448552 5983twf.doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（/ ) 本發明是有關於一種感測器（sensor)的封裝結構，特 別是有關於一種可以改善散熱方法之感測器封裝結構。 傳統感測器產品使用的封裝皆以陶.瓷封裝爲主，因爲 陶瓷的耐熱度高，故其產品的可靠度高，一般均使用於軍 用及工業級的製品上。由於近年來電子產業的篷勃發展， 其感測器的應用範圍也越來越廣，其商用及消費性產品使 用感測器產品的情況也越來越普遍，若這些商用及消費性 產品均用陶瓷封裝之感測器，則會使產品的成本過高。 目前國內有很多家封裝產商均使用印刷電路板（PCB)或 BT(雙順丁烯二酸醯亞胺）PCB板（BT substrate)來執行感 測器封裝作業，可大幅降低封裝成本，並可提昇感測器的 應用層面。 請參照第1A圖、第1B圖和第1C圖，其係繪示依照 —習知技術的=種感測器封裝結構圖，其中圖爲其 上視圖，第爲其部份剖面正視圖，而第\.1|圖爲其仰 \ 視圖。習知之感'測•封裝（sensor package)結構，包括一 PCB 板（印刷電路板，printed circuit board) 10，\暮替含一 正面 12 和一反面 14 ; 一環壁（per ipheral wal 1) 16，以 塑膠爲材質，環繞該PCB板10之正面12之四周，並以一 黏著劑（adhesive)固定於該PCB板10上，且該環壁16與 該PCB板構成一晶片容納空間17;—晶片座（die pad) 20， 以銅箔爲材質，製作於該PCB板10之該正面12上之中央； 一晶片（ctnp) 30,其包含一主動表面31和其相對應之一 背面33,該主動表面31上包含複數個焊墊（bonding 3 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（2儿x 297公釐) B7 448 5 5 2 5983tvvf.doc/006 五、發明說明（>) pad)(圖中未顯示），而該背面33則黏貼於該晶片座20 上； 複數個接腳（leads) 40，以銅箔爲材質，製作於PCB板1〇 之該正面12上而配置於該晶片30之周邊，且包含至 少一個接地接腳（ground iead) 42;複數條導線（bonding wire) 32 '用來將晶片30上之該焊墊電性連接至PCB板10 之該正面12上之該複數個接腳40 ;複數個接點 (connect ing points) 70，配置於該 PCB 板 10 之該反面 14 之周邊上，並在製作時穿過PCB板10之厚度方向電性連 接於該PCB板10之正面12上之該複數個接腳40 ;以及一 透明頂蓋（top lid) 18，配置於該晶片30之上方，以密 封該晶片之容納空間17。 唯上述使用PCB板（印刷電路板）或BT製造之基板雖 可大幅降低封裝成本，但因散熱不良，使得感測器在低照 度的情況下，會產生漏電現象（影像模糊不淸），所以如何 解決散熱問題是目前重要的課題。 本發明的目的之一，就是在提供一種改善感測器的散 熱方法，使得即使使用印刷電路板或BT製造之基板來執 行感測器封裝作業，亦可得到與使用陶瓷封裝同等的散熱 效果。 本發明提出一種改善散熱方法之感測器封裝，建構於 一 PCB板（印刷電路板）上，包含一固定於該PCB板上之一 環壁，一以銅箱爲材質之晶片座，一晶片，複數個以銅箱 爲材質之接腳'複數條用來將晶片電性連接到接腳之導 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閲讀背面之注意事項再填寫本頁) I . —--I I I 訂 -----^ 經濟部智慧財產局員工消費合作社印製 448552 A7 5983twf.doc/006 ______B7________ 五、發明說明（3) (請先閲讀背面之注意事項再填寫本頁) 線’複數個接點，一散熱片，一散熱片連接部，以及一透 明頂蓋。其中該複數個接點係以銅箔爲材質而配置於PCB 板上之該反面之周邊上並在製作時穿過PCB板之厚度方向 而連接至該複數個接腳，而其中該散熱片亦係以銅箔爲材 質而設置於該PCB板之背面上並電性連接於該複數個接腳 中之接地接腳而藉該散熱片連接部連同該複數個接腳以及 晶片座形成一散熱路徑。又該透明頂蓋係固定於該環壁用 來密封該晶片者。 依照本發明之一較佳實施例，其中用來連接散熱墊之 接地接腳及其所形成之散熱路徑可以有一個至數個。 依照本發明之另一較佳實施例，其中用來做散熱路徑 之接地接腳其寬度可以由內向外漸次擴大，俾加強其散熱 效果。 依照本發明之又一較佳實施例，其中該散熱塾之面積 在可能的範圍內可儘量放大，俾加強其散熱效果。 經濟部智慧財產局員工消費合作社印製 而上述之透明頂蓋可以是透明玻璃片或透明塑膠片， 配置於晶片容納空間之頂端，並固定於環壁上；或者可以 是透明液態材料，將其塡充於晶片容納空間中，並經過固 化程序而形成。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式’作詳 細說明如下： 圖式之簡單說明： 弟1A圖、第1 b圖和第1C圖繪示依照一習知技術 本紙張尺度適用中國國家標準規格（210 κ 297公釐> 448 5 5 2 5983tvvf.doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（/f ) h.:h Λ , ·'/ ，C 的一種感測器封裝結構圖，其中第卵爲其上視圖，第P 圖爲其部份剖面正視圖，而第l|:圖声其仰視圖。 第2A圖、第2B圖和第’'、紅/圖繪示依照本發明之一 實施例的77種感測器封裝結構圖，其中第2A圖爲其上視 圖，第2B;;网.爲其部份剖面正視圖，而氣圖爲其仰視圖。 第圖 '第3B圖和第3C圖繪每依照本發明之另 —實施例的種感測器封裝結構圖，其中$ . 3 A圖爲其上 視圖，第3藏:攀篇其部份剖面正視圖，而第崩爲其仰視 圖。 第4圖繪示依照本發明之又一實施例的一種感測器 封裝結構圖。 圖式之標示說明： 10 : PCB 板 12 :正面 14 :反面 16 :環壁 Π:晶片容納空間 18 :透明頂蓋 20 :晶片座 22 :散熱墊 30 :晶片 31 :主動表面 32 :導線 33 :背面 6 llj . -------------Μ.— (請先閱績背面之注意事項再填寫本頁) . 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐） A7 B7 五、發明說明（r) 40 :接腳 42 、 52 、 62 44 、 54 、 64 70 :接點 72 ' 82 ' 92 448 55 2 59S3twf.doc/〇〇6 接地接腳 74、84、94 :散熱墊連接部 102 :接地接點 實施例 請參照第2A圖、第2B圖和第2C圖其繪示照本 發明之一實施—種感測器封裝結構圖’其中圖 爲其上視圖，第圖爲其部份剖面正視圖，而第_ ^爲 其仰視圖。本發·胡；i感測器封裝（sensor package)i吉― 括一 PCB 板(印刷,¾板，printed ci rcui t board)'. 1之 其包 含正面12和一反面14 ; 一環壁 (peripheral wall) 16，以塑膠爲材質，環繞該PCB板10 之正面12之四周，並以一黏著劑（adhesive)固定於該PCB 板10上，且該環壁16與該PCB板構成一晶片容納空間17 ; 一晶片座（die pad) 20，以銅箔爲材質，製作於該PCB板 10之該正面12上之中央；一晶片（chip) 30，其包含一主 動表面31和其相對應之一背面33，該主動表面31上包含 複數個焊墊（bonding pad)(圖中未顯示），而該 背面33則以一導熱性黏著劑（heat conductive adhesive) 黏貼於該晶片座20上；複數個接腳（leads) 40，以銅箔 爲材質，製作於PCB板10之該正面12上而配置於該晶片 30之周邊，且包含至少一個接地接腳（ground lead) 42 ; ------------ Μ--------訂---------1、. (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印*1衣 本紙張尺度適用t國國家標準（CNS)A4規格（21〇χ 297公釐） 448552 5983twf.doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（厶） 複數條導線（bonding wire) 32，用來將晶片30上之該焊 墊電性連接至PCB板10之該正面12上之該複數個接腳 40 ;複數個接點（connecting points) 70，配置於該PCB 板10之該反面14之周邊上，並在製作時穿過PCB板10 之厚度方向電性連接於該PCB板10之正面12上之該複數 個接腳 40 散熱塾（heat dissipating pad) 22，以銅 箔爲材質，且以對應於晶片座20之位置設置於該PCB板ί〇 之背面14上，並電性連接於該複數個接腳40中之接地接 腳 42;—散熱塾連接部（heat dissipating pad connecting portion) 44、74，以銅箔爲材質各電性連接於該PCB板10 之該正面12上該接地接腳42與晶片座20之間，以及該PCB 板10之該背面14上該接地接點72與該散熱墊22之間以 形成由晶片座20至散熱墊22之一散熱路徑（heat dissipating path);以及一透明頂蓋（top lid) 18，配 置於該晶片30之上方，以密封該晶片之容納空間Π。 請參照第3A_、第3B圖和第3C圖其繪示依發明 之另一實施例1^:十種感測器封裝結構圖，其中第圖爲 ’、\ π ’' 部份剖面正視圖，而第3|邋.¥其 仰視圖。本發^之感測 器封裝（sensor 中用來連接散熱塾,、努-之散熱片連接部44、54、64、7\、§\、 94和其所形成之散熱路徑以及其所採用之接地接腳42、 52、62，和接地接點72、82、92可以有一個至數個，其 中第3A圖和第3B圖中所示者爲三個，以加強其散熱效果。 請參照第4圖其繪示依照本發明之又一實施例的一種 8 (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） A7 448552 5983twr,cioc/〇〇5 五、發明說明（) 感測器封裝結構圖’其中用來做散熱路徑之接地接腳82、 92、102其寬度可以由內向外漸次擴大，俾加強其散熱效 果。 如以上各實施例所述之感測器封裝結構，其中該散熱 墊22之面積在可能的範圍內可儘量放大，俾加強其散熱 效果。 又如以上各實施例所述之感測器封裝結構，其中 該透明頂蓋18可採用一透明塑膠片或透明玻璃片兩者擇 其一，配置於該晶片容納空間之頂端，並固定於該環壁16 之頂端。 又如以上各實施例所述之感測器封裝結構，其中該透 明頂蓋18亦可由一透明液態材料製成，塡充於該晶片容 納空間η，並經過固化程序而形成。透明液態材料包括液 態玻璃或液態膠’其通常含有溶劑，所以還需加熱使宜固 化（CUrlng)。然而點入透明液態材料的步 可以在適度真空環境中進行。 b 雖然本發明已以-較佳實施例贿社，然其並非 用以限定本發明’任何熟習此技藝者，在不脫離本發明之 精神和範圍內’當可作些許之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範園所界定者爲準。 9 ~t--------訂 <請先Μ讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作杜印製 本纸張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐）448552 5983twf.doc / 006 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (/) The present invention relates to a package structure for sensors, and in particular, to a method that can improve heat dissipation. Sensor package structure. The packages used in traditional sensor products are mainly ceramic. Porcelain packages. Because ceramics have high heat resistance, their products are highly reliable. They are generally used on military and industrial products. Due to the rapid development of the electronics industry in recent years, the application range of its sensors has become wider and wider, and the use of sensor products by its commercial and consumer products has become more and more common. If these commercial and consumer products are Using ceramic-encapsulated sensors would make the cost of the product too high. At present, many domestic packaging manufacturers use printed circuit boards (PCBs) or BT (bismaleimide) PCB substrates (BT substrates) to perform sensor packaging operations, which can greatly reduce packaging costs, and Can increase the application level of the sensor. Please refer to FIG. 1A, FIG. 1B, and FIG. 1C, which are diagrams showing the structure of a sensor package according to the conventional technology, wherein the figure is an upper view thereof, and the first is a partial sectional front view thereof, Figure \ .1 | is its bottom view. The sense of the sensor's package structure includes a PCB (printed circuit board) 10, and the twilight contains a front 12 and a reverse 14; a peripheral wal 1 16, The plastic material is used to surround the four sides of the front surface 12 of the PCB board 10, and an adhesive is fixed on the PCB board 10, and the annular wall 16 and the PCB board form a wafer receiving space 17; A die pad 20 is made of copper foil at the center of the front surface 12 of the PCB 10; a chip 30 includes a driving surface 31 and a corresponding back surface 33. The active surface 31 contains a plurality of bonding pads (bonding 3 (please read the precautions on the back before filling this page) This paper size applies to the Chinese National Standard (CNS) A4 specification (2 children x 297 mm) B7 448 5 5 2 5983tvvf.doc / 006 5. Description of the invention (>) pad) (not shown in the figure), and the back surface 33 is adhered to the chip holder 20; a plurality of leads 40, made of copper foil, Fabricated on the front surface 12 of the PCB 10 and disposed around the wafer 30, and includes at least A ground iead 42; a plurality of bonding wires 32 'are used to electrically connect the pads on the chip 30 to the plurality of pins 40 on the front surface 12 of the PCB 10; Connected points 70 are arranged on the periphery of the back surface 14 of the PCB board 10 and are electrically connected to the front surface 12 of the PCB board 10 through the thickness direction of the PCB board 10 during fabrication. A plurality of pins 40; and a transparent top lid 18 are disposed above the wafer 30 to seal the receiving space 17 of the wafer. However, although the above-mentioned substrates made of PCB (printed circuit board) or BT can greatly reduce the packaging cost, due to poor heat dissipation, the sensor will have a leakage phenomenon under low light conditions (the image is blurred). How to solve the heat dissipation problem is an important issue at present. One of the objects of the present invention is to provide a method for improving the heat dissipation of a sensor, so that even if a printed circuit board or a substrate manufactured by BT is used to perform a sensor packaging operation, a heat dissipation effect equivalent to that of a ceramic package can be obtained. The invention proposes a sensor package for improving heat dissipation method, which is constructed on a PCB (printed circuit board) and includes a ring wall fixed on the PCB, a wafer holder made of a copper box, and a wafer. Multiple pins with copper box as material are used to electrically connect the chip to the pins. 4 This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) (please read the back first) Please pay attention to this page before filling in this page) I. --- III Order ----- ^ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 448552 A7 5983twf.doc / 006 ______B7________ V. Description of Invention (3) (Please read first Note on the back, please fill in this page again) cable's multiple contacts, a heat sink, a heat sink connecting part, and a transparent top cover. The plurality of contacts are arranged on the periphery of the reverse surface of the PCB with copper foil as the material, and are connected to the plurality of pins through the thickness direction of the PCB during production, and the heat sink is also The copper foil is used as a material and is disposed on the back of the PCB and is electrically connected to a ground pin among the plurality of pins. A heat dissipation path is formed by the heat sink connection portion together with the plurality of pins and the chip holder. . The transparent top cover is fixed to the ring wall for sealing the wafer. According to a preferred embodiment of the present invention, there may be one to several ground pins for connecting the heat dissipation pads and the heat dissipation paths formed by the ground pins. According to another preferred embodiment of the present invention, the width of the ground pin used as a heat dissipation path can be gradually expanded from the inside to the outside to enhance its heat dissipation effect. According to another preferred embodiment of the present invention, the area of the heat sink can be enlarged as much as possible to enhance its heat dissipation effect. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and the above-mentioned transparent top cover may be a transparent glass sheet or a transparent plastic sheet, which is arranged on the top of the chip accommodation space and fixed on the ring wall; or it may be a transparent liquid material,塡 is filled in the wafer accommodating space and formed through a curing process. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below and described in detail with the accompanying drawings' as follows: Brief description of the drawings: Figure 1A Figure 1, Figure 1b and Figure 1C show that according to a known technology, the Chinese paper standard applies to this paper standard (210 κ 297 mm > 448 5 5 2 5983tvvf.doc / 006 A7 B7 Employees ’Intellectual Property Bureau, Ministry of Economic Affairs employee consumption Cooperative prints 5. Description of the invention (/ f) h.:h Λ, · '/, a sensor package structure diagram of C, wherein the first egg is its top view, and the first figure is its partial cross-sectional front view. And l |: the bottom view of the figure. Figures 2A, 2B, and '', red / figure show 77 kinds of sensor package structure diagram according to an embodiment of the present invention, of which Figure 2A is Its top view, No. 2B; Net. It is a partial cross-sectional front view, and the air figure is its bottom view. Figure 'Figure 3B and Figure 3C depict each kind of sensing according to another embodiment of the present invention. Package structure diagram, of which $. 3 A is its top view, Part 3: Front view of a part of its section, and Di Bian is its bottom view FIG. 4 is a structural diagram of a sensor package according to another embodiment of the present invention. The labeling description of the drawings: 10: PCB board 12: front side 14: reverse side 16: ring wall Π: chip receiving space 18: transparent Top cover 20: Wafer holder 22: Heat sink pad 30: Wafer 31: Active surface 32: Wire 33: Back 6 llj. ------------- M.— (Please read the note on the back first Please fill in this page for more details.) This paper size applies Chinese National Standard (CNS) A4 specification (210x 297 mm) A7 B7 V. Description of the invention (r) 40: Pins 42, 52, 62 44, 54, 64 70: Contacts 72 '82' 92 448 55 2 59S3twf.doc / 〇〇6 Ground pins 74, 84, 94: Heat sink pad connection section 102: Ground contact examples Please refer to Figures 2A, 2B, and 2C It shows a kind of sensor package structure according to one embodiment of the present invention, where the figure is its top view, the figure is a partial cross-sectional front view, and the _ ^ is its bottom view. Benfa · Hu; i The sensor package (sensor package) includes a PCB board (printed ¾ board, printed ci rcui t board) '. 1 which includes a front face 12 and a reverse face 14; a ring wall (periph eral wall) 16, which uses plastic as the material, surrounds the four sides of the front surface 12 of the PCB board 10, and is fixed to the PCB board 10 with an adhesive, and the annular wall 16 and the PCB board form a wafer to accommodate Space 17; a die pad 20 made of copper foil at the center of the front surface 12 of the PCB 10; a chip 30 including an active surface 31 and a corresponding surface A back surface 33 includes a plurality of bonding pads (not shown) on the active surface 31, and the back surface 33 is adhered to the wafer base 20 with a heat conductive adhesive; a plurality of Each lead 40 is made of copper foil on the front surface 12 of the PCB 10 and is arranged around the chip 30, and includes at least one ground lead 42; ---- -------- Μ -------- Order --------- 1. (Please read the notes on the back before filling out this page) Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Cooperative cooperative print * 1 The size of the paper is applicable to the national standard (CNS) A4 specification (21〇χ 297 mm) 448552 5983twf.doc / 006 A7 B7 Printed by the Bureau ’s Consumer Cooperatives 5. Description of the Invention (厶) A plurality of bonding wires 32 are used to electrically connect the pads on the chip 30 to the pins on the front surface 12 of the PCB 10 40; a plurality of connecting points 70 are arranged on the periphery of the reverse surface 14 of the PCB board 10 and are electrically connected to the front surface 12 of the PCB board 10 through the thickness direction of the PCB board 10 during fabrication The plurality of pins 40 are heat dissipating pads 22, which are made of copper foil, and are arranged on the back surface 14 of the PCB board 0 in a position corresponding to the chip holder 20, and are electrically connected to the plurality of pins. Ground pin 42 in each pin 40;-heat dissipating pad connecting portions 44 and 74, each of which is electrically connected to the ground pin on the front surface 12 of the PCB 10 with copper foil as the material 42 and the wafer holder 20, and between the ground contact 72 and the heat sink pad 22 on the back surface 14 of the PCB 10 to form a heat dissipating path from the wafer holder 20 to the heat sink pad 22; And a transparent top lid 18 disposed on the chip 30 To seal the receiving space Π of the wafer. Please refer to FIG. 3A_, FIG. 3B, and FIG. 3C, which show another embodiment 1 ^ of the invention according to the invention: ten kinds of sensor package structure diagrams, wherein the first diagram is a partial cross-sectional front view of ', \ π', And 3 | 邋. ¥ its bottom view. The sensor package of the present invention (the sensor is used to connect the heat sink, the heat sink connection parts 44, 54, 64, 7 \, § \, 94, and the heat dissipation path formed by the sensor, and the heat dissipation path used by the sensor. There can be one to several ground pins 42, 52, 62 and ground contacts 72, 82, 92, of which three are shown in Figures 3A and 3B to enhance its heat dissipation effect. Please refer to section Figure 4 shows a type 8 according to another embodiment of the present invention (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) A7 448552 5983twr, cioc / 〇〇5 V. Description of the invention () Sensor package structure diagram 'The ground pins 82, 92, 102 used for the heat dissipation path can be gradually expanded from the inside to the outside to enhance its heat dissipation effect The sensor package structure as described in the above embodiments, wherein the area of the heat dissipation pad 22 can be enlarged as much as possible to enhance its heat dissipation effect. The sensor package as described in the above embodiments Structure, wherein the transparent top cover 18 can be made of a transparent plastic sheet or transparent Either one of the clear glass sheets is arranged on the top of the chip receiving space and fixed on the top of the ring wall 16. The sensor package structure as described in the above embodiments, wherein the transparent top cover 18 is also It can be made of a transparent liquid material, filled in the wafer accommodating space η, and formed through a curing process. The transparent liquid material includes liquid glass or liquid glue, which usually contains a solvent, so it needs to be heated for curing. However, the step of tapping the transparent liquid material can be performed in a moderate vacuum environment. B Although the present invention has been used in the preferred embodiment, it is not intended to limit the present invention. Anyone skilled in the art will not depart from the present invention. Within the spirit and scope ', some modifications and retouching can be made, so the scope of protection of the present invention shall be determined as defined in the attached patent application park. 9 ~ t -------- Order < Please read the notes on the back before filling in this page.) The consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs Du printed this paper. The size of the paper applies to the Chinese National Standard (CNS) A4 (210 x 297 mm).