448532 五、發明說明（1) 本發明係提供—種半導體晶片失具，尤指用來夾持一 半導體晶片以進行一旋轉製程之夾具β 在半導體晶片製造過程中’必須防止微粒（particle) 附著於晶片表面上以及其他人為或環境因素造成的晶片污 染’才能控制半導體晶片的生產品質。在一些半導體晶片 的單元製程中，微粒會殘留於晶片表面上，必須適時地加 以清除’例如進行化學機械研磨（Chemica卜Mechanical Polishing)製程後殘留在晶片表面上的研磨污染物，以及 進行薄膜沈積（Thi n F i 1 m Depos i t i 〇n)製程後因反應器中 附著不良的沈積物而殘留在晶片表面上的微粒，都必須適 時地加以清除以便進行後續的製程’所以晶片之刷洗製程 是一個必要的程序。習知刷洗半導體晶月的方式是藉由一 個半導體晶片夾具將晶片固定於一個刷洗機台上，以進行 旋轉之刷洗製程，而如何使晶月在高速旋轉狀態下仍然固 定於夹具上而不會產生晃動現象，是研發夾具的一項重要 課題。 立請參考圖一及圖二，圖一為習知半導體晶片夾具1〇之 示思圖，圖二為圖—所示夾具丨〇之上視圖。半導體晶片夾 具10包含有一旋轉基座12，以及六個支撐釘w設置於旋轉 基座基座12上，用來固定一半導體晶片16。。六個支撐釘 14對稱設置於旋轉基座12之圓周邊上，其中五個支撐釘14 是以與旋轉基座12圓心等距的方式均勻地固定在旋轉基座448532 V. Description of the invention (1) The present invention provides a kind of semiconductor wafer missing parts, especially a jig used for holding a semiconductor wafer to perform a rotating process. In the semiconductor wafer manufacturing process, 'particles must be prevented from adhering. Only wafer contamination on the wafer surface and other man-made or environmental factors can control the production quality of semiconductor wafers. In the unit manufacturing process of some semiconductor wafers, particles will remain on the wafer surface and must be removed in a timely manner. For example, abrasive contamination remaining on the wafer surface after chemical mechanical polishing (Chemical Polishing) process, and thin film deposition (Thi n F i 1 m Depos iti 〇 On) After the process, the particles remaining on the wafer surface due to poor adhesion in the reactor must be removed in a timely manner for subsequent processes. So the wafer brushing process is A necessary procedure. The conventional method of brushing the semiconductor crystal moon is to fix the wafer on a brushing machine table by a semiconductor wafer fixture to perform the rotating brushing process, and how to make the crystal moon still fixed to the fixture under high speed rotation without The occurrence of sloshing is an important issue in the development of fixtures. Please refer to FIGS. 1 and 2 immediately. FIG. 1 is a schematic view of a conventional semiconductor wafer jig 10, and FIG. 2 is a top view of the illustrated jig. The semiconductor wafer holder 10 includes a rotating base 12 and six support pins w are disposed on the rotating base base 12 for fixing a semiconductor wafer 16. . Six support pins 14 are symmetrically arranged on the periphery of the circle of the rotary base 12, and five of the support pins 14 are uniformly fixed on the rotary base in a manner equidistant from the center of the circle of the rotary base 12.
I :\ACC\二維碼\NAIMAU-Q3. PTD 第4頁 4^8532 五、發明說明（2) 12之圓周邊上，而另一個支撐釘η則以較近於旋轉基座12 圓心的方式設置在旋轉基座12之圓周邊上，可以將近似圓 形的半導體晶片16緊卡於六個支撐釘14之上。 由於一般未加工晶片（Raw Wafer)的尺寸大小不 同’夾具1 0通常會依照尺寸最大的半導體晶片來設計，因 此尺寸較小的半導體晶片將無法緊緊地卡在六個支撐釘14 之間’而較小的晶片在高速旋轉的狀態下產生晃動甚至於 破碎的情形。旋轉基座12是一個不對稱的裝置，因此在高 速旋轉的狀態下，例如4000 rpm時，旋轉基座12本身也會 產生晃動現象’不僅造成刷洗機台的馬達抽心與其他配件 摩擦而產生微粒，長久下來也會讓刷洗機台的壽命減低， 並且使固疋在旋轉基座12上的晶片16在馬速旋轉的狀態下 也產生晃動現象。除此之外，因為晶片16與旋轉基座12的 重心位置不同，所以在長期南速旋轉狀態下，晶片16之晶I: \ ACC \ Two-dimensional code \ NAIMAU-Q3. PTD Page 4 4 ^ 8532 V. Description of the invention (2) On the periphery of the 12 circle, the other support pin η is closer to the circle center of the rotation base 12 The method is arranged on the periphery of the circle of the rotating base 12, and the semiconductor wafer 16 having a substantially circular shape can be tightly clamped on the six supporting pins 14. Raw wafers are generally of different sizes. 'Jig 10 is usually designed according to the largest semiconductor wafer, so smaller semiconductor wafers cannot be tightly clamped between the six support pins 14.' Smaller wafers can shake or even break under high-speed rotation. The rotating base 12 is an asymmetrical device, so in a high-speed rotating state, such as 4000 rpm, the rotating base 12 itself will also produce a shaking phenomenon. 'It will not only cause the motor of the brushing machine to rub against other parts and cause friction. For a long time, the particles will reduce the life of the scrubber and cause the wafer 16 fixed on the rotating base 12 to shake at the speed of the horse. In addition, because the position of the center of gravity of the wafer 16 and the rotating base 12 are different, the crystals of the wafer 16 under a long-term south speed rotation state
邊會嵌入支撐釘14並導致支撐釘14變形，造成後續之晶片 1 6的傳送異常。 BS 因此’本發明之主要目的在於提供一個用來爽持半導 體晶片以進行旋轉製程之夾具，可以防止半導鷇县片於高 速旋轉時產生晃動現象。 圖示之簡單說明 圖一為習知半導體晶片夾具之示意圖。The edges will be embedded in the support nails 14 and cause the support nails 14 to deform, resulting in abnormal transfer of subsequent wafers 16. BS Therefore, the main purpose of the present invention is to provide a jig for holding semiconductor wafers for the rotation process, which can prevent the wobbling phenomenon of semiconductor wafers during high-speed rotation. Brief Description of the Figures Figure 1 is a schematic diagram of a conventional semiconductor wafer holder.
I:\ACC\二維碼\NAU\NAU-03. PTD 苐 5 頁 44853^ 五、 發明說明（3) 圖 二 為 圖 一 所 示 夾 具 之 上 視 圖 〇 圊 三 為 本發 明 半 導 體 晶 片 夾 具 之上 視圖。 圖 四 為 圖 二 所 示 支撐 柱 之 側 視 圖。 圖 五 為 圖 四 所 示 失 臂 下 壓 住 晶 片之 示意圖。 圖 示 之 符 號 說 明 20 夾 具 22 圓 形 基 座 24 支撐柱 26 凹 槽 28 夾臂 30 墊 片 32 重鎚 請 參 考 圖 三 及 圖 四 ϊ 圖 三 為本發明之半 導 體 晶片 夾 具 20 之 上 視 圖 圖 四 為 圖 三 所 示 支撐 柱2 4之側 視 圖 。半 導 體 晶 片 夾 具20 是 用 來 固 定 一 近 似 圓形 之半導體 晶 片 16以 進 行 W—* 旋 轉 之 製 程 失 具20 包 含 有 一圓 形基座22 以 及複數個 支撐 柱24 以 近 似 等 距 的 方 式 均 勻地設置於圓 形 基 座22 之 圓 周 邊 上 並 且 對 稱 分 佈 於 . 通過圓 形基座22 圓 心 之直 線 兩 側 ί 用 來 水 平 地 固 定 半 導 體 晶 片16 。每一個 支 撐 柱24 之 頂 端 均 5又 有 近 似 直 角 之 凹 槽26 用來 固定晶片 16 之 晶邊 以 及 -— 可 上 下 移 動 之 夾 臂28 0 凹 槽26 包含有一 水 平 面27 用 來 水 平 地 放 置 晶 片 16 背 面 之 晶 邊 ，以 及一垂直 面29 用來 限 制 晶 片 16 之 水平 位 移 使 半 導 體 晶片 1 6得以固 定 於 複數 個 凹 槽2 6之間I: \ ACC \ Two-dimensional code \ NAU \ NAU-03. PTD 苐 5 Page 44853 ^ V. Description of the invention (3) Figure 2 is a top view of the jig shown in Figure 1; view. Figure 4 is a side view of the support post shown in Figure 2. Figure 5 is a schematic diagram of pressing the wafer under the lost arm shown in Figure 4. Explanation of the symbols in the figure 20 Fixture 22 Round base 24 Support column 26 Groove 28 Clamp arm 30 Spacer 32 Weight Please refer to Figures 3 and 4ϊ Figure 3 is a top view of the semiconductor wafer fixture 20 of the present invention Figure 4 It is a side view of the supporting post 24 shown in FIG. The semiconductor wafer holder 20 is used to fix an approximately circular semiconductor wafer 16 for W— * rotation. The process tool 20 includes a circular base 22 and a plurality of support posts 24 which are evenly arranged on an approximately equidistant manner. The circular pedestal 22 is symmetrically distributed on the periphery of the circle. The two sides of the straight line passing through the center of the circular pedestal 22 are used to horizontally fix the semiconductor wafer 16. The top of each support post 24 is 5 and has a substantially right-angled groove 26 for fixing the crystal edge of the wafer 16 and a clamp arm 28 that can be moved up and down. 28 The groove 26 includes a horizontal surface 27 for horizontally placing the wafer 16 The crystal edge on the back and a vertical plane 29 are used to limit the horizontal displacement of the wafer 16 so that the semiconductor wafer 16 can be fixed between a plurality of grooves 26.
I :\ACC\二維碼\NAU\NAU-03. PTD 第6頁 448532 五、發明說明（4) 請參考 2 8包含有一 臂28另一端 於支撐柱24 夾臂28之重 起的位置， 之内。而當 夾臂28之重 壓住半導體 隨著旋轉速 之墊片30向 轉時產生晃 圖五， 墊片30 ，而夹 之頂端 鎚32會 讓半導 半導體 鎚32會 晶片1 6 度的增 下壓得 動現象 圖五為圖四 位於夾臂28 臂2 8之中間 。當夾具20 因重力作用 體晶片1 6可 晶片夾具20 因離心力作 之晶邊，以 加，離心力 更緊，可以 所示夾臂28之 一端，以及一 部位是 處於一 而使夾 以垂直 處於一 用而使 水平地 的作用 防止半 以可轉 靜止狀 臂28之 地置入 旋轉狀 夾臂28 固定半 會越大 導體晶 示意圖 重鎚32 動的方 態時， 墊片30 複數個 態時， 之墊片 導體晶 ，使得 片16於 。夾臂 位於夾 式固定 每一個 處於抬 凹槽26 每一個 30向下 片16。 夾臂28 高速旋 相較於習知夾具1 〇，本發明夾具20是利用圓形基座上 的支撐桎24及其夾臂28來固定半導體晶片，進行旋轉之製 程時’由於夾臂之重鎚32會因離心力作用而使夹臂之墊片 3 0向下壓住半導體晶片1 6之晶邊，因此可以防止晶片丨6在 高速旋轉的狀態下產生晃動或是破碎的情形。並且本發明 夾具20用於晶片旋轉之刷洗製程時，不僅可以防止晶片產 生晃動現象，還可以延長刷洗機台的壽命。 以上所述僅為本發明之較佳實施例，凡依本發明申請 專利範圍所做之均等變化與修飾，皆應屬本發明專利之涵 蓋範圍。 1^·I: \ ACC \ Two-dimensional code \ NAU \ NAU-03. PTD page 6 448532 V. Description of the invention (4) Please refer to 2 8 including the position where the other end of the arm 28 rests on the support post 24 and the clamp arm 28, within. When the weight of the clamp arm 28 presses the semiconductor with the rotation speed of the pad 30, the wobble is generated as shown in Figure 5, the pad 30, and the top hammer 32 of the clip will increase the semiconductor semiconductor hammer 32 by 16 degrees. Fig. 5 shows the phenomenon of pressing down. Fig. 4 is located in the middle of the clamp arm 28 and the arm 28. When the clamp 20 acts on the body wafer 16 due to gravity, the wafer clamp 20 is made of crystal edges due to centrifugal force, so that the centrifugal force is tighter. One end of the clamp arm 28 can be shown, and one part is at one, so the clamp is vertically at one When the horizontal ground is used to prevent the semi-rotary arm 28 from being placed into the rotating clamp arm 28, the fixed half will be larger. When the conductor crystal is heavy, the weight is 32, and when the washer 30 is in multiple states, The spacer conductor crystals make the sheet 16u. The clamp arms are located in the clamp type, each in the lifting groove 26, each 30, and the downward piece 16. Compared with the conventional clamp 10, the clamp arm 28 has a high-speed rotation. The clamp 20 of the present invention uses the support 桎 24 on the circular base and the clamp arm 28 to fix the semiconductor wafer. Due to the centrifugal force of the hammer 32, the shim 30 of the clamp arm is pressed down on the crystal edge of the semiconductor wafer 16, so that the wafer 6 can be prevented from shaking or breaking under high-speed rotation. In addition, when the holder 20 of the present invention is used in a wafer brushing process, not only can the wafer be prevented from shaking, but also the life of the brushing machine can be extended. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application for the present invention shall fall within the scope of the invention patent. 1 ^ ·
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