 1 7 A7 _B7_五、發明説明(38 ) 如一普偏的設計,第4A_4D圈的實施例400較優 於第5A-5D圃的實施例500。 联臂窨掄例ίί 3 如第6Α—6D圖所示,一類似者(如,對於針對第 5 A — 5 Ε画之前逑實施例而言)•可K對一软金钃線圈 602嫌形成具有二個、平行(並排)的细長元件604及δ06 ,其等共用一共用的底部608。 细長元件60 4的其中之一被彎曲成一向一方向延伸的 分接頭,而细長元件之其中另一個被彎曲成向一相對方向 延伸的分接頭,造成如第6 Β圖所示之組態(比較第5Β 圖)° 如第6C圖所示,人合適的光罩材枓,諸如光阻610 施於薄片602上•在细長元件604及606及其等之共用底部 608部區域之外。 薄片602於是被外覆(如》霣镀)Κ一硬金羼材科( 如鎳或其合金)812,《Μ將分接頭(定形的细長元件604 及606)轉換成功能為彈簧的中間連接元件。接著•賴由 諸如被堪定的蝕刻法將光罩材料61Q被移除•且所有非外 覆的(藉612)的软金属(60 2)被移除|造成第6D1I所 示之插入物结構600 *其具有上指的禊合中間連接元件且 對應於下指的禊合中間连接元件,向上及向下指的中間連 接元件二者皆作用為懸臂,各足Κ傳授一所铺之接觸力( 如,15公克)至一電子組件的對鼴端子。 以此方式·可獲得插入物6QQ,其具有兩端,供將一 ---I;- I---- 木— — - I- ~~ 訂 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 42 450017 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(39 ) 第一鼋子組件(未顧示)之端子620連接至一第二電子姐 件(未顯示)之對應媾子622之用。 雖未顯示,多數届中間連接元件可以«將其等固定至 —諸如設有多数孔之合《的支撐姐件上*而配置於一所薄 之横圈(如,一矩形陣列)上•如第4CB所示。 湄成”當掄例 參照,例如,第4A_4D圖之實施例·明顯地,细 長元件(404、406)之原長(彎曲前)建立了分接頭能自 該薄片延伸多适的限制,換言之,即结果中間邃接元件之 長度(及/或高度&gt; 上的限制。 如此處所使用者,名詞“長度&quot;一般係指一细長元件 在定形(若有&gt; 之前的蹤向大小,而名詞“高度” 一般係 指细長元件(及最終中間連接元件)在定形及塗層之後的 級向大小。為本文獻所述之討論内容之故·此等名詞大致 上係可替換的。 如上所述•微電子中一區域的考驀在於以一諸如鄰近 諸中間連接元件間之0.010英时(10密耳)的微细間隙製 造中間連接元件陣列而言係令人所希望的。然而,其對於 各中間連接元件能具有50密耳、100或更多高度亦令人所 希望的。參見第4D圈,可顧見位於鄺近中間速接结構間 (例如,40 6、416)之10密耳的空間會使中間連拉元件的 此種高度在物質性上是不可能的。 第7A及7B圖繽示根據本發明之克服物質性上之限 制的技術。 ----------批衣------1T------.¾^ an | (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 43 4 5 0 0 1 Α7 Β7 經濟部中央橾隼局員工消費合作社印装 五、發明説明(4〇 ) 第7 A國嬢示一平坦薄片702的軟材質金。一單一细 長元件704 (比較404、504、604)僳形成於薄片702,且 向一方向(向下,如所示)彎曲*藉以形成一®自薄片 702向下延伸之分接頭。 因為·如上述*吾人期望有具相當長度但又彼此緊密 配置之中間連接元件,核710於是附接於分接頭的上(如 所示)表面,靠近分接頭自由端處*且定形成具有一可彌 簧的形狀。該核能具有任何可®簧的形狀(例如*比較第 1B圈所示之形狀),且能成為實質上任何想要的長度* 且一金接合線合通地連接該分接頭。如第7 B鬮所示,分 接頭7D4及核71 0的最終縴成係外覆以一諸如嫌及其合金的 硬材科712。核710大致正規地(如,以九十度)延伸至分 接頭704的表面。 以此方式,可獲得一逋於使用於一插入物的中間連接 结構,其具有兩端供將一第一電子驵件(未顯示)之端子 720連接至一第二霣子姐件(未顬示)之一對應的端子722 之用。 分接頭(外霣鍍以材科712之细長元件7Q4)作用為核 710的一“懸浮支撐”,且亦在該核之下端(如所示)建 立一接觭尖端。此係有利的,尤其於需要中間建接元件來 調節一待接觸之電子組件諸端子的同平面性上總偏差的應 用。舉例言之,一電子組件可Μ具有非平面的表面,此情 況下轚子組件諸端子(如,722)將會於“ ζ ” (垂直) 軸的不同位置上。兩涸櫬構作用成調節此籌非平面性。首 ----------装------訂 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度逋用中國國家標準(CNS ) Α4規格(21〇Χ297公釐) 44 4 5 Ο 0 t 7 Α7 Β7 經濟部中央搮準局員工消費合作社印策 五、發明説明(41 ) 先,分接頭(704)容易地作用成調節此等不規則(位置 上的公差)*而允許中間連接元件710建立一相當堅固且 可預測的彈性力於該二互連的電子驵件之間。第二*外覆 的核亦可以展現塑性及彈性形變的組合,塑性形變調節電 子組件上之端子的非平面性。因此,外覆的细長元件 主要作用為外覆畑長元件710的一懸浮支撐,而毋餺製造 一相當的貢獻給由外覆的细長元件710所使用的接觸力· 即使其較硬於外覆的细長元件710。(比較第3B匾之實 施例330的彌性支撐338)。 或者,细長元件7D4可Μ實質上整個被光軍(例如, 此較第5C圃的光罩材料510),以便细長元件704對主要 由塑性形變而非由强性形變|所形成的力作反應。於此方 面*此種替代的结構會承受一些(有限的)如第3Β圖所 示之實施例之功能上的類似點。细長元件70 4係部分或完 全地被光罩|以藉控制形成於其上之外覆材料Π2的虽而 視爾要調整其物理特性*乃雇於本發明的範困之内。 明顯地•第7Α—7Β圖之實施例能使中間速接元件 Μ—微细(如&gt; 10密耳)的間隙製成,但卻又長度及延伸 至逭大於其等之間隙(如· 1D0密耳)的高度。 核(71Q)能安装於一端平坦螺旋弹簧上,諸如示於 前述USP 4.893.172案中之螺旋彌簧的肉部端•乃羼於本 發明之範圃内。 餺诰對廉的由間迪描元件 第8Α及8Β_繪示製造對應中間逋接元件的技術· (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標车(CNS ) Α4规格(210 X 297公釐) 45 編 經濟部中央橾準局員工消費合作社印製 A7 B7五、發明説明(42 ) 諸如堆稹多數個此等“彌簧接觸”的元件,且嫌後自動地 將其等姐装成一諸如半導髏元伴或插入物之支撐基材的霣 子組件。 第8 A圈繪示一技術80 0,其中諸如軟飼材質的一平 坦薄片(箔)80 2被街床、蝕刻或類似法俾形成多數個( 此顯示一個)细長元件(分接頭)804。细長元件804陲後 被定形成具有一彈簧的形狀。各细長元件80 4具有一底部 8〇4a,其實實上為薄片80 2的一殘餘(剩餘)部,且其最 好被允許保持與薄片8Q2共平面。各细長元件80 4自底部 804a在细長元件804之相對端具有一端(頂)8Q4b。细長 元件804在位於頂804b與一鄰接於底部8Q4a之部分8(Md之 間的804c區*彎曲成具有任何缠於可強簧的形狀。 合適的光罩材料806·諸如光阻,乃施於薄片802的二 拥上,包括(如所示)可遘擇地碓於细長元件804之底部 804a上,留下细長元件804的“可操作”部分為未光罩的 狀態。细長元件於是外覆以一合瘇的材料8Q8 ·理定作為 傳授®性至最终中間連接元件的能力,如上所述。外覆材 料可Μ理擇性地覆蓋细長元件804的底部804a。 光軍材料8Q 6於是被移除·諸如藉由埋擇的蝕刻。此 造成多數個對應複合中間連接元件,該等元件能被安裝至 一轚子組件上之•或被支撐於一藉固定其等之底部( 804a )从支撺基材之彼此的規定空間闞係(如,一陴列)。或 者,多數個根據此一技術而形成之中間連接元件能被一彈 性體支揮於一陣列中。 ---------1衣------ir------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨OX297公釐) 46 45〇 0 Α7 Β7 經濟部中央標準局貝工消费合作社印策 五、發明説明(43 ) 第8 B躔獪示另一技術8 513 ·其中諸如軟網材質的一 平坦薄片(萡)852被衝床、蝕刻或類似法俾形成多數個 (此顯示六個)细長元件(分接頭)854。细長元件8Q4陳 後被定形成具有一彈簧的形狀。各分揭頭854a可比得上先 前的實施例800中的底部904a。於此實腌例850中,薄片被 衡床以便底部854 a全部彼此閭連。所繪示之“橋” 85 6僅 係例示性質。细長元件可Μ於衡床期間或之後被定形。 细長元件854被定井成具有弹簧形狀,然後文被外覆 以合適的材料(未顯示),如上述。外覆層(未顬示,如 上述)最好在细長元件仍然彼此互連之際施予之*且不爾 要施加任何的光罩材料。 於一最終步驟時,包含多數俚互連的、外覆的细長元 件之薄片被進一步衝床,俾彼此軍一化(分隔)對懕的外 覆细長元件。 如前述例子8Q0,此技術850造成刀多數個相對的中間 連接元件,其等能安裝至一霣子姐件、或藕由固定其等之 底部彼此被支撐於一陣列中。或者,多數傾根據此一技術 形成之中間連接元件能被一®性體懸浮於一陣列中。 靱诰璩培路/桂糟1T line 450017 Α7 Β7 Printed by Zhengong Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs V. Invention Description (27) • V The hard gold at the time of micro English is covered with about 10 inches of soft gold; Μ As the outermost layer outside the cover material 262 * The foreign employer who uses this kind of gold is due to its superior electrical resistance, contact resistance and solderability, and it is generally not affected by the use of κ to remove thin arrays and to be removed Influenced by the etching solution of the substrate. In addition, as illustrated in FIG. 2 (a), before removing the substrate 254 to be removed, any composite support structure 26, such as a thin plate with many holes, can be used; many (three of which are shown) connecting elements K Desired relative space h A positional relationship “fixed” • The hole on the plate to be removed will be removed. The support structure 266 may be a lining material or a mold-inducing material covered with a lining material. Further processing can be carried out (not specified); for example, many connecting components are mounted on a die part such as a silicon chip or a printed circuit board. In addition, in some applications it is necessary to stabilize the tip of the connecting element 264 (relative to the tip structure) and to avoid movement * especially when using a contact force, for this purpose, it is necessary to use a suitable sheet with many holes Material 268, such as a screen made of concrete, to limit the movement of the tip of the connecting element. The unique advantage of the above-mentioned technology 25D is that the pointed structure 258 can be made of materials that are desired in the world. And it can be of any desired structure. As mentioned above, the gold system has a good performance. Typical of precious metal alloys with II characteristics such as contact resistance, solderability and corrosion resistance. Since gold is also extensible * its special combination is used as the final cover marinated in any of the connection elements described here, especially the elastic connection elements described here * Other precious gold 靥 shows similar desires 霣. However, certain materials that demonstrate this excellent electrical durability are not compatible with externally connected connection elements. For example, * Ju is obviously fragile, and when it is covered as a strong connection element, it does not perform well. --East (please read the notes on the back before filling this page) This paper size applies to Chinese National Standard (CNS) Α4 size (210X297 mm) 31 m 4 50 0 1 7 A7 B7 Shellfish consumption of the Central Standards Bureau of the Ministry of Economic Affairs Cooperative cooperative printing V. Description of invention (28) * K is considered fi, M technology 250 is a typical technology to stably overcome such restrictions, for example • the first employment of multi-layered tip structure (see 258) can be thrown (non- The gold mentioned above) · rely on its excellent electrical characteristics for connecting electronic parts without affecting the mechanical behavior of the resulting connecting elements. Circle 2I illustrates another embodiment 270 for manufacturing a connecting element. In this embodiment, M is equivalent to the 2D picture on K. The technique described above applies a light material 272 on the substrate to be removed, and jk circles it so that it has many (shown among them A) Opening 276. In the area defined by these openings 276, K is used to manufacture connection elements in the form of discrete junctions. (If so far, explain the above, when it is joined to the end of the sub-component or the substrate to be removed Area * and when the opposite end of the connecting element is not joined to the rafter part or the substrate to be removed, a connecting element is "discrete".) By any suitable method | can cause the area in the opening, such as more than once Curling, as shown by a single ® line 278 extending into the surface of the substrate 274 to be removed. A core (line trunk) 280 is bonded to the surface of the substrate to be removed in the opening 27 6 and may be of any suitable shape * in this description * for clarity. Only one end of a connecting element is shown, ( (Not shown) The other end can be attached to a stack of parts. It can be clearly observed that the technology 270 is different from the previous technology 250 in that the nuclear system is directly connected to the substrate 274 to be removed, rather than the tip structure 258. on. «In this example, the M-Futuronic bonding technology · Gold wire core (280) S is solidly bonded to the surface of the aluminum substrate (2 74). In the next step of the method (270), it is included in the pressurized 28 卩 * on the core 280 and the exposed area of the substrate 274 in the opening 276 (eg, K species (please read the precautions on the back before Fill in this purchase) • Packing-• -0 Spring paper sizes are applicable to Chinese National Standards (CNS) A4 (21〇 乂 297 mm) 32 4 Printed by the Bayer Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5 0 0 17 A7 ___ B7 V. Description of the invention (29) Plating method) A gold mill 282. The main purpose of this layer 282 is to form a contact surface on the crotch of the obtained connecting element (for example, once the substrate to be removed is removed). After that, the layer 284 is coated with the same material as nickel 284 * As mentioned above, the main purpose of the calendar 284 is to add the desired mechanical properties (such as alkali properties) to the resulting composite connection element. In this embodiment, another main purpose of the layer 284 is to enhance the durability of the surface of the joint made on the lower end of the resulting embedded component. The final layer of gold can be placed outside of 靥 284, and M strengthens the electrical properties of the resulting connection elements ». In the final step, removing the light army material 27 2 and the substrate to be removed 2 74 results in many army-one connection elements (compare Fig. 2G); or many connection elements with predetermined space between them (compare 2B circle) . This embodiment 270 is a typical example of a technique for making a protruding contact tip in the crotch portion of a connection element. In this example, an excellent example of a "gold-clad nickel" contact tip * will be described. However, in the context of the present invention *, according to the techniques described herein, other analog contact tips can be made at the ends of the connecting elements. Another excitement of this embodiment 270 is that the contact tip is completely protruded on the substrate to be removed (274), instead of being designed on the surface of the substrate (254) to be removed as in the foregoing example 250. The main body using the intermediate connecting element of the present invention has been described above. In general, as used herein, an "insert w" refers to a substrate that has contact points on two opposing surfaces and is disposed between two sub-components and each electronic component. Note that an insert is required One of at least two sister-in-law's sister-in-law pieces was removed (for example, to replace, improve, and the like ---------- batch of clothes ----- 11-- ---- ^-(Please read the notes on the back before filling in this page) The paper size applies to the Chinese National Standard (CNS) A4 specification (2 丨 0'〆297mm) 33 4 5〇 &quot; A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (3) Purpose &lt; 〇 Figure 3A is a solid spot example 300 showing the use of the insert of the intermediate a connector of the present invention. Generally, a Insulating substrates 302, such as PCB-type substrates, are provided with a large number of penetration holes (e.g., plated channels) 306, 308, or the like, each having exposure to an insulating substrate. The top (upper) 302a and bottom (bottom) 302b surfaces of the material 302. A pair of soft cores 311 and 3 12 are penetrating holes 30 6 attached to the top surface 3Q2a of the substrate 3Q2. Part 霣. A pair of soft cores 313 and 314 are attached to the Sailu portion of the through hole 3D 6 on the bottom surface of the base 302. Similarly, a pair of soft cores 3 15 and 3 16 are attached to the substrate The exposed portion of the penetrating hole 3G8 on the top surface of 302, and a pair of soft cores 317 and 31 & A are attached to the portion B of the penetrating hole 308 on the bottom surface of the base 302. The core 311 ... 3 18 is then The outer layer is covered with a hard material 320M to form intermediate connection structures 322 and 324 on the top surface 302a of the substrate 302, and intermediate connection structures 326 and 328 are formed on the bottom surface 3D2b of the substrate 302. In this manner, corresponding The core 311 ... 318 is firmly fixed to the corresponding Sailu part of the penetration hole, and the intermediate connection structure 322M® is connected to the intermediate connection structure 326. The intermediate connection structure 3 2 4 is connected to the middle. Connection structure 328. It will be understood that by setting each intermediate connection structure (such as · 322) as a pair of intermediate connection elements (such as 322, 312), the external components (not shown) can be more reliable. Male connection (eg, compared to a single intermediate connection element). As shown, the intermediate connection element 31 The top groups of 1, 312, 315, and 316 are all formed in the same shape. K and the bottom groups of the middle connecting elements are the same ----------- world-(please read the note on the back first) Please fill in this page again) The size of the paper used for this edition applies to the Chinese National Standard (CNS) A4 specification (2 〖0X297mm) 34 Printed by the Bayer Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 4 5〇〇 1 η Α7 _! Z __________ 5 Invention description (31) Shape. It should be understood that the bottom group of the intermediate connection element can be provided with a different shape from the top group of the intermediate connection element * which will provide a mechanism for manufacturing a machine having a shape different from that of the intermediate connection element extending from the bottom surface of the substrate The meeting of the intermediate connection structure extends from the top surface of the insulating substrate of the structure. Fig. 3B of a character oil Fig. 3B shows another embodiment 30 using an insert of one of the intermediate quick-connecting elements of the present invention. In this embodiment, a plurality of (one shown here) intermediate connecting elements 332 are fabricated on a pattern (for example, an array) of a substrate (not shown) to be sown. A support substrate 3 34 is provided with a plurality of countersinks 336 in a pair of die designs. The supporting substrate 334 is placed on the intermediate connecting member 332 so that the intermediate connecting member 332 extends through the hole 336. The intermediate connecting element 3 3 2 is loosely held in the supporting substrate by a suitable material 338 (such as a strong concrete) and extends from the top and bottom surfaces of the supporting substrate. The sacrificial substrate was then removed ". Obviously • In the process of making this insert, the supporting substrate 334 (compared to 266) can be easily dropped by 44". In most installations on the sacrificial substrate (254) On the intermediate connecting element (Comparison 264). Inserting λ 物 营 3 3C_ series gun shows another embodiment 360 using one of the inserts of the intermediate connecting element of the present invention. This embodiment 360 is similar to the aforementioned one. Example 330 except that the intermediate connection structure 362 (comparison 332) is supported on the hole 366 (comparison 336) by relying on the electro-education 368 of the intermediate connection structure 362 to the through hole 366 of the supporting substrate. , Supporting substrate 384 (Comparison 266) can be dropped simply and purely in the process of making this insert. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210 X 297 mm) 35 1-- ------ 1 ------, 1T ------ # * (Please read the notes on the back before filling out this page) Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 4 50 0 1 7 A7 _____B7 __V. Description of the Invention (32) ”In most of the intermediate connecting elements mounted on the sowing substrate (254) (Comparison 266) . 3B and 3C show the fact that a single intermediate connection element (332, 362) can be used to complete a single connection of the corresponding dies of two electronic components. It should be understood and understood from the present invention that any conductive element can be used in place of the intermediate connection element of the present invention, as shown in Sections 3 and 3C. It should be understood that in the embodiments of the inserts of 3A, 3B, and 3C *, the sister-in-law piece (not shown) can be arranged on both ends of the insert (300, 330, 360), and the insert A radon gas connection is formed between the various crickets (not shown). Forming an intermediate pedestal piece from 上述 The above contents mainly focus on forming an intermediate connecting element from a flexible core, which is shaped and covered by a hard material. The present invention also relates to the formation of an intermediate connecting element, which is formed with a soft gold foil sheet K-shaped (such as by punching or etching) and covered with a hard material branch. The conventional technique of forming a connection structure which can be deformed in a vertical direction from a flat metal calendar made of an elastic material is illustrated *, for example, in USP 4,833,172 ("MATSUH0T0"). The HATSUMOTO case β is a circling flat strong spring made on a thin sheet of chain edge. The internal ridge of each spring is aligned with a hole through the insulating tab, which corresponds to the position of the wafer pole (32) and is soldered (31) to the pole. The outer ends of each of the springs are fixed to a thin plate and are connected to a substrate electrode (Kin solder) (41). The MATSUMOTO case of strong springs is manufactured by adhering a thin, flat strong spring material (copper, a Burmese alloy, or a composite metal) to an insulation. N 1 ^ — m ^^^ 1 n ^^^ 1 m ^^^ 1TJ • yfi (please read the precautions on the back before filling out this page) This paper size is applicable to the China National Standard (CNS) A4 specification (210X 297 mm) 36 4500 A7 B7 V. Invention Explanation (33) Printed by Shelley Consumer Cooperative of China Standards Bureau of the Ministry of Economic Affairs «. Sheets (Polyimide resin, glass, gas resin, glass polyimide resin, polyester resin, polystyrene containing quartz Amine resin, or a polyimide, a gas-containing resin containing a carbon fiber, or a polybasic grease). Then • Each hole larger than the spiral portion of the conductive flat coil spring that has been formed is formed on the insulating sheet material. Then, the flat spring material is photo-etched to form a spiral shape. Finally, the conductive flat strong spring is soldered to the corresponding chamfered electrode (32) and the substrate «pole (42). Some alternatives to this step sequence are described in the MATSUMOTO case (see, for example, lines 4 · 27-36), which include hot-press staking, brazing or welding instead of soldering. The preferred size of each spring is 10-40 μm thickness and 40-70 // m width (diameter). The spring structure described in the MATSUMOTO case consists of an inherently long conduction path between interconnected poles (32, 42), as described above, and this structure is not accessible to many applications. In addition, it becomes necessary to use a larger diameter spiral spring in the increased vertical direction (spring constant given by M). Furthermore, the device of the MATSUMOTO case merely establishes a single spring constant for each spring of all the intermediate connections between the sterns. It is obvious from the above that the present invention is easy to establish a first intermediate spring constant of a composite intermediate connection element (overlay core), the intermediate coupling element protruding upward and connected to a first ® subassembly; M and establishing a composite intermediate connection element (Outer core) A second spring constant that is not similar to the first spring constant, and the intermediate connecting element protrudes downward to connect with a second sub-assembly (for example, see 3AM). Generally speaking, for a given cover * and for covering all cores at the same time * the completely obscure spring rate is easily adjusted by the thin film to adjust the physical characteristics of the core element (eg, thickness, shape and many more). This paper size applies Chinese National Standard (CNS) Α4 specification (210 X 297 mm) ---. 1 '-----' Cai-(Please read the precautions on the back before filling this page) * τ Γ 450017 A7 B7 Shellfish Consumer Cooperatives of the China Standards Bureau of the Ministry of Economic Affairs. This concept is promoted by the following examples.醍 Buttocks Example 1 The 4A, 4B, 4C, and 4D sides illustrate the technique of making an insert using M according to the present invention. In the 4A exposure, it shows that a flat, thin (such as 0. 0 G1 — 0 · Q 05 hours) soft sheet of gold (for example, gold, soft mesh alloy, soft aluminum alloy) sheet 402 is shaped (such as By punching or etching), the majority of the elongated elements 404, 406 (herein shown in Fig. 2) described at the boundary of K. Each elongated element has a middle portion and two lanthanum portions extending from the middle portion in the plane of the sheet. As shown in Figure 4B, a layer of photomask lining 408, such as a photoresist, is applied to a thin layer of soft gold foil outside the area of the elongated elements. The crotch portion of each elongated element is flat relative to the laminae. One end 404a of the elongated element 404 is bent in a single direction (upward * as shown) by forming a tap extending upward from the sheet 402. The other end portion 404b of the elongated element is bent in a direction opposite (downward as shown), and K 借 is formed into a tap extending from the sheet 402 to the bottom of the sheet. Taps (404a, 4 0 4b) can be extended from the sheet to virtually any box distance 雠 • for example 5-100 mils · K for microelectronic applications. The shape of these taps (404a, 404b) can be independently controlled by the bending step. Therefore, the taps extending upwards have the same or different shapes as the taps extending downwards. It should be understood that the taps can be formed in the same steps as the shape of the elongated element, and that these steps can be performed using conventional equipment. As shown in Section 4C 圔, an absolute calendar (dielectric) supports the calendar 410 * Thin layers (瞑, plates) such as 铥 (Tm) or polyimide · with IIIIII ϋ IH line f (Please First read the notes on the back and then fill out this page) This paper size applies to Chinese National Standard (CNS) A4 (210 X25 * 7 mm) 4 50 Ο 1 7 Α7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs ^ _ B7 V. Description of the invention (35) A plurality of holes 4 12. The insulating sheet 410 is placed on the soft metal sheet 402. Therefore, the holes 412 are aligned with the taps on one side of the sheet relative to the mask material, and a suitable adhesive (not shown) is fixed to the soft gold. On thin slices. The insulating thin film in this embodiment and the following embodiments can be a technology having a coating of a dielectric material. The trim assembly is then covered with a hard material 4 12 such as nickel and its alloys. The supporting sheet 4 10 and the mask material 4 08 ensure that only the elongated elements are covered with the hard material. Finally, the light military material 408 is stripped, and the soft metal that has not been covered is removed by, for example, a selected chemical etching method. . Alternatively, the intermediate connecting element may exhibit a good contact resistance characteristic, such as a material of gold and an outer cover, at a later completion step. This results in an intermediate connection structure with composite intermediate connection elements (overlay taps) extending from its top and bottom surfaces. * As shown in Figure 4D, each of the upwardly extending coupling intermediate connection elements has a role to play. And is connected by a coil (402) to one of the relative taps which also serves as a downward extension of the desired product * each of the composite intermediate connection elements is sufficient to impart a required contact force (such as * 15 g) to a The e-sister piece is for the sister-in-law. This way * an insert 400 can be obtained, which has two tips for connecting a terminal 420 of a first electronic component (not shown) to a terminal 422 of a second sub-assembly (not shown), and can be obtained One is a second intermediate connection structure used in an insert, and the structure has two tips for connecting the terminal 424 of the first sub-assembly (not shown) to the corresponding terminal 426 of the second electronic assembly (not shown). Use. ---------- Batch clothing ----- 1T ------ ^ (Please read the precautions on the back before filling out this page) The paper size applies to China National Standard (CNS) Α4 Specifications (210 × 297 mm) 39 4 500 1 A7 B7 Printed by the Male Workers Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention (36) The fourth 4D shows an intermediate connection structure 400, which is composed of an elongated element 4 16 Formed, M is covered with the same material 412 in the manner of forming the aforementioned intermediate connection structure. The elongated element 416 is longitudinally aligned with the elongated element 406 at a distance, and the elongated element 404 is laterally aligned with the long-length element 406 at a distance, indicating that the intermediate connection element can be arranged in a K array. The space between adjacent slender elements will be described in more detail for the 7A and 7B circles. One of the advantages of this technology, and the technology that will be apparent later, is that a soft, non-elastic gold foil that can be easily formed (weighing bed and shape) can be coated with K, and M—like a soft palate core. Set and cover M to show a diffusive way, showing strong elastic properties. A fixture can perform the function of the photomask during an overcoating (eg, plating) procedure, and making the photomask material a non-essential technical level is within the technical scope of the present invention. A plurality of intermediate connecting elements may form a corresponding contact structure, and then be supported in the vicinity of each other such as a support sheet *, which is also within the technical scope of the present invention. -In general * the supporting layers (410) are in a prescribed relationship with each other, such as K-vertical (X * y &gt; array horizontal, supporting most of the intermediate connecting elements. The supporting layer may be flexible * as described above, Or it can be rigid (for example, * such as a ceramic magnet creator). A flexible support calendar has a good adhesion that allows the anchored intermediate connecting element to "float" in a certain vertical position. Surface differences (tolerances) of electronic parts. This main deer will be described in detail when discussing Figures 7A and 7B. Example 1 tt 2 .1. N I n. N ^ line * (please first Read the notes on the reverse side and fill in this page] This paper size is applicable to China National Standard (CMS) A4 (21 ο X 297 mm) 40 Printed by the Staff Consumer Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs Α7 Β7 V. Description of the invention ( 37) Circles 5A-5F show alternative techniques for making an insert from a flat sheet of metal. As shown in circle 5A, a flat sheet of gold (for example, feed) is cast (eg, foil) into a shape (street Bed, etch, or the like) 俾 has opposed elongated elements 504 and 506, And so on are substantially adjacent to each other and parallel. The bottom ends of the elongated elements 502 and 504 are held by a ring 506. K A similar to the 4A-4D embodiment, one of the elongated elements 504 is curved « Taps bent in one direction, and the other one is bent into a tap in the opposite direction, resulting in the configuration shown in 5B (compared to 4B 圔). As shown in 5C_ A mask material 510, such as a photoresist, is applied to the sheet 502, outside the area of the ring 508 and the elongated elements 504 and 506. The sheet 50 2 is then coated with an outer S (eg, plated) K—a hard gold ring material ( Such as nickel or its alloy) 512, use K to convert the taps (shaped elongated elements 504 and 506) into intermediate connecting elements that function as ® springs. Then • The mask material 510 is moved by an etching method such as buried In addition, it results in the insert structure 500 shown in country 5D * which has a composite intermediate connection element of the upper finger and corresponds to the composite intermediate connection element of the lower finger, and the intermediate connection element of the upward and downward clamps both function as Cantilever, each foot K imparts a required contact force (eg, 15 grams) to the pair of electronic components皤 子。 In this way, you can get 500 inserts * It has two brackets, which is used to connect the 52DS of a first daughter module (not shown) to a second ® daughter (not shown)皤 子 522。 This paper size uses Chinese National Standard (CNS) A4 specifications (210X297 mm) 41 I --.------------ 1T ------ &amp; (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Central Procurement Bureau of the Ministry of Economic Affairs 4 500 1 7 A7 _B7_ V. Description of the invention (38) Example of the 4A_4D circle as a universal design 400 is better than Example 500 of the 5A-5D garden. Example of the joint arm ί 3 As shown in Figures 6A-6D, a similar one (for example, for the previous embodiment for 5A-5E painting) • K can be formed against a soft gold coil 602 There are two parallel (side by side) elongated elements 604 and δ06, which share a common bottom 608. One of the elongated elements 60 4 is bent into a tap that extends in one direction, and the other of the elongated element is bent into a tap that extends in an opposite direction, resulting in a group as shown in FIG. 6B State (compare Fig. 5B) ° As shown in Fig. 6C, a suitable mask material, such as a photoresist 610, is applied to the sheet 602. In the elongated elements 604 and 606 and their common bottom 608 area, outer. The sheet 602 is then covered (eg, “plated”) with a hard gold (such as nickel or its alloy) 812, and “M” converts the taps (shaped elongated elements 604 and 606) into intermediate connecting elements that function as springs. . Then • the mask material 61Q was removed by a method such as a determined etching method • and all non-covered (by 612) soft metal (60 2) was removed | resulting in the insert structure shown in 6D1I 600 * It has a coupling intermediate connection element of the upper finger and corresponds to a coupling intermediate connection element of the lower finger, and the intermediate connection element of the upward and downward fingers both act as cantilevers, and each foot κ imparts a contact force of a shop (For example, 15 grams) to the opposing terminal of an electronic component. In this way, an insert 6QQ can be obtained, which has two ends for one --- I;-I ---- wood ----I- ~~ order (please read the precautions on the back before filling this page ) This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 42 450017 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (39) The first sub-assembly (not shown) The terminal 620 is connected to a corresponding electronic device 622 of a second electronic component (not shown). Although not shown, most intermediate connecting elements can be «fixed to—such as supporting pieces with a plurality of holes" and arranged on a thin horizontal ring (such as a rectangular array). As shown in 4CB. "Mei Cheng" as an example, for example, the embodiment of Figures 4A-4D. Obviously, the original length of the slender element (404, 406) (before bending) establishes a limit on how well the tap can extend from the sheet, in other words , Which is the limit on the length (and / or height) of the coupling element in the result. As used herein, the term "length" generally refers to the shape of an elongated element (if there is a track size before &gt; The term "height" generally refers to the stepwise size of the elongated element (and the final intermediate connecting element) after shaping and coating. For the reasons discussed in this document, these terms are generally replaceable. As described above, • A region of microelectronics is considered to be desirable for fabricating an array of intermediate connection elements with a fine gap of 0.010 inches (10 mils) between adjacent intermediate connection elements. However, It can also be desirable for each intermediate connection element to have a height of 50 mils, 100 or more. See circle 4D, which can be seen in the middle of the intermediate quick-connect structure (for example, 40 6, 416) 10 Mil space Such a height of the middle tensioning element is physically impossible. Figures 7A and 7B show the technology for overcoming material limitations according to the present invention. ----- 1T ------. ¾ ^ an | (Please read the notes on the back before filling in this page) This paper size applies to China National Standard (CNS) A4 (210X297 mm) 43 4 5 0 0 1 Α7 Β7 Printed by the Consumer Cooperatives of the Central Government Bureau of the Ministry of Economic Affairs 5. Description of the Invention (40) Country 7A shows a flat sheet of soft material 702. A single elongated element 704 (compare 404, 504) , 604) 僳 is formed on the sheet 702, and is bent in one direction (downward, as shown) * to form a tap that extends downward from the sheet 702. Because, as mentioned above, we expect to have a considerable length but Intermediate connecting elements arranged closely to each other, the core 710 is then attached to the upper (as shown) surface of the tap, near the free end of the tap *, and is shaped to have a resilience. The core can have any (For example * comparing the shape shown in circle 1B) and can be of virtually any desired length * And a gold bonding wire is connected to the tap together. As shown in Section 7B, the final fibrillation system of the tap 7D4 and the core 71 0 is covered with a hard material section 712 such as suspicion and its alloy. Nuclear 710 Roughly (eg, at ninety degrees) extends to the surface of tap 704. In this way, an intermediate connection structure for an insert can be obtained, which has two ends for a first electronic component The terminal 720 (not shown) is connected to a terminal 722 corresponding to one of the second sister-in-law pieces (not shown). The tap (the outer shell is plated with the elongated element 7Q4 of the material section 712) serves as the core 710 A "suspension support", and also a scissor tip at the lower end of the core (as shown). This is advantageous, especially for applications that require intermediate building elements to adjust the total deviation in coplanarity of the terminals of an electronic component to be contacted. For example, an electronic component may have a non-planar surface. In this case, the terminals of the sub-component (eg, 722) will be at different positions on the “ζ” (vertical) axis. The two structures act to regulate this non-planarity. First ---------- Install ------ Order (please read the precautions on the back before filling this page) This paper size adopts China National Standard (CNS) Α4 specification (21〇 × 297) (Centi) 44 4 5 〇 0 t 7 Α7 Β7 Employees' Cooperative Cooperatives of the Ministry of Economic Affairs of the Central Bureau of Commerce of the People's Republic of China Imprint 5. Description of the Invention (41) First, the tap (704) can easily be used to adjust these irregularities (positional tolerances) ) * While allowing the intermediate connection element 710 to establish a relatively strong and predictable elastic force between the two interconnected electronic components. The second * outer core can also exhibit a combination of plastic and elastic deformation. Plastic deformation regulates the non-planarity of the terminals on the electronic component. Therefore, the overlying elongated element mainly functions as a suspension support for the overlying elongated element 710 without making a considerable contribution to the contact force used by the overlying elongated element 710, even if it is harder than An overlying elongated element 710. (Comparing the diffuse support 338 of Example 330 of Plaque 3B). Alternatively, the elongated element 7D4 may be substantially entirely covered by the light army (for example, this is more than the mask material 510 of the 5C garden), so that the elongated element 704 acts on the force formed mainly by plastic deformation rather than strong deformation | reaction. In this respect * this alternative structure will bear some (limited) functional similarities to the embodiment shown in Figure 3B. The slender element 70 4 is partially or completely covered by a mask. Although it is necessary to control the outer material Π2 formed on it, it is necessary to adjust its physical characteristics * to be employed within the scope of the present invention. Obviously • The embodiment of FIGS. 7A-7B can make the intermediate quick-connecting element M-fine (such as &gt; 10 mil) gap, but it has a length and extension to a gap larger than 逭 (such as · 1D0 Mils). The core (71Q) can be mounted on a flat coil spring at one end, such as the flesh end of a spiral spring as shown in the aforementioned USP 4.893.172, which is contained in the scope of the present invention.馎 诰 Inexpensive Draw Elements 8A and 8B_shows the technology for manufacturing corresponding intermediate connection elements. (Please read the precautions on the back before filling out this page) This paper size is applicable to China National Standard Vehicle (CNS) Α4 specification (210 X 297 mm) 45 edited by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, printed A7 B7 V. Invention Description (42) Such as the "Mizun contact" of most of these components, and automatically These sisters are assembled into a shuttlecock assembly such as a semi-conductive cross-member or insert as a supporting substrate. Circle 8A shows a technique 80 0, in which a flat sheet (foil) 80 2 such as a soft-feed material is formed into a plurality of (this shown one) slender elements (tap) 804 by street bed, etching or the like. . The elongated member 804 'is then formed into a shape having a spring. Each of the elongated members 80 4 has a bottom portion 804a, which is actually a residual (residual) portion of the sheet 802, and it is preferably allowed to remain coplanar with the sheet 8Q2. Each elongated element 804 has one end (top) 8Q4b at the opposite end of the elongated element 804 from the bottom 804a. The elongated element 804 is bent in the area 804c between the top 804b and a portion 8 (Md) adjacent to the bottom 8Q4a * to have any shape entangled with a strong spring. Suitable photomask materials 806 · such as photoresist, Naishi On the second support of the sheet 802, it is included (as shown) on the bottom 804a of the elongated element 804, leaving the "operable" part of the elongated element 804 unmasked. The element is then clad with a combination of materials 8Q8. It is determined as the ability to impart ® properties to the final intermediate connection element, as described above. The clad material can optionally cover the bottom 804a of the elongated element 804. Guangjun Material 8Q 6 is then removed, such as by buried etching. This results in a large number of corresponding composite intermediate connection elements that can be mounted on a sub-assembly or supported by a fixed element. The bottom (804a) is connected to a predetermined space (for example, a line) from each other supporting the substrate. Alternatively, most of the intermediate connecting elements formed according to this technology can be supported by an elastomer in an array. --------- 1 clothing ------ ir ------ ^ (Please read the back first Note: Please fill in this page again.) This paper size is applicable to China National Standard (CNS) A4 (2 丨 OX297 mm) 46 4500 0 A7 Β7 Printing policy of the Bayer Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (43 ) Section 8B shows another technique 8 513 · In which a flat sheet (萡) 852 such as a soft mesh material is punched, etched, or the like to form a plurality (this shows six) of elongated elements (tap) 854. The elongated element 8Q4 is set to have the shape of a spring. The split head 854a is comparable to the bottom 904a in the previous embodiment 800. In this example 850, the sheet is weighed so that the bottom 854 a are all connected to each other. The "bridge" 85 6 shown is for illustrative purposes only. The slender element can be shaped during or after the weighing bed. The slender element 854 is fixed to have a spring shape, and then the quilt Cover with a suitable material (not shown), as described above. The outer cover (not shown, as described above) is best applied while the elongated elements are still interconnected with each other * and any photomask material is applied Include a majority in a final step The thin sheets of connected, overlying elongated elements are further punched to separate (separate) the overlying and overlying elongated elements from each other. As in the previous example 8Q0, this technique 850 causes the knife to have multiple opposing intermediate connecting elements, They can be mounted to a sister-in-law piece, or they can be supported in an array by the bottoms that hold them together. Alternatively, most intermediate connection elements formed according to this technique can be suspended in an array by a body Medium.

第9画獪示使用上述翡於自一軟金雇薄Η製造中間連 接元件的另一偁優點,該软金羼薄片已被外覆Μ —硬材料 。«接器900包含一塑膠的本臑902及多數個(顯示二傾) 用於連接器本體902内之中間連接元件9 04、306。各中間 連接元件(902、904) Μ—類似於上述有醆第4A-4D 本紙張尺度適用中國國家標準(CNS ) Α4規格(2ΙΟΧ297公釐) ---------裝------訂------涞 (請先S讀背面之注意事項再填寫本頁) A7 45001 7 _B7_ 五、發明説明(44 ) 圃之插人物的方式被製造•即一軟金羼薄片910被鐮形及 定形成具有一特定肜狀,且於長外覆K —硬材料912俾提 供所锊機械特性(如·彈性能)。如先前的例子,具有傑 出霣氣特性(如•金)之材科的一最後層(未顯示)能被 施加於外覆的中間連接元件上。 連接器900逸於收纳另一個匹配的連接器或電子組件 ,諸如所示者,具有自表面延伸之接脚924及926的霣子姐 件920,接脚924及926分別插人中間連接元件904及306。 如上述,本發明大大有別於習知技術,其中一外覆β 係用來傳授所需之櫬械特性(如•彈性)至另一非彌性、 易成形、未發逹的中間連接元件(接觸结構)。於習知技 藝中•塗曆(包括金霄鍍)係主要用於強化中間連接元件 的電氣特性*且防止腐蝕。 中間連接元件能在電子組件上“於其原來的位置”被 製成,或“預先製造”供随後安裝於電子姐件之用。 雖然本發明已於圖式及前述說明中詳细予Μ繪示及說 明•其乃供說明而非特性上的限制。吾人應瞭解僅有較佳 實施例已被顯示及描述,且所有來自本發明精神之變化及 修飾應被保護的。無疑地,熟於本發明相闢技術者會賺想 到許多其它上述之“主«&quot;的&quot;變化Μ ,而如此所掲露者 ,此等變化乃意羼本發明範矚之内。若干的此等變化則敘 述於母案之中。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐〉 (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部中央標準局員工消費合作社印製 48 A7B7 修正 :委Μ明. 五、發明説明(45 ) 元件編號對照表 經濟部中央標準局員工消費合作社印製 110 電氣中間連接疋件 114 殼 122 核 130 電氣中間連接元件 134 硬殼 142 軟核 150 中間連接元件 154 硬殼 212 電子組件 216 線核 220 外層 222 内部細長傳導元件 226 外層 240 電子組件 254 犧牲基材 258 尖牺結構 262 外覆材料 2ί56 支ί#結構 272 光罩材料 276 開口 280 核 284 材料層 30Γ)、 3 08 穿透孔 320 硬材科 112 核 120 中間連接元件 124 硬殼 132 軟核 140 中間連接元件 144 硬殼 152 軟核 210 中間連接元件 214 I.UJ ~Γ 218 内層 220 第2 Β圖中間連接元件 224 介電層 231 ··· 236 中問連接元件 252 光罩材料 257 壓花工具 260 核 264 中間連接元件 268 片材 274 基材 278 軍一壓縮 282 金層 ' 302 绝緣基材 m… 3 18 核 (請先閱讀背面之注意事項再填寫本頁) -40 -本紙法尺度速用中國国家標準(CNS ) Α4規格(2[0Χ297公釐) ^•SQOi ? A7 B7 五、發明説明(46 ) 經濟部中央標準局員工消費合作社印製 322 · 324 、 326 、 323 、 332 中間連接元件 334 支撑基材 336 伸透孔 333 材料 362 中問連接结構 364 支撑基材 366 穿透孔 368 電镀 300 - 330 、 360 插入物 31 軟銲 32 晶片電極 41 軟焊料 42 基材電極 400 中間連接结溝(插入物 402 薄片 404、 406 細長元件 408 光罩材抖 410 絶縴層支撑層 412 多數Μ孔(硬材料Ϊ 41 2 416 細長元件 420、 422、424、426 端子 5 0 0 插入物 502 薄片 50 4 506 細長元件 510 光罩材料 512 硬金屬材料 520 ' 522 端子 600 插入物 6 02 軟金屬線圏(薄片) 60 4、 606 細長元件 608 底部 610 光罩材料ί光阻) 612 硬金屬材料 6 20、 622 端子 702 平坦薄Η 704 細長元件 710 核 712 外覆材料(硬材料) 720 ' 722 端子 802 平坦薄Η (箔) 804 細長元件( 分接頭) 806 光罩材料 808 材料 852 平坦薄Η (箔) 8S4 細長7t件( 分接頭ί 85Β 橋 900 連接器 902 連接器本體 904 &gt; 9 Of) 中問連接元件 (請先閱讀背面之注意事項再填寫本頁) 本紙伕尺度適用中國國家標準(CNS ) Μ規格(2⑴X 297公釐) 4 50 CM 7 A7 B7 五、發明説明(47 ) 910 軟金震薄片 920 電子組件 912 哽材科 924 ' 926 接鯽 {請先閱讀背面之注意事項再填寫本頁)Fig. 9 shows another advantage of using the above-mentioned materials to manufacture an intermediate connection element from a thin sheet of soft gold, which has been coated with M-hard material. «The connector 900 includes a plastic base 902 and a plurality (showing two tilts) for the intermediate connecting elements 9 04,306 in the connector body 902. Each intermediate connecting element (902, 904) M—Similar to the above-mentioned 4A-4D. The paper size applies the Chinese National Standard (CNS) A4 specification (2ΙΟ × 297 mm) --------- install --- --- Order ------ 涞 (Please read the precautions on the back before filling this page) A7 45001 7 _B7_ V. Description of the Invention (44) The way of inserting characters in the garden is made. That is, a soft gold 羼The sheet 910 is sickle-shaped and shaped to have a specific shape, and is covered with a long K-hard material 912, which provides the mechanical properties (such as elasticity). As in the previous example, a final layer (not shown) of a material family with outstanding radon properties (such as • gold) can be applied to the overlying intermediate connection element. The connector 900 is accommodating another mating connector or electronic component, such as the one shown in the figure, which has pins 924 and 926 extending from the surface, and the pins 924 and 926 are inserted into the intermediate connecting element 904, respectively. And 306. As mentioned above, the present invention is very different from the conventional technology, in which an overlying beta is used to impart the required mechanical properties (such as • elasticity) to another non-differential, easy-to-form, and uninterrupted intermediate connecting element. (Contact structure). In the know-how • Tu calendars (including Jinxiao plating) are mainly used to strengthen the electrical characteristics of intermediate connection components * and prevent corrosion. The intermediate connection element can be made "on its original position" on the electronic component, or "prefabricated" for subsequent mounting on the electronic component. Although the present invention has been shown and described in detail in the drawings and the foregoing description, it is provided for illustration rather than limitation on characteristics. We should understand that only the preferred embodiments have been shown and described, and all changes and modifications from the spirit of the invention should be protected. Undoubtedly, those skilled in the invention of the present invention will think of many other variations of the above-mentioned "master", and those who are disclosed are intended to be within the scope of the present invention. These changes are described in the mother's case. This paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) (Please read the precautions on the back before filling this page) Set the consumption of employees of the Central Standards Bureau of the Ministry of Economic Affairs Printed by the cooperative 48 A7B7 Amendment: Ming Ming. V. Description of the invention (45) Component number comparison table Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economics Printed 110 Electrical intermediate connection parts 114 Shell 122 Core 130 Electrical intermediate connection elements 134 Hard shell 142 Soft core 150 Intermediate connection element 154 Hard shell 212 Electronic component 216 Wire core 220 Outer layer 222 Inner slender conductive element 226 Outer layer 240 Electronic component 254 Sacrifice substrate 258 Pointed sacrifice structure 262 Cover material 2 56 # Structure 272 Mask material 276 Opening 280 Core 284 Material layer 30Γ), 3 08 Penetration hole 320 Hard Materials Division 112 Core 120 Intermediate connection element 124 Hard shell 132 Core 140 Intermediate connection element 144 Hard shell 152 Soft core 210 Intermediate connection element 214 I. UJ ~ Γ 218 Inner layer 220 Figure 2 Β Intermediate connection element 224 Dielectric layer 231 ··· 236 Intermediate connection element 252 Photomask material 257 Pressure Flower Tool 260 Core 264 Intermediate Connection Element 268 Sheet 274 Substrate 278 Army One Compressed 282 Gold Layer '302 Insulating Substrate m ... 3 18 Core (Please read the precautions on the back before filling this page) -40-Paper method Quick Speed Standards Chinese National Standard (CNS) A4 Specification (2 [0 × 297mm) ^ • SQOi? A7 B7 V. Description of Invention (46) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 322 · 324, 326, 323, 332 Intermediate connection element 334 Support substrate 336 Perforation hole 333 Material 362 Intermediate connection structure 364 Support substrate 366 Penetration hole 368 Plating 300-330, 360 Insertion 31 Soldering 32 Wafer electrode 41 Soft solder 42 Substrate electrode 400 Intermediate connection groove (insert 402 sheet 404, 406 elongated element 408 mask material shake 410 insulation layer support layer 412 most M holes (hard material Ϊ 41 2 416 elongated element 420 422, 424, 426 Terminals 5 0 0 Inserts 502 Sheets 50 4 506 Slim elements 510 Photomask material 512 Hard metal materials 520 '522 Terminals 600 Inserts 6 02 Soft metal wire coils (sheets) 60 4, 606 Slim elements 608 Bottom 610 Photomask material (Photoresist) 612 Hard metal material 6 20, 622 Terminal 702 Flat thin Η 704 Slim element 710 Core 712 Cover material (hard material) 720 '722 Terminal 802 Flat thin Η (Foil) 804 Slim element ( Tap) 806 Photomask material 808 Material 852 Flat and thin 箔 (foil) 8S4 Slim 7t pieces (Tap ί 85Β Bridge 900 Connector 902 Connector body 904 &gt; 9 Of) Intermediate connection elements (Please read the note on the back first Please fill in this page for more details) This paper's standard is applicable to Chinese National Standards (CNS) M specifications (2⑴X 297mm) 4 50 CM 7 A7 B7 V. Description of the invention (47) 910 Soft gold shock sheet 920 Electronic component 912 哽 材 科 924 '926 then (Please read the notes on the back before filling out this page)

-1T 經濟部中央標準局負Η消費合作社印製 本紙法尺度通用十國國家標準(CNS ) Α4说格(210Χ 297公釐)-1T Printed by the Central Bureau of Standards of the Ministry of Economic Affairs and printed by a consumer cooperative. The paper standard is a universal ten-country national standard (CNS). A4 (210 × 297 mm)

Claims (1)

4 50 0 1 t、申請專利範圍 第85105623號專利再審查案申請專利範圍修正本 (锖先閱讀背面之注意事項再填寫本頁) 修正曰期:90年04月 1- 一種製造供微電子應用之一中間連接元件之方法,其 包含: 提供一具相對軟性材料之核;及 以一相對硬性材料之殼來外覆該核, 其中該核係由一金屬片材所圖案化之接頭。 2. —種製造一插入物之方法,其包含: 在一第一片材令成形一個如兩接頭之中間連接元 件’該中間連接元件具有一第一接頭及一第二接頭; 折彎該等接頭,藉此該兩接頭中之一者以一第一 方向由該片材延伸,且藉此該兩接頭之另—者以一第 二方向自該片材延伸; 以一降伏強度高於該第一片材之第二材料外覆該 等接頭。 3·如申請專利範圍第2項之方法,其更包含: 提供多數中間連接元件;且 經濟部智慧財產局負工消費合作社印裂 使用一絕緣片材,以一彼此間之空間關係支撐該 多數中間連接元件。 4.如申請專利範圍第2項之方法,其十: 在折f該等接頭之前,該第一接頭係縱向地與該 弟一择頭排成一線。 5·如申請專利範圍第2項之方法,其中: 在折彎該等接頭之前’該第一接頭係平行於該第4 50 0 1 t. Application for Patent Scope Revision of Patent No. 85105623. Revision of the scope of patent application (锖 Please read the precautions on the back before filling this page) Date of amendment: April 1990-A manufacturing for microelectronic applications A method of intermediately connecting components includes: providing a core of a relatively soft material; and covering the core with a shell of a relatively hard material, wherein the core is a joint patterned by a metal sheet. 2. A method for manufacturing an insert, comprising: forming an intermediate connection element such as two joints on a first sheet, the intermediate connection element having a first joint and a second joint; bending such A joint whereby one of the two joints extends from the sheet in a first direction, and thereby the other of the two joints extends from the sheet in a second direction; with a drop strength higher than the The second material of the first sheet covers the joints. 3. The method according to the second item of the patent application scope, further comprising: providing a plurality of intermediate connecting elements; and the consumer goods cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs uses an insulating sheet to support the majority with a spatial relationship between each other Intermediate connection element. 4. The method according to item 2 of the patent application scope, which is ten: Before folding the joints, the first joint is longitudinally aligned with the younger one. 5. The method of claim 2 in the scope of patent application, wherein: before the joints are bent, the first joint is parallel to the first joint. 45〇〇ι745〇〇ι7 六、申請專利範圍 經濟部智慧財產局員工消費合作社印製 二接頭。 6.如申請專利範圍第2項之方法,其中: 在折彎該等接頭之前, _ J这第一接頭係平行於該第 二接頭,且該等接頭共用一基座 7·-種用於製造一中間連接元件之方法,其包含: 由一第—片材成形-作為-接頭之第-加長元 件,該接頭具一自由端部; 將第一加長疋件之—第一端裝設於該接頭之自 由端部,該第二加長元件具一第二端,該第二加長元 件以一第二材料製成;及 以一降伏強度高於該第二材料之一第三材料外覆 該第二加長元件以及該第—加長元件之至少一毗鄰部 份- 8. 如申請專利範圍第7項之方法,其更包含: 在外覆該第二加長元件期間,外覆該整個第一加 長元件。 9. 如申請專利範圍第7項之方法,其更包含: 將多數第二加長元件之第一端部裝設至多數接頭 之自由端上。 10. 如申請專利範圍第9項之方法,其更包含: 以彼此間之空間關係配置該多數接頭a 11· —種製造供用於微電子應用上之一具有經控制之阻抗 之彈性中間連接元件之方法,其包含: 成形一内部加長導體元件以具有一彈簧的形狀; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公t ) ,^---------訂--- ----1-線 Ϊ (琦先閲讀背面之注意事項再填寫本頁) 450 0 1 7 A8 B8 C8 D8 申請專利範圍 在該内部元件上施予一電介材料; 以一導體材料外覆該電介材料層。 12‘如申請專利範圍第^項之方法,其中: 該内部元件包含一具有一降伏強度之材料之核; 該核外覆以一足夠厚度以及足夠降伏強度之材 料’該外覆材料之降伏強度大於該核,使得該所得之 中間連接元件具有一所欲之彈性量。 13. —種供用於微電子之十間連接元件,其包括: 一由軟性材料製成之核; 一位於該核外之硬性材料; 其中*該硬性材料之選擇係依據其使所得之中間 連接元件具有彈性的能力,以及 該核係由一片材形成之一接頭。 14. 一種製造各別彈簧接觸元件之方法,其包含: 將一片材圖案化以使之具有多數加長元件,每一 加長元件具一尖端且一相反於該尖端之基座部; 將每一加長元件成形,以使得在該尖端與相鄰該 基座部分之該加長元件的一部份之間的區域具有—彈 簧形狀; 以依據其使所得之中間連接元件具有彈性的能力 而選擇出之材料來外覆至少每一個除了其基座部分外 之整個加長元件。 1 5_如申請專利範圍第14項之方法,其更包含: 將該彈簧接觸元件自該片材分離。 準(cns)m ϋ&quot; ^请先閲讀背面之注意事項再填寫本頁) 裝---------訂---------線 ! 經濟部智慧財產局員χ消費合作社印製 (210 χ 297 公釐〉 AS B8 C8 D8 六、申請專利範圍 16. 如申請專利範圍第15項之方法,其更包含: 將該彈簧接觸元件裝設至一電子組件上。 17. 如申請專利範圍第14項之方法,其更包含: 以一預定之彼此間之空間關係來支撐該多數彈簧 接觸元件。 --------------裝---- (請先閱讀背面之注意事項再填寫本頁) 訂---------線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公餐)6. Scope of patent application Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. The method of claim 2 in the scope of patent application, wherein: before bending the joints, the first joint of _J is parallel to the second joint, and the joints share a base 7 ·- A method of manufacturing an intermediate connecting element, comprising: forming a first-sheet material-as a second-extension element of a joint, the joint having a free end; and mounting the first end of the first extension member on The free end of the joint, the second extension element has a second end, the second extension element is made of a second material; and the third material is covered with a third material having a higher drop strength than the second material The second lengthening element and at least one adjacent part of the first lengthening element-8. if the method of claim 7 of the patent application scope further includes: covering the entire first lengthening element during the period of covering the second lengthening element . 9. The method according to item 7 of the patent application scope, further comprising: mounting the first ends of most of the second extension elements to the free ends of most of the joints. 10. The method according to item 9 of the scope of patent application, further comprising: arranging the plurality of joints in a spatial relationship with each other a 11 · —a kind of elastic intermediate connection element with controlled impedance for manufacturing for use in microelectronic applications The method includes: forming an internally elongated conductive element to have a shape of a spring; the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 g t), ^ --------- order --- ---- 1-Wire 琦 (Please read the notes on the back before filling this page) 450 0 1 7 A8 B8 C8 D8 The scope of patent application is to apply a dielectric material on the internal component; a conductor Material is overlaid on the dielectric material layer. 12 'The method according to item ^ of the scope of patent application, wherein: the internal element includes a core of a material having a yield strength; the core is covered with a material having a sufficient thickness and a sufficient yield strength' the yield strength of the cover material Larger than the core, the resulting intermediate connecting element has a desired amount of elasticity. 13. —Ten connection elements for microelectronics, including: a core made of a soft material; a hard material located outside the core; where * the choice of the hard material is based on the intermediate connection obtained The element has the ability to be elastic, and the core is a joint formed from one piece of material. 14. A method of manufacturing individual spring contact elements, comprising: patterning a sheet to have a plurality of extension elements, each extension element having a tip and a base portion opposite to the tip; each The extension element is shaped so that the area between the tip and a portion of the extension element adjacent to the base portion has a spring shape; it is selected based on its ability to make the resulting intermediate connecting element elastic. The material covers at least each of the entire lengthening elements except its base portion. 1 5_ The method according to item 14 of the patent application scope, further comprising: separating the spring contact element from the sheet. Cn (cns) m ϋ &quot; ^ Please read the notes on the back before filling out this page) Install --------- Order --------- line! Member of Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Cooperatives Printing (210 χ 297 mm) AS B8 C8 D8 VI. Application for Patent Scope 16. For the method of the scope of patent application item 15, it further includes: mounting the spring contact element on an electronic component. 17. Such as The method for applying for the scope of patent application No. 14 further includes: supporting the plurality of spring contact elements with a predetermined spatial relationship between each other. -------------- installation ---- ( Please read the precautions on the back before filling this page) Order --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics The paper size is applicable to China National Standard (CNS) A4 (210 X 297 public) meal)
TW085105623A 1995-09-21 1996-05-13 Composite interconnection elements for microelectronic components, and methods of making same TW450017B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52624695A 1995-09-21 1995-09-21

Publications (1)

Publication Number Publication Date
TW450017B true TW450017B (en) 2001-08-11

Family

ID=24096531

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105623A TW450017B (en) 1995-09-21 1996-05-13 Composite interconnection elements for microelectronic components, and methods of making same

Country Status (1)

Country Link
TW (1) TW450017B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114206540A (en) * 2019-08-28 2022-03-18 图尔克股份有限公司 Welding device and method for connecting an electrical terminal, which is preassembled in a contact carrier, to an electrical conductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114206540A (en) * 2019-08-28 2022-03-18 图尔克股份有限公司 Welding device and method for connecting an electrical terminal, which is preassembled in a contact carrier, to an electrical conductor
CN114206540B (en) * 2019-08-28 2023-09-26 图尔克股份有限公司 Fusion device and method for connecting electrical terminals preloaded in a contact carrier with electrical conductors

Similar Documents

Publication Publication Date Title
KR100324059B1 (en) Interconnection Elements for Microelectronic Components
US6029344A (en) Composite interconnection element for microelectronic components, and method of making same
JP3360179B2 (en) Ball grid array socket
US5974662A (en) Method of planarizing tips of probe elements of a probe card assembly
KR100335167B1 (en) Method of testing semiconductor devices
JP2009508141A (en) Lateral interposer contact design and probe card assembly
US6402526B1 (en) Microelectronic contact assembly
JPH08508613A (en) Spring biased tapered contact element
JP2002313839A (en) Molded lead structure and method of forming the same
TWI335627B (en) Microelectronic assemblies having compliancy
JP2008518209A (en) An electroformed spring made on a mandrel that can be moved to other surfaces
JP2006013526A (en) Assembly of electronic component equipped with spring packaging
JP2004336062A (en) Contact carrier (tile) for stationing spring contact to larger substrate
TW201101443A (en) Substrate having leads
US5928005A (en) Self-assembled low-insertion force connector assembly
US6532654B2 (en) Method of forming an electrical connector
US6857915B2 (en) Wire bonding surface for connecting an electrical energy storage device to an implantable medical device
TW450017B (en) Composite interconnection elements for microelectronic components, and methods of making same
JPS59222947A (en) Semiconductor device and manufacture thereof
KR100623099B1 (en) Electrical Connection Between two Electronic Components
EP0792519B1 (en) Interconnection elements for microelectronic components
KR100278342B1 (en) How to change the orientation of the probe element in the probe card assembly
KR100556638B1 (en) Method of Forming a Contact Assembly
JPS5917855B2 (en) Semiconductor support and method for manufacturing a semiconductor device using the semiconductor support
KR100517256B1 (en) Electrical Contact Structures from Flexible Wire

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees