TW444363B - Manufacturing method for ball grid array packaging structure - Google Patents

Abstract

A manufacturing method for ball grid array packaging structure which includes the following steps: (a) providing a thin film with an opening; (b) locating the thin film on a substrate; (c) fixing a semiconductor chip on the upper surface of the substrate so that the semiconductor chip is located in the opening of the thin film; (d) electrically connecting the semiconductor chip to the substrate; (e) providing a mold comprising a runner, a gate and a cavity in which the runner is connected to the cavity through the gate; (f) clamping the mold to make the semiconductor chip located in the cavity where the thin film is located outside the cavity, and the runner and the edge of the gate are completely attached on the thin film; (g) injecting the encapsulation plastic material into the cavity; (h) curing the encapsulation plastic material; (i) opening the mold; and, (j) degating the runner and removing the thin film. The thin film in accordance with the present invention has larger adhering force with the encapsulation plastic material than the adhering force between the thin film and the substrate. Therefore, in the step (j), because the thin film will be apt to attach on the excess encapsulation plastic material, it will simultaneously remove the thin film during removing the excess encapsulation plastic material so as to automate the encapsulation process.

Description

mi: Ττ " _ (The above are all blocked by this bureau u 'ejrr invention patent specification 444363 a method of manufacturing ball grid array package structure in Chinese%, invention name English name (Chinese) 1. Wu Shiying 2. Zhao Xinghua 3. Feng Yaoxin Inventor's Name (English) 1. Wu Shyh-Ing 2. CHAO Shin Hua 3. Fang Yao Shin 'Nationality 1. Chinese People's Sleep 2. Chinese People's Ming 3. Chinese People's Sleep, Residence 1. ft # 冬 消! 5f 9th Floor, 216 Longjiu Road, Shenzhan Village 2. Kao Hsiung City, Lane 63, Lane 56, Hehexian Street, Kaohsiung City 3. No. 119, Zhonghe Street, Hualien City Company * Name (Name) (English) 1. Advanced Semiconductor Engineering, Inc. China Borrowed 1. Residence, Domicile (Office) of the Republic of China 1. Representative Name (Chinese), No. 26 Jingsan Road, Nanzi Processing and Export Zone, Kaohsiung City 1. Name of Zhang Qiansheng's Representative (English) 1. τ

Claims (1)

4443 63 V. Description of the invention (1) Field of invention for manufacturing a ball grid array package structure: Sealed in manufacturing system, which is particularly related to the use of the present invention, is related to a method for manufacturing s 0 if ^ (encapsulating method) ty down) Sealing method of ball grid array package structure. Prior art: The conventional cavity down ball grid array package structure generally includes a cavity in which a chip is disposed on a substrate. The wafer glaze on the surface of the lunar moon is connected to the chip bonding pads on the edge of the upper surface of the substrate by bonding wires. A plurality of solder ball pads are disposed on the upper surface of the substrate and are located around the plurality of chip connection pads. The plurality of solder ball pads are electrically connected to corresponding wafer connection pads, respectively. Each solder ball pad is provided with a solder ball for electrical communication with the outside world. The wafer, the connecting line and the cavity of the substrate are covered with a colloid (including a part of the upper surface of the substrate). The sealing compound is generally formed by transfer molding. The first circle is shown as a conventional mold device 100 for manufacturing a cavity down ball grid array package structure, which mainly includes a mold. It has a washing channel 110, a washing channel opening 120, and a chess hole 130. The runner 110 extends from a pot (not shown in the figure), and the washing channel 110 is connected to the chess hole 130 through the runner 120. The plastic sealant is placed in the tank and the After the chess set is tightly clamped, a pressure injection head (not shown) will start to move downward to compress the plastic sealant. The chess set and the sealing plastic are preheated first so that when the injection head compresses the sealing plastic downward, the sealing plastic will liquefy and pass through the runner 110 to Buy 5th 4443 6 3 V. Description of the invention (2) --- ^ and gate 120 filled with Qi hole 130 to cover the semiconductor crystal moon. After the knee-sealing plastic fills the cavity 210, the injection head remains stationary for a predetermined time. Then, the injection head is raised and the mold is opened / taken out of the molded product. However, the sealing plastic not only fills the cavity 130 but also fills the gate 120, the washing channel 110, and the tank. The excess sealing plastic must generally be removed by the molded product. Therefore, the binding device 100 further includes a metal partition 140 to separate the excess sealing plastic and the substrate, thereby preventing the substrate from being "decasted" The "runner" process (that is, removing the excess sealant) was distorted or damaged. The cross-sectional area of the gate 120 is generally smaller than that of the runner 110 to help the "decast runner" process. The second picture shows a conventional casting device 200 for manufacturing a cavity down ball grid array package structure. The characteristics of the casting device 200 are as follows: γ includes a fixed block 150 to separate the excess. Sealing plastic and substrate. However, a disadvantage of the aforementioned prior art is that it cannot be automated. Because when the mold is opened, the metal partition 140 or the fixing block 150 cannot be removed together during the "decasting and washing lane" process. After the excess sealing plastic is removed, the metal partition 140 or the fixing block 150 will prevent the pins built in the mold from automatically ejecting the chess pieces. Therefore, it is generally necessary to manually remove the metal partition 140 or the fixing block 50 in order to prevent it from hindering the ejection of the molded product. In addition, 'the metal spacer 14 or the fixing block 150 is easily deformed due to repeated use', so flash flash is likely to occur and affect solder joint reliability of the solder ball pad. 4 443 6 3 Summary of the Invention: The main purpose of the present invention is a fabrication method, which utilizes a thin array package structure and a substrate in a sealing process, wherein the thin medium can be removed in a row, thereby automating the sealing process. In the process of "operation, runner"-and the method of this method is to provide a ball grid array package structure Λ Tai Λ Λ Λ using a film to prevent the occurrence of glue overflow. The method for manufacturing a ball grid array package structure according to the present invention comprises the following steps-(a) providing a film with an opening; (b) placing the film on a substrate; (c) fixing a semiconductor wafer to the substrate The upper surface is such that the semiconductor wafer is located in the opening of the film: (d) electrically connecting the semiconductor wafer to the substrate; (e) providing a mold having a washing channel, a washing channel opening, and a cavity Where the runner is connected to the cavity by the runner; (f) the chess set is tightly clamped so that the semiconducting wafer system is located inside the cavity, the thin media system is outside the cavity, and the The edges of the runner and the washer are completely tightly attached to the film; (g) the sealing plastic is injected into the cavity; (h) the sealing plastic is hardened; (i) the mold is opened; and (J) the The degating and simultaneous removal of the film. According to the film of the present invention, the adhesion between the film and the sealant is greater than the adhesion between the film and the substrate. Therefore, in step (j), 'Since the film tends to adhere to the excess sealing plastic, it can be taken at the same time when removing the excess sealing plastic, so that the thin seal can be automated. Operation * In addition, since the thin f is disposable after being used, it will not be deformed due to repeated use, thereby preventing soil scum. Chapter 7 I 4443 63 V. Description of the Invention (4) ----- ® shows: In order to make the above and other objects, features, and advantages of the present invention more obvious, the following describes the preferred embodiments of the present invention, As shown in the following, the detailed description is as follows: β 1 ρ α Section 1 of the conventional mold device, which is used to manufacture a cavity down ball grid array package structure; second circle: another conventional mold Sectional view of a chess device; and 謇 A3 circle: it is used to explain a method for manufacturing a ball grid array package structure according to a preferred embodiment of the present invention. Β Drawing number description: 120 150 220 230 Device 130 Mold cavity 20 0 Mold device 222 Cavity 300 Thin 骐 11 〇Gate 140 Metal spacer 210 Semiconductor wafer 224 Solder ball pad Description of the invention: A method for manufacturing a ball grid array package structure according to a preferred embodiment of the present invention. The third circle reveals that a substrate strip includes a plurality of substrates (only two substrates 220 are shown in the third circle) and a thin film 300 has One Opening. At the time of production, a plurality of substrates 2 to 20 are generally integrated into one package so that the packaging process can be automated. The upper surface of the substrate 220 has a cavity 222. A plurality of wafer connection pads (not shown in a circle) are projected on the upper surface of the substrate 220 at the edges of the recesses 2 and 22, and a plurality of solder ball pads 224 are located on the wafer connection pads 4443 63 5. Description of the invention (5 )-, The plurality of solder ball pads 224 are electrically connected to corresponding wafer connection pads, respectively. : The film 300 is preferably made of a heat-resistant material and does not deform warp during the sealing process. In other words, it must be resistant to the operating temperature of the sealing process (about 1 75 ° C). In addition, the adhesion between the film 300 and the sealing plastic must be greater than the adhesion between the film and the substrate 220. Preferably, the adhesion between the film and the sealing plastic is about ten times the adhesion between the film and the substrate. A suitable thin material is Teflon (polytetrafluroethylene (PTFE)) or ethylene tetrafluroethylene (ETFE). Please refer to the fourth figure. First place the film 300 on the top surface of the substrate 220 so that The plurality of wafer connection pads (not shown in the figure) are located in the opening of the film 300. A semiconductor wafer 210 is then fixed to the cavity 222 of the substrate 2 20 by a conductive adhesive such as silver adhesive (shown in the figure). The semiconductor wafer 210 has a plurality of wafer pads (not shown in the circle) provided on the upper surface thereof to connect its internal circuits. The plurality of connection wires, such as gold wires 230, use conventional wire bonding. The technology connects a plurality of wafer bonding pads of the semiconductor wafer 210 to a plurality of wafer connection pads (not shown in the figure) on the upper surface of the substrate 220. Preferably, the inner row of the solder ball pads 224 on the substrate 220 near the cavity 222 are all the back cover of the film 300, thereby preventing the occurrence of flash and ensuring the solder connection of the solder ball pads 24. Reliability (s〇ider j〇int reliability) ° Please refer to the fifth circle 'closely clamp the chess set so that the semi-conducting chip 230 4443 63 V. Description of the invention (6) The system is located in the cavity 130, the film 300 is located outside the cavity 130, and the edges of the washing channel 110 and the sprue opening 120 are completely in contact with the film 300. Then, a sealing compound is injected into the cavity 130. At this time, the thin film 300 provides a good sealing effect to prevent the overflow of glue from occurring on the substrate, and the surface ', thereby preventing the solder ball pad 224 from being contaminated by the overflow of glue. Then, after the sealant has hardened, the mold is opened. Finally, a degating process is performed, that is, the excess sealing material is removed from the molded product. Since the film 300 tends to adhere to the excess sealing plastic, the film can be taken away at the same time when removing the excess sealing plastic (see Section 7). At this time, the ejector pin built into the mold (jins) can automatically eject the molded product, and obtain a cavity down (cavity down) ball grid array packaging structure as shown in the sixth Fujian. It can be understood that the method for manufacturing a ball grid array package structure according to the present invention may further include a step of mounting a solder ball on the solder ball pad 224. The method for manufacturing a ball grid array package structure according to the present invention When removing the excess sealing plastic, the film can be taken away, so that the sealing process can be automated. In addition, the film is discarded after being used, so it will not be deformed due to repeated use. This prevents the occurrence of flash. Although the present invention has been disclosed in the foregoing preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The protection of Fan Yuan shall be determined by the scope of the attached patent application. Case No. 89105411 a Brief description of the revised diagram m Please indicate clearly to the commissioner) After the QE of this case, the original authentic guest 93.1. 18 Φΐ ^ zs P00-023, ptc Buy 11